TW201328138A - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
TW201328138A
TW201328138A TW101100264A TW101100264A TW201328138A TW 201328138 A TW201328138 A TW 201328138A TW 101100264 A TW101100264 A TW 101100264A TW 101100264 A TW101100264 A TW 101100264A TW 201328138 A TW201328138 A TW 201328138A
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Taiwan
Prior art keywords
heat sink
heat
sinks
assembly
parallel
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TW101100264A
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Chinese (zh)
Inventor
Jing-Ya He
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Hon Hai Prec Ind Co Ltd
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Publication of TW201328138A publication Critical patent/TW201328138A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)

Abstract

A heat sink assembly includes a base, a plurality of heat pipes, a first heat sink, and a fan. The first heat sink includes a first fin assembly, and a second fin assembly located on a first side of the first fin assembly. The fan is installed on a second side of the first fin assembly opposite to the second fin assembly. The first fin assembly includes a plurality of first fins spaced from each other and paralleled to each other. The second fin assembly includes a plurality of second fins spaced from each other and paralleled to each other. Each first and second fins are misaligned each other. The heat pipes are mounted to the base, and extending through the first and second fins.

Description

散熱器組合Radiator combination

本發明是關於一種散熱器組合。The present invention relates to a heat sink assembly.

習知技術中，複數鰭片間隔平行地固設於熱管上，每一鰭片一般作為一個整體均與所有的熱管相接觸，相鄰近的兩鰭片之間形成一風流通道，風流直接自該風流通道流出不利於熱冷空氣的交換，影響散熱效果。In the prior art, the plurality of fins are fixed in parallel on the heat pipe, and each fin is generally in contact with all the heat pipes as a whole, and a wind flow channel is formed between the adjacent fins, and the wind flow directly from the The outflow of the airflow passage is not conducive to the exchange of hot and cold air, which affects the heat dissipation effect.

鑒於以上，有必要提供一種可增強熱冷空氣的交換，提高散熱效率的散熱器組合。In view of the above, it is necessary to provide a heat sink combination that enhances the exchange of hot and cold air and improves heat dissipation efficiency.

一種散熱器組合，包括一基座、複數熱管、一第一散熱器及一風扇，該第一散熱器包括一第一散熱片組及一位於該第一散熱片組的一側的第二散熱片組，該風扇裝設於該第一散熱片組的另一側，該第一散熱片組包括複數間隔平行的第一散熱片，該第二散熱片組包括複數間隔平行的第二散熱片，每一第一散熱片與每一第二散熱片相互錯位，該等熱管固定於該基座並穿設於該等第一散熱片及第二散熱片。A heat sink assembly includes a base, a plurality of heat pipes, a first heat sink and a fan, the first heat sink including a first heat sink group and a second heat sink located on one side of the first heat sink group The first heat sink group includes a plurality of first heat sinks that are parallel in parallel, and the second heat sink group includes a plurality of second heat sinks that are parallel in parallel. Each of the first heat sinks and the second heat sinks are offset from each other, and the heat pipes are fixed to the base and are disposed through the first heat sinks and the second heat sinks.

相較習知技術，該散熱器組合的第一散熱片與第二散熱片相互錯位設置，使經過第一散熱片組的風流於流入第二散熱片組時分流，同時增強風流阻抗，使熱交換更充分，提高散熱效率。Compared with the prior art, the first heat sink and the second heat sink of the heat sink combination are offset from each other, so that the wind flow passing through the first heat sink group is shunted when flowing into the second heat sink group, and the wind flow impedance is enhanced to make heat The exchange is more complete and the heat dissipation efficiency is improved.

請參照圖1，本發明散熱器組合100的較佳實施方式用以對安裝於一主機板300上的一發熱元件302散熱，該主機板300於該發熱元件302的周圍開設四鎖固孔304。該散熱器組合100包括一基座20、一第一散熱器40、一第二散熱器60、一連接框80及一風扇90。Referring to FIG. 1 , a preferred embodiment of the heat sink assembly 100 of the present invention is used to dissipate heat from a heat generating component 302 mounted on a motherboard 300 . The motherboard 300 defines four locking holes 304 around the heat generating component 302 . . The heat sink assembly 100 includes a base 20 , a first heat sink 40 , a second heat sink 60 , a connecting frame 80 , and a fan 90 .

該基座20包括一基板22及分別固設於該基板22相對的兩端的兩U形的固定板26。該基板22的頂面開設四平行的收容槽222。每一固定板26包括一固定於該基板的固定部262及自該固定部262相對的兩端分別向外傾斜延伸的一延伸部264。每一延伸部264的自由端開設一通孔266。The susceptor 20 includes a substrate 22 and two U-shaped fixing plates 26 respectively fixed to opposite ends of the substrate 22. The top surface of the substrate 22 defines four parallel receiving grooves 222. Each of the fixing plates 26 includes a fixing portion 262 fixed to the substrate and an extending portion 264 extending obliquely outward from opposite ends of the fixing portion 262. A through hole 266 is defined in the free end of each extending portion 264.

該第一散熱器40包括四個U形的熱管42、一固設於其中兩熱管42的第一散熱片組44及一固設於另兩熱管42的第二散熱片組46。每一熱管42包括一定位部422及由該定位部422相對的兩端向上延伸的兩導熱部424。The first heat sink 40 includes four U-shaped heat pipes 42 , a first heat sink set 44 fixed to the two heat pipes 42 , and a second heat sink set 46 fixed to the other two heat pipes 42 . Each heat pipe 42 includes a positioning portion 422 and two heat conducting portions 424 extending upward from opposite ends of the positioning portion 422.

該第一散熱片組44包括複數長方形的第一散熱片442。每一第一散熱片442上開設四穿插孔446。每一第一散熱片442的相對的兩端分別開設一缺口444。The first fin group 44 includes a plurality of rectangular first fins 442. Four insertion holes 446 are defined in each of the first fins 442. A notch 444 is defined in each of opposite ends of each of the first fins 442.

該第二散熱片組46包括複數長方形的第二散熱片462。每一第二散熱片462開設四穿插孔464。The second fin group 46 includes a plurality of rectangular second fins 462. Each of the second fins 462 defines a four-through jack 464.

該第二散熱器60包括一底板62及垂直設於該底板62的複數鰭片64。該底板62的底面對應該基板22的收容槽222開設四卡槽622。The second heat sink 60 includes a bottom plate 62 and a plurality of fins 64 vertically disposed on the bottom plate 62. The bottom surface of the bottom plate 62 defines a four-card slot 622 corresponding to the receiving groove 222 of the substrate 22 .

該連接框80呈方形，其包括一位於中部的出風口85及位於四角的連接板82。每一連接板82設置一螺孔86該連接框80相對的兩側朝同一側垂直延伸形成兩卡持板84。每一卡持板84向內凸設兩彈性的卡鉤87。The connecting frame 80 has a square shape and includes a central air outlet 85 and a connecting plate 82 at the four corners. Each of the connecting plates 82 is provided with a screw hole 86. The opposite sides of the connecting frame 80 extend perpendicularly to the same side to form two holding plates 84. Each of the holding plates 84 protrudes inwardly with two elastic hooks 87.

該風扇90的四角處各設有一通孔92。A through hole 92 is defined in each of the four corners of the fan 90.

請一併參照圖2至圖4，組裝時，將其中兩熱管42對應的導熱部424穿入每一第一散熱片442的穿插孔446並藉由焊接固定，使該等第一散熱片442平行間隔地固定於熱管42上，每兩相鄰的第一散熱片442之間形成一間距相同的第一風道447，該等第一散熱片442兩端的缺口444共同形成兩相對的卡固槽448。將另外兩熱管42對應的導熱部424穿入每一第二散熱片462的穿插孔464並藉由焊接固定，每相鄰的兩第二散熱片462之間形成一間距相同的第二風道467，使該等第二散熱片462間隔平行地固定於熱管42上。將固接有第一散熱片組44的熱管42的定位部422下側部收容於該基板22鄰近一端的兩收容槽222內，並藉由焊接固定。將固接有第二散熱片組46的熱管42的定位部422下側部收容於該基板22鄰近另一端的兩收容槽222內，並藉由焊接固定，使每一第二散熱片462正對相應的第一風道447。將該第二散熱器60蓋設於該基板22，使熱管42的定位部422上側部收容於對應的卡槽622內。將該連接框80的卡持板84正對該第一散熱片組44的兩端，並使卡鉤87卡入對應的卡固槽448內。利用四個螺釘分別穿過風扇90的通孔92鎖固於該連接框80對應的螺孔86內。利用四個鎖固件分別穿過固定板26的通孔266鎖固於該主機板300對應的鎖固孔304內。本實施方式中，每一第二散熱片462正對相應的第一風道447的中部。Referring to FIG. 2 to FIG. 4 together, in the assembly, the heat conducting portions 424 corresponding to the two heat pipes 42 are inserted into the insertion holes 446 of each of the first heat sinks 442 and fixed by welding to make the first heat sinks. 442 is fixed to the heat pipe 42 in parallel, and a first air channel 447 having the same spacing is formed between each two adjacent first heat sinks 442. The notches 444 at the two ends of the first heat sink 442 together form two opposite cards. Solid groove 448. The heat conducting portions 424 corresponding to the other two heat pipes 42 are inserted into the through holes 464 of each of the second heat sinks 462 and fixed by welding. A second wind having the same spacing is formed between each adjacent two second heat sinks 462. The track 467 is such that the second fins 462 are fixed to the heat pipe 42 in parallel at intervals. The lower portion of the positioning portion 422 of the heat pipe 42 to which the first heat sink group 44 is fixed is received in the two receiving grooves 222 adjacent to one end of the substrate 22, and is fixed by welding. The lower side portion of the positioning portion 422 of the heat pipe 42 to which the second heat sink group 46 is fixed is received in the two receiving grooves 222 of the substrate 22 adjacent to the other end, and is fixed by welding so that each second heat sink 462 is positive. For the corresponding first air duct 447. The second heat sink 60 is placed on the substrate 22 , and the upper portion of the positioning portion 422 of the heat pipe 42 is received in the corresponding card slot 622 . The holding plate 84 of the connecting frame 80 is opposite to both ends of the first fin group 44, and the hook 87 is inserted into the corresponding fixing groove 448. The four screws are respectively inserted into the corresponding screw holes 86 of the connecting frame 80 through the through holes 92 of the fan 90. The four locking fasteners are respectively inserted into the corresponding locking holes 304 of the motherboard 300 through the through holes 266 of the fixing plate 26 . In this embodiment, each of the second fins 462 faces the middle of the corresponding first air duct 447.

使用時，該發熱元件302工作產生的熱量傳導至基板22後，一部分熱量經基板22熱管42傳導至第一、第二散熱片組44、46，另一部分熱量經蓋板24傳導至第二散熱器60。該風扇90的風流經過每一第一風道447後分流至與該第一風道447對應兩第二風道467內，再經第二風道467流出，增大了風流阻抗，使風流與第一、第二散熱片442、462能充分接觸，更利於熱交換，提高散熱效率。In use, after the heat generated by the operation of the heating element 302 is conducted to the substrate 22, a portion of the heat is conducted to the first and second heat sink groups 44, 46 via the heat pipe 42 of the substrate 22, and another portion of the heat is conducted to the second heat dissipation through the cover plate 24. 60. The wind flow of the fan 90 is diverted to the two air ducts 467 corresponding to the first air duct 447 after passing through each of the first air ducts 447, and then flows out through the second air duct 467, thereby increasing the wind current impedance and making the air flow and the air flow The first and second fins 442 and 462 can be in sufficient contact, which is more conducive to heat exchange and improves heat dissipation efficiency.

綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100．．．散熱器組合100. . . Radiator combination

300．．．主機板300. . . motherboard

302．．．發熱元件302. . . Heating element

304．．．鎖固孔304. . . Locking hole

20．．．基座20. . . Pedestal

22．．．基板twenty two. . . Substrate

26．．．固定板26. . . Fixed plate

222．．．收容槽222. . . Storage slot

262．．．固定部262. . . Fixed part

264．．．延伸部264. . . Extension

266、92．．．通孔266, 92. . . Through hole

40．．．第一散熱器40. . . First radiator

42．．．熱管42. . . Heat pipe

44．．．第一散熱片組44. . . First heat sink set

46．．．第二散熱片組46. . . Second heat sink

422．．．定位部422. . . Positioning department

424．．．導熱部424. . . Heat transfer department

442．．．第一散熱片442. . . First heat sink

444．．．缺口444. . . gap

446．．．穿插孔446. . . Wear jack

447．．．第一風道447. . . First air duct

462．．．第二散熱片462. . . Second heat sink

464．．．穿插孔464. . . Wear jack

467．．．第二風道467. . . Second air duct

60．．．第二散熱器60. . . Second radiator

62．．．底板62. . . Bottom plate

64．．．鰭片64. . . Fin

622．．．卡槽622. . . Card slot

80．．．連接框80. . . Connection box

82．．．連接板82. . . Connection plate

84．．．卡持板84. . . Card holding plate

85．．．出風口85. . . Air outlet

86．．．螺孔86. . . Screw hole

87．．．卡鉤87. . . Hook

90．．．風扇90. . . fan

448．．．卡固槽448. . . Card slot

圖1係本發明散熱器組合的較佳實施方式的立體分解圖，該散熱器組合包括一第一散熱器。1 is an exploded perspective view of a preferred embodiment of a heat sink assembly of the present invention, the heat sink assembly including a first heat sink.

圖2係圖1的第一散熱器的結構示意圖。FIG. 2 is a schematic structural view of the first heat sink of FIG. 1. FIG.

圖3係圖1的部分立體組裝圖。3 is a partial perspective assembled view of FIG. 1.

圖4係圖1的立體組裝圖。4 is a perspective assembled view of FIG. 1.

40．．．第一散熱器40. . . First radiator

42．．．熱管42. . . Heat pipe

442．．．第一散熱片442. . . First heat sink

447．．．第一風道447. . . First air duct

462．．．第二散熱片462. . . Second heat sink

467．．．第二風道467. . . Second air duct

Claims (6)

一種散熱器組合，包括一基座、複數熱管、一第一散熱器及一風扇，該第一散熱器包括一第一散熱片組及一位於該第一散熱片組的一側的第二散熱片組，該風扇裝設於該第一散熱片組的另一側，該第一散熱片組包括複數間隔平行的第一散熱片，該第二散熱片組包括複數間隔平行的第二散熱片，每一第一散熱片與每一第二散熱片相互錯位，該等熱管固定於該基座並穿設於該等第一散熱片及第二散熱片。A heat sink assembly includes a base, a plurality of heat pipes, a first heat sink and a fan, the first heat sink including a first heat sink group and a second heat sink located on one side of the first heat sink group The first heat sink group includes a plurality of first heat sinks that are parallel in parallel, and the second heat sink group includes a plurality of second heat sinks that are parallel in parallel. Each of the first heat sinks and the second heat sinks are offset from each other, and the heat pipes are fixed to the base and are disposed through the first heat sinks and the second heat sinks. 如申請專利範圍第1項所述之散熱器組合，其中每相鄰的兩第一散熱片之間形成一第一風道，每一第二散熱片正對相應的第一風道。The heat sink assembly of claim 1, wherein a first air passage is formed between each adjacent two first heat sinks, and each of the second heat sinks faces the corresponding first air passage. 如申請專利範圍第2項所述之散熱器組合，其中每相鄰的兩第二散熱片之間形成一第二風道，風流經過第一風道後分流至與該第一風道相鄰的兩第二風道內。The heat sink assembly of claim 2, wherein a second air passage is formed between each adjacent two second heat sinks, and the wind flow passes through the first air passage and is branched to be adjacent to the first air passage. Inside the two second air ducts. 如申請專利範圍第1項所述之散熱器組合，其中該散熱器組合還包括一設置於該基座與第一散熱器的熱管之間的第二散熱器。The heat sink assembly of claim 1, wherein the heat sink assembly further comprises a second heat sink disposed between the base and the heat pipe of the first heat sink. 如申請專利範圍第4項所述之散熱器組合，其中每一熱管呈U形，包括一夾持於第二散熱器與基板之間的定位部及由該定位部的兩端向上延伸的穿設於第一散熱片或第二散熱片的兩導熱部。The heat sink assembly of claim 4, wherein each of the heat pipes is U-shaped, including a positioning portion sandwiched between the second heat sink and the substrate, and extending through the two ends of the positioning portion The two heat conducting portions are disposed on the first heat sink or the second heat sink. 如申請專利範圍第1項所述之散熱器組合，其中該風扇與第一散熱片組之間設有一連接框，每一第一散熱片相對的兩端各開設一缺口，該等第一散熱片的缺口共同形成一卡固槽，該連接框包括一用於安裝該風扇的連接板及由該連接板相對的兩側分別延伸形成的一卡固於該卡固槽的卡鉤。The heat sink assembly of claim 1, wherein a connecting frame is disposed between the fan and the first heat sink, and a gap is formed at each of the opposite ends of each of the first heat sinks. The gaps of the strips together form a retaining slot. The connecting frame includes a connecting plate for mounting the fan, and a hook extending from opposite sides of the connecting plate respectively.
TW101100264A 2011-12-28 2012-01-04 Heat sink assembly TW201328138A (en)

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CN111328244A (en) * 2018-12-17 2020-06-23 青岛海尔智能技术研发有限公司 Fin radiator and refrigeration cabinet machine

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CN110379785B (en) * 2019-07-25 2020-12-01 邢台职业技术学院 Electronic radiator

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CN1183430C (en) * 2001-11-05 2005-01-05 刘俊富 Quick heat conducting heat radiator module
CN2664194Y (en) * 2003-10-13 2004-12-15 鸿富锦精密工业（深圳）有限公司 Liquid cooling type heat sink
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CN111328244A (en) * 2018-12-17 2020-06-23 青岛海尔智能技术研发有限公司 Fin radiator and refrigeration cabinet machine
CN111328244B (en) * 2018-12-17 2021-11-26 青岛海尔智能技术研发有限公司 Fin radiator and refrigeration cabinet machine

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