KR20110107639A - Light emitting device package and light unit having thereof - Google Patents

Abstract

The embodiment provides a light emitting device package and a light unit having the same.
The light emitting device package according to the embodiment includes a package body; A plurality of lead frames on the package body; A light emitting diode electrically connected to the plurality of lead frames; A molding member covering the light emitting diode; And a linear member around the molding member.

Description

LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THEREOF}

The embodiment relates to a light emitting device package and a light unit having the same.

Light emitting diodes (LEDs) may be configured to generate light sources using compound semiconductor materials such as GaAs series, AlGaAs series, GaN series, InGaN series, and InGaAlP series.

Such a light emitting diode is packaged and used as a light emitting device that emits various colors, and the light emitting device is used as a light source in various fields such as a lighting indicator for displaying a color, a character display, an image display, and a lighting device.

The embodiment provides a light emitting device package including a linear member around a molding member and a light unit having the same.

The embodiment provides a light emitting device package including a linear member around a cavity and a light unit having the same.

The light emitting device package according to the embodiment includes a package body; A plurality of lead frames on the package body; A light emitting diode electrically connected to the plurality of lead frames; A molding member covering the light emitting diode; And a plurality of linear members around the molding member.

Light unit according to the embodiment, the package body; A plurality of lead frames on the package body; A light emitting diode electrically connected to the plurality of lead frames; A molding member covering the light emitting diode; A plurality of light emitting device packages including a plurality of linear members around the molding member; A substrate in which the plurality of light emitting device packages are arranged; And an optical member disposed on the light path side of the light emitting device package.

The embodiment provides a light emitting device package having improved light efficiency.

The embodiment provides a light emitting device package resistant to moisture.

1 is a side cross-sectional view illustrating a light emitting device package according to a first embodiment.
2 is a perspective view of FIG. 1.
3 is a plan view illustrating a light emitting device package according to a second embodiment.
4 is a plan view illustrating a light emitting device package according to a third embodiment.
5 is a side cross-sectional view illustrating a light emitting device package according to a fourth embodiment.
6 is a diagram illustrating a display device including a light emitting device package according to an exemplary embodiment.

Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings. Hereinafter, in describing the embodiment, the size of the components shown in each drawing is an example, and is not limited to the size of the drawings.

1 is a side cross-sectional view illustrating a light emitting device package according to a first embodiment, and FIG. 2 is a perspective view of FIG. 1.

1 and 2, the light emitting device package 10 may include a package body 11, a cavity 14, lead frames 12 and 13, a light emitting diode 15, a plurality of linear members 20, and And a molding member 17.

The package body 11 may be formed of any one of a silicon material, a ceramic material, and a resin material. For example, silicon, silicon carbide (SiC), aluminum nitride (AlN), and polyphthalamide may be used. (polyphthalamide: PPA), a liquid crystal polymer (Liquid Crystal Polymer: LCP) may be made of at least one material, but is not limited thereto. In addition, the package body 11 may be formed of a structure of a single layer or a multilayer substrate, or may be injection molded, and is not limited to the shape or structure of such a package body.

The package body 11 may be formed with a cavity 14 having an open upper portion, and the circumference of the cavity 14 may function as a reflector.

A plurality of lead frames 12 and 13 are disposed on the package body 11. At least one of the plurality of lead frames 12 and 13 may be disposed on the bottom of the cavity 14 and may be exposed to the outside through the package body 11. The plurality of lead frames 12 and 13 are spaced apart from each other and electrically open in the cavity 14.

The circumference of the cavity 14 may be formed to be perpendicular or inclined with respect to the bottom surface of the cavity 14.

A plurality of linear members 20 are formed around the cavity 14 or the molding member 17. The plurality of linear members 20 may have a wire shape and may be formed of a material having good reflection characteristics such as Ag, Al, Au, or the like.

The plurality of linear members 20 may be arranged around the cavity 14 or the molding member 17, and the arrangement intervals may be spaced at regular or irregular intervals. The plurality of linear members 20 may be arranged in a direction parallel to the bottom surface of the cavity or in a direction perpendicular to the cavity bottom surface.

The plurality of linear members 20 may be formed in a helical or loop shape around the cavity 14.

The plurality of linear members 20 may or may not be connected to at least one of the lead frames 12 and 13, but is not limited thereto.

The light emitting diode 15 may be disposed on at least one lead frame of the plurality of lead frames 12 and 13, for example, the first lead frame 12. The light emitting diode 15 may be bonded to the lead frames 12 and 13 by at least one wire 16 or may be connected by die bonding or flip bonding, but is not limited thereto.

The light emitting diode 15 may include an LED chip that emits a color spectrum such as blue, red, green, or the like, or may include a UV LED chip. In addition, one or more light emitting diodes 15 may be disposed, but the embodiment is not limited thereto.

A molding member 17 is formed in the cavity 14. The molding member 17 may be formed of a transparent resin material or a transparent resin material to which a phosphor is added. The molding member 17 comprises, for example, a silicone or epoxy material. The molding member 17 may include at least one type of phosphor that absorbs some light of the light emitting diode 15 and emits light of another color, but is not limited thereto.

Portions of the lead frames 12 and 13 may be formed in a branched form, or may be trimmed and formed.

The plurality of linear members 20 may reflect some light emitted from the light emitting diodes 15, thereby improving the light efficiency of the light emitting device package 10. The circumference of the molding member 17 is in contact with the linear body 20 and the package body 11, which is the cavity circumferential surface, thereby improving adhesion to the circumference of the cavity 14. The plurality of linear members 20 may improve adhesion between the molding member 17 and the interface of the cavity 14, thereby suppressing moisture inflow that may flow through the upper portion of the cavity 13. Can be.

The plurality of linear members 20 may include a metal material, thereby effectively suppressing thermal expansion of the molding member 17 around the molding member 17.

3 is a plan view illustrating a light emitting device package according to a second embodiment. In describing the second embodiment, the same parts as in the first embodiment are referred to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 3, the light emitting device package includes a linear member 22 having a curved shape around the cavity 14. The linear member 22 may be continuously arranged or discontinuously arranged in a shape such as an S shape along the circumference of the cavity 14. The linear member 22 may have a shape in which curved shapes having a circumferential width of the cavity 14 are continuously connected or arranged in a discontinuous shape.

The linear member 22 may be formed in another shape, for example, a non-curve shape, in which a V shape, an X shape, and a Z shape are continuously connected.

The linear member 22 may or may not be connected to the first and second lead frames 12 and 13, but is not limited thereto.

4 is a plan view illustrating a light emitting device package according to a third embodiment. In the description of the third embodiment, the same parts as in the first embodiment are referred to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 4, the light emitting device package includes a plurality of linear members 23 and 24 disposed correspondingly to each other around the cavity 17. The plurality of linear members 23 and 24 may be disposed in regions facing each other among the circumferences of the cavity 14, but is not limited thereto. The linear members 23 and 24 may have a linear shape having an open loop shape or a closed loop shape around the cavity 14 in a direction perpendicular to the bottom surface of the cavity.

5 is a side single perspective view showing a light emitting device package according to the fourth embodiment. In the description of the fourth embodiment, the same parts as in the first embodiment are referred to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 5, the light emitting device package 30 includes a plurality of linear members 20 in which a yaw shape and an iron shape are continuously connected to a circumference of the cavity 34 or a circumference of the molding member 37. The linear member 20 may be arranged in a multi-layered structure having a curved or non-curved irregular shape, and may be arranged in whole or in part around the cavity.

The light emitting diode 35 may be electrically connected to the plurality of lead frames 32 and 33 by a plurality of wires 36.

The plurality of lead frames 32 and 33 may be extended on the bottom surface of the package body 31, but is not limited thereto. Shapes of the package body 31, the cavity 34, and the lead frames 32 and 33 may be variously modified, but are not limited thereto.

Embodiments may arrange the linear member around the cavity or around the cavity, whereby the light reflection efficiency in the cavity may be improved, and the adhesion between the molding member and the package body may be improved.

The embodiment has described a process of trimming and forming a plurality of lead frames in a light emitting device package, but one lead frame may adopt a via structure, so that the other lead frames may be trimmed and formed. It may be performed on the outside of one or a plurality of lead frames within the technical scope, but is not limited to the above embodiments.

A plurality of light emitting device packages according to the embodiment may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, or the like, which is an optical member, may be disposed on an optical path of the light emitting device package. The light emitting device package, the substrate, and the optical member may function as a light unit. The light unit may be implemented in a top view or a side view type and provided to a portable terminal, a notebook computer, or the like, or may be variously applied to an illumination device and an indicator device.

6 is an exploded perspective view of a display device according to an exemplary embodiment.

Referring to FIG. 6, the display device 1000 according to the embodiment includes a light guide plate 1041, a light emitting module 1031 that provides light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), An optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light emitting module 1031, and a reflective member 1022 on the optical sheet 1051. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses light to serve as a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin-based such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may include one of the resins.

The light emitting module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

The light emitting module 1031 may include at least one, and may provide light directly or indirectly at one side of the light guide plate 1041. The light emitting module 1031 includes a board 1033 and a light emitting device package 10 according to the above-described embodiment, wherein the light emitting device or the light emitting device package 10 is disposed on the board 1033 at predetermined intervals. Can be arrayed. That is, the light emitting devices may be arranged in a chip or package form on the board 1033.

The board 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the board 1033 may include not only a general PCB but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device package 10 is mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, the board 1033 may be removed. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

The plurality of light emitting device packages 10 may be mounted on the board 1033 such that an emission surface on which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device package 10 may directly or indirectly provide light to a light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 may improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet. The optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses the incident light, the horizontal and / or vertical prism sheet focuses the incident light into the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light emitting module 1031, but are not limited thereto.

Although the above has been described with reference to preferred embodiments thereof, these are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains will be exemplified above within the scope not departing from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are possible. For example, each component shown in detail in the embodiment of the present invention may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

10, 30: light emitting device package, 11, 31: package body, 12, 13, 32, 33: lead frame, 14, 34: cavity, 15, 35: light emitting diode, 17, 37: molding member, 20, 22, 23,24,26: linear member

Claims (12)

Package body;
A plurality of lead frames on the package body;
A light emitting diode electrically connected to the plurality of lead frames;
A molding member covering the light emitting diode; And
The light emitting device package including a linear member around the molding member. The light emitting device package of claim 1, wherein the linear member includes a spiral shape or a plurality of loop shapes. The method of claim 1, wherein the package body includes a cavity open at the top,
The plurality of lead frames, the light emitting diodes and the molding member are disposed in the cavity. The light emitting device package of claim 3, wherein the linear member is disposed around a cavity of the package body. The light emitting device package of claim 4, wherein a circumference of the cavity is inclined with respect to an axis perpendicular to the bottom surface of the cavity. The light emitting device package of claim 4, wherein the linear members are arranged in a plurality of parallel structures along the circumference of the cavity. The light emitting device package of claim 6, wherein a space between the preceding members includes a constant space or an irregular space. The light emitting device package of claim 1 or 4, wherein the linear members are disposed to correspond to each other in at least two regions of a circumference of the molding member. The light emitting device package of claim 1 or 6, wherein at least one portion of the linear member comprises at least one of a linear shape, a curved shape, and a non-linear shape. The light emitting device package of claim 1, wherein the linear member comprises a metal including at least one of aluminum (Al), gold (Au), and silver (Ag). The light emitting device package of any one of claims 1 to 6;
A substrate in which the plurality of light emitting device packages are arranged; And
And a light member disposed on the light path side of the light emitting device package. The light unit of claim 11, wherein the optical member comprises at least one of a light guide plate, a prism sheet, and a diffusion sheet.

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