TW201318984A - Method of manufacturing a touch panel - Google Patents

Method of manufacturing a touch panel Download PDF

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Publication number
TW201318984A
TW201318984A TW101104986A TW101104986A TW201318984A TW 201318984 A TW201318984 A TW 201318984A TW 101104986 A TW101104986 A TW 101104986A TW 101104986 A TW101104986 A TW 101104986A TW 201318984 A TW201318984 A TW 201318984A
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glass substrate
touch panel
manufacturing
panel according
strengthening
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TW101104986A
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Chinese (zh)
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TWI478881B (en
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Yuh-Wen Lee
Yea-Wan Chen
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Tpk Touch Solutions Xiamen Inc
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B32/00Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/039Accessories therefor, e.g. mouse pads
    • G06F3/0393Accessories for touch pads or touch screens, e.g. mechanical guides added to touch screens for drawing straight lines, hard keys overlaying touch screens or touch pads
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Position Input By Displaying (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The present disclosure relates to a method of manufacturing a touch panel, and more particularly, to a manufacturing method capable of strengthening the strength of the touch panel. The method comprises: sinking and then strengthening a glass substrate, and then conducting a manufacturing process of placing a sensing electrode array. Finally, the glass substrate is cut and produced into several touch panels, each having strengthening properties.

Description

觸控面板的製造方法Touch panel manufacturing method

本發明有關於一種觸控面板的製造方法,特別涉及一種可強化觸控面板強度的製造方法。The present invention relates to a method of manufacturing a touch panel, and more particularly to a manufacturing method capable of strengthening the strength of a touch panel.

目前常見的觸控面板(Touch Panel),除了佈設有感測電極陣列的基板之外,通常還會設計有一層保護用的玻璃蓋板(Cover Lens)。而隨著觸控技術的發展,感測電極陣列可直接佈設於保護用的玻璃蓋板上,以形成所謂的單板觸控面板(Touch on Lens)。由於作為保護用的玻璃蓋板必須具備避免容易因外力影響而損毀的條件,因此玻璃的強化處理是觸控面板製程中不可缺少的重要環節。At present, a common touch panel (Touch Panel) is usually provided with a cover glass cover (Cover Lens) in addition to the substrate on which the sensing electrode array is disposed. With the development of the touch technology, the sensing electrode array can be directly disposed on the protective glass cover to form a so-called touch-on-board (Touch on Lens). Since the glass cover plate for protection must be provided with conditions that are easily damaged by external force, the strengthening treatment of the glass is an indispensable important part in the process of the touch panel.

請參閱圖1,為揭示習知技術玻璃強化方法的流程圖。Please refer to FIG. 1 for a flow chart of a conventional glass reinforced method.

步驟S1:裁切。根據所欲製成的玻璃的尺寸規格,使用數值控制(Numerical Control,NC)機具的刀輪、刀具或鐳射光束,將一母玻璃裁切成若干片的子玻璃。Step S1: Cutting. A mother glass is cut into a plurality of pieces of sub-glass according to the size specifications of the glass to be produced, using a cutter wheel, a cutter or a laser beam of a numerical control (NC) machine.

步驟S2:修整。使用電腦數值控制(Computerized Numerical Control,CNC)機具,逐一研磨所述裁切後的子玻璃的四周端邊,以去除裁切製程所造成的毛邊、細裂痕等,並且修整出包含倒角(Chamfer Angle)的端邊形狀,以進一步減少與機構件組裝時因碰撞擠壓而產生破裂的機會。Step S2: Trimming. Using a computerized numerical control (CNC) machine, the peripheral edges of the cut sub-glass are ground one by one to remove burrs, fine cracks, etc. caused by the cutting process, and trimmed to include chamfers (Chamfer Angle's end shape to further reduce the chance of cracking due to collisional compression during assembly of the machine components.

步驟S3:強化處理。採用化學強化方式,將所述已修整完成的子玻璃進行表面強化。Step S3: Strengthening the processing. The finished sub-glass is surface-strengthened by chemical strengthening.

然而,在單板觸控面板的製程上,佈設感測電極陣列的製程(圖案化製程)必須是在玻璃蓋板經過上述強化處理之後進行,藉此避免因化學強化過程破壞感測電極陣列。但是如果單板觸控面板的製程是採用上述習知技術玻璃強化的方法,那麼一次便只能針對一片單板觸控面板來進行圖案化製程。如此一來,將導致生產效能不彰,無法大量生產。However, in the process of the single-panel touch panel, the process of patterning the sensing electrode array (patterning process) must be performed after the glass cover is subjected to the above-described strengthening treatment, thereby avoiding destruction of the sensing electrode array by the chemical strengthening process. However, if the process of the single-panel touch panel is a glass-reinforced method using the above-mentioned conventional technology, the patterning process can be performed only for one single-plate touch panel at a time. As a result, production performance will be ineffective and mass production will not be possible.

有鑑於此,本發明透過製程上的步驟改善,先設計倒角(Chamfer Angle)的斜切面,再依序進行強化、感測電極陣列的佈設與裁切等步驟,進而解決單板觸控面板無法大量生產的問題。In view of the above, the present invention improves the steps on the process, first designs the chamfered surface of the chamfer angle, and then sequentially performs the steps of strengthening and sensing the arrangement and cutting of the electrode array, thereby solving the single-layer touch panel. Problems that cannot be mass produced.

根據本發明的一實施例,提供一種觸控面板的製造方法,其步驟包括:於一玻璃基板凹陷成形至少一凹槽,其中所述的凹槽包含一底邊及兩斜面側邊;接著,表面強化所述玻璃基板;進而,依據該底邊之位置來裁切該玻璃基板。According to an embodiment of the invention, a method for manufacturing a touch panel includes: forming at least one recess in a glass substrate, wherein the recess includes a bottom edge and two bevel sides; and then, The glass substrate is surface-reinforced; further, the glass substrate is cut according to the position of the bottom edge.

進一步的,所述凹槽是成對設計,並對應地凹陷成形於玻璃基板的一上表面及一下表面。Further, the grooves are in a paired design and are correspondingly concavely formed on an upper surface and a lower surface of the glass substrate.

進一步的,上述底邊實質為一平面或弧凹面。Further, the bottom edge is substantially a plane or an arc concave surface.

進一步的,所述玻璃基板是透過蝕刻、刻劃或機械製模來凹陷成形所述的凹槽。Further, the glass substrate is recessed to form the groove by etching, scoring or mechanical molding.

進一步的,所述表面強化玻璃基板的步驟是採用化學強化之方式。Further, the step of surface-strengthening the glass substrate is by chemical strengthening.

進一步的,所述裁切該玻璃基板的步驟是包含形成一裁切面。Further, the step of cutting the glass substrate comprises forming a cutting surface.

進一步的,所述斜面側邊是相接於玻璃基板表面與裁切面之間,以形成一倒角。Further, the side of the inclined surface is in contact with the surface of the glass substrate and the cutting surface to form a chamfer.

進一步的,在所述裁切該玻璃基板的步驟之後,還包含平滑化該裁切面。Further, after the step of cutting the glass substrate, further comprising smoothing the cutting surface.

進一步的,在所述表面強化玻璃基板的步驟後,還包含佈設一感測電極陣列於玻璃基板表面。Further, after the step of tempering the glass substrate, the method further comprises disposing a sensing electrode array on the surface of the glass substrate.

承上所述,由於本發明在裁切該玻璃基板之前,玻璃基板得以一次性地佈設感測電極陣列。因此,本發明之設計能應用於量產製程,並且讓所製成的單板觸控面板得以同時具有倒角設計、化學強化等強度強化之特性。As described above, since the present invention cuts the glass substrate, the glass substrate can be disposed with the sensing electrode array at one time. Therefore, the design of the present invention can be applied to a mass production process, and the formed single-panel touch panel can simultaneously have the characteristics of strength enhancement such as chamfering design and chemical strengthening.

以上所述之技術手段及其產生功效的具體實施細節,請參照下列實施例及圖式加以說明。For the specific implementation details of the above-mentioned technical means and the efficacy thereof, please refer to the following embodiments and drawings.

【實施例】[Examples]

請合併參閱圖2及圖3。其中,圖2揭示本發明觸控面板的製造方法的實施例流程圖;圖3包含(a)結構至(f)結構,分別用來對應揭示圖2所示之方法步驟中的構造示意圖。如圖所示,本實施例之觸控面板的製造方法的步驟包括:Please refer to Figure 2 and Figure 3. 2 is a flow chart of an embodiment of a method for manufacturing a touch panel of the present invention; and FIG. 3 includes structures (a) to (f) for respectively showing a schematic configuration of the method steps shown in FIG. As shown in the figure, the steps of the method for manufacturing the touch panel of the embodiment include:

步驟S10:凹陷成形(Sinking)。根據所欲製成的觸控面板的尺寸規格,於一玻璃基板100進行一凹陷成形至少一凹槽103的加工製程,用來在玻璃基板100上劃分出如矩陣排列的多個區域。其中,每一凹槽103(如圖3所示),包含一底邊1031及兩斜面側邊1032。而本實施例所述的凹陷成形之加工製程可例如圖3中的(a)結構至(b)結構所示,是採用藥劑或雷射來蝕刻一平面的玻璃基板100,以形成凹槽103。當然在實際設計上,亦可採用機械刀具來刻劃平面的玻璃基板100,以形成凹槽103;或者直接採用機械製模來進行一體成形具有凹槽103之玻璃基板100的加工製程方式,在此並非為本發明所限制。Step S10: Sinking. According to the size specification of the touch panel to be formed, a process for recessing and forming at least one groove 103 on a glass substrate 100 is used to divide a plurality of regions arranged in a matrix on the glass substrate 100. Each of the grooves 103 (shown in FIG. 3) includes a bottom edge 1031 and two beveled sides 1032. For example, the processing of the recess forming process in the embodiment can be, for example, the structure of (a) to (b) in FIG. 3, and the glass substrate 100 is etched by a chemical or laser to form the groove 103. . Of course, in actual design, a mechanical cutter can also be used to scribe the planar glass substrate 100 to form the groove 103; or a mechanical molding process can be used to integrally form the glass substrate 100 having the groove 103. This is not a limitation of the invention.

如圖3所示,本實施例所設計的凹槽103是成對的設計,以對應地凹陷成形於玻璃基板100的一上表面101及一下表面102,以形成上、下倒置的架構。其中,凹槽103的底邊1031可依實際製程需求而採用一平面或一弧凹面的設計,並且本實施例之凹槽103的任一斜面側邊1032與玻璃基板100的上表面101或下表面102之間相接出的夾角θ1是呈現出大於九十度的角度,藉以減少應力集中的現象。As shown in FIG. 3, the grooves 103 designed in this embodiment are in a paired design to be correspondingly recessed and formed on an upper surface 101 and a lower surface 102 of the glass substrate 100 to form an upper and lower inverted structure. The bottom edge 1031 of the groove 103 can adopt a plane or an arc concave design according to actual process requirements, and any beveled side 1032 of the groove 103 of the embodiment and the upper surface 101 or the lower surface of the glass substrate 100 The angle θ1 that is brought into contact between the surfaces 102 is an angle that exhibits more than ninety degrees, thereby reducing the phenomenon of stress concentration.

步驟S20:表面強化處理。如圖3中的(c)結構所示,本實施例是例如採用化學強化的方式來對上述已凹陷成形完成的整片玻璃基板100進行表面強化處理,藉以讓玻璃基板100的表面區域(包含上表面101、下表面102以及每一凹槽103的底邊1031與兩斜面側邊1032)皆因發生離子交換現象而形成離子交換層105,進而達到強度強化的目的。Step S20: Surface strengthening treatment. As shown in the structure (c) of FIG. 3, the present embodiment is a surface strengthening treatment of the entire recessed glass substrate 100 by chemical strengthening, for example, so that the surface area of the glass substrate 100 (including The upper surface 101, the lower surface 102, and the bottom edge 1031 and the two beveled sides 1032 of each of the grooves 103 form an ion exchange layer 105 due to ion exchange, thereby achieving strength strengthening.

接下來,在完成上述表面強化處理後,由於本實施例是用來說明觸控面板的製造過程,因此在強化後的玻璃基板100的上表面101及/或下表面102上即可進行佈設形成一感測電極陣列,也就是所謂的圖案化製程。然而,所屬技術領域具有通常知識者可以了解圖案化製程的詳細製造流程,在此便不再加以贅述。並且感測電極陣列可例如是由單層導電層或雙層導電層所架構成的結構,在此並無加以限制。Next, after the surface strengthening treatment is completed, since the present embodiment is used to explain the manufacturing process of the touch panel, the upper surface 101 and/or the lower surface 102 of the strengthened glass substrate 100 can be formed on the surface. A sensing electrode array, also known as a patterning process. However, those skilled in the art can understand the detailed manufacturing process of the patterning process, and will not be described again here. And the sensing electrode array can be, for example, a structure composed of a single-layer conductive layer or a double-layer conductive layer, which is not limited herein.

請參考圖4,為本發明玻璃基板佈設感測電極陣列的實施例俯視示意圖。其中,由於圖4之實施例是用來揭示由單層導電層所架構成的感測電極陣列108,因此感測電極陣列108是形成於玻璃基板100的上表面101或下表面102。如圖4所示,玻璃基板100上雖因凹槽103而劃分出矩陣排列的多個區域,但仍可針對整個玻璃基板100上的所有區域進行一次性地圖案化製程,以達到大量生產的目的。Please refer to FIG. 4 , which is a schematic top view of an embodiment of a method for arranging a sensing electrode array on a glass substrate of the present invention. Wherein, since the embodiment of FIG. 4 is used to disclose the sensing electrode array 108 composed of a single conductive layer, the sensing electrode array 108 is formed on the upper surface 101 or the lower surface 102 of the glass substrate 100. As shown in FIG. 4, although a plurality of regions of a matrix arrangement are divided by the grooves 103 on the glass substrate 100, a one-time patterning process can be performed for all regions on the entire glass substrate 100 to achieve mass production. purpose.

此外,在本發明的一實施例中,在佈設感測電極陣列的步驟之前,但不限於在表面強化處理的步驟之前或之後,更可進一步於玻璃基板100表面進行抗眩、抗菌等處理,以讓用來作為保護用之玻璃基板100更具有抗眩、抗菌等效果。In addition, in an embodiment of the present invention, before the step of arranging the sensing electrode array, but not limited to before or after the step of surface strengthening treatment, anti-glare, antibacterial and the like may be further processed on the surface of the glass substrate 100. The glass substrate 100 used for protection is more resistant to glare, antibacterial, and the like.

請複參閱圖2及圖3。Please refer to Figure 2 and Figure 3.

步驟S30:裁切。如圖3的(d)結構至(f)結構所示,本實施例是採用數值控制(NC)機具來對已佈設有感測電極陣列的玻璃基板100進行裁切加工。具體而言,本實施例利用數值控制機具的刀輪、刀具或鐳射光束來裁切該玻璃基板100。進一步而言,步驟S30在裁切時,是依據該底邊1031的位置,來裁切該玻璃基板100,藉以去除該底邊1031,進而在每一裁切成的觸控面板110上形成一裁切面106。其中,裁切面106是相接於斜面側邊1032,且裁切面106與斜面側邊1032之間相接出的夾角θ2亦呈現出大於九十度的角度,以減少應力集中的現象。此外,更重要的是,本實施例透過所預先成形的斜面側邊1032之設計,玻璃基板100的上表面101及下表面102即可分別與裁切面106之間形成一倒角(Chamfer Angle)104,也就是俗稱的C角,藉以當日後觸控面板110與機構件組裝時得以減少因碰撞擠壓而產生破裂的機會。Step S30: cutting. As shown in the structure (d) of FIG. 3 to the structure (f), the present embodiment uses a numerical control (NC) tool to perform a cutting process on the glass substrate 100 on which the sensing electrode array is disposed. Specifically, the present embodiment cuts the glass substrate 100 using a cutter wheel, a cutter or a laser beam of a numerical control implement. Further, in the step S30, the glass substrate 100 is cut according to the position of the bottom edge 1031, thereby removing the bottom edge 1031, and forming a cut surface on each of the cut touch panels 110. Cut face 106. Wherein, the cutting surface 106 is in contact with the inclined side 1032, and the angle θ2 between the cutting surface 106 and the inclined side 1032 also exhibits an angle greater than ninety degrees to reduce the phenomenon of stress concentration. In addition, more importantly, in the present embodiment, the upper surface 101 and the lower surface 102 of the glass substrate 100 can form a chamfer angle with the cutting surface 106 respectively through the design of the pre-formed bevel side 1032. 104, also known as the C-corner, is used to reduce the chance of cracking due to collisional compression when the touch panel 110 is assembled with the machine components.

附帶一提的是,本實施例之凹槽103所成形的凹陷程度並無加以限制,較佳的設計是讓上、下對應的兩凹槽103之間的距離越短越好,也就是讓裁切面106的長度越短越好,如此以利裁切製程的進行。It should be noted that the degree of depression formed by the groove 103 of the embodiment is not limited. The preferred design is to make the distance between the upper and lower corresponding grooves 103 as short as possible, that is, let The shorter the length of the cutting surface 106, the better, so as to facilitate the cutting process.

此外,倘若裁切製程造成在裁切面106上形成毛邊、細裂痕等現象時,本實施例更可進一步使用電腦數值控制(CNC)機具的研磨輪或其它整平工具或設備來進行平滑化裁切面106的處理,以去除該毛邊、細裂痕等現象。In addition, if the cutting process causes a phenomenon of burrs, fine cracks, and the like on the cutting surface 106, the embodiment can further perform smoothing using a grinding wheel or other leveling tool or device of a computer numerical control (CNC) tool. The face 106 is treated to remove such burrs, fine cracks, and the like.

經由上述所載之詳細內容,通常知識者即可據以實施本發明,並製成保留有多數強度的單板觸控面板110。本發明所稱的強度,泛指觸控面板110在承受外力作用下所能抵抗永久變形或破壞的抗撓(彎)強度、抗壓強度及抗拉強度。Through the above-mentioned details, the inventors can generally implement the present invention and make a single-panel touch panel 110 that retains most of the strength. The strength referred to in the present invention generally refers to the flexural (bending) strength, compressive strength and tensile strength of the touch panel 110 which can resist permanent deformation or damage under the action of external force.

綜上所述,本發明透過在未裁切之前的玻璃基板上直接成形出所需的倒角(Chamfer Angle)之斜切面,進而再進行整片玻璃基板的表面強化,並在佈設完感測電極陣列之後,才進行裁切。如此一來,得以讓所製成的單板觸控面板同時具有倒角設計、化學強化等強度強化之特性。此外由於本發明在強化製程或佈設感測電極陣列製程上都是維持整片玻璃基板的完整來對多個觸控面板進行一次性的加工處理,因此更可適用於同時需提供保護功能及觸控感測功能的單板觸控面板的大量生產流程。In summary, the present invention directly forms a chamfered surface of a chamfer angle directly on a glass substrate before being cut, and then performs surface strengthening of the entire glass substrate, and performs sensing after being disposed. The cutting is performed after the electrode array. In this way, the fabricated single-panel touch panel has the characteristics of strength enhancement such as chamfering design and chemical strengthening. In addition, since the present invention maintains the integrity of the entire glass substrate in the process of strengthening the process or routing the sensing electrode array to perform one-time processing on the plurality of touch panels, it is more suitable for providing protection functions and touches at the same time. Mass production process of single-panel touch panel with sensing function.

以上實施例僅為表達了本發明的幾種實施方式,但並不能因此而理解為對本發明專利範圍的限制。應當指出的是,對於本發明所屬技術領域中具有通常知識者而言,在不脫離本發明構思的前提下,還可以做出複數變形和改進,這些都屬於本發明的保護範圍。因此,本發明應以申請專利範圍中限定的請求項內容為準。The above embodiments are merely illustrative of several embodiments of the invention, but are not to be construed as limiting the scope of the invention. It should be noted that various modifications and improvements may be made without departing from the spirit and scope of the invention. Therefore, the present invention should be based on the content of the claims defined in the scope of the patent application.

100...玻璃基板100. . . glass substrate

101...上表面101. . . Upper surface

102...下表面102. . . lower surface

103...凹槽103. . . Groove

1031...底邊1031. . . Bottom edge

1032...斜面側邊1032. . . Beveled side

104...倒角104. . . Chamfer

105...離子交換層105. . . Ion exchange layer

106...裁切面106. . . Cutting surface

108...感測電極陣列108. . . Sense electrode array

110...觸控面板110. . . Touch panel

θ1、θ2...夾角Θ1, θ2. . . Angle

S1至S3...圖1流程圖之步驟說明S1 to S3. . . Steps of the flow chart of Figure 1

S10至S30...圖2流程圖之步驟說明S10 to S30. . . Step 2 of the flow chart of Figure 2

圖1是習知技術玻璃強化方法的流程圖;1 is a flow chart of a prior art glass strengthening method;

圖2是本發明觸控面板的製造方法的實施例流程圖;2 is a flow chart of an embodiment of a method of manufacturing a touch panel of the present invention;

圖3是對應圖2所示之方法步驟中的玻璃基板的構造實施例示意圖;及3 is a schematic view showing a configuration example of a glass substrate corresponding to the method steps shown in FIG. 2;

圖4是本發明玻璃基板佈設感測電極陣列的實施例俯視示意圖。4 is a top plan view showing an embodiment of a glass substrate on which a sensing electrode array is disposed.

指定代表圖為流程圖,故無元件符號簡單說明。The specified representative figure is a flow chart, so there is no simple description of the component symbols.

Claims (10)

一種觸控面板的製造方法,其步驟包括:於一玻璃基板凹陷成形至少一凹槽,其中該凹槽包含一底邊及兩斜面側邊;表面強化該玻璃基板;及依據該底邊之位置來裁切該玻璃基板。A method for manufacturing a touch panel, the method comprising: forming at least one recess in a glass substrate, wherein the recess comprises a bottom edge and two beveled sides; the surface is reinforced by the glass substrate; and the position of the bottom edge is The glass substrate is cut. 如申請專利範圍第1項所述之觸控面板的製造方法,其中所述凹槽是成對設計,並對應地凹陷成形於該玻璃基板的一上表面及一下表面。The method of manufacturing a touch panel according to claim 1, wherein the grooves are in a paired design and are correspondingly recessed and formed on an upper surface and a lower surface of the glass substrate. 如申請專利範圍第1項所述之觸控面板的製造方法,其中該底邊是一平面或弧凹面。The method of manufacturing a touch panel according to claim 1, wherein the bottom edge is a plane or an arc concave surface. 如申請專利範圍第1項所述之觸控面板的製造方法,其中該玻璃基板是透過蝕刻、刻劃或機械製模來凹陷成形該凹槽。The method of manufacturing a touch panel according to claim 1, wherein the glass substrate is recessed into the groove by etching, scoring or mechanical molding. 如申請專利範圍第1項所述之觸控面板的製造方法,其中該表面強化該玻璃基板的步驟是採用化學強化。The method of manufacturing a touch panel according to claim 1, wherein the step of strengthening the glass substrate by the surface is chemical strengthening. 如申請專利範圍第1項所述之觸控面板的製造方法,其中該裁切該玻璃基板的步驟包含形成一裁切面。The method of manufacturing a touch panel according to claim 1, wherein the step of cutting the glass substrate comprises forming a cut surface. 如申請專利範圍第6項所述之觸控面板的製造方法,其中所述斜面側邊是相接於該玻璃基板的表面與該裁切面之間,以形成一倒角。The method of manufacturing a touch panel according to claim 6, wherein the beveled side is connected between the surface of the glass substrate and the cutting surface to form a chamfer. 如申請專利範圍第6項所述之觸控面板的製造方法,其中在該裁切該玻璃基板的步驟後,進一步包含:平滑化該裁切面。The method of manufacturing a touch panel according to claim 6, wherein after the step of cutting the glass substrate, the method further comprises: smoothing the cut surface. 如申請專利範圍第1項所述之觸控面板的製造方法,其中在該表面強化該玻璃基板的步驟後,進一步包含:佈設一感測電極陣列於該玻璃基板的表面。The method for manufacturing a touch panel according to claim 1, wherein after the step of strengthening the glass substrate, the method further comprises: disposing a sensing electrode array on a surface of the glass substrate. 如申請專利範圍第9項所述之觸控面板的製造方法,其中在該佈設該感測電極陣列的步驟之前,進一步包含:抗眩處理及/或抗菌處理該玻璃基板。The method of manufacturing a touch panel according to claim 9, wherein the step of arranging the sensing electrode array further comprises: anti-glare treatment and/or antibacterial treatment of the glass substrate.
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