KR101683887B1 - Light emitting device package and light unit having thereof - Google Patents

Abstract

Embodiments provide a light emitting device package and a light unit having the same.
A light emitting device package according to an embodiment includes a package body; A plurality of lead frames on the package body; A light emitting diode electrically connected to the plurality of lead frames; A molding member covering the light emitting diode; And a linear member around the molding member.

Description

[0001] LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THEREOF [0002]

An embodiment relates to a light emitting device package and a light unit having the same.

Light emitting diodes (LEDs) can constitute a light source that generates light by using compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaN, and InGaAlP.

Such a light emitting diode is used as a light emitting device which is packaged and emits various colors, and the light emitting device is used as a light source in various fields such as a lit indicator, a character indicator, an image indicator, and a lighting device.

Embodiments provide a light emitting device package including a linear member around a molding member and a light unit having the light emitting device package.

Embodiments provide a light emitting device package including a linear member around a cavity and a light unit having the same.

A light emitting device package according to an embodiment includes a package body; A plurality of lead frames on the package body; A light emitting diode electrically connected to the plurality of lead frames; A molding member covering the light emitting diode; And a plurality of linear members around the molding member.

A light unit according to an embodiment includes: a package body; A plurality of lead frames on the package body; A light emitting diode electrically connected to the plurality of lead frames; A molding member covering the light emitting diode; And a plurality of light emitting device packages including a plurality of linear members around the molding member; A substrate on which the plurality of light emitting device packages are arrayed; And an optical member disposed on an optical path side of the light emitting device package.

The embodiment provides a light emitting device package with improved light efficiency.

The embodiment provides a moisture-resistant light emitting device package.

1 is a side sectional view showing a light emitting device package according to a first embodiment.
2 is a perspective view of FIG.
3 is a plan view of a light emitting device package according to the second embodiment.
4 is a plan view of a light emitting device package according to the third embodiment.
5 is a side sectional view showing a light emitting device package according to a fourth embodiment.
6 is a view illustrating a display device having a light emitting device package according to an embodiment.

Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description of the embodiments, the sizes of the constituent elements shown in the figures are merely an example, and are not limited to the sizes of the drawings.

FIG. 1 is a side sectional view showing a light emitting device package according to a first embodiment, and FIG. 2 is a perspective view of FIG. 1.

1 and 2, the light emitting device package 10 includes a package body 11, a cavity 14, lead frames 12 and 13, a light emitting diode 15, a plurality of linear members 20, And a molding member (17).

The package body 11 may be formed of any one of a silicon material, a ceramic material and a resin material. The package body 11 may be made of silicon, silicon carbide (SiC), aluminum nitride (AlN), polyphthalamide a polyphthalamide (PPA), and a liquid crystal polymer (LCP). However, the present invention is not limited thereto. Further, the package body 11 may be formed as a single layer or multi-layer substrate structure, or may be injection molded, and the shape and structure of the package body are not limited.

The package body 11 may be provided with a cavity 14 having an open top, and the periphery of the cavity 14 may function as a reflector.

A plurality of lead frames (12, 13) are disposed in the package body (11). At least one of the plurality of lead frames 12 and 13 is disposed at the bottom of the cavity 14 and may be exposed to the outside through the package body 11. [ The plurality of lead frames (12, 13) are electrically isolated from each other in the cavity (14).

The periphery of the cavity 14 may be formed perpendicular or inclined with respect to the bottom surface of the cavity 14.

A plurality of linear members (20) are formed around the cavity (14) or the molding member (17). The plurality of linear members 20 may have a wire shape and may be formed of a metal material such as Ag, Al, Au or the like with good reflection characteristics.

The plurality of linear members 20 may be arranged around the cavity 14 or the molding member 17, and the arrangement intervals may be spaced apart at regular or irregular intervals. The plurality of linear members 20 may be arranged in a direction parallel to the cavity bottom surface, respectively, or in a direction perpendicular to the cavity bottom surface.

The plurality of linear members 20 may be formed around the cavity 14 in a spiral or loop shape.

The plurality of linear members 20 may or may not be connected to at least one of the lead frames 12 and 13, but the present invention is not limited thereto.

The light emitting diode 15 may be disposed on at least one of the plurality of lead frames 12 and 13, for example, on the first lead frame 12. The light emitting diode 15 may be bonded to the lead frames 12 and 13 by at least one wire 16, or by die bonding or flip bonding. However, the present invention is not limited thereto.

The light emitting diode 15 may include an LED chip emitting a color spectrum such as blue, red, green, or the like, or may include a UV LED chip. Further, the light emitting diodes 15 may be arranged in one or a plurality of light emitting diodes 15, but the invention is not limited thereto.

A molding member (17) is formed in the cavity (14). The molding member 17 may be formed of a transparent resin material or a transparent resin material to which a phosphor is added. The molding member 17 comprises, for example, silicon or epoxy material. The molding member 17 may include at least one kind of phosphor that absorbs a part of light of the light emitting diode 15 and emits light of a different color. However, the present invention is not limited thereto.

A part of the lead frames 12 and 13 may be formed in a branched shape or may be formed in a predetermined trim and forming.

The plurality of linear members 20 may reflect some light emitted from the light emitting diode 15 to improve the light efficiency of the light emitting device package 10. The periphery of the molding member 17 is in contact with the package body 11 which is the periphery of the linear member 20 and the cavity so that the adhesion to the periphery of the cavity 14 can be improved. The plurality of linear members 20 improve the adhesion between the molding member 17 and the interface of the cavity 14 to thereby suppress the inflow of moisture that can flow through the upper portion of the cavity 13 .

The plurality of linear members 20 include a metal material, so that the thermal expansion of the molding member 17 can be effectively suppressed around the molding member 17.

3 is a plan view of a light emitting device package according to the second embodiment. In describing the second embodiment, the same parts as those of the first embodiment are referred to in the first embodiment, and redundant description will be omitted.

Referring to FIG. 3, the light emitting device package includes a linear member 22 having a curved shape around the cavity 14. The linear member 22 may be continuously or discontinuously arranged with curved lines such as an S-shaped curve along the periphery of the cavity 14. The linear member 22 may have a curved shape having a peripheral width of the cavity 14 continuously connected to each other, or may be arranged in a discontinuous shape.

The linear member 22 may have a different shape, for example, a non-curved shape, and a V-shape X-shape and a Z-shape may be continuously connected.

The linear member 22 may or may not be connected to the first and second lead frames 12 and 13, but is not limited thereto.

4 is a plan view of a light emitting device package according to the third embodiment. In describing the third embodiment, the same parts as those of the first embodiment will be referred to in the first embodiment, and redundant description will be omitted.

Referring to FIG. 4, the light emitting device package includes a plurality of linear members 23 and 24 arranged to correspond to each other around the cavity 17. The plurality of linear members 23 and 24 may be disposed in areas facing each other in the periphery of the cavity 14, but the present invention is not limited thereto. The plurality of linear members 23 and 24 may be arranged in a direction perpendicular to the bottom surface of the cavity in the form of a line having an open loop shape or a closed loop shape around the cavity 14.

5 is a side view of the light emitting device package according to the fourth embodiment. In describing the fourth embodiment, the same parts as those of the first embodiment are referred to in the first embodiment, and redundant description will be omitted.

Referring to FIG. 5, the light emitting device package 30 includes a plurality of linear members 20 connected to the periphery of the cavity 34 or the molding member 37 continuously and continuously. The linear member 20 may be arrayed in a multi-layered structure having curved or non-curved convexo-concave shapes, and may be arrayed on the whole or part of the periphery of the cavity.

The light emitting diode 35 may be electrically connected to the plurality of lead frames 32 and 33 by a plurality of wires 36.

The plurality of lead frames 32 and 33 may extend from the bottom surface of the package body 31, but the present invention is not limited thereto. The shape of the package body 31, the cavity 34, and the lead frames 32 and 33 may be variously modified, and the structure is not limited thereto.

Embodiments can improve the light reflection efficiency in the cavity and improve the adhesion between the molding member and the package body by arranging the linear member around the cavity or around the cavity.

Although the process of trim and form a plurality of lead frames in the light emitting device package has been described in the embodiment, one lead frame can employ a via structure, so that the remaining lead frames can be trimmed and formed. But may be performed on the outside of one or a plurality of lead frames within the technical scope, and is not limited to the above embodiment.

A light guide plate, a prism sheet, a diffusion sheet, and the like, which are optical members, may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. The light unit may be implemented in a top view or a side view type, and may be provided in a portable terminal, a notebook computer, or the like, or may be variously applied to a lighting apparatus and a pointing device.

6 is an exploded perspective view of a display device according to an embodiment.

6, a display apparatus 1000 according to an embodiment includes a light guide plate 1041, a light emitting module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light emitting module 1031, and a reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light emitting module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

The light emitting module 1031 may include at least one light source, and may provide light directly or indirectly from one side of the light guide plate 1041. The light emitting module 1031 includes a board 1033 and a light emitting device package 10 according to the embodiment described above and the light emitting device or the light emitting device package 10 is mounted on the board 1033 at a predetermined interval Lt; / RTI > That is, the light emitting devices may be arrayed on the board 1033 in the form of a chip or a package.

The board 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the board 1033 may include not only a general PCB but also a metal core PCB (MCPCB), a flexible PCB (FPCB) and the like, but the present invention is not limited thereto. When the light emitting device package 10 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the board 1033 can be removed. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.

The plurality of light emitting device packages 10 may be mounted on the board 1033 such that the light emitting surface is spaced apart from the light guiding plate 1041 by a predetermined distance. However, the present invention is not limited thereto. The light emitting device package 10 may directly or indirectly provide light to the light-incident portion on one side of the light guide plate 1041, but the present invention is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light emitting module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

The light emitting diode package according to claim 1, wherein the light emitting diode package comprises a light emitting diode package, 23, 24, 26:

Claims (12)

A package body including a cavity with an open top;
A plurality of lead frames on the package body;
A light emitting diode electrically connected to the plurality of lead frames;
A molding member covering the light emitting diode;
A linear member around the molding member; And
And the periphery of the molding member contacts the peripheral surface of the linear member and the cavity. The light emitting device package according to claim 1, wherein the linear member includes a spiral shape or a plurality of loop shapes. The method according to claim 1,
Wherein the plurality of lead frames, the light emitting diode, and the molding member are disposed in the cavity. The light emitting device package according to claim 3, wherein the linear member is disposed around a cavity of the package body. The light emitting device package according to claim 4, wherein a periphery of the cavity is inclined with respect to an axis perpendicular to the cavity bottom surface. The light emitting device package according to claim 4, wherein the linear member is arranged in a structure in which a plurality of linear members are parallel to each other along the periphery of the cavity. The light emitting device package according to claim 6, wherein the spacing between the linear members includes a constant gap or an irregular gap. The light emitting device package according to claim 1 or 4, wherein the linear members are disposed corresponding to at least two regions of the periphery of the molding member. The light emitting device package according to claim 1 or 6, wherein at least one portion of the linear member includes at least one of a linear shape, a curved shape, and a non-linear shape. The light emitting device package according to claim 1, wherein the linear member comprises a metal including at least one of aluminum (Al), gold (Au), and silver (Ag). 10. A light emitting device package according to any one of claims 1 to 7,
A substrate on which the plurality of light emitting device packages are arrayed; And
And an optical member disposed on an optical path side of the light emitting device package. The light unit according to claim 11, wherein the optical member includes at least one of a light guide plate, a prism sheet, and a diffusion sheet.

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