TWI547375B - Method of joining a substrate and a target, method of packaging, and a housing using thereof - Google Patents

Description

Substrate bonding method, packaging method and method using the same case

The present invention relates to a substrate bonding method, and more particularly to a substrate bonding method using silicone rubber.

In many product manufacturing processes, the mutual joining of two separate substrates is involved. For example, the packaging process of the battery case involves the joining of two plastic shells; the packaging process of the panel and the casing involves the joining of a glass plate and a plastic shell.

The existing two independent substrate bonding methods are nothing more than the use of adhesives or ultrasonic welding technology. In the case of using an adhesive, there is a problem that the amount of glue is not easily controlled and the curing time is long. Among them, when the amount of glue is too much, the glue will overflow, which will affect the appearance and even affect the structural relationship and function; when the amount of glue is insufficient, the strength will be affected. In the case of ultrasonic welding technology, the processing cost is high because of the time required for the welding mechanism and the mold processing, and it is only suitable for the bonding of the plastic substrate, and cannot be applied to glass or metal materials.

In addition, when the two independent substrates are made of metal, the existing joining method uses welding technology, which involves high temperature and easily affects peripheral components. And the quality of the welding is affected by many parameters. When one of the substrates is made of a non-metal material, an adhesive is often used.

In addition, in many electronic products, in order to have a better visual and tactile texture, a decorative layer is usually formed on the casing to increase the texture of the product.

Accordingly, it is an object of the present invention to provide a substrate bonding method which is simplified in procedure and improved in yield, and which can replace the bonding technique of adhesive adhesion, ultrasonic welding or soldering. Further, with the substrate bonding method of the present invention, the product itself has a texture of decorative appearance, and no additional decorative process procedure is required. In other words, with the substrate bonding method of the present invention, the product itself can achieve the purpose of bonding and decoration at the same time.

Thus, the substrate bonding method of the present invention comprises a preparation step, a coating step, a surface modification step, and a pressing step.

Wherein the preparation step comprises: providing a first substrate having a first surface, and a bonding target.

The coating step is such that a first silicone layer covers the first surface, the first silicone layer has a bonding surface attached to the first surface, and a first working surface different from the bonding surface; Further, the above-mentioned bonding target includes a second silicone layer having a second working surface.

The surface modification step is to modify the first working surface and the second working surface to generate a bonding functional group for the first working surface and the second working surface.

The pressing step is such that the above-mentioned joint target is in its second worksheet The surface is pressed against the first working surface of the first silicone layer, and the bonding of the second working surface and the first working surface is bonded to each other to form a covalent bond to complete the bonding.

Another object of the present invention is to provide a packaging method that simplifies the program and improves the package yield.

The encapsulation method of the present invention comprises a preparation step, a coating step, a surface modification step, and a pressing step.

Wherein, the preparing step provides a first substrate having a first surface, and a bonding target.

The covering step is such that a first silicone layer covers the first surface, the first silicone layer has a bonding surface attached to the first surface, and a first work different from the bonding surface a surface, and the first working surface forms a closed contour; the joint target includes a second silicone layer having a second working surface.

The surface modification step is to modify the first working surface and the second working surface to cause the first working surface and the second working surface to generate a bonding functional group.

The pressing step is such that the second working surface of the bonding target is pressed against the first working surface of the first silicone layer, the second working surface at least corresponding to the closed contour, the second working surface and the first working surface The bonding of a working surface is bonded to each other to form a covalent bond, so that the pressed first substrate, the first silicone layer, and the bonding target together define a sealed accommodation space.

A further object of the present invention is to provide a program simplification and A housing that improves package yield.

The housing includes a first substrate, a first silicone layer, and a bonding target.

Wherein the first substrate has a first surface. The first silicone layer covers the first surface of the first substrate and has a bonding surface attached to the first surface, and a first working surface different from the bonding surface, and The first working surface constitutes a closed contour. The bonding target includes a second silicone layer having a second working surface that is pressed against the first working surface.

The effect of the invention is that the silicone resin layer is used to form the appearance surface, and at the same time, it can replace the bonding technology of adhesive adhesion, ultrasonic welding or welding, simplify the processing procedure and effectively improve the yield.

S1‧‧‧ Preparation steps

3‧‧‧ joint target

S2‧‧‧ drape steps

4‧‧‧Second substrate

S3‧‧‧ Surface modification steps

40‧‧‧ bottom

S4‧‧‧Compression step

41‧‧‧ second surface

100‧‧‧shell

42‧‧‧ Periphery

1‧‧‧First substrate

5‧‧‧Second rubber layer

10‧‧‧ inner surface

50‧‧‧Second bonding surface

11‧‧‧ first surface

51‧‧‧Second work surface

12‧‧‧ Shell

52‧‧‧ appearance

2‧‧‧The first silicone layer

53‧‧‧ bottom

20‧‧‧First bonding surface

6‧‧‧Antenna

21‧‧‧First work surface

7‧‧‧Adhesive

211‧‧‧closed outline

S‧‧‧ accommodating space

22‧‧‧ appearance

The other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a flow chart illustrating the steps of the present invention. FIG. 2 is a cross-sectional view illustrating the first preferred embodiment. FIG. 3 is a perspective view schematically illustrating a first substrate coated with a first silicone layer in the first preferred embodiment; FIG. 4 is a cross-sectional view illustrating the cutting along IV-IV in FIG. Figure 5 is a cross-sectional view schematically illustrating surface modification of the first working surface and the second working surface of the joint target; Figure 6 is a cross-sectional view schematically illustrating a pressing step; Figure 7 is a cross-sectional view similar to Figure 2, illustrating a second preferred embodiment of the present invention; Figure 8 is a perspective view similar to Figure 3, schematically illustrating a third preferred embodiment of the present invention; Figure 9 is a similar view A cross-sectional view of Fig. 6 schematically illustrates a third preferred embodiment; and Fig. 10 is a cross-sectional view similar to Fig. 6 for schematically illustrating a fourth preferred embodiment of the present invention.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 and FIG. 2, the first preferred embodiment of the present invention is illustrated by a packaging method and a housing 100 manufactured by the packaging method; however, it should be noted that the present invention is not limited to the application. It can also be applied to the joining of any two separate substrates.

The housing 100 includes a first substrate 1, a first silicone layer 2, and a bonding target 3. The joint target 3 of the present embodiment includes a second substrate 4 and a second silicone layer 5. The encapsulation method includes a preparation step S1, a coating step S2, a surface modification step S3, and a pressing step S4.

Referring to FIG. 3 and FIG. 4 , the first substrate 1 of the present embodiment is exemplified by a plastic material casing, and the first substrate 1 and the second substrate 4 are provided in the preparation step S1 . However, the shape of the first substrate 1 is not limited to this embodiment. The first substrate 1 includes a first surface 11 having a shell edge 12, and a connecting shell edge 12 and defining a space for receiving the electron element The inner surface 10 of the housing S is accommodated in a piece (not shown). The first surface 11 is different from the inner surface 10. The first surface 11 described in this embodiment refers to a surface covered by the first silicone layer 2 in a subsequent step. In this embodiment, the first silicone layer 2 does not cover the inner surface 10, but covers the shell edge 12. The first surface 11 thus comprises all surfaces except the inner surface 10, covering the shell edge 12.

The second substrate 4 of the present embodiment is exemplified by a cover plate of a plastic material. However, the shape of the second substrate 4 is not limited to this embodiment. The second substrate 4 includes a second surface 41 having a peripheral edge 42 and a bottom surface 40 that connects the peripheral edge 42 and faces the accommodation space S. The second surface 41 in this embodiment refers to the surface covered by the second silicone layer 5 in the subsequent step. In this embodiment, the second silicone layer 5 does not cover the bottom surface 40, but covers the periphery 42; The second surface 41 therefore includes all surfaces except the bottom surface 40, encompassing the perimeter 42.

In the coating step S2 of the embodiment, the first silicone layer 2 and the second silicone layer 5 are directly coated on the first surface 11 and the second substrate 4 of the first substrate 1 by injection molding. Second surface 41. The silicone rubber of the embodiment may be liquid silicone (LSR) or solid silicone (SSR).

The first silicone layer 2 has a first bonding surface 20 attached to the first surface 11, an outwardly facing design surface 22, and a surface substantially facing the second substrate 4 and different from the first bonding surface. 20 and the first working surface 21 of the design surface 22. In detail, the first working surface 21 is positioned corresponding to the shell edge 12 and constitutes a closed contour 211 of a horizontal plane. The position of the closed contour 211 depends on the design requirements of the product packaging part, as long as it is a closed line.

The second silicone layer 5 has a second bonding surface 50 attached to the second surface 41, an outwardly facing surface 52, and a surface substantially facing the first substrate 1 and different from the second bonding surface. 50 and a second working surface 51 of the design surface 52. In detail, the second working surface 51 is located at a position corresponding to the peripheral edge 42 of the second substrate 4, and is flush and coplanar with the bottom surface 40 in this embodiment. In other embodiments, the second silicone layer 5 may also cover a portion of the bottom surface 40, resulting in the second working surface 51 not being flush with the bottom surface 40.

In addition, in another embodiment, the first surface 11 of the first substrate 1 of the present embodiment is further provided with an antenna 6 for covering the antenna 6 by covering the first surface 11 with the first silicone layer 2. The procedure for painting the exterior of the antenna 6 or adding a cover is omitted.

Referring to FIG. 1 and FIG. 5, in the surface modification step S3 of the embodiment, the first working surface 21 of the first silicone layer 2 and the second working surface 51 of the second silicone layer 5 are processed by a plasma surface treatment technique. Perform the upgrading process. The first working surface 21 is made under the control condition that the plasma energy is between 7 and 30 watts, the plasma bombardment time is between 20 and 30 seconds, and the chamber pressure is between 4.0 and 4.5 x 10 ^-1 torr. The second working surface 51 all produces a silanol. However, the present invention is not limited to the production of a sterol group. In another embodiment, in a case where the first silicone layer 2 or the first substrate 1 is a transparent material, the first working surface 21 may also be made to produce a silanol by using a UV surface treatment technique; When the silicone layer 5 or the second substrate 4 is made of a transparent material, the second working surface 51 may be made to produce a silanol by a UV surface treatment technique. Alternatively, the first working surface 21 and the second working surface 51 may be subjected to other chemical functional groups such as a carboxyl group (-COOH) or an amine group (-NH ₂ ) by chemical treatment.

Referring to Figures 1, 2 and 6, in the pressing step S4 of the present embodiment, the bonding target 3 is pressed against the first working surface 21. The second working surface 51 of the second silicone layer 5 contacts the first working surface 21 of the first silicone layer 2 in this step and completely closes the contour 211. The silicate group at the contact of the second working surface 51 with the first working surface 21 of the first silicone layer 2 under a pressing condition of an area of more than 5 kg per square centimeter and a time of more than 10 minutes per square centimeter Bonding to form a covalent bond, so that the pressed first substrate 1, the first silicone layer 2, and the bonding target 3 together define a sealed space, that is, the accommodation space of the first substrate 1 S sealed. For the principles described in this example and the surface modification to produce functional functional groups and the formation of covalent bonds after compression, reference may be made to the University of Michigan paper "Surface Micromachining Of Polydimethylsiloxane (PDMS) For Microfluidic Biomedical Applications".

It is worth mentioning that the first silicone layer 2 and the second silicone layer 5 of the embodiment are designed as the design faces 22 and 52 for the housing 100, in addition to providing a soft touch and protection, at the same time A first working surface 21 and a second working surface 51 are provided for engagement. Moreover, the housing 100 completed by the method of the present invention can precisely complete the joint sealing of the two substrates, and can have a waterproof effect without using a conventional O-ring.

Further, in the embodiment, the first silicone layer 2 and the second silicone layer 5 are directly cured on the first surface 11 and the second substrate 4 of the first substrate 1 of the plastic material. Second surface 41. If the first substrate 1 and/or the second substrate 4 are made of glass, they can also be phased. Draped and cured in the same way.

Referring to FIG. 7, in the second preferred embodiment of the present invention, the first substrate 1 and/or the second substrate 4 are made of other materials such as metal or ceramic, and the corresponding first surface 11 and/or the first surface is required. The two surfaces 41 are coated with an adhesive 7, and then the first silicone layer 2 and the second silicone layer 5 are coated to achieve a better coating fixing effect. Since the coating adhesive described in the second embodiment described above is applied to the second working surface 51 in contact with the first working surface 21 as compared with the prior art, it is a coating of a large area, and thus is allowed. A larger coating amount error is relatively less prone to overflow problems.

Referring to FIG. 8 and FIG. 9, the third preferred embodiment of the present invention differs from the first preferred embodiment in that the joint target 3 includes only a second silicone layer 5, that is, the second silicone layer 5 is directly used as the sealing cover. Without the second substrate 4 (see Figure 6). Therefore, in the present embodiment, the first substrate 1 and the second silicone layer 5 are provided in the preparation step S1. The second silicone layer 5 of the present embodiment has a design surface 52 and a bottom surface 53 facing the accommodation space S, but does not have a second bonding surface 50 (see FIG. 6). This embodiment defines that the bottom surface 53 corresponds to the second working surface 51 at the shell edge 12 of the first substrate 1, and the entire bottom surface 53 may be defined as the second working surface 51.

In addition, the first silicone layer 2 of the present embodiment covers only the shell edge 12 of the first substrate 1, that is, the first surface 11 of the first substrate 1 (the surface covered by the first silicone layer 2) Shell edge 12.

In the coating step S2, the first silicone layer 2 is coated on the shell edge 12 only for the first substrate 1. In this embodiment, the first silicone layer 2 has a frame shape and has a first bonding surface 20 attached to the first surface 11 and substantially faces the second surface. The first working surface 21 of the silicone layer 5, but without the appearance surface (see Figure 6). The first working surface 21 is identical to the first preferred embodiment and also constitutes a closed contour 211.

In the surface modification step S3, the first working surface 21 and the second working surface 51 are subjected to a modification treatment, so that the first working surface 21 and the second working surface 51 both generate bonding functional groups.

In the pressing step, the second silicone layer 5 is pressed against the first working surface 21, whereby the first working surface 21 is in contact with the second working surface 51 and completely corresponds to the closed contour 211, as described in the first embodiment. Under specific pressure conditions, the bonding functional groups are bonded to each other to form a covalent bond, thereby completing bonding and encapsulation.

Further, taking the mobile telephone device as an example, the internal components such as batteries can be covered by the method of the present embodiment to prevent damage caused by liquid intrusion.

Referring to FIG. 10, a fourth preferred embodiment of the present invention differs from the first preferred embodiment in that the second substrate 4 of the bonding target 3 is a glass cover plate, and the second silicone layer 5 is only coated on the second substrate. The bottom surface 40 of the material 4 is frame-shaped adjacent to the peripheral edge 42. That is, the second surface 41 of the second substrate 4 is a portion of the bottom surface 40 adjacent the periphery 42. The second silicone layer 5 has a second bonding surface 50 attached to the second surface 41, and a second working surface 51 substantially facing the first substrate 1 and different from the second bonding surface 50, but has no appearance. surface. The structure of the first substrate 1 and the first silicone layer 2 in this embodiment is the same as that of the first preferred embodiment, and the process steps are the same except that the second silicone layer 2 is different in coating process. .

In summary, the present invention utilizes a silicone layer to form an appearance surface, and at the same time, a surface functional group is used to produce a bonding functional group, and then a bonding bond with a surface of the silicone surface is formed to form a covalent bond, thereby replacing the adhesive. The bonding technique of adhesion, ultrasonic welding or welding does achieve the purpose of simplifying the processing procedure of the present invention and effectively improving the yield.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

S1‧‧‧ Preparation steps

S2‧‧‧ drape steps

S3‧‧‧ Surface modification steps

S4‧‧‧Compression step

Claims (14)

A substrate bonding method comprising: preparing a first substrate having a first surface, and a bonding target; and the coating step: covering a first surface with the first silicone layer, the first silicone The layer has a bonding surface attached to the first surface, and a first working surface different from the bonding surface; the bonding target includes a second silicone layer having a second working surface; surface modification Step: modifying the first working surface and the second working surface to cause the first working surface and the second working surface to generate a bonding functional group; and pressing step: making the bonding target The working surface is pressed against the first working surface of the first silicone layer, and the bonding of the second working surface and the first working surface is bonded to each other to form a covalent bond to complete the bonding. The substrate bonding method according to claim 1, wherein the first substrate is made of plastic or glass, and the coating step covers the first surface of the first substrate by injection molding. The substrate bonding method of claim 1, wherein the bonding target further comprises a second substrate having a second surface, and the coating step further comprises at least partially covering the second silicone layer Two surfaces. The substrate bonding method according to claim 3, wherein the second substrate is a plastic or glass material, and the coating step covers the second surface of the second substrate by injection molding. The substrate bonding method of claim 1, wherein at least one of the first silicone layer and the second silicone layer have a difference from the bonding surface, the first working surface, and the second work The surface of the surface is exposed to the outside. A packaging method comprising: preparing a material: providing a first substrate having a first surface, and a bonding target; and a coating step: covering a first surface of the first silicone layer with the first silicone layer a bonding surface attached to the first surface, and a first working surface different from the bonding surface, and the first working surface forms a closed contour; the bonding target includes a second working surface a second silicone layer; a surface modification step: modifying the first working surface and the second working surface to cause the first working surface and the second working surface to produce a bonding functional group; and a pressing step : pressing the second working surface of the joint target with the first working surface of the first silicone layer, the second working surface at least corresponding to the closed contour, the second working surface and the first working surface The bonding functional groups are bonded to each other to form a covalent bond, so that the pressed first substrate, the first silicone layer, and the bonding target together define a sealed accommodation space. The packaging method according to claim 6, wherein the first substrate is made of plastic or glass, and the coating step covers the first surface of the first substrate by injection molding. The encapsulation method of claim 6, wherein the bonding target further comprises a second substrate having a second surface, and the coating step further comprises at least partially covering the second surface of the second silicone layer . The encapsulation method of claim 8, wherein the second substrate is made of plastic or glass, and the coating step covers the second surface of the second substrate by injection molding. The encapsulation method of claim 6, wherein at least one of the first silicone layer and the second silicone layer has a difference from the bonding surface, the first working surface, and the second working surface. The appearance of the exposed exterior. A housing comprising: a first substrate having a first surface; a first silicone layer covering the first surface of the first substrate and having a conformal fit to the first surface a surface, and a first working surface different from the bonding surface, and the first working surface constitutes a closed contour; and a bonding target comprising a second silicone layer, the second silicone layer having a press-fit a second working surface of the first working surface, and the first working surface and the second working surface are joined to each other by a covalent bond. The housing of claim 11, wherein the bonding target further comprises a second substrate having a second surface, and the second silicone layer at least partially covers the second surface. The housing of claim 11, wherein the first silicone layer and the first At least one of the two silicone layers has an outwardly facing appearance surface that is different from the conforming surface, the first working surface, and the second working surface. A method for bonding a substrate, comprising: forming a first silicone layer and a second silicone layer on each surface of a substrate and a bonding target; respectively, respectively forming a first working surface of the first silicone layer and the first a second working surface of the second silicone layer generates a bonding functional group; and bonding the first working surface and the second working surface to bond the bonding functional groups on the first working surface and the second working surface The junction is formed to form a covalent bond, thereby bonding the substrate and the bonding target.