TW201334149A - Back light module - Google Patents

Abstract

A backlight module including a frame, a plurality of light emitting diode chips, a plurality of leads and a plurality of first conductive circuits is provided. The frame has a plurality of fillisters. The light emitting diode chips are disposed in the fillisters respectively. The leads are disposed in the fillisters respectively and electrically connected to the light emitting diode chips respectively. The first conductive circuits are embedded in the frame and extended to the fillisters to be electrically connected to the leads.

Description

Light source module

The present invention relates to an optical module, and more particularly to a light source module.

In recent years, with the advancement of the semiconductor industry and related electronics industries, the use of digital tools such as mobile phones, digital cameras, and notebooks has become more common and A convenient, versatile and aesthetically pleasing design direction is developed to provide users with more choices. As the demand for digital products is increasing, the display screen, which plays an important role in digital products, has also become the focus of designers. Liquid crystal display (LCD) has become the mainstream of display screens.

Since the liquid crystal display itself does not have a light emitting function, a backlight module can be disposed under the liquid crystal display to provide a light source to achieve the display function. At present, most of the backlight modules use a light bar composed of a light emitting diode (LED) as a light source, and a light emitting diode light bar is disposed on the light guide plate (light) Next to guide plate, LGP). In the conventional process, the light-emitting diode is attached to the circuit board by, for example, surface mount technology (SMT) to form a light-emitting diode light strip, which is easy to cause illumination due to uneven distribution of the solder paste. The flatness of the diode strip is not good. In addition, by placing the LED strip in the backlight module by human power, in addition to labor, it is also possible to cause an electrostatic discharge (ESD) effect during assembly to cause the LED to fail.

US Pat. No. 7,242,035 discloses a package structure of a light-emitting diode in which a front portion of a resin structure is hollow to accommodate a light-emitting diode wafer, and a lead frame is wrapped in a rear portion of the resin structure. Continental Patent No. CN200820094899.8 discloses a package structure of a light-emitting diode, wherein the light-emitting diode chip is sealed and fixed on the package frame and connected to the circuit board outside the package frame. Taiwan Patent No. TWI317827 discloses a surface light source device in which a light emitting diode die is encapsulated inside a light guide plate.

The invention provides a light source module, which has a relatively simple process and can reduce the cost.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a light source module including a plastic frame, a plurality of light emitting diode chips, a plurality of pins, and a plurality of first Conductive line. The plastic frame has a plurality of grooves. These light emitting diode wafers are respectively disposed in these grooves. The pins are respectively disposed in the recesses and electrically connected to the LEDs. The first conductive lines are embedded in the plastic frame and extend to the recesses to electrically connect the pins.

Based on the above, in the above embodiments of the present invention, at least one of the following advantages is obtained. The LED chips are respectively disposed in the grooves of the plastic frame, and the first conductive lines are buried in the plastic frame and used to turn on the holes. Light-emitting diode wafer. Thereby, the LED chips can be directly packaged on the plastic frame, and the light source module does not need to be configured to carry the circuit boards of the LED chips, thereby simplifying the process and reducing the cost.

The above described features and advantages of the invention will be apparent from the following description.

The foregoing and other objects, features, and advantages of the invention will be apparent from the Detailed Description The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

1 is a perspective view of a light source module according to an embodiment of the present invention. 2 is a partial cross-sectional view of the light source module of FIG. 1. In order to make the drawings clearer, FIG. 1 does not show the light guide plate 170 of FIG. Referring to FIG. 1 and FIG. 2 , in the embodiment, the light source module 100 includes a plastic frame 110 , a plurality of light emitting diode chips 120 , a plurality of pins 130 , and a plurality of first conductive lines 140 . The light source module 100 is applied to, for example, a liquid crystal display module or other device requiring a backlight, and the present invention is not limited thereto.

The plastic frame 110 has a plurality of grooves 112, and the light emitting diode chips 120 are respectively disposed in the grooves 112. The pins 130 are respectively disposed in the recesses 112 and electrically connected to the LEDs 120. The first conductive lines 140 are buried in the bezel 110 and extend to the recesses 112 to electrically connect the leads 130. Therefore, the LED chips 120 can be directly packaged on the plastic frame 110. The light source module 100 does not need to be configured to carry the circuit boards of the LED chips 120, thereby simplifying the process and reducing the cost.

The plastic frame 110 of this embodiment can be manufactured by an injection molding process. The first conductive line 140 can be pre-injected into the mold used in the molding process, so that the first conductive line 140 is covered with plastic after the plastic enters the mold to form the plastic frame 110 in which the first conductive line 140 is buried. Then, the LED chip 120 and the lead 130 are placed in the recess 112 and electrically connected to the first conductive line 140. In this embodiment, the material of the plastic frame 110 is, for example, polycarbonate (PC). However, the invention is not limited thereto, and may be other suitable materials.

In addition, in the embodiment, the plastic frame 110 may have a plurality of convex portions 114 for respectively providing the grooves 112. The function of the raised portion 114 is to increase the thickness of the bezel 110 to facilitate the formation of the recess 112. In other embodiments of the present invention, the plastic frame 110 may not have the convex portion 114, and the invention is not limited thereto.

Referring to FIG. 2 , the light source module 100 of the embodiment further includes a plurality of encapsulants 150 and a plurality of phosphors 160 . After the LEDs 120 are respectively disposed in the recesses 112 and electrically connected to the first conductive traces 140 through the leads 130, the encapsulants 150 are respectively filled in the recesses 112 to be covered in the recesses. The LED chip 120 in the 112, and the phosphor powder 160 can be mixed with the encapsulant 150. The phosphor powder 160 may have various colors such that light emitted from the LED chip 120 passes through the encapsulant 150 and becomes colored light.

In this embodiment, the light source module 100 further includes a light guide plate 170. The plastic frame 110 is disposed at a position adjacent to the side surface 172 of the light guide plate 170 such that the light emitting diode chip 120 disposed in the groove 112 faces the side surface 172 of the light guide plate 170.

3 is a block diagram of the light source module of FIG. 1. 4 is a perspective view of the light source module of FIG. 1 in another perspective. Referring to FIG. 2 to FIG. 4 , in the embodiment, the light source module 100 further includes at least one second conductive line 180 ( illustrated in FIG. 4 ). The second conductive line 180 is disposed on the plastic frame 110 and electrically connected to a power source 200 , and the first conductive lines 140 are electrically connected to the second conductive line 180 . The second conductive line 180 has the function of connecting these first conductive lines 140 in series. Thereby, the light emitting diode chip 120 can receive power from the power source 200 via the pin 130, the first conductive line 140, and the second conductive line 180. In the present embodiment, the second conductive line 180 is disposed outside the plastic frame 110 as shown in FIG. 4, but in other embodiments, the second conductive line 180 may also be embedded in the plastic frame 110. This is limited.

Referring to FIG. 2, in the embodiment, the surface P1 of the encapsulant 150 is planar. However, the present invention is not limited thereto, and is exemplified by FIG. 5 and FIG. 6 below. FIG. 5 is a partial cross-sectional view of a light source module according to another embodiment of the present invention. FIG. 6 is a partial cross-sectional view showing a light source module according to another embodiment of the present invention. The surface P2 of the encapsulant 150' may be convex as shown in FIG. 5 so that the light emitted from the LED wafer 120 is relatively divergent. As shown in FIG. 6, the surface P3 of the encapsulant 150" may also be concave, which is not limited by the present invention.

In summary, in the above embodiments of the present invention, at least one of the following advantages is obtained: while the plastic frame is manufactured by the injection molding process, the first conductive line is buried in the plastic frame, and the LED array is disposed. The galvanic frame is electrically connected to the first conductive line through a pin and electrically connected to the power source through the second conductive line. Accordingly, the light source module does not need to be configured to carry the circuit board of the light emitting diode chip, thereby saving the manufacturing cost of the light source module and simplifying the process, and the surface of the light emitting diode chip is not attached by using the surface adhesion technology. On the circuit board, it can avoid the unevenness of the light-emitting diode strip due to uneven distribution of solder paste. In addition, since the light-emitting diode chip and the circuit board are not first made into the light-emitting diode light bar, the light-emitting diode light bar is manually placed into the light source module, thereby avoiding electrostatic discharge during assembly. The effect is that the LED chip fails.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. In addition, the terms "first", "second" and the like mentioned in the specification or the scope of the claims are only used to name the elements or distinguish different embodiments or ranges, and are not intended to limit the number of elements. Upper or lower limit.

100. . . Light source module

110. . . Plastic frame

112. . . Groove

114. . . Raised portion

120. . . Light-emitting diode chip

130. . . Pin

140. . . First conductive line

150, 150', 150"... encapsulant

160. . . Fluorescent powder

170. . . Light guide

172. . . side

180. . . Second conductive line

200. . . power supply

P1, P2, P3. . . surface

1 is a perspective view of a light source module according to an embodiment of the present invention.

2 is a partial cross-sectional view of the light source module of FIG. 1.

3 is a block diagram of the light source module of FIG. 1.

4 is a perspective view of the light source module of FIG. 1 in another perspective.

FIG. 5 is a partial cross-sectional view of a light source module according to another embodiment of the present invention.

FIG. 6 is a partial cross-sectional view showing a light source module according to another embodiment of the present invention.

100. . . Light source module

110. . . Plastic frame

112. . . Groove

114. . . Raised portion

120. . . Light-emitting diode chip

130. . . Pin

140. . . First conductive line

150. . . Encapsulant

160. . . Fluorescent powder

170. . . Light guide

172. . . side

180. . . Second conductive line

P1. . . surface

Claims (10)

A light source module includes: a plastic frame having a plurality of grooves; a plurality of light emitting diode chips respectively disposed in the grooves; and a plurality of pins respectively disposed in the grooves and respectively electrically The light-emitting diode chips are connected to the light-emitting diodes; and a plurality of first conductive lines are embedded in the plastic frame and extend to the grooves to electrically connect the pins. The light source module of claim 1, further comprising a plurality of encapsulants, wherein the encapsulants are respectively filled in the recesses to cover the LEDs. The light source module of claim 2, wherein a surface of each of the encapsulants is convex, concave or planar. The light source module of claim 2, further comprising a plurality of phosphor powders, wherein the phosphor powders are mixed with the encapsulants. The light source module of claim 1, wherein the plastic frame has a plurality of protrusions, and the grooves are respectively formed on the protrusions. The light source module of claim 1, wherein the plastic frame is made by an injection molding process. The light source module of claim 6, wherein the first conductive lines are buried in the plastic frame by the injection molding process. The light source module of claim 1, wherein the material of the plastic frame comprises polycarbonate. The light source module of claim 1, further comprising a light guide plate, wherein the plastic frame carries the light guide plate, and the light emitting diode chips face a side of the light guide plate. The light source module of claim 1, further comprising a second conductive line, wherein the second conductive line is disposed on the plastic frame and electrically connected to a power source, wherein the first conductive lines are electrically connected The second conductive line.