TW201417982A - Assembling method for housing of electronic device and assembly of housing of electronic device - Google Patents

Abstract

An assembling method for a housing of an electronic device is provided. The assembling method for a housing of an electronic device includes the following steps. An antenna pattern layer and an adhesive layer is provided, wherein the antenna pattern layer has a first surface and an opposite second surface, and the adhesive layer is disposed on the first surface of the antenna pattern layer. A plastic frame is formed on the second surface of the antenna pattern layer by injection molding. The antenna pattern layer and the plastic frame are attached on a substrate by the adhesive layer. In addition, an assembly of a housing of an electronic device is also provided.

Description

Assembly method of housing of electronic device and group of housing of electronic device Combined

The present invention relates to a method and a combination of a housing assembly, and more particularly to an assembly method and combination of a housing for an electronic device.

At present, the communication methods of the general public have gradually entered the era of wireless communication, so the use of electronic devices in various occasions is becoming more and more diverse, such as notebook computers, smart phones, and Tablet devices and so on. In the case of the gradual popularization of wireless networks, users can use the wireless network to connect to the Internet in addition to the Internet route.

In order to enable users to obtain better signal quality, electronic devices often need to have antennas arranged therein to receive signals from wireless network base stations. In general, conventional electronic devices use metal as the material of the outer casing for the strength of the outer casing. However, due to the shielding effect of the metal, the reception of the antenna is affected. Therefore, on the outer casing of the conventional notebook computer, in addition to the metal material, in the portion corresponding to the antenna, it is necessary to additionally reserve a block, and replace the metal material with plastic instead of affecting the antenna reception. As a result, in the production of the outer casing, it is necessary to additionally increase the cost of producing and assembling the plastic parts.

Another method of assembling an antenna is to use glass as the material of the outer casing, and the antenna is locked to the frame of the electronic device, and the glass casing is combined with the frame of the electronic device by the double-sided tape. However, this practice is not only time consuming, but also limits the configuration space of the antenna.

The invention provides a method for assembling a casing of an electronic device, which solves the problem caused when the antenna pattern layer is attached, and does not limit the arrangement space of the antenna pattern layer.

The present invention provides a combination of housings for an electronic device that enhances the space utilization of the antenna pattern layer.

The invention provides a method for assembling a housing of an electronic device, comprising the following steps. An antenna pattern layer and an adhesive layer are provided, wherein the antenna pattern layer has a first surface and a second surface, and the adhesive layer is disposed on the first surface of the antenna pattern layer. Next, a plastic frame is formed on the second surface of the antenna pattern layer by injection molding. The antenna pattern layer and the plastic frame are attached to a substrate by an adhesive layer.

The invention further provides a combination of the housing of the electronic device, comprising an antenna pattern layer, an adhesive layer, a plastic frame and a substrate. The antenna pattern layer has a first surface and a second surface opposite to each other. The adhesive layer is disposed on the first surface of the antenna pattern layer. The plastic frame is assembled on the second surface of the antenna pattern layer. The substrate is attached to the antenna pattern layer by an adhesive layer.

Based on the above, the antenna pattern layer of the present invention is integrated with the adhesive layer, and the plastic frame is formed in advance in the antenna pattern layer, compared to the assembly method of the housing of the conventional electronic device and the combination of the housing of the electronic device. Then, the antenna pattern layer and the plastic frame are attached to the substrate by the adhesive layer, and the substrate is attached to the substrate by means of double-sided tape or dispensing.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a text flow diagram of a method of assembling a housing of an electronic device according to an embodiment of the present invention. 2A to 2G are schematic diagrams showing the assembly process of the assembly method of the housing of the electronic device of FIG. 1. Referring to FIG. 1 and FIG. 2A, the assembly method of the housing of the electronic device of the present embodiment is as shown in FIG. 2A. An antenna pattern layer 110 and an adhesive layer 120 are provided. The antenna pattern layer 110 has a first one. Surface 112 and a second surface 114. At this time, the adhesive layer 120 is disposed on the first surface 112 of the antenna pattern layer 110 (step S110). The material of the antenna pattern layer 110 is, for example, copper, nickel, gold, silver, platinum, or an alloy thereof, and can be formed by plating, vapor deposition, sputtering, printing, coating, etching, or the like. Further, the thickness of the antenna pattern layer 110 is, for example, 1 to 20 um.

It should be noted that the heat resistant temperature of the adhesive layer 120 of the embodiment is greater than 230 degrees, and the adhesive layer 120 is an acrylic adhesive, an acrylic foam, a polyolefin adhesive, It is made of polyolefin adhesive or a material with high heat resistance such as adhesive and foam. In detail, for example, the upper and lower layers of the adhesive layer 120 are acrylic adhesives, and an acrylate foam may be added between the upper and lower layers to make the adhesive layer 120 elastic. Further, the thickness of the adhesive layer 120 is, for example, 20 um to 2.0 mm.

The step S110 of providing the antenna pattern layer 110 and the adhesive layer 120 described above includes the following steps. First, a release layer 130 is disposed on the adhesive layer 120 as shown in FIG. 2B. In detail, the material of the release layer 130 includes silane or fluorosilane, and the thickness of the release layer 130 For example, 0.1 to 5 um. Next, a protective layer 140 is disposed on the second surface 114 of the antenna pattern layer 110 as shown in FIG. 2C. The material of the protective layer 140 includes a polyester adhesive, an acrylic adhesive, and a polyolefin adhesive. Further, the thickness of the protective layer 140 is, for example, 5 to 20 um. In other embodiments, the protective layer 140 may be disposed on the second surface 114 of the antenna pattern layer 110, and then the release layer 130 may be disposed on the adhesive layer 120. Therefore, the embodiment does not limit the order of the assembly method. .

Referring to FIG. 2D, a plastic frame 150 is formed on the second surface 114 of the antenna pattern layer 110 by injection molding (step S120). Under the assembly process, the material of the adhesive layer 120 used in this embodiment has a heat resistance temperature of more than 230 degrees, so that it can withstand a higher heat resistant temperature. Thereby, when the step 120 of the injection molding is performed, the adhesive layer 120 does not lose the adhesiveness of the adhesive layer 120 itself due to the high temperature.

Referring to FIG. 2G, the antenna pattern layer 110 and the plastic frame 150 are attached to a substrate 160 by the adhesive layer 120 (step S130). The substrate 160 is made of, for example, glass, acryl, polycarbonate, ABS resin, polystyrene, cholesteryl resin, epoxy resin, or ceramic. In this way, the assembly process of the housing of the electronic device is completed.

The antenna pattern layer 110 of the present embodiment is integrated with the adhesive layer 120, and the plastic frame 150 is formed in advance in the antenna pattern layer 110, and then by the adhesive layer 120, compared with the assembly method of the housing of the conventional electronic device. The antenna pattern layer 110 and the plastic frame 150 are attached to the substrate 160 without being additionally attached to the substrate 160 by means of double-sided tape or dispensing. this In addition, the plastic frame 150 of the present embodiment is formed on the antenna pattern layer 110 by in-mold injection molding, and the antenna pattern layer 110 is changed from a planar shape to a three-dimensional shape, thereby producing a curved surface (stereoscopic) or A planar antenna pattern layer 110. In this way, the curved (stereo) or planar antenna pattern layer 110 can be freely attached to the proper position of the substrate 160 without being restricted by the shape of the substrate 160, which can enhance the antenna pattern layer 110. Configuration space.

Specifically, referring to FIG. 2E , in the step S130 of attaching the antenna pattern layer 110 and the plastic frame 150 to the substrate 160 by the adhesive layer 120 , the assembly method of the housing of the electronic device further includes removing the separation. Type layer 130. For example, substrate 160 may first form a decorative ink layer 170, as shown in Figure 2F. The decorative ink layer 170 is, for example, a white ink layer or a black ink layer, wherein the white ink layer can provide a relatively pure white appearance, and the black ink layer can block light leakage or avoid viewing from the substrate 160 at the periphery of the substrate 160. It will look into the internal components. However, the color and structure of the decorative ink layer 170 are freely variable for those of ordinary skill in the art to achieve the desired decorative effect.

In the present embodiment, the combination 100 of housings of the electronic device can be used to perform the assembly method of the housing of the aforementioned electronic device. Referring to FIG. 2G , the combination 100 of the housing of the electronic device includes an antenna pattern layer 110 , an adhesive layer 120 , a plastic frame 150 , and a substrate 160 . The antenna pattern layer 110 has a three-dimensional shape. The antenna pattern layer 110 has a first surface 112 and a second surface 114 opposite to each other. Specifically, the material of the antenna pattern layer 110 is, for example, copper, nickel, palladium, gold, silver, platinum, or an alloy thereof, and can be plated, It is formed by vapor deposition, sputtering, printing, coating, etching, or the like. Further, the thickness of the antenna pattern layer 110 is, for example, 1 to 20 um.

The adhesive layer 120 is disposed on the first surface 112 of the antenna pattern layer 110, and the thickness of the adhesive layer 120 is, for example, 16 to 250 um. The plastic frame 150 is assembled to the second surface 114 of the antenna pattern layer 110. The combination 100 of housings of the electronic device further includes a protective layer 140. The protective layer 140 is disposed between the plastic frame 150 and the second surface 114 of the antenna pattern layer 110. The material of the protective layer 140 includes a polyester adhesive, an acrylic adhesive, a polyolefin adhesive, and the protective layer 140 has a thickness of, for example, 5 to 20 um.

The substrate 160 is attached to the antenna pattern layer 110 by the adhesive layer 120. In addition, the combination 100 of housings of the electronic device further includes a decorative ink layer 170. The decorative ink layer 170 is disposed between the adhesive layer 120 and the substrate 160, and the present invention does not limit the color and structure of the decorative ink layer 170.

In this configuration, the antenna pattern layer 110 of the present embodiment is attached to the substrate 160 by the adhesive layer 120, without the need to additionally pass the double-sided tape or the dot, compared with the combination of the casing of the conventional electronic device. The glue is attached to the substrate 160, so that the space utilization ratio of the antenna pattern layer 110 can be improved. In addition, the plastic frame 150 is assembled to the second surface 114 of the antenna pattern layer 110 by injection molding, and the adhesive layer 120 is made of a heat resistant temperature such as an acrylic adhesive, an acrylate foam, a polyolefin adhesive, or a polyolefin foam. Made of high material. Accordingly, the material of the adhesive layer 120 used in the embodiment can have a heat resistance temperature of more than 230 degrees, so that it can withstand a higher heat resistant temperature. Therefore, even if the injection molding is performed, the adhesive layer 120 does not lose the adhesiveness of the adhesive layer 120 itself due to the high temperature.

In summary, the antenna pattern layer of the present invention is integrated with the adhesive layer and the plastic frame is pre-formed in the antenna pattern, compared to the assembly method of the housing of the conventional electronic device and the combination of the housing of the electronic device. After the layer is attached to the substrate by the adhesive layer, the adhesive layer and the plastic frame are attached to the substrate without separately applying the double-sided tape or dispensing.

In addition, the plastic frame of the present embodiment is formed in the antenna pattern layer by in-mold injection molding, thereby producing a curved (stereo) or planar antenna pattern layer. In this way, the curved (stereo) or planar antenna pattern layer can be freely attached to the appropriate position of the substrate without being restricted by the shape of the substrate, which can enhance the arrangement space of the antenna pattern layer.

In addition, the material of the adhesive layer used in the present invention has a heat-resistant temperature of more than 230 degrees, so that it can withstand a high heat-resistant temperature. Thereby, in the step of injection molding, the adhesive layer does not lose its adhesiveness due to high temperature, so that the adhesive layer can be attached to the substrate.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Combination of housings for electronic devices

110‧‧‧Antenna pattern layer

112‧‧‧ first surface

114‧‧‧ second surface

120‧‧‧Adhesive layer

130‧‧‧ release layer

140‧‧‧Protective layer

150‧‧‧Plastic frame

160‧‧‧Substrate

170‧‧‧Decorative ink layer

S110~S130‧‧‧Steps

1 is a text flow diagram of a method of assembling a housing of an electronic device according to an embodiment of the present invention.

2A to 2G are schematic diagrams showing the assembly process of the assembly method of the housing of the electronic device of FIG. 1.

S110~S130‧‧‧Steps

Claims (28)

A method for assembling a housing of an electronic device includes: providing an antenna pattern layer and an adhesive layer, wherein the antenna pattern layer has a first surface and a second surface, and the adhesive layer is disposed on the antenna pattern layer Forming a plastic frame on the second surface of the antenna pattern layer by injection molding; and attaching the antenna pattern layer and the plastic frame to a substrate by the adhesive layer. The method of assembling a casing of an electronic device according to claim 1, wherein in the step of forming the plastic frame on the second surface of the antenna pattern layer by injection molding, the antenna pattern layer is The planar shape is transformed into a three-dimensional shape. The method of assembling a casing of an electronic device according to claim 1, wherein the adhesive layer has a heat resistance temperature of more than 230 degrees. The method of assembling a casing of an electronic device according to claim 1, wherein the material of the adhesive layer comprises an acrylic adhesive, an acrylate foam, a polyolefin adhesive, a polyolefin foam or an adhesive plus foam. The method of assembling a casing of an electronic device according to claim 1, wherein the adhesive layer has a thickness of 20 um to 2.0 mm. The method for assembling a casing of an electronic device according to claim 1, further comprising: disposing a plastic frame before the second surface of the antenna pattern layer by injection molding, and disposing a release layer On the adhesive layer; The release layer is removed before the antenna pattern layer and the plastic frame are attached to the substrate by the adhesive layer. The method of assembling a casing of an electronic device according to claim 6, wherein the material of the release layer comprises decane or fluorodecane. The method of assembling a casing of an electronic device according to claim 6, wherein the release layer has a thickness of 0.1 to 5 um. The method for assembling a casing of an electronic device according to claim 1, further comprising: arranging a protective layer on the second surface of the antenna pattern layer by injection molding The second surface of the antenna pattern layer. The method for assembling a casing of an electronic device according to claim 9, wherein the material of the protective layer comprises a polyester adhesive, an acrylic adhesive, and a polyolefin adhesive. The method of assembling a casing of an electronic device according to claim 9, wherein the protective layer has a thickness of 5 to 20 um. The method for assembling a casing of an electronic device according to claim 1, further comprising: arranging a decorative ink layer by attaching the antenna pattern layer and the plastic frame to the substrate by the adhesive layer On the substrate. The method of assembling a casing of an electronic device according to claim 1, wherein the material of the substrate comprises glass, acrylic, polycarbonate, ABS resin, polystyrene, urethane resin, epoxy Star ester, ceramic. The housing of the electronic device according to claim 1 of the patent application The assembly method, wherein the material of the antenna pattern layer comprises copper, nickel, palladium, gold, silver, platinum, and alloys thereof. The method of assembling a housing of an electronic device according to claim 1, wherein the antenna pattern layer has a thickness of 1 to 20 um. The method of assembling a casing of an electronic device according to claim 1, wherein the formation of the antenna pattern layer comprises electroplating, evaporation, sputtering, printing, coating, etching. A combination of a housing of an electronic device, comprising: an antenna pattern layer having a first surface and a second surface; an adhesive layer disposed on the first surface of the antenna pattern layer; a plastic frame body, The second surface assembled to the antenna pattern layer; and a substrate adhered to the antenna pattern layer by the adhesive layer. The combination of the housing of the electronic device of claim 17, wherein the antenna pattern layer has a three-dimensional shape. The combination of the housing of the electronic device of claim 17, wherein the adhesive layer has a heat resistant temperature of greater than 230 degrees. The combination of the casing of the electronic device of claim 17, wherein the adhesive layer comprises an acrylic adhesive, an acrylate foam, a polyolefin adhesive, a polyolefin foam or an adhesive plus foam. The combination of the casing of the electronic device of claim 17, wherein the adhesive layer has a thickness of 20 um to 2.0 mm. The housing of the electronic device as claimed in claim 17 The combination further includes: a protective layer disposed between the plastic frame and the second surface of the antenna pattern layer. The combination of the casing of the electronic device of claim 22, wherein the material of the protective layer comprises a polyester adhesive, an acrylic adhesive, and a polyolefin adhesive. The combination of the casings of the electronic device of claim 22, wherein the protective layer has a thickness of 5 to 20 um. The combination of the housing of the electronic device of claim 17, further comprising: a decorative ink layer disposed between the adhesive layer and the substrate. The combination of the casing of the electronic device of claim 17, wherein the material of the substrate comprises glass, acrylic, polycarbonate, ABS resin, polystyrene, dandelion, epoxy tree Ester, ceramic. The combination of the casings of the electronic device of claim 17, wherein the material of the antenna pattern layer comprises copper, nickel, palladium, gold, silver, zinc, platinum, and alloys thereof. The combination of the casings of the electronic device of claim 17, wherein the antenna pattern layer has a thickness of 1 to 20 um.