TW201326011A - Testing and classifying machine for semiconductor components - Google Patents

Abstract

A testing and classifying machine for semiconductor components contains a feeding device, a collecting device, a testing device, a central controlling device, and a carrying device, which includes at least moving unit to change a distance to pick, place, and move the semiconductor components, wherein the moving unit includes at least one picker and an X-axis distance changing mechanism, the at least one picker includes a holder to support a motor, and the motor drives at least one transmitting set to actuate at least one sucker to displace in a Z-axis direction, and the X-axis distance changing mechanism includes at least one pitch controller to extend and retract in the an X-axis direction, the at least one pitch controller includes a plurality of connecting rods axially connected and arranged in a crosslink manner, and each connecting rod actuates at least one picker to displace in the X-axis direction, hence the X-axis distance changing mechanism adjusts a distance the at least one picker in the X-axis direction, and when a height of the sucker of the picker happens error, the height of the sucker adjusts electrically, thereby picking and placing the semiconductor elements precisely.

Description

Semiconductor component inspection sorter

The invention provides a moving material unit capable of adjusting the X-axis spacing of at least one column of pick and place devices by using an X-axis variable pitch mechanism, and is easy to electronically adjust the pick-and-place operation height of the pick-up head of the pick-and-placer, thereby accurately picking and placing the semiconductor. A component and a semiconductor component inspection and sorting machine that enhances the convenience of operation.

Please refer to FIG. 1 for the applicant's previous application for the invention of Taiwan Patent No. 96117901, "Picking and Feeding Unit of Variable Distance Transfer Unit", which is provided with a driveable Z-axis pulley on the frame 11. The Z-axis motor 12 of the group 13 is coupled to a receiving plate 14 by a Z-axis pulley set 13, and an X-axis motor 15 for driving the X-axis pulley set 16 is attached to the receiving plate 14, and is X. The axial pulley set 16 is provided with a plurality of connecting members 17, each of which is connected to a picker 18, and each of the pickers 18 is provided with a piston rod connected by a Z-axis cylinder 181 for driving the Z-axis. The displacement tip 182 is used for picking and placing semiconductor components; referring to FIG. 2, when adjusting the X-axis spacing of each of the pickers 18, the X-axis motor 15 can be controlled to drive the X-axis pulley set 16 so that The X-axis pulley set 16 drives the picker 18 to X-axis displacement via the connecting members 17 to adjust the X-axis spacing of each pick-and-placer 18 so that the X-axis of the pick-up head 182 of each pick-and-placer 18 The spacing corresponds to the X-axis spacing of the receiving slots 191 of the container 19; please refer to FIG. 3, after adjusting the X-axis spacing of each of the pickers 18, The Z-axis motor 12 drives the Z-axis pulley set 13 so that the Z-axis pulley set 13 drives the receiving plate 14 to perform Z-axis displacement, and the receiving plate 14 drives the pick-and-placers 18 to simultaneously make the Z-axis downward. Displaced above the container 19, and then the Z-axis cylinder 181 of each of the pickers 18 is driven to drive the tip 182 to be displaced downwardly in the Z-axis, respectively, to be taken in the receiving groove 191 of the container 19. The semiconductor device A is placed; however, the pick-and-place mechanism 18 of the pick-and-place mechanism can use the piston rod of the Z-axis pressure cylinder 181 to drive the suction head 182 to shift downward and take the semiconductor component A, but the operation of the pressure cylinder 181 cannot be performed. The control method fine-tunes the amount of protrusion of the piston rod, which causes over-voltage or air-throwing when the semiconductor component A needs to be placed on a device with different working heights, and in addition, the pick-up device 18 is in the process of placing the semiconductor component A. It is prone to jamming, and the cylinder tends to cause over-voltage damage to the semiconductor element A, and it is impossible to increase the yield of the work, which needs to be improved.

Therefore, how to design a semiconductor component inspection and sorting machine that can adjust the X-axis spacing of at least one column of pick-and-placers and easily adjust the pick-and-place operation height of the pick-and-place device to accurately pick and place semiconductor components and improve workability is The subject of research and development by the industry.

A first object of the present invention is to provide a semiconductor component inspection and sorting machine, which is provided with a feeding device, a receiving device, a testing device, a central control device and a conveying device, and the conveying device is provided with at least one a shifting unit for shifting and transferring a semiconductor component, wherein the moving unit is provided with at least one column of pick-and-placers and an X-axis variable pitch mechanism on the frame, and at least one column of pick-and-place devices is respectively provided with a bearing a carriage of the motor and driving at least one transmission group by a motor, wherein the transmission group drives at least one suction head for Z-axis displacement, and the X-axis variable pitch mechanism is provided with at least one variable distance which can be used for X-axis expansion and contraction The variable distance device is provided with a plurality of connecting rods arranged in a cross-pivoting arrangement, and the connecting rods are connected to drive at least one row of pick and place devices for X-axis displacement; thereby, the X-axis variable pitch mechanism can be used to adjust at least The X-axis spacing of a row of pick-and-placers, and when the pick-and-place operation height of the pick-and-placer is abnormal, the torque electronic signal fed back by the electronically controlled motor is used to judge whether an abnormality occurs, so there is no need to install many sensors. You can achieve the goal, It can be easily electronically adjusted to adjust the pick-and-place height of the tip and warn the user to achieve the practical benefit of accurately picking and placing semiconductor components and improving the convenience of the operation.

A second object of the present invention is to provide a semiconductor component detection sorting machine, wherein the shifting unit is provided with at least first and second rows of pick and place devices, and a Y-axis variable pitch mechanism is provided on the frame, and the Y-axis The variable distance mechanism is mounted on the frame with a driving structure for driving at least one transmission frame for Y-axis displacement, and the transmission frame is coupled to drive at least one column of the pick-and-place device for Y-axis displacement; thereby, the Y-axis can be utilized Adjusting the Y-axis spacing of at least the first and second rows of pick and place devices to the variable pitch mechanism, so that different semiconductor containers can accurately pick and place semiconductor components, thereby achieving practical benefits of improving the use efficiency.

A third object of the present invention is to provide a semiconductor component inspection and sorting machine, wherein the transmission group of the pick and place device is coupled with at least one connecting member to connect the suction head, and an auxiliary slip is arranged between the two ends of the connecting member and the bracket. The structure is used to prevent the yaw of the connecting member from swaying, thereby improving the smoothness of the pick-and-place component of the picking head.

A fourth object of the present invention is to provide a semiconductor component detecting and sorting machine, wherein a guide groove is arranged on a frame of each pick-and-placer, and the X-axis variable pitch mechanism is respectively disposed at two ends of each link of the variable pitcher The first transmission member and the second transmission member are disposed, wherein the first transmission member is displaceably displaceable on the guide groove of the carrier of the pick-and-placer, and the second transmission member is pivotally positioned on the carrier, and further The accuracy of the transmission between the variable distance device and the pick-and-place device can be improved to prevent the tip of the pick-and-place device from being biased, thereby achieving the practical benefit of improving the displacement stability of the tip.

In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: The semiconductor component inspection and sorting machine of the present invention comprises an organic table, a feeding device, a receiving device, and a test. a device, a central control device, and a transport device, wherein the transport device is provided with at least one shifting unit 20 for variable-pick-and-shift transfer of semiconductor components. Referring to Figures 4, 5, 6, and 7, the mobile unit 20 includes a frame, at least one row of pick-and-placers and an X-axis variable pitch mechanism, at least one row of pick-and-place devices respectively provided with a frame for holding the motor, and driving at least one transmission group by a motor, and the transmission group driving at least one suction head Z-axis displacement mechanism, the X-axis variable pitch mechanism is provided with at least one variable distance device capable of performing X-axis expansion and contraction, and the variable distance device is provided with a plurality of connecting rods arranged in a cross-pivoting arrangement, and each of the links The rod connection drives at least one row of pickers for X-axis displacement; in the embodiment, the moving unit 20 includes a frame 30, at least first and second rows of pick-and-placers 40, 50, and an X-axis variable pitch mechanism 60. , Y-axis variable pitch mechanism 70 and Z-axis carrier mechanism 80, the frame 30 can In the present embodiment, the frame 30 is a movable design and is mounted on a Z-axis carrier mechanism 80 for Z-axis displacement; at least the first and second rows are taken. The receivers 40 and 50 are respectively provided with the brackets 41 and 51 of the one side mask guide grooves 411 and 511, and the motors 42 and 52 are assembled on the respective brackets 41 and 51, and the motors 42 and 52 are respectively driven to have a Z-axis. Each of the pulley sets 43 and 53 is configured to drive at least one of the suction heads for Z-axis displacement. In the present embodiment, each of the pulley sets 43 and 53 is coupled to the drive trains 43 and 53 respectively. The connecting members 44 and 54 are disposed in the Z-axis direction, and the connecting members 44 and 54 are respectively connected to the suction heads 45 and 55, and the auxiliary sliding members are disposed between the ends of the connecting members 44 and 54 and the brackets 41 and 51. The structure is configured to prevent the swaying of the connecting members 44 and 54 and smoothly move the suction heads 45 and 55 for Z-axis displacement. In this embodiment, the auxiliary sliding of the first and second rows of pick-and-placers 40 and 50 The shifting structure is provided with a sliding portion and a sliding portion between the connecting members 44 and 54 and the brackets 41 and 51 respectively, and the sliding portion can be a sliding rail or a sliding seat, and the guiding sliding portion is In this embodiment, a sliding portion of the sliding blocks 441 and 541 is disposed at one end of each of the connecting members 44 and 54 , and a sliding rail 412 is disposed on the brackets 41 and 51 . And a sliding portion of the sliding portion 441, 541 for sliding displacement, and a sliding portion for the other end of each of the supporting frames 41, 51 corresponding to the connecting members 44, 54 for the connecting members 44, 54 In the present embodiment, a sliding portion for the slides 413, 513 is provided at a position corresponding to the other end of each of the brackets 41, 51 corresponding to the joints 44, 54 for the joint members 44, 54 to slide. Positioning the displacement; the X-axis variable pitch mechanism 60 is provided with first and second distance changing devices 61 and 62 for performing X-axis expansion and contraction on the first and second rows of pick and place devices 40, 50, respectively. The two pitchers 61 and 62 are respectively provided with a plurality of links 611 and 621 which are arranged in a cross-continuous pivotal arrangement, and the links 611 and 621 are connected to the frame 41 of the pick-and-placers 40 and 50 by at least one transmission member. 51, for driving the respective pickers 40, 50 for X-axis displacement. In this embodiment, each of the links 611, 621 is respectively provided with a first transmission member 612A, 622A as a rod at one end, and First transmission 612A and 622A are respectively inserted into the guiding grooves 411 and 511 of the brackets 41 and 51, and can be displaced in the Z-axis direction in the guiding grooves 411 and 511, and the other ends of the connecting rods 611 and 621 are provided with a rod member. The second transmission members 612B, 622B, and the second transmission members 612B, 622B are respectively pivotally positioned on the carriers 41, 51 of the pick-and-placers 40, 50, and the respective transmission members 611, 621 can respectively utilize the first transmission member The 612A, 622A and the second transmission members 612B, 622B push the respective pickers 40, 50 for X-axis displacement. Further, the X-axis variable pitch mechanism 60 is provided with a driving structure on the frame 30. The driving structure can drive at least one pick-and-place device for X-axis displacement, and the pick-and-placer can use the variable distance device to drive other pick-and-placers to synchronously perform X-axis displacement, or the driving structure can directly drive the variable distance device as the X-axis. In the embodiment, the driving structure is provided with a driving source on the frame 30 for driving at least one transmission group, and the transmission is driven by the variable distance device. The group is coupled to drive at least one pick-and-place device for X-axis displacement. In this embodiment, the driving structure is provided on the frame 30. A driving source of the motor 63, the motor 63 drives a transmission group of the pulley set 64, and drives a rotating rod 65 disposed in the Y-axis direction by the pulley set 64. The two ends of the rotating rod 65 are respectively connected and driven. The transmission group of the X-axis axially disposed pulley set 66, and the carrier of the at least one row of the pick-and-place device are provided with a linkage frame disposed in the Y-axis direction and connectable to the pulley set 66, and at least one column of the pick-and-place device The bracket is provided with a sliding member that can be slidably placed on the linkage frame. In the embodiment, the bracket 51 of each of the second row of pick and placers 50 is provided with a Y-axis and can be connected to the pulley. The linkage frame 67 of the group 66 is provided with a sliding member 414 which can be slidably placed on the linkage frame 67 on the frame 41 of each of the first rows of the pick-and-places 40, and a linkage 67 of the pick-and-placer 50 is further provided. The two ends are respectively connected to the pulley set 66, and the two ends of each of the interlocking frames 67 and the frame 30 are provided with a sliding seat 671 and a sliding rail 301 which are arranged in an X-axis direction to assist the smoothing of the interlocking frames 67. Each of the pick-and-place devices 40, 50 is driven to perform X-axis displacement; the Y-axis variable pitch mechanism 70 is mounted on the frame 30 with a driving structure for driving at least one carrier for Y-axis In the embodiment, the drive structure is coupled to the frame 30 and is provided with a driving source for driving at least one transmission group, and the transmission group is driven. The drive frame is Y-axis displacement, the drive source can be a motor, and the drive set can be a screw set or a pulley set for connecting the drive frame. In this embodiment, the drive structure is attached to the frame 30. The motor 71 is driven by a drive unit of the pulley 71, and the pulley set 72 drives a rotary rod 73 disposed in the X-axis direction. The transmission group of the Y-axially disposed pulley set 74, each of the pulley sets 74 is coupled to drive the transmission frame 75 for Y-axis displacement, and the transmission frame 75 is coupled to drive the first row of the pick-and-placers 40 for Y-axis displacement. In the embodiment, the transmission frame 75 is designed as a slide rail, and each of the pick-up devices 40 is mounted on the carrier 41 with a sliding member for the sliding seat 415, and is slidably placed on the transmission frame 75 by the sliding seat 415. The X-axis displacement can be used, and the transmission frame 75 and the frame 30 are mutually matched and arranged in the Y-axis direction. The sliding block 751 and the sliding rail 302 are used to assist the driving frame 75 to smoothly drive the first row of pickers 40 for Y-axis displacement; the Z-axis carrying mechanism 80 is coupled to a carrier 81 and provided with a motor. The driving source of 82, the motor 82 drives a transmission group of the Z-axis screw threaded set 83, and drives the frame 30 and the first and second rows of pick-and-placers 40, 50 with the Z-axis screw threaded set 83. The X-axis variable pitch mechanism 60 and the Y-axis variable pitch mechanism 70 are displaced in the Z-axis direction, so that the first and second-row pick-and-place devices 40, 50 are synchronously taken and placed.

Referring to Figures 7, 8, and 9, the shifting unit 20 can control the motor 63 of the X-axis variable pitch mechanism 60 via the pulley set when adjusting the X-axis spacing of the first and second rows of pick and placeers 40, 50. 64, the rotating rod 65 is driven, and the two pulley sets 66 are driven by the rotating rod 65. The two pulley sets 66 drive a linkage 67 for X-axis displacement, and the linkage 67 can be used along the sliding rail 301 of the frame 30 by the sliding seat 671. While assisting the smooth sliding, the linkage frame 67 is used to drive the first and second rows of pick and placers 40, 50 for X-axis displacement, and the first and second rows of pick-and-placers 40 and 50 respectively push the first and second respectively. The first transmission members 612A and 622A and the second transmission members 612B and 622B of the distance changers 61 and 62 are actuated, and the respective transmission members 612 and 621 are driven by the first transmission members 612A and 622A and the second transmission members 612B and 622B. Since the plurality of support links 611 and 621 adopt a cross-continuous pivotal arrangement design, the plurality of support links 611 and 621 can be mutually displaced by the X-axis inward displacement, and the first transmission member 612A at both ends thereof is respectively The 622A and the second transmission members 612B and 622B drive the pivotal pickers 40 and 50 to perform X-axis displacement synchronously, and the sliding seat 415 of the first row of pick-and-placers 40 can be along the Y-axis. The transmission frame 75 of the mechanism 70 is X-axis displaced, so that the suction heads 45, 55 of the first and second rows of the pick-and-placers 40, 50 adjust the X-axis spacing, and the first and second pitchers 61. The second transmission members 612B and 622B of the 62 are pivotally positioned on the brackets 41 and 51 of the pickers 40 and 50, and only the first transmission members 612A and 622A are slid along the guide grooves 411 and 511 of the brackets 41 and 51. The movement can improve the accuracy of the transmission between the first and second shifters 61, 62 and the first and second rows of pick and placeers 40, 50 to prevent the suction heads 45 of the first and second rows of pick and placeers 40, 50. 55 yaw actuation, so that each of the suction heads 45, 55 is smoothly displaced; further, when the motor 63 suddenly stops rotating from high speed operation, if the first and second rows of the pick and placers 40, 50 are displaced by the inertia force, In the case where the positioning of the motor 63 is affected to cause the positioning error of the motor 63, in order to reduce the error, the X-axis variable pitch mechanism 60 is attached to the first and second variable pitchers 61, 62 or the driving structure. The braking device further reduces the influence of the displacement inertia force of the first and second rows of the pick and placers 40, 50 on the positioning of the motor 63 by using the braking device, so that the motor 63 can be accurately positioned. In the case of high-speed moving, the first and second rows of pick-and-placers 40, 50 adjust the accuracy of the X-axis spacing; when adjusting the Y-axis spacing of the first and second rows of pick-and-placers 40, 50, the Y-axis can be controlled. The motor 71 of the variable pitch mechanism 70 drives the rotating rod 73 via the pulley set 72, and drives the two pulley sets 74 with the rotating rod 73. The two pulley sets 74 drive the transmission frame 75 for Y-axis displacement, because the first column is taken. The splicer 40 is coupled to the carrier 75 by a carriage 415, so that the carrier 75 can drive the first rows of the pickers 40 to be synchronously displaced in the Y-axis, and the pick-ups 40 of the first row are further slipped. The member 414 is displaced along the linkage 67 of the X-axis variable pitch mechanism 60, thereby adjusting the Y-axis spacing of the first and second rows of pick and placeers 40, 50. Further, when the motor 71 suddenly stops rotating from high speed operation, If the first and second rows of the pick-and-place devices 40, 50 have an influence on the positioning of the motor 71 due to the displacement inertia force, and the motor 71 generates a positioning error, in order to reduce the error, the Y-axis variable pitch mechanism is used. 70 can be installed on the driving structure, and then use the brake device to reduce the displacement of the first and second rows of the pick and place devices 40, 50 The influence of the inertial force on the positioning of the motor 71 enables the motor 71 to be accurately positioned to improve the accuracy of adjusting the Y-axis spacing of the first and second rows of pick and placeers 40, 50 in the case of high-speed movement.

Referring to FIG. 10, after the XY axial spacing of the first and second rows of pick and placeers 40, 50 is adjusted, the shifting unit 20 can control the motor 82 of the Z-axis carrying mechanism 80 to pass the Z-axis. The screw threaded set 83 drives the frame 30 to perform Z-axis displacement, and the frame 30 drives the first and second rows of pick-and-placers 40, 50 to synchronously shift the Z-axis to the container with the semiconductor component (Fig. Shown) above.

Referring to Figures 11 and 12, after the first and second rows of pick and place units 40, 50 of the material moving unit 20 are displaced above the container, the motor 42 of each of the pickers 40, 50 can be separately controlled. 52, through the pulley sets 43, 53 to drive the connecting members 44, 54 for Z-axis displacement, each of the connecting members 44, 54 can respectively drive the suction heads 45, 55 for Z-axis displacement, and because of the connecting members 44, 54 One end is slid on the sliding rails 412, 512 of the brackets 41, 51 by the sliding blocks 441, 541, and the other end is slid on the sliding seats 413, 513 of the brackets 41, 51, thereby preventing the connecting member 44. 54 yaw actuation to smoothly drive the suction heads 45, 55 for Z-axis displacement, and take and place the semiconductor component on the container, if the nozzle 45 of a pick-and-placer 40 does not fall to the preset pick and place At the working height, the torsion electronic signal fed back by the electronic control motor 42 can be used to determine whether an abnormality has occurred. Therefore, it is not necessary to install a plurality of sensors to achieve the purpose. After determining that an abnormality occurs, the pick-up device 40 is connected to the motor 42. The suction head 45 is driven by the pulley set 43 and the connecting member 44 for Z-axis displacement, so that the worker can use the electronic control method The control motor 42 is actuated to cause the motor 42 to drive the pulley set 43 and the connecting member 44 again, and the connecting member 44 drives the suction head 45 to perform Z-axis displacement, thereby quickly fine-tuning the pick-and-place operation height of the suction head 45 and alerting the user that there is no need to It takes time and labor to manually adjust the working height of the suction head 45 to achieve the practical benefit of improving the convenience of the work.

Referring to FIG. 13 , an embodiment of the above-described moving unit 20 is disposed in the semiconductor component detecting and sorting machine of the present invention. The detecting sorting machine includes an organic table 90, a feeding device 100, a receiving device 110, a testing device 120, and a conveying device. The air supply device 100 and the central control device are further disposed on the machine 90 for accommodating at least one semiconductor component to be tested. In the embodiment, the feeding device 100 is provided. There is at least one tray 1001 for holding a plurality of semiconductor components to be tested; the receiving device 110 is disposed on the machine 90 for accommodating at least one semiconductor component to be tested. In this embodiment, the receiving device The device 110 is provided with at least one tray 1101 for holding a plurality of completed semiconductor components. The testing device 120 is provided with a test circuit board 1201 having at least one test socket 1202 for testing semiconductor components and a tester (not shown) transmits the test result to a central control device (not shown), and the central control device controls the operation of each device; the transport device is provided with at least one variable-pitch pick-and-place transfer semiconductor component The material feeding unit 20 is the above-mentioned moving material unit for transferring the semiconductor element. In the embodiment, the conveying device is provided with the first feeding stage 1301 and the first part before the testing device 120. A discharge stage 1302 for respectively carrying the semiconductor components to be tested/finished, and a second loading stage 1303 and a second discharging stage 1304 are disposed behind the testing device 120 for respectively carrying The semiconductor component to be tested/finished is further provided with a first crimper 1305 and a second crimper 1306 above the test device 120. The first crimper 1305 is attached to the first inlet and discharge carrier 1301. The semiconductor component to be tested/finished is transferred between 1302 and the test device 120, and the second crimper 1306 is used to transfer the semiconductor to be tested/tested between the second input and discharge carriers 1303, 1304 and the test device 120. And the conveying device is provided with two moving units 20, 20A which are the same as the above-mentioned moving unit (please refer to the drawings of Figures 4, 5, 6, and 7), and the moving unit 20 is connected to the first and second materials. The semiconductor components to be tested are transferred between the stages 1301, 1303 and the feeding device 100, and the other moving unit 20A is attached to the first and second discharging loads. The semiconductor component is transferred between the 1302, 1304 and the receiving device 110, and the empty device 140 is used to receive the empty tray of the feeding device 100, and the empty tray is replenished to the receiving device 110 for Contains the electronic components that have been tested.

Please refer to Figure 14 (please refer to Figures 4, 5, 6, and 7). When performing the inspection operation, the moving unit 20 of the conveying device is displaced to the feeding device 100, and the X-axis variable pitch mechanism is utilized. 60. The Y-axis variable pitch mechanism 70 and the Z-axis carrier mechanism 80 drive the first and second rows of pick and placeers 40, 50 to adjust the XY axial spacing, and take out the test to be tested in the tray 1001 of the feeding device 100. The semiconductor device 150; referring to FIG. 15, after the reclaiming, the first and second rows of the pick and place units 40, 50 of the loading unit 20 adjust the XY axial spacing, and the semiconductor component 150 to be tested is placed and transferred. On the first loading stage 1301; referring to FIG. 16, the first loading stage 1301 is used for X-axis displacement to carry the semiconductor component 150 to be tested to the test device 120, the first crimper. 1305 takes out the semiconductor component 150 to be tested at the first loading stage 1301, and loads the semiconductor component 150 into the test socket 1202 of the testing device 120 to perform a test operation. The test circuit board 1201 of the testing device 120 The test signal is transmitted to the tester, and the tester transmits the test result to the central control unit; see 17 , after the test operation is completed, the first crimper 1305 is taken out of the test socket 1202 to take out the tested semiconductor component 150, and the finished semiconductor component 150 is transferred onto the first discharge carrier 1302. Referring to FIG. 18, the first discharge stage 1302 carries out the tested semiconductor component 150, and the first and second rows of pick and place units 40A, 50A of the other transfer unit 20A adjust the XY axial spacing, and The semiconductor component 150 is taken out from the first discharging stage 1302, and according to the test result, the moving unit 20A is displaced to the receiving device 110, and the first and second rows of the pick-and-place unit 40A of the moving unit 20A, The 50A re-adjusts the XY axial spacing to place the finished semiconductor component 150 into the tray 1101 of the receiving device 110 to complete the sorting and receiving operation.

Accordingly, the shifting unit of the detecting and sorting machine of the present invention can adjust the XY axial spacing of at least the first and second rows of pick and place devices to improve the use efficiency and shorten the working time, which is a practical and progressive design. However, the same products and publications have not been disclosed, so that the requirements for invention patent applications are allowed, and the application is filed according to law.

[知知]

11. . . frame

12. . . Z axial motor

13. . . Z-axis pulley set

14. . . Bearing board

15. . . X-axis motor

16. . . X-axis pulley set

17. . . Link

18. . . Pick and place

181. . . Z axial pressure cylinder

182. . . Tip

19. . . Container

191. . . Locating slot

A. . . Semiconductor component

[this invention]

20, 20A. . . Transfer unit

30. . . frame

301. . . Slide rail

302. . . Slide rail

40, 40A. . . Pick and place

41. . . Shelf

411. . . Guide slot

412. . . Slide rail

413. . . Slide

414. . . Slipper

415. . . Slide

42. . . motor

43. . . Pulley set

44. . . Link

441. . . Slide

45. . . Tip

50, 50A. . . Pick and place

51. . . Shelf

511. . . Guide slot

512. . . Slide rail

513. . . Slide

52. . . motor

53. . . Pulley set

54. . . Link

541. . . Slide

55. . . Tip

60. . . X axial variable pitch mechanism

61. . . First pitcher

611. . . link

612A. . . First transmission

612B. . . Second transmission

62. . . Second pitcher

621. . . link

622A. . . First transmission

622B. . . Second transmission

63. . . motor

64. . . Pulley set

65. . . Rotating rod

66. . . Pulley set

67. . . Linkage

671. . . Slide

70. . . Y axial variable pitch mechanism

71. . . motor

72. . . Pulley set

73. . . Rotating rod

74. . . Pulley set

75. . . Drive frame

751. . . Slide

80. . . Z axial carrier

81. . . Carrier

82. . . motor

83. . . Z axial screw set

90. . . Machine

100. . . Feeding device

1001. . . Trays

110. . . Receiving device

1101. . . Trays

120. . . Test device

1201. . . Test board

1202. . . Test stand

1301. . . First feeding stage

1302. . . First discharge stage

1303. . . Second feeding stage

1304. . . Second discharge stage

1305. . . First crimper

1306. . . Second crimper

140. . . Open device

150. . . Semiconductor component

Figure 1: Schematic diagram of the structure of the patent No. 96117901 of Taiwan.

Figure 2: Schematic diagram of the use of the patent No. 96117901 of Taiwan (1).

Figure 3: Schematic diagram of the use of the patent No. 96117901 of Taiwan (2).

Fig. 4 is a view showing the appearance of a material moving unit of the sorting machine of the present invention.

Figure 5: Front view of the transfer unit of the present invention.

Figure 6: Top view of the transfer unit of the present invention.

Figure 7: A partial side view of the transfer unit of the present invention.

Figure 8: Schematic diagram of the use of the transfer unit of the present invention (I).

Figure 9: Schematic diagram of the use of the transfer unit of the present invention (2).

Figure 10: Schematic diagram of the use of the transfer unit of the present invention (3).

Figure 11: Schematic diagram of the use of the transfer unit of the present invention (4).

Figure 12: Schematic diagram of the use of the transfer unit of the present invention (5).

Figure 13 is a schematic view showing the configuration of each device of the detection sorting machine of the present invention.

Figure 14: Schematic diagram of the use of the detection sorter of the present invention (1).

Figure 15: Schematic diagram of the use of the detection sorter of the present invention (2).

Figure 16: Schematic diagram of the use of the detection sorter of the present invention (3).

Figure 17: Schematic diagram of the use of the detection sorter of the present invention (4).

Figure 18: Schematic diagram of the use of the detection sorting machine of the present invention (5).

30. . . frame

301. . . Slide rail

40. . . Pick and place

41. . . Shelf

412. . . Slide rail

413. . . Slide

414. . . Slipper

415. . . Slide

42. . . motor

43. . . Pulley set

44. . . Link

441. . . Slide

45. . . Tip

50. . . Pick and place

51. . . Shelf

512. . . Slide rail

513. . . Slide

52. . . motor

53. . . Pulley set

54. . . Link

541. . . Slide

55. . . Tip

60. . . X axial variable pitch mechanism

61. . . First pitcher

611. . . link

612A. . . First transmission

612B. . . Second transmission

62. . . Second pitcher

621. . . link

622A. . . First transmission

622B. . . Second transmission

66. . . Pulley set

67. . . Linkage

671. . . Slide

75. . . Drive frame

80. . . Z axial carrier

81. . . Carrier

82. . . motor

83. . . Z axial screw set

Claims (10)

A semiconductor component detecting and sorting machine, comprising: a machine; a feeding device disposed on the machine for accommodating at least one semiconductor component to be tested; and a receiving device disposed on the machine for accommodating at least one The semiconductor device is tested; the test device is disposed on the machine table, and is provided with a test circuit board having at least one test socket for detecting the semiconductor component; and the conveying device is disposed on the machine table and provided with at least one a shifting unit for shifting and transferring the semiconductor component, the loading unit comprises a frame, at least one column of pick-and-placers and an X-axis variable pitch mechanism, and each of the pick and place devices of the at least one column of pick and place devices is respectively provided with a The motor is supported by the frame, and the motor drives at least one transmission group, and the transmission group drives at least one suction head for Z-axis displacement for picking and placing semiconductor components, and the X-axis variable pitch mechanism is mounted on the frame. And at least one variable distance device capable of performing X-axis expansion and contraction, wherein the variable distance device is provided with a plurality of connecting rods arranged in a cross-pivoting arrangement, and each of the connecting rods is connected to drive at least one column of pick and place devices for the X-axis. Displacement; central control unit: for use And integration control means of each actuator to perform automatic operation. The semiconductor component inspection and sorting machine according to the first aspect of the invention, wherein the motor of the pick and place device drives a transmission group of a pulley set, the pulley set is coupled to the connecting piece, and the connecting piece is coupled to drive at least one suction head. Make Z axial displacement. The semiconductor component inspection and sorting machine according to claim 2, wherein an auxiliary sliding structure is provided between the connecting member of the pick-and-placer and the bracket for preventing the joint from being yawed, and the auxiliary sliding structure is A sliding portion and a sliding portion are provided between the one end of the connecting member and the bracket, and a sliding portion is provided at a position corresponding to the other end of the supporting member for sliding the connecting member. The semiconductor component inspection and sorting machine according to the first aspect of the invention, wherein the carrier of each of the pick-and-place devices is provided with a guide groove, and the variable distance device of the X-axis variable pitch mechanism is provided with a plurality of branches The rods are arranged in a pivotal manner, and the first transmission member and the second transmission member are respectively disposed at two ends of each of the connecting rods, and the first transmission member is attached to the guide groove of the carrier of the pick and place device for Z-axis displacement The second transmission member is pivotally positioned on the carrier. The semiconductor component inspection and sorting machine according to claim 1, wherein the X-axis variable pitch mechanism is provided with a driving structure on the frame, and the driving structure is provided with a driving source on the frame for At least one drive train is driven, and the drive train is coupled to drive the pick and place. The semiconductor component inspection and sorting machine according to claim 5, wherein the driving structure is provided with a driving source for the motor on the frame, and the motor is driven by the transmission group of the pulley group, and is driven by the pulley set. The rotating rod and the rotating rod are connected to drive another driving group which can be a pulley group, and the carrier of each of the pickers is provided with a linkage frame which can be connected to another pulley group, and the X-axis variable distance mechanism is attached to A brake device is mounted on the pitch changer or the drive structure to assist in motor positioning. The semiconductor component inspection and sorting machine according to claim 1, wherein the moving unit is provided with at least first and second rows of pick and place devices, and a Y-axis variable pitch mechanism is disposed on the frame. The Y-axis variable pitch mechanism is equipped with a driving structure on the frame for driving at least one transmission frame for Y-axis displacement, and the transmission frame is coupled to drive at least one column of the pick-and-place device for Y-axis displacement, the X-axis transformation The driving mechanism is provided with a driving structure on the frame, the driving structure is provided with a driving source on the frame for driving at least one transmission group, and the connecting transmission group is disposed on the frame of the at least one column of the pick-and-place device. Linkage. The semiconductor component inspection and sorting machine according to claim 7, wherein the driving structure of the Y-axis variable pitch mechanism is provided with a driving source for the motor on the frame, and the motor drive can be a transmission of the pulley set. The pulley set is driven by the rotating rod, and the rotating rod is driven by at least one transmission group of the pulley set, the pulley set is coupled to drive the transmission frame for Y axial displacement, and the transmission frame is coupled to drive at least one column of the pick and place device for Y axial direction. Displacement, the driving structure of the X-axis variable pitch mechanism is provided with a driving source for the motor on the frame, the motor drive can be a transmission group of the pulley set, and the rotating rod is driven by the pulley set, and the rotating rod is coupled to drive another For the transmission group of the pulley set, the linkage frame of the connecting pulley set is arranged on the frame of the second row of pick-and-placers, and is arranged on the carrier of the first row of pick-and-placers to be slidably placed on the linkage frame. The sliding member, the X-axis variable-distance mechanism is equipped with a braking device on the variable-distance or driving structure for assisting the positioning of the motor, and the Y-axis variable-distance mechanism is equipped with a braking device on the driving structure for assisting Motor positioning. The semiconductor component inspection and sorting machine according to the seventh aspect of the invention, wherein the transmission frame is a slide rail, and the pick-up device is attached to the carrier with a sliding member as a sliding seat, and is placed on the sliding seat. On the drive frame. The semiconductor component inspection and sorting machine according to claim 1, further comprising a Z-axis carrying mechanism, wherein the Z-axis carrying mechanism is provided with a driving source on a carrier to drive at least A transmission group, the transmission group is coupled to the frame for driving the frame, at least one column of pick-and-place devices and the X-axis variable pitch mechanism for synchronous Z-axis displacement.