TWI485887B - Method for manufacturing light emitting diode - Google Patents

Description

Light emitting diode packaging method

The present invention relates to a semiconductor packaging method, and more particularly to a light emitting diode packaging method.

Light Emitting Diode (LED) is a semiconductor component that converts current into light of a specific wavelength range. It has been widely used in current applications due to its high luminous efficiency, small size, light weight, and environmental protection. Among the various fields. Before applying the light-emitting diode to the above various fields, it is necessary to package the light-emitting diode wafer to protect the light-emitting diode wafer.

When the industry uses injection molding to package, the plastic filled in the mold needs to be fully cured in a temperature range of 180 to 200 degrees for 120 seconds to 180 seconds, due to the long molding time of the plastic in the mold. , resulting in the use of mold is not efficient. Therefore, the packaging efficiency needs to be further improved.

The present invention aims to provide an efficient light emitting diode packaging method for a packaging process.

A light emitting diode packaging method comprising the steps of: providing an electrode structure comprising first and second electrodes spaced apart from each other; providing a mold to form a cavity between the mold and the electrode structure; and injecting into the cavity Fluid material and pre-curing the fluid material, the pre-cured temperature a degree of environment of 180 degrees to 200 degrees, the pre-curing time range of 60 seconds to 90 seconds; removing the mold; transferring the electrode structure with the pre-cured fluid material into the oven and fully curing; setting on the electrode structure a light-emitting element, the light-emitting element is electrically connected to the two electrodes; and an encapsulation layer is formed on the light-emitting element.

Compared with the prior art, the package structure is formed based on the above packaging method, and the mold is removed in the fluid material pre-curing stage, and the mold is transferred to the next round of injection molding, and the preform structure is transferred and then solidified at a high temperature. The mold usage time is much smaller than that of the conventional package. The use time of the mold can greatly reduce the waiting time of the work, improve the use efficiency of the mold, make the packaging process more efficient, and facilitate mass production.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

100‧‧‧Lighting diode

10‧‧‧Electrode structure

11‧‧‧First electrode

12‧‧‧Second electrode

13‧‧‧ gap

14‧‧‧ upper surface

15‧‧‧ Lower surface

20‧‧‧Mold

21‧‧‧Bottom mode

22‧‧‧Top mold

221‧‧‧ top board

222‧‧‧Resistance Department

223‧‧‧ Positioning Department

30‧‧‧ cavity

31‧‧‧ flow path

40‧‧‧ Fluid materials

50‧‧‧Reflection Cup

61‧‧‧Substrate

62‧‧‧Lighting elements

63‧‧‧Encapsulation layer

FIG. 1 to FIG. 7 are schematic diagrams showing steps of a method for packaging a light-emitting diode according to an embodiment of the invention.

The method of encapsulating the LED assembly 100 of the present invention will be further described in detail below with reference to the accompanying drawings.

First Step: Referring first to FIG. 1, an electrode structure 10 is provided, which includes a first electrode 11 and a second electrode 12. The first electrode 11 and the second electrode 12 are spaced apart from each other to form a gap 13, and each electrode 11 12 includes an upper surface 14 and a lower surface 15 opposite the upper surface 14.

Second Step: Referring to Figure 2, a mold 20 is provided that includes a bottom mold 21 and a top mold 22. The top of the bottom mold 21 is a flat surface for abutting the lower surface of the electrode structure 10 to carry the electrode structure 10. The top mold 22 abuts the upper surface of the electrode structure 10 and forms a cavity 30 with the upper surface of the electrode structure 10 for subsequent injection molding to form the reflective cup 50.

The top mold 22 includes a top plate 221, a resisting portion 222 protruding from the periphery of the top plate 221 toward the bottom mold 21, and a positioning portion 223 protruding from the center of the top plate 221 toward the bottom mold 21. Specifically, the outer surface of the top plate 221 is a smooth plane. The abutting portion 222 defines an annular side wall at the periphery of the top plate 221, and is integrally formed with the top plate 221 and protrudes from the lower surface edge of the top plate 221 toward the bottom mold 21. The middle portion of the resisting portion 222 is perforated to form a flow path. 31, for the subsequent injection of the fluid material 40, in the embodiment, the number of the flow channels 31 is two. The positioning portion 223 extends from the middle of the lower surface of the top plate 221 toward the bottom mold 21, and is spaced apart from the resisting portion 222. The peripheral dimension of the positioning portion 223 gradually decreases from the top plate 221 toward the bottom mold 21, The lower surface of the positioning portion 223 is flush with the lower surface of the resisting portion 222.

The third step is as follows: Referring to FIG. 3, the bottom mold 21 and the top mold 22 are disposed between the electrode structures 10, that is, the top of the bottom mold 21 is attached to the lower surface of the electrode structure 10, and the top mold 22 is The positioning portion 223 is attached to the upper surface of the electrode structure 10 and covers the gap 13 . The blocking portion 222 surrounds the positioning portion 223 and is attached to the upper surface of the electrode structure 10 , that is, the positioning portion 223 . The resisting portion 222 and the electrode structure 10 enclose an annular cavity 30 for subsequently filling the plastic fluid material 40. The fluid material 40 fills the cavity and solidifies to form the reflective cup 50 structure.

Fourth step: Referring to FIG. 4, the fluid material 40 is injected into the cavity 30 along the flow channel 31, while the fluid material can flow through the upper surface of the electrode structure 10 to inject the first electrode 11 and In the gap 13 between the second electrodes 12, the fluid material 40 located in the cavity 30 subsequently forms a reflective cup 50 structure, and the fluid material 40 located in the gap 13 subsequently forms the substrate 61. The fluid material 40 can be an epoxy resin, a resin or other polymeric material. When the fluid material 40 fills the cavity 30 and the gap 13 , the fluid material 40 is pre-cured at a high temperature. Specifically, the temperature of the mold 20 is controlled within a range of 180 degrees to 200 degrees, at which time the fluid material 40 The temperature is maintained in the range of 160 to 180 degrees, and the temperature is maintained for 60 seconds to 90 seconds to pre-cure to form the reflector cup 50 structure and the substrate 61.

The mold 20 is removed from the injection molding package of the next LED assembly 100. At this time, the reflector cup 50 and the substrate 61 are substantially solidified only by the external structure, that is, the reflector cup 50 and the substrate 61 are not completely cured.

The fifth step: Referring to FIG. 5, the preformed LED assembly 100 is transferred into an oven (not shown), and the temperature is controlled in the range of 160 to 180 degrees, and the preform is baked. The light emitting diode 100 package structure is completely cured to the reflective cup 50 structure and the substrate 61.

Sixth step: Referring to FIG. 6, a light-emitting element 62 is disposed on the electrode structure 10. Specifically, the residual burrs on the surfaces of the first electrode 11 and the second electrode 12 are removed first to ensure the conductivity of the surface of the electrode structure 10. Then, a light-emitting element 62 is disposed on a surface of the first electrode 11 adjacent to one end of the second electrode 12. The light-emitting element 62 is electrically connected to the first electrode 11 and electrically connected to the second electrode 12 by a wire, that is, the two electrodes of the light-emitting element 62 are respectively formed with the first electrode 11 and the second electrode 12 Electrical connection. In the embodiment, the light-emitting element 62 is a light-emitting diode die. In this step, the light-emitting element 62 can also be fixed on the electrode structure 10 in the form of wafer flip-chip, and the two electrodes of the light-emitting element are respectively connected to the first electrode 11 and the second electrode 12 by conductive solid glue. Form an electrical connection.

The seventh step: Referring to FIG. 7, an encapsulation layer 63 is overlaid on the light-emitting element 62. The encapsulation layer 63 fills the reflective cup 50 and is flush with the upper surface of the reflective cup 50. The encapsulation layer 63 is made of a transparent material, which may be made of tantalum resin or other resin, or other mixed materials. The encapsulation layer 63 may further contain phosphor powder according to the light-emitting element 62 and the light-emitting requirements. The phosphor powder comprises garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, and oxynitride group. One or more of phosphor powder and nitride-based phosphor powder.

Compared with the prior art, the light emitting diode 100 package structure is formed based on the above packaging method, and the mold 20 is removed in the pre-curing stage of the fluid material 40, and the next light-emitting diode 100 is injected, and the preformed structure is transferred and the high temperature is completely completed. The curing forms the structure of the reflective cup 50. The use time of the mold 20 is far less than the use time of the conventional packaging mold 20, the work waiting time can be greatly reduced, the use efficiency of the mold 20 is improved, the packaging process is more efficient, and mass production is facilitated.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

11‧‧‧First electrode

12‧‧‧Second electrode

50‧‧‧Reflection Cup

61‧‧‧Substrate

62‧‧‧Lighting elements

63‧‧‧Encapsulation layer

Claims (7)

A light emitting diode packaging method comprising the steps of: providing an electrode structure comprising first and second electrodes spaced apart from each other. providing a mold to form a cavity between the mold and the electrode structure; and injecting into the cavity Fluid material and pre-curing the fluid material, the pre-cured temperature environment is 180 degrees to 200 degrees, the pre-curing time ranges from 60 seconds to 90 seconds; removing the mold; transferring the electrode structure with the pre-cured fluid material Into the oven and fully cured; a light-emitting element is disposed on the electrode structure, the light-emitting element is electrically connected to the two electrodes; and an encapsulation layer is formed on the light-emitting element. The method of claim 2, wherein the first electrode and the second electrode are separated by a gap, and the gap communicates with the cavity via the upper surface of the electrode structure, and the fluid in the cavity The material solidifies to form a reflective cup structure, and the fluid material in the gap solidifies to form a substrate. The method of claim 2, wherein the mold comprises a bottom mold and a top mold, the top of the bottom mold is attached to a lower surface of the electrode structure, and the top mold and the top mold The upper surface of the electrode structure forms the cavity. The method of claim 3, wherein the top mold comprises a top plate, a resisting portion protruding from the peripheral edge of the top plate toward the bottom mold, and the bottom mold from the center of the top plate A positioning portion protruding in a direction, the positioning portion, the resisting portion and the electrode structure are collectively formed to form the cavity. The method of claim 4, wherein the resisting portion is an annular side wall, and the middle portion of the resisting portion is formed with a through hole to form a flow channel. The method of claim 2, wherein the positioning portion and the resisting portion are spaced apart from each other, and a lower surface of the positioning portion is flush with a lower surface of the resisting portion. The method of claim 6, wherein the peripheral dimension of the positioning portion gradually decreases from the top plate toward the bottom mold.