TW201331299A - Conductive silicone composition and method for producing the same - Google Patents

Conductive silicone composition and method for producing the same Download PDF

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TW201331299A
TW201331299A TW101136855A TW101136855A TW201331299A TW 201331299 A TW201331299 A TW 201331299A TW 101136855 A TW101136855 A TW 101136855A TW 101136855 A TW101136855 A TW 101136855A TW 201331299 A TW201331299 A TW 201331299A
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silver
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Naoki Yamakawa
Yoshitaka Hamada
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Shinetsu Chemical Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances

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Abstract

An addition-curable conductive silicone composition includes the components as following: (A) denoted by an average composition formula (1), which is organopolysiloxane including at least two alkenyls connected with one silicon atom in one molecule, Ra R/bSiO(4-a-b)/2 (1); (B), which is organic hydrogen polysiloxane including at least two hydrogen atoms connected with one silicon atom in one molecule; (C) silver powder or silver coated microsphere powder; (D) conductive microphere power (which does not include silver, copper or metal including silver or copper); and (E) an addition reaction catalyst; and (F) one or more than two selected from fatty acids, fatty acid derivatives and their metal salts. Cured material specially silicon rubber with high conductivity 1.0*10<SP>-2</SP> Ω*cm is formed from the conductive silicone composition, which can be used for coating, the shape maintenance is good, and the storage stability is good.

Description

導電性矽酮組成物及其製造方法 Conductive fluorenone composition and method of producing the same

本發明係關於一種賦予導電性矽酮橡膠等之導電性矽酮硬化物的導電性矽酮組成物,特別是關於一種高導電性,並且能夠塗佈,且在塗佈後(硬化前)之形狀保持性優異的加成硬化型導電性矽酮組成物、及其製造方法。 The present invention relates to a conductive fluorenone composition for imparting a conductive fluorenone cured product such as a conductive fluorenone rubber, and more particularly to a high electrical conductivity and capable of coating, and after coating (before hardening) An addition-curable conductive fluorenone composition excellent in shape retention and a method for producing the same.

導電性矽酮橡膠組成物,係在硬化之後成為導電性優異的矽酮橡膠,故特別是在要求有能發揮矽酮的優點之耐熱性的領域等被使用。導電性矽酮橡膠組成物,以往係已知有由一分子中至少具有2個烯基之有機聚矽氧烷、與一分子中至少具有2個矽原子鍵結氫原子之有機氫聚矽氧烷、與鉑系觸媒、與銀粉末所構成之加成硬化型導電性矽酮橡膠組成物。用以賦予高導電性的填料係使用有還原銀粉末、電解銀粉末、霧化銀粉末、對於二氧化矽或銅粉施以銀塗敷者。形狀雖有球狀、扁平狀、樹枝狀、不定形狀等之各種形狀,但多使用有能夠高填充銀粉末,且能作為高導電率組成物之扁平狀的銀粉末。 Since the conductive fluorenone rubber composition is an fluorenone rubber which is excellent in conductivity after curing, it is used in the field of heat resistance which is required to exhibit the advantages of fluorenone. A conductive anthrone rubber composition is known in the art as an organic polyoxosiloxane having at least two alkenyl groups in one molecule and an organic hydrogen polyoxygen group having at least two halogen atoms bonded to one atom in one molecule. A composition of an addition-curable conductive fluorenone rubber composed of an alkane, a platinum-based catalyst, and a silver powder. The filler for imparting high conductivity is a silver coated powder, an electrolytic silver powder, an atomized silver powder, and a silver coating for cerium oxide or copper powder. Although the shape has various shapes such as a spherical shape, a flat shape, a dendritic shape, and an indefinite shape, a silver powder which can be highly filled with silver powder and which can be used as a high conductivity composition is often used.

但,若將銀粉或銅粉等之金屬粉或者是施以銀鍍敷後的填料添加至加成硬化型矽酮橡膠組成物,則會產生作用於鉑族觸媒而使硬化性惡化,或隨著時間經過而使硬化逐漸消失的問題。 However, when a metal powder such as silver powder or copper powder or a filler after silver plating is added to the addition-curable fluorenone rubber composition, the platinum group catalyst acts to deteriorate the hardenability, or The problem of hardening gradually disappears as time passes.

此外,高導電性矽酮橡膠組成物係主要使用於導體間 之電連接,但為了作成高填充銀粉而使用能夠進行塗佈的低黏度之矽酮橡膠組成物,故若進行以分注器所致之塗佈或網版印刷則會導致形狀崩塌的問題產生。 In addition, the highly conductive anthrone rubber composition is mainly used between the conductors. Although it is electrically connected, in order to form a high-filled silver powder, a low-viscosity fluorenone rubber composition that can be applied is used. Therefore, if the coating or screen printing by the dispenser is performed, the problem of shape collapse may occur. .

關於此等之先前文獻係列舉如下所述者。 The previous literature series on these are as follows.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特開昭61-266462號公報 [Patent Document 1] Japanese Patent Laid-Open No. 61-266462

〔專利文獻2〕日本特開平3-170581號公報 [Patent Document 2] Japanese Patent Laid-Open No. Hei 3-170081

〔專利文獻3〕日本特開平5-230373號公報 [Patent Document 3] Japanese Patent Laid-Open No. Hei 5-230373

〔專利文獻4〕日本特開平7-133432號公報 [Patent Document 4] JP-A-7-133432

〔專利文獻5〕日本特開平7-150048號公報 [Patent Document 5] Japanese Patent Laid-Open No. Hei 7-150048

〔專利文獻6〕日本特開2000-336273號公報 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2000-336273

〔專利文獻7〕日本特開2002-212426號公報 [Patent Document 7] Japanese Patent Laid-Open Publication No. 2002-212426

〔專利文獻8〕日本特開2004-27087號公報 [Patent Document 8] Japanese Patent Laid-Open Publication No. 2004-27087

〔專利文獻9〕日本特開2004-176165號公報 [Patent Document 9] Japanese Patent Laid-Open Publication No. 2004-176165

〔專利文獻10〕日本特開2005-162827號公報 [Patent Document 10] Japanese Patent Laid-Open Publication No. 2005-162827

〔專利文獻11〕日本特開2006-328302號公報 [Patent Document 11] Japanese Patent Laid-Open Publication No. 2006-328302

〔專利文獻12〕日本特開2008-303233號公報 [Patent Document 12] Japanese Patent Laid-Open Publication No. 2008-303233

本發明係鑑於上述情事而完成者,其目的為提供一種能進行塗佈且塗佈後之形狀保持性及保存安定性優異的高導電性矽酮組成物及其製造方法。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a highly conductive fluorenone composition which can be applied and which is excellent in shape retention and storage stability after coating, and a method for producing the same.

本發明者們係為了達成上述目的反覆致力探討的結果發現:由於使高導電性與形狀保持性兩相成立,因此為了成為將由經高填充之銀粉末所致之鉑觸媒的不活性化加以抑制,且保存安定性優異的組成物,而進一步添加導電性微粉末及脂肪酸或者是脂肪酸衍生物及/或其金屬鹽者係為有效,因而完成本發明。 The present inventors have found that in order to achieve the above object, it has been found that the high conductivity and the shape retention are both established, so that the platinum catalyst is inactivated by the highly filled silver powder. It is effective to further suppress the addition of a composition having excellent stability, and to further add a conductive fine powder and a fatty acid or a fatty acid derivative and/or a metal salt thereof, and thus the present invention has been completed.

亦即,本發明係提供一種加成硬化型導電性矽酮組成物,其係含有:(A)以下述平均組成式(1)所表示之一分子中至少含有2個鍵結於矽原子的烯基之有機聚矽氧烷:100質量份、RaR’bSiO(4-a-b)/2 (1)(式中,R為烯基,R’為不具有脂肪族不飽和鍵的非取代或取代之碳數1~10的一價烴基,a、b為滿足0<a≦2、0<b<3、0<a+b≦3之數)(B)一分子中至少含有2個鍵結於矽原子的氫原子之有機氫聚矽氧烷:相對於(A)成分中之全矽原子鍵結烯基,(B)成分中之鍵結於矽原子的氫原子係成為0.5~5.0倍莫耳之量、(C)銀粉末或經銀鍍敷的微粉末粒子:100~1,500質量份、 (D)導電性微粉末(其中,屏除銀、銅及包含此等之金屬):0.5~30質量份、(E)加成反應觸媒:觸媒量、以及(F)脂肪酸或者是脂肪酸衍生物及/或其金屬鹽:0.1~20質量份。 That is, the present invention provides an addition-curable conductive fluorenone composition comprising: (A) one of the molecules represented by the following average composition formula (1) having at least two bonds bonded to a ruthenium atom. Alkenyl organopolyoxane: 100 parts by mass, R a R' b SiO (4-ab)/2 (1) (wherein R is an alkenyl group, and R' is a non-aliphatic unsaturated bond a substituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, a and b satisfying 0<a≦2, 0<b<3, 0<a+b≦3) (B) at least 2 in one molecule An organic hydrogen polyoxyalkylene bonded to a hydrogen atom of a halogen atom: a hydrogen atom bonded to a halogen atom in the component (B) is 0.5 with respect to a total alkene bonded to an alkenyl group in the component (A). ~5.0 times the molar amount, (C) silver powder or silver-plated fine powder particles: 100 to 1,500 parts by mass, (D) conductive fine powder (in which the screen removes silver, copper and metals containing the same) : 0.5 to 30 parts by mass, (E) addition reaction catalyst: amount of catalyst, and (F) fatty acid or fatty acid derivative and/or metal salt thereof: 0.1 to 20 parts by mass.

本發明之導電性矽酮組成物係為賦予1.0×10-2Ω.cm以下之高導電率的硬化物,特別是可形成矽酮橡膠,且具塗佈性時,其形狀保持性良好,進而保存安定性亦良好者。 The conductive anthrone composition of the present invention is given 1.0 × 10 -2 Ω. A cured product having a high electrical conductivity of not more than cm, particularly when an oxime rubber is formed, and has good coatability and good stability in storage stability.

本發明之導電性矽酮組成物係含有:(A)以下述平均組成式(1)所表示之一分子中至少含有2個鍵結於矽原子的烯基之有機聚矽氧烷:100質量份、RaR’bSiO(4-a-b)/2 (1)(式中,R為烯基,R’為不具有脂肪族不飽和鍵的非取代或取代之碳數1~10的一價烴基,a、b為滿足0<a≦2、0<b<3、0<a+b≦3之數)(B)一分子中至少含有2個鍵結於矽原子的氫原子之有機氫聚矽氧烷:相對於(A)成分中之全矽原子鍵結烯 基,(B)成分中之鍵結於矽原子的氫原子係成為0.5~5.0倍莫耳之量、(C)銀粉末或經銀鍍敷的微粉末粒子:100~1,500質量份、(D)導電性微粉末(其中,屏除銀、銅及包含此等之金屬):0.5~30質量份、(E)加成反應觸媒:觸媒量、以及(F)脂肪酸或者是脂肪酸衍生物及/或其金屬鹽:0.1~20質量份。 The conductive fluorenone composition of the present invention contains: (A) an organopolyoxane having at least two alkenyl groups bonded to a ruthenium atom in a molecule represented by the following average composition formula (1): 100 mass Parts, R a R' b SiO (4-ab) / 2 (1) (wherein R is an alkenyl group, and R' is an unsubstituted or substituted carbon number of 1 to 10 having no aliphatic unsaturated bond. a valence hydrocarbon group, a, b is a number satisfying 0 < a ≦ 2, 0 < b < 3, 0 < a + b ≦ 3) (B) an organic molecule having at least two hydrogen atoms bonded to a ruthenium atom in one molecule Hydrogen polyoxyalkylene: The hydrogen atom bonded to the ruthenium atom in the component (B) is 0.5 to 5.0 times the molar amount relative to the total ruthenium atom-bonded alkenyl group in the component (A), (C) Silver powder or silver-plated fine powder particles: 100 to 1,500 parts by mass, (D) conductive fine powder (in which, screen silver, copper, and metals containing the same): 0.5 to 30 parts by mass, (E) plus The reaction catalyst: the amount of the catalyst, and (F) a fatty acid or a fatty acid derivative and/or a metal salt thereof: 0.1 to 20 parts by mass.

(A)含烯基之有機聚矽氧烷 (A) Alkenyl-containing organopolyoxane

(A)成分之含烯基之有機聚矽氧烷,係以下述平均組成式(1)所表示,且一分子中至少含有2個鍵結於矽原子的烯基者。 The alkenyl group-containing organopolyoxane of the component (A) is represented by the following average composition formula (1), and contains at least two alkenyl groups bonded to a ruthenium atom in one molecule.

RaR’bSiO(4-a-b)/2 (1)(式中,R為烯基,R’為不具有脂肪族不飽和鍵的非取代或取代之碳數1~10的一價烴基,a、b為滿足0<a≦2、0<b<3、0<a+b≦3之數)。 R a R' b SiO (4-ab) / 2 (1) (wherein R is an alkenyl group, and R' is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms which does not have an aliphatic unsaturated bond. , a, b are the numbers satisfying 0<a≦2, 0<b<3, 0<a+b≦3).

(A)成分之含烯基之有機聚矽氧烷,係為該組成物的主劑(基質聚合物),且一分子中至少含有平均2個以上(通常2~50個),較佳為2~20個,更佳為2~10個左右之鍵結於矽原子的烯基。(A)成分之有機聚矽氧烷 之烯基R係可舉例如:乙烯基、丙烯基、丁烯基、戊烯基、己烯基、庚烯基等,特別是以乙烯基者為佳。(A)成分之烯基的鍵結位置係可列舉例如:分子鏈末端及/或分子鏈側鏈。 The alkenyl group-containing organopolyoxane of the component (A) is a main component (matrix polymer) of the composition, and contains at least two or more (generally 2 to 50) molecules per molecule, preferably 2 to 20, more preferably 2 to 10 or so, bonded to an alkenyl group of a halogen atom. Organic polyoxane of component (A) The alkenyl group R may, for example, be a vinyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group or a heptenyl group, and particularly preferably a vinyl group. The bonding position of the alkenyl group of the component (A) is, for example, a molecular chain terminal and/or a molecular chain side chain.

(A)成分之有機聚矽氧烷中,烯基以外之鍵結於矽原子的有機基R’係可列舉例如:甲基、乙基、丙基、丁基、戊基、己基、庚基等之烷基;苯基、甲苯基、二甲苯基、萘基等之芳基;苄基、苯乙基等之芳烷基;氯甲基、3-氯丙基、3,3,3-三氟丙基等之鹵化烷基等,特別是以甲基、苯基者為佳。 In the organopolyoxane of the component (A), the organic group R' which is bonded to the ruthenium atom other than the alkenyl group may, for example, be a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group or a heptyl group. An alkyl group such as phenyl, tolyl, xylyl or naphthyl; an aralkyl group such as benzyl or phenethyl; chloromethyl, 3-chloropropyl, 3,3,3- A halogenated alkyl group such as a trifluoropropyl group or the like is preferably a methyl group or a phenyl group.

如此之(A)成分的分子結構雖可列舉例如:直鏈狀、具有局部分支的直鏈狀、環狀、分支鏈狀、三維網狀等,但以基本上主鏈為由二有機矽氧烷單元(D單元)重複所構成,且分子鏈兩末端為經三有機矽氧烷基封鎖的直鏈狀之二有機聚矽氧烷、直鏈狀之二有機聚矽氧烷與分支鏈狀或者是三維網狀之有機聚矽氧烷的混合物者為佳。 The molecular structure of the component (A) may be, for example, a linear chain, a linear chain having a partial branch, a cyclic chain, a branched chain, a three-dimensional network, or the like, but a substantially main chain is a diorganosiloxane. The alkane unit (D unit) is repeatedly formed, and the two ends of the molecular chain are linear diorganopolyoxyalkylene blocked by a triorganophosphonyl group, a linear diorganopolyoxyalkylene and a branched chain. Or a mixture of three-dimensional networked organopolyoxane is preferred.

此時,樹脂狀(分支鏈狀、三維網狀)之有機聚矽氧烷,只要含有烯基與SiO4/2單元(Q單元)及/或R”SiO3/2(T單元)(R”為R或R’)之有機聚矽氧烷則無特別限制,但可例示:由SiO4/2單元(Q單元)與RR’2SiO1/2單元或R’3SiO1/2單元等之M單元所構成,且M/Q之莫耳比為0.6~1.2之樹脂狀有機聚矽氧烷、或由T單元與M單元及/或D單元所構成之樹脂狀有機聚矽氧烷等。 In this case, the resinous (branched, three-dimensional network) organopolyoxane contains an alkenyl group and an SiO 4/2 unit (Q unit) and/or R"SiO 3/2 (T unit) (R). The organopolyoxane of "R or R') is not particularly limited, but may be exemplified by a SiO 4/2 unit (Q unit) and an RR' 2 SiO 1/2 unit or an R' 3 SiO 1/2 unit. a resinous organopolyoxane composed of M units having an M/Q molar ratio of 0.6 to 1.2, or a resinous organopolyoxane composed of a T unit and an M unit and/or a D unit. Wait.

樹脂狀之有機聚矽氧烷之調配量,就組成物之塗佈性 及銀粉末之填充性的觀點而言,直鏈狀有機聚矽氧烷與樹脂狀有機聚矽氧烷的較佳調配比例,以質量比計較佳係成為70:30~100:0,特佳為80:20~100:0之量。 The amount of resinous organic polyoxane, the coating properties of the composition From the viewpoint of the filling property of the silver powder, the preferred blending ratio of the linear organopolyoxane to the resinous organopolyoxane is preferably 70:30 to 100:0 by mass ratio, which is particularly preferable. It is an amount of 80:20~100:0.

a係0<a≦2,較佳為0.001≦a≦1;b係0<b<3,較佳為0.5≦b≦2.5;a+b係0<a+b≦3,較佳為滿足0.5≦a+b≦2.7之數。 a is 0 < a ≦ 2, preferably 0.001 ≦ a ≦ 1; b is 0 < b < 3, preferably 0.5 ≦ b ≦ 2.5; a + b is 0 < a + b ≦ 3, preferably satisfied The number of 0.5≦a+b≦2.7.

(A)成分於23℃時之黏度,就所得之矽酮組成物的物理特性為良好,此外,組成物之處理作業性、塗佈性為良好的觀點而言,以100~5,000mPa.s之範圍內者為佳,特別是以100~1,000mPa.s之範圍內者為佳。於直鏈狀有機聚矽氧烷併用樹脂狀有機聚矽氧烷時,由於樹脂狀有機聚矽氧烷係溶解於直鏈狀有機聚矽氧烷,因此予以混合而成為均勻狀態下的黏度。另外,於本發明中,黏度係可藉由旋轉黏度計而進行測量。 The viscosity of the component (A) at 23 ° C is good, and the physical properties of the obtained fluorenone composition are good, and the processing workability and coating property of the composition are good, and it is 100 to 5,000 mPa. The range of s is better, especially 100~1,000mPa. Those within the range of s are preferred. When a resinous organopolysiloxane is used in combination with a linear organopolysiloxane, the resinous organopolysiloxane is dissolved in a linear organopolyoxane, and thus mixed to have a viscosity in a uniform state. Further, in the present invention, the viscosity can be measured by a rotary viscometer.

上述之(A)成分的有機聚矽氧烷係可列舉例如:分子鏈兩末端三甲基矽氧基封鎖二甲基矽氧烷.甲基乙烯基矽氧烷共聚物、分子鏈兩末端三甲基矽氧基封鎖甲基乙烯基聚矽氧烷、分子鏈兩末端三甲基矽氧基封鎖二甲基矽氧烷.甲基乙烯基矽氧烷.甲基苯基矽氧烷共聚物、分子鏈兩末端二甲基乙烯基矽氧基封鎖二甲基聚矽氧烷、分子鏈兩末端二甲基乙烯基矽氧基封鎖甲基乙烯基聚矽氧烷、分子鏈兩末端二甲基乙烯基矽氧基封鎖二甲基矽氧烷.甲基乙烯基矽氧烷共聚物、分子鏈兩末端二甲基乙烯基矽氧基封鎖二甲基矽氧烷.甲基乙烯基矽氧烷.甲基苯基矽氧烷 共聚物、分子鏈兩末端三乙烯基矽氧基封鎖二甲基聚矽氧烷、由以式:R1 3SiO0.5所表示之矽氧烷單元與以式:R1 2R2SiO0.5所表示之矽氧烷單元與式:R1 2 SiO所表示之矽氧烷單元與以式:SiO2所表示之矽氧烷單元所構成的有機矽氧烷共聚物、由以式:R1 3SiO0.5所表示之矽氧烷單元與以式:R1 2R2SiO0.5所表示之矽氧烷單元與式:SiO2所表示之矽氧烷單元所構成的有機矽氧烷共聚物、由以式:R1 2 R2SiO0.5所表示之矽氧烷單元與以式:R1 2SiO所表示之矽氧烷單元與以式:SiO2所表示之矽氧烷單元所構成的有機矽氧烷共聚物、由以式:R1 R2SiO所表示之矽氧烷單元與以式:R1SiO1.5所表示之矽氧烷單元或以式:R2SiO1.5所表示之矽氧烷單元所構成的有機矽氧烷共聚物、及由此等之有機聚矽氧烷之2種以上所構成的混合物。 The organopolyoxyalkylene of the above component (A) may, for example, be a dimethyloxy group at the end of the molecular chain. Methyl vinyl alkane copolymer, molecular chain two-terminal trimethyl methoxy group blocking methyl vinyl polyoxyalkylene, molecular chain two-terminal trimethyl methoxy group blocking dimethyl oxane. Methyl vinyl siloxane. Methylphenyl fluorene copolymer, molecular chain two-terminal dimethylvinyl methoxy group blocking dimethyl polyoxyalkylene, molecular chain two terminal dimethyl vinyl methoxy group blocking methyl vinyl fluorene Oxygenane, the two ends of the molecular chain dimethyl vinyl methoxy group block dimethyl oxa oxide. Methyl vinyl alkane copolymer, molecular chain two-terminal dimethyl vinyl methoxy group block dimethyl oxa oxide. Methyl vinyl siloxane. a methylphenyl siloxane copolymer, a trivinyl methoxy group at the two ends of the molecular chain, which blocks dimethyl polyoxane, a siloxane unit represented by the formula: R 1 3 SiO 0.5 and a formula: R 1 2 R 2 SiO 0.5 represents a oxoxane unit and a formula: an organooxane copolymer represented by R 1 2 SiO and an organooxane copolymer represented by a siloxane unit represented by the formula: SiO 2 , An organic compound composed of a oxoxane unit represented by the formula: R 1 3 SiO 0.5 and a oxoxane unit represented by the formula: R 1 2 R 2 SiO 0.5 and a decane unit represented by the formula: SiO 2 a siloxane copolymer, a fluoran oxide unit represented by the formula: R 1 2 R 2 SiO 0.5 and a oxoxane unit represented by the formula: R 1 2 SiO and an oxygen represented by the formula: SiO 2 An organooxane copolymer composed of an alkane unit, a siloxane unit represented by the formula: R 1 R 2 SiO, and a siloxane unit represented by the formula: R 1 SiO 1.5 or a formula: R 2 SiO A mixture of two or more kinds of an organic oxirane copolymer composed of a siloxane unit represented by 1.5 and an organic polysiloxane.

在此,上述式中之R1係為烯基以外之一價烴基,可列舉例如:甲基、乙基、丙基、丁基、戊基、己基、庚基等之烷基;苯基、甲苯基、二甲苯基、萘基等之芳基;苄基、苯乙基等之芳烷基;氯甲基、3-氯丙基、3,3,3-三氟丙基等之鹵化烷基等。此外,上述式中之R2係為烯基,可舉例如:乙烯基、丙烯基、丁烯基、戊烯基、己烯基、庚烯基等。 Here, R 1 in the above formula is a monovalent hydrocarbon group other than the alkenyl group, and examples thereof include an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, and a heptyl group; An aryl group such as a tolyl group, a xylyl group or a naphthyl group; an aralkyl group such as a benzyl group or a phenethyl group; a halogenated alkane such as a chloromethyl group, a 3-chloropropyl group or a 3,3,3-trifluoropropyl group; Base. Further, in the above formula, R 2 is an alkenyl group, and examples thereof include a vinyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, and a heptenyl group.

(B)有機氫聚矽氧烷 (B) organic hydrogen polyoxyalkylene oxide

本發明之組成物所使用的有機氫聚矽氧烷(B),係 一分子中至少含有2個(通常,2~300),較佳為3個以上(例如,3~150個左右),更佳為3~100左右之鍵結於矽原子的氫原子(亦即,SiH基)者,且可為直鏈狀、分支狀、環狀、或三維網狀結構之樹脂狀物中任一者。上述之有機氫聚矽氧烷係可列舉例如:以下述平均組成式(2)所表示之有機氫聚矽氧烷。 The organohydrogen polyoxane (B) used in the composition of the present invention is At least two (usually 2 to 300), preferably three or more (for example, about 3 to 150), more preferably from about 3 to 100, bonded to a hydrogen atom of a halogen atom in one molecule (ie, Any of the resin materials of a linear, branched, cyclic, or three-dimensional network structure, which may be a SiH group. The organic hydrogen polyoxyalkylene system described above is, for example, an organic hydrogen polyoxyalkylene represented by the following average composition formula (2).

HcR3 dSiO(4-c-d)/2 (2)(式中,R3係為獨立不含有脂肪族不飽和鍵之非取代或取代的一價烴基或烷氧基,c及d係成為0<c<2、0.8≦d≦2且0.8<c+d≦3之數,較佳係成為0.05≦c≦1、1.5≦d≦2且1.8≦c+d≦2.7之數。此外,一分子中之矽原子之數(或聚合度)係2~100個,特別是以3~50個為佳)。 H c R 3 d SiO (4-cd)/2 (2) (wherein R 3 is an unsubstituted or substituted monovalent hydrocarbon group or alkoxy group independently containing no aliphatic unsaturated bond, c and d systems The number of 0 < c < 2, 0.8 ≦ d ≦ 2 and 0.8 < c + d ≦ 3 is preferably 0.05 ≦ c ≦ 1, 1.5 ≦ d ≦ 2 and 1.8 ≦ c + d ≦ 2.7. The number of atoms (or degree of polymerization) in one molecule is 2 to 100, especially 3 to 50.

在此,上述式中R3之不含有脂肪族不飽和鍵之非取代或取代的一價烴基,除可列舉與作為前述之R’所例示者相同以外,其他作為甲氧基、乙氧基等之烷氧基、取代一價烴基,可列舉含環氧基之一價烴基等,其具代表性者係碳數為1~10,特別是碳數為1~7者,較佳為甲基等之碳數1~3之低級烷基、3,3,3-三氟丙基、碳數1~4之烷氧基。此時,含環氧基之一價烴基係可列舉上述非取代之一價烴基,特別是烷基之氫原子之1個或其以上經環氧丙基、環氧丙氧基取代者。R3特佳為甲基、甲氧基、乙氧 基、含環氧基之一價烴基。 Here, the unsubstituted or substituted monovalent hydrocarbon group of R 3 which does not contain an aliphatic unsaturated bond in the above formula may be, for example, the same as those exemplified as R' described above, and other methoxy group and ethoxy group. The alkoxy group or the substituted monovalent hydrocarbon group may, for example, be a monovalent hydrocarbon group containing an epoxy group, and the representative ones have a carbon number of 1 to 10, particularly a carbon number of 1 to 7, preferably A. a lower alkyl group having a carbon number of 1 to 3, a 3,3,3-trifluoropropyl group or an alkoxy group having 1 to 4 carbon atoms. In this case, the monovalent hydrocarbon group containing an epoxy group may be one of the above-mentioned unsubstituted one-valent hydrocarbon groups, and in particular, one or more hydrogen atoms of the alkyl group may be substituted with a glycidyl group or a glycidoxy group. R 3 is particularly preferably a methyl group, a methoxy group, an ethoxy group or a monovalent hydrocarbon group containing an epoxy group.

上述之有機氫聚矽氧烷係可列舉例如:1,1,3,3-四甲基二矽氧烷、1,3,5,7-四甲基四環矽氧烷、1,3,5,7,8-五甲基五環矽氧烷、甲基氫環聚矽氧烷、甲基氫矽氧烷.二甲基矽氧烷環狀共聚物、參(二甲基氫矽氧烷)甲基矽烷等之矽氧烷寡聚物;分子鏈兩末端三甲基矽氧基封鎖甲基氫聚矽氧烷、分子鏈兩末端三甲基矽氧基封鎖二甲基矽氧烷.甲基氫矽氧烷共聚物、分子鏈兩末端矽醇基封鎖甲基氫聚矽氧烷、分子鏈兩末端矽醇基封鎖二甲基矽氧烷.甲基氫矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封鎖二甲基聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封鎖甲基氫聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封鎖二甲基矽氧烷.甲基氫矽氧烷共聚物等;由R3 2(H)SiO1/2單元與SiO4/2單元所構成,且能任意含有R3 3SiO1/2單元、R3 2SiO2/2單元、R3(H)SiO2/2單元、(H)SiO3/2單元或R3SiO3/2單元之矽酮樹脂(但,R3係與前述相同)等以外,其他可列舉將此等之列示化合物中甲基之一部分或全部經乙基、丙基等之其他的烷基取代者等,進而可列舉以下述式 (式中,R3係與前述相同,s、t係各自為0或1以上之整數)等所表示者。 Examples of the above-mentioned organic hydrogen polyoxyalkylene oxides include 1,1,3,3-tetramethyldioxane, 1,3,5,7-tetramethyltetracyclodecane, and 1,3. 5,7,8-pentamethylpentacyclononane, methylhydrocyclopolyoxyalkylene, methylhydroquinone. a methoxy alkane oligomer such as a dimethyl methoxy olefin cyclic copolymer or a dimethyl hydrazine oxide; a trimethyl methoxy group at the two ends of the molecular chain to block methyl hydrogen polyoxyl The alkane and the end of the molecular chain trimethyl methoxy group block the dimethyl oxane. The methylhydroquinone copolymer, the sterol group at both ends of the molecular chain blocks the methyl hydrogen polyoxyalkylene, and the sterol group at both ends of the molecular chain blocks the dimethyloxane. Methyl hydroquinone copolymer, dimethyl hydrazine oxy group at the two ends of the molecular chain, dimethyl polyoxyalkylene, dimethyl hydrazine at the two ends of the molecular chain, methyl hydrogen polyoxyalkylene, molecular The two ends of the chain, dimethylhydroquinone, block the dimethyloxane. a methylhydroquinone copolymer or the like; composed of R 3 2 (H)SiO 1/2 units and SiO 4/2 units, and optionally containing R 3 3 SiO 1/2 units, R 3 2 SiO 2 / Other than the two units, the R 3 (H) SiO 2/2 unit, the (H) SiO 3/2 unit or the R 3 SiO 3/2 unit fluorenone resin (however, the R 3 system is the same as described above), etc. These may be listed as a part or all of a methyl group in a compound, which may be substituted with another alkyl group such as an ethyl group or a propyl group, and the like. (In the formula, R 3 is the same as described above, and s and t are each an integer of 0 or 1 or more).

此外,當接著性為重要時,係以於(B)成分之一部分或全部使用如同以下述式(3)、(4)所表示般之分子中具有烷氧基及/或含環氧基者為佳。特別是如同以式(4)所表示般之分子中具有烷氧基與含環氧基的有機氫聚矽氧烷,係對於接著性提昇方面為有效。 Further, when the adhesion is important, a part or all of the component (B) is used as the one having the alkoxy group and/or the epoxy group in the molecule as represented by the following formulas (3) and (4). It is better. In particular, an organic hydrogen polyoxyalkylene having an alkoxy group and an epoxy group-containing molecule in the molecule as represented by the formula (4) is effective for improving the adhesion.

本發明之組成物中所使用的有機氫聚矽氧烷,係可利用習知的方法取得,例如,可藉由將由一般式:R3SiHCl2及R3 2SiHCl(式中,R3係與前述相同)中所選出之至少1種的氯矽烷進行(共)水解,或者是使該氯矽烷與一般式:R3 3SiCl及R3 2SiCl2(式中,R3係與前述相同)中所選出之至少1種的氯矽烷組合而進行共水解,並予以縮合而得者。此外,有機氫聚矽氧烷,亦可為將進行上述之(共)水解縮合所得到的聚矽氧烷予以平衡化而得者。 The organohydrogenpolyoxane used in the composition of the present invention can be obtained by a conventional method, for example, by the general formula: R 3 SiHCl 2 and R 3 2 SiHCl (wherein the R 3 system) At least one of the chlorodecane selected in the same manner as described above is (co)hydrolyzed, or the chlorodecane is of the general formula: R 3 3 SiCl and R 3 2 SiCl 2 (wherein the R 3 system is the same as the above) The at least one selected chlorodecane selected from the group is co-hydrolyzed and condensed. Further, the organic hydrogen polyoxyalkylene may be obtained by equilibrating a polyoxyalkylene obtained by performing the above (co)hydrolysis condensation.

(B)成分之調配量,係以相對於(A)成分中之鍵結於全矽原子之烯基,(B)成分中之鍵結於矽原子之氫原子成為0.5~5.0倍莫耳之量者為佳,更佳係成為0.7~3.0倍莫耳之量。無論是未達0.5或5.0以上,皆有交聯平衡崩塌而無法得到充分的強度之硬化物的情況。 The amount of the component (B) is an alkenyl group bonded to the total ruthenium atom in the component (A), and the hydrogen atom bonded to the ruthenium atom in the component (B) is 0.5 to 5.0 times the molar amount. The amount is better, and the better is 0.7 to 3.0 times the amount of Mo. In the case of less than 0.5 or more, there is a case where the crosslinked balance collapses and a cured product having sufficient strength cannot be obtained.

(C)銀粉末或經銀鍍敷的微粉末粒子 (C) Silver powder or silver-plated fine powder particles

為了賦予矽酮組成物的硬化物導電性,於本發明中,導電性填料係使用有銀粉末或經銀鍍敷的微粉末粒子。針對銀粉末,具體而言係可例示還原銀粉末、電解銀粉末、霧化銀粉末。(C)成分之形狀雖有球狀、扁平狀、樹枝狀、不定形狀等之各種者,但並無特別限定。但,為了將用以作成高導電性組成物之銀粉予以高填充,而以扁平狀之銀粉末為佳。此外,針對經銀鍍敷的微粉末粒子,雖市售有所鍍敷的基材為二氧化矽或銅者,但並無特別限定。為了利用銀來塗佈表面,係以球狀之基材者為佳。(C) 成分之平均粒徑雖無特別限定,但較佳為0.1~15μm。該平均粒徑,係可作為以雷射光繞射法所進行的粒度分佈測量裝置中之累計質量平均值D50而求得者。 In order to impart conductivity to the cured product of the anthrone composition, in the present invention, the conductive filler is a fine powder particle in which silver powder or silver plating is used. Specific examples of the silver powder include reduced silver powder, electrolytic silver powder, and atomized silver powder. The shape of the component (C) is not particularly limited as long as it has various shapes such as a spherical shape, a flat shape, a dendritic shape, and an indefinite shape. However, in order to highly fill the silver powder used to form the highly conductive composition, it is preferable to use a flat silver powder. Further, the silver-plated fine powder particles are not particularly limited as long as the substrate to be plated is cerium oxide or copper. In order to coat the surface with silver, it is preferred to use a spherical substrate. The average particle diameter of the component (C) is not particularly limited, but is preferably 0.1 to 15 μm. The average particle diameter can be obtained as the cumulative mass average value D 50 in the particle size distribution measuring device by the laser light diffraction method.

銀粉係依據該製造過程而含有防鏽劑或用以防止凝集的潤滑劑等。若此等作用於加成反應觸媒之鉑族觸媒,則會有引起硬化延遲或變得不完全硬化的情況。因此,銀粉或銀鍍敷填料,係以利用大量的水或者是丙酮或甲基乙基酮的有機溶劑預先加以洗淨後使其乾燥者為佳。 The silver powder contains a rust preventive agent or a lubricant for preventing aggregation depending on the manufacturing process. If these acts on the platinum group catalyst of the addition reaction catalyst, there is a case where the hardening is delayed or incompletely hardened. Therefore, the silver powder or the silver plating filler is preferably washed with a large amount of water or an organic solvent of acetone or methyl ethyl ketone and then dried.

(C)成分之調配量,相對於(A)成分100質量份,其必須為100~1,500質量份,更佳為300~1,000質量份。若(C)成分低於100質量份,則硬化物之導電率會降低,若多於1,500質量份,則組成物之處理會變得困難。 The amount of the component (C) to be added is 100 to 1,500 parts by mass, more preferably 300 to 1,000 parts by mass, per 100 parts by mass of the component (A). When the component (C) is less than 100 parts by mass, the electrical conductivity of the cured product is lowered, and if it is more than 1,500 parts by mass, the treatment of the composition becomes difficult.

(D)導電性微粉末(其中,屏除銀、銅及包含此等之金屬) (D) Conductive fine powder (in which the screen removes silver, copper, and metals containing the same)

(D)成分係為了一面持保持組成物之導電性一面使搖變性提昇,且提高形狀保持性而使用。賦予導電性的粉末,雖可列舉碳黑或導電性中國白(氧化鋅)等,但於作為具有高導電率之組成物的本發明中,係以使用碳黑者為較佳。 The component (D) is used to improve the shakeability while maintaining the conductivity of the composition and to improve the shape retention. The powder to which the conductivity is imparted is, for example, carbon black or conductive Chinese white (zinc oxide). However, in the present invention which is a composition having high conductivity, it is preferred to use carbon black.

碳黑,係能使用一般常用於導電性橡膠組成物者,可列舉例如:乙炔碳、導電爐黑(CF)、超導電爐黑(SCF)、特導電爐黑(XCF)、導電槽製炭黑(CC)、 在1,500~3,000℃左右之高溫下經熱處理之爐黑或槽製炭黑等。此等之中,乙炔碳,就雜質含有率較低,而且具有發展後之2元結構構造的觀點而言,導電性優異,故特別適合使用於本發明。 For carbon black, those generally used for conductive rubber compositions can be used, and examples thereof include acetylene carbon, conductive furnace black (CF), superconducting furnace black (SCF), special conductive furnace black (XCF), and conductive groove carbon. Black (CC), Heat treated furnace black or tank carbon black at a high temperature of about 1,500 to 3,000 °C. Among these, acetylene carbon is particularly suitable for use in the present invention because of its low impurity content and excellent conductivity in view of the developed two-dimensional structure.

(D)成分之添加量,相對於(A)成分100質量份,其為0.5~30質量份,更佳為1~25質量份,特佳為3~20質量份。於添加量低於0.5質量份的情況中,搖變性提昇效果並不充分,且組成物之塗佈後的形狀保持性會變差,於多於30質量份的情況中,其黏度會過度上昇而使組成物之作業性降低。 The amount of the component (D) to be added is 0.5 to 30 parts by mass, more preferably 1 to 25 parts by mass, even more preferably 3 to 20 parts by mass, per 100 parts by mass of the component (A). In the case where the amount added is less than 0.5 parts by mass, the effect of improving the shake denaturation is insufficient, and the shape retainability after coating of the composition is deteriorated, and in the case of more than 30 parts by mass, the viscosity is excessively increased. The workability of the composition is lowered.

(E)加成反應觸媒 (E) Addition reaction catalyst

本發明所使用之加成反應觸媒(矽氫化反應觸媒),係為用以促進前述之(A)成分的烯基與(B)成分之鍵結於矽原子的氫原子(亦即,SiH基)之加成反應的觸媒,可列舉鉑族金屬系觸媒等之眾所周知的觸媒作為矽氫化反應所使用之觸媒。 The addition reaction catalyst (hydrazine hydrogenation reaction catalyst) used in the present invention is a hydrogen atom for promoting the bonding of an alkenyl group of the above-mentioned (A) component and a component (B) to a halogen atom (that is, As the catalyst for the addition reaction of the SiH group, a well-known catalyst such as a platinum group metal catalyst can be used as a catalyst for the hydrogenation reaction.

此鉑族金屬系觸媒係可作為矽氫化反應觸媒而使用鉑、銠、鈀等之鉑族金屬系觸媒等所有習知者。可列舉例如:鉑黑、銠、鈀等之鉑族金屬單體;H2PtCl4.yH2O、H2PtCl6.yH2O、NaHPtCl6.yH2O、KHPtCl6.yH2O、Na2PtCl6.yH2O、K2PtCl4.yH2O、PtCl4.yH2O、PtCl2、Na2HPtCl4.yH2O(式中,y為0~6之整數,較佳為0或6)等之氯化鉑、 氯鉑酸及氯鉑酸鹽;醇改性氯鉑酸(參照美國專利第3,220,972號說明書);氯鉑酸與烯烴之錯合物(參照美國專利第3,159,601號說明書、同第3,159,662號說明書、同第3,775,452號說明書);於氧化鋁、二氧化矽、碳等之擔體擔持有鉑黑、鈀等之鉑族金屬者;銠-烯烴錯合物;氯參(三苯基膦)銠(威爾金森(Wilkinson)觸媒);氯化鉑、氯鉑酸或氯鉑酸鹽與含乙烯基之矽氧烷,特別是與含乙烯基之環狀矽氧烷的錯合物等。作為在此等中較佳者,就相容性之觀點及氯雜質之觀點而言,可列舉氯鉑酸經矽酮改質者,具體而言係可列舉例如氯鉑酸經四甲基二乙烯基二矽氧烷改質之鉑觸媒。 This platinum group metal-based catalyst system can be used as a ruthenium hydrogenation catalyst, and a platinum group metal catalyst such as platinum, rhodium or palladium can be used. For example, a platinum group metal monomer such as platinum black, rhodium or palladium; H 2 PtCl 4 . yH 2 O, H 2 PtCl 6 . yH 2 O, NaHPtCl 6 . yH 2 O, KHPtCl 6 . yH 2 O, Na 2 PtCl 6 . yH 2 O, K 2 PtCl 4 . yH 2 O, PtCl 4 . yH 2 O, PtCl 2 , Na 2 HPtCl 4 . yH 2 O (wherein, y is an integer of 0 to 6, preferably 0 or 6), such as platinum chloride, chloroplatinic acid, and chloroplatinate; alcohol-modified chloroplatinic acid (refer to U.S. Patent No. 3,220,972) The specification is a complex of chloroplatinic acid and an olefin (refer to the specification of U.S. Patent No. 3,159,601, the specification of the same as No. 3,159,662, the specification of the same as No. 3,775,452); the support of alumina, cerium oxide, carbon, etc. Platinum group metals such as platinum black, palladium, etc.; ruthenium-olefin complex; chlorohydrazine (triphenylphosphine) ruthenium (Wilkinson catalyst); platinum chloride, chloroplatinic acid or chloroplatinate A complex with a vinyl-containing alkane, particularly a vinyl-containing cyclic siloxane. Preferred among these, from the viewpoint of compatibility and chlorine impurities, chloroplatinic acid may be exemplified by fluorenone, and specific examples thereof include chloroplatinic acid via tetramethyl bis Platinum catalyst modified with vinyl dioxane.

(E)成分之添加量,係為鉑原子而相對於(A)成分,且以質量換算為0.5~1,000ppm,較佳為1~500ppm,更佳為5~200ppm。 The amount of the component (E) to be added is platinum atom and is 0.5 to 1,000 ppm, preferably 1 to 500 ppm, more preferably 5 to 200 ppm, based on the mass of the component (A).

(F)脂肪酸或者是脂肪酸衍生物及/或其金屬鹽 (F) a fatty acid or a fatty acid derivative and/or a metal salt thereof

(F)成分之脂肪酸或者是脂肪酸衍生物及/或其金屬鹽,係欲將組成物之加成硬化性予以安定化而加以調配者,亦可使用市售者。 The fatty acid of the component (F) or the fatty acid derivative and/or its metal salt may be prepared by blending the addition curability of the composition, and may be used commercially.

(F)成分之添加量,相對於(A)成分100質量份,其為0.1~20質量份,較佳為0.1~5質量份。若未達0.1質量份則保存安定性提昇效果會變得不充足,若超過20質量份則硬化性會變差。在此,脂肪酸或者是脂肪酸衍生物及/或其金屬鹽之較佳的碳數係為8以上,較佳為8~ 20。 The amount of the component (F) to be added is 0.1 to 20 parts by mass, preferably 0.1 to 5 parts by mass, per 100 parts by mass of the component (A). If it is less than 0.1 part by mass, the effect of preserving stability improvement may become insufficient, and if it exceeds 20 mass parts, hardenability may deteriorate. Here, the preferred carbon number of the fatty acid or the fatty acid derivative and/or its metal salt is 8 or more, preferably 8~. 20.

脂肪酸之具體的例子係可例示:辛酸、十一碳烯酸、月桂酸、肉豆蔻酸、棕櫚酸、十七酸、硬脂酸、海藻酸、二十四酸、二十六酸、三十酸、肉豆蔻油酸、油酸、亞麻油酸、蘇子油酸等。 Specific examples of the fatty acid can be exemplified by caprylic acid, undecylenic acid, lauric acid, myristic acid, palmitic acid, heptadecanoic acid, stearic acid, alginic acid, tetracosic acid, hexacylic acid, and thirty Acid, nutmeg oleic acid, oleic acid, linoleic acid, succulent acid, and the like.

脂肪酸衍生物之例子係可列舉:脂肪酸酯、脂肪族醇之酯等。脂肪族酯係可例示:上述脂肪酸等與C1~C5之低級醇酯、山梨醇酯、丙三醇酯等之多元醇酯。脂肪族醇之酯係可例示:辛醯醇、辛醇、月桂醇、肉豆蔻醇、硬脂醇等之飽和醇等的脂肪酸醇之戊二酸酯或辛二酸酯之類的二元酸酯、檸檬酸酯之類的三元酸酯。 Examples of the fatty acid derivative include fatty acid esters, esters of aliphatic alcohols, and the like. The aliphatic ester system may, for example, be a polyhydric alcohol ester such as a fatty acid such as a fatty acid such as a C 1 to C 5 lower alcohol ester, a sorbitol ester or a glycerin ester. The ester of an aliphatic alcohol can be exemplified by a fatty acid alcohol such as octanol, octanol, lauryl alcohol, myristyl alcohol or stearyl alcohol, or a dibasic acid such as a glutarate or a suberate. a ternary acid ester such as an ester or a citric acid ester.

於脂肪酸金屬鹽之脂肪酸的例子係可列舉;辛酸、十一碳烯酸、月桂酸、肉豆蔻酸、棕櫚酸、十七酸、硬脂酸、海藻酸、二十四酸、二十六酸、三十酸、肉豆蔻油酸、油酸、亞麻油酸、蘇子油酸等;金屬係可列舉例如:鋰、鈣、鎂、鋅等。 Examples of the fatty acid of the fatty acid metal salt include octanoic acid, undecylenic acid, lauric acid, myristic acid, palmitic acid, heptadecanoic acid, stearic acid, alginic acid, tetracosic acid, and hexacylic acid. And tridecanoic acid, nutmeg oleic acid, oleic acid, linoleic acid, ursolic acid, and the like; and the metal system may, for example, be lithium, calcium, magnesium, zinc or the like.

(F)成分係以脂肪酸為佳,以硬脂酸為較佳。(F)成分雖可單獨使用,但以使用預先與(E)成分進行混合者就能夠使保存安定性更加提昇一事較為理想。 The component (F) is preferably a fatty acid, and stearic acid is preferred. Although the component (F) can be used alone, it is preferable to use the component (E) in advance to improve the preservation stability.

本發明之組成物,雖可為與一般之加成硬化型矽酮組成物相同地1液組成物亦可為使用前才加以混合的2液組成物,但就作業性之觀點而言,係以成為1液組成物者為佳。 The composition of the present invention may be a two-liquid composition which is mixed with the general addition-curable fluorenone composition, and may be mixed before use. However, from the viewpoint of workability, It is preferred to be a one-liquid composition.

於本發明之組成物中,可在不損及本發明之目的的範 圍內進一步添加各種之添加劑。特別是為了將本發明之組成物以1液型作使用之際的儲存安定性提昇,而可調配矽氫化反應抑制劑。反應抑制劑係可使用以往眾所周知者,可列舉例如:乙炔系化合物、含有2個以上烯基之化合物、含有炔基之化合物、或三聚氰酸三烯丙酯或其改質品等。此等之中,以具有烯基或炔基之化合物的使用較為理想。 In the composition of the present invention, it can be used without impairing the object of the present invention. Further additives are added to the circumference. In particular, in order to improve the storage stability when the composition of the present invention is used in the one-liquid type, the hydrogenation reaction inhibitor can be formulated. The reaction inhibitor can be used, and examples thereof include an acetylene compound, a compound containing two or more alkenyl groups, a compound containing an alkynyl group, or a triallyl cyanurate or a modified product thereof. Among these, the use of a compound having an alkenyl group or an alkynyl group is preferred.

該等之反應抑制劑的添加量,若過少則有無法得到矽氫化反應之延遲效果的情況,若過多則有導致硬化本身受到阻礙的情況,因此,相對於(A)~(F)成分之合計量100質量份,以在0.01~1.0質量份之範圍內者為佳。 If the amount of the reaction inhibitor added is too small, the delayed effect of the hydrogenation reaction may not be obtained. If the amount is too large, the curing itself may be inhibited. Therefore, the component (A) to (F) is not affected. The total amount is 100 parts by mass, preferably in the range of 0.01 to 1.0 part by mass.

此外,為了提昇接著性亦可調配矽烷偶合劑。 Further, a decane coupling agent may be formulated in order to improve adhesion.

本發明之加成硬化型導電性矽酮組成物之製造方法,係可列舉例如:利用行星混合機、捏合機、品川混合機等之混合機來將(A)~(F)成分及其他之任意成分進行混合的方法等。此時,將預先混合有(E)成分與(F)成分者與其他成分進行混合者,就使組成物之保存安定性更加提昇的觀點而言較為理想。 In the method for producing the addition-curable conductive fluorenone composition of the present invention, for example, a component such as a planetary mixer, a kneader or a Shinagawa mixer is used to carry out the components (A) to (F) and others. A method of mixing arbitrary components, and the like. In this case, it is preferable to mix the components (E) and (F) in advance with other components, and it is preferable to improve the storage stability of the composition.

於本發明中,組成物之黏度與搖變係數係於塗佈後之形狀安定性中為重要的因子。使用有E型黏度計時的旋轉速度為10rpm時於23℃之組成物的黏度係為10Pa.s以上500Pa.s以下,特別是以20~200Pa.s者為佳。若黏度過低,則會有藉由分注器等進行塗佈之際或者是於加熱硬化時流動而無法保持形狀的情況。此外,若黏度過高,則 有在利用分注器進行塗佈時產生絲線,或進行網版印刷時無法充分追隨遮罩的圖案,而引起圖案之缺損之虞。另外,於23℃時之組成物在10rpm的黏度與在20rpm的黏度之比(10rpm/20rpm)(以下,以搖變係數表示)係為1.5以上,特別是以2.0~5.0者為佳。若該搖變係數未達1.5,則會有使塗佈後形狀安定變得不充分的情況,因此,於塗佈後的形狀安定性為重要的情況中,係以使用搖變係數為1.5以上者為佳。 In the present invention, the viscosity and the coefficient of the shake of the composition are important factors in the shape stability after coating. The viscosity of the composition at 23 ° C when the rotational speed of the E-type viscosity is 10 rpm is 10 Pa. s above 500Pa. s below, especially 20~200Pa. s is better. When the viscosity is too low, there is a case where the film is applied by a dispenser or the like, or flows during heat curing, and the shape cannot be maintained. In addition, if the viscosity is too high, then There is a pattern in which a thread is generated when coating with a dispenser, or a pattern that cannot sufficiently follow the mask when screen printing is performed, and the pattern is defective. Further, the composition at 23 ° C has a viscosity at 10 rpm and a viscosity at 20 rpm (10 rpm / 20 rpm) (hereinafter, expressed by a rocking coefficient) of 1.5 or more, particularly preferably 2.0 to 5.0. If the coefficient of rocking is less than 1.5, the shape stability after coating may be insufficient. Therefore, when the shape stability after coating is important, the use of the rocking coefficient is 1.5 or more. It is better.

本發明之組成物的硬化條件,係以在100~150℃下使其硬化1~120分鐘者較為理想。此時,硬化物之導電率,係以將(C)、(D)成分之調配量進行調整而成為1.0×10-2Ω.cm以下者為佳,特別是以1.0×10-2~1.0×10-5Ω.cm者為佳。 The curing conditions of the composition of the present invention are preferably 1 to 120 minutes at 100 to 150 ° C. At this time, the conductivity of the cured product is adjusted to be 1.0 × 10 -2 Ω by adjusting the amount of the components (C) and (D). The following is better than cm, especially 1.0 × 10 -2 ~ 1.0 × 10 -5 Ω. The cm is better.

〔實施例〕 [Examples]

以下,雖列舉實施例及比較例來具體說明本發明,但本發明並不限定於以下之實施例。 Hereinafter, the present invention will be specifically described by way of examples and comparative examples, but the present invention is not limited to the following examples.

〔實施例1~4、比較例1~4〕 [Examples 1 to 4, Comparative Examples 1 to 4]

在表1、表2所展示的調配量下,藉由THINKY(股)製自轉/公轉攪拌機(AWATORI練太郎)來將下述所示之成分均勻地混合,而調製出矽酮組成物。實施例及比較例中,黏度係在23℃下藉由E型黏度計(東機產業(股)製RE80)所測量出的值。 Under the blending amounts shown in Tables 1 and 2, the components shown below were uniformly mixed by a THINKY (rotary/rotary mixer) (AWATORI) to prepare an anthrone composition. In the examples and the comparative examples, the viscosity was measured at 23 ° C by an E-type viscometer (RE80 manufactured by Toki Sangyo Co., Ltd.).

(A)一分子中具有2個鍵結於矽原子的乙烯基,且黏度600mPa.s之甲基乙烯基聚矽氧烷 (A) has a vinyl group bonded to a ruthenium atom in one molecule, and has a viscosity of 600 mPa. s methyl vinyl polyoxyalkylene

(B-1)於23℃之黏度5mPa.s,氫氣產生量為350ml/g之甲基氫聚矽氧烷 (B-1) viscosity at 23 ° C 5mPa. s, methyl hydrogen polyoxane having a hydrogen production of 350 ml/g

(B-2)以式(4)所表示之含SiH化合物 (B-2) SiH-containing compound represented by formula (4)

(C)利用丙酮來將福田金屬箔粉工業(股)製銀粉(AgC-237)進行洗淨,並使其乾燥者 (C) Washing and drying the Fukuda Metal Foil Powder Industrial Co., Ltd. silver powder (AgC-237) with acetone

(D)電氣化學工業(股)製DENKA BLACK HS-100 (D) Electrochemical Industry (Stock) DENKA BLACK HS-100

(E-1)具有由氯鉑酸所衍生之四甲基二乙烯基二矽氧烷作為配位子之鉑觸媒(鉑原子量:1質量%) (E-1) Platinum catalyst having tetramethyldivinyldioxane derived from chloroplatinic acid as a ligand (platinum atomic weight: 1% by mass)

(E-2)將上述(E-1)與硬脂酸在質量比3/2下進行混合者 (E-2) mixing the above (E-1) with stearic acid at a mass ratio of 3/2

(F)硬脂酸 (F) stearic acid

(G)由BET法所進行之比表面積為200m2/g,且表面係經六甲基二矽氮烷加以處理的煙霧質二氧化矽 (G) a fumed cerium oxide having a specific surface area of 200 m 2 /g by the BET method and having a surface treated with hexamethyldioxane

(反應抑制劑)1-乙炔基-1-環己醇 (Reaction inhibitor) 1-ethynyl-1-cyclohexanol

將所得之矽酮橡膠組成物的導電率、黏度、搖變係數、形狀保持性、保存安定性之結果併記於表1、2中。另外,導電率、形狀保持性、保存安定性係以下述所示之方法進行。 The results of the electrical conductivity, viscosity, shaking coefficient, shape retention, and storage stability of the obtained fluorenone rubber composition are shown in Tables 1 and 2. Moreover, electrical conductivity, shape retention, and storage stability were performed by the method shown below.

〔導電率之測量〕 [Measurement of conductivity]

在1mm厚度的模具內,將矽酮橡膠組成物以150℃/1小時進行爐內硬化(Oven Curing),藉此而形成導電性矽酮橡膠薄片。 In the mold of 1 mm thickness, the fluorenone rubber composition was subjected to in-furnace hardening at 150 ° C / 1 hour, thereby forming a conductive fluorenone rubber sheet.

導電率之測量係使用KEITHLEY 237 High Voltage Source Measure Unit Conductivity is measured using KEITHLEY 237 High Voltage Source Measure Unit

(定電流電源) (constant current power)

KEITHLEY 2000 Multimeter(定電壓)來進行。 KEITHLEY 2000 Multimeter (constant voltage) is used.

〔形狀保持性〕 [shape retention]

針對形狀保持性,係將組成物載置於25mm×250mm(厚度0.5mm)之不鏽鋼(SUS)板,予以30度傾斜藉由150℃/1小時硬化時之組成物的流動性,而判斷出:◎(完全無變化)、○(不流動為少的傾向)、△(1~3mm流動)、×(超過3mm流動)。 For the shape retention, the composition was placed on a stainless steel (SUS) plate of 25 mm × 250 mm (thickness: 0.5 mm), and the fluidity of the composition at 150 ° C / 1 hour was determined by tilting at 30 degrees. : ◎ (no change at all), ○ (prone to no flow), △ (1 to 3 mm flow), × (more than 3 mm flow).

〔保存安定性〕 [save stability]

對於剛製造後及經在5℃下保存2個月的組成物,利用硬度計A型硬度計來測量出以150℃/1小時硬化時的硬度。 For the composition immediately after production and after storage at 5 ° C for 2 months, the hardness at 150 ° C / 1 hour was measured by a durometer type A durometer.

Claims (5)

一種加成硬化型導電性矽酮組成物,其特徵為含有:(A)以下述平均組成式(1)所表示之一分子中至少含有2個鍵結於矽原子的烯基之有機聚矽氧烷:100質量份、RaR’bSiO(4-a-b)/2 (1)(式中,R為烯基,R’為不具有脂肪族不飽和鍵的非取代或取代之碳數1~10的一價烴基,a、b為滿足0<a≦2、0<b<3、0<a+b≦3之數)(B)一分子中至少含有2個鍵結於矽原子的氫原子之有機氫聚矽氧烷:相對於(A)成分中之全矽原子鍵結烯基,(B)成分中之鍵結於矽原子的氫原子係成為0.5~5.0倍莫耳之量、(C)銀粉末或經銀鍍敷的微粉末粒子:100~1,500質量份、(D)導電性微粉末(其中,屏除銀、銅及包含此等之金屬):0.5~30質量份、(E)加成反應觸媒:觸媒量、(F)脂肪酸或者是脂肪酸衍生物及/或其金屬鹽:0.1~20質量份。 An addition-curable conductive fluorenone composition comprising: (A) an organic polyfluorene having at least two alkenyl groups bonded to a ruthenium atom in a molecule represented by the following average composition formula (1) Oxytomane: 100 parts by mass, R a R' b SiO (4-ab) / 2 (1) (wherein R is an alkenyl group, and R' is an unsubstituted or substituted carbon number having no aliphatic unsaturated bond a monovalent hydrocarbon group of 1 to 10, a and b satisfying 0 < a ≦ 2, 0 < b < 3, and 0 < a + b ≦ 3) (B) at least 2 bonded to a ruthenium atom in one molecule Organic hydrogen polyoxyalkylene of a hydrogen atom: the hydrogen atom bonded to the halogen atom in the component (B) is 0.5 to 5.0 times the molar ratio with respect to the all-oxide atom-bonded alkenyl group in the component (A). Amount, (C) silver powder or silver-plated fine powder particles: 100 to 1,500 parts by mass, (D) conductive fine powder (wherein, silver, copper and metals containing the same): 0.5 to 30 parts by mass (E) Addition reaction catalyst: amount of catalyst, (F) fatty acid or fatty acid derivative and/or metal salt thereof: 0.1 to 20 parts by mass. 如申請專利範圍第1項所記載之加成硬化型導電性矽酮組成物,其中(D)成分係為碳黑。 The addition-curable conductive fluorenone composition according to the first aspect of the invention, wherein the component (D) is carbon black. 如申請專利範圍第1項或第2項所記載之加成硬化型導電性矽酮組成物,其中由E型黏度計所得之於23℃時的搖變比(10rpm的黏度/20rpm的黏度)係為1.5以上。 The addition-curable conductive fluorenone composition according to the first or second aspect of the patent application, wherein the shake ratio at 23 ° C obtained by an E-type viscometer (viscosity at 10 rpm / viscosity at 20 rpm) It is 1.5 or more. 如申請專利範圍第1項所記載之加成硬化型導電性矽酮組成物,其中硬化物之導電率係為1.0×10-2Ω.cm以下。 The addition-curable conductive fluorenone composition according to the first aspect of the invention, wherein the conductivity of the cured product is 1.0×10 -2 Ω. Below cm. 一種組成物之製造方法,其特徵為:於製造如申請專利範圍第1項~第4項中任一項所記載之加成硬化型導電性矽酮組成物之際,將預先混合有(E)成分與(F)成分之物質與其他成分加以混合。 A method for producing a composition, which is prepared by mixing (E) a addition-curable conductive fluorenone composition according to any one of the first to fourth aspects of the invention. The component and the component (F) are mixed with other components.
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