TW201318934A - 切割用黏晶膜之捆包構造及捆包方法 - Google Patents
切割用黏晶膜之捆包構造及捆包方法 Download PDFInfo
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Abstract
輥5係由薄膜9捲附於中空的芯7所構成。此外,薄膜9係與如圖7所示之薄膜100大致相同者,且於其表面形成有凹凸之切割用黏晶膜。輥5放置在收納袋11中。於輥5被放置在收納袋11之狀態下,側板3為設置於其兩端部。側板3的凸部19係嵌合安裝在芯7的兩端部之中空部。對於在上下端安裝有一對側板3的輥5而言,固定側板3及輥5係受2條至4條的捆帶15固定。以捆帶15為至少2條交叉的方式遍及全周圍地被裝設在側板3及輥5(收納袋11)的外部,將側板3及輥5固定。
Description
本發明係關於製造半導體裝置時使用的切割用黏晶膜之捆包構造及其捆包方法。
以往,開發有兼具切割膠帶(dicing tape)和晶粒接合薄膜(die bonding film)這兩種功能的切割用黏晶膜(die dicing bonding film),該切割膠帶係於將半導體晶圓切斷分離成各個晶片時用以固定半導體晶圓,該晶粒接合薄膜係用以將被切斷的半導體晶片接合在引線架或封裝基板等。這種切割用黏晶膜通常被施以預切割加工。
圖8係顯示做為切割用黏晶膜之一例的薄膜100之圖,圖8(a)為前視圖,圖8(b)為圖8(a)的D-D線剖視圖。薄膜100係由脫模薄膜103、接著劑層105、以及由圓形標籤部107a及周邊部107b構成的黏合薄膜107等所構成。
接著劑層105係被加工成對應晶圓的形狀之圓形,配置於脫模薄膜103上。黏合薄膜107係被去除對應切割用連結框之形狀的圓形部分的周邊區域者。黏合薄膜107的圓形標籤部107a覆蓋接著劑層105,外周部與脫模薄膜103接觸。
如圖8(b)所示,接著劑層105和圓形標籤部107a積層的部分,比黏合薄膜107的周邊部107b厚。因此,在被捲成做為製品之輥狀時,接著劑層105和圓形標籤部107a的積層部分、及周邊部107b之階差疊合,而有該階差會被轉印至柔軟的接著劑層105表面之虞。若產生這種轉印痕,則會因為接著劑層105和半導體晶圓的接著不良而有晶圓加
工時產生不良狀況之虞。
另一方面,為了抑制這種轉印痕的產生而有減弱膠帶的捲繞力之方法。但是,這種方法會因為輸送時的振動而有使製品的捲繞產生不齊之虞。
對此,研究出在預切割形狀下工夫的方法,用以防止這種標籤痕(例如專利文獻1)。
專利文獻1 日本特開2007-2173號公報
但是,如專利文獻1在預切割形狀下工夫的方法,除了形狀調整困難之外,一旦薄膜捲繞張力變強即無法防止標籤痕產生。因而,必須調整捲繞張力。又,以往的捆包方法在搬運線圈時,會有因對製品的一部分施加力量、或手滑而讓製品落下等情形而有對製品造成損傷之虞。
本發明係鑑於這種問題而研發者,其目的在於提供確實地抑制捲繞不齊,處理性亦優異之切割用黏晶膜之捆包構造及其捆包方法。
為了達成前述目的之第1發明,係一種切割用黏晶膜之捆包構造,特徵在於其係具備:由中空的芯、及捲附於前述芯且預切割成預定的形狀之長形的切割用黏晶膜所構成的輥;具有對應前述芯的中空部之凸部的側板;及固定前述輥和前述側板的2條至4條的捆帶;且前述凸部被安裝成嵌合於前述芯的兩端,前述至少2條之捆帶係於前述
側板的部位互相交叉,在一對的各個前述側板被載置成朝向上下方向之狀態下,將上側的前述側板朝上方抬起時的前述側板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。
經由前述捆帶固定的前述側板及前述輥,亦可並排2個以上且收容於捆包箱內。
在前述側板之前述凸部的相反側面設有凹部,亦可在前述凹部至少有2條之前述捆帶交叉。至少2條之前述捆帶亦可在交叉部互相固定。
根據第1發明,由於藉由一對側板夾入輥,因此薄膜在輸送中等,不會產生捲繞不齊。又,側板及輥係以至少2條的捆帶交叉之方式被固定,因此不會產生側板偏移。又,藉由將處理時的側板間距離之變化量設定為1%以下之方式,於處理時亦能確實地防止薄膜捲繞不齊。
又,以將2個以上的輥並排收納於捆包箱之方式,捆包箱的層疊性亦優異。又,在側板的外面形成凹部,以將捆帶交叉於凹部之方式,較容易抓取該捆帶,且從捆包箱取出輥之作業等的處理性佳。又,以固定捆帶彼此的交叉部之方式能防止捆帶偏移。
第2發明係一種切割用黏晶膜之捆包方法,其特徵在於:將預切割成預定的形狀之長形的切割用黏晶膜捲附於中空的芯而形成輥,將具有對應前述芯的中空部之凸部的一對側板安裝至前述輥,以使前述凸部嵌合於前述芯的兩端,以2條至4條的捆帶在前述側板交叉的方式來固定前述輥和前述側板,以使得一對的各個前述側板於朝向上下方向載置之狀態下,將上側的前述側板朝上方抬起時的前述側
板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。
裝設前述捆帶後,亦可在彼此的交叉部至少固定有2條的前述捆帶。
根據第2發明,能確實地防止薄膜捲繞不齊,並且處理性亦優異,能防止轉印痕產生。
根據本發明,可提供確實地抑制捲繞不齊且處理性亦優異之切割用黏晶膜之捆包構造及其捆包方法。
以下,一邊參照圖式,一邊說明本發明之實施形態。圖1係顯示捆包構造1之分解立體圖,圖2係顯示捆包構造1之立體圖。捆包構造1主要由輥5、側板3、收納袋11、捆帶15、捆包箱13等所構成。
輥5係薄膜9捲附於中空的芯7而構成。此外,薄膜9係與圖7所示之薄膜100大致同樣者,其係表面形成有凹凸之切割用黏晶膜。
薄膜9對芯7的捲繞張力,例如10N~20N左右為佳。若薄膜9的捲繞張力超過20N,則產生依照前述凹凸形狀之轉印痕。又,薄膜9的捲繞張力未達10N時,會有產生薄膜9捲繞不齊等之虞。此外,細節於後述,但通常考慮到捲繞不齊而將薄膜的捲繞張力設定於15N左右,但本發明係以採用以往未有的捆包構造之方式,即使以更低的8N左右捲繞,仍不會產生捲繞不齊。
輥5被放入收納袋11。此外,使用光(紫外線)硬化性組成物等做為構成薄膜9的黏著劑或接著劑時,可使用該
等光不透過物做為收納袋11。
將輥5放入收納袋11,於脫氣、熱密封之狀態下,其兩端部設有側板3。圖3係顯示側板3之圖,圖3(a)為俯視圖,圖3(b)為圖3(a)的A-A線剖視圖。
側板3係從中央以放射狀形成為肋之大致矩形形狀的構件。側板3的上面之大致中央設有凹部17。又,側板3的下面側之大致中央設有凸部19。凸部19係朝側板下方突出之大致圓柱狀的部位。於側板3的外緣部,在與凸部19的形成方向同方向形成肋。肋之間可以是連續的板狀,也可是如圖3所示隔著貫通的孔。又,側板3的大致矩形形狀之四隅角可以具有角度,也可以如圖3(a)所示描畫弧形。為了使從上下方向施加的力量緩和且不易分散,較佳為隔著孔或/及描畫弧形。此外,側板3的形狀不限於圖示之例,可適當設定側板3的外形、凹部17、凸部19的形狀或大小、或肋形狀等。又,側板3可使用模具等以一次成形製造,亦可分成大致矩形形狀的板和凸部19等零件,予以分別製造後再組合成形。若按各零件製造則可分解並收納製品,因而容易處理。
又,薄膜9係用於製造半導體裝置,故而通常係於潔淨室內處理。因此,構成捆包構造1的芯7、側板3、收納袋11、捆帶15等,係以可在潔淨室內處理的樹脂等構成。亦即,紙、厚紙板、纖維等素材不適用。樹脂方面,特別是使用自然分解性的樹脂時能達到減少環境負擔而更佳。
其中,變形量相對於來自側板3的側方之1500N的壓縮力,為2%以下較佳。圖4係顯示側板3的壓縮強度實驗方法之概略圖。如圖4所示,在側板3的側方(與凹部17、
凸部19的形成方向垂直之方向)配置夾具21,對於夾具21以1500N的力量賦予壓縮力(圖中箭頭C方向),測定此時的壓縮變形量。若其變形量對原來的幅寬超過2%,則輸送時或後述以捆帶固定時,側板3變形且有隨其在薄膜9產生捲繞不齊等之虞。
如圖1、圖2所示,側板3的凸部19嵌合安裝於芯7的兩端部之中空部。其中,於將側板3安裝於輥5的狀態下,輥5(薄膜9)被側板3夾入。因此,薄膜9於輥狀態下,其兩側部被側板3固定。
其中,將側板3推入芯7時,為了不讓側板3損傷薄膜的側端部,芯7的幅寬和薄膜9的幅寬大致相同或略小為佳。又,使側板3與芯7嵌合時,為了藉由側板3確實地保持薄膜9的兩側端部,於必要時亦可在側板3和薄膜9側端部的間隙配置緩衝用的彈性構件等。又,若將側板3的尺寸設定成比輥5的外徑稍大,且讓輥5收納於側板3外緣部的肋之內部,則能防止捆包箱內面和輥5之接觸。
如圖2所示,相對於上下端安裝有一對側板3的輥5而言,側板3及輥5係受2條捆帶15固定。捆帶15係以至少2條交叉的方式遍及全周圍裝設在側板3及輥5(收納袋11)的外部,而將側板3及輥5固定。
捆帶為2條時,2條捆帶15係於側板3的大致中央交叉。亦即,2條捆帶15的交叉部為凹部17(圖3)的位置。因而,不讓2條捆帶15的交叉部附近與側板3接觸,而在側板3(凹部17)之間形成間隙。因而,於將輥5抬起時,能將手(指)插入利用凹部17形成的間隙,抓住捆帶15的交叉部而抬起。因而,從捆包箱取出時,能於複數個輥5並排
之狀態下容易地抬起輥5。
又,如圖5所示之捆包構造1a,亦可進一步增加為4條捆帶。於此情形下,4條捆帶係以各2條形成井型狀。因而,在中央部的交叉變得困難而使得容易地抬起輥5一事變得稍微困難,但以將手指等插入斜向的交叉部分予以抬起的方式,即能以良好的平衡取出輥5。又,捆帶為4條時,亦可綁成1條和3條互相交叉。任一者皆可設置1處以上的交叉部,藉此能容易地抬起輥5。
此外,2條捆帶15的交叉部亦可互相固定。例如,亦可將捆帶15彼此熔接或黏接,或利用其他捆綁構件予以固定。又,亦可在側板3的外緣部設置嵌合捆帶的淺溝,固定捆帶捆綁的位置,藉此誘導交叉部來到凹部17(圖3)的位置。藉由這種方式,使交叉部的位置不會偏移,更為容易處理。
又,捆帶15以可帶進潔淨室內的樹脂製為佳。特別是使用自然分解性的樹脂時能達到減少環境負擔而更佳。又,如前述,為了避免抓住捆帶15抬起輥5時捆帶斷掉,拉伸斷裂強度或5%模數為200N以上較佳。
圖6(a)係顯示捆包構造1(捆包箱除外)之前視圖。將輥5配置成一對側板3位於上下方向。於該狀態下,藉由捆帶15使兩側板3對輥5確實地固定。此時的側板3間的距離為H1。
接著,如圖6(b)所示,從該狀態抬起上方的側板3(圖中箭頭B方向)。將輥5完全地抬起時的側板3間的距離為H2。亦即,(H2-H1)係利用捆包構造本身的重量,藉由捆帶15的伸展及側板3的餘份而產生的距離變化量。
本發明係考慮到捆包構造的重量、捆帶15的強度、側板3的餘份等,而將該側板間距離的變化量(H2-H1)設定為H1的1%以下為佳。亦即,設定捆包構造的重量後,相對於其,以成為上述關係的方式設定捆帶15的強度及側板3的餘裕。又,由於切割用黏晶膜於輸送、保管等時,放置於5℃以下的環境中,於處理時放置於常溫中,因而,受溫度變化的影響較小者為佳。具體而言,捆帶15於0至30℃中,長邊方向的伸縮率為±1%以內為佳。
如圖1、圖2所示,將如此地形成的輥5等插入捆包箱13。此外,捆包箱13係於運搬、保管時受保護者,於潔淨室內被處理前,內部的輥5等被取出。因此,捆包箱13亦可以厚紙板製。
又,圖中,例示將2個輥5收納在捆包箱13,但本發明不限於此。但是,考慮到輸送時的捆包箱之層疊性、處理性,對於一個捆包箱13,收納2捲或4捲的輥5為佳。1捲的輥5會使捆包箱13的底面積變小而變得不穩定,因此困難層疊複數層。又,若6捲以上,則捆包箱13的大小會變大且變重,而變得困難處理。因此,將2捲或4捲的輥5收納於捆包箱13為佳。
如以上說明,根據本發明,由於輥5被側板3夾入,因此捲繞張力比通常弱,而能防止產生捲繞不齊。又,由於側板3的凸部19被嵌合於芯7,因此側板3於運搬時等不會有偏移。又,由於側板3的強度充分,因此亦能防止變形等造成的位置偏移。
又,側板3形成有凹部,捆帶15係於凹部17的位置交叉,因此能容易地抓住捆帶15的交叉部以抬起輥5。又,
交叉部為互相固定、或捆帶被固定於捆綁的位置,則交叉部的位置不會偏移。
又,將側板3朝上下方向配置,以抬起上部的側板3時之側板間的距離變化量為原來的側板間的距離之1%以下之方式,能防止處理時產生捲繞不齊。
以上,一邊參照附圖,一邊說明本發明之實施形態,但本發明之技術範圍不受前述實施形態左右。只要是熟習此技藝人士,即能在申請專利範圍所記載之技術思想範疇內想到各種變更例或修正例是當然的,亦明瞭該等當然亦屬於本發明之技術範圍。
對各種捆包形態進行其評價。評價對象之薄膜係作成如圖8所示之切割用黏晶膜來使用。以下,說明各構成之製造方法。
在溶劑之甲苯400g中,將丙烯酸正丁酯128g,丙烯酸2-乙基己酯307g、(甲基)丙烯酸甲酯67g、甲基丙烯酸1.5g、做為聚合起始劑之過氧化苯混合液,適當調整滴下量,調整反應溫度及反應時間,得到具有官能基之化合物(1)的溶液。
接著於該聚合物溶液,做為具有放射線硬化性碳-碳雙鍵及官能基之化合物(2),另外由甲基丙烯酸和乙二醇合成的(甲基)丙烯酸2-羥乙酯2.5g,將做為聚合抑制劑之氫醌調整適當滴下量並加入,調整反應溫度及反應時間,得到具有放射線硬化性碳-碳雙鍵之化合物(A)的溶液。接著,對化合物(A)溶液中的化合物(A)100質量份,加入做為聚異氰酸
酯(B)的1質量份之日本Polyurethane公司製之CORONET L,將做為光聚合起始劑之0.5質量份日本Ciba-geigy公司製之IRGACURE184、做為溶劑之150質量份之乙酸乙酯,加入化合物(A)溶液並混合,調製放射線硬化性的黏著劑組成物。
接著,在厚度100μm之乙烯-乙酸乙烯酯共聚物基材薄膜,將經調製之黏著劑層組成物塗布成乾燥膜厚為20μm,以110℃乾燥3分鐘,製作成黏合薄膜1A。
脫模薄膜2A係使用厚度25μm之經脫模處理之聚對苯二甲酸乙二酯薄膜。
在由做為環氧樹脂之甲酚酚醛型環氧樹脂(環氧當量197、分子量1200、軟化點70℃)50質量份、做為矽烷耦合劑之γ-巰丙基三甲基矽烷1.5質量份、γ-脲丙基三乙基矽烷3質量份、由平均粒徑16nm之二氧化矽填料30質量份構成的組成物,加入環己酮並攪拌混合,進一步使用珠磨機混練90分鐘。
於其中加入丙烯酸樹脂(質量平均分子量:80萬,玻璃轉移溫度-17℃)100質量份、做為6官能丙烯酸酯單體之聚二季戊四醇六丙烯酸酯5質量份、做為硬化劑之六亞甲基二異氰酸酯之加合物體0.5質量份、curezol 2PZ(日本四國化成(股)製商品名,2-苯基咪唑)2.5質量份,攪拌混合且真空脫氣而得到接著劑。將上述接著劑塗布於脫模薄膜2A上,以110℃加熱乾燥1分鐘,形成膜厚為20μm之B層(stage)狀態(熱硬化性樹脂的硬化中間狀態)的塗膜,在脫模薄膜
2A上形成接著劑層3A並冷藏保管。
使形成有經冷藏保管的接著劑層3A之脫模薄膜2A回到常溫,對接著劑層,調整成朝脫模薄膜的切入深度為10μm以下,進行直徑220 mm的圓形預切割加工。然後,去除接著劑層不要的部分,使脫模薄膜2A於室溫中層疊,以使黏合薄膜1A之黏著劑層與接著劑層相接。然後,對黏合薄膜1A,調整成朝脫模薄膜的切入深度為10μm以下,進行與接著劑層為同心圓狀之直徑290 mm的圓形預切割之加工,以製作成晶圓加工用膠帶4A。
將根據以上所製作的薄膜以各種方法捆包。
將經預切割加工的晶圓加工用膠帶4A,於開始捲繞和結束捲繞處設置大約1.2m的無標籤部分,以10N捲取300片。將其收納在聚乙烯製袋中,脫氣後予以熱密封並將圖3的形狀之聚丙烯製的側板安裝於兩端部。進一步,將2條PP捆帶捆綁成十字並熔接而接合。側板間的距離變化量(圖5之H2-H1)為側板間的距離(H1)之0.3%。製作2捲相同者,如圖7(a)所示,將2捲收納於厚紙板箱之捆包箱13,而得到實施例1的晶圓加工用膠帶捆包體。
如圖7(b)所示,除了將4捲收納於捆包箱13a以外,與實施例1同樣,而得到實施例2之晶圓加工用膠帶捆包體。
除了將PP捆帶捆綁成側板間的距離變化量為1%以外,與實施例1同樣,而得到實施例3之晶圓加工用膠帶
捆包體。
除了將4條捆帶捆綁成井型狀以外,與實施例1同樣,而得到實施例4之晶圓加工用膠帶捆包體。
除了不熔接2條PP捆帶,而在側板的四邊之外緣部設置溝用以捆綁捆帶以外,與實施例1同樣,而得到實施例5之晶圓加工用膠帶捆包體。
除了捲繞張力為40N以外,與實施例1同樣,而得到比較例1之晶圓加工用膠帶捆包體。
如圖7(c)所示,除了將1捲收納於捆包箱13b以外,與實施例1同樣,而得到比較例2之晶圓加工用膠帶捆包體。
除了側板為牛皮紙製以外,與實施例1同樣,而得到比較例3之晶圓加工用膠帶捆包體。
除了將PP捆帶捆綁成側板間的距離變化量為2%以外,與實施例1同樣,而得到比較例4之晶圓加工用膠帶捆包體。
結果顯示於表1。
表中的「捲繞不齊」及「轉印痕」係以下述方式評價。首先,將各捆包體保管於冷藏庫內(5℃)1個月後,放在運送用卡車,於冷藏狀態下在日本平塚至神戸間(約1000km)來回。然後,將各捆包體開捆,使輥回到常溫後將包裝袋開封,只固定芯且於自然負重下將輥放置1分鐘後,觀察有無捲繞不齊,若捲繞不齊為2 mm以內則為「○」,捲繞不齊為2 mm以上則為「×」。
接著,解開輥,以目視觀察有無轉印痕並評價。從各種角度目視觀察皆無法確認轉印痕或孔隙者為「◎」,根據角度而能確認若干轉印痕或孔隙者為「○」,從任何角度目視觀察皆能確認薄膜上有轉印痕或孔隙者為「×」。
又,將各捆包體層疊3層,於冷藏庫內(5℃)保管1個月後,放在搬運用台車,以0.01~0.25m/sec2之加速度,觀察有無貨物塌下。無貨物塌下時為「○」,有貨物塌下時為「×」。
又,將各捆包體開捆,於取出輥時評價處理性。非常
容易處理、處理性及生產性優異者為「◎」,容易處理、處理性及生產性良好者為「○」,處理困難、處理性及生產性差者為「×」。
使用側板的實施例1~3及比較例1~3中未產生捲繞不齊,但側板間的距離變化量大的比較例4中產生捲繞不齊。得知以側板間的距離變化量小的方式能防止捲繞不齊。
關於轉印痕,各實施例、比較例皆完全無法抑制,但於捲繞張力高到40N的比較例1中被評價為「×」。亦即,得知根據捲繞張力會使轉印痕的產生有差異。
關於層疊性,在將1捲收納於捆包箱的比較例2中產生貨物塌下。得知捆包箱收納有2捲以上者,層疊後的穩定性高。
關於處理性,在將捆帶強力捆包的實施例1~2、5及比較例1中,製品容易取出。實施例3中,捆帶有若干鬆動,因此製品取出性略差。實施例4中,捆帶的交叉部分無凹陷處,因此取出時不易抓住,處理性略差。比較例2中,製品容易取出,但1捲1捲地收納於捆包箱,因而必須1捲1捲地開捆而使得生產性較差。比較例3中,由於使用牛皮紙製的側板,因而無法直接帶入使用製品的潔淨室,必須在潔淨室外取下側板處理,處理性差。比較例4中,捆帶強度弱,因而難以拿著,處理性差。
1、1a‧‧‧捆包構造
3‧‧‧側板
5‧‧‧輥
7、101‧‧‧芯
9、100‧‧‧薄膜
11‧‧‧收納袋
13、13a、13b‧‧‧捆包箱
15‧‧‧捆帶
17‧‧‧凹部
19‧‧‧凸部
21‧‧‧夾具
103‧‧‧脫模薄膜
105‧‧‧接著劑層
107‧‧‧黏合薄膜
107a‧‧‧圓形標籤部
107b‧‧‧周邊部
H1、H2‧‧‧側板3間的距離
圖1係顯示捆包構造1之分解立體圖。
圖2係顯示捆包構造1之立體圖。
圖3(a)及(b)係顯示側板3之圖,圖3(a)為俯視圖,圖3(b)為圖3(a)的A-A線剖視圖。
圖4係顯示側板3的壓縮強度實驗方法之概略圖。
圖5係顯示捆包構造1之分解立體圖。
圖6(a)及(b)係顯示將捆包構造1抬起之狀態圖。
圖7(a)至(c)係顯示輥5的收納形態圖。
圖8(a)及(b)係顯示薄膜100之圖,圖8(a)為前視圖,圖8(b)為圖8(a)的D-D線剖視圖。
1‧‧‧捆包構造
3‧‧‧側板
5‧‧‧輥
7‧‧‧芯
9‧‧‧薄膜
11‧‧‧收納袋
13‧‧‧捆包箱
15‧‧‧捆帶
17‧‧‧凹部
19‧‧‧凸部
Claims (6)
- 一種切割用黏晶膜之捆包構造,特徵在於其具備:由中空的芯、及捲附於前述芯且預切割成預定形狀之長形的切割用黏晶膜所構成的輥,具有對應前述芯的中空部之凸部的側板,及固定前述輥和前述側板的2條至4條的捆帶;且前述凸部被安裝成嵌合於前述芯的兩端,至少2條之前述捆帶係於前述側板的部位互相交叉,在一對的各個前述側板被載置成朝向上下方向之狀態下,將上側的前述側板朝上方抬起時的前述側板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。
- 如申請專利範圍第1項之切割用黏晶膜之捆包構造,其中經由前述捆帶固定的前述側板及前述輥係並排2個以上且收容於捆包箱內。
- 如申請專利範圍第1項之切割用黏晶膜之捆包構造,其中在前述側板之前述凸部的相反側面設有凹部,在前述凹部至少有2條之前述捆帶交叉。
- 如申請專利範圍第1項之切割用黏晶膜之捆包構造,其中至少2條之前述捆帶係於交叉部互相固定。
- 一種切割用黏晶膜之捆包方法,其特徵在於:將預切割成預定形狀之長形的切割用黏晶膜捲附於中空的芯而形成輥,將具有對應前述芯的中空部之凸部的一對側板安裝至前述輥,以使前述凸部嵌合於前述芯的兩端,以2條至4條的捆帶在前述側板交叉的方式來固定前述 輥和前述側板,以使得一對的各個前述側板於朝向上下方向載置之狀態下,將上側的前述側板朝上方抬起時的前述側板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。
- 如申請專利範圍第5項之切割用黏晶膜之捆包方法,其係在裝設前述捆帶後,在彼此的交叉部至少固定有2條的前述捆帶。
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TW201408552A (zh) * | 2012-08-27 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | 包裝裝置 |
JPWO2015159647A1 (ja) * | 2014-04-17 | 2017-04-13 | コニカミノルタ株式会社 | 光反射フィルムロール及び光反射フィルムロール包装体 |
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US4287991A (en) * | 1979-04-02 | 1981-09-08 | Donnelly Bernard P | Modularized unit load and disposable pallet therefor |
JPS5846765U (ja) * | 1981-09-24 | 1983-03-29 | 大森機械工業株式会社 | 積重状の紙葉状物品の把束体 |
US4730732A (en) * | 1982-09-30 | 1988-03-15 | Continental Fibre Drum, Inc. | Pallet and top frame for scrolled drum palletized package |
US4821880A (en) * | 1987-07-27 | 1989-04-18 | Essex Group, Inc. | Palletized structure containing spools |
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US20040251156A1 (en) * | 2003-06-12 | 2004-12-16 | Bell Norman H. | Roll end support |
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