TW201339471A - Lamp - Google Patents

Lamp Download PDF

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Publication number
TW201339471A
TW201339471A TW101148724A TW101148724A TW201339471A TW 201339471 A TW201339471 A TW 201339471A TW 101148724 A TW101148724 A TW 101148724A TW 101148724 A TW101148724 A TW 101148724A TW 201339471 A TW201339471 A TW 201339471A
Authority
TW
Taiwan
Prior art keywords
base
light
casing
emitting diode
bulb
Prior art date
Application number
TW101148724A
Other languages
Chinese (zh)
Inventor
Keisuke Imamura
Katsushi Seki
Yoshitaka Kurimoto
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201339471A publication Critical patent/TW201339471A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

A lamp comprises a main body in which a base is attached to one end side of a tubular case, an LED element provided on the surface of the base of the main body, and a globe mounted onto the main body in a state covering the LED element. The main body includes a recess that dents in conformity with the shape of at least a part of the end portion on the opening side of the globe. The part of the end portion on the opening side of the globe is inserted into the recess and fixed by adhesive within the recess. A portion forming part of the surface of the recess projects towards the globe side within the recess so as to form a projected portion and the opening edge of the recess abuts the outer periphery of the recess.

Description

燈具 Lamp

本發明係關於一種將半導體發光元件當作光源的燈具。 The present invention relates to a luminaire that uses a semiconductor light-emitting element as a light source.

過去雖將白熾燈泡、mini krypton燈泡以及燈泡形螢光燈具等燈具(以下將該等燈具統稱為「以往的燈具」)用來當作照明器具的光源,但近年來提出利用發光效率高且使用壽命長的發光二極體(LED;Light Emitting Diode)元件的燈具代替以往之燈具的方案,該發光二極體元件為半導體發光元件的1種。又,為了區別使用此發光二極體元件的燈具與以往的燈具,故將其稱為發光二極體燈具。 In the past, lamps such as incandescent bulbs, mini krypton bulbs, and bulb-shaped fluorescent lamps (hereinafter referred to as "conventional lamps") have been used as light sources for lighting fixtures, but in recent years, high luminous efficiency and use have been proposed. A lamp having a long life of a light-emitting diode (LED) element replaces a conventional lamp, and the light-emitting diode element is one type of a semiconductor light-emitting element. Moreover, in order to distinguish between a lamp using the light-emitting diode element and a conventional lamp, it is called a light-emitting diode lamp.

例如在本體的基台表面上設置複數發光二極體元件(該本體系將基台裝設於筒狀殼體的一端所形成),並且以覆蓋複數發光二極體元件的方式,在本體上裝設燈球,以此作為上述的發光二極體燈具。 For example, a plurality of light emitting diode elements are disposed on the surface of the base of the body (the system is formed by mounting the base on one end of the cylindrical casing), and on the body in such a manner as to cover the plurality of light emitting diode elements. A light ball is installed as the above-mentioned light-emitting diode lamp.

燈球的裝設,係例如將燈球之開口側的端部插入凹入部(溝)之中,並在此狀態下,藉由配置於凹入部中的黏著劑將其固定,該凹入部係以圍住配置於基台上的複數發光二極體元件的方式設置在本體上(例如專利文獻1)。 The lamp ball is mounted, for example, by inserting an end portion on the opening side of the lamp ball into a recessed portion (groove), and in this state, fixing the recessed portion by an adhesive disposed in the recessed portion. The body is provided on the body so as to surround the plurality of light emitting diode elements disposed on the base (for example, Patent Document 1).

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特許4612120號 [Patent Document 1] Japanese Patent No. 4612120

一般用以結合燈球與本體的黏著劑,必須設定為固定的量,以符合結合兩者所需要的結合力,並將該黏著劑配置於凹入部之中。此時,在使用例如分配器等裝置的情況中,若噴嘴的一部分堵塞,則配置於凹入部中的黏著劑的量減少。若噴嘴完全堵塞,則無法將黏著劑配置於凹入部當中,雖然可輕易地發現分配器的故障(噴嘴的異常),但卻難以目視的方式,發現凹入部中的黏著劑之填充量不足。 The adhesive generally used to bond the lamp ball to the body must be set to a fixed amount to conform to the bonding force required to combine the two, and the adhesive is disposed in the recess. At this time, in the case of using a device such as a dispenser, if a part of the nozzle is clogged, the amount of the adhesive disposed in the concave portion is reduced. If the nozzle is completely clogged, the adhesive cannot be placed in the concave portion. Although the failure of the dispenser (abnormality of the nozzle) can be easily found, it is difficult to visually find that the amount of the adhesive in the concave portion is insufficient.

另一方面,若噴嘴破裂,則配置在凹入部當中的黏著劑的量會變得過多。此情況下,若將燈球的開口側端部插入凹入部,則剩餘的黏著劑從凹入部滲出燈球的外側面,明顯地降低設計感。 On the other hand, if the nozzle is broken, the amount of the adhesive disposed in the concave portion may become excessive. In this case, when the opening side end portion of the bulb is inserted into the recessed portion, the remaining adhesive oozes from the recessed portion to the outer side surface of the bulb, and the design feeling is remarkably lowered.

本發明之目的在於提供一種燈具,其可在固定燈球與本體的黏著劑的量不足的情況下,輕易地發現該不足的情形,亦可在黏著劑的量過多的情況中,防止設計感的降低。 It is an object of the present invention to provide a lamp which can easily find the deficiency in the case where the amount of the adhesive for fixing the lamp ball and the body is insufficient, and can prevent the design feeling in the case where the amount of the adhesive is excessive. The reduction.

為了達成上述之目的,本發明之燈具其特徵包含:本體,其係將基台裝設於筒狀殼體之一端所形成;半導體發光元件,其設置於該本體的基台表面;以及燈球,其在另一端具有開口,且在覆蓋該半導體發光元件的狀態下,其開口側的端部裝設於該本體上;該本體具有凹入部,其使該燈球之開口側端部的至少一部份插入其中;在該燈球中,該燈球之開口側端部的至少一部分插入該凹入部,且藉由配置於該凹入部內的黏著劑固定於凹入部中;在該凹入部中,於構成該凹入部的面當中沿著該燈球之開口側端部插入該凹入部之插入方向的部份的面上,具有在該凹入部內,朝向該燈球側凸出的凸出形狀,而該凹入部的開口緣抵接於該燈球的外圓周面。 In order to achieve the above object, a lamp of the present invention is characterized in that: a body is formed by mounting a base on one end of a cylindrical casing; a semiconductor light-emitting element is disposed on a surface of the base of the body; and a light ball And having an opening at the other end, and in an end covering the semiconductor light emitting element, an opening side end portion thereof is mounted on the body; the body has a concave portion that makes at least an open side end portion of the lamp ball One portion is inserted therein; in the lamp ball, at least a portion of the opening side end portion of the lamp ball is inserted into the recessed portion, and is fixed in the recessed portion by an adhesive disposed in the recessed portion; at the recessed portion The surface of the surface of the recessed portion that is inserted into the recessed portion along the opening side end portion of the bulb is inserted into the recessed portion and protrudes toward the bulb side. The shape is formed, and the opening edge of the concave portion abuts against the outer circumferential surface of the bulb.

本發明之燈具,因為具有構成凹入部之部份的面朝向燈球側凸出的形狀,故凸出的部分與因為凸出的形狀變化所形成的邊界線等部份,在檢查配置於凹入部內之黏著劑的量時成為基準,故即使以目視的方式,亦可輕易地發現黏著劑之量的不足。 In the lamp according to the present invention, since the surface having the concave portion is convex toward the bulb side, the convex portion and the boundary line formed by the convex shape change are inspected and arranged in the concave portion. Since the amount of the adhesive in the portion is used as a reference, the amount of the adhesive can be easily found even by visual observation.

另外,因為凹入部的開口緣抵接於燈球的外圓周面,故即使在配置於凹入部內的黏著劑的量過多的情況下,凹入部中的黏著劑亦難以滲出燈球的外側面,進而降低破壞設計感的可能性。 Further, since the opening edge of the recessed portion abuts against the outer circumferential surface of the bulb, even in the case where the amount of the adhesive disposed in the recessed portion is excessive, the adhesive in the recessed portion is hard to seep out from the outer side of the bulb. , thereby reducing the possibility of damaging the sense of design.

1‧‧‧照明裝置 1‧‧‧Lighting device

3‧‧‧天花板 3‧‧‧ ceiling

3a‧‧‧開口 3a‧‧‧ openings

5‧‧‧照明器具 5‧‧‧ Lighting fixtures

7‧‧‧發光二極體燈具 7‧‧‧Lighting diode lamps

9‧‧‧器具本體 9‧‧‧ Appliance body

11‧‧‧插槽 11‧‧‧Slot

13‧‧‧連結構件 13‧‧‧Connected components

15‧‧‧連接部 15‧‧‧Connecting Department

20‧‧‧燈頭 20‧‧‧ lamp holder

22‧‧‧本體 22‧‧‧Ontology

24‧‧‧發光二極體模組 24‧‧‧Lighting diode module

26‧‧‧電路單元 26‧‧‧ circuit unit

28‧‧‧電路殼體 28‧‧‧ circuit housing

30‧‧‧燈球 30‧‧‧light ball

34‧‧‧外殼 34‧‧‧Shell

36‧‧‧接觸片 36‧‧‧Contacts

38‧‧‧絶緣連接體 38‧‧‧Insulated connectors

40a、40b‧‧‧配線 40a, 40b‧‧‧ wiring

42‧‧‧封蓋殼體 42‧‧‧Cover housing

44‧‧‧基台 44‧‧‧Abutment

46‧‧‧傾斜部 46‧‧‧ inclined section

48‧‧‧延伸突出部 48‧‧‧Extensions

49‧‧‧開口 49‧‧‧ openings

50‧‧‧突出部 50‧‧‧Protruding

52‧‧‧蓋部 52‧‧‧ 盖部

52a‧‧‧抵接部分 52a‧‧‧Apartment

52b‧‧‧突出部分 52b‧‧‧ highlight

56‧‧‧第1凹入部 56‧‧‧1st recessed part

58‧‧‧第2凹入部 58‧‧‧2nd recessed part

62‧‧‧底面 62‧‧‧ bottom

63a、63b‧‧‧段差部 63a, 63b‧‧

64‧‧‧端部 64‧‧‧End

65‧‧‧凹入部 65‧‧‧ recessed

65a‧‧‧內側面 65a‧‧‧ inside

65b‧‧‧外側面 65b‧‧‧Outside

65c‧‧‧底面 65c‧‧‧ bottom

65d‧‧‧凸出部份 65d‧‧‧ protruding part

65e‧‧‧邊界線 65e‧‧‧ boundary line

66‧‧‧底板 66‧‧‧floor

68、70‧‧‧貫通孔 68, 70‧‧‧through holes

72‧‧‧安裝基板 72‧‧‧Installation substrate

74‧‧‧發光二極體元件 74‧‧‧Lighting diode components

76‧‧‧封裝體 76‧‧‧Package

78、80‧‧‧端子部 78, 80‧‧‧ Terminals

82、84‧‧‧配線 82, 84‧‧‧ wiring

86、88‧‧‧連接端子構件 86, 88‧‧‧Connecting terminal components

90‧‧‧保持板 90‧‧‧ Keep board

92‧‧‧開口 92‧‧‧ openings

94、96‧‧‧較高部分 94, 96‧‧‧higher part

98、100‧‧‧較低部分 98, 100‧‧‧ lower part

102、104‧‧‧螺絲 102, 104‧‧‧ screws

110‧‧‧電路基板 110‧‧‧ circuit board

112‧‧‧電解電容器 112‧‧‧Electrical capacitor

112a、112b‧‧‧引線 112a, 112b‧‧‧ lead

114‧‧‧抗流線圈 114‧‧‧Current coil

116‧‧‧IC零件 116‧‧‧IC parts

120‧‧‧第1殼體 120‧‧‧1st housing

122‧‧‧第2殼體 122‧‧‧2nd housing

124‧‧‧本體部 124‧‧‧ Body Department

126‧‧‧裝設部 126‧‧‧Installation Department

128‧‧‧錐體部分 128‧‧‧ cone section

130‧‧‧延伸突出部分 130‧‧‧Extensions

131‧‧‧第1外徑部分 131‧‧‧1st outer diameter section

132‧‧‧第2外徑部分 132‧‧‧2nd outer diameter section

136‧‧‧螺狀部份 136‧‧‧Spiral part

140‧‧‧基座部 140‧‧‧Base section

142‧‧‧單元收納部 142‧‧‧Unit Storage Department

142a‧‧‧傾斜部 142a‧‧‧ inclined section

143a‧‧‧支持突起 143a‧‧‧Support protrusion

143b‧‧‧卡止爪 143b‧‧‧Card claws

144、146‧‧‧延伸突出的筒狀部分 144, 146‧‧‧ Extended cylindrical part

148‧‧‧延伸突出部 148‧‧‧Extensions

150‧‧‧黏著劑 150‧‧‧Adhesive

152‧‧‧嵌合筒體 152‧‧‧Mating cylinder

154‧‧‧段差部 154‧‧‧Departure

162‧‧‧凸部 162‧‧‧ convex

162‧‧‧限制機構 162‧‧‧Restricted institutions

164‧‧‧凸部 164‧‧‧ convex

203‧‧‧發光二極體模組 203‧‧‧Lighting diode module

205‧‧‧基台 205‧‧‧Abutment

205a‧‧‧小徑部 205a‧‧‧Little Trails Department

205b‧‧‧大徑部 205b‧‧‧The Great Trails Department

205c‧‧‧外圓周面 205c‧‧‧ outer circumferential surface

205d‧‧‧凸出部份 205d‧‧‧ protruding part

205e‧‧‧底面 205e‧‧‧ bottom

206‧‧‧本體 206‧‧‧ Ontology

207‧‧‧殼體 207‧‧‧Shell

207a‧‧‧端部 207a‧‧‧End

209‧‧‧燈球 209‧‧‧light ball

209a‧‧‧端部 209a‧‧‧End

209b‧‧‧外圓周面 209b‧‧‧ outer circumferential surface

211‧‧‧電路單元 211‧‧‧ circuit unit

213‧‧‧電路殼體 213‧‧‧ circuit housing

213a‧‧‧殼體本體 213a‧‧‧Shell body

213b‧‧‧蓋體 213b‧‧‧ cover

215‧‧‧燈頭構件 215‧‧‧Light head components

217‧‧‧安裝基板 217‧‧‧Installation substrate

218‧‧‧發光二極體元件 218‧‧‧Lighting diode components

219‧‧‧封裝體 219‧‧‧Package

221‧‧‧螺絲 221‧‧‧ screws

223‧‧‧黏著劑 223‧‧‧Adhesive

225‧‧‧電路基板 225‧‧‧ circuit board

226‧‧‧IC零件 226‧‧‧IC parts

227a‧‧‧配線 227a‧‧‧Wiring

227b‧‧‧配線 227b‧‧‧Wiring

228‧‧‧燈頭 228‧‧‧ lamp holder

229‧‧‧絶緣構件 229‧‧‧Insulating components

230‧‧‧凹入部 230‧‧‧ recessed

232‧‧‧段差部 232‧‧‧Departure

301‧‧‧發光二極體燈具 301‧‧‧Lighting diode lamps

303‧‧‧發光二極體元件 303‧‧‧Lighting diode components

305‧‧‧發光二極體模組 305‧‧‧Lighting diode module

307‧‧‧燈球 307‧‧‧light ball

307a‧‧‧球狀部 307a‧‧‧spherical

307b‧‧‧筒狀部 307b‧‧‧Cylinder

307c‧‧‧段差部 307c‧‧‧Departure

307d‧‧‧膨脹部分 307d‧‧‧Expanded part

309‧‧‧殼體 309‧‧‧Shell

309a‧‧‧大徑部 309a‧‧‧The Great Trails Department

309b‧‧‧小徑部 309b‧‧‧Little Trails Department

309c‧‧‧段差部 309c‧‧‧Departure

309d‧‧‧內圓周面 309d‧‧‧ inner circumference

309e‧‧‧凸出部份 309e‧‧‧ protruding part

309f‧‧‧端緣 309f‧‧‧ edge

310‧‧‧本體 310‧‧‧ Ontology

311‧‧‧燈頭 311‧‧‧ lamp holder

313‧‧‧基台 313‧‧‧Abutment

313a‧‧‧小徑部 313a‧‧‧The Small Trails Department

313b‧‧‧大徑部 313b‧‧‧The Great Trails Department

313c‧‧‧底面 313c‧‧‧ bottom

315‧‧‧電路單元 315‧‧‧ circuit unit

317‧‧‧延伸構件 317‧‧‧Extension members

317a‧‧‧凸部 317a‧‧‧ convex

321‧‧‧安裝基板 321‧‧‧Installation substrate

321a‧‧‧孔部 321a‧‧‧ Hole Department

323‧‧‧封裝體 323‧‧‧Package

324‧‧‧銲錫 324‧‧‧ solder

327‧‧‧外殼部 327‧‧‧ Shell Department

329‧‧‧絶緣材料 329‧‧‧Insulation materials

331‧‧‧接觸片部 331‧‧‧Contacts

333、335‧‧‧引線 333, 335‧‧‧ lead

337‧‧‧凹入部 337‧‧‧ recessed department

339‧‧‧黏著劑 339‧‧‧Adhesive

341‧‧‧電路基板 341‧‧‧ circuit board

343、345‧‧‧電子零件 343,345‧‧‧Electronic parts

347‧‧‧卡止構造 347‧‧‧Lock construction

349、351‧‧‧引線 349, 351‧‧‧ leads

353、355、357、359‧‧‧貫通孔 353, 355, 357, 359‧ ‧ through holes

401‧‧‧本體 401‧‧‧ Ontology

403‧‧‧凹入部 403‧‧‧ recessed

405‧‧‧燈球 405‧‧‧light ball

407‧‧‧缺口部分 407‧‧‧ gap section

409‧‧‧突出部分 409‧‧‧ highlight

D1‧‧‧第1平面 D1‧‧‧1st plane

D2‧‧‧第2平面 D2‧‧‧2nd plane

Z‧‧‧中心軸 Z‧‧‧ center axis

【圖1】係第1實施態樣之照明裝置的剖面圖。 Fig. 1 is a cross-sectional view showing a lighting device of a first embodiment.

【圖2】係第1實施態樣之發光二極體燈具外觀的立體圖。 Fig. 2 is a perspective view showing the appearance of a light-emitting diode lamp of the first embodiment.

【圖3】係第1實施態樣之發光二極體燈具的剖面圖。 Fig. 3 is a cross-sectional view showing a light-emitting diode lamp according to a first embodiment.

【圖4】係第1實施態樣之基台的立體剖面圖。 Fig. 4 is a perspective cross-sectional view showing a base of the first embodiment.

【圖5】係第1實施態樣之發光二極體燈具的分解立體圖。 Fig. 5 is an exploded perspective view showing the light-emitting diode lamp of the first embodiment.

【圖6】係第1實施態樣之發光二極體燈具上部的分解立體圖。 Fig. 6 is an exploded perspective view showing the upper portion of the light-emitting diode lamp of the first embodiment.

【圖7】係第2實施態樣1之發光二極體燈具的前視圖。 Fig. 7 is a front elevational view showing a light-emitting diode lamp of a second embodiment.

【圖8】係第2實施態樣1之發光二極體燈具的剖面圖。 Fig. 8 is a cross-sectional view showing a light-emitting diode lamp according to a second embodiment.

【圖9】係第2實施態樣2之發光二極體燈具的立體圖。 Fig. 9 is a perspective view showing a light-emitting diode lamp according to a second embodiment.

【圖10】係第2實施態樣2之發光二極體燈具的剖面圖。 Fig. 10 is a cross-sectional view showing a light-emitting diode lamp according to a second embodiment.

【圖11】係表示凹入部之變化實施例的圖。 Fig. 11 is a view showing a modified embodiment of the concave portion.

以下,就本發明之發光二極體燈具及照明裝置之範例的實施態樣,參照圖式進行說明。 Hereinafter, an embodiment of an example of a light-emitting diode lamp and a lighting device according to the present invention will be described with reference to the drawings.

又,在發明的實施態樣中所使用的材料、數值僅用於示範較佳實施例,而本發明並不限定於此態樣。另外,在不脫離本發明之技術思想的範圍內, 可在該範圍中進行適當的變化。另外,在不產生矛盾的範圍之內,其他實施態樣的組合係為可能。 Further, the materials and numerical values used in the embodiments of the invention are only used to exemplify the preferred embodiments, and the invention is not limited thereto. In addition, without departing from the technical idea of the present invention, Appropriate changes can be made in this range. In addition, combinations of other embodiments are possible within the scope of no contradiction.

以下所說明的燈具包含:本體,其係由將基台裝設於筒狀之殼體的一端所形成;半導體發光元件,其設置於該本體的基台表面;以及燈球,其在覆蓋該半導體發光元件的狀態之下,裝設於該本體之上;該本體具有凹入部,其以符合該燈球之開口側端部的至少一部分的方式凹入;在該燈球中,該燈球之開口側端部的至少一部份插入該凹入部,並且藉由配置於該凹入部內的黏著劑固定於其中;在該凹入部中,構成該凹入部的面當中,沿著該燈球之開口側端部插入該凹入部的插入方向之部分的面上,具有在該凹入部內朝向該燈球側凸出的凸出形狀,該凹入部的開口緣抵接於該燈球的外圓周面。藉此,例如,與構成凹入部的面不是凸出形狀的情況相比,可減少黏著劑的使用量。 The luminaire described below includes a body formed by one end of a base mounted on a cylindrical casing, a semiconductor light emitting element disposed on a surface of the base of the body, and a light ball covering the same The semiconductor light-emitting element is mounted on the body; the body has a concave portion recessed in conformity with at least a portion of the open-side end of the light ball; in the light ball, the light ball At least a portion of the opening-side end portion is inserted into the recessed portion, and is fixed therein by an adhesive disposed in the recessed portion; in the recessed portion, among the faces constituting the recessed portion, along the lamp ball The opening-side end portion is inserted into a surface of the portion in the insertion direction of the recessed portion, and has a convex shape that protrudes toward the bulb side in the recessed portion, and an opening edge of the recessed portion abuts against the bulb Circumferential surface. Thereby, for example, the amount of the adhesive to be used can be reduced as compared with the case where the surface constituting the concave portion is not a convex shape.

另外,在該燈球中,僅有抵接於該凹入部之開口緣的部分與該凹入部接觸。藉此,例如可抑制本體側的熱傳至燈球側。或是該燈球位於該凹入部內之開口側端部的至少一部分,與構成該凹入部的面接觸。藉此,例如可促進本體側的熱傳至燈球側。更進一步,該燈球之開口側端部的至少一部份其前端的厚度,以比該開口側端部的厚度更厚的狀態膨脹凸出。藉此,假設在凹入部內,燈球的開口側端部與黏著劑剝離的情況下,膨脹凸出的部分亦卡止於黏著劑上,故可防止燈球從本體脫落。 Further, in the bulb, only a portion abutting against the opening edge of the recess is in contact with the recess. Thereby, for example, heat transfer on the body side can be suppressed to the bulb side. Or the lamp ball is located at least a portion of the opening-side end portion of the recessed portion, and is in contact with a surface constituting the recessed portion. Thereby, for example, heat transfer to the bulb side can be promoted. Further, at least a portion of the opening-side end portion of the bulb is expanded and protruded in a state where the thickness of the front end is thicker than the thickness of the opening-side end portion. Therefore, in the case where the opening side end portion of the bulb is separated from the adhesive in the recessed portion, the portion which is inflated and protruded is also stuck to the adhesive, so that the bulb can be prevented from falling off from the main body.

<第1實施態樣> <First embodiment>

1.照明裝置 Lighting device

圖1係第1實施態樣之照明裝置1的剖面圖。 Fig. 1 is a cross-sectional view showing a lighting device 1 according to a first embodiment.

照明裝置1包含:照明器具5,其利用天花板3的開口3a埋設於天花板3之中;以及發光二極體燈具7,其安裝於照明器具5上。又,在後述的段落中,進行關於發光二極體燈具7的說明。 The lighting device 1 includes a lighting fixture 5 that is embedded in the ceiling 3 by an opening 3a of the ceiling 3, and a light-emitting diode lamp 7 that is attached to the lighting fixture 5. Further, in the paragraphs to be described later, the description of the light-emitting diode lamp 7 will be made.

照明器具5,係用於所謂的吊燈,其包含:碗狀的器具本體9、用來裝 設燈具的插槽11、使插槽11以既定角度相對器具本體9傾斜且使其與器具本體9連結的連結構件13以及與商用電源連接的連接部15。又,在插槽中,可裝設本實施態樣之發光二極體燈具7,或是白熾燈泡、mini krypton燈泡及燈泡形螢光燈具等以往的燈具。 The lighting fixture 5 is used for a so-called chandelier, which comprises: a bowl-shaped appliance body 9 for loading A slot 11 for the lamp, a connecting member 13 for tilting the slot 11 toward the fixture body 9 at a predetermined angle and coupled to the fixture body 9, and a connecting portion 15 connected to the commercial power source are provided. Further, in the slot, the light-emitting diode lamp 7 of the present embodiment or a conventional lamp such as an incandescent light bulb, a mini krypton bulb, and a bulb-shaped fluorescent lamp can be mounted.

在插槽11中,插槽11的中心軸Y(亦為發光二極體燈具7的中心軸)以既定的傾斜角度A相對於器具本體9的中心軸X傾斜,例如傾斜70度。又,插槽的傾斜角度,以中心軸X、Y的交點O當作中心,並將延伸至該交點O的更上方的中心軸X當作起點。 In the slot 11, the central axis Y of the slot 11 (also the central axis of the light-emitting diode lamp 7) is inclined with respect to the central axis X of the fixture body 9 at a predetermined inclination angle A, for example, by 70 degrees. Further, the inclination angle of the slot is centered on the intersection O of the central axes X and Y, and the center axis X extending further above the intersection point O is taken as the starting point.

2.發光二極體燈具 2. Light-emitting diode lamps

圖2係第1實施態樣之發光二極體燈具7的外觀立體圖,圖3係第1實施態樣之發光二極體燈具7的剖面圖。圖4係基台44的立體剖面圖。另外,圖5係發光二極體燈具7的分解立體圖,圖6係發光二極體燈具7上部的分解立體圖。 Fig. 2 is an external perspective view of the light-emitting diode lamp 7 of the first embodiment, and Fig. 3 is a cross-sectional view of the light-emitting diode lamp 7 of the first embodiment. 4 is a perspective cross-sectional view of the base 44. 5 is an exploded perspective view of the light-emitting diode lamp 7, and FIG. 6 is an exploded perspective view of the upper portion of the light-emitting diode lamp 7.

圖3的假想線Z,係燈頭20的中心軸,亦為發光二極體燈具7之中心軸的燈具軸。另外,在圖3之中的假想線Z,若發光二極體燈具7裝設於照明器具5當中,則與圖1所示的假想線Y一致。 The imaginary line Z of Fig. 3 is the central axis of the base 20 and is also the lamp axis of the central axis of the light-emitting diode lamp 7. Further, in the imaginary line Z in FIG. 3, when the light-emitting diode lamp 7 is mounted in the lighting fixture 5, it coincides with the imaginary line Y shown in FIG.

發光二極體燈具7,特別如圖3所示,包含:燈頭20,其可自由地裝設於照明器具5的插槽11上;本體22,其具有平坦面(基台44的底面62),該平坦面可以燈頭20(發光二極體燈具7)的中心軸Z為中心進行旋轉,並以此方式與本體22連結,且以既定的角度B相對燈頭20的中心軸Z傾斜;發光二極體模組24,其搭載於本體22的平坦面上;電路單元26,其使發光二極體模組24點燈;電路殼體28,其收納於本體22內且覆蓋電路單元26;以及燈球30,其覆蓋發光二極體模組24。 The light-emitting diode lamp 7, particularly as shown in FIG. 3, comprises: a lamp cap 20 which is freely mountable on the slot 11 of the lighting fixture 5; and a body 22 having a flat surface (the bottom surface 62 of the base 44) The flat surface is rotatable about the central axis Z of the base 20 (light-emitting diode lamp 7), and is coupled to the body 22 in this manner, and is inclined with respect to the central axis Z of the cap 20 at a predetermined angle B; The pole body module 24 is mounted on a flat surface of the body 22; the circuit unit 26 lights the LED module 24; the circuit housing 28 is housed in the body 22 and covers the circuit unit 26; The light ball 30 covers the light emitting diode module 24.

此處,上述的平坦面,如圖4所示,存在於基台44的頂面。又,在發光二極體模組24點燈時所產生的熱,透過基台44傳至殼體42,並從該殼體42放出至大氣當中。因此,殼體42亦具有散熱片的功能。 Here, the flat surface described above exists on the top surface of the base 44 as shown in FIG. Further, heat generated when the light-emitting diode module 24 is turned on is transmitted to the casing 42 through the base 44, and is discharged from the casing 42 to the atmosphere. Therefore, the housing 42 also has the function of a heat sink.

(1)燈頭20 (1) lamp holder 20

燈頭20,如圖2、圖3及圖5所示,為了合用於照明器具5(其亦可裝設以往的燈具之燈泡;參照圖1),故係使用與以往的燈具之燈頭相同的元件,例如使用JIS(日本工業規格)所規定的E型與G型。 As shown in FIG. 2, FIG. 3 and FIG. 5, the base 20 is used for the lighting fixture 5 (which can also be equipped with a bulb of a conventional lamp; see FIG. 1), so that the same components as those of the conventional lamp are used. For example, E type and G type specified by JIS (Japanese Industrial Standards) are used.

此處的燈頭20為E17,如圖3所示,接觸片36透過絶緣連接體38與筒狀的外殼34連接。外殼34及接觸片36,透過配線40a、40b與電路單元26連接。又,燈頭20,利用外殼34的內螺紋部與電路殼體28的裝設部126螺合。 Here, the base 20 is E17. As shown in FIG. 3, the contact piece 36 is connected to the cylindrical outer casing 34 through the insulating connecting body 38. The outer casing 34 and the contact piece 36 are connected to the circuit unit 26 through the wirings 40a and 40b. Further, the base 20 is screwed to the mounting portion 126 of the circuit case 28 by the female screw portion of the outer casing 34.

(2)本體22 (2) Ontology 22

本體22,如圖3及圖5所示,包含:筒狀的殼體42,其在兩端具有開口;以及基台44,以封蓋殼體42的一端之開口的方式,裝設於該一端部上。此處的殼體42的一端,係指與燈頭20存在之處相反的一端,意即燈球30所存在的一端,而另一端係指與燈球30存在之處相反的一端,意即燈頭20所存在的一端。另外,假想線Z係表示殼體42的中心軸,亦可表示為中心軸Z。 As shown in FIGS. 3 and 5, the main body 22 includes a cylindrical casing 42 having an opening at both ends, and a base 44 mounted on the opening of one end of the casing 42. On one end. The end of the casing 42 herein refers to the end opposite to the position where the lamp cap 20 exists, that is, the end where the lamp ball 30 exists, and the other end refers to the end opposite to the existence of the lamp ball 30, that is, the lamp cap. One end of 20. Further, the imaginary line Z indicates the central axis of the casing 42, and may be expressed as the central axis Z.

殼體42與基台44,例如,係以將基台44壓入殼體42,並藉由黏著劑固定的方式互相結合,而本體22藉由後述之機構形成相對燈頭20自由旋轉的態樣(但可旋轉的角度未滿360°)。又,亦可使用其他的習知技術,例如螺絲、鉚接、焊接等方式,將殼體42與基台44結合為一體,以構成本體22。 The housing 42 and the base 44 are, for example, pressed into the housing 42 and joined to each other by means of an adhesive, and the body 22 is formed to be freely rotatable relative to the base 20 by a mechanism to be described later. (But the angle of rotation is less than 360°). Further, the housing 42 and the base 44 may be integrated into one another to form the body 22 by other conventional techniques such as screwing, riveting, welding, or the like.

(2-1)殼體42 (2-1) Housing 42

殼體42,如圖3及圖5所示,係剖面形狀為圓環狀的筒狀,且直徑隨著中心軸Z上的一端到另一端漸小的圓錐台狀。具體而言,殼體42係由傾斜部46、延伸突出部48以及突出部50所構成;傾斜部46以從殼體42的中心軸Z的一端至另一端逐漸靠近中心軸Z的方式傾斜,延伸突出部48係在另一端上朝向中心軸Z彎曲且延伸突出,突出部50係在與中心軸Z平行的方向上從延伸突出部48朝另一端突出。 As shown in FIGS. 3 and 5, the casing 42 has a cylindrical shape having a circular cross-sectional shape and a truncated cone shape having a diameter which gradually decreases from one end to the other end on the central axis Z. Specifically, the housing 42 is constituted by the inclined portion 46, the extended protruding portion 48, and the protruding portion 50; the inclined portion 46 is inclined so as to gradually approach the central axis Z from one end to the other end of the central axis Z of the housing 42. The extension protrusion 48 is bent and extended toward the center axis Z at the other end, and the protrusion 50 protrudes from the extension protrusion 48 toward the other end in a direction parallel to the center axis Z.

此處,殼體42係由熱傳導率高的材料,例如鋁等材料所構成,其具有放熱功能與傳熱功能。又,延伸突出部48並未到達殼體42的中心軸Z,而開口49(參照圖3)係由延伸突出部48的內圓周面所形成。 Here, the casing 42 is made of a material having a high thermal conductivity, such as a material such as aluminum, which has an exothermic function and a heat transfer function. Further, the extending projection 48 does not reach the central axis Z of the housing 42, and the opening 49 (refer to FIG. 3) is formed by the inner circumferential surface of the extending projection 48.

(2-2)基台44 (2-2) Abutment 44

圖4係基台44的立體剖面圖。 4 is a perspective cross-sectional view of the base 44.

基台44,如圖3、圖4及圖6,特別如圖3所示,其形狀近似於以兩個平面將燈球截斷的形狀。兩個平面,係在燈球的下端附近與燈具軸Z垂直交叉的第1平面D1,以及在離開第1平面D1的位置,相對於第1平面D1傾斜的第2平面D2,該兩平面在基台44的外觀上並未互相交叉。又,基台44,係藉由高熱傳導率材料,例如鋁等材料所構成。 The base 44, as shown in Fig. 3, Fig. 4 and Fig. 6, particularly as shown in Fig. 3, has a shape similar to the shape in which the bulb is cut in two planes. The two planes are a first plane D1 that vertically intersects the lamp axis Z near the lower end of the lamp ball, and a second plane D2 that is inclined with respect to the first plane D1 at a position away from the first plane D1. The abutments 44 do not intersect each other in appearance. Further, the base 44 is made of a material having a high thermal conductivity material such as aluminum.

在基台44被第1平面D1截斷的一側,形成封蓋殼體42之一端的蓋部52。在將基台44裝設於殼體42上的狀態下,如圖3所示,蓋部52的外圓周大略與殼體42之一端的外圓周一致。 On the side where the base 44 is cut by the first plane D1, a cover portion 52 that covers one end of the cover case 42 is formed. In a state where the base 44 is mounted on the casing 42, as shown in FIG. 3, the outer circumference of the cover portion 52 substantially coincides with the outer circumference of one end of the casing 42.

蓋部52,如圖3及圖4所示,包含抵接於殼體42之一端面的抵接部分52a,以及從比該抵接部分52a稍微往內側後退的位置朝向殼體42的一端之內部突出的突出部分52b。突出部分52b的外圓周,稍微大於殼體42之一端之端部的內圓周,並且藉由將突出部分52b壓入殼體42之一端的端部,將基台44裝設(結合)於殼體42上。 As shown in FIGS. 3 and 4, the lid portion 52 includes an abutting portion 52a that abuts against one end surface of the casing 42, and an end portion of the casing 42 that is slightly retracted from the abutting portion 52a. An inner protruding portion 52b. The outer circumference of the protruding portion 52b is slightly larger than the inner circumference of the end portion of one end of the housing 42, and the base 44 is attached (bonded) to the case by pressing the protruding portion 52b into the end of one end of the housing 42. On body 42.

基台44,如圖3所示,包含第1凹入部56,其以第2平面D2作為基準而從該第2平面D2往內側凹入;以及第2凹入部58,其從蓋部52的中央往內側凹入。 As shown in FIG. 3, the base 44 includes a first recessed portion 56 which is recessed from the second plane D2 on the basis of the second plane D2, and a second recessed portion 58 from the lid portion 52. The center is concave toward the inside.

第1凹入部56,其底面62如圖3所示,係以角度B相對於中心軸Z傾斜的方式凹入。該角度B小於第2平面D2與燈具軸Z之間的角度,而底面62從第2平面D2所凹入的量,在離開第1平面D1與第2平面D2交叉側後逐漸減小。 As shown in FIG. 3, the first concave portion 56 has a bottom surface 62 recessed so that the angle B is inclined with respect to the central axis Z. The angle B is smaller than the angle between the second plane D2 and the lamp axis Z, and the amount of the bottom surface 62 recessed from the second plane D2 gradually decreases after leaving the first plane D1 and the second plane D2.

因此,在從圖3的箭號C方向觀察基台44時(從與燈具軸Z垂直的方向觀察發光二極體燈具7時),底面62以下側部分為前方側、上側部分為後方側的方式傾斜。在此傾斜的底面62之中央位置,搭載(載置)了發光二極體模組24。 Therefore, when the base 44 is viewed from the direction of the arrow C in Fig. 3 (when the light-emitting diode lamp 7 is viewed from a direction perpendicular to the lamp axis Z), the lower side of the bottom surface 62 is the front side and the upper side is the rear side. The way is tilted. The light-emitting diode module 24 is mounted (mounted) at the center of the inclined bottom surface 62.

又,在底面62上,未與連接發光二極體模組24的端子構件86、88抵接的2邊的外側,具有用來決定發光二極體模組24之位置的段差部63a、63b(參照圖6)。 Further, on the bottom surface 62, the step portions 63a and 63b for determining the position of the light-emitting diode module 24 are provided on the outer sides of the two sides that are not in contact with the terminal members 86 and 88 to which the light-emitting diode module 24 is connected. (Refer to Figure 6).

因為在基台44中搭載發光二極體模組24的部分(底面62的中央部分),係以在離開第1平面D1與第2平面D2交叉側後,從第2平面D2所凹入的量逐漸減小的方式傾斜,故在中央部分的外側(外周),形成用以裝設燈球30的開口側之端部64的凹入部65。 The portion (the central portion of the bottom surface 62) on which the light-emitting diode module 24 is mounted on the base 44 is recessed from the second plane D2 after being separated from the first plane D1 and the second plane D2. Since the amount is gradually decreased, the concave portion 65 for arranging the end portion 64 on the opening side of the bulb 30 is formed on the outer side (outer circumference) of the center portion.

凹入部65,在第1平面D1與第2平面D2交叉側(靠近交叉位置側),因為底面62的凹入量變大而消失。換言之,凹入部65,在基台44中靠近第2平面D2側,與第1凹入部56相連,而被第1凹入部56吸收。若再以另外的方式來說明,凹入部65在第1平面D1與第2平面D2交叉側,凹入部的幅度變得較大。 The recessed portion 65 is on the side where the first plane D1 intersects with the second plane D2 (close to the intersection position side), and the amount of recessed in the bottom surface 62 is large and disappears. In other words, the recessed portion 65 is connected to the first recessed portion 56 on the side of the base 44 near the second plane D2, and is absorbed by the first recessed portion 56. Further, the recessed portion 65 is on the side where the first plane D1 intersects the second plane D2, and the width of the recessed portion becomes large.

在凹入部65中,構成該凹入部的部份的面上形成往凹入部65內之燈球30側凸出的凸出形狀。此處,凹入部65,如圖3及圖4所示,係由在發光二極體模組24附近位置的內側面65a、與內側面65a相對且夾住空間的外側面65b以及底面65c的3個面所構成。具有上述往燈球30側凸出的凸出形狀的面,即為外側面65b。換言之,凹入部65具有往燈球30側凸出的凸出部分65d。此處的凸出部份65d,係在圓周方向上,形成於全圓周之上(亦包含第1凹入部56內)。由外側面65b的形狀變化所形成的邊界線65e,因為凸出部份65而在圓周方向上形成連續的態樣。 In the concave portion 65, the surface of the portion constituting the concave portion is formed in a convex shape that protrudes toward the side of the bulb 30 in the concave portion 65. Here, as shown in FIGS. 3 and 4, the recessed portion 65 is formed by the inner side surface 65a at a position near the light-emitting diode module 24, and the outer side surface 65b and the bottom surface 65c which face the inner side surface 65a and sandwich the space. It consists of three faces. The surface having the convex shape protruding toward the side of the bulb 30 is the outer side surface 65b. In other words, the recessed portion 65 has a convex portion 65d that protrudes toward the side of the light ball 30. Here, the convex portion 65d is formed in the circumferential direction over the entire circumference (including also in the first concave portion 56). The boundary line 65e formed by the shape change of the outer side surface 65b forms a continuous state in the circumferential direction because of the convex portion 65.

第2凹入部58,如圖3所示,為了使電路殼體28之一部份插入其中,故以與該電路殼體28之一部份的形狀、大小對應的方式凹入。具體而言,凹入的形狀,係如同以與第1凹入部56之底面62平行的假想平面傾斜地截斷柱子的形狀,在從C方向觀察時,係以相對於第1平面D1,從前方側往後方側逐漸變深(從燈頭20離開)的方式凹入。 As shown in FIG. 3, the second recessed portion 58 is recessed in such a manner as to correspond to the shape and size of a portion of the circuit case 28 in order to insert a part of the circuit case 28. Specifically, the shape of the recess is such that the shape of the column is cut obliquely with respect to a virtual plane parallel to the bottom surface 62 of the first recessed portion 56, and is viewed from the front side with respect to the first plane D1 when viewed from the C direction. It is recessed in such a manner that it gradually becomes deeper toward the rear side (away from the base 20).

在第1凹入部56與第2凹入部58之間的底板66上,形成貫通孔68、70,其用於使發光二極體模組24透過配線82、84(參照圖5)與電路單元26電性連接(參照圖6)。 Through holes 68 and 70 are formed in the bottom plate 66 between the first recessed portion 56 and the second recessed portion 58 for transmitting the light emitting diode module 24 through the wirings 82 and 84 (refer to FIG. 5) and the circuit unit. 26 electrical connection (refer to Figure 6).

(3)發光二極體模組24 (3) Light-emitting diode module 24

發光二極體模組24,如圖3所示,包含:安裝基板72,其在表面上具有配線圖樣(省略圖式);複數發光二極體元件74,其安裝於安裝基板72的表面上;以及封裝體76,其收整複數發光二極體元件74並將其封裝。 As shown in FIG. 3, the LED module 24 includes a mounting substrate 72 having a wiring pattern on the surface (omitted from the drawing), and a plurality of LED components 74 mounted on the surface of the mounting substrate 72. And a package 76 that rounds and packages the plurality of light emitting diode elements 74.

在圖3當中,雖表示了6個安裝於發光二極體模組24中的發光二極體元件74,但包含以封裝體76覆蓋的其他發光二極體元件(74),總計安裝了36個發光二極體元件。又,發光二極體元件74的安裝數量並不限於該數量,燈具的規格,可根據發光二極體元件之規格等條件適當的決定。 In FIG. 3, six LED components 74 mounted in the LED module 24 are shown, but other LED components (74) covered by the package 76 are provided, and a total of 36 are mounted. Light-emitting diode components. Further, the number of the light-emitting diode elements 74 to be mounted is not limited to this number, and the specifications of the lamps can be appropriately determined depending on conditions such as the specifications of the light-emitting diode elements.

安裝基板72,係由絶緣性材料(例如陶瓷)所構成,此處在俯視的情況下為正方形(參照圖6)。配線圖樣包含:連接部,其以串聯及/或並聯的方式連接安裝於安裝基板72上的複數發光二極體元件74;以及端子部78、80,其接收從電路單元26而來的電力(參照圖6)。 The mounting substrate 72 is made of an insulating material (for example, ceramic), and is square here in plan view (see FIG. 6). The wiring pattern includes: a connection portion that connects the plurality of light emitting diode elements 74 mounted on the mounting substrate 72 in series and/or in parallel; and terminal portions 78, 80 that receive power from the circuit unit 26 ( Refer to Figure 6).

又,端子部78、80,透過連接端子構件86、88(參照圖3及圖5),與通過基台44的貫通孔68、70與一對配線82、84(參照圖5)連接(該一對配線82、84係從基台44的內部導出至外部)。 Further, the terminal portions 78 and 80 are connected to the pair of wirings 82 and 84 (see FIG. 5) through the through holes 68 and 70 passing through the base 44 through the connection terminal members 86 and 88 (see FIGS. 3 and 5). The pair of wires 82 and 84 are led out from the inside of the base 44 to the outside.

封裝體76,由例如透光性樹脂(例如矽氧樹脂)等材料所構成,在需要變換從發光二極體元件74所發出的光波長的情況中,可將螢光體粉末等具 有變換波長功能的材料混入透光性樹脂當中。 The package body 76 is made of a material such as a light-transmitting resin (for example, a silicone resin). When it is necessary to change the wavelength of light emitted from the light-emitting diode element 74, the phosphor powder or the like can be used. A material having a function of changing wavelength is mixed in a light-transmitting resin.

例如,在從發光二極體模組24發出白光的情況中,可使用發出藍光的GaN系列的元件來當作發光二極體元件74,可使用(Ba、Sr)2SiO4:Eu2+與YAG:Ce3+等黄綠色螢光體粉末,以及Sr2Si5N8:Eu2+與(Sr、Ca)AlSiN3:Eu2+等紅色螢光體粉末來當作螢光體粉末。 For example, in the case where white light is emitted from the light-emitting diode module 24, a blue-emitting GaN-series element can be used as the light-emitting diode element 74, and (Ba, Sr) 2 SiO 4 :Eu 2+ can be used. A yellow-green phosphor powder such as YAG:Ce 3+, and a red phosphor powder such as Sr 2 Si 5 N 8 :Eu 2+ and (Sr, Ca)AlSiN 3 :Eu 2+ are used as the phosphor powder. .

又,在不以封裝體(76)來變換從發光二極體元件74所發出之光波長的情況中,例如在燈球30的內圓周面形成包含螢光體粉末的螢光膜,亦可發出白光。 Further, when the wavelength of light emitted from the light-emitting diode element 74 is not changed by the package (76), for example, a fluorescent film containing phosphor powder may be formed on the inner circumferential surface of the bulb 30. Give a white light.

發光二極體模組24,藉由圖6所示的保持板90,被壓附且固定於基台44的底面62之上。保持板90,如圖6所示,其整體大於發光二極體模組24,在與發光二極體模組24的封裝體76對應的部分(相當於中央部份)具有開口92。 The light emitting diode module 24 is pressed and fixed on the bottom surface 62 of the base 44 by the holding plate 90 shown in FIG. As shown in FIG. 6, the holding plate 90 is larger than the LED module 24, and has an opening 92 in a portion corresponding to the package 76 of the LED module 24 (corresponding to the central portion).

在保持板90中,於四角形的發光二極體模組24上相互對向的一組的邊,相當於形成端子部78、80側之邊的部分94、96,高於相當於另一組互相對向之邊的部分98、100。在此較高部分94、96與發光二極體模組24的安裝基板72之間配置了連接端子構件86、88(參照圖3)。 In the holding plate 90, the pair of sides facing each other on the square-shaped light-emitting diode module 24 corresponds to the portions 94, 96 forming the sides of the terminal portions 78, 80, which are higher than the other group. The parts 98, 100 that are opposite each other. The connection terminal members 86 and 88 are disposed between the upper portions 94 and 96 and the mounting substrate 72 of the LED module 24 (see FIG. 3).

藉此,在保持板90覆蓋發光二極體模組24時,保持板90的較低部分98、100抵接於安裝基板72的表面,較高的部分94、96抵接於連接端子構件86、88的頂面。在此狀態下,藉由螺絲102、104使保持板90較低的部分98、100與基台44的段差部63a、63b螺合,以將發光二極體模組24裝設於基台44上。 Thereby, when the holding plate 90 covers the LED module 24, the lower portions 98, 100 of the holding plate 90 abut against the surface of the mounting substrate 72, and the higher portions 94, 96 abut against the connecting terminal member 86. , the top surface of 88. In this state, the lower portions 98, 100 of the holding plate 90 are screwed to the step portions 63a, 63b of the base 44 by the screws 102, 104 to mount the light-emitting diode module 24 to the base 44. on.

又,連接端子構件86、88,具有與配線82、84連接的金屬製的彈簧片,此彈簧片,與發光二極體模組24的安裝基板72上之端子部78、80接觸,在將保持板90裝設於基台44之上時產生彈性變形。 Further, the connection terminal members 86 and 88 have metal spring pieces connected to the wirings 82 and 84, and the spring pieces are in contact with the terminal portions 78 and 80 on the mounting substrate 72 of the light-emitting diode module 24, and The retaining plate 90 is elastically deformed when it is mounted on the base 44.

又,發光二極體模組24,亦可藉由黏著劑固定於基台44的第1凹入部56的底面62上。在此情況中,因為發光二極體模組24與底面62透過黏著劑完全地密合,故可效率良好地將發光二極體模組24的熱傳遞至基台44。又,亦可透過導熱膠使發光二極體模組24與底面62熱接合。 Further, the light-emitting diode module 24 may be fixed to the bottom surface 62 of the first recessed portion 56 of the base 44 by an adhesive. In this case, since the light-emitting diode module 24 and the bottom surface 62 are completely adhered to each other through the adhesive, the heat of the light-emitting diode module 24 can be efficiently transmitted to the base 44. Moreover, the LED module 24 can be thermally bonded to the bottom surface 62 through the thermal conductive adhesive.

(4)電路單元26 (4) Circuit unit 26

電路單元26,利用透過燈頭20接收的電力,使發光二極體元件74點燈。電路單元26,如圖3及圖5所示,係由安裝於電路基板110上的複數電子零件等元件所構成,例如,由整流.平滑電路、DC/DC轉換器、控制電路等元件所構成。 The circuit unit 26 turns on the light-emitting diode element 74 by the power received through the lamp cap 20. The circuit unit 26, as shown in FIGS. 3 and 5, is composed of components such as a plurality of electronic components mounted on the circuit substrate 110, for example, by rectification. It consists of components such as smoothing circuits, DC/DC converters, and control circuits.

例如,可使用平流電路的電解電容器112、DC/DC轉換器的抗流線圈114、控制電路的IC零件116等元件來當作複數的電子零件。 For example, an electrolytic capacitor 112 of a smoothing circuit, a choke coil 114 of a DC/DC converter, an IC component 116 of a control circuit, and the like can be used as a plurality of electronic components.

在電路基板110中,分別於一主面上安裝抗流線圈114等電子零件,而在另一主面上安裝IC零件116。在後段中所述的電解電容器112,以配置於燈頭20內的方式,藉由引線112a、112b與電路基板110連接。 In the circuit board 110, electronic components such as the choke coil 114 are mounted on one main surface, and the IC component 116 is mounted on the other main surface. The electrolytic capacitor 112 described in the latter stage is connected to the circuit board 110 by wires 112a and 112b so as to be disposed in the base 20.

又,電路單元26,如上所述,係在全部或是部份收納於電路殼體28中的狀態下,被配置於本體22內。關於在電路殼體28中裝設電路單元26,將在後段中敘述。 Further, as described above, the circuit unit 26 is disposed in the main body 22 in a state in which all or part of the circuit unit 26 is housed in the circuit case 28. The circuit unit 26 is mounted in the circuit case 28, which will be described later.

(5)電路殼體28 (5) Circuit case 28

電路殼體28,如圖3及圖5所示,包含:第1殼體120,其主要收納於本體22之殼體42與燈頭20的內部;以及第2殼體122,其主要收納於本體22之基台44的內部。 As shown in FIGS. 3 and 5, the circuit case 28 includes a first case 120 that is mainly housed in the case 42 of the body 22 and the inside of the base 20, and a second case 122 that is mainly housed in the body. The interior of the base 44 of 22.

本體22,形成可相對電路殼體28的第1殼體120自由旋轉(360°以下)的態樣,另外,收納於基台44中的第2殼體122亦形成可相對於第1殼體120自由旋轉的態樣。 The main body 22 is formed to be rotatable relative to the first housing 120 of the circuit case 28 (360° or less), and the second housing 122 housed in the base 44 is also formed to be movable relative to the first housing. 120 free rotations.

(5-1)第1殼體120 (5-1) First housing 120

第1殼體120包含:本體部124,其收納於殼體42內;限制機構(162),其限制電路殼體28與本體22的旋轉;以及裝設部126,其上裝設了燈頭20與嵌合筒體152。裝設部126,係從殼體42的燈頭20側之端部的開口49突出殼體42的外部;限制機構(162),設置於裝設部126中,與殼體42之開口49對應的部分。 The first housing 120 includes a main body portion 124 housed in the housing 42, a restriction mechanism (162) that restricts rotation of the circuit housing 28 and the main body 22, and a mounting portion 126 on which the base 20 is mounted And the fitting cylinder 152. The mounting portion 126 protrudes from the opening 49 of the end portion of the housing 42 on the base 20 side, and the restricting mechanism (162) is provided in the mounting portion 126 corresponding to the opening 49 of the housing 42. section.

又,因為以燈頭20與嵌合筒體152自由旋轉地夾持本體22的殼體42,故第1殼體120具有作為構造構件的功能。 Moreover, since the housing 42 of the main body 22 is rotatably held by the base 20 and the fitting cylinder 152, the first housing 120 has a function as a structural member.

本體部124,具有錐體部分128,其對應殼體42的內圓周面的形狀,形成上側較寬的錐體狀;以及從錐體部分128的燈頭20之端部朝向中心軸延伸出來的延伸突出部分130(參照圖3)。延伸突出部分130的外側面(另一端的端面),如圖3所示,抵接於殼體42的延伸突出部48的內側面(一端的端面)。又,本體部124上側的端部,意即,與燈頭20相反側的端部,被第2殼體122封蓋。 The body portion 124 has a conical portion 128 corresponding to the shape of the inner circumferential surface of the housing 42 to form a wider cone shape on the upper side; and an extension extending from the end of the base portion of the cone portion 128 toward the central axis The protruding portion 130 (refer to FIG. 3). The outer side surface (the end surface of the other end) of the extending portion 130 is abutted against the inner side surface (the end surface of one end) of the extending projection 48 of the casing 42 as shown in FIG. Further, the upper end portion of the main body portion 124, that is, the end portion on the opposite side to the base 20, is covered by the second casing 122.

裝設部126,從第1殼體120之本體部124的延伸突出部分130朝向燈頭20以筒狀、此處為圓筒狀延伸出來。裝設部126,從本體部124側開始,依序包含:第1外徑部分131,其直徑小於殼體42之開口49的直徑且大於嵌合筒體152的內圓周的直徑;第2外徑部分132,其具有可嵌合於嵌合筒體152之內圓周面的直徑;以及螺狀部份136,其外圓周面形成螺絲。 The mounting portion 126 extends in a cylindrical shape from the extending portion 130 of the main body portion 124 of the first casing 120 toward the base 20 in a cylindrical shape. The mounting portion 126 includes, from the side of the main body portion 124, a first outer diameter portion 131 having a diameter smaller than a diameter of the opening 49 of the housing 42 and larger than a diameter of an inner circumference of the fitting cylinder 152; The diameter portion 132 has a diameter engageable to the inner circumferential surface of the fitting cylinder 152, and a spiral portion 136 whose outer circumferential surface forms a screw.

第1外徑部分131、第2外徑部分132的直徑小於在殼體42的延伸突出部48所形成的開口49的直徑,更進一步,螺狀部份136其外徑小於第2外徑部分132。藉此,裝設部126可透過開口49從殼體42的內側朝向外部突出。 The diameters of the first outer diameter portion 131 and the second outer diameter portion 132 are smaller than the diameter of the opening 49 formed in the extended projection 48 of the casing 42. Further, the outer diameter of the spiral portion 136 is smaller than the second outer diameter portion. 132. Thereby, the mounting portion 126 can protrude from the inner side of the casing 42 toward the outside through the opening 49.

限制機構(162),如圖5所示,係由形成於第1外徑部分131且朝向外部突出的1個凸部162所構成。該凸部162,在本體22相對第1殼體120旋轉時,在該旋轉不被限制的情況下旋轉至某位置時,與形成於殼體42之 延伸突出部48上的凸部164卡合。藉此可限制本體22相對第1殼體120的旋轉。 As shown in FIG. 5, the restricting mechanism (162) is composed of one convex portion 162 which is formed in the first outer diameter portion 131 and protrudes outward. When the main body 22 rotates relative to the first casing 120, the convex portion 162 rotates to a certain position when the rotation is not restricted, and is formed in the casing 42. The convex portion 164 on the extended protrusion 48 is engaged. Thereby, the rotation of the body 22 relative to the first housing 120 can be restricted.

第1殼體120,因為被當作構造構件來使用,故具有期望的機械特性(強度、剛性),例如,可利用樹脂(聚對苯二甲酸丁二酯(PBT),熱傳導率為0.2W/mK~0.3W/mK)等材料。 The first case 120 has a desired mechanical property (strength, rigidity) because it is used as a structural member. For example, a resin (polybutylene terephthalate (PBT)) having a thermal conductivity of 0.2 W can be used. /mK~0.3W/mK) and other materials.

(5-2)第2殼體122 (5-2) Second housing 122

第2殼體122,如圖3及圖5所示,包含板狀的基座部140,以及保持電路單元26中的電路基板110且收納部分電路單元26的單元收納部142,該第2殼體122可相對燈頭20自由旋轉。 As shown in FIGS. 3 and 5, the second casing 122 includes a plate-shaped base portion 140 and a unit housing portion 142 that houses the circuit board 110 in the circuit unit 26 and houses the partial circuit unit 26, and the second housing The body 122 is free to rotate relative to the base 20.

單元收納部142,其外觀形狀,係如同在傾斜方向上將圓柱截斷而留下部份頂面的形狀。將在傾斜方向上截斷的部分,意即傾斜的部分當作傾斜部142a。 The unit housing portion 142 has an outer shape that is like a shape in which the column is cut in the oblique direction to leave a part of the top surface. The portion that is cut in the oblique direction, that is, the portion that is inclined, is regarded as the inclined portion 142a.

單元收納部142,具有既定程度以上的厚度,內側面係沿著構成該外觀形狀的外側面的形狀,且藉由內側面形成收納部份電路單元26的收納空間。 The unit housing portion 142 has a thickness equal to or greater than a predetermined degree, and the inner side surface has a shape along the outer side surface constituting the outer shape, and the storage space of the housing portion circuit unit 26 is formed by the inner side surface.

在單元收納部142的內側面,形成固定電路單元26中的電路基板110的固定機構。具體而言,如圖3所示,係由支持突起143a與卡止爪143b所構成;該支持突起143a支持電路基板110的背面(安裝IC零件116側的面),該卡止爪143b卡止於電路基板110的表面(安裝抗流線圈114側的面)之邊緣。 A fixing mechanism of the circuit board 110 in the fixed circuit unit 26 is formed on the inner side surface of the unit housing portion 142. Specifically, as shown in FIG. 3, the support protrusion 143a and the locking claw 143b are formed. The support protrusion 143a supports the back surface of the circuit board 110 (the surface on the side where the IC component 116 is mounted), and the locking claw 143b is locked. The edge of the surface of the circuit board 110 (the surface on which the choke coil 114 is mounted).

在傾斜部142a上,如圖5所示,形成往外部延伸出去的延伸突出的筒狀部分144、146。此延伸突出的筒狀部分144、146,在組裝成為燈具時,插入基台44的貫通孔68、70內部,並使與發光二極體模組24電性連接的配線82、84通過其內部。 On the inclined portion 142a, as shown in Fig. 5, cylindrical portions 144, 146 which extend and protrude outward are formed. The cylindrical portions 144 and 146 which are extended and protruded are inserted into the through holes 68 and 70 of the base 44 when assembled into a lamp, and the wirings 82 and 84 electrically connected to the LED module 24 are passed through the inside. .

第2殼體122,為了具有可將電路單元26側的熱傳導至基台44的功能, 而以具有高熱傳導率的材料所構成,該熱傳導率至少高於第1殼體120與空氣的熱傳導率,例如,可使用樹脂等材料(將高熱傳導性的填充物(例如氧化鋁填充物等)混入聚對苯二甲酸丁二酯(PBT)的材料,熱傳導率為1W/mK~15W/mK)。 The second casing 122 has a function of transmitting heat on the side of the circuit unit 26 to the base 44. Further, the material has a high thermal conductivity, and the thermal conductivity is at least higher than the thermal conductivity of the first casing 120 and the air. For example, a material such as a resin (a filler having a high thermal conductivity (for example, an alumina filler, etc.) may be used. A material mixed with polybutylene terephthalate (PBT) having a thermal conductivity of 1 W/mK to 15 W/mK.

又,在以樹脂為主材料構成第1殼體120及第2殼體122的情況中,可藉由混入樹脂的填充量來調整其熱傳導率,若填充量增加,則熱傳導率提高,且可些許提升機械特性。 Further, when the first case 120 and the second case 122 are made of a resin-based material, the thermal conductivity can be adjusted by the amount of the resin mixed therein, and when the amount of the filler is increased, the thermal conductivity can be improved. A little improvement in mechanical properties.

(6)燈球30 (6) Light ball 30

燈球30,形成例如半球狀,外觀上類似mini krypton燈泡的燈球(玻璃部分)形狀的部份。意即,在燈球30裝設於本體22的狀態下,以燈球30與本體22構成類似白熾燈泡的燈泡形狀之形狀。燈球30,係在覆蓋發光二極體模組24的狀態下,裝設於本體22(基台44)上。 The light ball 30 is formed, for example, in a hemispherical shape, and looks like a portion of a light bulb (glass portion) of a mini krypton bulb. That is, in a state where the light ball 30 is mounted on the body 22, the light bulb 30 and the body 22 form a shape of a bulb shape similar to an incandescent light bulb. The light ball 30 is mounted on the main body 22 (the base 44) in a state of covering the light emitting diode module 24.

燈球30,如圖1及圖2所示,係在包含開口邊緣的假想面相對發光二極體燈具7的中心軸傾斜的狀態下,裝設於本體22上。 As shown in FIGS. 1 and 2, the illuminating ball 30 is attached to the main body 22 in a state where the imaginary plane including the opening edge is inclined with respect to the central axis of the illuminating diode lamp 7.

此處,燈球30之開口側端部64,係在插入基台44的第1凹入部56或凹入部65的狀態下,藉由配置於第1凹入部56或凹入部65中的黏著劑150,固定於基台44之上。 Here, the opening side end portion 64 of the bulb 30 is placed in the first recessed portion 56 or the recessed portion 65 in the state in which the first recessed portion 56 or the recessed portion 65 of the base 44 is inserted, and the adhesive is disposed in the first recessed portion 56 or the recessed portion 65. 150, fixed on the base 44.

(7)嵌合筒體152 (7) fitting cylinder 152

嵌合筒體152,以使本體22的殼體42可相對裝設於裝設部126上的燈頭20以及電路殼體28(第1殼體120)自由旋轉的方式,保持本體22的殼體42。嵌合筒體152包含其形狀與殼體42的另一端之形狀對應的內圓周面。具體而言,殼體42的另一端部形成段差狀,嵌合筒體152的內圓周面亦形成段差狀(段差部154)。藉此,可決定嵌合筒體152與殼體42的位置,而使殼體42在不搖動的情況下保持於電路殼體28與嵌合筒體152之間。 The fitting cylinder 152 is configured such that the housing 42 of the main body 22 can hold the housing of the main body 22 so as to be rotatable relative to the base 20 and the circuit housing 28 (the first housing 120) mounted on the mounting portion 126. 42. The fitting cylinder 152 includes an inner circumferential surface whose shape corresponds to the shape of the other end of the casing 42. Specifically, the other end portion of the casing 42 is formed in a stepped shape, and the inner circumferential surface of the fitting cylinder 152 is also formed in a stepped shape (segment portion 154). Thereby, the position of the fitting cylinder 152 and the casing 42 can be determined, and the casing 42 can be held between the circuit casing 28 and the fitting cylinder 152 without shaking.

在燈頭20的一端之端面抵接於該嵌合筒體152的狀態下,使燈頭20固定於裝設部126,藉此將嵌合筒體152裝設於電路殼體28之上。 When the end surface of one end of the base 20 abuts against the fitting cylinder 152, the base 20 is fixed to the mounting portion 126, whereby the fitting cylinder 152 is mounted on the circuit case 28.

3.旋轉限制 3. Rotation limit

在本實施態樣當中設置了限制機構(162、164),其限制本體22相對燈頭20進行360°以上的旋轉。這是因為,電路單元26係藉由配線40a、40b與燈頭20連接,若本體22進行360°以上的旋轉,則配線40a、40b可能被截斷或是從燈頭20脫落,而這樣的限制旋轉係為了防止上述情況的發生。 In the present embodiment, a restriction mechanism (162, 164) is provided which restricts rotation of the body 22 with respect to the base 20 by 360 or more. This is because the circuit unit 26 is connected to the base 20 by the wires 40a and 40b. If the body 22 rotates 360° or more, the wires 40a and 40b may be cut off or detached from the base 20, and such a limited rotation system In order to prevent this from happening.

另外可防止在將發光二極體燈具7裝設至插槽11之際,在載持燈球30與基台44的情況下將發光二極體燈具7旋入插槽11時,燈球30與基台44相對於燈頭20空轉。 In addition, when the light-emitting diode lamp 7 is mounted to the slot 11 and the light-emitting diode lamp 7 is screwed into the slot 11 while the light ball 30 and the base 44 are being carried, the light ball 30 is prevented. The base 44 is idling with respect to the base 20.

限制旋轉機構,係在燈頭20(電路殼體28)相對殼體42(本體22)旋轉時,使設置於電路殼體28側的卡止機構(凸部162),與設置於殼體42側的被卡止機構(凸部164)在既定的旋轉位置卡合,並藉此限制該旋轉。 When the base 20 (the circuit case 28) is rotated relative to the casing 42 (the main body 22), the locking mechanism (the convex portion 162) provided on the circuit casing 28 side is disposed on the casing 42 side. The locked mechanism (protrusion 164) engages at a predetermined rotational position and thereby limits the rotation.

又,亦可分別將卡止機構設置於殼體側、將被卡止機構設置於電路殼體側。另外,其他的機構,例如,藉由位於電路殼體與燈頭之中心軸上的螺絲,將電路殼體裝設於燈頭,藉由使電路殼體相對螺絲自由旋轉,亦可使電路殼體相對於燈頭自由旋轉。 Further, the locking mechanism may be provided on the casing side and the locked mechanism may be provided on the circuit casing side. In addition, other mechanisms, for example, the circuit housing is mounted on the base by screws located on the central axis of the circuit housing and the base, and the circuit housing can be relatively rotated by freely rotating the circuit housing relative to the screw. Free rotation of the lamp cap.

以下對卡止機構及被卡止機構進行具體的說明。 The locking mechanism and the locked mechanism will be specifically described below.

於電路殼體28之第1殼體120的第1外徑部分131,在與殼體42的開口49之內圓周面對向之部分的1處,具有朝向殼體42的開口面凸出的凸部162(參照圖5)。 The first outer diameter portion 131 of the first casing 120 of the circuit case 28 has a portion facing the inner circumference of the opening 49 of the casing 42 and has a convex surface that faces the opening surface of the casing 42. The convex portion 162 (see Fig. 5).

另一方面,於構成殼體42的開口49的內圓周面,在與第1殼體120的第1外徑部分131相對向的部分之1處,具有朝向殼體42之中心軸Z凸出的凸部164(參照圖5)。 On the other hand, the inner circumferential surface of the opening 49 constituting the casing 42 has a convex portion toward the central axis Z of the casing 42 at a portion facing the first outer diameter portion 131 of the first casing 120. The convex portion 164 (see Fig. 5).

藉由上述的構造,在殼體42的凸部164抵接於電路殼體28之第1殼 體120的第1外徑部分131的外圓周面的狀態下使殼體42旋轉,最後凸部162抵接於殼體42之凸部164之上(卡合),而以此方式將該旋轉限制於360°之內。 With the above configuration, the convex portion 164 of the casing 42 abuts against the first casing of the circuit casing 28 The housing 42 is rotated in the state of the outer circumferential surface of the first outer diameter portion 131 of the body 120, and finally the convex portion 162 abuts (engages) the convex portion 164 of the housing 42, and the rotation is performed in this manner. Limited to 360°.

另外,在上述說明當中,本體22雖相對燈頭20形成自由旋轉的構造,其亦可以例如使構成本體22的基台(44)相對於殼體(42)自由旋轉的方式裝設。 Further, in the above description, the main body 22 is configured to freely rotate with respect to the base 20, and for example, the base (44) constituting the main body 22 may be rotatably provided with respect to the casing (42).

4.將燈球30裝設於本體22之上 4. Mounting the light ball 30 on the body 22

將燈球30裝設於本體22之上,係將燈球30之開口側的端部64插入基台44的第1凹入部56與凹入部65中,並藉由配置(填充)於第1凹入部56的一部分與凹入部65中的黏著劑150固定於其中。 The lamp ball 30 is mounted on the main body 22, and the end portion 64 of the opening side of the lamp ball 30 is inserted into the first recessed portion 56 and the recessed portion 65 of the base 44, and is placed (filled) in the first portion. A portion of the recess 56 and the adhesive 150 in the recess 65 are fixed therein.

具體而言,係使基台44的第1凹入部56形成向上的態樣且使第2平面D2形成水平的態樣,並以此方式使本體22傾斜,在這樣的態樣之下,對第1凹入部56的既定位置與凹入部65的內部供給硬化前的黏著劑。 Specifically, the first recessed portion 56 of the base 44 is formed in an upward state and the second flat surface D2 is formed in a horizontal state, and the body 22 is tilted in this manner. Under such an aspect, The predetermined position of the first recessed portion 56 and the inside of the recessed portion 65 are supplied with an adhesive before curing.

黏著劑的供給方法,例如可使用分配器,亦可使用其他的方法。此時,因為在凹入部65當中形成如圖4所示的凸出部份65d,故可以在凹入部65內的凸出部份65d的根部之邊界線65e與凸出部份65d為基準,來判斷所供給的黏著劑的量是否過多。 As a method of supplying the adhesive, for example, a dispenser may be used, and other methods may be used. At this time, since the convex portion 65d as shown in FIG. 4 is formed in the concave portion 65, the boundary line 65e and the convex portion 65d of the root portion of the convex portion 65d in the concave portion 65 can be used as a reference. To judge whether the amount of the adhesive supplied is excessive.

具體的說明,若在供給規定量的黏著劑的情況下凸出部份65d形成整體被埋入的態樣,則在黏著劑供給量太少的情況下凸出部份65d則會露出,故可藉由目視直接發現供給量不足。 Specifically, if the convex portion 65d is formed as a whole in a case where a predetermined amount of the adhesive is supplied, the convex portion 65d is exposed when the amount of the adhesive supply is too small, so that the convex portion 65d is exposed. It is possible to directly find that the supply amount is insufficient by visual observation.

或是,在僅供給規定量的黏著劑的情況下,凸出部份65d為例如露出1mm左右的態樣,而在黏著劑的供給量較少的情況中,凸出部份65d的露出量較多,則可藉由目視直接發現供給量不足。 Alternatively, when only a predetermined amount of the adhesive is supplied, the convex portion 65d is exposed to, for example, a shape of about 1 mm, and in the case where the supply amount of the adhesive is small, the exposure amount of the convex portion 65d is small. If there are more, the supply amount can be directly found by visual observation.

另外,即使是在黏著劑比規定量更多的情況下,因為凹入部65抵接於 燈球30的外側面,故可防止黏著劑從凹入部65流出至外部。 In addition, even in the case where the adhesive is more than a predetermined amount, since the concave portion 65 abuts The outer side surface of the bulb 30 prevents the adhesive from flowing out of the recessed portion 65 to the outside.

<第2實施態樣> <Second embodiment>

在第1實施態樣當中,本體22的凹入部65係形成於基台44之上,另外,凹入部65,因為第1凹入部56的關係(凹入部65包含第1凹入部56),故係以對應燈球30之開口側的端部64之全圓周的一部分的方式所構成。 In the first embodiment, the recessed portion 65 of the main body 22 is formed on the base 44, and the recessed portion 65 is in the relationship of the first recessed portion 56 (the recessed portion 65 includes the first recessed portion 56). It is configured to correspond to a part of the entire circumference of the end portion 64 of the opening side of the bulb 30.

然而,凹入部可設置於本體上,亦可在例如基台與殼體上形成凹入部。在第2實施態樣當中,就凹入部形成於基台與殼體上的2種態樣進行說明。 However, the recessed portion may be provided on the body, and a recessed portion may be formed on, for example, the base and the housing. In the second embodiment, two aspects in which the concave portion is formed on the base and the casing will be described.

1.形態1 Form 1

圖7係第2實施態樣1之發光二極體燈具201的前視圖,圖8係第2實施態樣1之發光二極體燈具201的剖面圖。又,在圖8當中,為了了解凹入部230內的構造,在面向圖式之左側的凹入部的擴大圖中,省略黏著劑223的圖式。 Fig. 7 is a front view of the light-emitting diode lamp 201 of the second embodiment, and Fig. 8 is a cross-sectional view of the light-emitting diode lamp 201 of the second embodiment. Further, in Fig. 8, in order to understand the structure in the concave portion 230, the pattern of the adhesive 223 is omitted in the enlarged view of the concave portion on the left side of the drawing.

發光二極體燈具201包含:發光二極體模組203,其具備作為光源的發光二極體元件218;基台205,其搭載發光二極體模組203;殼體207,其一端裝設了基台205;燈球209,其覆蓋發光二極體模組203;電路單元211,其使發光二極體元件218點燈;電路殼體213,其內部收納電路單元211,且配置於殼體207內;以及燈頭構件215,其設置於殼體207的另一端。 The light-emitting diode lamp 201 includes a light-emitting diode module 203 having a light-emitting diode element 218 as a light source, a base 205 mounted with a light-emitting diode module 203, and a housing 207 having one end mounted thereon. a base 205; a light ball 209 covering the light emitting diode module 203; a circuit unit 211 for lighting the light emitting diode element 218; and a circuit case 213 for accommodating the circuit unit 211 therein and disposed in the case Inside the body 207; and a cap member 215 disposed at the other end of the housing 207.

又,本體206係由殼體207與基台205所組合而成之裝置。 Further, the body 206 is a device in which the housing 207 and the base 205 are combined.

發光二極體模組203,與第1實施態樣相同,包含安裝基板217、複數發光二極體元件218、封裝體219,封裝體219係由將透光性材料(例如矽氧樹脂等材料)混入波長變換材料(例如螢光體粒子)所形成。 The light-emitting diode module 203 includes a mounting substrate 217, a plurality of light-emitting diode elements 218, and a package 219, and the package 219 is made of a light-transmissive material (for example, a material such as a silicone resin), similarly to the first embodiment. ) formed by mixing in a wavelength converting material such as a phosphor particle.

基台205,在該表面上搭載發光二極體模組203的同時,封住殼體207的一端。基台205,具有將在發光二極體元件218點燈時所產生的熱傳遞至殼體207的功能,其係使用高熱傳導性的材料(例如鋁)。 The base 205 is provided with a light-emitting diode module 203 on the surface, and seals one end of the casing 207. The base 205 has a function of transmitting heat generated when the light-emitting diode element 218 is turned on to the casing 207, and a material having high thermal conductivity (for example, aluminum) is used.

在第2實施態樣1當中,基台205係由盤狀,例如圓盤狀的構件所構成,其被壓入殼體207的一端,另外,其藉由螺絲221與電路殼體213連結。 In the second embodiment, the base 205 is formed of a disk-shaped member such as a disk-shaped member, and is pressed into one end of the casing 207, and is coupled to the circuit case 213 by a screw 221.

基台205在燈球209側具有小徑部205a,在燈頭構件215側具有外徑大於小徑部205a的大徑部205b。基台205的外圓周面,因為小徑部205a及大徑部205b而形成段差狀。在此段差部232與殼體207的一端部之間形成凹入部230。 The base 205 has a small diameter portion 205a on the side of the bulb 209, and has a large diameter portion 205b having an outer diameter larger than the small diameter portion 205a on the base member 215 side. The outer circumferential surface of the base 205 is formed in a stepped shape by the small diameter portion 205a and the large diameter portion 205b. A concave portion 230 is formed between the step portion 232 and one end portion of the casing 207.

殼體207為筒狀,其分別在一端上安裝了上述的基台205,在另一端上安裝了燈頭構件215。在殼體207中,由基台205接收在點燈時從發光二極體元件218所產生的熱,其亦具有輻射此熱的功能,可使用熱輻射性高的材料(例如鋁)。 The casing 207 has a cylindrical shape, and the above-described base 205 is attached to one end, and the base member 215 is attached to the other end. In the casing 207, heat generated from the light-emitting diode element 218 at the time of lighting is received by the base 205, which also has a function of radiating this heat, and a material having high heat radiation (for example, aluminum) can be used.

在殼體207的內部收納了電路殼體213之殼體本體213a,而殼體本體213a的一部分從殼體207的另一端往外部延伸出去,並在該延伸突出的部份裝設有燈頭構件215。 A housing body 213a of the circuit housing 213 is housed inside the housing 207, and a part of the housing body 213a extends outward from the other end of the housing 207, and a base member is mounted on the extended protruding portion. 215.

電路單元211,係在電路基板225上安裝有複數電子零件的元件,並收納於電路殼體213當中。電路單元211與發光二極體模組203係藉由配線227a、227b電性連接。IC零件226為電子零件之一,其安裝於電路基板225側的主面上,該主面係接近基台205的一側。 The circuit unit 211 is an element in which a plurality of electronic components are mounted on the circuit board 225 and housed in the circuit case 213. The circuit unit 211 and the LED module 203 are electrically connected by wires 227a and 227b. The IC part 226 is one of electronic parts mounted on the main surface on the side of the circuit board 225, which is close to the side of the base 205.

電路殼體213,具有殼體本體213a與蓋體213b,分別由絶緣性材料所形成。可使用例如合成樹脂(具體為聚對苯二甲酸丁二酯(PBT))來當作絶緣性材料。 The circuit case 213 has a case body 213a and a cover body 213b, each of which is formed of an insulating material. For example, a synthetic resin (particularly polybutylene terephthalate (PBT)) can be used as the insulating material.

蓋體213b,為了具有將電路單元211側的熱傳導至基台205的功能,故由熱傳導性高的材料所構成。又,殼體本體213a,可由與蓋體203b相同的材料所構成,亦可由具有與在第1實施態樣中的第1殼體120相同的機 械特性優良的材料所構成。 The lid body 213b is made of a material having high thermal conductivity in order to have a function of conducting heat on the circuit unit 211 side to the base 205. Further, the casing body 213a may be made of the same material as the lid body 203b, or may have the same machine as the first casing 120 in the first embodiment. It consists of materials with excellent mechanical properties.

此處的燈頭構件215亦為E型,其具有用以確保燈頭228與殼體207之絶緣性的絶緣構件229。 The base member 215 herein is also of the E-shape and has an insulating member 229 for ensuring insulation between the base 228 and the housing 207.

燈球209,嵌入(插入)在組合基台205與殼體207時所形成的上述凹入部230當中,藉由將黏著劑223填充至該凹入部230中,而被固定(黏著)於基台205及殼體207之上。又,以下就凹入部進行詳細的說明。 The light bulb 209 is embedded (inserted) in the recessed portion 230 formed when the base 205 and the housing 207 are combined, and is fixed (adhered) to the base by filling the adhesive 223 into the recessed portion 230. 205 and above the housing 207. In addition, the recessed part will be described in detail below.

凹入部230,係由基台205外圓周的段差部232與殼體207之一端的端部207a所形成。在構成凹入部230的面當中,基台205(其小徑部205a)的外圓周面205c凸出燈球209之開口側的端部209a側,形成凸出部份205d。 The recessed portion 230 is formed by the step portion 232 of the outer circumference of the base 205 and the end portion 207a of one end of the housing 207. Among the faces constituting the recessed portion 230, the outer circumferential surface 205c of the base 205 (the small diameter portion 205a) protrudes from the side of the end portion 209a on the opening side of the bulb 209 to form a convex portion 205d.

在構成凹入部230的面上,殼體207的一端之端部207a的內圓周面之端緣與燈球209的外圓周面209b連接。凹入部230的底面205e與燈球209的開口側之端部209a接觸。藉此,可將基台205的熱傳導至燈球209側,故可抑制基台205(發光二極體模組203)的溫度上升。 On the surface constituting the concave portion 230, the end edge of the inner circumferential surface of the end portion 207a of one end of the casing 207 is connected to the outer circumferential surface 209b of the bulb 209. The bottom surface 205e of the recessed portion 230 is in contact with the end portion 209a on the opening side of the bulb 209. Thereby, the heat of the base 205 can be conducted to the side of the bulb 209, so that the temperature rise of the base 205 (light emitting diode module 203) can be suppressed.

2.形態2 2. Form 2

圖9係第2實施態樣2之發光二極體燈具301的立體圖,圖10係第2實施態樣2之發光二極體燈具301的剖面圖。又,在圖10中,為了了解凹入部337內的構造,在面向圖式的左側的凹入部之擴大圖當中,省略黏著劑339的圖式。 Fig. 9 is a perspective view of a light-emitting diode lamp 301 according to a second embodiment, and Fig. 10 is a cross-sectional view of the light-emitting diode lamp 301 of the second embodiment. Further, in Fig. 10, in order to understand the structure in the concave portion 337, the pattern of the adhesive 339 is omitted in the enlarged view of the concave portion on the left side facing the drawing.

在發光二極體燈具301中,於燈球307內包含發光二極體模組305,其具備發光二極體元件303以作為光源。在燈球307的開口側端部,安裝殼體309。此殼體309為筒狀。 In the light-emitting diode lamp 301, a light-emitting diode module 305 is included in the light ball 307, and is provided with a light-emitting diode element 303 as a light source. A housing 309 is attached to the opening side end of the bulb 307. This housing 309 has a cylindrical shape.

在殼體309的另一端(圖10中的下側)安裝燈頭311。另外,殼體309之一端的開口由基台313所封阻。在殼體309之內部收納了電路單元315。在基台313上,安裝延伸構件317,其延伸至燈球307內且其前端安裝發光 二極體模組305。 A lamp cap 311 is attached to the other end of the housing 309 (the lower side in Fig. 10). In addition, the opening at one end of the housing 309 is blocked by the base 313. The circuit unit 315 is housed inside the casing 309. On the base 313, an extension member 317 is mounted which extends into the bulb 307 and has a front end mounted with illumination Diode module 305.

發光二極體模組305,包含在俯視的情況下為矩形的安裝基板321、以2列安裝於安裝基板321表面的複數發光二極體元件303及以列為單位覆蓋各列複數發光二極體元件303的封裝體323。此處,為了不使安裝基板321遮蔽在從發光二極體元件303所發出的光線中,朝向後方(燈頭311側)所發出的光線,故使用透光性材料(例如玻璃或是氧化鋁等材料)來形成安裝基板321。 The light-emitting diode module 305 includes a mounting substrate 321 which is rectangular in a plan view, a plurality of light-emitting diode elements 303 which are mounted on the surface of the mounting substrate 321 in two rows, and a plurality of light-emitting diodes which are arranged in units of columns. The package 323 of the body element 303. Here, in order to prevent the mounting substrate 321 from being shielded from the light emitted from the light-emitting diode element 303 and toward the rear (the side of the base 311), a light-transmitting material (for example, glass or alumina) is used. Material) to form the mounting substrate 321.

燈球307,係與白熾燈泡的球狀體(亦稱為玻璃球狀體)相同的形狀,意即所謂的A型。燈球307包含為中空球狀的球狀部307a以及為筒狀的筒狀部307b。筒狀部307b,其直徑依照離開球狀部307a的距離逐漸縮小。又,燈球307係以透光性材料(例如,玻璃材料與樹脂材料等材料)所構成。 The light bulb 307 has the same shape as the spheroid (also referred to as a glass spheroid) of an incandescent light bulb, which is a so-called type A. The bulb 307 includes a spherical portion 307a having a hollow spherical shape and a cylindrical portion 307b having a cylindrical shape. The cylindrical portion 307b has a diameter that gradually decreases in accordance with the distance from the spherical portion 307a. Further, the bulb 307 is made of a light transmissive material (for example, a material such as a glass material or a resin material).

殼體309的形狀,為近似白熾燈泡之燈泡的形狀。意即,殼體309係對應位於白熾燈泡當中的燈泡之燈頭側的部分,其形狀與白熾燈泡此部分的形狀相似。殼體309,在中心軸方向上分別在燈球側具有一半的大徑部309a,以及在燈頭側具有另一半的小徑部309b,在大徑部309a與小徑部309b之間產生段差部309c。 The shape of the housing 309 is similar to the shape of a bulb of an incandescent light bulb. That is, the housing 309 corresponds to the portion of the bulb side of the bulb among the incandescent bulbs, and its shape is similar to that of the portion of the incandescent bulb. The casing 309 has a large diameter portion 309a having a half on the bulb side in the central axis direction and a small diameter portion 309b having the other half on the base side, and a step portion is formed between the large diameter portion 309a and the small diameter portion 309b. 309c.

在殼體309中,大徑部309a的端部被基台313所封阻,燈球307插入形成於殼體309的大徑部309a與基台313之間的凹入部337,並且藉由黏著劑339固定該燈球307。又,本體310係由殼體309與基台313所構成。燈頭311以覆蓋殼體309的小徑部309b的方式裝設於其上。殼體309係藉由樹脂材料,例如聚對苯二甲酸丁二酯(PBT)所構成。 In the casing 309, the end portion of the large diameter portion 309a is blocked by the base 313, and the bulb 307 is inserted into the concave portion 337 formed between the large diameter portion 309a of the casing 309 and the base 313, and is adhered by The lamp 339 fixes the lamp ball 307. Further, the body 310 is composed of a housing 309 and a base 313. The base 311 is attached to the small diameter portion 309b of the casing 309. The casing 309 is made of a resin material such as polybutylene terephthalate (PBT).

殼體309,其一端的開口被上述的基台313封阻,另一端的開口被燈頭311所封阻,藉此,在內部形成的空間中收納了電路單元315。 The casing 309 has an opening at one end thereof blocked by the base 313, and an opening at the other end is blocked by the base 311, whereby the circuit unit 315 is housed in a space formed therein.

燈頭311,係在發光二極體燈具301裝設於照明器具上並且點燈時,從 照明器具的插槽接收電力的元件。雖無特別限定燈頭311的種類,但是此處為具有於筒狀之圓周壁形成螺紋的外殼部327、隔著絶緣材料329裝設於外殼部327上的接觸片部331的E型。 The lamp cap 311 is mounted on the lighting fixture when the LED lamp 301 is mounted and lit. The socket of the lighting fixture receives the components of the power. Although the type of the base 311 is not particularly limited, it is an E-shape having a case portion 327 in which a cylindrical peripheral wall is formed with a screw, and a contact piece portion 331 which is attached to the case portion 327 via an insulating material 329.

基台313,具有小徑部313a,以及其直徑大於小徑部313a之直徑的大徑部313b,大徑部313b的外圓周面抵接於殼體309的大徑部309a之內圓周面。藉此,在小徑部313a與殼體309的內圓周面之間,形成沿著殼體309之內圓周面的凹入部337。又,在凹入部337之中,如圖10所示,插入了燈球307之開口側的端部307c,並藉由黏著劑339將燈球307固定於本體310上。 The base 313 has a small diameter portion 313a and a large diameter portion 313b having a diameter larger than the diameter of the small diameter portion 313a, and the outer circumferential surface of the large diameter portion 313b abuts against the inner circumferential surface of the large diameter portion 309a of the casing 309. Thereby, a concave portion 337 along the inner circumferential surface of the casing 309 is formed between the small diameter portion 313a and the inner circumferential surface of the casing 309. Further, in the recessed portion 337, as shown in FIG. 10, the end portion 307c on the opening side of the bulb 307 is inserted, and the bulb 307 is fixed to the body 310 by the adhesive 339.

在本形態2中的基台313,除了具有封阻殼體309之大徑部309a的開口的功能之外,亦具有在收納於內部的電路單元315使發光二極體元件303發光時,將所產生的熱傳導至殼體309的功能。另外,其具有將從延伸構件317所傳遞而來的熱(該熱為點燈時發光二極體元件303所產生的熱)傳導至燈球307與殼體309的功能。因此,基台313與燈球307在凹入部337內互相接觸。 In addition to the function of the opening of the large-diameter portion 309a of the sealing case 309, the base 313 of the second embodiment has a function of blocking the light-emitting diode element 303 when the circuit unit 315 housed inside is turned on. The generated heat is conducted to the function of the housing 309. In addition, it has a function of transmitting heat transmitted from the extension member 317 (the heat is generated by the light-emitting diode element 303 at the time of lighting) to the bulb 307 and the housing 309. Therefore, the base 313 and the bulb 307 are in contact with each other in the recessed portion 337.

電路單元315,與態樣1相同,係由電路基板341與安裝於該電路基板341之上的各種電子零件343、345所構成。電路基板341,係利用卡止構造347固定於殼體309的內部。 The circuit unit 315 is the same as the aspect 1 and is composed of a circuit board 341 and various electronic components 343 and 345 mounted on the circuit board 341. The circuit board 341 is fixed to the inside of the casing 309 by the locking structure 347.

延伸構件317,在燈球307的中央位置支持發光二極體模組305。延伸構件317為棒狀,其上端(一端)部與發光二極體模組305結合,下端(另一端)部安裝於基台313上。 The extension member 317 supports the LED module 305 at a central position of the bulb 307. The extension member 317 has a rod shape, and an upper end (one end) portion thereof is coupled to the light emitting diode module 305, and a lower end portion (the other end portion) is attached to the base 313.

延伸構件317的上端(一端)部與發光二極體模組305結合,如圖9所示,延伸構件317的頂面的凸部317a,在與發光二極體模組305的安裝基板321的略中央的孔部321a嵌合的狀態下,以黏著劑(省略圖式)將其固定(結合)於安裝基板321上。 The upper end (one end) of the extension member 317 is coupled to the LED module 305. As shown in FIG. 9, the convex portion 317a of the top surface of the extension member 317 is on the mounting substrate 321 of the LED module 305. In a state in which the hole portion 321a at the center is fitted, the adhesive is fixed (bonded) to the mounting substrate 321 with an adhesive (omitted from the drawing).

延伸構件317,具有在基台313之上支持發光二極體模組305的功能。其具有將在發光時於發光二極體元件303所產生的熱傳導至基台313的功能。藉由使用熱傳導性高的材料可實現此傳熱功能。 The extension member 317 has a function of supporting the LED module 305 over the base 313. It has a function of conducting heat generated by the light-emitting diode element 303 to the base 313 at the time of light emission. This heat transfer function can be achieved by using a material having high thermal conductivity.

電路單元315,係以分別插入並且通過基台313的貫通孔357、359、延伸構件317的貫通孔353、355的引線349、351,來與發光二極體模組305連接。 The circuit unit 315 is connected to the light-emitting diode module 305 by the through holes 357 and 359 of the base 313 and the leads 349 and 351 of the through holes 353 and 355 of the extending member 317, respectively.

電路單元315,藉由引線333、335與燈頭311連接。又,引線349、351藉由銲錫324與發光二極體模組305連接。 The circuit unit 315 is connected to the base 311 by wires 333 and 335. Further, the leads 349 and 351 are connected to the light-emitting diode module 305 by solder 324.

設置於本體310的凹入部337,在構成該凹入部337的面之中,殼體309的內圓周面309d,往燈球307之開口側的端部307c側凸出,形成凸出部份309e。 The concave portion 337 provided in the main body 310, and the inner circumferential surface 309d of the casing 309 protrudes toward the end portion 307c of the opening side of the bulb 307, forming a convex portion 309e. .

凸出部份309e,具有防止基台313從殼體309脫落的功能,其係在基台313插入殼體309之後,從外側將與凹入部337對應的殼體309部分壓入(局部地推壓)所形成。又,凸出部份309e,只要成為在目視凹入部337內之黏著劑339的填充量時的基準即可,可為複數個,亦可為1個。 The protruding portion 309e has a function of preventing the base 313 from coming off the casing 309, and after the base 313 is inserted into the casing 309, the casing 309 corresponding to the recessed portion 337 is partially pressed in from the outside (partially pushed Formed by pressure). Further, the protruding portion 309e may be a reference for a filling amount of the adhesive 339 in the visual concave portion 337, and may be plural or one.

在構成凹入部337的面上,殼體309之一端的端部的內圓周面之端緣309f抵接於燈球307的外圓周面。另外,凹入部337的底面313c與燈球307之開口側的端部307c的膨脹部分307d接觸。又,膨脹部分307d,其厚度比在端部307c中位於端部前方位置的部分的壁厚更大,且係在厚度方向上凸出的部份。 On the surface constituting the concave portion 337, the end edge 309f of the inner circumferential surface of the end portion of one end of the casing 309 abuts against the outer circumferential surface of the bulb 307. Further, the bottom surface 313c of the recessed portion 337 is in contact with the expanded portion 307d of the end portion 307c on the opening side of the bulb 307. Further, the expanded portion 307d has a thickness larger than a portion of the end portion 307c at a position in front of the end portion, and is a portion which is convex in the thickness direction.

<變化實施例> <Variable embodiment>

1.本體 Ontology

在實施態樣當中的本體,雖具有基台被插入殼體之一端的構造,但是亦可為例如,像是筒狀的殼體的一端插入基台內的構造,亦可為以基台覆 蓋殼體之一端的一部分的構造。 In the embodiment, the main body has a structure in which the base is inserted into one end of the casing, but may be, for example, a structure in which one end of the cylindrical casing is inserted into the base, or may be covered with a base. A configuration of a portion of one end of the cover housing.

殼體與基台的裝設,可使用黏著劑,亦可使用將基台相對於殼體旋入螺合的方法。更進一步,在將基台插入殼體內的情況中,亦可使用將基台壓入殼體內的壓入方法,亦可適用該等方法的組合方法。 The housing and the base may be provided with an adhesive, or a method of screwing the base relative to the housing. Further, in the case where the base is inserted into the casing, a press-fitting method of pressing the base into the casing may be used, and a combination of the methods may be applied.

關於本體的材料,在從發光二極體模組直接(參照第1實施態樣)或是間接(參照第2實施態樣2)將傳導至本體(基台)的熱積極地往殼體側傳遞的情況下,使用熱傳導率高的材料,而在不將熱傳導至殼體側的情況下,使用熱傳導率不佳的材料即可。例如,在使用樹脂材料的情況中,藉由混入氧化鋁填充物等熱傳導性高的材料,可調整本體(基台、殼體)的熱傳導率。 Regarding the material of the main body, the heat conducted to the main body (base) is actively directed to the casing side from the light-emitting diode module directly (see the first embodiment) or indirectly (see the second embodiment 2). In the case of transfer, a material having a high thermal conductivity is used, and when heat is not conducted to the side of the casing, a material having a poor thermal conductivity may be used. For example, in the case of using a resin material, the thermal conductivity of the body (base, casing) can be adjusted by mixing a material having high thermal conductivity such as an alumina filler.

在將本體的熱積極地傳導至殼體側的情況中,若本體與殼體的接觸面積變大,則傳導變得困難,故宜減少本體與殼體的接觸面積。另外,在使用黏著劑固定本體與殼體的情況中,在希望將本體側的熱積極地傳導至殼體側時,使用熱傳導率高的黏著劑,在希望不容易傳導時,則宜使用熱傳導性低的黏著劑。 In the case where the heat of the body is actively conducted to the side of the casing, if the contact area between the body and the casing becomes large, conduction becomes difficult, so it is preferable to reduce the contact area between the body and the casing. Further, in the case where the body and the casing are fixed by using an adhesive, when it is desired to positively conduct heat on the body side to the casing side, an adhesive having a high thermal conductivity is used, and when it is desired to be difficult to conduct, heat conduction is preferably used. Low adhesive.

2.凹入部 2. Recessed part

在實施態樣中的凹入部,於第1實施態樣中形成於基台44,在第2實施態樣中雖形成跨越基台205、313與殼體207、309的態樣,亦可例如將凹入部形成於殼體上。在殼體上形成凹入部的情況中,可使殼體一端的厚度較大,以在此部分設置凹入部。 The concave portion in the embodiment is formed on the base 44 in the first embodiment, and in the second embodiment, the surface 205, 313 and the casings 207 and 309 are formed, for example. The recessed portion is formed on the housing. In the case where the concave portion is formed on the casing, the thickness of one end of the casing can be made large to provide the concave portion at this portion.

凹入部,如同在第2實施態樣中所說明,可為使燈球的開口側的端部之全部插入其中的態樣,亦可為使燈球的開口側的端部之一部份插入其中的態樣。 As described in the second embodiment, the recessed portion may be a portion in which the end portion on the opening side of the bulb is inserted, or a part of the end portion on the opening side of the bulb may be inserted. The way it is.

圖11係表示凹入部的變化實施例的圖。 Fig. 11 is a view showing a modified embodiment of the concave portion.

在如圖11所示的變化實施例當中,本體401之一端(在圖中為上端)具 有複數的凹入部403,此處為6個。燈球405,其開口側的端部在圓周方向上,隔著間隔設置有複數的缺口部分407(此處為與本體401的凹入部403對應的6個),並且在圓周方向上相鄰連接的缺口部分407之間,形成突出部分409。 In a variant embodiment as shown in Figure 11, one end of the body 401 (upper end in the figure) has There are a plurality of concave portions 403, here six. The bulb 405 has an opening-side end portion which is provided with a plurality of notch portions 407 (here, six corresponding to the concave portion 403 of the body 401) at intervals in the circumferential direction, and is adjacently connected in the circumferential direction. A protruding portion 409 is formed between the notched portions 407.

燈球405,係藉由將燈球405的突出部分409插入本體401的凹入部403,並在此狀態下以黏著劑將其固定於凹入部403內的方式,來裝設於本體401之上。 The lamp ball 405 is mounted on the body 401 by inserting the protruding portion 409 of the lamp ball 405 into the recessed portion 403 of the body 401 and fixing it in the recessed portion 403 with an adhesive in this state. .

又,此處,燈球405之開口側的端部的突出部分409的個數,雖與本體401之凹入部403的個數一致,但是若燈球405的突出部分409與本體401的凹入部403之位置對應,則燈球405的突出部分409的個數,亦可少於本體401的凹入部403的個數。 Here, the number of the protruding portions 409 at the end portions on the opening side of the bulb 405 is the same as the number of the recessed portions 403 of the main body 401, but the protruding portion 409 of the bulb 405 and the recess of the body 401 are concave. The position of the entrance portion 403 corresponds to the number of the protruding portions 409 of the lamp ball 405, which may be less than the number of the concave portions 403 of the body 401.

在凹入部中的凸出部份,只要在構成凹入部的面中沿著燈球的開口側之端部插入凹入部的方向上的部份的面,往凹入部內的燈球側凸出即可,亦可為例如,在構成凹入部的面上,沿著燈球的開口側的端部插入凹入部的方向的兩個面之中,在將靠近燈具軸側的面當作內側面,較遠側的面當作外側面時,將凸出部份設置於內側面或外側面,更宜在內側面與外側面的兩者皆設置凸出部份。 The convex portion in the concave portion protrudes toward the side of the bulb in the concave portion as long as the surface of the portion in the direction in which the concave portion is inserted along the end portion of the opening side of the bulb in the surface constituting the concave portion Alternatively, for example, on the surface constituting the concave portion, the two surfaces in the direction in which the concave portion is inserted along the opening side end of the bulb, and the surface near the shaft side of the lamp are regarded as the inner side. When the far side is regarded as the outer side, the protruding portion is disposed on the inner side surface or the outer side surface, and it is preferable to provide a convex portion on both the inner side surface and the outer side surface.

另外,在凹入部內,不需要對於圓周方向上的全部的面形成凸出部份,亦可如第2實施態樣2中所說明的,複數地隔著間隔設置凸出部份,亦可僅設置1個凸出部份。 Further, in the concave portion, it is not necessary to form the convex portion for all the surfaces in the circumferential direction, and as described in the second embodiment 2, the protruding portion may be provided at a plurality of intervals. Only one protruding part is set.

20‧‧‧燈頭 20‧‧‧ lamp holder

22‧‧‧本體 22‧‧‧Ontology

24‧‧‧發光二極體模組 24‧‧‧Lighting diode module

26‧‧‧電路單元 26‧‧‧ circuit unit

28‧‧‧電路殼體 28‧‧‧ circuit housing

30‧‧‧燈球 30‧‧‧light ball

34‧‧‧外殼 34‧‧‧Shell

36‧‧‧接觸片 36‧‧‧Contacts

38‧‧‧絶緣連接體 38‧‧‧Insulated connectors

40a、40b‧‧‧配線 40a, 40b‧‧‧ wiring

42‧‧‧殼體 42‧‧‧Shell

44‧‧‧基台 44‧‧‧Abutment

46‧‧‧傾斜部 46‧‧‧ inclined section

48‧‧‧延伸突出部 48‧‧‧Extensions

49‧‧‧開口 49‧‧‧ openings

50‧‧‧突出部 50‧‧‧Protruding

52‧‧‧蓋部 52‧‧‧ 盖部

52a‧‧‧抵接部分 52a‧‧‧Apartment

52b‧‧‧突出部分 52b‧‧‧ highlight

56‧‧‧第1凹入部 56‧‧‧1st recessed part

58‧‧‧第2凹入部 58‧‧‧2nd recessed part

62‧‧‧底面 62‧‧‧ bottom

64‧‧‧端部 64‧‧‧End

65‧‧‧凹入部 65‧‧‧ recessed

65d‧‧‧凸出部分 65d‧‧‧ protruding parts

66‧‧‧底板 66‧‧‧floor

72‧‧‧安裝基板 72‧‧‧Installation substrate

74‧‧‧發光二極體元件 74‧‧‧Lighting diode components

76‧‧‧封裝體 76‧‧‧Package

80‧‧‧端子部 80‧‧‧ Terminals

86、88‧‧‧連接端子構件 86, 88‧‧‧Connecting terminal components

90‧‧‧保持板 90‧‧‧ Keep board

110‧‧‧電路基板 110‧‧‧ circuit board

112‧‧‧電解電容器 112‧‧‧Electrical capacitor

114‧‧‧抗流線圈 114‧‧‧Current coil

116‧‧‧IC零件 116‧‧‧IC parts

120‧‧‧第1殼體 120‧‧‧1st housing

122‧‧‧第2殼體 122‧‧‧2nd housing

124‧‧‧本體部 124‧‧‧ Body Department

126‧‧‧裝設部 126‧‧‧Installation Department

128‧‧‧錐體部分 128‧‧‧ cone section

130‧‧‧延伸突出部分 130‧‧‧Extensions

131‧‧‧第1外徑部分 131‧‧‧1st outer diameter section

132‧‧‧第2外徑部分 132‧‧‧2nd outer diameter section

136‧‧‧螺狀部分 136‧‧‧Spiral part

140‧‧‧基座部 140‧‧‧Base section

142‧‧‧單元收納部 142‧‧‧Unit Storage Department

150‧‧‧黏著劑 150‧‧‧Adhesive

152‧‧‧嵌合筒體 152‧‧‧Mating cylinder

154‧‧‧段差部 154‧‧‧Departure

162‧‧‧限制機構 162‧‧‧Restricted institutions

112a、112b‧‧‧引線 112a, 112b‧‧‧ lead

142a‧‧‧傾斜部 142a‧‧‧ inclined section

143a‧‧‧支持突起 143a‧‧‧Support protrusion

143b‧‧‧卡止爪 143b‧‧‧Card claws

D1‧‧‧第1平面 D1‧‧‧1st plane

D2‧‧‧第2平面 D2‧‧‧2nd plane

Z‧‧‧中心軸 Z‧‧‧ center axis

Claims (4)

一種燈具,其特徵為包含:本體,其係將基台裝設於筒狀之殼體的一端所形成;半導體發光元件,其設置於該本體的基台表面;以及燈球,其在另一端具有開口,且在覆蓋該半導體發光元件的狀態下,使開口側的端部裝設於該本體上;該本體具有凹入部,其使該燈球之開口側端部的至少一部份插入其中;在該燈球,其開口側端部的至少一部份插入該凹入部,且藉由配置於該凹入部內的黏著劑固定於該凹入部中;在該凹入部,於構成該凹入部的面,沿著該燈球之開口側端部插入該凹入部的方向的部份的面上,形成朝向該凹入部內的該燈球側凸出的形狀,且該凹入部的開口緣抵接於該燈球的外圓周面。 A luminaire characterized by comprising: a body formed by mounting an abutment at one end of a cylindrical casing; a semiconductor light emitting element disposed on a surface of the base of the body; and a lamp ball at the other end An opening is provided, and an end portion on the opening side is mounted on the body in a state of covering the semiconductor light emitting element; the body has a recessed portion into which at least a portion of the open side end portion of the lamp ball is inserted At least a portion of the opening side end portion of the lamp ball is inserted into the recessed portion, and is fixed in the recessed portion by an adhesive disposed in the recessed portion; and the recessed portion is configured to constitute the recessed portion The surface of the portion in the direction in which the recessed portion is inserted along the opening-side end portion of the bulb is formed to protrude toward the bulb side in the recess, and the opening edge of the recess is abutted Connected to the outer circumferential surface of the light bulb. 如申請專利範圍第1項之燈具,其中,該燈球僅以抵接於該凹入部之開口緣的部分與該凹入部接觸。 The luminaire of claim 1, wherein the bulb is in contact with the recess only at a portion that abuts the opening edge of the recess. 如申請專利範圍第1項之燈具,其中,該燈球,以位於該凹入部內的開口側端部的至少一部份與構成該凹入部的面接觸。 A lamp according to claim 1, wherein the lamp ball is in contact with at least a portion of the opening-side end portion located in the recessed portion and a surface constituting the recessed portion. 如申請專利範圍第1至3項中任一項之燈具,其中,該燈球之開口側端部的至少一部份之前端的厚度,以較該開口側之端部的厚度更厚的狀態膨脹凸出。 The luminaire according to any one of claims 1 to 3, wherein the thickness of the front end of at least a portion of the opening side end portion of the lamp ball is expanded in a state thicker than the thickness of the end portion of the opening side. Protruding.
TW101148724A 2012-01-31 2012-12-20 Lamp TW201339471A (en)

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JP (1) JP5351361B1 (en)
CN (1) CN203907257U (en)
TW (1) TW201339471A (en)
WO (1) WO2013114502A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345509A (en) * 1998-06-02 1999-12-14 Toshiba Lighting & Technology Corp Fluorescent lamp device
JP4676578B2 (en) * 2009-06-30 2011-04-27 パナソニック株式会社 Lighting equipment
JP2012009278A (en) * 2010-06-24 2012-01-12 Maxled Co Ltd Led bulb

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JP5351361B1 (en) 2013-11-27
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JPWO2013114502A1 (en) 2015-05-11

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