TW201317537A - Heat dissipation device and assembling method thereof - Google Patents

Abstract

A heat dissipation device comprises plural heat dissipation plates which are piled along an axial direction. Each heat dissipation plate comprises a fixed portion and plural striping-fins. The striping-fins are disposed separately the outer edge of the fixed portion. The heat dissipation device with the foregoing structures has the superior cooling efficiency and dedusting efficiency.

Description

Heat sink and assembly method thereof

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device comprising a plurality of heat dissipating plate stacks having a plurality of fin strips and an assembling method thereof.

The application of electronic products has penetrated into all aspects of production and life in today's society. Its system performance and user experience are directly related to social production efficiency and people's quality of life. Computers play an important role in the field of electronic products. The electronic components in the computer generate heat during operation. The high-heat electronic components must be equipped with heat sinks to keep the operating temperature within the allowable range. If the operating temperature is too high, the performance will be poor or even invalid. The heat generating components of the existing computer that need to dissipate heat mainly include a central processing unit (CPU) mounted on the motherboard, a graphics processing unit (GPU) mounted on the display card, and installed in the power supply. Components such as power electronic components, and even hard disks of computers, require heat dissipation to function properly.

To solve the problem of heat dissipation, the most common way is to use both heat conduction and heat convection. In terms of heat conduction, heat-dissipating fins are usually installed above the above-mentioned heat-generating component, and in terms of heat convection, a heat-dissipating fan or a heat pipe having heat conduction and heat convection function is used to achieve heat dissipation. Therefore, when the heat generated by the heat generating component is transferred to the heat radiating fin, the heat radiating fan can forcibly convect the heat to be discharged.

The current cooling fan can be divided into two types, namely an axial flow fan and a centrifugal fan. The axial flow fan guides the airflow into the blade, and after the blade rotates, the airflow is blown in parallel along the central axis of the hub, which is characterized by small static pressure and large air volume; the centrifugal fan uses the driven disk hub to fluidize Inhalation, the rotating power radiates the airflow along the blade along the flow path, characterized by a static pressure higher than that of the axial flow. However, centrifugal fans generate a large amount of noise, and therefore, a heat sink generally used for electronic components generally employs an axial fan.

However, the axial flow fan is generally designed to be disposed perpendicular to the electronic component, and the heat sink used is arranged to have a plurality of erected fins, so that the airflow resistance generated by the cooling fan is large, resulting in severe wind pressure loss. Can not play the performance of the axial flow fan.

The conventional heat sink discloses a structure that looks like a sun flower shape. The conventional heat sink includes a hollow cylinder and a plurality of spiral fins extending outward from the cylinder, wherein the bottom of the hollow cylinder is in contact with the heat source. When the heat source is hot, the column transfers heat to the outer wall of the column, and the outer wall of the column transfers heat to the plurality of fins on the outer wall. The plurality of fins exchange heat with the forced airflow of the cooling fan to dissipate heat to the surrounding area. Space to achieve heat dissipation.

However, the heat of the solar shaped heat sink is mainly concentrated in the column and the root of the fin near the column, where the area is small and the heat density is large, and the heat distribution of the entire heat sink gradually decreases from the outer wall of the column, away from the column. The heat of the fin end of the body is less, and the air flow of the axial fan gradually increases from the central portion to the peripheral direction, so that the strong airflow of the cooling fan corresponds to the lower heat distribution portion of the heat sink, and the cooling fan weak airflow Corresponding to the area where the area of the heat sink is small and the heat density is large, the cooperation between the heat dissipating fan and the heat sink is obviously not corresponding, and the forced heat exchange effect of the fan cannot be fully utilized.

In addition, since the airflow is gradually dispersed outwardly from the top to the bottom and away from the cylinder, the airflow of the radiator at a higher temperature near the heat source is small, so that the heat cannot be dissipated outward in time.

Furthermore, in the general environment, air is usually mixed with dust and foreign matter (such as suspended particles or tiny fine hair, etc.), so when the fan rotates, the air with dust and foreign matter is brought into the electronic product to be cooled. With electronic components, the electronic products and electronic components that are intended to dissipate heat are accumulated.

However, because the airflow generated by the cooling fan is a linear flow field, and due to the obstruction of the structure of the cooling fan and the structure of the heat sink, the linear airflow generated is slow, and the dust accumulated therein cannot be discharged. This in turn seriously affects the heat dissipation effect of the cooling fan.

In view of the above problems, an object of the present invention is to solve the problem of the heat dissipation effect of the conventional heat sink device. In addition, another object of the present invention is to solve the problem that the conventional heat sink device cannot effectively remove dust.

In order to achieve the above object, the present invention provides a heat dissipating device including a plurality of heat dissipating plates, each of which is stacked along an axial direction. Each of the heat dissipation plates includes a fixing portion and a plurality of fin strips, and each of the heat dissipation plates is stacked and coupled to each other by the fixing portions, and a plurality of fin strips are spaced apart from the outer edge of the fixing portion.

In the present invention, a column may be further disposed along the axial direction, and each of the fixing portions further has an opening, and each of the fixing portions is respectively sleeved on the outer edge of the cylinder.

In the present invention, a plurality of fixing members are further included, and the fixing portion further has a plurality of locking holes corresponding to the fixing members, and the fixing members respectively pass through the respective locking holes to combine the heat dissipation plates.

In order to achieve the above object, the present invention further provides a method for assembling a heat dissipating device, the method comprising: stacking a plurality of heat dissipating plates along an axial direction, and combining the fixing portions of the heat dissipating plates to form a heat dissipating device.

In the present invention, the assembling method of the heat dissipating device further includes the steps of: inserting the openings of the fixing portions in a direction along the axial direction by a column, and fitting the fixing portion to the outer edge of the column.

In the present invention, the assembling method of the heat dissipating device further includes the following steps: a plurality of fixing holes are respectively inserted through the plurality of fixing portions to engage the heat dissipating plates.

The effect of the present invention is that the heat dissipating device formed by stacking a plurality of fins having a plurality of fin strips in the axial direction has a large amount of heat absorbing areas due to the large number of fin strips. The increase, and more, because the thickness of the heat sink is very thin, it can achieve a good heat conduction effect, in order to effectively increase the heat dissipation effect.

Moreover, when the fan is running, the fins of the thin structure are blown by the airflow blown by the fan to generate a slight vibration, so that the dust is not easily attached to the heat sink, and the vibration caused by the fin strips is also generated. Disturb the dust to effectively achieve the effect of dust removal.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Please refer to the schematic diagram of the heat dissipating device of the first embodiment of the present invention shown in FIG. 1 , and also refer to the exploded view of the heat dissipating device of the first embodiment of the present invention shown in FIG. 2 , and the embodiment shown in FIG. 23 . A flow chart of the steps of the heat dissipation device of the first embodiment of the invention.

The heat sink 100 includes a plurality of heat sinks 120, wherein each of the heat sinks 120 is sequentially stacked along an axial direction A (step 500 as shown in FIG. 23). Furthermore, each of the heat dissipation plates 120 includes a fixing portion 121 and a plurality of fin strips 123. The fixing portion 121 has a ring-shaped solid sheet structure and therefore has a certain range of area. However, the appearance of the fixing portion 121 is not limited to the type disclosed in the embodiment. In addition, the plurality of fin strips 123 are long rectangular strip-shaped sheet structures, and the fin strips 123 extend outward from the outer edge of the fixing portion 121, and each fin strip 123 is separated by a certain distance, so the plurality of fins The strips 123 are circumferentially and spaced apart from the outer edge of the fixing portion 121.

It should be noted that the spacing between the fin strips 123 may be equal or unequal, and may be correspondingly designed according to actual use requirements, and is not limited to the disclosed embodiment of the present invention. In addition, the fin strip 123 and the fixing portion 121 of the embodiment are integrally formed, and can be formed by any suitable machining method such as cutting, stamping, etc., but the fixing portion 121 and the fin strip 123 of the present invention may also be The two separate members are combined with each other by a suitable bonding means such as adhesion, clamping, welding, etc., and are not limited to the embodiment.

The plurality of heat dissipation plates 120 are coupled to each other by the fixing portion 121 (step 501 as shown in FIG. 23), for example, by bonding, clamping, welding, or the like to form a complete structure of the heat dissipation device 100.

The fins 123 of the adjacent heat dissipation plates 120 are alternately arranged. Referring to FIG. 3, a schematic plan view of the heat dissipation device according to the first embodiment of the present invention is shown. After the plurality of heat dissipation plates 120 are stacked and combined, the installation positions of the heat dissipation plates 120 can be adjusted according to actual design requirements, so that the plurality of fin strips 123 of the adjacent heat dissipation plates 120 are in a staggered relationship. As a result, the fin strips 123 of the heat dissipating plates 120 are evenly distributed on the outer edge of the column 110 and extend outwardly, so that the heat dissipating device 100 of the embodiment exhibits a structure such as a sunflower shape. It should be noted that the number of the heat dissipation plates 120 and the fins 123 thereof may be changed according to the needs of actual use, and should not be limited.

In this embodiment, the material of the heat dissipation plate 120 may be aluminum or copper. It should be noted that, for those having ordinary knowledge in the art, it should be clearly understood from the above description that any material having a high heat transfer coefficient can be used as the material of the heat dissipation plate 120, and should not be merely an embodiment. The materials disclosed herein are intended to define the scope of the invention.

Next, please refer to the perspective view of the heat dissipating device of the first embodiment of the present invention shown in FIG. 4, and the flow chart of the steps shown in FIG. 1 to FIG. 3 and FIG. 24 will be referred to. The heat sink 100 of the present embodiment further includes a fan 150 disposed on the plurality of heat sinks 120 (step 502 as shown in FIG. 24). In the embodiment, the fan 150 used is an axial fan, but is not limited thereto.

Since the thickness of the heat sink 120 is very thin, the absorbed heat is quickly conducted to the plurality of fin strips 123 on the outer edge, and the heat is dissipated into the air by the fin strips 123. Therefore, the heat dissipated into the air is quickly taken away from the heat generating component (not shown) and the heat sink 100 by the heat convection by the airflow generated by the heat radiating fan 150. Therefore, once the heat generating component generates heat, the heat sink 100 of the present invention can quickly and effectively carry heat away from the heat generating component, thereby effectively achieving the heat dissipation effect.

Moreover, since the thickness of the heat dissipation plate 120 is very thin, and one end of the fin strip 123 is connected to the fixing portion 121, the other end of the fin strip 123 is in a suspended state, and the width of the fin strip 123 is fine. Therefore, when the cooling fan 150 operates, a straight downward flow of air is blown to the heat sink 100, and the airflow causes the fins 123 to be disturbed and constantly vibrated, such as Simple Harmonic Motion or more complex vibrations. motion. Therefore, even if the airflow generated by the cooling fan 150 entrains the dust, or the dust deposited when the heat sink 100 is not in operation, the dust is shaken off by the fins 123, so the dust is not easily attached to the implementation. For example, the fin strip 123 of the heat sink 100 effectively achieves the effect of dust removal.

Please refer to the perspective view of the heat dissipating device of the second embodiment of the present invention shown in FIG. 5 and the top view of the heat dissipating device of the second embodiment of the present invention shown in FIG. 6. Here, for the sake of clarity, the same or similar elements will be described using the same reference numerals, and the same or similar structures in the present embodiment will not be described again.

In the present embodiment, the heat dissipating device 100 is formed by sequentially stacking a plurality of heat dissipating plates 120, wherein the fin strips 123 of the adjacent respective heat dissipating plates 120 are stacked on each other along the axial direction A of the column body 110. When a plurality of heat dissipation plates 120 are stacked on each other, the respective fin strips 123 of the heat dissipation plates 120 are arranged in a juxtaposed structure.

In this embodiment, the number of fins 123 of each of the heat dissipation plates 120 may be increased or decreased according to the needs of the embodiments without departing from the scope of the present invention. Similarly, the structure of the heat dissipating device 100 disclosed in the second embodiment of the present invention also has the same heat dissipating effect and dust removing effect as the heat dissipating device 100 of the first embodiment described above, and details are not described herein again.

Next, please refer to the perspective view of the heat dissipating device of the third embodiment of the present invention shown in FIG. 7, and please refer to the exploded view of the heat dissipating device of the third embodiment of the present invention shown in FIG. Likewise, the same or similar elements will be described using the same element symbols, and the same or similar structures in the above embodiments will not be described again.

In this embodiment, the fixing portion 121 of each of the heat dissipation plates 120 of the heat dissipation device 100 has a plurality of locking holes 133, and the fin strips 123 of the respective heat dissipation plates 120 are disposed around the outer edge of the fixing portion 121, and adjacent to each other. The fin strips 123 of the respective heat dissipation plates 120 are staggered, that is, the respective heat dissipation plates 120 are not completely identical, but correspond to the positions of the plurality of locking holes 133, and the plurality of fins used in the adjacent heat dissipation plates 120. The strips 123 have a distance difference, so that the effect of staggering the fin strips 123 of the adjacent heat dissipation plates 120 can be achieved.

The heat dissipating device 100 of the present embodiment further includes a plurality of fixing members 143 corresponding to the locking holes 133 of the fixing portion 131. The fixing members 143 are respectively inserted through the respective locking holes 133 to combine the heat dissipation plates 120 and fixed. In this embodiment, the fixing member 143 is achieved by using a screw. The screw can be selectively used to fix the screw according to different requirements. However, in different embodiments, only the screw can be used. Furthermore, it should be noted that although the screw is used as the fixing member 143 in the present embodiment, any one of ordinary skill in the art can achieve the tight fixing of the heat dissipation plate 120 on the cylinder 110. The manner should be covered by the scope of the invention and should not be construed as limiting.

In addition, it should be noted that although the number of the fixing member 143 and the locking hole 133 shown in FIGS. 7 and 8 corresponding to the present embodiment is four groups, it is common to those skilled in the art. For example, the number of the locking holes 133 and the fixing member 143 may be changed to more or less according to the actual implementation requirements, and should not be limited only by the quantity disclosed in the embodiment. Moreover, the number of the locking holes 133 may be more than the number of the fixing members 143, and should still be covered by the scope of the present invention.

Similarly, the heat dissipating device 100 of the third embodiment of the present invention also has a good heat dissipation effect and a dust removing effect as described above, and will not be described again.

Next, please refer to the top view of the heat sink of the heat dissipating device of the fourth embodiment of the present invention shown in FIG. In the embodiment, the heat dissipation plate 120 also includes a fixing portion 121 and a plurality of fin strips 123, and an opening 131 is defined in the center of the fixing portion 121. A weight member 125 is disposed on the suspension end of the fin strip 123 (ie, the end of the fin strip 123 away from the fixing portion 121), so that the weight of the suspension end of the fin strip 123 is slightly heavier than the connection end (ie, The weight of the fin strips 123 is connected to the end of the fixing portion 121, so that the fins 123 of the embodiment have different weights at the two ends. Therefore, when the fins 123 generate vibration, the amplitude of the vibration is more enlarged, thereby further The dust removing effect of the heat sink of the embodiment is improved.

It should be noted that any conventional technical means for designing the weight of the suspension end of the fin strip 123 to be slightly heavier than the weight of the connection end should be covered by the present invention. Medium, and should not be limited.

It should be noted that the heat sink 123 provided with a weight member 125 at the suspension end disclosed in the fifth embodiment of the present invention can be selectively applied to the heat dissipation device disclosed in the first embodiment to the fourth embodiment. Among 100, to increase the dust removal effect.

Please refer to the perspective view of the heat dissipating device of the fifth embodiment of the present invention shown in FIG. 10, and also refer to the exploded view of the heat dissipating device of the fifth embodiment of the present invention shown in FIG.

The heat sink 100 includes a cylinder 110 and a plurality of heat sinks 120. The cylinder 110 has an axial direction A, and a plurality of heat dissipation plates 120 are sleeved on the periphery of the cylinder 110 along the axial direction A. Furthermore, each of the heat dissipation plates 120 includes a fixing portion 121 and a plurality of fin strips 123. The fixing portion 121 has an opening 131 formed at a central portion thereof, and the opening 131 is sleeved on the outer surface of the cylinder 110 (step 503 as shown in FIG. 25). In addition, the plurality of fin strips 123 are long rectangular strip-shaped sheet structures, and the fin strips 123 extend outward from the outer edge of the fixing portion 121, and each fin strip 123 is separated by a certain distance, so the plurality of fins The strip 123 is disposed around the outer edge of the fixing portion 121.

It should be noted that the spacing between the fin strips 123 may be equal or unequal, and may be correspondingly designed according to actual use requirements, and is not limited to the disclosed embodiment of the present invention. In addition, the fin strip 123 and the fixing portion 121 of the embodiment are integrally formed, and can be formed by any suitable machining method such as cutting, stamping, etc., but the fixing portion 121 and the fin strip 123 of the present invention may also be The two separate members are combined with each other by a suitable bonding means such as adhesion, clamping, welding, etc., and are not limited to the embodiment.

When the plurality of heat dissipation plates 120 are sleeved outside the column 110 by the opening 131 of the fixing portion 121, the fins 123 of the adjacent heat dissipation plates 120 are alternately arranged. Referring to the fifth aspect of the present invention shown in FIG. A schematic top view of an embodiment of a heat sink. When a plurality of heat dissipation plates 120 are sleeved to the outer edge surface of the cylinder 110, the fin strips 123 of the heat dissipation plates 120 are uniformly spread on the outer edge of the column 110 and extended outward, so that the present embodiment For example, the heat sink 100 exhibits a structure such as a sunflower shape. It should be noted that the number of the heat dissipation plates 120 and the fins 123 thereof may be changed according to the needs of actual use, and should not be limited.

In the present embodiment, the cylinder 110 has a cylindrical shape, and the opening 131 of the fixing portion 121 of the heat dissipation plate 120 corresponds to a circular ring shape, wherein the diameter of the cylinder 110 is approximately larger than the inner diameter of the opening 131 of the fixing portion 121. . Therefore, when the fixing portion 121 of the heat dissipation plate 120 is sleeved on the outer edge surface of the column 110 with the opening 131, the column 110 slightly pushes the heat dissipation plate 120, and the fixing portion 121 of the heat dissipation plate 120 is slightly deformed. Further, the effect of tight bonding is achieved, so that the heat dissipation plate 120 is stably mounted on the column 110 without being easily peeled off or displaced. Then, a plurality of heat dissipation plates 120 are stacked on the column 110 in sequence.

Furthermore, in order to further improve the heat dissipation performance of the heat dissipation device 100 of the present invention, a heat conductive medium may be applied to the outer edge of the column 110, and when a heat dissipation plate 120 is provided for each set, the fixing portion 121 of the heat dissipation plate 120 may be used. After the upper heat-conducting medium is coated, another heat-dissipating plate 120 is further disposed to fix the two heat-dissipating plates 120 with the heat-conducting medium to reduce the thermal resistance between the heat-dissipating plates 120, and then the plurality of heat-dissipating plates 120 are set to the required quantity. . The heat conductive medium may comprise a thermal conductive adhesive or a thermal conductive paste, and the material thereof may be tin glue, silver glue or gold glue, or a compound composed of eucalyptus oil and magnesium oxide may be achieved, and any heat conductive medium capable of having heat conduction effect may be obtained. Or viscous materials can be applied to this, and should not be limited.

It should be noted that when a heat conductive medium or a heat conductive adhesive material is used to connect the heat dissipation plate 120, the outer diameter of the cylinder 110 may be equivalent to the inner diameter of the opening 131 of the fixing portion 121, or The outer diameter of the cylinder 110 can also be slightly smaller than the inner diameter of the opening 131 of the fixing portion 121, and the gap between the cylinder 110 and the fixing portion 121 can be filled by a heat conductive medium or a viscous substance having a heat conducting effect. The implementation of the invention should be construed as being within the scope of the invention and should not be limited.

It should be noted that, although the column 110 used in the embodiment has a cylindrical shape, and the opening 131 of the fixing portion 121 is designed to have a ring shape, it is generally known to those skilled in the art. It should be readily understood that the cylinder 110 is in the shape of a square cylinder and the fixing portion 121 is a square ring. Even the cylindrical body 110 of any geometric shape and the fixed portion 121 of the corresponding geometry should be covered by the present invention. In spirit and scope, it should not be limited to a specific shape.

In this embodiment, the material of the pillar 110 may be copper or a copper alloy, and the material of the heat dissipation plate 120 may be aluminum or copper. It should be noted that, for those having ordinary knowledge in the art, it should be clearly understood from the above description that any material having a high thermal conductivity can be used as the material of the cylinder 110 and the heat dissipation plate 120, and should not be used. The scope of the invention is defined only by the materials disclosed in the examples.

Next, please refer to the perspective view of the heat dissipating device of the fifth embodiment of the present invention shown in FIG. 13 with a fan, and please refer to FIGS. 10 to 12. The heat dissipation device 100 of the embodiment further includes a fan 150 disposed on the column 110 and the plurality of heat dissipation plates 120. In the embodiment, the fan 150 used is an axial fan, but is not limited thereto.

Please refer to the side view of the heat dissipating device of the fifth embodiment of the present invention shown in FIG. 14 applied to the heat generating component, and please refer to FIGS. 10 to 12 at the same time. A heat generating component 701 is electrically disposed on a substrate 702. The heat sink 100 of the present embodiment is disposed above the heat generating component 701 to effectively and quickly dissipate heat generated by the heat generating component 701. The substrate 702 can be a printed circuit board (PCB), but not limited thereto, and the heating element 701 can be a central processing unit (CPU) or a graphics processing unit (GPU), and is not limited thereto. .

Therefore, when the heat generating component 701 disposed on the substrate 702 is operated, the generated heat is first transmitted to the fixing portion 121 of the pillar 110 having the heat conductive property and the outer edge heat radiating plate 120 through the heat conduction manner, and further, the column The body 110 can also quickly transfer heat to the outer edge of the surface, and then transfer the heat of the surface to the fixing portion 121 of each of the heat dissipation plates 120. Since the thickness of the heat dissipation plate 120 is very thin, the absorbed heat is quickly The plurality of fin strips 123 are conducted to the outer edge, and the heat is dissipated into the air by the fin strips 123. Therefore, the heat dissipated into the air is quickly taken away from the heating element 701 and the heat sink 100 by the heat convection by the airflow generated by the cooling fan 150. Therefore, once the heat generating component 701 generates heat, the heat sink 100 of the present invention can quickly and efficiently carry heat away from the heat generating component 701, effectively achieving the heat dissipation effect.

Moreover, since the thickness of the heat dissipation plate 120 is very thin, and one end of the fin strip 123 is connected to the fixing portion 121, the other end of the fin strip 123 is in a suspended state, and the width of the fin strip 123 is fine. Therefore, when the cooling fan 150 operates, a straight downward flow of air is blown to the heat sink 100, and the airflow causes the fins 123 to be disturbed and constantly vibrated, such as Simple Harmonic Motion or more complex vibrations. motion. Therefore, even if the airflow generated by the cooling fan 150 entrains the dust, or the dust deposited when the heat sink 100 is not in operation, the dust is shaken off by the fins 123, so the dust is not easily attached to the implementation. For example, the fin strip 123 of the heat sink 100 effectively achieves the effect of dust removal.

Please refer to the perspective view of the heat dissipation device of the sixth embodiment of the present invention shown in FIG. Here, for the sake of clarity, the same or similar elements will be described using the same reference numerals, and the same or similar structures in the present embodiment will not be described again.

In the embodiment, the heat dissipation device 100 is sleeved on the column 110 by the openings 131 of the plurality of heat dissipation plates 120. The fins 123 of the adjacent heat dissipation plates 120 are mutually along the axial direction A of the column 110. The stacking arrangement is as follows. Referring to the top view of the heat dissipating device of the sixth embodiment of the present invention shown in FIG. 16, when a plurality of heat dissipating plates 120 are sleeved to the column 110, the fins 123 of the heat dissipating plates 120 are arranged. It will appear as a petal-like structure.

In this embodiment, the number of fins 123 of each of the heat dissipation plates 120 may be increased or decreased according to the needs of the embodiments without departing from the scope of the present invention. Similarly, the heat dissipating device 100 of the fifth embodiment of the present invention has the same heat dissipation effect and dust removing effect as the heat dissipating device 100 of the fifth embodiment, and will not be described again.

Next, please refer to a perspective view of the heat dissipating device of the seventh embodiment of the present invention shown in FIG. 17, and an exploded view of the heat dissipating device of the seventh embodiment of the present invention shown in FIG. Likewise, the same or similar elements will be described using the same element symbols, and the same or similar structures in the above embodiments will not be described again.

In this embodiment, the fixing portion 121 of each of the heat dissipation plates 120 of the heat dissipation device 100 has a plurality of locking holes 133, and the fin strips 123 of the respective heat dissipation plates 120 are disposed around the outer edge of the fixing portion 121, and adjacent to each other. The fin strips 123 of the respective heat dissipation plates 120 are staggered, that is, the respective heat dissipation plates 120 are not completely identical, but correspond to the positions of the plurality of locking holes 133, and the plurality of fins used in the adjacent heat dissipation plates 120. The strips 123 have a distance difference, so that the effect of staggering the fin strips 123 of the adjacent heat dissipation plates 120 can be achieved. Referring to the top view of the heat dissipation device of the seventh embodiment of the present invention shown in FIG. 19, when a plurality of heat dissipation plates 120 are sleeved to the column 110, the fins 123 are filled with the column 110. The outer edge presents a structure like a sunflower.

The heat dissipating device 100 of the present embodiment further includes a plurality of fixing members 143 corresponding to the locking holes 133 of the fixing portion 131. The fixing members 143 are respectively inserted through the respective locking holes 133 to combine the heat dissipation plates 120 and Fixed (step 504 as shown in Figure 26). In this embodiment, the fixing member 143 is achieved by using a screw. The screw can be selectively used to fix the screw according to different requirements. However, in different embodiments, only the screw can be used. Furthermore, it should be noted that although the screw is used as the fixing member 143 in the present embodiment, any one of ordinary skill in the art can achieve the tight fixing of the heat dissipation plate 120 on the cylinder 110. The manner should be covered by the scope of the invention and should not be construed as limiting.

In addition, it should be noted that although the number of the fixing member 143 and the locking hole 133 shown in the 17th, 18th, and 19th drawings corresponding to the embodiment is four groups, it is in the art. For the person having ordinary knowledge, the number of the locking holes 133 and the fixing members 143 may be changed to more or less according to the actual implementation requirements, and should not be limited only by the quantity disclosed in the embodiment. Moreover, the number of the locking holes 133 may be more than the number of the fixing members 143, and should still be covered by the scope of the present invention.

Similarly, the heat dissipation device 100 of the seventh embodiment of the present invention also has the same heat dissipation effect and dust removal effect as the heat dissipation device 100 of the fifth embodiment, and will not be described again.

Please refer to the perspective view of the heat dissipating device of the eighth embodiment of the present invention shown in FIG. The same or similar elements will be described with the same reference numerals, and the same or similar structures in the above embodiments will not be described again.

In the embodiment, the fixing portion 121 of each of the heat dissipation plates 120 of the heat dissipation device 100 has a plurality of locking holes 133. When the plurality of heat dissipation plates 120 are sleeved on the column 110, the fins of the adjacent heat dissipation plates 120 are fins. The strips 123 are arranged in a stack. Please refer to the top view of the heat sink of the eighth embodiment of the present invention shown in FIG. 21. When a plurality of heat sinks 120 are sleeved to the pillars 110, the fins of the heat sinks 120 are Strip 123 will appear as a petal-like structure.

After the plurality of heat dissipation plates 120 are sleeved to the column 110, a plurality of fixing members 143 corresponding to the locking holes 133 are respectively inserted through the respective locking holes 133 to join the heat dissipation plates 120, wherein the locking plates are coupled. The number of holes 133 and fixing members 143 should also not be limited. Similarly, the heat dissipating device 100 of the eighth embodiment of the present invention has the same heat dissipation effect and dust removing effect as the heat dissipating device 100 of the fifth embodiment, and will not be described again.

Next, please refer to the top view of the heat sink of the heat dissipation device of the ninth embodiment of the present invention shown in FIG. In the embodiment, the heat dissipation plate 120 also includes a fixing portion 121 and a plurality of fin strips 123, and an opening 131 is defined in the center of the fixing portion 121. A weight member 125 is disposed on the suspension end of the fin strip 123 (ie, the end of the fin strip 123 away from the fixing portion 121), so that the weight of the suspension end of the fin strip 123 is slightly heavier than the connection end (ie, The weight of the fin strips 123 is connected to the end of the fixing portion 121, so that the fins 123 of the embodiment have different weights at the two ends. Therefore, when the fins 123 generate vibration, the amplitude of the vibration is more enlarged, thereby further The dust removing effect of the heat sink of the embodiment is improved.

It should be noted that any conventional technical means for designing the weight of the suspension end of the fin strip 123 to be slightly heavier than the weight of the connection end should be covered by the present invention. Medium, and should not be limited.

It should be noted that the heat sink 123 provided with a weight member 125 at the suspension end disclosed in the ninth embodiment of the present invention can be selectively applied to the heat dissipation device disclosed in the fifth embodiment to the eighth embodiment. Among 100, to increase the dust removal effect.

As described above, the present invention has an advantage in that a heat dissipating device is formed by stacking a plurality of fins having a plurality of fin strips along the axial direction of the cylinder, and the number of fin strips is large. Therefore, the area for absorbing heat is greatly increased, and since the thickness of the heat dissipation plate is very thin, a good heat conduction effect can be achieved, and thus the heat dissipation effect can be effectively increased.

Furthermore, when the fan is running, the fin strips are blown by the air blown by the fan to cause a slight vibration. Therefore, the dust is not easily attached to the heat sink, and the dust is generated by the vibration generated by the fin strips. Disturbance, effectively achieve the effect of dust removal.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100. . . Heat sink

110. . . Cylinder

A. . . Axial direction

120. . . Radiating plate

121. . . Fixed part

123. . . Fin strip

131. . . Opening

133. . . Locking hole

143. . . Fastener

150. . . fan

701. . . Heating element

702. . . Substrate

125. . . Counterweight

Step 500 stacking a plurality of heat dissipation plates along the axial direction

Step 501 combines the fixing portions of the heat dissipation plates

Step 502: Setting the fan on the heat sink

Step 503: the opening of each of the fixing portions is inserted in the axial direction of the cylinder

Step 504: The fixing hole is inserted through the fixing hole of each fixing portion

1 is a perspective view of a heat sink according to a first embodiment of the present invention.

2 is an exploded perspective view of a heat sink according to a first embodiment of the present invention.

Figure 3 is a top plan view of a heat sink according to a first embodiment of the present invention.

Fig. 4 is a perspective view showing the heat dissipating device of the first embodiment of the present invention with a fan.

Figure 5 is a perspective view of a heat sink according to a second embodiment of the present invention.

Figure 6 is a top plan view of a heat sink according to a second embodiment of the present invention.

Figure 7 is a perspective view of a heat sink according to a third embodiment of the present invention.

Figure 8 is an exploded perspective view of a heat sink according to a third embodiment of the present invention.

Figure 9 is a top plan view of a heat sink of a heat sink according to a fourth embodiment of the present invention.

Figure 10 is a perspective view of a heat sink according to a fifth embodiment of the present invention.

Figure 11 is an exploded perspective view of a heat sink according to a fifth embodiment of the present invention.

Figure 12 is a top plan view of a heat sink according to a fifth embodiment of the present invention.

Figure 13 is a perspective view showing the heat sink of the fifth embodiment of the present invention with a fan.

Fig. 14 is a side view showing the heat dissipating device of the fifth embodiment of the present invention applied to a heat generating component.

Figure 15 is a perspective view of a heat sink according to a sixth embodiment of the present invention.

Figure 16 is a top plan view of a heat sink according to a sixth embodiment of the present invention.

Figure 17 is a perspective view of a heat sink according to a seventh embodiment of the present invention.

Figure 18 is an exploded perspective view of a heat sink according to a seventh embodiment of the present invention.

Figure 19 is a top plan view of a heat sink according to a seventh embodiment of the present invention.

Figure 20 is a perspective view of a heat sink according to an eighth embodiment of the present invention.

Figure 21 is a top plan view of a heat sink according to an eighth embodiment of the present invention.

Figure 22 is a top plan view showing a heat sink of a heat sink according to a ninth embodiment of the present invention.

Figure 23 is a flow chart showing the steps of the heat sink according to the first embodiment of the present invention.

Figure 24 is a flow chart showing the steps of installing a fan in the heat sink of the first embodiment of the present invention.

Figure 25 is a flow chart showing the steps of the heat sink according to the fifth embodiment of the present invention.

Figure 26 is a flow chart showing the steps of a heat sink according to a seventh embodiment of the present invention.

100. . . Heat sink

110. . . Cylinder

120. . . Radiating plate

Claims (13)

A heat dissipating device includes: a plurality of heat dissipating plates stacked in an axial direction, wherein each of the heat dissipating plates includes: a fixing portion, each of the heat dissipating plates being stacked and joined to each other by the fixing portion; and a plurality of fins Strips are spaced apart from the outer edge of the fixing portion. The heat dissipating device of claim 1, further comprising a cylinder disposed along the axial direction, each of the fixing portions further having an opening, wherein each of the fixing portions is sleeved on the cylinder Outer edge. The heat dissipation device of claim 2, wherein the material of the column and the heat dissipation plate is one of aluminum, copper, copper alloy or a combination thereof. The heat dissipating device of claim 1, wherein the fin strips of the adjacent ones of the heat dissipating plates are staggered, stacked, or a combination thereof. The heat dissipating device of claim 1, further comprising a plurality of fixing members, wherein the fixing portion further has a plurality of locking holes, corresponding to the fixing members, each of the fixing members respectively passing through the respective locking members Holes to join the heat sinks. The heat sink of claim 5, wherein the fixing member is a screw. The heat sink of claim 1, further comprising a fan disposed on the heat sink. The heat sink of claim 1, wherein each of the fin strips has an opposite suspension end and a connection end, the connection end being coupled to one end of the fixing portion, the suspension end further having a weight Pieces. A method for assembling a heat dissipating device includes the steps of: stacking a plurality of heat dissipating plates along an axial direction; and combining the fixing portions of the heat dissipating plates to form the heat dissipating device. The method of assembling the heat dissipating device of claim 9, further comprising the steps of: inserting, by the column, one opening of each of the fixing portions along the axial direction, and the fixing portion is sleeved on the fixing portion The outer edge of the cylinder. The method for assembling a heat sink according to claim 9 further comprising the steps of: inserting a plurality of locking holes of each of the fixing portions with a plurality of fixing members to join the heat dissipation plates. The method for assembling a heat sink according to claim 9, further comprising the step of: providing a fan on the heat dissipation plates. The method of assembling a heat sink according to claim 9, wherein after the step of stacking the plurality of heat sinks along the axial direction, the method further comprises the steps of: adjusting a position of each of the heat sinks, A plurality of fin strips adjacent to each of the heat dissipation plates are staggered, stacked, or a combination thereof.