TW201323817A - 散熱器 - Google Patents

散熱器 Download PDF

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Publication number
TW201323817A
TW201323817A TW100146011A TW100146011A TW201323817A TW 201323817 A TW201323817 A TW 201323817A TW 100146011 A TW100146011 A TW 100146011A TW 100146011 A TW100146011 A TW 100146011A TW 201323817 A TW201323817 A TW 201323817A
Authority
TW
Taiwan
Prior art keywords
heat
heat dissipation
base
dissipation fins
body portion
Prior art date
Application number
TW100146011A
Other languages
English (en)
Inventor
Chao-Ke Wei
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW100146011A priority Critical patent/TW201323817A/zh
Priority to US13/337,313 priority patent/US20130146269A1/en
Publication of TW201323817A publication Critical patent/TW201323817A/zh

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一種散熱器,包括一底座及複數自底座向上垂直延伸形成的散熱鰭片,底座包括一本體部,本體部的橫截面概呈梯形,本體部的兩側各設一傾斜的導風面,該散熱鰭片包括複數平行的第一散熱鰭片及分別位於第一散熱鰭片兩側的第二散熱鰭片,每一第二散熱鰭片包括一延伸自底座並與第一散熱鰭片平行的散熱部以及自散熱部的兩端分別傾斜向外延伸形成的兩擋風板。

Description

散熱器
本發明涉及一種散熱器。
目前,通常利用散熱器附著於伺服器等電子裝置內的發熱的電子元件(如中央處理器)上對電子元件進行散熱。隨著IT產業的快速發展,電子元件的高速、高頻及集成化使其發熱量劇增,需要更加利於散熱的高效能的散熱器。
鑒於以上內容,有必要提供一種更加利於散熱的散熱器。
一種散熱器,包括一底座及複數自底座向上垂直延伸形成的散熱鰭片,底座包括一本體部,本體部的橫截面概呈梯形,本體部的兩側各設一傾斜的導風面,該等散熱鰭片包括複數平行的第一散熱鰭片及分別位於第一散熱鰭片兩側的第二散熱鰭片,每一第二散熱鰭片包括一延伸自底座並與第一散熱鰭片平行的散熱部以及自散熱部的兩端分別傾斜向外延伸形成的兩擋風板。
相較習知技術,本發明散熱器利用兩第二散熱鰭片的位於同一端的兩擋風板共同形成一擴口,用於增大流經散熱鰭片的風量,利於散熱,本體部的傾斜的導風面在風流經過時可有效減少風阻,利於風流通過。
請參照圖1至圖3,本發明散熱器包括一底座10、複數自底座10向上垂直延伸形成的散熱鰭片20以及複數散熱管30。
底座10包括一本體部12以及分設於本體部12四角的四個固定部14。本體部12的橫截面概呈梯形,本體部12的兩側各設一傾斜的導風面122。每一固定部14開設一固定孔142用於將散熱器固定於主機板(圖未示)上。
散熱鰭片20包括複數平行的第一散熱鰭片22及分別位於該等第一散熱鰭片22兩側的一第二散熱鰭片24。每一第二散熱鰭片24包括一延伸自本體部12並與第一散熱鰭片22平行的散熱部242以及自散熱部242的兩端分別傾斜向外延伸形成的兩擋風板244。
每一散熱管30概呈U形,其包括一固定於本體部12的基部31、自基部31垂直向上延伸形成的第一導熱部32及自第一導熱部32的頂端延伸形成的平行於本體部12的第二導熱部33。第二導熱部33垂直穿設於各個第一散熱鰭片22。
本實施方式中,兩第二散熱鰭片24的位於同一端的兩擋風板244共同形成一擴口,用於增大流經散熱鰭片20的風量。本體部12的傾斜的導風面122在風流經過時可有效減少風阻,利於風流通過。
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
10...底座
12...本體部
122...導風面
14...固定部
142...固定孔
20...散熱鰭片
22...第一散熱鰭片
24...第二散熱鰭片
242...散熱部
244...擋風板
30...散熱管
31...基部
32...第一導熱部
33...第二導熱部
圖1為本發明散熱器的具體實施方式的立體組合圖。
圖2為圖1中散熱器的底座及散熱管的立體放大圖。
圖3為圖1中沿III-III方向的剖視圖。
10...底座
20...散熱鰭片
22...第一散熱鰭片
24...第二散熱鰭片
242...散熱部
244...擋風板

Claims (4)

  1. 一種散熱器,包括一底座及複數自底座向上垂直延伸形成的散熱鰭片,底座包括一本體部,本體部的橫截面概呈梯形,本體部的兩側各設一傾斜的導風面,該等散熱鰭片包括複數平行的第一散熱鰭片及分別位於第一散熱鰭片兩側的一第二散熱鰭片,每一第二散熱鰭片包括一延伸自底座並與第一散熱鰭片平行的散熱部以及自散熱部的兩端分別傾斜向外延伸形成的兩擋風板。
  2. 如申請專利範圍第1項所述之散熱器,其中本體部的四角各設一固定部。
  3. 如申請專利範圍第1項所述之散熱器,其中本體部上設有複數穿設於第一散熱鰭片的散熱管。
  4. 如申請專利範圍第3項所述之散熱器,其中每一散熱管概呈U形,其包括一固定於本體部的基部、自基部垂直向上延伸形成的第一導熱部及自第一導熱部的頂端延伸形成的平行於本體部並垂直穿設於各個第一散熱鰭片的第二導熱部。
TW100146011A 2011-12-13 2011-12-13 散熱器 TW201323817A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100146011A TW201323817A (zh) 2011-12-13 2011-12-13 散熱器
US13/337,313 US20130146269A1 (en) 2011-12-13 2011-12-27 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100146011A TW201323817A (zh) 2011-12-13 2011-12-13 散熱器

Publications (1)

Publication Number Publication Date
TW201323817A true TW201323817A (zh) 2013-06-16

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US (1) US20130146269A1 (zh)
TW (1) TW201323817A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107454807A (zh) * 2017-09-01 2017-12-08 昆山新力精密五金有限公司 高性能连续模组散热器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI291093B (en) * 2006-01-24 2007-12-11 Ama Precision Inc Heat exchange module
US7766074B2 (en) * 2006-05-12 2010-08-03 Cpumate Inc. Heat-dissipating device having air-guiding structure
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
CN101202529A (zh) * 2006-12-11 2008-06-18 丹佛斯传动有限公司 电子装置及电动机变频器
US7729119B2 (en) * 2007-11-28 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107454807A (zh) * 2017-09-01 2017-12-08 昆山新力精密五金有限公司 高性能连续模组散热器
CN107454807B (zh) * 2017-09-01 2023-12-01 昆山新力精密五金有限公司 高性能连续模组散热器

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