KR20100028183A - Backlight assemble and liquid crystal display apparatus having the same - Google Patents

Backlight assemble and liquid crystal display apparatus having the same Download PDF

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Publication number
KR20100028183A
KR20100028183A KR1020080087092A KR20080087092A KR20100028183A KR 20100028183 A KR20100028183 A KR 20100028183A KR 1020080087092 A KR1020080087092 A KR 1020080087092A KR 20080087092 A KR20080087092 A KR 20080087092A KR 20100028183 A KR20100028183 A KR 20100028183A
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KR
South Korea
Prior art keywords
light
light emitting
circuit board
printed circuit
guide plate
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Application number
KR1020080087092A
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Korean (ko)
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KR101539665B1 (en
Inventor
김대원
김경남
Original Assignee
서울반도체 주식회사
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Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080087092A priority Critical patent/KR101539665B1/en
Priority to US12/355,993 priority patent/US8164710B2/en
Priority to TW098115159A priority patent/TWI397749B/en
Publication of KR20100028183A publication Critical patent/KR20100028183A/en
Application granted granted Critical
Publication of KR101539665B1 publication Critical patent/KR101539665B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

A backlight assembly and a liquid crystal display having the same are disclosed. The backlight assembly includes a light guide plate and a light emitting module. The light guide plate guides light from the light emitting module toward the liquid crystal display panel. The light emitting module is provided on the incident surface side of the light guide plate. The light emitting module includes a printed circuit board vertically disposed to face the incident surface, and a plurality of tower light emitting diodes mounted on the printed circuit board to emit light in a direction perpendicular to the mounting surface of the printed circuit board. The top light emitting diode includes a blue chip for generating blue light and a red phosphor and a green phosphor for converting a part of the blue light generated from the blue chip into red light and green light to implement white light. The printed circuit board is formed to have a width smaller than or equal to the height of the incident surface of the light guide plate. Therefore, the thickness of the backlight assembly can be reduced, and the light utilization efficiency and color reproducibility can be improved.

Description

BACKLIGHT ASSEMBLE AND LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME}

The present invention relates to a backlight assembly and a liquid crystal display device having the same, and more particularly, to a backlight assembly for supplying light to a liquid crystal display unit using a plurality of light emitting diodes and a liquid crystal display device having the same.

In general, a liquid crystal display (LCD) is a flat panel display that displays an image using liquid crystal, and is thinner and lighter than other display devices such as CRT and PDP, and has a low driving voltage and low power consumption. There is an advantage that has been widely used throughout the industry.

Since the liquid crystal display is a non-light emitting device in which the liquid crystal display panel for displaying an image does not emit light by itself, it requires a separate backlight assembly for supplying light to the liquid crystal display panel.

Conventionally, a cold cathode fluorescent lamp (CCFL) has been mainly used as a light source employed in a backlight assembly. Recently, however, a backlight assembly product using a light emitting diode (LED) as a light source has excellent color reproducibility and low power consumption compared to a cold cathode fluorescent lamp.

In particular, a backlight assembly applied to a small and medium-sized product such as a mobile phone or a notebook includes a light guide plate for guiding a path of light toward a liquid crystal display panel, and a light emitting module disposed at a side of the light guide plate to supply light. In this case, the light emitting module has a structure including a printed circuit board arranged in a direction parallel to the exit surface of the light guide plate, and side light emitting diodes mounted on the printed circuit board to emit light toward the side of the light guide plate. In addition, the side-emitting light emitting diode implements white light using a yellow phosphor on a blue chip, or white light using a blue chip, a green chip, and a red chip.

However, in the case of the side-emitting light emitting diodes, there is a problem in that light utilization efficiency is lowered because the orientation angles in the vertical direction and the horizontal direction are different. In addition, since the printed circuit board is disposed above the upper surface or the lower surface of the light guide plate, there is a problem that the overall thickness is increased. In addition, the use of yellow phosphors in the blue chip has a problem of poor color reproducibility, and in the case of using the blue and green chips and the red chip, a separate color feedback system is required to increase the cost and increase the thickness of the module. There is a problem.

Accordingly, the present invention has been made in view of such a problem, and the present invention provides a backlight assembly capable of reducing thickness and improving color reproducibility.

In addition, the present invention provides a liquid crystal display device having the above-described backlight assembly.

The backlight assembly according to an aspect of the present invention includes a light guide plate and a light emitting module. The light guide plate guides light from the light emitting module. The light emitting module is installed on the incident surface side of the light guide plate. The light emitting module includes a printed circuit board vertically disposed to face the incident surface and a plurality of top light emitting diodes mounted on the printed circuit board to emit light in a direction perpendicular to the mounting surface of the printed circuit board. The top light emitting diode includes a blue chip generating blue light, and a red phosphor and a green phosphor converting a part of the blue light generated from the blue chip into red light and green light to implement white light.

The printed circuit board may have a width smaller than or equal to the height of the incident surface of the light guide plate. The top light emitting diode may be formed in a package size smaller than or equal to the width of the printed circuit board.

The red phosphor may be formed of an inorganic compound or a solid solution having the same crystal structure as SrS: Eu, (Sr, Ca) S: Eu, CaS: Eu, (Sr, Ca) GeS: Eu, and CaAlSiN 3. The green phosphor may be formed of SrGa 2 S 4 : Eu and (Ba, Sr, Ca) 2 SiO 4 : Eu.

The top light emitting diodes are arranged in a line along the length direction of the printed circuit board.

The top light emitting diode includes a lead frame electrically connected to the printed circuit board to supply power to the blue chip, and a housing having an opening for fixing the lead frame and exposing the blue chip. And the green phosphor is filled with a molding member in the opening of the housing.

The lead frame may include a chip mounting part in which the blue chip is mounted, a side part bent from the chip mounting part and exposed at the side of the housing, and a bottom part bent from the side part and exposed at the bottom of the housing. At this time, the lower surface portion is formed with a larger area than the side portion.

A liquid crystal display device according to an aspect of the present invention includes a display unit including a liquid crystal display panel for displaying an image and a backlight assembly for supplying light to the liquid crystal display panel. The backlight assembly may include a light guide plate for guiding light toward the liquid crystal display panel and a light emitting module disposed at an incident surface side of the light guide plate. The light emitting module includes a printed circuit board vertically disposed to face the incident surface and a plurality of top light emitting diodes mounted on the printed circuit board to emit light in a direction perpendicular to the mounting surface of the printed circuit board. The top light emitting diode includes a blue chip generating blue light, and a red phosphor and a green phosphor converting wavelengths of blue light generated from the blue chip to realize white light.

According to such a backlight assembly and a liquid crystal display device having the same, the thickness of the backlight assembly may be arranged by facing the incident surface of the light guide plate with a light emitting module mounted on a printed circuit board having a top light emitting diode having the same directivity angle in left and right directions and up and down directions. Can be reduced, and the utilization efficiency of light can be improved. In addition, color reproducibility can be improved by using a tower light emitting diode using a blue chip, a red phosphor, and a green phosphor. Furthermore, by forming the lower surface portion of the lead frame in a larger area than the side surface portion, the mounting stability of the top light emitting diode can be improved.

The above-described features and effects of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, and thus, those skilled in the art to which the present invention pertains may easily implement the technical idea of the present invention. Could be. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view showing a backlight assembly according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing a combined state of the backlight assembly shown in Figure 1, Figure 3 is a light emitting module shown in Figure 1 A perspective view showing in detail.

1, 2 and 3, the backlight assembly 100 according to an embodiment of the present invention includes a light guide plate 200 for guiding light and a light emitting module 300 for supplying light to the light guide plate 200. ).

The light emitting module 300 is installed at one side of the light guide plate 200, that is, the incident surface 210, and supplies light to the light guide plate 200. The light emitting module 300 includes a printed circuit board 310 and a plurality of light emitting diodes 320 mounted on the printed circuit board 310 to generate light.

The printed circuit board 310 is to fix the light emitting diodes 320 and to supply power to the light emitting diodes 320 and is vertically disposed to face the incident surface 210 of the light guide plate 200. On the surface of the printed circuit board 310, a metal pattern for transmitting power to the mounted light emitting diodes 320 is formed.

The printed circuit board 310 is formed in a rectangular shape corresponding to the incident surface 210 of the light guide plate 200. In this case, the width W of the printed circuit board 310 corresponding to the height H direction of the incident surface 210 of the light guide plate 200 is smaller than or equal to the height H of the incident surface 210. As such, by forming the width W of the printed circuit board 310 to be smaller than or equal to the maximum thickness of the light guide plate 200, the total thickness of the backlight assembly 100 may be prevented from increasing. Meanwhile, the length of the printed circuit board 310 corresponding to the length direction of the incident surface 210 of the light guide plate 200 may be smaller than or equal to the length of the light guide plate 200.

The top light emitting diodes 320 are arranged in a line at regular intervals along the length direction of the printed circuit board 310. The top light emitting diodes 320 are mounted on the mounting surface of the printed circuit board 310 facing the incident surface 210 of the light guide plate 200, and are printed circuits in response to power applied through the printed circuit board 310. Light is emitted in a direction perpendicular to the mounting surface of the substrate 310. Therefore, the light emitted from the top light emitting diodes 320 is incident into the light guide plate 200 through the incident surface 210 of the light guide plate 200.

The top light emitting diode 320 is formed to have a package size S smaller than or equal to the width W of the printed circuit board 310 in order to prevent an increase in the thickness of the backlight assembly 100 and increase light utilization efficiency. The light emitted from the top light emitting diode 320 is emitted at the same direction angle, for example, about 120 ° in the left and right direction and the vertical direction. Therefore, compared to the side-emitting light emitting diodes having a smaller orientation angle in the up-down direction than in the left-right direction, uniform light is incident on the incident surface 210 of the light guide plate 200 to improve light utilization efficiency. have.

FIG. 4 is a plan view illustrating the tower light emitting diode of FIG. 3 in detail, and FIG. 5 is a cross-sectional view of the tower light emitting diode of FIG. 4.

4 and 5, the top light emitting diode 320 according to an exemplary embodiment of the present invention may be a blue chip 321 for generating blue light, and a blue chip 321 for generating white light. And a red phosphor 322 and a green phosphor 323 that convert a portion of the blue light into red and green light. In addition, the top light emitting diode 320 may include lead frames 324 and 325 including a first lead terminal 324 and a second lead terminal 325 to supply power to the blue chip 321, and a top package. It may include a housing 326 to.

The blue chip 321 is mounted on the first lead terminal 324 and has a maximum light emission wavelength of about 430 nm to 470 nm in response to power applied through the first lead terminal 324 and the second lead terminal 325. Generate blue light. The blue chip 321 is formed of, for example, an InGaN-based light emitting diode chip. The blue chip 321 may be electrically connected to the first lead terminal 324 and the second lead terminal 325 through the conductive wire 327. The blue chip 321 may be electrically connected to the first lead terminal 324 through a conductive adhesive.

The red phosphor 322 and the green phosphor 323 are mixed in the molding member 328 and filled in the opening 329 of the housing 326. The molding member 328 is made of epoxy resin, for example. The red phosphor 322 is excited by a part of the blue light generated from the blue chip 321 to emit red light. The red phosphor 322 is, for example, an inorganic compound or a solid solution having a crystal structure similar to SrS: Eu, (Sr, Ca) S: Eu, CaS: Eu, (Sr, Ca) GeS: Eu, and CaAlSiN 3 . Can be formed. The green phosphor 323 is excited by a part of the blue light generated by the blue chip 321 to emit green light. The green phosphor 323 may be formed of, for example, SrGa 2 S 4 : Eu and (Ba, Sr, Ca) 2 SiO 4 : Eu. Therefore, the top light emitting diode 320 emits white light by mixing blue light emitted from the blue chip 321, red light emitted from the red phosphor 322, and green light emitted from the green phosphor 323. Done.

As such, when the white light is implemented using the blue chip 321, the red phosphor 322, and the green phosphor 323, the light emitting diode using the blue chip and the yellow phosphor having a color reproducibility of about 85 or less may be up to 20. The color reproducibility of about 90 to 110, which is improved by about%, can be obtained.

The lead frames 324 and 325 support the blue chip 321, and receive power from the printed circuit board 310 to supply the blue chip 321 to the blue chip 321. The lead frames 324 and 325 are formed of a metal having excellent electrical conductivity. The lead frames 324 and 325 include a first lead terminal 324 and a second lead terminal 325 spaced at predetermined intervals and electrically separated from each other. The first lead terminal 324 is electrically connected to the blue chip 321 through the conductive wire 327 or the conductive adhesive, and the second lead terminal 325 is connected to the blue chip 321 through the conductive wire 327. Electrically connected. On the other hand, the first lead terminal 324 and the second lead terminal 325 is formed in a shape bent in a substantially "C" shape, a portion of these housing for the electrical connection with the printed circuit board 310 Exposed to 326.

In detail, the lead frames 324 and 325 are bent downward from the chip mounting parts 324a and 325a and the chip mounting parts 324a and 325a on which the blue chips 321 are mounted to be external from the side of the housing 326. The lower surface portions 324c and 325c which are bent to face the chip mounting portions 324a and 325a from the side portions 324b and 325b and the side portions 324b and 325b exposed to the outside and exposed to the outside from the lower surface of the housing 326. do. When the top light emitting diode 320 having such a structure is soldered to the printed circuit board 310, the lower surface portions 324c and 325c and the side portions 324b and 325b of the lead frames 324 and 325 are soldered. In this case, the top light emitting diode 320 soldered to the printed circuit board 310 may have a defect such as being lifted or tilted from the printed circuit board 310 by an external impact. Therefore, in order to prevent such defects, the area of the lower surface portions 324c and 325c of the lead frames 324 and 325 is formed larger than that of the side surface portions 324b and 325b so that the center of gravity of the lead frames 324 and 325c is lowered to the lower surface portions 324c and 325c. By tilting, the mounting stability of the top light emitting diode 320 can be improved. The lower surface portions 324c and 325c of the lead frames 324 and 325 may be formed to have an area larger than, equal to, or smaller than the chip mounting portions 324a and 325a.

The housing 326 is formed to surround portions of the first lead terminal 324 and the second lead terminal 325 to fix the first lead terminal 324 and the second lead terminal 325. An opening 329 is formed in the housing 326 to expose the blue chip 321 and to accommodate the molding member 328 in which the red phosphor 322 and the green phosphor 323 are mixed. The housing 326 may be formed by molding using, for example, polyphthalamide (PPA) resin or the like.

The opening 329 formed in the housing 326 is formed to have a substantially circular shape when viewed in plan view, as shown in FIG. 4. Specifically, the opening 329 has the smallest circle area in the inner side adjacent to the lead frames 324 and 325, and is formed in a funnel shape in which the circle area becomes wider toward the outside. Therefore, the inner wall of the housing 326 in which the opening 329 is formed is formed as an inclined surface inclined at a predetermined angle. The directing angle of the light emitted from the top light emitting diode 320 depends on the shape of the opening 329 of the housing 326. Therefore, when the shape of the opening part 329 is formed in a circular shape like the present embodiment, the orientation angles in all directions of up, down, left and right are the same. In addition, the inclination surface of the opening 329 may be adjusted by adjusting the inclination angle of the inclined surface. For example, the inclination surface of the opening 329 may be adjusted such that the inclination angle is about 120 °. On the other hand, the package size of the top light emitting diode 320 should be smaller than the thickness of the light guide plate 200, in order to further reduce the size of the package, if necessary, the shape of the opening 329 has a short axis in the vertical direction of the oval shape It can also be formed.

Referring back to FIGS. 1 and 2, the light guide plate 200 changes a path of light incident from the light emitting module 300 disposed on the side surface and guides the light guide plate toward the liquid crystal display panel to be disposed thereon. The light guide plate 200 is preferably formed of a transparent material to minimize the loss of light. The light guide plate 200 is formed of, for example, a transparent polymethyl methacrylate (PMMA) or polycarbonate (PC) material.

A predetermined reflection pattern (not shown) for scattering reflection of light may be formed on the lower surface of the light guide plate 200. For example, the reflective pattern formed on the lower surface of the light guide plate 200 may include a printing pattern or an uneven pattern. Therefore, the light incident from the light emitting module 300 into the light guide plate 200 is scattered and reflected by the reflection pattern, and the light incident on the upper surface of the light guide plate 200 at an angle exceeding a specific critical angle is applied to the light guide plate 200. It will exit through the upper surface of the.

The light guide plate 200 has a plate shape in which the light incident surface 210 on which the light emitting module 300 is disposed and the opposite light facing surface have the same thickness, or the thickness becomes thinner from the light incident surface 210 toward the light facing surface. The paper may have a wedge shape.

Meanwhile, the backlight assembly 100 may further include a reflective sheet 110 disposed on the bottom surface of the light guide plate 200. The reflective sheet 110 reflects light leaking to the outside through the lower surface of the light guide plate 200 to the inside of the light guide plate 200 to improve light utilization efficiency. The reflective sheet 110 is formed of, for example, white polyethylene terephthalate (PET) or polycarbonate (PC).

In addition, the backlight assembly 100 may further include at least one optical sheet 120 disposed on the light guide plate 200. The optical sheet 120 includes at least one of a diffusion sheet for diffusing light to improve luminance uniformity, a light collecting sheet for condensing light to improve front luminance, a reflective polarizing sheet for increasing luminance through recycling of light, and the like. can do.

6 is an exploded perspective view illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

Referring to FIG. 6, the liquid crystal display device 400 according to an exemplary embodiment supplies light to the display unit 500 and the liquid crystal display panel 510 including the liquid crystal display panel 510 for displaying an image. It includes a backlight assembly 100 for.

Since the backlight assembly 100 may have the same configuration as that shown in FIGS. 1 to 5, a detailed description thereof will be omitted.

The display unit 500 includes a liquid crystal display panel 510 for substantially displaying an image and a driving circuit unit 520 for driving the liquid crystal display panel 510.

The liquid crystal display panel 510 includes a first substrate 512, a second substrate 514 coupled to the first substrate 512, and a liquid crystal interposed between the first substrate 512 and the second substrate 514. It may include a layer (not shown).

The first substrate 512 is a TFT substrate in which thin film transistors (hereinafter referred to as TFTs) as switching elements are formed in a matrix form. A data line and a gate line are respectively connected to the source terminal and the gate terminal of the TFTs, and a pixel electrode made of a transparent conductive material is connected to the drain terminal.

The second substrate 514 is a color filter substrate in which an RGB color filter for realizing color is formed in a thin film form. The common electrode made of a transparent conductive material is formed on the second substrate 514. Meanwhile, the RGB color filter may be formed on the first substrate 512.

When the gate driving signal is applied to the gate terminal of the TFT and the TFT is turned on, the liquid crystal display panel 510 applies a data signal to the pixel electrode to form an electric field between the pixel electrode and the common electrode. By the electric field, the arrangement of the liquid crystal molecules of the liquid crystal layer disposed between the first substrate 512 and the second substrate 514 is changed, and the transmittance of light supplied from the backlight assembly 100 is changed according to the arrangement change of the liquid crystal molecules. The image is changed to display an image of a desired gradation.

The driving circuit unit 520 may include a source printed circuit board 521 for outputting various control signals for driving the liquid crystal display panel 510, and a data driving circuit connecting the source printed circuit board 521 and the liquid crystal display panel 510. The gate driving circuit film 525 connected to the film 523 and the liquid crystal display panel 510 may be included.

The data driving circuit film 523 is connected to the data line of the first substrate 512, and the gate driving circuit film 525 is connected to the gate line of the first substrate 512. The data driving circuit film 523 and the gate driving circuit film 525 may include a data driving chip configured to output a driving signal for driving the liquid crystal display panel 510 in response to a control signal supplied from the source printed circuit board 521; It may include a gate driving chip. The data driving circuit film 523 and the gate driving circuit film 525 are formed of, for example, a tape carrier package (TCP) or a chip on film (COF). Although not shown, the driving circuit unit 520 may further include a gate printed circuit board connected to the gate driving circuit film 525. In addition, the gate driving circuit film 525 may be removed by directly mounting the gate driving chip on the first substrate 512 or by directly forming the gate driving circuit on the first substrate 512 through a thin film process.

According to such a backlight assembly and a liquid crystal display device having the same, the printed circuit board of the light emitting module installed on the side of the light guide plate is disposed to face the light guide plate, and the top light emitting diodes are mounted to emit light in a direction perpendicular to the printed circuit board. By doing so, the thickness of the backlight assembly can be reduced. In addition, the use efficiency of light can be improved by using the tower light emitting diode having the same directing angle in the left and right direction and the vertical direction. Furthermore, color reproducibility can be improved by using a tower light emitting diode using a blue chip, a red phosphor, and a green phosphor.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

1 is an exploded perspective view showing a backlight assembly according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the combined state of the backlight assembly illustrated in FIG. 1.

3 is a perspective view illustrating in detail the light emitting module illustrated in FIG. 1.

4 is a plan view illustrating the tower light emitting diode of FIG. 3 in detail.

FIG. 5 is a cross-sectional view of the tower light emitting diode shown in FIG. 4.

6 is an exploded perspective view illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: backlight assembly 110: reflective sheet

120: optical sheet 200: light guide plate

300: light emitting module 310: printed circuit board

320: top light emitting diode 321: blue chip

322 red phosphor 323 green phosphor

400: liquid crystal display device 500: display unit

510 liquid crystal display panel

Claims (9)

A light guide plate for guiding light; And A plurality of tower types disposed on the incident surface side of the light guide plate and mounted on the printed circuit board to face the incident surface and mounted on the printed circuit board to emit light in a direction perpendicular to the mounting surface of the printed circuit board; A light emitting module including light emitting diodes, The top light emitting diode includes a blue chip for generating blue light, and a red phosphor and a green phosphor for converting a part of the blue light generated from the blue chip into red light and green light to implement white light. Backlight assembly. The method of claim 1, And the printed circuit board has a width less than or equal to the height of the incident surface of the light guide plate. The method of claim 2, And the top light emitting diode has a package size less than or equal to the width of the printed circuit board. The method of claim 1, The red phosphor is any one selected from the group consisting of inorganic compounds or solid solutions having a crystal structure similar to SrS: Eu, (Sr, Ca) S: Eu, CaS: Eu, (Sr, Ca) GeS: Eu and CaAlSiN 3 Backlight assembly comprising a. The method of claim 1, The green phosphor includes any one selected from the group consisting of SrGa 2 S 4 : Eu and (Ba, Sr, Ca) 2 SiO 4 : Eu. The method of claim 1, And the top light emitting diodes are arranged in a line along the length direction of the printed circuit board. The method of claim 1, The top light emitting diode includes a lead frame electrically connected to the printed circuit board to supply power to the blue chip, and a housing having an opening for fixing the lead frame and exposing the blue chip. And the green phosphor is filled with a molding member in the opening of the housing. The method of claim 7, wherein The lead frame includes a chip mounting part in which the blue chip is mounted, a side part bent from the chip mounting part and exposed at the side of the housing, and a bottom part bent from the side part and exposed at the bottom of the housing, The lower surface portion is a backlight assembly, characterized in that formed with a larger area than the side portion. A display unit including a liquid crystal display panel for displaying an image; And It includes a backlight assembly for supplying light to the liquid crystal display panel, The backlight assembly, A light guide plate for guiding light toward the liquid crystal display panel; And A plurality of tower types disposed on the incident surface side of the light guide plate and mounted on the printed circuit board to face the incident surface and mounted on the printed circuit board to emit light in a direction perpendicular to the mounting surface of the printed circuit board; A light emitting module including light emitting diodes, The top light emitting diode includes a blue chip for generating blue light and a red phosphor and a green phosphor for converting wavelengths of the blue light generated from the blue chip to implement white light.
KR1020080087092A 2008-09-04 2008-09-04 Backlight assemble and liquid crystal display apparatus having the same KR101539665B1 (en)

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KR1020080087092A KR101539665B1 (en) 2008-09-04 2008-09-04 Backlight assemble and liquid crystal display apparatus having the same
US12/355,993 US8164710B2 (en) 2008-09-04 2009-01-19 Backlight assembly and liquid crystal display apparatus having the same
TW098115159A TWI397749B (en) 2008-09-04 2009-05-07 Backlight assembly and liquid crystal display apparatus having the same

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KR1020080087092A KR101539665B1 (en) 2008-09-04 2008-09-04 Backlight assemble and liquid crystal display apparatus having the same

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KR101539665B1 KR101539665B1 (en) 2015-07-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110107639A (en) * 2010-03-25 2011-10-04 엘지이노텍 주식회사 Light emitting device package and light unit having thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001043720A (en) * 1999-07-28 2001-02-16 Sanyo Electric Co Ltd Surface light source device and display device
JP5245222B2 (en) * 2005-08-10 2013-07-24 三菱化学株式会社 Phosphor and light emitting device using the same
KR100826426B1 (en) * 2006-02-22 2008-04-29 삼성전기주식회사 Light emitting diode package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110107639A (en) * 2010-03-25 2011-10-04 엘지이노텍 주식회사 Light emitting device package and light unit having thereof

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