TW201311069A - 晶片封裝件及晶片封裝方法 - Google Patents

晶片封裝件及晶片封裝方法 Download PDF

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TW201311069A
TW201311069A TW100130586A TW100130586A TW201311069A TW 201311069 A TW201311069 A TW 201311069A TW 100130586 A TW100130586 A TW 100130586A TW 100130586 A TW100130586 A TW 100130586A TW 201311069 A TW201311069 A TW 201311069A
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Taiwan
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wafer
double
adhesive film
light
sided adhesive
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TW100130586A
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Kai-Wen Wu
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Hon Hai Prec Ind Co Ltd
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Priority to TW100130586A priority Critical patent/TW201311069A/zh
Priority to US13/284,978 priority patent/US8614504B2/en
Publication of TW201311069A publication Critical patent/TW201311069A/zh

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Abstract

一種晶片封裝件，其包括一個電路基板；一個襯墊形成於該電路基板上，其具有一背離該電路基板的表面；一個雙面膠薄膜包括一第一膠面黏著於該襯墊的該表面，以及相背的一第二膠面；一個晶片附著於該雙面膠薄膜的第二膠面，該晶片具有一個發光面或接光面位於其背離該雙面膠薄膜的頂面；以及一個封膠體塗覆於該襯墊的該表面並黏附於該晶片及該雙面膠薄膜的周圍。該封膠體背離該襯墊的頂面低於該晶片的發光面或接光面以露出該晶片的發光面或接光面。一種晶片封裝方法包括固化該封膠體的步驟以固定該晶片。

Description

晶片封裝件及晶片封裝方法
本發明涉及晶片封裝，尤其涉及光纖連接傳輸系統中使用之晶片封裝件及晶片封裝方法。
在英特爾發表的光纖連接傳輸（Light Peak）系統規格中，為降低成本並且縮小面積，會使用尚未封裝的晶片。此尚未封裝的晶片為將晶片固定至印刷電路板（PCB）上，就要使用晶片封裝製程。由於Light Peak是利用光傳輸訊號的介面，光介面相對於傳統的銅線介面而言，其對位誤差容忍度很小，因此晶片封裝需要高的精密度。
一般的晶片封装結構通常會在欲黏晶的位置設計一襯墊（PAD）於PCB板上。在晶片封装的過程中，會先在襯墊塗上液態的膠，然後再將晶片擺上去，之後再將膠固化。然而由於一般使用的膠是液態的，特別是Light Peak的系統，所使用的晶片，例如雷射二極體（Laser diode, LD）和光電二極體（Photo-Diode，PD）都非常小，LD甚至可能長、寬均才200 um，所需要的膠就非常少，因此塗膠量就很難控制，很容易會有溢膠的情形，或是塗膠不平整，或是塗膠位置偏移等問題。另外，由於膠是液態的，因此在擺放晶片的時候，膠會被擠壓而流動，如此即使膠塗得很好，還是很容易產生位置偏移，或是產生嚴重的傾斜角等問題。進一步，液態膠在固化時，需要進行高溫烘烤，但是膠的熱膨脹係數很大，因此在溫度變化劇烈的烘烤過程中，亦很容易會產生位置偏移。
有鑒於此，有必要提供一種晶片封裝件及一種晶片封裝方法。
一種晶片封裝件，其包括一個電路基板；一個襯墊形成於該電路基板上，其具有一背離該電路基板的表面；一個雙面膠薄膜包括一第一膠面黏著於該襯墊的該表面，以及一與該第一膠面相背的第二膠面；一個晶片附著於該雙面膠薄膜的第二膠面，該晶片具有一個發光面或接光面位於其背離該雙面膠薄膜的頂面；以及一個封膠體塗覆於該襯墊的該表面並黏附於該晶片及該雙面膠薄膜的周圍。該封膠體背離該襯墊的頂面低於該晶片的發光面或接光面以露出該晶片的發光面或接光面。
一種晶片封裝方法，其包括：形成一個襯墊於一個電路基板上，該襯墊具有一背離該電路基板的表面；提供一個雙面膠薄膜，該雙面膠薄膜具有一第一膠面及一與該第一膠面相背的第二膠面；黏附該雙面膠薄膜的第一膠面於該襯墊的該表面；附著一個晶片於該雙面膠薄膜的第二膠面，該晶片具有一個發光面或接光面背離該雙面膠薄膜；塗覆一個封膠體於該襯墊的該表面並使其黏附於該晶片及該雙面膠薄膜的周圍，該封膠體背離該襯墊的頂面低於該晶片的發光面或接光面以露出該晶片的發光面或接光面；以及固化該封膠體以固定該晶片。
相對於先前技術，本發明提供之晶片封裝件以雙面膠薄膜先黏附於襯墊上，再以封膠體從周圍固定該晶片，以解決微小晶片底部不易塗膠之問題，該晶片封裝件及晶片封裝方法不會影響晶片發光或接光。
請參閱圖1和圖2，本發明實施方式提供的晶片封裝件100包括一個電路基板10，一個襯墊20，一個雙面膠薄膜30，一個晶片40以及一個封膠體50。
該晶片40為雷射二極體（Laser diode, LD）或光電二極體（Photo-Diode，PD）。應用於光纖連接傳輸系統中，該晶片40為微晶片，其一種常用尺寸為長與寬均於200 um左右。該晶片40具有一個發光面或接光面42，本實施例中，該發光面或接光面42位於該晶片40的一頂面。
該電路基板10可以布滿電路用於驅動和控制該晶片40工作。該襯墊20形成於該電路基板10欲封裝該晶片40的位置，且該襯墊20的面積比該晶片40的面積大。該襯墊20由銅、鎳、金、銀或其合金等導電金屬性材質製成，其可以通過焊接形成於該電路基板10上。該襯墊20具有一背離該電路基板10的表面22。該晶片40可以打線連接至該襯墊20的表面22，並通過該襯墊20電性連接至該電路基板10。
該雙面膠薄膜30包括一第一膠面32黏著於該襯墊20的該表面22，以及相背的一第二膠面34。該雙面膠薄膜30之長度尺寸不小於該晶片40之長度尺寸，二者以相當，即基本等於為宜。該晶片40附著於該雙面膠薄膜30的第二膠面34，該晶片40之發光面或接光面42所在之頂面朝上，即背離該雙面膠薄膜30。
該封膠體50塗覆於該襯墊20的該表面22並黏附於該晶片40及該雙面膠薄膜30周圍。本實施例中，該封膠體50以360度圍繞該晶片40及該雙面膠薄膜30周圍。該封膠體50背離該襯墊20的頂面52低於該晶片40的發光面或接光面42以露出該晶片40的發光面或接光面42。本實施例中，該封膠體50之高度小於該雙面膠薄膜30之高度與該晶片40之高度之和。
該封膠體50之材質可以為環氧樹脂或其它具有黏性的樹脂材料。該封膠體50塗覆時可以為熔融狀態，即可以具有一定的流動性，其經固化，例如烘烤後可以固定下來並且固定該晶片40。
上述的晶片封裝方法，其可以依如下步驟進行：
形成一個所述襯墊20於一個電路基板10上；
提供一個所述雙面膠薄膜30；
黏附該雙面膠薄膜30的第一膠面32於該襯墊20的該表面22；
附著晶片40於該雙面膠薄膜30的第二膠面34，該晶片40之發光面或接光面42朝上，即背離該雙面膠薄膜30；
塗覆一個封膠體50於該襯墊20的該表面22並使其黏附於該晶片40及該雙面膠薄膜30周圍，該封膠體50背離該襯墊20的頂面低於該晶片40的發光面或接光面42以露出該晶片40的發光面或接光面42；以及
固化該封膠體50以固定該晶片40。
本實施方式提供之晶片封裝件以雙面膠薄膜先黏附於襯墊上，再以封膠體從周圍固定該晶片，以解決微小晶片底部不易塗膠之問題，該晶片封裝件及晶片封裝方法不會影響晶片發光或接光。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100．．．晶片封裝件
10．．．電路基板
20．．．襯墊
30．．．雙面膠薄膜
40．．．晶片
50．．．封膠體
42．．．發光面/接光面
22．．．襯墊表面
32．．．第一膠面
34．．．第二膠面
52．．．封膠體頂面
圖1係本發明實施方式提供的晶片封裝件立體示意圖。
圖2係圖1沿II-II線的剖示圖。
100．．．晶片封裝件
10．．．電路基板
20．．．襯墊
30．．．雙面膠薄膜
40．．．晶片
50．．．封膠體
42．．．發光面或接光面
52．．．封膠體頂面
32．．．第一膠面
34．．．第二膠面

Claims (10)

  1. 一種晶片封裝件，其包括：
    一個電路基板；
    一個襯墊形成於該電路基板上，其具有一背離該電路基板的表面；
    一個雙面膠薄膜包括一第一膠面黏著於該襯墊的該表面，以及一與該第一膠面相背的第二膠面；
    一個晶片附著於該雙面膠薄膜的第二膠面，該晶片具有一個發光面或接光面位於其背離該雙面膠薄膜的頂面；以及
    一個封膠體塗覆於該襯墊的該表面並黏附於該晶片及該雙面膠薄膜的周圍，該封膠體背離該襯墊的頂面低於該晶片的發光面或接光面以露出該晶片的發光面或接光面。
  2. 如申請專利範圍第1項所述之晶片封裝件，其中：該襯墊之材質選自銅、鎳、金、銀或其合金。
  3. 如申請專利範圍第1項所述之晶片封裝件，其中：該晶片為雷射二極體或光電二極體。
  4. 如申請專利範圍第1項所述之晶片封裝件，其中：該封膠體之高度小於該雙面膠薄膜之高度與該晶片之高度之和。
  5. 如申請專利範圍第1項所述之晶片封裝件，其中：該雙面膠薄膜之長度尺寸與該晶片之長度尺寸相當。
  6. 一種晶片封裝方法，其包括：
    形成一個襯墊於一個電路基板上，該襯墊具有一背離該電路基板的表面；
    提供一個雙面膠薄膜，該雙面膠薄膜具有一第一膠面及一與該第一膠面相背的第二膠面；
    黏附該雙面膠薄膜的第一膠面於該襯墊的該表面；
    附著一個晶片於該雙面膠薄膜的第二膠面，該晶片具有一個發光面或接光面背離該雙面膠薄膜；
    塗覆一個封膠體於該襯墊的該表面並使其黏附於該晶片及該雙面膠薄膜的周圍，該封膠體背離該襯墊的頂面低於該晶片的發光面或接光面以露出該晶片的發光面或接光面；以及
    固化該封膠體以固定該晶片。
  7. 如申請專利範圍第6項所述之晶片封裝方法，其中：該襯墊焊接於該電路基板上。
  8. 如申請專利範圍第6項所述之晶片封裝方法，其中：該封膠體之高度小於該雙面膠薄膜之高度與該晶片之高度之和。
  9. 如申請專利範圍第6項所述之晶片封裝方法，其中：該雙面膠薄膜之長度尺寸與該晶片之長度尺寸相當。
  10. 如申請專利範圍第6項所述之晶片封裝方法，其中：該固化該封膠體使用烘烤方法。
TW100130586A 2011-08-25 2011-08-25 晶片封裝件及晶片封裝方法 TW201311069A (zh)

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