TW201316889A - Thermal module and fixing method thereof - Google Patents
Thermal module and fixing method thereof Download PDFInfo
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- TW201316889A TW201316889A TW100136833A TW100136833A TW201316889A TW 201316889 A TW201316889 A TW 201316889A TW 100136833 A TW100136833 A TW 100136833A TW 100136833 A TW100136833 A TW 100136833A TW 201316889 A TW201316889 A TW 201316889A
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- heat dissipation
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 48
- 238000003825 pressing Methods 0.000 claims description 40
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- 239000004519 grease Substances 0.000 description 12
- 238000005452 bending Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004838 Heat curing adhesive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- UBPAPMPMQOUVNZ-UHFFFAOYSA-N copper nickel niobium Chemical compound [Cu][Ni][Nb] UBPAPMPMQOUVNZ-UHFFFAOYSA-N 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/08—Fastening; Joining by clamping or clipping
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/20—Fastening; Joining with threaded elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明涉及一種散熱模組及其固定方法，特別是一種用於對電子產品散熱的散熱模組及其固定方法。The invention relates to a heat dissipation module and a fixing method thereof, in particular to a heat dissipation module for dissipating heat of an electronic product and a fixing method thereof.
目前全球掀起了筆記本薄型化及平板電腦的熱潮，這些薄型系統在空間受限的情況下，使得散熱模組無法使用傳統的彈簧螺絲組來鎖固，目前一般會採用彈片組以取代彈簧螺絲組。現有的固定散熱模組的彈片組常需借助一板件來實現散熱模組的熱管與彈片的固定配合。彈片通過鉚接、扣接等方式固定於板件上，或者直接與板件一體成型。板件與熱管焊接，並通過彈片所產生的彈力與發熱元件接觸。然而，現有的此種彈片與板件的固定結構由於需要進行鉚接或扣接，導致組裝過程較為繁瑣；並且，板件的使用也會導致材料的增加，從而造成製造成本的上升。而彈片與板件一體成型的結構則由於製造工藝的限制導致所需的材料面積較大，從而也影響到製造成本的控制。此外，由於彈片需要鉚合在板件或壓鑄件上，沒有板件就無法固定彈片在散熱模組上，故難以避免成本高昂的問題。At present, there is a boom in thin notebooks and tablet PCs in the world. These thin systems can't be locked with traditional spring screw sets in space-constrained situations. Currently, shrapnel sets are generally used instead of spring screw sets. . The existing shrapnel group of the fixed heat dissipating module often needs a plate member to realize the fixed cooperation between the heat pipe and the shrapnel of the heat dissipating module. The elastic piece is fixed to the plate by riveting, fastening, or the like, or directly formed integrally with the plate. The plate is welded to the heat pipe and is in contact with the heat generating component by the elastic force generated by the elastic piece. However, the existing fixing structure of the shrapnel and the plate member requires riveting or fastening because of the need for riveting or fastening, and the assembly process is cumbersome; and the use of the plate member also leads to an increase in material, thereby causing an increase in manufacturing cost. The structure in which the elastic piece and the plate piece are integrally formed has a large material area required due to the limitation of the manufacturing process, thereby also affecting the control of the manufacturing cost. In addition, since the elastic piece needs to be riveted to the plate member or the die-casting member, the elastic piece cannot be fixed on the heat-dissipating module without the plate member, so that it is difficult to avoid the problem of high cost.
因此，有必要提供一種製造成本較低的散熱模組及其固定方法。Therefore, it is necessary to provide a heat dissipation module with a lower manufacturing cost and a fixing method thereof.
一種散熱模組，用於對安裝在電路板上的電子元件散熱，其包括一熱管及一彈片結構，該彈片結構包括一直接焊接於熱管上的抵壓部及一固定至電路板的固定部，該彈片結構的抵壓部對該熱管施力使其與電子元件熱接觸。A heat dissipation module for dissipating heat from an electronic component mounted on a circuit board, comprising a heat pipe and a spring structure, the spring structure comprising a pressing portion directly welded to the heat pipe and a fixing portion fixed to the circuit board The pressing portion of the elastic piece structure urges the heat pipe to make thermal contact with the electronic component.
一種散熱模組的固定方法，其步驟包括：提供一熱管及一彈片結構，該彈片結構包括一抵壓部及與一抵壓部連接的固定部；將該彈片結構的抵壓部焊接於該熱管上；將該彈片結構的固定部固定在一電路板上，使抵壓部帶動熱管與電路板上的一電子元件熱接觸。A method for fixing a heat dissipation module, the method comprising: providing a heat pipe and a spring structure, the spring structure comprising a pressing portion and a fixing portion connected to a pressing portion; welding the pressing portion of the elastic piece structure to the The fixing portion of the elastic structure is fixed on a circuit board, so that the pressing portion drives the heat pipe to be in thermal contact with an electronic component on the circuit board.
由於該散熱模組的彈片結構直接焊接在熱管上，因此無需借助板體來實現彈片與熱管之間的配合固定。由此，可省去傳統的鉚合或扣接工序，從而節省工時並降低成本。Since the elastic structure of the heat dissipation module is directly welded to the heat pipe, the cooperation between the elastic piece and the heat pipe is not required by the plate body. Thereby, the conventional riveting or fastening process can be omitted, thereby saving man-hours and reducing costs.
請同時參閱圖1-2，示出了本發明第一實施例的散熱模組100的立體圖及部分分解圖。該散熱模組100包括一熱管10、一彈片結構20及四個螺絲30。該彈片結構20用以將熱管10固定於電路板200上，並將熱管10的蒸發端貼設於電路板200上的電子元件240表面。為使得該熱管10與該電子元件240更充分地貼合，其貼合面還可塗有一層散熱膏40。該熱管10呈長扁狀並由左到右延伸，其具有一與電子元件240接觸的下表面以及一與該下表面相對的上表面。散熱膏40位於熱管10的下表面。該彈片結構20由左右分佈的第一彈片21和第二彈片22組成。第一彈片21整體呈一開口向左的“U型”，其由第一固定部212、第二固定部214以及一連接該第一固定部212以及該第二固定部214的抵壓部216三部分組成。該抵壓部216包含一沿前後方向延伸的水平板，其長度等於或略大於該熱管10的寬度，該抵壓部216還包含前後兩端向下延伸的垂直板，分別用以連接第一固定部212和第二固定部214。抵壓部216前端的垂直板向水平方向延伸出第一固定部212。該第一固定部212先向前延伸後再垂直向左延伸，並在其最左端延伸出一向下階梯狀的彎折，該向下階梯狀的彎折設有螺絲30。抵壓部216後端的垂直板向水平方向延伸出第二固定部214。該第二固定部214自抵壓部216後端的垂直板向左延伸，並在其最左端延伸出一向下階梯狀的彎折，該向下階梯狀的彎折設有螺絲30。抵壓部216的水平板位於比第一固定部212和第二固定部214略高的水平面上，而且該高度為抵壓部216的垂直板的高度，並等於或略大於熱管10的厚度。第二彈片22具有與第一彈片21對稱相同的形狀與結構，其由第一固定部222、第二固定部224以及向上突起並連接該第一固定部222與該第二固定部224的抵壓部226組成，整體呈一開口向右的“U型”。第二彈片22的最右端同樣設有兩個螺絲30。組裝時，第一彈片21與第二彈片22位於熱管10的上方並橫跨熱管10的前後兩側。該第一彈片21與該第二彈片22對準並在左右方向上隔開一段距離，即第一彈片21的抵壓部216與第二彈片22的抵壓部226對齊並隔開一段距離，該段距離的長短由電路板200上的電子元件240的大小決定。抵壓部216、226抵壓熱管10的上表面以及對應的前後側，其水平段以錫膏焊接或是接著膠(例如Dow Corning SE4450 高導熱加熱固化接著膠、EPORITE 2095 高黏度電子級接著膠)貼合固定在熱管10的上表面上。位於彈片結構20的左右兩端的四個螺絲30鎖在電路板200上時，熱管10被固定在電路板200上，並且熱管10的對應於第一彈片21和第二彈片22隔開的空位的下表面貼合在電子元件240上，該熱管10的下表面與電子元件240之間塗有一層散熱膏40。借由四個螺絲30將彈片結構20固定在電路板200上，該彈片結構20給熱管10施一向下壓力使其與電子元件240緊密接觸。當電子元件240運作時，其產生的熱量可借由固定在其上方的熱管10的蒸發端傳輸到冷凝端散去。Referring to FIG. 1-2, a perspective view and a partially exploded view of the heat dissipation module 100 of the first embodiment of the present invention are shown. The heat dissipation module 100 includes a heat pipe 10, a spring structure 20 and four screws 30. The shrapnel structure 20 is used to fix the heat pipe 10 to the circuit board 200, and the evaporation end of the heat pipe 10 is attached to the surface of the electronic component 240 on the circuit board 200. In order to make the heat pipe 10 and the electronic component 240 more closely fit, the bonding surface may also be coated with a thermal grease 40. The heat pipe 10 is elongated and extends from left to right and has a lower surface in contact with the electronic component 240 and an upper surface opposite the lower surface. The thermal grease 40 is located on the lower surface of the heat pipe 10. The shrapnel structure 20 is composed of a first elastic piece 21 and a second elastic piece 22 distributed left and right. The first elastic piece 21 is integrally formed with an opening U-shaped opening, and the first fixing portion 212, the second fixing portion 214, and a pressing portion 216 connecting the first fixing portion 212 and the second fixing portion 214. Three parts. The pressing portion 216 includes a horizontal plate extending in the front-rear direction, the length of which is equal to or slightly larger than the width of the heat pipe 10, and the pressing portion 216 further includes a vertical plate extending downward from the front and rear ends for respectively connecting the first plate. The fixing portion 212 and the second fixing portion 214. The vertical plate at the front end of the pressing portion 216 extends in the horizontal direction from the first fixing portion 212. The first fixing portion 212 extends forwardly and then extends vertically to the left, and a downward stepped bend is extended at the leftmost end thereof, and the downward stepped bending is provided with a screw 30. The vertical plate at the rear end of the pressing portion 216 extends in the horizontal direction from the second fixing portion 214. The second fixing portion 214 extends leftward from the vertical plate at the rear end of the pressing portion 216, and has a downward stepped bending at the leftmost end thereof, and the downward stepped bending is provided with a screw 30. The horizontal plate of the pressing portion 216 is located at a level slightly higher than the first fixing portion 212 and the second fixing portion 214, and the height is the height of the vertical plate of the pressing portion 216 and is equal to or slightly larger than the thickness of the heat pipe 10. The second elastic piece 22 has the same shape and structure as the first elastic piece 21 , and is protruded from the first fixing portion 222 , the second fixing portion 224 , and the upper fixing portion 222 and the second fixing portion 224 . The pressing portion 226 is composed of a "U-shaped" opening to the right as a whole. The second right end of the second elastic piece 22 is also provided with two screws 30. When assembled, the first elastic piece 21 and the second elastic piece 22 are located above the heat pipe 10 and span the front and rear sides of the heat pipe 10. The first elastic piece 21 is aligned with the second elastic piece 22 and spaced apart in the left-right direction, that is, the pressing portion 216 of the first elastic piece 21 is aligned with the pressing portion 226 of the second elastic piece 22 and separated by a distance. The length of the length of the segment is determined by the size of the electronic component 240 on the circuit board 200. The pressing portions 216 and 226 are pressed against the upper surface of the heat pipe 10 and the corresponding front and rear sides, and the horizontal sections thereof are soldered with solder paste or glued together (for example, Dow Corning SE4450 high heat conduction heat curing adhesive, EPORITE 2095 high viscosity electronic grade adhesive) The bonding is fixed to the upper surface of the heat pipe 10. When the four screws 30 located at the left and right ends of the elastic structure 20 are locked on the circuit board 200, the heat pipe 10 is fixed on the circuit board 200, and the vacancies of the heat pipe 10 corresponding to the first elastic piece 21 and the second elastic piece 22 are separated. The lower surface is attached to the electronic component 240, and a thermal grease 40 is applied between the lower surface of the heat pipe 10 and the electronic component 240. The shrapnel structure 20 is secured to the circuit board 200 by four screws 30 that apply a downward pressure to the heat pipe 10 for intimate contact with the electronic component 240. When the electronic component 240 operates, the heat generated by it can be dissipated to the condensation end by the evaporation end of the heat pipe 10 fixed above it.
請同時參閱圖3-4，示出了本發明第二實施例的散熱模組100a的立體圖及部分分解圖。該散熱模組100a與第一實施例中的散熱模組100相似，均由一熱管10a，一彈片結構20a，四個螺絲30a組成。該彈片結構20a用以將熱管10a固定於電路板200上，並將熱管10a的蒸發端貼設於電路板200上的電子元件240表面。為使得該熱管10a與該電子元件240更充分地貼合，其貼合面塗有一層散熱膏40。該熱管10a呈長扁狀由左到右延伸，其具有一與電子元件240接觸的下表面以及一與該下表面相對的上表面。散熱膏40位於熱管10a的下表面。該彈片結構20a由前後分佈的第一彈片21a和第二彈片22a組成。該第一彈片21a包含位於左端的第一固定部212a、位於右端的第二固定部222a以及位於後端並連接該第一固定部212a與該第二固定部214a的抵壓部216a。該抵壓部216a包含一沿與熱管10a的延伸方向的相同方向延伸的水平板，其寬度等於或略小於二分之一該熱管10a的寬度，該抵壓部216a前端靠近其左端和右端處還包含向下延伸的垂直板，分別用以連接第一固定部212a和第二固定部214a。該抵壓部216a靠近其左端的位置處的垂直板向水平方向延伸出第一固定部212a。該第一固定部212a先向前延伸再向左延伸，並在其最左端處延伸出一向下階梯狀的彎折，該向下階梯狀的彎折設有螺絲30a。該抵壓部216a靠近其右端的位置處的垂直板向水平方向延伸出第二固定部214a。該第二固定部214a先向前延伸再向右延伸，並在其最右端處延伸出一向下階梯狀的彎折，該向下階梯狀的彎折設有螺絲30a。第二彈片22a具有與第一彈片21a對稱相似的形狀與結構，其由第一固定部222a、第二固定部224a以及向上突起並連接該第一固定部222a與該第二固定部224a的抵壓部226a組成。第二彈片22a的第一固定部222a和第二固定部224a只包含向左和向右延伸的部分，不包含向後延伸的部分。第二彈片22a的第一固定部222a和第二固定部224a的最左端和最右端同樣包含設有螺絲30a的向下階梯狀。與第一實施例中的結合方式一樣，該彈片結構20a的兩個抵壓部216a和226a對齊並分別以錫膏焊接或者接著膠貼合固定在熱管10a的上表面。位於彈片結構20a左右兩端的四個螺絲30a鎖在電路板200上時，熱管10a被固定在電路板200上，並由熱管10a對應抵壓部216a、226a的下表面貼合電子元件240，該熱管10a的下表面與電子元件240之間還具有一層散熱膏40。同樣地，借由四個螺絲30a將彈片結構20a固定在電路板200上，該彈片結構20a給熱管10a施一向下壓力使其與電子元件240緊密接觸。Referring to FIG. 3-4, a perspective view and a partially exploded view of the heat dissipation module 100a according to the second embodiment of the present invention are shown. The heat dissipation module 100a is similar to the heat dissipation module 100 of the first embodiment, and is composed of a heat pipe 10a, a spring structure 20a, and four screws 30a. The elastic structure 20a is used for fixing the heat pipe 10a to the circuit board 200, and the evaporation end of the heat pipe 10a is attached to the surface of the electronic component 240 on the circuit board 200. In order to make the heat pipe 10a and the electronic component 240 more closely adhere, the bonding surface is coated with a thermal grease 40. The heat pipe 10a extends in a long flat shape from left to right and has a lower surface in contact with the electronic component 240 and an upper surface opposite to the lower surface. The thermal grease 40 is located on the lower surface of the heat pipe 10a. The elastic piece structure 20a is composed of a first elastic piece 21a and a second elastic piece 22a which are distributed forward and backward. The first elastic piece 21a includes a first fixing portion 212a at the left end, a second fixing portion 222a at the right end, and a pressing portion 216a at the rear end and connecting the first fixing portion 212a and the second fixing portion 214a. The pressing portion 216a includes a horizontal plate extending in the same direction as the extending direction of the heat pipe 10a, the width of which is equal to or slightly smaller than the width of one-half of the heat pipe 10a, and the front end of the pressing portion 216a is near the left end and the right end thereof. A vertical plate extending downward is further included for connecting the first fixing portion 212a and the second fixing portion 214a, respectively. The vertical plate at the position of the pressing portion 216a near the left end thereof extends in the horizontal direction from the first fixing portion 212a. The first fixing portion 212a extends forward and then extends to the left, and extends at a leftmost end thereof with a downward stepped bending, and the downward stepped bending is provided with a screw 30a. The vertical plate at the position of the pressing portion 216a near the right end thereof extends in the horizontal direction from the second fixing portion 214a. The second fixing portion 214a extends forward and then extends to the right, and extends at a rightmost end thereof with a downward stepped bend, and the downward stepped bend is provided with a screw 30a. The second elastic piece 22a has a shape and structure similar to the first elastic piece 21a, and is formed by the first fixing portion 222a, the second fixing portion 224a, and the upward protruding portion and connecting the first fixing portion 222a and the second fixing portion 224a. The pressing portion 226a is composed of. The first fixing portion 222a and the second fixing portion 224a of the second elastic piece 22a include only a portion extending leftward and rightward, and do not include a portion extending rearward. The leftmost end and the rightmost end of the first fixing portion 222a and the second fixing portion 224a of the second elastic piece 22a also include a downward stepped shape in which the screw 30a is provided. As in the first embodiment, the two pressing portions 216a and 226a of the elastic piece structure 20a are aligned and fixed to the upper surface of the heat pipe 10a by solder paste bonding or adhesive bonding, respectively. When the four screws 30a located at the left and right ends of the elastic structure 20a are locked on the circuit board 200, the heat pipe 10a is fixed on the circuit board 200, and the electronic component 240 is attached to the lower surface of the heat pipe 10a corresponding to the pressing portions 216a, 226a. There is also a layer of thermal grease 40 between the lower surface of the heat pipe 10a and the electronic component 240. Similarly, the shrapnel structure 20a is fixed to the circuit board 200 by four screws 30a which apply a downward pressure to the heat pipe 10a to be in close contact with the electronic component 240.
請同時參閱圖5-6，示出了本發明第三實施例的散熱模組100b的立體圖及部分分解圖。該散熱模組100b與第一實施例中的散熱模組100相似，均由一熱管10b，一彈片結構20b，四個螺絲30b組成。該彈片結構20b用以將熱管10b的蒸發端固定於電路板200上，並將熱管10b的蒸發端貼設於電路板200上的電子元件240表面。為使得該熱管10b與該電子元件240更充分地貼合，其貼合面塗有一層散熱膏40。該熱管10b呈長扁狀由左到右延伸，其具有一與電子元件240接觸的下表面以及一與該下表面相對的上表面。散熱膏40位於熱管10b的下表面。該彈片結構20b由左右分佈的第一彈片21b和第二彈片22b組成。第一彈片21b呈一開口向左的“U型”，其包括與熱管10b的延伸方向平行的前後兩部分以及橫跨熱管10b的垂直部分，該前後兩部分的最左端分別設有螺絲30b。第二彈片22b呈一開口向右的“U型”，其包括與熱管10b的延伸方向平行的前後兩部分以及橫跨熱管10b的垂直部分，該前後兩部分的最右端分別設有螺絲30b。該第一彈片21b及第二彈片22b均為平坦的片狀結構，未在豎直方向上有任何彎折。組合時，彈片結構20b位於熱管10b的下方，該第一彈片21b與該第二彈片22b對準並在左右方向上隔開一段距離，其橫跨熱管10b的兩個垂直部分通過焊接或接著膠貼合固定在熱管10b的下表面。也即是說，熱管10b與彈片結構20b接觸以及與電子元件240接觸為同一表面。位於彈片結構20b的左右兩端的四個螺絲30b鎖在電路板200上時，熱管10b被固定在電路板200上，並且由熱管10b的對應第一彈片21b和第二彈片22b隔開的下表面貼合在電子元件240上，該熱管10b的下表面與電子元件240之間塗有一層散熱膏40。與前兩個實施例不同，本實施例中的彈片結構20b是與熱管10b的下表面接觸，故該彈片結構20b給熱管10b施一向下拉力使其與電子元件240緊密接觸。5-6, a perspective view and a partially exploded view of the heat dissipation module 100b according to the third embodiment of the present invention are shown. The heat dissipation module 100b is similar to the heat dissipation module 100 of the first embodiment, and is composed of a heat pipe 10b, a spring structure 20b, and four screws 30b. The elastic structure 20b is used to fix the evaporation end of the heat pipe 10b to the circuit board 200, and the evaporation end of the heat pipe 10b is attached to the surface of the electronic component 240 on the circuit board 200. In order to make the heat pipe 10b and the electronic component 240 more closely adhere, the bonding surface is coated with a thermal grease 40. The heat pipe 10b extends from left to right in a long flat shape, and has a lower surface in contact with the electronic component 240 and an upper surface opposite to the lower surface. The thermal grease 40 is located on the lower surface of the heat pipe 10b. The elastic piece structure 20b is composed of a first elastic piece 21b and a second elastic piece 22b which are distributed left and right. The first elastic piece 21b is an "U-shaped" opening to the left, and includes two front and rear portions parallel to the extending direction of the heat pipe 10b and a vertical portion spanning the heat pipe 10b, and the leftmost ends of the front and rear portions are respectively provided with screws 30b. The second elastic piece 22b has a "U-shaped" opening to the right, and includes two front and rear portions parallel to the extending direction of the heat pipe 10b and a vertical portion spanning the heat pipe 10b, and the rightmost ends of the front and rear portions are respectively provided with screws 30b. The first elastic piece 21b and the second elastic piece 22b are both flat sheet-like structures without any bending in the vertical direction. When assembled, the elastic structure 20b is located below the heat pipe 10b, and the first elastic piece 21b is aligned with the second elastic piece 22b and spaced apart in the left-right direction, and is welded or glued across the two vertical portions of the heat pipe 10b. The bonding is fixed to the lower surface of the heat pipe 10b. That is to say, the heat pipe 10b is in contact with the elastic structure 20b and is in contact with the electronic component 240. When the four screws 30b located at the left and right ends of the elastic structure 20b are locked on the circuit board 200, the heat pipe 10b is fixed to the circuit board 200, and the lower surface of the heat pipe 10b is separated from the corresponding first elastic piece 21b and the second elastic piece 22b. The electronic component 240 is attached to the electronic component 240. A thermal grease 40 is applied between the lower surface of the heat pipe 10b and the electronic component 240. Different from the first two embodiments, the elastic structure 20b in this embodiment is in contact with the lower surface of the heat pipe 10b, so that the elastic structure 10b applies a downward pulling force to the heat pipe 10b to be in close contact with the electronic component 240.
請同時參閱圖7-8，示出了本發明第四實施例的散熱模組100c的立體圖及部分分解圖。該散熱模組100c第一實施例中的散熱模組100基本相同，均包括一熱管10c，一彈片結構20c，四個螺絲30c。不同之處在於，本實施中的散熱模組100c還包含一金屬材質的板件50c。該彈片結構20c具有與第一實施例中的散熱模組100的彈片結構20相同的形狀結構，並且該彈片結構20c與該熱管10c的固定方式與第一實施例中的彈片結構20與該熱管10的固定方式相同。該板體50c焊接在該熱管10c下表面對應與電子元件240接觸的位置處，再通過散熱膏40與電子元件240接觸。借由四個螺絲30c將彈片結構20c固定在電路板200上，該彈片結構20c給熱管10施一向下壓力使其抵壓該板體50c與電子元件240緊密接觸。7-8, a perspective view and a partially exploded view of a heat dissipation module 100c according to a fourth embodiment of the present invention are shown. The heat dissipation module 100 of the first embodiment of the heat dissipation module 100c is substantially identical, and includes a heat pipe 10c, a spring structure 20c, and four screws 30c. The difference is that the heat dissipation module 100c in this embodiment further includes a metal plate member 50c. The shrapnel structure 20c has the same shape structure as the shrapnel structure 20 of the heat dissipation module 100 of the first embodiment, and the manner of fixing the shrapnel structure 20c and the heat pipe 10c with the shrapnel structure 20 and the heat pipe in the first embodiment 10 is fixed in the same way. The plate body 50c is soldered to a position where the lower surface of the heat pipe 10c contacts the electronic component 240, and is then in contact with the electronic component 240 through the thermal grease 40. The shrapnel structure 20c is fixed to the circuit board 200 by four screws 30c. The shrapnel structure 20c applies a downward pressure to the heat pipe 10 to press the plate body 50c into close contact with the electronic component 240.
請同時參閱圖9-10，示出了本發明第五實施例的散熱模組100d的立體圖及部分分解圖。該散熱模組100d包括一熱管10d，一彈片結構20d，四個螺絲30c以及一板體50d。該熱管10d的蒸發端呈一圓柱形由左向右延伸。該彈片結構20d由左右分佈的第一彈片21d和第二彈片22d組成。該第一彈片21d橫跨熱管10d的前後兩端設置，其中部位置靠近熱管10d位置處向上凸伸出一與熱管10d的橫截面相匹配的圓拱形抵壓部216d。第二彈片22d具有與第一彈片21d相同的結構，均在其中部位置靠近熱管10d的位置處向上凸伸出一相同形狀的抵壓部226d。第一彈片21d和第二彈片22d的前後兩端分別設有螺絲30。板體50d整體呈一矩形平板狀，由於熱管10d的蒸發端為圓柱形，為使板體50d與熱管10d有更好的接觸，板體50d上還包含一對應於熱管10d的凹槽51d。組合時，該板體50d焊接於熱管10d的下端，該第一彈片21d和該第二彈片22d在左右方向上隔開一段與板體50d的左右長度對應的距離，並將其抵壓部216d、226d焊接或者通過接著膠貼合固定在熱管10d上。位於彈片結構20d的前後兩端的四個螺絲30d鎖在電路板200上時，熱管10d抵壓板體50d貼合在電子元件240上。為使該板體50d與電子元件240更充分地貼合，其接觸面上還可塗有一層導熱膏40。借由四個螺絲30d將彈片結構20d固定在電路板200上，該彈片結構20d給熱管10d施一向下壓力使板體50d與電子元件240緊密接觸。Referring to FIG. 9-10, a perspective view and a partially exploded view of a heat dissipation module 100d according to a fifth embodiment of the present invention are shown. The heat dissipation module 100d includes a heat pipe 10d, a spring structure 20d, four screws 30c and a plate body 50d. The evaporation end of the heat pipe 10d has a cylindrical shape extending from left to right. The elastic piece structure 20d is composed of a first elastic piece 21d and a second elastic piece 22d which are distributed left and right. The first elastic piece 21d is disposed across the front and rear ends of the heat pipe 10d, and a central portion thereof is convexly protruded from a position close to the heat pipe 10d to form a round arched pressing portion 216d matching the cross section of the heat pipe 10d. The second elastic piece 22d has the same structure as the first elastic piece 21d, and protrudes upwardly from the same position of the pressing portion 226d at a position where the middle portion is close to the heat pipe 10d. Screws 30 are respectively provided at the front and rear ends of the first elastic piece 21d and the second elastic piece 22d. The plate body 50d has a rectangular plate shape as a whole. Since the evaporation end of the heat pipe 10d is cylindrical, in order to make the plate body 50d have better contact with the heat pipe 10d, the plate body 50d further includes a groove 51d corresponding to the heat pipe 10d. When assembled, the plate body 50d is welded to the lower end of the heat pipe 10d, and the first elastic piece 21d and the second elastic piece 22d are spaced apart from each other in the left-right direction by a distance corresponding to the left and right lengths of the plate body 50d, and the pressing portion 216d is provided. , 226d is welded or fixed to the heat pipe 10d by adhesive bonding. When the four screws 30d located at the front and rear ends of the elastic structure 20d are locked on the circuit board 200, the heat pipe 10d is pressed against the electronic component 240 by the pressing plate 50d. In order to make the plate body 50d and the electronic component 240 more fully adhered, a contact layer 40 may be coated on the contact surface. The shrapnel structure 20d is fixed to the circuit board 200 by four screws 30d. The shrapnel structure 20d applies a downward pressure to the heat pipe 10d to bring the plate body 50d into close contact with the electronic component 240.
上述五個實施例中的彈片結構20、20a、20b、20c、20d均具有抵壓部216、216a、216d、226、226a、226d，均是以焊接或者接著膠貼合固定的方式固定在熱管10、10a、10b、10c、10d上。本發明中的五個實施例中的彈片結構20、20a、20b、20c、20d以及第四、第五實施例中的板件50c、50d均由抗拉/降伏程度與不銹鋼相似的金屬合金（如鈸銅、銅鎳矽或鈦銅）製作而成，解決了傳統的不銹鋼材質與銅（或鋁）材上的拒焊問題。又由於第四、第五實施例中的彈片結構20c、20d以及板件50c、50d是獨立城型的，解決了製造彈片結構20c、20d和板體50c、50d時因金屬材料面積較大而產生的材料和成本問題。由於散熱模組100、100a、100b、100c、100d在安裝於電路板200前已將其彈片結構20、20a、20b、20c、20d通過回焊爐烘烤固定於其熱管10、10a、10b、10c、10d上，組裝只需螺合螺絲30、30a、30b、30c、30d與電路板200上，又或者採用直接焊接等其他固定方式，可省去傳統的鉚合或扣接的工序，也避免了因板件50c、50d太薄而在鉚合過程中可能產生的變形問題。並且第一至三實施例中由於省去了板體而將彈片結構20、20a、20b直接固定至熱管10、10a、10b上，因此可節省成本。可以理解地，各實施例中的散熱模組100、100a、100b、100c、100d可以包含多於一根的熱管10、10a、10b、10c、10d，該多根熱管10、10a、10b、10c、10d可相互緊挨著並列排布或相間由多個抵壓部216、216a、216d、226、226a、226d分別固定。在第一、第三、第四、第五實施例中，該彈片結構20、20b、20c、20d也可只包含第一彈片21、21b、21c、21d。The elastic structure 20, 20a, 20b, 20c, 20d in the above five embodiments each have a pressing portion 216, 216a, 216d, 226, 226a, 226d, which are fixed to the heat pipe by welding or adhesive bonding. 10, 10a, 10b, 10c, 10d. The shrapnel structures 20, 20a, 20b, 20c, 20d and the plates 50c, 50d in the fourth and fifth embodiments of the present invention are each made of a metal alloy having a tensile/lowering degree similar to that of stainless steel ( Made of beryllium copper, copper nickel niobium or titanium copper, it solves the problem of soldering on traditional stainless steel and copper (or aluminum). Moreover, since the elastic piece structures 20c and 20d and the plate pieces 50c and 50d in the fourth and fifth embodiments are of an independent city type, the manufacturing of the elastic piece structures 20c and 20d and the plate bodies 50c and 50d is solved due to the large metal material area. Material and cost issues. Since the heat dissipation modules 100, 100a, 100b, 100c, 100d have their shrapnel structures 20, 20a, 20b, 20c, 20d fixed to their heat pipes 10, 10a, 10b by reflow oven before being mounted on the circuit board 200, 10c, 10d, the assembly only needs to screw the screws 30, 30a, 30b, 30c, 30d and the circuit board 200, or other fixed means such as direct welding, can save the traditional riveting or fastening process, also The deformation problem that may occur during the riveting process due to the fact that the plates 50c, 50d are too thin is avoided. Also, in the first to third embodiments, since the shrapnel structures 20, 20a, 20b are directly fixed to the heat pipes 10, 10a, 10b by omitting the plate body, cost can be saved. It can be understood that the heat dissipation modules 100, 100a, 100b, 100c, 100d in each embodiment may include more than one heat pipe 10, 10a, 10b, 10c, 10d, the plurality of heat pipes 10, 10a, 10b, 10c 10d may be arranged next to each other or in parallel by a plurality of pressing portions 216, 216a, 216d, 226, 226a, 226d. In the first, third, fourth, and fifth embodiments, the elastic structure 20, 20b, 20c, 20d may also include only the first elastic pieces 21, 21b, 21c, 21d.
100、100a、100b、100c、100d．．．散熱模組100, 100a, 100b, 100c, 100d. . . Thermal module
10、10a、10b、10c、10d．．．熱管10, 10a, 10b, 10c, 10d. . . Heat pipe
20、20a、20b、20c、20d．．．彈片結構20, 20a, 20b, 20c, 20d. . . Shrapnel structure
21、21a、21b、21c、21d．．．第一彈片21, 21a, 21b, 21c, 21d. . . First shrapnel
22、22a、22b、22c、22d．．．第二彈片22, 22a, 22b, 22c, 22d. . . Second shrapnel
212、212a、212d、222、222a、222d．．．第一固定部212, 212a, 212d, 222, 222a, 222d. . . First fixed part
214、214a、214d、224、224a、224d．．．第二固定部214, 214a, 214d, 224, 224a, 224d. . . Second fixed part
216、216a、216d、226、226a、226d．．．抵壓部216, 216a, 216d, 226, 226a, 226d. . . Compression department
30、30a、30b、30c、30d．．．螺絲30, 30a, 30b, 30c, 30d. . . Screw
40．．．散熱膏40. . . Thermal grease
50c、50d．．．板件50c, 50d. . . Plate
51d．．．凹槽51d. . . Groove
200．．．電路板200. . . Circuit board
240．．．電子元件240. . . Electronic component
圖1示出了本發明第一實施例的散熱模組的立體圖。Fig. 1 is a perspective view showing a heat dissipation module of a first embodiment of the present invention.
圖2示出了圖1第一實施例的散熱模組的部分分解圖。2 is a partially exploded view of the heat dissipation module of the first embodiment of FIG. 1.
圖3示出了本發明第二實施例的散熱模組的立體圖。Fig. 3 is a perspective view showing a heat dissipation module of a second embodiment of the present invention.
圖4示出了圖3第二實施例的散熱模組的部分分解圖。4 is a partially exploded view of the heat dissipation module of the second embodiment of FIG. 3.
圖5示出了本發明第三實施例的散熱模組的立體圖。Fig. 5 is a perspective view showing a heat dissipation module of a third embodiment of the present invention.
圖6示出了圖5第三實施例的散熱模組的部分分解圖。Figure 6 is a partially exploded view showing the heat dissipation module of the third embodiment of Figure 5.
圖7示出了本發明第四實施例的散熱模組的立體圖。Fig. 7 is a perspective view showing a heat dissipation module of a fourth embodiment of the present invention.
圖8示出了圖7第四實施例的散熱模組的部分分解圖。Figure 8 is a partially exploded view showing the heat dissipation module of the fourth embodiment of Figure 7.
圖9示出了發明本第五實施例的散熱模組的立體圖。Fig. 9 is a perspective view showing the heat dissipation module of the fifth embodiment of the invention.
圖10示出了圖9第五實施例的散熱模組的部分分解圖。Figure 10 is a partially exploded view showing the heat dissipation module of the fifth embodiment of Figure 9.
100．．．散熱模組100. . . Thermal module
10．．．熱管10. . . Heat pipe
20．．．彈片結構20. . . Shrapnel structure
21．．．第一彈片twenty one. . . First shrapnel
22．．．第二彈片twenty two. . . Second shrapnel
30．．．螺絲30. . . Screw
40．．．散熱膏40. . . Thermal grease
200．．．電路板200. . . Circuit board
240．．．電子元件240. . . Electronic component
Claims (14)
提供一熱管及一彈片結構，該彈片結構包括一抵壓部及與一抵壓部連接的固定部；
將該彈片結構的抵壓部焊接於該熱管上；
將該彈片結構的固定部固定在一電路板上，使抵壓部帶動熱管與電路板上的一電子元件熱接觸。A method for fixing a heat dissipation module, the steps of which include:
Providing a heat pipe and a shrapnel structure, the shrapnel structure comprising a pressing portion and a fixing portion connected to a pressing portion;
Welding the pressing portion of the elastic structure to the heat pipe;
The fixing portion of the elastic structure is fixed on a circuit board, so that the pressing portion drives the heat pipe to be in thermal contact with an electronic component on the circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100136833A TWI451832B (en) | 2011-10-11 | 2011-10-11 | Thermal module and fixing method thereof |
| US13/332,391 US20130087311A1 (en) | 2011-10-11 | 2011-12-21 | Thermal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100136833A TWI451832B (en) | 2011-10-11 | 2011-10-11 | Thermal module and fixing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201316889A true TW201316889A (en) | 2013-04-16 |
| TWI451832B TWI451832B (en) | 2014-09-01 |
Family
ID=48041320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100136833A TWI451832B (en) | 2011-10-11 | 2011-10-11 | Thermal module and fixing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20130087311A1 (en) |
| TW (1) | TWI451832B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150330716A1 (en) * | 2014-05-18 | 2015-11-19 | Asia Vital Components Co., Ltd. | Base plate fixing structure for a heat dissipating module |
| US11067343B2 (en) * | 2018-10-25 | 2021-07-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same |
| JP7097477B1 (en) * | 2021-05-12 | 2022-07-07 | レノボ・シンガポール・プライベート・リミテッド | Manufacturing methods for electronic devices, cooling devices, and cooling devices |
| US11991859B2 (en) * | 2022-07-13 | 2024-05-21 | Dell Products L.P. | Apparatus for direct contact heat pipe |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5725050A (en) * | 1996-09-03 | 1998-03-10 | Thermal Corp. | Integrated circuit with taped heat pipe |
| US20030106670A1 (en) * | 2001-12-10 | 2003-06-12 | Lee Hsieh Kun | Clip for heat sink |
| US20070006887A1 (en) * | 2005-07-08 | 2007-01-11 | Med-Track Partners Llc | Tracking system for prosthetic and implantable devices |
| TW200739327A (en) * | 2006-04-14 | 2007-10-16 | Compal Electronics Inc | Heat dissipating module |
| US7606036B2 (en) * | 2006-05-25 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US7511958B2 (en) * | 2006-05-31 | 2009-03-31 | Cheng-Hsing Lin | Heat dissipating assembly of heat dissipating device |
| CN101370370B (en) * | 2007-08-17 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Heat radiation module |
| WO2009123618A1 (en) * | 2008-04-01 | 2009-10-08 | Hewlett-Packard Development Company, L.P. | Apparatuses and methods for dissipating heat from a computer component |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN102111984A (en) * | 2009-12-23 | 2011-06-29 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
| US20110168358A1 (en) * | 2010-01-13 | 2011-07-14 | Asia Vital Components Co., Ltd. | Lap-joined heat pipe structure and thermal module using same |
| TWM383766U (en) * | 2010-03-01 | 2010-07-01 | Kwo Ger Metal Technology Inc | Positioning mechanism for heat dissipating device |
| TWM410251U (en) * | 2011-04-01 | 2011-08-21 | Asia Vital Components Co Ltd | Heat dissipation module |
-
2011
- 2011-10-11 TW TW100136833A patent/TWI451832B/en not_active IP Right Cessation
- 2011-12-21 US US13/332,391 patent/US20130087311A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TWI451832B (en) | 2014-09-01 |
| US20130087311A1 (en) | 2013-04-11 |
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