TW201329561A - System for continuous production of liquid crystal display elements and method for continuous production of liquid crystal display elements - Google Patents

System for continuous production of liquid crystal display elements and method for continuous production of liquid crystal display elements Download PDF

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TW201329561A
TW201329561A TW101141186A TW101141186A TW201329561A TW 201329561 A TW201329561 A TW 201329561A TW 101141186 A TW101141186 A TW 101141186A TW 101141186 A TW101141186 A TW 101141186A TW 201329561 A TW201329561 A TW 201329561A
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Taiwan
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base portion
liquid crystal
optical film
film
crystal display
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TW101141186A
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Chinese (zh)
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Kazuya Hada
Satoru Koshio
Kazuo Kitada
Hiromichi Ohashi
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Nitto Denko Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20Cutting beds
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528Polarisers

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polarising Elements (AREA)
  • Liquid Crystal (AREA)
  • Details Of Cutting Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

This system for the continuous production of liquid crystal display elements is provided with a half cutting device, which, in an optical film laminate, leaves a carrier film and severs the optical film in the widthwise direction thereof to form an optical film sheet piece, and a paste-together device that pastes the sheet piece peeled from the carrier film to a liquid crystal panel, wherein the half cutting device has a blade and a pedestal facing the blade, and the pedestal has a structure resulting from layering a first pedestal section, which is proximal to the blade, and a second pedestal section, which is distal to the blade and has an elasticity that is higher than that of the first pedestal section.

Description

液晶顯示元件之連續製造系統及液晶顯示元件之連續製造方法 Continuous manufacturing system of liquid crystal display element and continuous manufacturing method of liquid crystal display element

本發明係關於一種於光學膜積層體內保留承載膜將光學膜沿其寬度方向切斷而形成光學膜之薄片並將自承載膜剝離之薄片貼合於液晶面板上之液晶顯示元件之連續製造系統及液晶顯示元件之連續製造方法。 The present invention relates to a continuous manufacturing system for a liquid crystal display element in which a carrier film is retained in an optical film laminate to cut an optical film in a width direction thereof to form a sheet of an optical film, and a sheet peeled from the carrier film is attached to a liquid crystal panel. And a continuous manufacturing method of a liquid crystal display element.

已知有一種液晶顯示元件之連續製造系統,其具備:半切裝置(切斷機構),其於具有厚度為10~50 μm之承載膜、及經由黏著層形成於該承載膜上且包含該黏著層之光學膜之光學膜積層體內,保留該承載膜將該光學膜沿其寬度方向切斷而形成該光學膜之薄片;以及貼合裝置,其將自上述承載膜剝離之上述薄片貼合於液晶面板上(專利文獻1)。 There is known a continuous manufacturing system of a liquid crystal display element comprising: a half-cutting device (cutting mechanism) having a carrier film having a thickness of 10 to 50 μm and being formed on the carrier film via an adhesive layer and containing the adhesive a film in which the optical film is cut in the optical film layer of the layer, the optical film is cut along the width direction thereof to form a sheet of the optical film, and a bonding device that bonds the sheet peeled from the carrier film to On a liquid crystal panel (Patent Document 1).

又,作為可進行穩定之半切之方法,已知有一種半切方法,其於基座中使用剛性較低之柔軟材料,從而將切刀側之基材薄片切斷,可使柔軟材料側之剝離薄片偏向柔軟材料側而不被切斷(專利文獻2)。 Further, as a method for performing stable half-cutting, there is known a half-cut method in which a soft material having a low rigidity is used in a susceptor to cut a base sheet on a cutter side to peel off a soft material side. The sheet is biased toward the soft material side without being cut (Patent Document 2).

先前技述文獻Previous technical literature 專利文獻Patent literature

專利文獻1:日本專利特開2005-37416號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-37416

專利文獻2:日本專利特開平7-292816號公報 Patent Document 2: Japanese Patent Laid-Open No. Hei 7-292816

然而,於專利文獻1中,對光學膜之薄片之切斷面,自 光學上之使用之特徵考慮會要求高品質之切斷面。例如,若於半切時切斷面之黏著層變形,則當貼合於液晶面板上時,於該變形部位會產生氣泡之滲入,於液晶顯示元件中變成點缺陷。從而,於包含黏著層之光學膜之情形時,不僅半切之穩定性,半切之品質(切斷面之品質)亦為重要。然而,於該文獻中,僅記載有用於切斷之切刀之例,對於穩定且高品質地進行半切之方法並未具體地談及。 However, in Patent Document 1, the cut surface of the sheet of the optical film is self-contained. The characteristics of optical use require high quality cut surfaces. For example, when the adhesive layer of the cut surface is deformed at the time of half-cutting, when it is bonded to the liquid crystal panel, infiltration of bubbles occurs at the deformed portion, and a dot defect occurs in the liquid crystal display element. Therefore, in the case of an optical film including an adhesive layer, not only the stability of the half cut but also the quality of the half cut (the quality of the cut surface) is also important. However, in this document, only an example of a cutter for cutting is described, and a method of performing half-cutting stably and with high quality has not been specifically mentioned.

又,於專利文獻2中,記載有藉由調整基座之硬度而實現穩定之半切。然而,於對剛性較低之光學膜積層體進行半切之情形時,僅藉由基座之硬度調整難以穩定且高品質地進行半切。即,若基座之硬度較低,則藉由刀具之壓入,光學膜積層體會局部地變形,產生糊劑缺欠或糊劑拖曳等。相反地若基座之硬度較高,則當刀具之壓入過多時,光學膜積層體無法偏向基座側,而導致承載膜之破斷,當刀具之壓入不足時,因光學膜之未切斷而導致糊劑缺欠或糊劑拖曳。進而,由於基座之硬度取決於其構成材料,故而只能取離散性之值,其最佳化較為困難。 Further, Patent Document 2 describes that a stable half cut is achieved by adjusting the hardness of the susceptor. However, in the case of half-cutting an optical film laminate having a low rigidity, it is difficult to perform half-cutting stably and with high quality only by hardness adjustment of the susceptor. That is, if the hardness of the susceptor is low, the optical film laminate is locally deformed by press-fitting of the cutter, resulting in a paste defect or a drag of the paste. On the contrary, if the hardness of the susceptor is high, when the tool is pushed too much, the optical film laminate cannot be biased toward the susceptor side, and the carrier film is broken. When the tool is insufficiently pressed, the optical film is not The cut causes the paste to be deflated or the paste to be dragged. Further, since the hardness of the susceptor depends on the constituent material, it is only possible to take the value of the dispersion, and it is difficult to optimize it.

本發明係鑒於上述情況而完成者,其目的在於提供一種可穩定且高品質地對光學膜積層體進行半切之液晶顯示元件之連續製造系統、液晶顯示元件之連續製造方法及半切裝置。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a continuous manufacturing system of a liquid crystal display element which can stably and efficiently perform half-cutting of an optical film laminate, a continuous manufacturing method of the liquid crystal display element, and a half-cut apparatus.

為解決上述課題,反覆銳意研究之結果完成了以下之本發明。 In order to solve the above problems, the following invention has been completed as a result of intensive research.

本發明係一種液晶顯示元件之連續製造系統,其具備如下2個裝置:半切裝置,其於具有承載膜、及經由黏著層形成於該承載膜上且包含該黏著層之光學膜之光學膜積層體內,保留該承載膜將該光學膜沿其寬度方向切斷而形成該光學膜之薄片;以及貼合裝置,其將自上述承載膜剝離之上述薄片貼合於液晶面板上;上述半切裝置具有刀具、及與該刀具對向之基座;上述基座具有由距上述刀具較近之第1基座部、及距上述刀具較遠且具有高於該第1基座部之彈性模數的彈性模數之第2基座部積層而成之構造。 The present invention relates to a continuous manufacturing system for a liquid crystal display device, comprising two devices: a half-cutting device, which is provided with an optical film layer having a carrier film and an optical film formed on the carrier film via an adhesive layer and containing the adhesive layer. a sheet in which the optical film is cut along the width direction thereof to form a sheet of the optical film, and a bonding device that bonds the sheet peeled from the carrier film to the liquid crystal panel; the half-cutting device has a tool and a base opposite the tool; the base having a first base portion that is closer to the tool and a tool that is farther from the tool and has a higher modulus than the first base portion The structure in which the second base portion of the elastic modulus is laminated.

根據該構成,藉由使彈性模數較低之層(第1基座部)為刀具側之最表面,可不對切刀之切入深度要求高精度而穩定地進行半切。又,藉由使第2層為彈性模數較高之層(第2基座部),可抑制糊劑缺欠或糊劑拖曳等不良狀況,從而可高品質地進行半切。即,藉由彈性模數不同之第1基座部與第2基座部之協動作用,可適當地調整切斷時之光學膜積層體之變形程度。 According to this configuration, by making the layer (the first base portion) having a low modulus of elasticity the outermost surface of the tool side, it is possible to perform the half-cut stably without requiring a high precision for the cutting depth of the cutter. In addition, by making the second layer a layer having a high modulus of elasticity (second pedestal portion), it is possible to suppress a defect such as a paste defect or a drag of the paste, and it is possible to perform half-cutting with high quality. In other words, the degree of deformation of the optical film laminate at the time of cutting can be appropriately adjusted by the cooperation of the first base portion and the second base portion having different elastic modulus.

以下對體現本發明所產生之效果之機制進行說明。於圖4A、4B、5中,表示使用彈性模數不同之基座之情形時之半切之概念。於圖4A、圖4B中,當基座212之彈性模數較高(硬度較高)之情形時,刀201之設置精度或刀本身之形狀精度(例如於圓刀之情形時係指圓度)會直接成為刀201相對於膜之壓入量之變化,易於產生因切入深度之過多而導致之承載膜12之破斷(圖4A)、或因切入不足而導致之光學膜 13之未切斷(圖4B)等。又,於圖5中,當基座211之彈性模數較低(硬度較低較軟)之情形時,藉由與刀201之按壓相應之基座211之變形,光學膜積層體10自身亦會於切斷部位局部且過度地變形。如此,若於光學膜積層體10局部且過度地變形之狀態下進行切斷,則會對黏著劑層131造成不必要之應力,或使切斷部之穩定性喪失,而產生糊劑缺欠或糊劑拖曳等切斷面之糊劑不良。另一方面,於如圖1所示,基座21為彈性模數不同之2層構造,且與承載膜相接之最表面之第1基座部211之彈性模數低於第2層(下層)之第2基座部212之彈性模數之情形時,基座21受到彈性模數較低之第1基座部211之影響而具有變形性,且亦受到彈性模數較高之第2基座部212之影響而不會過度變形。即,基座21對應於刀201之按壓與光學膜積層體10(承載膜12)一併變形,並且為防止光學膜積層體10之局部之過度變形亦賦予必要之反作用力。藉此,可穩定地對光學膜13進行半切,且可形成不會產生糊劑缺欠或糊劑拖曳之乾淨之切斷面。如以上所示,於單層基座之情形時,難以穩定且高品質地對光學膜積層體進行半切,但藉由如本發明般引入積層化之概念,可使其變得比較容易。 The mechanism for embodying the effects produced by the present invention will be described below. In Figs. 4A, 4B, and 5, the concept of half cut in the case where a base having a different modulus of elasticity is used is shown. In FIGS. 4A and 4B, when the modulus of elasticity of the susceptor 212 is high (higher hardness), the setting accuracy of the knives 201 or the shape accuracy of the knives themselves (for example, in the case of a circular knives refers to roundness). ) directly becomes a change in the amount of pressing of the blade 201 with respect to the film, and is liable to cause breakage of the carrier film 12 due to excessive cutting depth (Fig. 4A), or an optical film due to insufficient cutting. 13 is not cut (Fig. 4B) and the like. Further, in FIG. 5, when the modulus of elasticity of the susceptor 211 is low (the hardness is relatively soft), the optical film laminate 10 itself is also deformed by the deformation of the susceptor 211 corresponding to the pressing of the blade 201. It will be partially and excessively deformed at the cutting site. When the optical film laminate 10 is partially and excessively deformed, the unnecessary stress is applied to the adhesive layer 131, or the stability of the cut portion is lost, and a paste defect or The paste on the cut surface such as the drag is poor. On the other hand, as shown in FIG. 1, the susceptor 21 has a two-layer structure in which the modulus of elasticity is different, and the first base portion 211 on the outermost surface that is in contact with the carrier film has a lower modulus of elasticity than the second layer ( In the case of the elastic modulus of the second base portion 212 of the lower layer), the susceptor 21 is deformed by the first base portion 211 having a low modulus of elasticity, and is also subjected to a higher modulus of elasticity. 2 The base portion 212 is affected without excessive deformation. That is, the base 21 is deformed together with the optical film laminate 10 (the carrier film 12) in response to the pressing of the blade 201, and also provides a necessary reaction force for preventing excessive deformation of the portion of the optical film laminate 10. Thereby, the optical film 13 can be stably cut in half, and a clean cut surface which does not cause a paste defect or a drag of the paste can be formed. As described above, in the case of a single-layer susceptor, it is difficult to perform half-cutting of the optical film laminate in a stable and high-quality manner, but it is easier to introduce the concept of stratification as in the present invention.

作為上述發明之一實施形態,上述第1基座部之厚度為0.1 mm~5.0 mm。 According to an embodiment of the invention, the first base portion has a thickness of 0.1 mm to 5.0 mm.

作為上述發明之一實施形態,上述第1基座部之彈性模數為0.2 GPa~60 GPa。上述第2基座部之彈性模數為130 GPa以上。 According to an embodiment of the invention, the first base portion has an elastic modulus of 0.2 GPa to 60 GPa. The second base portion has an elastic modulus of 130 GPa or more.

作為上述發明之一實施形態,上述第1基座部之彈性模數與上述第2基座部之彈性模數之差較佳為100 GPa以上。藉此,進一步發揮上述作用效果。 In an embodiment of the invention, the difference between the elastic modulus of the first base portion and the elastic modulus of the second base portion is preferably 100 GPa or more. Thereby, the above effects are further exerted.

作為上述發明之一實施形態,上述刀具為圓刀。圓刀由於難以加工為正圓,故而必然於切入深度上存在不均。然而,根據本發明,藉由將基座設定為積層構造,可不對刀具之切入深度要求高精度,即便為圓刀亦能進行穩定且高品質之半切。 According to an embodiment of the invention, the cutter is a round knife. Since the round knife is difficult to machine into a perfect circle, it is inevitably uneven in the depth of cut. However, according to the present invention, by setting the susceptor to a laminated structure, it is possible to achieve high precision without cutting the depth of the cutting tool, and it is possible to perform stable and high-quality half-cutting even with a round knife.

作為上述發明之一實施形態,上述承載膜之厚度為20 μm~50 μm。 According to an embodiment of the invention, the carrier film has a thickness of 20 μm to 50 μm.

又,另一本發明係一種液晶顯示元件之連續製造方法,其包括如下2個步驟:半切步驟,其於具有承載膜、及經由黏著層形成於該承載膜上且包含該黏著層之光學膜之光學膜積層體內,保留該承載膜將該光學膜沿其寬度方向切斷而形成該光學膜之薄片;以及貼合步驟,其將自上述承載膜剝離之上述薄片貼合於液晶面板上;上述半切步驟係如下所述之步驟:於具有由第1基座部及具有高於該第1基座部之彈性模數的彈性模數之第2基座部積層而成之構造之基座之該第1基座部上,使上述承載膜為該第1基座部側而配置上述光學膜積層體,保留該承載膜將上述光學膜沿其寬度方向切斷。 Further, another invention is a continuous manufacturing method of a liquid crystal display element, which comprises the following two steps: a half-cutting step on an optical film having a carrier film and formed on the carrier film via an adhesive layer and comprising the adhesive layer In the optical film laminate, the carrier film is retained to cut the optical film in the width direction thereof to form a sheet of the optical film; and a bonding step of bonding the sheet peeled from the carrier film to the liquid crystal panel; The half-cutting step is a step of arranging a structure having a first base portion and a second base portion having an elastic modulus higher than an elastic modulus of the first base portion. In the first base portion, the optical film laminate is placed on the first base portion side of the carrier film, and the carrier film is left to cut the optical film in the width direction.

根據該構成,藉由使彈性模數較低之層(第1基座部)為刀具側之最表面,可不對切刀之切入深度要求高精度而穩定地進行半切。又,藉由使第2層為彈性模數較高之層(第 2基座部),可抑制糊劑缺欠或糊劑拖曳等不良狀況,從而可高品質地進行半切。即,藉由彈性模數不同之第1基座部與第2基座部之協動作用,可適當地調整切斷時之光學膜積層體之變形程度。 According to this configuration, by making the layer (the first base portion) having a low modulus of elasticity the outermost surface of the tool side, it is possible to perform the half-cut stably without requiring a high precision for the cutting depth of the cutter. Moreover, by making the second layer a layer having a higher modulus of elasticity (No. In the 2 base portion, it is possible to suppress a defect such as a defect in the paste or a drag of the paste, and the half cut can be performed with high quality. In other words, the degree of deformation of the optical film laminate at the time of cutting can be appropriately adjusted by the cooperation of the first base portion and the second base portion having different elastic modulus.

作為上述發明之一實施形態,於上述半切步驟中,用以切斷上述光學膜之刀具為圓刀。藉由將基座設定為積層構造,可不對刀具之切入深度要求高精度,即便為圓刀亦能進行穩定且高品質之半切。 According to an embodiment of the invention, in the half-cutting step, the cutter for cutting the optical film is a round knife. By setting the susceptor to a laminated structure, high precision can be achieved without cutting the depth of the tool, and even a round knife can perform stable and high-quality half-cutting.

又,另一本發明係一種半切裝置,其具有刀具、及與該刀具對向之基座,且上述基座具有由距上述刀具較近之第1基座部、及距上述刀具較遠且具有高於該第1基座部之彈性模數的彈性模數之第2基座部積層而成之構造。 Still another aspect of the invention is a half-cutting device having a tool and a base opposite the tool, and the base has a first base portion that is closer to the tool and is farther from the tool A structure in which a second base portion having an elastic modulus higher than the elastic modulus of the first base portion is laminated.

藉由該構成,於保留承載膜將光學膜沿其寬度方向切斷而形成光學膜之薄片之情形時,藉由使彈性模數較低之層(第1基座部)為刀具側之最表面,可不對切刀之切入深度要求高精度而穩定地進行半切。又,藉由使第2層為彈性模數較高之層(第2基座部),可抑制糊劑缺欠或糊劑拖曳等不良狀況,從而可高品質地進行半切。 According to this configuration, when the optical film is cut along the width direction of the carrier film to form a sheet of the optical film, the layer having the lower modulus of elasticity (the first base portion) is the most on the tool side. The surface can be semi-cut with high precision and stability without cutting the depth of the cutter. In addition, by making the second layer a layer having a high modulus of elasticity (second pedestal portion), it is possible to suppress a defect such as a paste defect or a drag of the paste, and it is possible to perform half-cutting with high quality.

作為上述發明之一實施形態,上述刀具為圓刀。藉由將基座設定為積層構造,可不對刀具之切入深度要求高精度,即便為圓刀亦能進行穩定且高品質之半切。 According to an embodiment of the invention, the cutter is a round knife. By setting the susceptor to a laminated structure, high precision can be achieved without cutting the depth of the tool, and even a round knife can perform stable and high-quality half-cutting.

以下,一面參照圖1、2,一面對液晶顯示元件之連續製 造系統及連續製造方法進而具體地進行說明,但本發明並不限定於本實施形態之態樣。 Hereinafter, referring to FIGS. 1 and 2, a continuous system of liquid crystal display elements is faced. The manufacturing system and the continuous manufacturing method will be specifically described, but the present invention is not limited to the embodiment.

本實施形態之液晶顯示元件之連續製造系統係具備如下2個裝置之液晶顯示元件之連續製造系統:半切裝置20,其於具有承載膜12、及經由黏著層132形成於該承載膜12上且包含該黏著層132之偏光膜(光學膜)13之光學膜積層體10內,保留該承載膜12將該偏光膜13沿其寬度方向切斷而形成該偏光膜13之薄片135;以及貼合裝置103,其將自上述承載膜12剝離之上述薄片135貼合於液晶面板4上;且上述半切裝置20具有刀具201、及與該刀具201對向之基座21,上述基座21具有由距上述刀具201較近之第1基座部211、及距上述刀具201較遠且具有高於該第1基座部之彈性模數的彈性模數之第2基座部212積層而成之構造。 The continuous manufacturing system of the liquid crystal display device of the present embodiment includes a continuous manufacturing system of liquid crystal display elements of two devices: a half-cut device 20 having a carrier film 12 and formed on the carrier film 12 via an adhesive layer 132. In the optical film laminate 10 including the polarizing film (optical film) 13 of the adhesive layer 132, the carrier film 12 is retained, and the polarizing film 13 is cut along the width direction thereof to form a sheet 135 of the polarizing film 13; The device 103 is configured to adhere the sheet 135 peeled from the carrier film 12 to the liquid crystal panel 4; and the half-cutting device 20 has a cutter 201 and a base 21 opposed to the cutter 201, and the base 21 has The first base portion 211 that is closer to the cutter 201 and the second base portion 212 that is farther from the cutter 201 and has an elastic modulus higher than the elastic modulus of the first base portion are laminated. structure.

一般而言,偏光膜13例如係由偏光片膜(厚度為10~30 μm左右)、及藉由接著劑或黏著劑形成於偏光片膜之單面或兩面上之偏光片保護膜(厚度為20~80 μm左右)所形成。再者,光學膜並不限定於必需偏光片膜之偏光膜,亦可為具有其他光學特性之膜(例如:相位差膜、視角補償膜、亮度提昇膜等),也可為複數種膜積層而成之積層構造。於本實施形態中,偏光膜13亦可包含表面保護膜、相位差膜、亮度提昇膜等。 In general, the polarizing film 13 is, for example, a polarizer film (having a thickness of about 10 to 30 μm), and a polarizer protective film formed on one or both sides of the polarizer film by an adhesive or an adhesive (thickness is Formed around 20~80 μm). Further, the optical film is not limited to a polarizing film which is required to have a polarizing film, and may be a film having other optical characteristics (for example, a retardation film, a viewing angle compensation film, a brightness enhancement film, etc.), or may be a plurality of film layers. It is a laminated structure. In the present embodiment, the polarizing film 13 may include a surface protective film, a retardation film, a brightness enhancement film, and the like.

構成黏著層132之黏著劑並不特別限制,可列舉例如:丙烯酸系黏著劑、聚矽氧系黏著劑、胺基甲酸酯系黏著劑等。黏著層132之厚度例如為10~40 μm。 The adhesive constituting the adhesive layer 132 is not particularly limited, and examples thereof include an acrylic adhesive, a polyoxygen adhesive, and a urethane adhesive. The thickness of the adhesive layer 132 is, for example, 10 to 40 μm.

承載膜可使用例如塑膠膜(例如:聚對苯二甲酸乙二酯系膜、聚烯烴系膜等)等先前公知之膜。又,視需要可使用由聚矽氧系或長鏈烷基系、氟系或硫化鉬等適當之剝離劑進行塗佈處理而成之膜等以先前為基準之適當之膜。承載膜12之厚度較佳為20 μm~50 μm。 As the carrier film, a conventionally known film such as a plastic film (for example, a polyethylene terephthalate film, a polyolefin film, or the like) can be used. Further, a film obtained by coating a film obtained by a suitable release agent such as a polyfluorinated or a long-chain alkyl group, a fluorine-based or a molybdenum sulfide, or the like may be used as a suitable film based on the prior art. The thickness of the carrier film 12 is preferably from 20 μm to 50 μm.

光學膜積層體之厚度可列舉例如50 μm~400 μm之範圍。光學膜積層體之每1 mm寬度之剛性例如為0.1~50 N.mm2。再者,當將彈性模數設為E(MPa)、寬度設為b(mm)、厚度設為h(mm)時,光學膜積層體之剛性(N.mm2)可由E×b×h3/12算出。 The thickness of the optical film laminate may be, for example, in the range of 50 μm to 400 μm. The rigidity of the optical film laminate body per 1 mm width is, for example, 0.1 to 50 N. Mm 2 . Further, when the elastic modulus is E (MPa), the width is b (mm), and the thickness is h (mm), the rigidity (N.mm 2 ) of the optical film laminate can be E × b × h 3 / 12 calculated.

(連續輥) (continuous roller)

連續輥1係將光學膜積層體10捲繞成捲筒狀而形成者,其中光學膜積層體10包含承載膜12、及經由黏著層132形成於承載膜12上且具有平行於進給方向(長邊方向)之吸收軸之偏光膜13(包含黏著層132)。於圖2(b)中,表示光學膜積層體10之積層構造之剖面之一例。 The continuous roll 1 is formed by winding the optical film laminate 10 into a roll shape, wherein the optical film laminate 10 includes a carrier film 12, and is formed on the carrier film 12 via the adhesive layer 132 and has a direction parallel to the feed direction ( The polarizing film 13 (including the adhesive layer 132) of the absorption axis of the longitudinal direction). An example of a cross section of the laminated structure of the optical film laminate 10 is shown in Fig. 2(b).

(液晶顯示元件) (liquid crystal display element)

液晶顯示元件係於液晶面板之單面或兩面上至少形成有偏光膜之薄片者,視需要會裝入驅動電路。液晶面板可使用例如垂直定向(VA,Vertical Alignment)型、面內切換(IPS,In-Plane Switching)型等任意類型者。圖2所示之液晶面板4係於對向配置之一對基板間密封有液晶層之構成。 The liquid crystal display element is formed by forming at least a thin film of a polarizing film on one surface or both surfaces of the liquid crystal panel, and is incorporated in a driving circuit as needed. As the liquid crystal panel, any type such as a vertical alignment (VA) type or an in-plane switching (IPS) type can be used. The liquid crystal panel 4 shown in FIG. 2 is configured by sealing a liquid crystal layer between one of the opposing substrates.

液晶顯示元件之連續製造系統具備薄片積層裝置100, 該薄片積層裝置100具有膜搬送部101、液晶面板搬送部102、貼合裝置103(貼附輥50a、驅動輥50b)、及液晶面板搬送部104。薄片積層裝置100係於液晶面板4之一面上貼附偏光膜之薄片135而進行積層。液晶顯示元件之連續製造系統亦可進而具備另一薄片積層裝置(未圖示),藉此於液晶面板之另一面上貼附偏光膜之薄片而進行積層。另一薄片積層裝置亦可具有與薄片積層裝置100相同之構成。 A continuous manufacturing system of liquid crystal display elements is provided with a sheet stacking device 100, The sheet stacking apparatus 100 includes a film transport unit 101, a liquid crystal panel transport unit 102, a bonding apparatus 103 (attach roller 50a, driving roller 50b), and a liquid crystal panel transport unit 104. The sheet laminating apparatus 100 is laminated on a sheet 135 on which one surface of the liquid crystal panel 4 is attached with a polarizing film. The continuous manufacturing system of the liquid crystal display element may further include another thin film laminating device (not shown), and a thin film of the polarizing film may be attached to the other surface of the liquid crystal panel to laminate. The other sheet stacking device may have the same configuration as the sheet stacking device 100.

膜搬送部101係一面自連續輥1捲出光學膜積層體10,一面對包含黏著劑132之長條之偏光膜13進行切斷加工而形成偏光膜之薄片135,並將薄片135自承載膜12剝離,供給至貼合裝置103。因此,膜搬送裝置101具有捲出部101a、複數個搬送部101b、半切裝置20、跳動輥30、剝離部40、捲取部60。 The film transporting unit 101 winds up the optical film laminate 10 from the continuous roll 1, and faces the long polarizing film 13 including the adhesive 132 to form a polarizing film 135, and the wafer 135 is self-supporting. The film 12 is peeled off and supplied to the bonding apparatus 103. Therefore, the film conveying device 101 has the winding portion 101a, the plurality of conveying portions 101b, the half cutting device 20, the dancer roller 30, the peeling portion 40, and the winding portion 60.

於捲出部101a中,設置有連續輥1,自連續輥1捲出光學膜積層體10。 In the unwinding portion 101a, a continuous roll 1 is provided, and the optical film laminate 10 is taken up from the continuous roll 1.

複數個搬送部101b係以對光學膜積層體10施予張力而搬送該光學膜積層體10之方式設置。 The plurality of conveying portions 101b are provided to apply the tension to the optical film laminate 10 to transport the optical film laminate 10.

半切裝置20具有刀具201、及與刀具201對向之基座21。於基座21上自承載膜12側固定光學膜積層體10,將偏光膜13沿其寬度方向切斷,而於承載膜12上形成偏光膜之薄片135(包含黏著層)。 The half-cutting device 20 has a cutter 201 and a base 21 opposed to the cutter 201. The optical film laminate 10 is fixed to the susceptor 21 from the side of the carrier film 12, and the polarizing film 13 is cut along the width direction thereof, and a sheet 135 (including an adhesive layer) of the polarizing film is formed on the carrier film 12.

作為刀具20,可列舉例如湯姆遜(Thomson)刀、切割刀、圓刀(包括固定式、自轉式)等,較佳為圓刀。圓刀係切斷面不斷移動,故而較於固定位置進行切斷之切割刀而 言刀之壽命較長、更換頻度較少。又,為避免低彈性層表面(基座最表面)之壓痕,較切割刀較佳使用圓刀。其不易殘留痕跡,適於切斷之高速連續處理(進而適於液晶顯示元件之高速連續生產)。 Examples of the cutter 20 include a Thomson knife, a cutter, a round knife (including a fixed type, a self-rotating type), and the like, and a round knife is preferable. The cutting edge of the circular knife is constantly moving, so the cutting blade is cut compared to the fixed position. The life of the knife is longer and the frequency of replacement is less. Moreover, in order to avoid the indentation of the surface of the low elastic layer (the outermost surface of the base), a round knife is preferably used as the cutting blade. It is not easy to leave traces, and is suitable for high-speed continuous processing of cutting (and further suitable for high-speed continuous production of liquid crystal display elements).

圓刀之刀徑及圓度係根據光學膜積層體之厚度等而適當調整,通常,刀徑為30 mm~120 mm,圓度為50 μm以下。再者,於刀具為切割刀或圓刀之情形時,半切裝置20通常進而具備使刀具於光學膜積層體10之寬度方向上滑動之滑動機構。 The tool radius and the roundness of the round knife are appropriately adjusted depending on the thickness of the optical film laminate, and the tool radius is usually 30 mm to 120 mm, and the roundness is 50 μm or less. Further, when the cutter is a cutter or a circular cutter, the half-cutting device 20 usually further includes a slide mechanism that slides the cutter in the width direction of the optical film laminate 10 .

(基座) (base)

基座21係低彈性之第1基座部211、及較第1基座部211高彈性之第2基座部212之2層構造。再者,第1基座部211及第2基座部212亦可分別為單層構造,也可為積層構造。第1基座部211之厚度例如為0.1 mm~5.0 mm,較佳為0.2 mm~3.0 mm,更佳為0.3 mm~1.0 mm。若厚度未達0.1 mm,則有第1基座部211不起作用而產生承載膜12之破斷或偏光膜13之未切斷之虞。若厚度超過5.0 mm,則有第2基座部212不起作用(無法獲得適度之反作用力)而因切斷時之光學膜積層體10之局部且過度之變形產生糊劑缺欠、糊劑拖曳之虞。又,第1基座部211(於積層構造之情形時,為構成積層構造之所有層)之彈性模數較佳為0.2 GPa~60 GPa,更佳為1.0 GPa~50 GPa。若彈性模數未達0.2 GPa,則有因其過軟而產生糊劑缺欠或糊劑殘餘之虞。若彈性模數超過60 GPa,則有因其過硬而產生偏光膜13之未切斷或 承載膜12之破斷之虞。作為低彈性之第1基座部211之材料,可列舉例如鋁、腈橡膠、聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚乙酸乙烯酯、鐵氟龍(註冊商標)、ABS(Acrylonitrile-Butadiene-Styrene,丙烯腈-丁二烯-苯乙烯)樹脂、丙烯酸系樹脂等。 The susceptor 21 has a two-layer structure of a first base portion 211 having low elasticity and a second base portion 212 having higher elasticity than the first base portion 211. Further, the first base portion 211 and the second base portion 212 may each have a single-layer structure or a laminated structure. The thickness of the first base portion 211 is, for example, 0.1 mm to 5.0 mm, preferably 0.2 mm to 3.0 mm, more preferably 0.3 mm to 1.0 mm. When the thickness is less than 0.1 mm, the first base portion 211 does not function, and the carrier film 12 is broken or the polarizing film 13 is not cut. When the thickness exceeds 5.0 mm, the second base portion 212 does not function (a moderate reaction force cannot be obtained), and a part of the optical film laminate 10 at the time of cutting and excessive deformation causes a paste defect and a paste drag. After that. Further, the first base portion 211 (in the case of a laminated structure, all the layers constituting the laminated structure) preferably have an elastic modulus of 0.2 GPa to 60 GPa, more preferably 1.0 GPa to 50 GPa. If the modulus of elasticity is less than 0.2 GPa, there is a tendency for the paste to be absent or the residue of the paste to be too soft. If the modulus of elasticity exceeds 60 GPa, the polarizing film 13 is not cut due to its excessive hardness or The breakage of the carrier film 12 is achieved. Examples of the material of the first base portion 211 having low elasticity include aluminum, nitrile rubber, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, Teflon (registered trademark), and ABS (for example). Acrylonitrile-Butadiene-Styrene, acrylonitrile-butadiene-styrene resin, acrylic resin, and the like.

較第1基座部211高彈性之第2基座部212(於積層構造之情形時,為構成積層構造之所有層)之彈性模數較佳為130 GPa以上,更佳為150 GPa以上。若彈性模數未達130 GPa,則有產生糊劑缺欠或糊劑殘餘之虞。作為高彈性之第2基座部212之材料,可列舉例如不鏽鋼等鋼鐵等。 The second base portion 212 having a higher elasticity than the first base portion 211 (in the case of a laminated structure, all the layers constituting the laminated structure) preferably have an elastic modulus of 130 GPa or more, and more preferably 150 GPa or more. If the modulus of elasticity is less than 130 GPa, there is a tendency to cause a defect in the paste or a residue of the paste. The material of the second base portion 212 which is highly elastic is, for example, steel such as stainless steel.

第1基座部211之彈性模數與第2基座部212之彈性模數之差較佳為100 GPa以上,更佳為150 GPa以上。 The difference between the modulus of elasticity of the first base portion 211 and the modulus of elasticity of the second base portion 212 is preferably 100 GPa or more, and more preferably 150 GPa or more.

第1基座部211與第2基座部212之積層方法並不特別限制,可列舉例如融合、接著材料、黏著劑、膠帶固定等。 The method of laminating the first base portion 211 and the second base portion 212 is not particularly limited, and examples thereof include fusion, a bonding material, an adhesive, and tape fixing.

於圖3中,表示半切裝置20之一例。半切裝置20具有基座21與刀具202。基座21係由側面支持部214支持其兩端部,遠離裝置座架215而設置。基座21具有第1基座部211及第2基座部212。第1基座部211藉由膠帶213相對於第2基座部212而貼附。而且,夾具23、24於原位置(未圖示)待機。於切斷時,如圖3所示,夾具23、24自原位置於圖3中向左移動,相對於第1基座部211之面211a按壓光學膜積層體10。於該狀態下,一面使正在原位置(未圖示)待機之圓刀202沿箭頭A之方向移動一面對光學膜積層體10進行半切(不切斷承載膜12而是將其保留,切斷偏光膜13)。繼而, 夾具23、24於圖3中移動至右側(回歸至原位置),停止向第1基座部211之面211a按壓光學膜積層體10。圓刀202亦回歸至原位置為下一個半切處理而待機。然後,使光學膜積層體10移動特定距離,執行下一個半切處理。 In Fig. 3, an example of the half cutting device 20 is shown. The half cutting device 20 has a base 21 and a cutter 202. The base 21 is supported by the side support portions 214 at both ends thereof, and is provided away from the device mount 215. The susceptor 21 has a first base portion 211 and a second base portion 212. The first base portion 211 is attached to the second base portion 212 by the tape 213 . Further, the jigs 23 and 24 stand by at the home position (not shown). At the time of cutting, as shown in FIG. 3, the jigs 23 and 24 are moved to the left from the home position in FIG. 3, and the optical film laminate 10 is pressed against the surface 211a of the first base portion 211. In this state, the circular knife 202 waiting in the home position (not shown) is moved in the direction of the arrow A to perform half-cutting on the optical film laminate 10 (the carrier film 12 is not cut but retained, and cut Broken polarizing film 13). Then, The jigs 23 and 24 are moved to the right side (return to the original position) in FIG. 3, and the pressing of the optical film laminate 10 to the surface 211a of the first base portion 211 is stopped. The round knife 202 also returns to the original position for standby in the next half-cut process. Then, the optical film laminate 10 is moved by a specific distance, and the next half-cut process is performed.

跳動輥30具有保持承載膜12之張力之功能。 The dancer roller 30 has a function of maintaining the tension of the carrier film 12.

剝離部40於其前端部使承載膜12成為內側而折返,將偏光膜之薄片135自承載膜12剝離。於本實施形態中,作為剝離部40,在前端部中使用尖銳之刀刃部,但並不限定於此。 The peeling portion 40 is folded back at the front end portion of the carrier film 12, and the sheet 135 of the polarizing film is peeled off from the carrier film 12. In the present embodiment, a sharp blade portion is used as the peeling portion 40 in the distal end portion, but the present invention is not limited thereto.

捲取部60捲取已將偏光膜之薄片135剝離之承載膜12。 The winding unit 60 winds up the carrier film 12 from which the sheet 135 of the polarizing film has been peeled off.

貼合裝置102自藉由搬送裝置80而搬送之液晶面板4之上側,經由黏著層132貼附已藉由剝離部40將承載膜12剝離之薄片135。於本實施形態中,貼合裝置102包括貼附輥50a、驅動輥50b。 The bonding apparatus 102 attaches the sheet 135 which has peeled the carrier film 12 by the peeling part 40 via the adhesive layer 132 from the upper side of the liquid-crystal panel 4 conveyed by the conveyance apparatus 80. In the present embodiment, the bonding apparatus 102 includes an attaching roller 50a and a driving roller 50b.

搬送裝置80係搬送液晶面板4、於液晶面板4之單面或兩面上貼附有偏光膜之薄片之液晶顯示元件Y之一系列搬送裝置。該搬送裝置80例如係具有搬送輥81、吸附板等而構成。 The transport device 80 is a one-series transport device that transports the liquid crystal panel 4 to the liquid crystal display element Y on which a thin film of a polarizing film is attached to one surface or both surfaces of the liquid crystal panel 4. The conveying device 80 is configured by, for example, a conveying roller 81, an adsorption plate, and the like.

為於液晶面板4之另一面上貼附其他偏光膜之薄片,可使用上述所說明之薄片積層裝置100。 In order to attach a sheet of another polarizing film to the other surface of the liquid crystal panel 4, the sheet laminating apparatus 100 described above can be used.

(液晶顯示元件之連續製造方法) (Continuous manufacturing method of liquid crystal display element)

液晶顯示元件之連續製造方法包括如下2個步驟:半切步驟,其於具有承載膜12、及經由黏著層132形成於該承載膜12上且包含該黏著層132之偏光膜13之光學膜積層體 10內,保留該承載膜12將該偏光膜13沿其寬度方向切斷而形成該偏光膜13之薄片135;以及貼合步驟,其將自上述承載膜12剝離之上述薄片135貼合於液晶面板4上。上述半切步驟係如下所述之步驟:於具有由第1基座部211及具有高於該第1基座部211之彈性模數的彈性模數之第2基座部212積層而成之構造之基座21之該第1基座部211上,使上述承載膜12為該第1基座部211側而配置上述光學膜積層體10,保留該承載膜12將上述光學膜13沿其寬度方向切斷。 The continuous manufacturing method of the liquid crystal display element includes the following two steps: a half-cutting step on the optical film laminate having the carrier film 12 and the polarizing film 13 formed on the carrier film 12 via the adhesive layer 132 and including the adhesive layer 132. 10, the carrier film 12 is left to cut the polarizing film 13 in the width direction thereof to form the sheet 135 of the polarizing film 13, and a bonding step of bonding the sheet 135 peeled from the carrier film 12 to the liquid crystal On panel 4. The half-cutting step is a step of laminating a second base portion 212 having a first base portion 211 and an elastic modulus higher than the elastic modulus of the first base portion 211. The optical film laminate 10 is disposed on the first base portion 211 of the susceptor 21 on the first base portion 211 side of the carrier film 12, and the carrier film 12 is retained to extend the optical film 13 along the width thereof. The direction is cut off.

(另一實施形態) (Another embodiment)

於本實施形態中,自液晶面板之上側貼附有偏光膜之薄片135,但並不限制於此,亦可自液晶面板之下側貼附薄片135。 In the present embodiment, the sheet 135 of the polarizing film is attached to the upper side of the liquid crystal panel. However, the sheet 135 is not limited thereto, and the sheet 135 may be attached from the lower side of the liquid crystal panel.

又,於本實施形態中,以特定間隔將自連續輥捲出之長條之偏光膜切斷,但本發明並不特別限制於該構成。例如,亦可對自連續輥捲出之長條之光學膜積層體進行缺陷檢查,以根據該檢查結果而避開缺陷之方式進行切斷(所謂的跳躍切割)。又,於在長條之偏光膜上預先標示有表示缺陷位置之標記之情形時,亦可讀取該標記,以根據該標記而避開缺陷之方式進行切斷。 Further, in the present embodiment, the long polarizing film wound from the continuous roll is cut at a predetermined interval, but the present invention is not particularly limited to this configuration. For example, it is also possible to perform defect inspection on the long optical film laminate wound from the continuous roll, and perform cutting (so-called jump cutting) so as to avoid the defect based on the result of the inspection. Further, when a mark indicating a defect position is previously marked on the long polarizing film, the mark may be read to be cut so as to avoid the defect according to the mark.

又,於本實施形態中,長條之偏光膜具有平行於長邊方向之吸收軸,但長條之偏光膜之吸收軸方向並不限定於此。例如,亦可為長條之偏光膜13具有平行於其短邊方向(寬度方向)之吸收軸而另一長條之偏光膜具有平行於其長邊方向之吸收軸。 Further, in the present embodiment, the long polarizing film has an absorption axis parallel to the longitudinal direction, but the absorption axis direction of the long polarizing film is not limited thereto. For example, the long polarizing film 13 may have an absorption axis parallel to the short side direction (width direction) and the other long polarizing film may have an absorption axis parallel to the longitudinal direction thereof.

實施例Example

實施例使用圖2及圖3之裝置構成。對利用半切裝置20將具有長條之偏光膜13、及承載膜12之光學膜積層體10半切時之破斷產生之有無、及半切之品質(糊劑缺欠、糊劑拖曳)進行評價。使用VEGQ 1784CUAG150(寬度為400 mm,每1 mm寬度之剛性為8.5 N.mm2,厚度為273 μm)作為長條之光學膜積層體10。該長條之光學膜積層體10具有包含黏著劑(厚度為23 μm)之長條之偏光膜(厚度為235 μm)、及作為承載膜之PET(Polyethylene Terephthalate,聚對苯二甲酸乙二酯)膜(厚度為38 μm)。 The embodiment is constructed using the apparatus of Figs. 2 and 3. The presence or absence of the breakage of the long-length polarizing film 13 and the optical film laminate 10 of the carrier film 12 when half-cut, and the quality of the half-cut (paste defect, paste drag) were evaluated by the half-cutting device 20. A VEGQ 1784CUAG150 (having a width of 400 mm and a rigidity of 8.5 N.mm 2 per 1 mm width and a thickness of 273 μm) was used as the long optical film laminate 10. The long optical film laminate 10 has a long polarizing film (thickness: 235 μm) containing an adhesive (thickness: 23 μm), and PET (Polyethylene Terephthalate) as a carrier film. ) film (thickness 38 μm).

於刀具中使用圓刀(圓度為30 μm,刀徑為100 mm)。於改變基座(低彈性之第1基座部及較第1基座部高彈性之第2基座部)之材料、及第1基座部之厚度之各種條件下進行評價。彈性模數係使用Daipla Wintes股份有限公司製造之SAICAS而測定。測定條件設定為以0.05 μm/sec之壓入速度垂直地壓入2 μm。使用曲率半徑為0.04 mm之曲面者作為壓頭。 Use a round knife (roundness 30 μm, tool radius 100 mm) in the tool. The evaluation was performed under various conditions of changing the material of the susceptor (the first base portion having low elasticity and the second base portion having higher elasticity than the first base portion) and the thickness of the first pedestal portion. The elastic modulus was measured using SAICAS manufactured by Daipla Wintes Co., Ltd. The measurement conditions were set so as to be vertically pressed at 2 μm at a press-in speed of 0.05 μm/sec. A curved surface with a radius of curvature of 0.04 mm is used as the indenter.

實施例1之基座係於第1基座部中使用厚度為0.5 mm之聚乙烯(PE,Polyethylene),於第2基座部中使用厚度為30 mm之不鏽鋼(SUS)。 In the susceptor of the first embodiment, polyethylene (PE, Polyethylene) having a thickness of 0.5 mm was used for the first base portion, and stainless steel (SUS) having a thickness of 30 mm was used for the second base portion.

實施例2之基座係除於第1基座部中使用厚度為3 mm之聚乙烯(PE)以外,其他與實施例1相同。 The susceptor of the second embodiment is the same as the first embodiment except that polyethylene (PE) having a thickness of 3 mm is used for the first base portion.

實施例3之基座係除於第2基座部中使用鋁(AL,Aluminium)以外,其他與實施例1相同。 The susceptor of the third embodiment is the same as that of the first embodiment except that aluminum (AL, Aluminium) is used for the second base portion.

實施例4之基座係除於第1基座部中使用厚度為1.0 mm之鋁(AL)以外,其他與實施例1相同。 The susceptor of the fourth embodiment is the same as the first embodiment except that aluminum (AL) having a thickness of 1.0 mm is used for the first base portion.

實施例5之基座係除於第1基座部中使用厚度為0.5 mm之聚苯乙烯(PS,Polystyrene)以外,其他與實施例1相同。 The susceptor of the fifth embodiment is the same as that of the first embodiment except that polystyrene (PS, Polystyrene) having a thickness of 0.5 mm is used for the first base portion.

比較例1之基座設定為單層之厚度為30 mm之不鏽鋼(SUS)。 The susceptor of Comparative Example 1 was set to a single layer of stainless steel (SUS) having a thickness of 30 mm.

比較例2之基座設定為單層之厚度為30 mm之聚乙烯(PE)。 The susceptor of Comparative Example 2 was set to a single layer of polyethylene (PE) having a thickness of 30 mm.

於實施例1~4、比較例1~2各者中,對長條之偏光膜進行半切而於承載膜上形成300片薄片。目視確認承載膜之破斷、半切之品質(糊劑缺欠、糊劑拖曳)。將其結果表示於表1中。於切割品質之評價中,判斷為不良之片數若為0則記作「○」,若為1~5則記作「△」,若為6以上則記作「×」。 In each of Examples 1 to 4 and Comparative Examples 1 and 2, the long polarizing film was half-cut and 300 sheets were formed on the carrier film. The quality of the breakage and half cut of the carrier film (paste defect, paste drag) was visually confirmed. The results are shown in Table 1. In the evaluation of the cutting quality, if the number of sheets determined to be defective is 0, it is referred to as "○", and if it is 1 to 5, it is referred to as "△", and if it is 6 or more, it is indicated as "X".

由表1之結果可知:若為如比較例1、2之單層之基座,則切割品質均較差;若為比較例1之不鏽鋼之單層基座,則存在產生承載膜之破斷之情形。另一方面,實施例1、2及5均無承載膜之破斷,半切之品質亦良好。實施例3、4雖無承載膜之破斷,但與實施例1、2及5相比半切之品質稍微下降。 As is clear from the results of Table 1, if the susceptors of the single layers of Comparative Examples 1 and 2 were used, the cutting quality was poor. If the single-layer susceptor of the stainless steel of Comparative Example 1 was used, the carrier film was broken. situation. On the other hand, none of Examples 1, 2 and 5 was broken by the carrier film, and the quality of the half cut was also good. In Examples 3 and 4, although the carrier film was not broken, the quality of the half cut was slightly lower than those of Examples 1, 2 and 5.

4‧‧‧液晶面板 4‧‧‧LCD panel

10‧‧‧光學膜積層體 10‧‧‧Optical film laminate

12‧‧‧承載膜 12‧‧‧ carrying film

13‧‧‧偏光膜 13‧‧‧ polarizing film

20‧‧‧半切裝置 20‧‧‧Half cutting device

21‧‧‧基座 21‧‧‧Base

103‧‧‧貼合裝置 103‧‧‧Fitting device

132‧‧‧黏著層 132‧‧‧Adhesive layer

135‧‧‧偏光膜之薄片 135‧‧‧Flakes of polarizing film

201‧‧‧刀具 201‧‧‧Tools

202‧‧‧圓刀 202‧‧‧ round knife

203‧‧‧切割刀 203‧‧‧Cutting knife

211‧‧‧第1基座部 211‧‧‧1st base section

212‧‧‧第2基座部 212‧‧‧2nd base section

Y‧‧‧液晶顯示元件 Y‧‧‧Liquid display components

圖1係表示本發明之基座之一例之概略圖。 Fig. 1 is a schematic view showing an example of a susceptor of the present invention.

圖2係表示液晶顯示元件之製造系統之一例之概略圖。 Fig. 2 is a schematic view showing an example of a manufacturing system of a liquid crystal display element.

圖3係表示使用圓刀進行切斷之一例之概略圖。 Fig. 3 is a schematic view showing an example of cutting using a circular knife.

圖4A係表示彈性模數較高之單層基座之一例之概略圖。 Fig. 4A is a schematic view showing an example of a single-layer base having a high modulus of elasticity.

圖4B係表示彈性模數較高之單層基座之一例之概略圖。 Fig. 4B is a schematic view showing an example of a single-layer base having a high modulus of elasticity.

圖5係表示彈性模數較低之單層基座之一例之概略圖。 Fig. 5 is a schematic view showing an example of a single-layer base having a low modulus of elasticity.

12‧‧‧承載膜 12‧‧‧ carrying film

13‧‧‧偏光膜 13‧‧‧ polarizing film

21‧‧‧基座 21‧‧‧Base

132‧‧‧黏著層 132‧‧‧Adhesive layer

201‧‧‧刀具 201‧‧‧Tools

211‧‧‧第1基座部 211‧‧‧1st base section

212‧‧‧第2基座部 212‧‧‧2nd base section

Claims (9)

一種液晶顯示元件之連續製造系統,其具備如下2個裝置:半切裝置,其於具有承載膜、及經由黏著層形成於該承載膜上且包含該黏著層之光學膜之光學膜積層體內,保留該承載膜將該光學膜沿其寬度方向切斷而形成該光學膜之薄片;以及貼合裝置,其將自上述承載膜剝離之上述薄片貼合於液晶面板上;上述半切裝置具有刀具、及與該刀具對向之基座;上述基座具有由距上述刀具較近之第1基座部、及距上述刀具較遠且具有高於該第1基座部之彈性模數的彈性模數之第2基座部積層而成之構造。 A continuous manufacturing system for a liquid crystal display element, comprising: a half-cutting device, which is retained in an optical film laminate having a carrier film and an optical film formed on the carrier film via an adhesive layer and containing the adhesive layer a carrier film that cuts the optical film in a width direction thereof to form a sheet of the optical film, and a bonding device that bonds the sheet peeled from the carrier film to a liquid crystal panel; the half-cutting device has a cutter, and a base opposite to the cutter; the base having a first base portion that is closer to the cutter and an elastic modulus that is farther from the cutter and has an elastic modulus higher than the first base portion The structure in which the second base portion is laminated. 如請求項1之液晶顯示元件之連續製造系統,其中上述第1基座部之厚度為0.1 mm~5.0 mm。 The continuous manufacturing system of the liquid crystal display element of claim 1, wherein the first base portion has a thickness of 0.1 mm to 5.0 mm. 如請求項1之液晶顯示元件之連續製造系統,其中上述第1基座部之彈性模數為0.2 GPa~60 GPa。 The continuous manufacturing system of the liquid crystal display element of claim 1, wherein the first base portion has an elastic modulus of 0.2 GPa to 60 GPa. 如請求項1至3中任一項之液晶顯示元件之連續製造系統,其中上述第2基座部之彈性模數為130 GPa以上。 The continuous manufacturing system of a liquid crystal display element according to any one of claims 1 to 3, wherein the second base portion has an elastic modulus of 130 GPa or more. 如請求項1或2之液晶顯示元件之連續製造系統,其中上述第1基座部之彈性模數與上述第2基座部之彈性模數之差為100 GPa以上。 The continuous manufacturing system of the liquid crystal display element of claim 1 or 2, wherein a difference between an elastic modulus of the first base portion and an elastic modulus of the second base portion is 100 GPa or more. 如請求項1之液晶顯示元件之連續製造系統,其中上述刀具為圓刀。 A continuous manufacturing system of a liquid crystal display element of claim 1, wherein the tool is a circular knife. 如請求項1之液晶顯示元件之連續製造系統,其中上述承載膜之厚度為20 μm~50 μm。 The continuous manufacturing system of the liquid crystal display element of claim 1, wherein the carrier film has a thickness of 20 μm to 50 μm. 一種液晶顯示元件之連續製造方法,其包括如下2個步驟:半切步驟,其於具有承載膜、及經由黏著層形成於該承載膜上且包含該黏著層之光學膜之光學膜積層體內,保留該承載膜將該光學膜沿其寬度方向切斷而形成該光學膜之薄片;以及貼合步驟,其將自上述承載膜剝離之上述薄片貼合於液晶面板上;上述半切步驟係如下所述之步驟:於具有由第1基座部及具有高於該第1基座部之彈性模數的彈性模數之第2基座部積層而成之構造之基座之該第1基座部上,使上述承載膜為該第1基座部側而配置上述光學膜積層體,保留該承載膜將上述光學膜沿其寬度方向切斷。 A continuous manufacturing method of a liquid crystal display element, comprising the following two steps: a half-cutting step, which is retained in an optical film laminate having a carrier film and an optical film formed on the carrier film via an adhesive layer and containing the adhesive layer The carrier film is cut along the width direction thereof to form a sheet of the optical film, and a bonding step of bonding the sheet peeled from the carrier film to the liquid crystal panel; the half-cutting step is as follows The step of forming the first base portion of the base having the first base portion and the second base portion having an elastic modulus higher than the elastic modulus of the first base portion The optical film laminate is placed on the first base portion side of the carrier film, and the carrier film is retained to cut the optical film in the width direction. 一種半切裝置,其具有刀具、及與該刀具對向之基座,且上述基座具有由距上述刀具較近之第1基座部、及距上述刀具較遠且具有高於該第1基座部之彈性模數的彈性模數之第2基座部積層而成之構造。 A half-cutting device having a tool and a base opposite the tool, wherein the base has a first base portion that is closer to the tool and is farther from the tool and has a higher than the first base The structure in which the second base portion of the elastic modulus of the elastic modulus of the seat is laminated.
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