TW201308749A - Communication antenna of thin film type mobile device - Google Patents

Communication antenna of thin film type mobile device Download PDF

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Publication number
TW201308749A
TW201308749A TW100128518A TW100128518A TW201308749A TW 201308749 A TW201308749 A TW 201308749A TW 100128518 A TW100128518 A TW 100128518A TW 100128518 A TW100128518 A TW 100128518A TW 201308749 A TW201308749 A TW 201308749A
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Taiwan
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mobile device
film type
antenna
layer
metal layer
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TW100128518A
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Chinese (zh)
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Sen-Gong Xu
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Tran Tran Teck Co
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Priority to TW100128518A priority Critical patent/TW201308749A/en
Publication of TW201308749A publication Critical patent/TW201308749A/en

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Abstract

The invention relates to a communication antenna of thin film type mobile device and, more particularly, to an antenna disposed on a housing of the mobile device for receiving signal and improving the effect of transmitting and receiving signal. The communication antenna mainly comprises a plastic substrate, and a metal layer coated onto the plastic substrate bonded via an interface layer, wherein the metal layer is engraved with isolation loops of in different shapes and different areas, so that the inner edges of the isolation loops are employed to form antennas of in different shapes and different areas. Then, a protective layer of insulating material is coated on the engraved metal layer to cover the metal layer and the isolation loops, so as to be connected to the receiving and transmitting circuit of the mobile device, thereby increasing the effect of transmitting and receiving signal for the mobile device.

Description

薄膜式行動裝置通訊天線Thin film mobile device communication antenna

本發明係有關一種薄膜式行動裝置通訊天線,尤指一種供連接於行動通訊裝置之收、發電路,以提高行動通訊裝置之收、發訊效果之薄膜式行動裝置通訊天線。The present invention relates to a thin film type mobile device communication antenna, and more particularly to a thin film type mobile device communication antenna for connecting to a mobile communication device to improve the receiving and transmitting effects of the mobile communication device.

按;一般之手機等行動裝置,通常係將其天線設於內部之電路中,惟由於內部電路較為窄小,使得天線無法有太大的應用面積,影響收、發訊之效果。申請人有鑑於此,乃秉持從事該項業務多年之經驗,經不斷研究、實驗,遂萌生改良一種行動裝置之天線結構,祈使提高行動通訊裝置之收、發訊效果。According to the general mobile phone and other mobile devices, the antenna is usually placed in the internal circuit. However, due to the narrow internal circuit, the antenna cannot have a large application area, which affects the effect of receiving and transmitting. In view of this, the applicant has been adhering to the experience of many years of experience in this business. After continuous research and experimentation, Yan Mengsheng improved the antenna structure of a mobile device and prayed for the improvement of the receiving and transmitting effects of mobile communication devices.

本發明之主要目的,即在提供一種薄膜式行動裝置通訊天線,以供連接於行動裝置之收、發電路,提高行動裝置之收訊效果。The main object of the present invention is to provide a thin film type mobile device communication antenna for connecting to a receiving and transmitting circuit of a mobile device, thereby improving the receiving effect of the mobile device.

前述之薄膜式行動裝置通訊天線,係包含塑膠底材、塗佈於塑膠底材以介面層結合之金屬層,於該金屬層鏤刻出不同形狀、不同面積之隔離迴路,使隔離迴路的內緣形成不同形狀、不同面積之薄膜天線,再以高、低分子絕緣材之保護層塗佈封裝於鏤刻後之金屬層,將金屬層及隔離迴路予以披覆,俾供連接於行動通訊裝置之收、發電路,以提高行動裝置之收、發訊效果。The aforementioned film type mobile device communication antenna comprises a plastic substrate, a metal layer coated on the plastic substrate and an interface layer, and an isolation circuit of different shapes and different areas is engraved in the metal layer to make the inner edge of the isolation circuit Forming film antennas of different shapes and different areas, and coating the metal layer encapsulated in the engraved layer with a protective layer of high and low molecular insulating materials, covering the metal layer and the isolation circuit for connection to the mobile communication device And send the circuit to improve the receiving and sending effect of the mobile device.

前述之薄膜式行動裝置通訊天線,其中之金屬層係利用高壓電弧將金屬材料高溫熔化,再經由高壓空氣將該熔化之金屬液噴塗於已成形之塑膠底材上,且該塑膠底材係先塗佈一層黏著層成為塑膠與金屬間的接合媒介,使熔化之金屬液體與塑膠層穩固貼合成一體,形成金屬導電層。The above-mentioned thin film type mobile device communication antenna, wherein the metal layer uses a high voltage arc to melt the metal material at a high temperature, and then sprays the molten metal liquid onto the formed plastic substrate via high pressure air, and the plastic substrate is first Applying an adhesive layer to form a bonding medium between the plastic and the metal, so that the molten metal liquid and the plastic layer are firmly integrated to form a metal conductive layer.

前述之薄膜式行動裝置通訊天線,其中之金屬層係為鋅、鋁等不同合金之金屬材料。The aforementioned film type mobile device communication antenna, wherein the metal layer is a metal material of different alloys such as zinc and aluminum.

前述之薄膜式行動裝置通訊天線,其中之介面層係可為壓克力樹脂、環氧樹脂、矽膠樹脂、PU樹脂、熱塑性樹脂等樹脂黏著劑,以供噴塗於塑膠底材表面,形成具黏結的介面層。The above-mentioned film type mobile device communication antenna, wherein the interface layer can be a resin adhesive such as acrylic resin, epoxy resin, silicone resin, PU resin, thermoplastic resin, etc., for spraying on the surface of the plastic substrate to form a bonding layer. Interface layer.

請同時參閱第一圖、第二圖及第三圖,係為本發明之立體圖及剖視圖。如圖所示,本發明係包含塑膠底材1、塗佈於塑膠底材1以介面層2結合之金屬層3,以及披覆於金屬層3之保護層5。其中,該塑膠底材1係為經由射出成型為不同形狀之行動通訊裝置機殼,於該金屬層3鏤刻出不同形狀之隔離迴路4,使隔離迴路4的深度至少與該介面層2等齊,從而使隔離迴路4的內緣形成不同形狀之天線A,再以絕緣材之保護層5塗佈於鏤刻後之金屬層3,將金屬層3及隔離迴路4予以披覆,俾供連接於行動裝置之收、發電路,以提高行動裝置之收、發訊效果。Please refer to the first, second and third figures, which are perspective views and cross-sectional views of the present invention. As shown, the present invention comprises a plastic substrate 1, a metal layer 3 coated on the plastic substrate 1 with the interface layer 2, and a protective layer 5 coated on the metal layer 3. Wherein, the plastic substrate 1 is a mobile communication device casing which is formed into different shapes by injection molding, and the isolation circuit 4 of different shapes is engraved in the metal layer 3 so that the depth of the isolation circuit 4 is at least equal to the interface layer 2 So that the inner edge of the isolation circuit 4 forms the antenna A of different shapes, and then the protective layer 5 of the insulating material is applied to the metal layer 3 after the etching, and the metal layer 3 and the isolation circuit 4 are covered, and the connection is made. The receiving and transmitting circuits of the mobile device are used to improve the receiving and transmitting effects of the mobile device.

請參閱第四圖,係為本發明較佳實施例之製造流程圖。敬請配合第三圖,如圖所示,本發明之製造步驟主要包含:Please refer to the fourth drawing, which is a manufacturing flow chart of a preferred embodiment of the present invention. Please cooperate with the third figure. As shown in the figure, the manufacturing steps of the present invention mainly include:

1.以射出成型為不同形狀行動裝置機殼之塑膠底材1。1. Injection molding into a plastic substrate 1 of a mobile device casing of different shapes.

2.於塑膠底材1先塗佈介面層2,該介面層2可為壓克力樹脂、環氧樹脂、矽膠樹脂、PU樹脂、熱塑性樹脂等樹脂黏著劑,以供噴塗於塑膠底材1表面,形成具黏結的介面層2。2. Applying the interface layer 2 to the plastic substrate 1 , the interface layer 2 may be a resin adhesive such as acrylic resin, epoxy resin, silicone resin, PU resin, thermoplastic resin, etc., for spraying on the plastic substrate 1 The surface forms a bonded interface layer 2.

3.利用高壓電弧將鋅、鋁等不同合金之金屬材料高溫熔化,再經由高壓空氣將該熔化之金屬液噴塗於已成形之塑膠底材1上,構成金屬層3,且由於該塑膠底材1係先塗佈一層介面層2,使其成為塑膠與金屬間的接合媒介,從而使熔化之金屬液體與塑膠層穩固貼合成一體,形成金屬導電層。3. High-temperature arc is used to melt the metal material of different alloys such as zinc and aluminum at a high temperature, and then the molten metal liquid is sprayed on the formed plastic substrate 1 through high-pressure air to form the metal layer 3, and the plastic substrate is The first layer is coated with a layer of interface layer 2 to form a bonding medium between the plastic and the metal, so that the molten metal liquid and the plastic layer are firmly integrated to form a metal conductive layer.

4.於該金屬層3鏤刻出不同形狀、不同面積之隔離迴路4,使隔離迴路4的深度至少與該介面層2等齊,從而使隔離迴路4的內緣形成不同形狀之天線A。4. The isolation circuit 4 of different shapes and different areas is engraved on the metal layer 3 so that the depth of the isolation circuit 4 is at least equal to the interface layer 2, so that the inner edge of the isolation circuit 4 forms the antenna A of different shapes.

5.於鏤刻出隔離迴路4之金屬層3表面塗佈一保護層5,使保護層5將金屬層3及隔離迴路4予以披覆,該保護層5係為噴漆或烤漆等絕緣材質,且其中,該金屬層3所鏤刻之隔離迴路4及天線A,係於塗佈保護層5前,再施以高、低分子樹脂塗料,以構成封裝絕緣。5. coating a protective layer 5 on the surface of the metal layer 3 of the isolation circuit 4, so that the protective layer 5 is coated with the metal layer 3 and the isolation circuit 4, which is an insulating material such as paint or baking varnish, and The isolation circuit 4 and the antenna A engraved by the metal layer 3 are applied with a high- and low-molecular resin coating before the protective layer 5 is applied to constitute package insulation.

藉由前述之製程,該行動裝置機殼所構成之天線A,係可供連接於行動裝置內部之收、發電路,由於天線A係位於行動裝置的外部,因此,不但不會因金屬層3影響收、發訊,且可提高收、發訊效果。According to the foregoing process, the antenna A formed by the mobile device casing is connected to the receiving and transmitting circuit inside the mobile device, and since the antenna A is located outside the mobile device, not only the metal layer 3 is not Affect the collection and transmission, and improve the effect of receiving and sending.

請參閱第五圖,係為本發明與收、發電路連接實施例圖。敬請配合第一圖,如圖所示,本發明之天線A於製作完成後,係以導線61穿過塑膠底材1連接於該天線A,使導線61之另端連接於行動裝置內部之收、發電路62,從而使收、發電路62藉由天線A提高收、發訊之效果。Please refer to the fifth figure, which is a diagram of an embodiment of the invention connected to the receiving and transmitting circuit. Please cooperate with the first figure. As shown in the figure, after the antenna A of the present invention is completed, the wire 61 is connected to the antenna A through the plastic substrate 1 so that the other end of the wire 61 is connected to the inside of the mobile device. The receiving and transmitting circuit 62 is configured to increase the effect of receiving and transmitting by the antenna A by the receiving and transmitting circuit 62.

請參閱第六圖,係為本發明製作為成品之實施例圖。敬請配合第一圖,如圖所示,本發明之機殼於組裝為行動裝置6(手機)後,該天線A係隱藏於行動裝置6之機殼(通常係設於機殼背面),使天線A不會被金屬層3所遮蔽,從而可提高收、發訊效果。且由於天線A被保護層5所披覆,行動裝置6機殼的表面得以保持平滑,而不會影響外觀之美感。Please refer to the sixth drawing, which is a diagram of an embodiment of the present invention. Please cooperate with the first figure. As shown in the figure, after the casing of the present invention is assembled into the mobile device 6 (mobile phone), the antenna A is hidden in the casing of the mobile device 6 (usually disposed on the back of the casing). The antenna A is not shielded by the metal layer 3, so that the receiving and transmitting effects can be improved. And since the antenna A is covered by the protective layer 5, the surface of the casing of the mobile device 6 is kept smooth without affecting the aesthetic appearance.

請參閱第七圖,係為本發明另一製作為成品之實施例圖。敬請配合第一圖,如圖所示,本發明之機殼於組裝為另一種型態之行動裝置7(手機)後,該天線A係隱藏於行動裝置7機殼(通常係設於機殼背面),使天線A不會被金屬層3所遮蔽,從而可提高收、發訊效果。且由於天線A被保護層5所披覆,行動裝置7機殼的表面得以保持平滑,而不會影響外觀之美感。Please refer to the seventh figure, which is another embodiment of the invention made into a finished product. Please cooperate with the first figure. As shown in the figure, after the casing of the present invention is assembled into another type of mobile device 7 (mobile phone), the antenna A is hidden in the casing of the mobile device 7 (usually installed in the machine). The back of the case makes the antenna A not obscured by the metal layer 3, thereby improving the receiving and transmitting effects. And since the antenna A is covered by the protective layer 5, the surface of the casing of the mobile device 7 is kept smooth without affecting the aesthetic appearance.

請參閱第八圖,係為本發明又一製作為成品之實施例圖。敬請配合第一圖,如圖所示,本發明之天線A係可依通訊靈敏度的需求,鏤刻出不同形狀及不同面積之迴路。如本實施例,係為較大面積之天線A,以配合行動裝置6所需要之收、發訊效果。Please refer to the eighth figure, which is a diagram of another embodiment of the present invention. Please cooperate with the first figure. As shown in the figure, the antenna A of the present invention can engrave loops of different shapes and different areas according to the requirements of communication sensitivity. In this embodiment, the antenna A of a larger area is used to match the receiving and transmitting effects required by the mobile device 6.

前述實施例,僅為說明本發明之較佳實施方式,而非限制本發明之範圍,凡經由些微修飾、變更,仍不失本發明之要義所在,亦不脫本發明之精神範疇。The foregoing embodiments are merely illustrative of the preferred embodiments of the present invention, and are not intended to limit the scope of the invention.

綜上所述,本發明以塑膠底材,配合結合於塑膠底材之金屬層,以及鏤刻於金屬層之隔離迴路,構成行動裝置之天線,以供連接於行動裝置之收、發電路,提高行動裝置之收、發訊效果。為一實用之設計,誠屬一俱創新之發明,爰依法提出專利之申請,祈 鈞局予以審查,早日賜准專利,至感德便。In summary, the present invention uses a plastic substrate, a metal layer bonded to the plastic substrate, and an isolation circuit engraved on the metal layer to form an antenna for the mobile device for connection to the receiving and transmitting circuits of the mobile device. The receiving and sending effect of the mobile device. For a practical design, it is an invention of innovation. It is necessary to file a patent application according to law, and the Bureau of Public Security will review it and grant patents as soon as possible.

1...塑膠底材1. . . Plastic substrate

2...介面層2. . . Interface layer

3...金屬層3. . . Metal layer

4...隔離迴路4. . . Isolation loop

5...保護層5. . . The protective layer

A...天線A. . . antenna

6...行動裝置6. . . Mobile device

61...導線61. . . wire

62...收、發電路62. . . Receiving and transmitting circuit

7...行動裝置7. . . Mobile device

第一圖係本發明之立體圖。The first figure is a perspective view of the present invention.

第二圖係本發明之剖視圖。The second drawing is a cross-sectional view of the present invention.

第三圖係本發明之另一剖視圖。The third figure is another cross-sectional view of the present invention.

第四圖係本發明較佳實施例之製造流程圖。The fourth drawing is a manufacturing flow diagram of a preferred embodiment of the present invention.

第五圖係本發明與收、發電路連接實施例圖。The fifth figure is a diagram showing an embodiment of the connection between the present invention and the receiving and transmitting circuit.

第六圖係本發明製作為成品之實施例圖。The sixth drawing is a diagram of an embodiment of the present invention produced as a finished product.

第七圖係本發明另一製作為成品之實施例圖。Figure 7 is a diagram showing another embodiment of the present invention made into a finished product.

第八圖係本發明又一製作為成品之實施例圖。The eighth figure is another embodiment of the invention made into a finished product.

1...塑膠底材1. . . Plastic substrate

2...介面層2. . . Interface layer

3...金屬層3. . . Metal layer

4...隔離迴路4. . . Isolation loop

5...保護層5. . . The protective layer

A...天線A. . . antenna

61...導線61. . . wire

Claims (9)

一種薄膜式行動裝置通訊天線,係包含:設於行動裝置機殼之天線;設於天線周圍之金屬層;設於前述天線與金屬層之間,使兩者形成隔離之隔離迴路。A film type mobile device communication antenna comprises: an antenna disposed on a casing of a mobile device; a metal layer disposed around the antenna; and is disposed between the antenna and the metal layer to form an isolated isolation circuit. 一種薄膜式行動裝置通訊天線之製程,包含:經由射出成型為不同形狀行動裝置機殼之塑膠底材;於塑膠底材塗佈介面層;塗佈金屬層,藉由介面層與塑膠底材結合;於金屬層鏤刻出不同形狀、不同面積之隔離迴路,使隔離迴路的深度至少與該介面層等齊,從而使隔離迴路的內緣形成不同形狀、不同面積之天線;於該金屬層及隔離迴路及天線塗佈保護層。The invention relates to a process for a communication device of a film type mobile device, comprising: a plastic substrate formed by injection molding into a casing of a different shape mobile device; an interface layer coated on the plastic substrate; and a metal layer coated by the interface layer and the plastic substrate The isolation circuit of different shapes and different areas is engraved in the metal layer, so that the depth of the isolation circuit is at least equal to the interface layer, so that the inner edge of the isolation circuit forms antennas with different shapes and different areas; the metal layer and the isolation The circuit and the antenna are coated with a protective layer. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,其中,該金屬層係利用高壓電弧將金屬材料高溫熔化為金屬液,再噴塗於已成形且塗佈有一層介面層之塑膠底材。The process of the communication device for a thin film type mobile device according to claim 2, wherein the metal layer is formed by high-pressure arc melting the metal material into a molten metal at a high temperature, and then spraying on the formed and coated with an interface layer. Plastic substrate. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,其中,該高溫熔化之金屬液,係藉由高壓空氣噴塗於塑膠底材。The process of the communication device for a thin film type mobile device according to the second aspect of the invention, wherein the high temperature molten metal liquid is sprayed on the plastic substrate by high pressure air. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,其中,該金屬層之金屬材料係為鋅、鋁等不同合金。The process of the communication device for a thin film type mobile device according to the second aspect of the invention, wherein the metal material of the metal layer is a different alloy such as zinc or aluminum. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,該介面層係為壓克力樹脂、環氧樹脂等樹脂黏著劑,以供噴塗於塑膠底材表面,形成具黏結的介面層。The process of the communication device of the thin film type mobile device described in claim 2, wherein the interface layer is a resin adhesive such as an acrylic resin or an epoxy resin for spraying on the surface of the plastic substrate to form a bonded structure. Interface layer. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,其中,該介面層係為矽膠樹脂、PU樹脂、熱塑性樹脂等樹脂黏著劑,以供噴塗於塑膠底材表面,形成具黏結的介面層。The process of the communication device for a thin film type mobile device according to the second aspect of the invention, wherein the interface layer is a resin adhesive such as silicone resin, PU resin or thermoplastic resin for spraying on the surface of the plastic substrate to form a device. Bonded interface layer. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,其中,金屬導電層所鏤刻之隔離迴路及天線,係施以高、低分子樹脂塗料以構成封裝絕緣。For example, in the process of the communication device of the thin film type mobile device described in claim 2, the isolation circuit and the antenna engraved by the metal conductive layer are coated with high and low molecular resin paint to form package insulation. 如申請專利範圍第2項所述之薄膜式行動裝置通訊天線之製程,其中,該金屬層及隔離迴路及天線所塗佈之保護層,係為噴漆或烤漆等絕緣材質。For example, the process of the communication device of the thin film type mobile device described in claim 2, wherein the metal layer, the isolation circuit and the protective layer coated by the antenna are insulating materials such as paint or baking varnish.
TW100128518A 2011-08-10 2011-08-10 Communication antenna of thin film type mobile device TW201308749A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113055103A (en) * 2021-03-10 2021-06-29 安徽超清科技股份有限公司 5G mobile communication signal all-round test equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113055103A (en) * 2021-03-10 2021-06-29 安徽超清科技股份有限公司 5G mobile communication signal all-round test equipment

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