TW201303514A - Absorption stage - Google Patents

Abstract

The invention provides an absorption stage, wherein workpieces can be held in a flat state without increasing the working time and lowering the product accuracy. When the absorption stage (40) is in use, a workpiece (22) are held on a flat loading surface (40b). The workpiece (22) is exposed to light so as to be imaged as a predetermined mask pattern, wherein the absorption stage comprises a fixed adsorption mechanism (60) capable of absorbing the workpiece (22) to fix the workpiece (22) relative to the flat loading surface (40b); a plane adsorption mechanism (70) capable of enabling the workpiece (22) to abut against the loading surface (40b) and provided with a plurality of planar adsorption holes (71) opened on the loading surface (40b).

Description

Adsorption station

The present invention relates to an adsorption stage for holding a substrate such as a printed circuit board or a liquid crystal substrate (hereinafter referred to as a workpiece) by adsorption, and an exposure apparatus equipped with the adsorption stage.

Photolithography is widely used in various fields by exposing a predetermined mask pattern to a surface of a workpiece coated with a photosensitive material such as photoresist by an exposure apparatus, and then etching the substrate on the substrate. A mask pattern is formed thereon, and a printed circuit board, a liquid crystal substrate, or the like is also manufactured using an exposure apparatus. In such an exposure apparatus, a projection lens is used to form an exposure light that has passed through a mask in which a predetermined pattern is formed on a surface of a workpiece, thereby forming a predetermined mask pattern on the workpiece. In such an exposure apparatus, there is known an adsorption stage which holds a workpiece by an adsorption method to image exposure light at a desired position on a surface of a workpiece (for example, refer to Patent Document 1).

In the adsorption stage of the conventional exposure apparatus, a receiving pin that can be moved up and down through the through hole and a suction cup formed by the hole are provided in the substrate holding table as the mounting table. On the suction stage, the workpiece conveyed by the transfer arm is received by the upper end of the receiving pin that protrudes from the mounting surface of the substrate holding table, the transfer arm is retracted, and the receiving pin is lowered to place the workpiece. The workpiece is held on the mounting surface of the substrate holding table so that the workpiece can be held by the suction cup.

[Previous Technical Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-186681

Such an exposure apparatus forms a mask pattern on a workpiece by imaging of exposure light, and thus it is required that the workpiece held on the mounting surface is flat with respect to the image forming surface. However, in the above-described conventional adsorption stage, only the substrate having a high surface precision is adsorbed, so that it is difficult to bend the workpiece (also referred to as undulation and warpage) in a state of being supported by the receiving pin. It is eliminated as a whole or locally. For this reason, it is generally considered to adopt a configuration in which the workpiece is pressed into a flat state by a plurality of claws to press the workpiece on the mounting surface, and then sucked by the suction cup.

However, if constructed in this manner, it is necessary to project and place the claws on the workpiece placed on the bearing surface, which results in an increase in the time (handling amount) required for the formation of the mask pattern; Pushing the workpiece may cause scratches on the surface of the workpiece, and the action of the claws may also contaminate the workpiece. Therefore, there is a possibility that the accuracy of the product is lowered due to the above situation.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a suction stage which can hold a workpiece in a flat state without causing an increase in work time and a decrease in product accuracy.

The invention described in claim 1 relates to an adsorption stage for holding a workpiece Exposing a predetermined mask pattern to the workpiece by exposure light on a flat mounting surface, characterized by comprising: a fixed adsorption mechanism for adsorbing the workpiece to make the workpiece relative to the mounting surface And a plane adsorption mechanism capable of adsorbing the workpiece to bring the surface of the workpiece into contact with the mounting surface; the plane adsorption mechanism has a plurality of planar adsorption holes formed on the mounting surface, and the mounting is performed from the surface The adsorption operation by the planar adsorption holes is performed in order from any point on the surface toward the outer edge of the placement surface.

The invention of claim 2 is characterized in that in the adsorption stage of claim 1, the plane adsorption mechanism has a plurality of adsorption zones on the placement surface, and at least one of the planar adsorption holes in each adsorption zone And performing the adsorption operation of each of the above-mentioned plane adsorption holes in accordance with each of the adsorption unit units described above.

The invention according to claim 3 is characterized in that in the adsorption stage of claim 1 or 2, the fixed adsorption mechanism has at least two fixed adsorption portions on the mounting surface, and each of the fixed adsorption portions may have an upper end surface thereof Adsorbed onto the aforementioned workpiece.

According to the invention of claim 4, in the adsorption stage of the claim 3, in the state in which the respective fixed adsorption portions are adsorbed and held, the upper end surface of the fixed adsorption portion may be along the mounting surface. The direction changes the position.

The invention according to claim 5 is characterized in that, in the adsorption stage of the claim 3, the lift pins having the suction surface that is advanced and retractable in the orthogonal direction of the mounting surface with respect to the mounting surface and having an adsorption surface at the upper end are further provided; Fixed adsorption The upper end surface of the fixed adsorption unit is sucked and held in the orthogonal direction from the mounting surface, and the workpiece is adsorbed and held, and the fixed adsorption unit is attached while the workpiece is being adsorbed and held. The end surface and the mounting surface can be the same plane.

The invention according to claim 6 is characterized in that, in the adsorption stage of the claim 1 or 2, the plane adsorption means is used in order from the center position of the mounting surface toward the peripheral edge portion of the mounting surface. The adsorption action of the plane adsorption hole.

The invention according to claim 7 is characterized in that, in the adsorption stage of the claim 1 or 2, the plane adsorption mechanism is sequentially performed from the edge of the placement surface toward the center position of the placement surface. The adsorption operation of each of the above-mentioned adsorption holes is used.

The invention according to claim 8 is characterized in that, in the adsorption stage of the claim 1 or 2, the plane adsorption means performs the use of the next plane adsorption hole in accordance with the adsorption state of the plane adsorption hole in which the adsorption operation has been performed. Adsorption action.

The invention according to claim 9 is characterized in that in the adsorption stage of the claim 1 or 2, the plane adsorption means performs the adsorption operation on the plane adsorption holes in accordance with the deflection of the workpiece held by the fixed adsorption mechanism. Set in order.

The invention described in claim 10 is a mounting table for controlling the position and posture of the reference plane on which the workpiece is imaged with respect to the exposure light, and is characterized in that the adsorption stage of claim 1 or 2 is employed.

The exposure apparatus of claim 11 is characterized in that the adsorption stage of claim 1 or 2 is employed.

According to the adsorption stage of the present invention, since the plane adsorption mechanism sequentially performs the adsorption operation from any point on the mounting surface toward the outer edge, even if the workpiece is deflected, the workpiece caused by the deflection can be floated toward The outer side (outer edge) of the mounting surface escapes, so that the workpiece can be suitably adsorbed on the flat mounting surface. Thereby, the workpiece can be adsorbed and maintained in a flat state.

Further, since the planar adsorption mechanism can be suctioned (vacuum) by a plurality of planar adsorption holes formed on the placement surface, the workpiece can be made flat, so that the accuracy of the product can be prevented from being lowered.

Further, in the adsorption stage, since the plane adsorption mechanism is suctioned (vacuum) by a plurality of plane adsorption holes formed on the placement surface, the workpiece is brought into a flat state, so that the workpiece is placed on the placement surface. Therefore, the suction (vacuum) can be immediately performed by the respective plane adsorption holes, so that the time (processing amount) required for the formation of the mask pattern can be shortened.

In addition to the above configuration, the plane adsorption mechanism has a plurality of adsorption zones on the mounting surface, and has at least one planar adsorption hole in each adsorption zone, and performs adsorption operations of the respective adsorption holes in accordance with each adsorption zone unit. The control for performing the adsorption operation can be performed in the plane adsorption mechanism in accordance with the adsorption section, and the workpiece can be flattened with simple control.

In addition to the above configuration, since the fixed adsorption mechanism has at least two fixed adsorption portions on the placement surface, the fixed adsorption portion can be sucked by the upper end surface thereof. Since it is attached to the workpiece, it is possible to prevent the change in the posture of the workpiece by the adsorption holding by the fixed adsorption mechanism with a simple configuration.

In addition to the above configuration, in the state in which the fixed adsorption portion holds and holds the workpiece, the upper end surface of the fixed adsorption portion can be changed in the direction of the placement surface, so that the posture of the workpiece can be maintained at all times, and the plane adsorption mechanism can be utilized. The step-by-step adsorption operation causes the workpiece to float due to deflection to easily escape to the outside.

In addition to the above configuration, the lift pin having the suction surface that is advanced and retractable in the orthogonal direction of the mounting surface and having the suction surface at the upper end is provided, and each of the fixed adsorption portions can be aligned with the upper end surface of the fixed adsorption portion from the mounting surface. In the state in which the cross direction is extended, the workpiece is sucked and held, and in the state in which the workpiece is adsorbed and held, the upper end surface of the fixed adsorption portion and the mounting surface can be made the same plane, thereby preventing the workpiece from being attached to the lift pin. The hold state is the load applied to the workpiece when transferring.

In addition, the posture of the workpiece can be maintained at all times, and the workpiece can be quietly placed on the mounting surface.

In addition to the above-described configuration, the plane adsorption mechanism gradually moves the adsorption hole by the plane adsorption hole from the center position of the placement surface toward the peripheral portion of the placement surface, so that the offset caused by the floating of the workpiece can be further prevented. The position and posture determined by the adsorption of the fixed adsorption portions of the fixed adsorption mechanism are maintained more reliably, and the workpiece is flattened.

In addition to the above configuration, the plane adsorption mechanism gradually moves the suction by the plane adsorption hole from the edge of the placement surface toward the center position of the overloading surface, thereby causing the workpiece caused by the deflection to float to another One The edge of the square escapes, whereby the workpiece can be properly adsorbed on the flat mounting surface, and the workpiece can be adsorbed and held in a flat state.

In addition to the above-described configuration, the plane adsorption mechanism performs the adsorption operation according to the next plane adsorption hole based on the adsorption state of the plane adsorption hole that has been subjected to the adsorption operation, and thus the portion where the adsorption operation is performed first (planar adsorption hole) After the workpiece is adsorbed on the mounting surface in an appropriate manner, the next planar adsorption hole can be used for the adsorption operation, so that the workpiece can be further flattened.

In addition to the above configuration, the plane adsorption mechanism sets the order of the adsorption operation of each of the plane adsorption holes in accordance with the deflection of the workpiece held by the fixed adsorption mechanism, and therefore, the plane adsorption holes can be performed in the order in which the workpiece is flexed. The adsorption action can further flatten the workpiece.

In the mounting table using the above-described adsorption stage, since the workpiece is flat on the adsorption stage with extremely high precision, the workpiece can be placed at an appropriate position with respect to the portion where the projection optical system of the exposure apparatus exposes.

In the exposure apparatus using the above adsorption stage, the workpiece is flattened with extremely high precision on the adsorption stage, and the mask pattern can be exposed to the workpiece in an appropriate manner.

Hereinafter, an embodiment of the mounting table 30 according to the present invention will be described with reference to the drawings.

[Examples]

First, a schematic configuration of an exposure apparatus 10 using the mounting table 30 of the present invention will be described. FIG. 1 is an explanatory view showing a configuration of an exposure apparatus 10 as an example of an exposure apparatus according to the present invention. As shown in FIG. 1, the exposure device 10 has a light source 11, a cold light mirror 12, an exposure shutter 13, an ultraviolet band pass filter 14, an integrator lens 15, a collimator lens 16, and a plane mirror 17 from the emission side in the optical axis direction. The mask stage 18, the mask dead zone portion 19, the projection lens 20, the magnification correction unit 21, and the mounting table 30 (projection exposure stage). The exposure device 10 uses ultraviolet rays as exposure light.

The light source 11 is provided for ultraviolet irradiation to provide exposure light for exposure, and the mercury lamp 11a is disposed at the first focus position of the elliptical mirror (elliptical mirror) 11b. In the light source 11, the emitted light emitted from the mercury lamp 11a is reflected by the elliptical mirror 11b, and travels toward the cold mirror 12.

The cold mirror 12 transmits infrared rays in the infrared region which is incident into the incoming light, and reflects light of other wavelength ranges, thereby separating infrared rays in the infrared region from the incident light. Thereby, the emitted light emitted from the light source 11 is separated from the infrared light in the infrared region by the cold mirror 12, and then travels toward the exposure shutter 13 or the ultraviolet band pass filter 14.

The exposure shutter 13 can freely enter and exit the optical path (the illumination light path to be described later) of the cold-light mirror 12 toward the ultraviolet band pass filter 14, thereby switching between the transmitted light reflected from the cold mirror 12 and the transmission. . The exposure shutter 13 is detached from the optical path, and the workpiece 22 can be exposed as will be described later; if it is located on the optical path, the exposure of the workpiece 22 to be described later is caused. stop.

The ultraviolet band pass filter 14 allows only ultraviolet rays incident into the incoming light to pass therethrough. In the present embodiment, it is composed of an i-line band pass filter that allows a spectral line of mercury having a wavelength of 365 nm, that is, an i-line transmission. Therefore, the emitted light reflected by the cold mirror 12 passes through the ultraviolet band pass filter 14 to leave only the ultraviolet (i-line) wavelength range of light (actually high-intensity light in the vicinity of the i-line wavelength range), and is oriented The integrator lens 15 travels.

The integrator lens 15 is for eliminating illuminance unevenness of the incident light, and distributing the illuminance distribution on the irradiation surface to the periphery in a bright and uniform manner. Therefore, the incident light of the light in the wavelength range of only the ultraviolet ray (i-line) is passed through the ultraviolet band pass filter 14, and the illuminance is uniformly distributed after passing through the integrator lens 15, and further travels toward the integrator lens 16.

The collimator lens 16 emits the incident light as parallel light (light beam). Therefore, the emitted light having the illuminance uniformly distributed by the integrator lens 15 is parallel light and acts on the plane mirror 17 by the collimator lens 16, and is reflected by the plane mirror 17 toward the mask stage 18.

The mask stage 18 causes the mask 18a on which the pattern is formed to be located on the optical path of the emitted light reflected by the plane mirror 17, and is movable and held in a direction orthogonal to the optical axis of the optical path. Moreover, not further shown in the figures, the mask 18a of the mask table 18 is detachable and can be replaced with a mask formed with other different patterns. Next, the emitted light reflected by the plane mirror 17 passes through the mask 18a and travels toward the projection lens 20 in accordance with the shape of the pattern formed on the mask 18a.

According to the above, in the exposure device 10, it is emitted from the light source 11 and The light path of the supercooling mirror 12, the exposure shutter 13, the ultraviolet band pass filter 14, the integrator lens 15, the collimator lens 16, and the plane mirror 17 is used as an irradiation for irradiating the mask 18a with ultraviolet rays (i-line) as exposure light. The optical system functions.

A mask dead zone portion 19 is provided between the mask stage 18 and the projection lens 20. The mask dead zone portion 19 is provided on the optical path passing through the light emitted from the mask 18a, and the mask pattern in the mask pattern of the mask 18a is formed in the mask pattern as appropriate. The workpiece 22 on the mounting table 30 is placed on the workpiece 22, and the mask blind portion 19 is appropriately inserted into the optical path according to the mask pattern of the mask 18a.

The projection lens 20 is for appropriately exposing the pattern formed on the mask 18a to the later-described workpiece 22 on the mounting table 30, and appropriately changing the pattern of the mask 18a held on the mask table 18 (hereinafter also referred to as masking) A multiple of the cover pattern is formed on the surface of the workpiece 22 to be described later placed on the mounting table 30. That is, the projection lens 20 has a surface of the workpiece 22 placed in the state of the mounting table 30 as an imaging surface, and the imaging surface and the mask 18a optically form a conjugate positional relationship. As described above, in the exposure device 10, ultraviolet rays (i lines) are used as exposure light, and therefore, the projection lens 20 can perform high-accuracy aberration correction on ultraviolet rays (i-line). Therefore, when the emitted light that has passed through the mask 18a is incident, the projection lens 20 can appropriately form the mask pattern of the mask 18a on the imaging surface (on the workpiece 22 to be described later) on the mounting table 30.

A magnification correction unit 21 is provided between the projection lens 20 and the mounting table 30. According to the strain of the workpiece 22 to be described later placed on the mounting table 30, the magnification is corrected. The positive portion 21 deforms the mask pattern formed on the imaging surface on the mounting table 30. The magnification correction unit 21 causes the mask pattern in the imaging plane to be deformed by appropriately changing the magnification in an arbitrary direction along the plane orthogonal to the optical path. The magnification correction unit 21 can be realized by, for example, a configuration in which a plurality of glass plates are inserted so as to be orthogonal to the optical axis of the projection lens 20, and the respective glass plates are appropriately bent or rotated.

In the exposure apparatus 10, the mask blind area 19, the projection lens 20, and the magnification correcting unit 21 function as a projection optical system in which the exposure of the mask 18a through which the predetermined pattern is formed is transmitted. The ultraviolet rays of the light are imaged on the image forming surface (on the workpiece 22 to be described later) on the mounting table 30 as a mask pattern.

The workpiece 22 is placed on the mounting table 30 to mask the exposure of the pattern. With respect to the mounting table 30, the workpiece 22 can be held in such a manner that the surface of the placed workpiece 22 is aligned with the imaging surface of the projection lens 20, and the held workpiece 22 can be aligned with the optical axis of the projection optical system. Move the face to move. The movement of the workpiece 22 in the mounting table 30 is performed under the control of the drive control unit 43 (refer to FIG. 14) provided inside the mounting table 30. The structure of the mounting table 30 will be described later. In addition, the movement of the workpiece 22 in the mounting table 30 can be performed manually.

The workpiece 22 is formed by applying or attaching a photosensitive material such as a photoresist that reacts with ultraviolet rays (i-line) on a ruthenium sheet, a glass substrate, a printed circuit board or the like. Therefore, the workpiece 22 can be exposed by irradiation with ultraviolet rays (i-line).

In the exposure device 10, the light source 11 is emitted from the light source 11 The emitted light passes through the cold mirror 12, the ultraviolet band pass filter 14, the integrator lens 15, the collimator lens 16, and the plane mirror 17, and is transmitted to the mask stage 18, so that the ultraviolet light (i line) can be held in the mask table in the same manner. The mask 18a on the 18 is illuminated. Then, in the exposure apparatus 10, the mask pattern obtained by ultraviolet rays (i-line) is appropriately formed on the mounting table 30 by the action of the mask blind portion 19, the projection lens 20, and the magnification correcting portion 21 as the projection optical system. on. According to this, in the exposure device 10, the workpiece 22 is placed at an appropriate position (attitude) along the image plane, whereby the mask pattern can be properly exposed on the workpiece 22. The position of the workpiece 22 with respect to the mask pattern, that is, the position of the workpiece 22 with respect to the mask 18a passing through the projection optical system can be adjusted (aligned) by appropriately moving the workpiece 22 held by the mounting table 30 on the image plane.

As shown in FIGS. 2 and 3, the mounting table 30 used in the exposure apparatus 10 of the present invention has a base member 31, two Y-axis drive mechanisms 32, a Y-axis floating member 33, and two X-axis drive mechanisms. 34. Two X-axis floating members 35, XY adjustment plates 36, three Z-axis drive mechanisms 37, Z-axis adjustment plates 38, lifting mechanisms 39, and suction plates 40.

The base member 31 is a plate-like member that extends along a reference plane serving as a reference when the positional relationship of the workpiece 22 with respect to the projection optical system (refer to FIG. 1) is set, and is fixed to the projection optical system. The reference plane is a position at which the position of the mask pattern is imaged by the above-described projection optical system, that is, the reference plane is an image plane that is optically conjugate with the mask 18a by the projection lens 20. In this embodiment, the reference plane is perpendicular to the Z-axis and parallel to the Z-axis by the projection optical system. The plane in the X-Y plane. The positive direction of the Z axis is the side directed from the mounting table 30 to the above-described projection optical system (refer to FIG. 2). The base member 31 extends along the X-Y plane, and two Y-axis drive mechanisms 32 are provided on the upper surface of the base member 31.

As shown in FIGS. 2 to 4, the two Y-axis drive mechanisms 32 are provided at both ends in the X-axis direction on the upper surface of the base member 31. The two Y-axis drive mechanisms 32 apply a driving force in the Y-axis direction of the base member 31 to the Y-axis floating member 33. The Y-axis floating member 33 has a plate shape having a through hole 33a at the center, and is provided along the reference plane.

Each of the Y-axis drive mechanisms 32 has the same configuration as the X-axis drive mechanism 34 described later, and includes a Y-axis fixed member 32a, a pair of base-side Y-axis guide members 32b, a Y-axis movable member (not shown), and a pair of floating member sides. Y-axis guiding member. On the upper surface of the base member 31, the Y-axis fixing member 32a is formed by arranging a plurality of permanent magnets in the Y-axis direction with different magnetic poles adjacent to each other, thereby constituting a so-called electromagnetic track. The two base-side Y-axis guide members 32b are provided in pairs on the upper surface of the base member 31 so as to sandwich the Y-axis fixing member 32a, and extend in the Y-axis direction. The two base-side Y-axis guiding members 32b and a pair of floating member-side Y-axis guiding members (not shown) provided on the lower surface (back surface) of the Y-axis floating member 33 are slidable in the extending direction (Y-axis direction) Fit together. The Y-axis movable element (not shown) is provided on the lower surface (back surface) of the Y-axis floating member 33 so as to face the Y-axis fixing member 32a so as to face the pair of floating member-side Y-axis guiding members (not shown). between. A coil to which an electric current can be applied is accommodated in the Y-axis movable element (not shown).

For each of the Y-axis drive mechanisms 32, the Y-axis of the Y-axis movable element can be fixed by appropriately applying a suction repulsive force by a magnetic force between the Y-axis movable element (not shown) and the Y-axis fixing element 32a. The floating member 33 moves in the Y-axis direction. Further, in the present embodiment, the Y-axis direction functions as the first direction along the reference plane, the two Y-axis drive mechanisms 32 function as the first drive mechanism, and the Y-axis float member 33 functions as the first slide device. Further, in order to detect the position of the Y-axis floating member 33 in the base member 31, a position detecting element (not shown) is provided. In addition, for the two Y-axis drive mechanisms 32, the two are synchronously controlled to move the single Y-axis floating member 33.

In the mounting table 30, the applied current applied to the two Y-axis moving elements (not shown) is synchronously controlled by the drive control unit 43 (refer to FIG. 14) provided therein to make the two Y-axis movable elements and the two Y-axis The attraction repulsive force caused by the magnetic force acts between the fixing members 32a, thereby causing the Y-axis floating member 33 to which the two Y-axis movable members are fixed to move. At this time, since the drive control unit 43 moves by the attraction repulsive force by the magnetic force, the servo control is performed based on the position information detected by the position detecting element (not shown), and the moving target can be appropriately oriented. Position moves. Two X-axis drive mechanisms 34 are provided on the Y-axis floating member 33.

Two X-axis drive mechanisms 34 are provided at both end positions in the Y-axis direction of the upper surface of the Y-axis floating member 33. Each of the X-axis driving mechanisms 34 applies a driving force directed to the X-axis direction of the Y-axis floating member 33 to the corresponding X-axis floating member 35 (35A, 35B). The two X-axis floating members 35 have a substantially equal plate shape and are equal in the Z-axis direction (upper and lower positions) , configured along the X axis.

Each of the X-axis driving mechanisms 34 has an X-axis fixing member 34a, a pair of base-side X-axis guiding members 34b, an X-axis movable member 34c, and a pair of floating member-side X-axis guiding members 34d. On the upper surface of the Y-axis floating member 33, the X-axis fixing member 34a is formed by arranging a plurality of permanent magnets in the X-axis direction with different magnetic poles adjacent to each other, thereby constituting a so-called electromagnetic track. The two base side X-axis guiding members 34b are provided in pairs on the upper surface of the Y-axis floating member 33 so as to sandwich the X-axis fixing member 34a, and extend in the X-axis direction. The two base-side X-axis guide members 34b are slidably fitted in the extending direction with a pair of floating member-side X-axis guide members 34d provided on the lower surface (back surface) of the X-axis floating member 35. The X-axis movable element 34c is disposed on the lower surface (back surface) of the X-axis floating member 35 so as to face the X-axis fixing member 34a (refer to FIG. 3). A coil to which an electric current can be applied is accommodated in the X-axis movable element 34c.

The two X-axis driving mechanisms 34, one of which (referred to as 34A when described separately) is disposed in a manner corresponding to the X-axis floating member 35A; the other (referred to as 34B in a separate description) to correspond to the X-axis floating member 35B. Mode setting. That is, the X-axis driving mechanism 34A is provided to move one of the X-axis floating members 35A in the X-axis direction, and the X-axis movable member 34c is provided on the lower surface of the X-axis floating member 35A; in addition, the X-axis driving mechanism 34B is for The other X-axis floating member 35B is moved in the X-axis direction, and the X-axis movable member 34c is provided on the lower surface of the X-axis floating member 35B.

Each X-axis drive mechanism 34 utilizes attraction rejection caused by magnetic force The force acts between the X-axis movable element 34c and the X-axis fixed element 34a so that the corresponding X-axis floating member 35 (35A or 35B) can be moved in the X-axis direction. Further, in the present embodiment, the X-axis direction acts as a second direction orthogonal to the first direction along the reference plane, and each X-axis drive mechanism 34 functions as a second drive mechanism, and each X is operated. The shaft floating member 35 functions as a second sliding device. In order to detect the position of each of the X-axis floating members 35A and 35B on the Y-axis floating member 33, a position detecting element (not shown) is provided. Further, in the present embodiment, the reference position of the drive control (movement in the X-axis direction) by the two X-axis drive mechanisms 34 is defined as: the X-axis floating member 35A and the X-axis floating member 35B are movable along the X-axis. The central position of the range, and the state is formed by arranging the X-axis floating member 35A and the X-axis floating member 35B on the upper surface of the Y-axis floating member 33 in the Y-axis direction (refer to FIG. 4 and the like).

In the mounting table 30, the applied current to each of the X-axis movable elements 34c is controlled by the drive control unit 43 (refer to FIG. 14) provided therein, so that the attraction repulsive force caused by the magnetic force is on the X-axis movable element 34c. The X-axis floating member 35 (35A or 35B) fixed by the X-axis movable member 34c is moved individually or integrally between the X-axis fixing member 34a and the X-axis fixing member 34a. At this time, since the movement is performed by the drive control unit 43 by the attraction repulsive force caused by the magnetic force, the servo control is performed based on the position information detected by the position detecting element (not shown) to move to the already set moving target. The position moves appropriately. The XY adjustment plate 36 is disposed to be placed between the two X-axis floating members 35 ( Refer to Figure 5).

The XY adjustment plate 36 is provided to set (adjust) the position of the workpiece 22 (refer to FIG. 1) in the X-Y direction and the rotational posture along the X-Y plane. As shown in FIG. 5, the XY adjustment plate 36 has a plate shape and extends so as to be stretched over the two X-axis floating members 35 along the reference plane. The XY adjustment plate 36 is coupled to the X-axis floating member 35A via the first coupling portion 51, and is also coupled to the X-axis floating member 35B via the second coupling portion 52. In the present embodiment, the first connecting portion 51 and the second connecting portion 52 are connected to the X-axis floating member 35A via the third connecting portion 53, and are coupled to the X-axis floating member 35B via the fourth connecting portion 54. . Each of the joint portions (51, 52, 53, 54) extends along the Z-axis, and is connected to the XY adjustment plate 36 at one end on the positive side of the Z-axis, and is connected to the other X at the other end on the negative side of the Z-axis. Axle floating member 35 (35A, 35B).

Here, as shown in FIG. 6, the portion of the XY adjustment plate 36 that connects the first connection portion 51 is the plate-side first support point Sb1, and the portion that connects the second connection portion 52 is the plate-side second support point Sb2. The portion connecting the third connecting portion 53 is the third support point Sb3 on the board side, and the portion connecting the fourth connecting portion 54 is the fourth support point Sb4 on the board side. In the X-axis floating member 35A, the portion where the first connecting portion 51 is connected is the floating member side first support point Ss1, and the portion where the third connecting portion 53 is connected is the floating member side third support point Ss3. In the X-axis floating member 35B, the portion where the second connecting portion 52 is connected is the second supporting point Ss2 on the floating member side, and the portion where the fourth connecting portion 54 is connected is the fourth supporting point Ss4 on the floating member side. In the present embodiment, each of the support points on the XY adjustment plate 36 (Sb1, Sb12, Sb3 and Sb4) are arranged in a manner of being depicted as a square.

In the first connecting portion 51, the plate-side first support point Sb1 and the floating member-side first support point Ss1 are viewed on the same straight line from the Z-axis positive side, and the X-axis floating members 35A and XY are adjusted. The plates 36 are joined together in such a manner as to allow the X-axis floating member 35A and the XY adjustment plate 36 to be relatively rotated about the reference axis Ba passing through the 2 support points Sb1, Ss1 in a state where the relative positional relationship has been fixed. . In the present embodiment, as shown in FIG. 7, the first joint portion 51 has a joint base portion 51a that is fixed to the X-axis floating member 35A and extends in the Z-axis direction, and an extended end that is slidable relative to the joint base portion 51a. The rotating portion 51c is provided in such a manner that the portion 51b is rotated. The joint base portion 51a has a cylindrical shape and defines its central axis along the Z-axis. The rotating portion 51c is an annular shape that surrounds the extended end portion 51b of the joint base portion 51a, and surrounds the central axis of the joint base portion 51a so as to be rotatable relative to the extended end portion 51b. Further, the rotating portion 51c of the first joint portion 51 is fixed to the XY adjustment plate 36.

In the first joint portion 51, since the joint base portion 51a and the rotation portion 51c are rotatable about the central axis of the joint base portion 51a, the X-axis floating member 35A provided with the joint base portion 51a and the rotary portion 51c are provided. The relative rotation of the XY adjustment plate 36 about the central axis also joins the X-axis floating member 35A and the XY adjustment plate 36. Therefore, in the first connecting portion 51, the central axis of the connecting base portion 51a is the reference axis Ba, the center position of the connecting base portion 51a is the first support point Ss1 on the floating member side, and the center position of the rotating portion 51c is the first side of the plate side. Support point Sb1.

The second coupling portion 52 connects the X-axis floating member 35B and the XY adjustment plate 36 in such a manner that not only the plate-side second support point Sb2 but also the floating member-side second support point Ss2 are oriented in the third direction along the XY plane. The relative position is changed, and the X-axis floating member 35B and the XY adjustment plate 36 are also allowed to relatively rotate about the Z-axis (refer to FIG. 6 and the like). As shown in FIG. 8, the second coupling portion 52 has a coupling base portion 52a that is fixed to the X-axis floating member 35B and extends in the Z-axis direction, and a coupling rotating portion 52b that is rotatable relative to the coupling base portion 52a. A rail holding portion 52c of the upper end surface thereof; a rail 52d slidably held on the rail holding portion 52c; and a mounting portion 52e fixed to the rail 52d. The joint base portion 52a has a cylindrical shape and its central axis is along the Z-axis. The joint rotating portion 52b has a cylindrical shape having a smaller diameter than the joint base portion 52a, and is disposed at a position concentric with the joint base portion 52a. The joint rotating portion 52b is rotatable around the central axis of the joint base portion 52a. The rail holding portion 52c holds the rail 52d which is oblique to the X-axis (second direction) and the Y-axis (third direction) in the direction along the XY plane in such a manner as to be slidable in the third direction. direction. The rail 52d has a rod shape extending in the third direction and is fixed to the mounting portion 52e. The mounting portion 52e has a cylindrical shape and is fixed to the XY adjustment plate 36. Thus, the rail 52d is fixed to the XY adjustment plate 36 via the mounting portion 52e. In the XY adjustment plate 36, the third direction of the direction in which the rail 52d extends is the direction of the straight line connecting the second support point Sb2 on the board side and the first support point Sb1 on the board side. Consistent, and in turn, the diagonals of the squares depicted by the respective support points (Sb1, Sb2, Sb3, Sb4) are identical . Therefore, the third direction has an angle of 45 degrees with respect to the X-axis (second direction) and the Y-axis (first direction). Further, in the third embodiment, the third direction may be fixed to the XY adjustment plate 36 or may be fixed to the X-axis floating member 35B.

In the second joint portion 52, the rail 52d and the rail holding portion 52c are relatively movable in the third direction, and the joint rotating portion 52b and the joint base portion 52a can also be wound around the joint rotating portion 52b provided with the rail holding portion 52c. The central axis rotates relative to each other. Therefore, the second joint portion 52 allows not only the X-axis floating member 35B provided with the joint base portion 52a but also the XY adjustment plate 36 provided with the rail 52d (mounting portion 52e) to change the relative position in the third direction, and also allows the X-axis The floating member 35B and the XY adjustment plate 36 are relatively rotated about the central axis of the joint base portion 52a (joining rotary portion 52b), and the X-axis floating member 35B and the XY adjustment plate 36 are coupled. Therefore, in the second joint portion 52, the center position of the joint base portion 52a is the float member side second support point Ss2, and the center position of the rail 52d (mounting portion 52e) is the plate side second support point Sb2. The second connecting portion 52 is provided such that the plate-side second support point Sb2 and the floating member-side second support point Ss2 are respectively disposed on the X-axis floating member 35B and the XY adjustment plate 36, and when X When the shaft floating member 35A and the X-axis floating member 35B are located at the reference position of the drive control, the plate-side second support point Sb2 and the floating member-side second support point Ss2 are located on the same straight line from the Z-axis positive side (track 52d) The center position (the central axis of the mounting portion 52e) coincides with the central axis of the joint base portion 52a).

The third joint portion 53 connects the X-axis floating member 35A and the following manner. The XY adjustment plates 36 are coupled, that is, not only allow the plate-side third support point Sb3 and the floating member-side third support point Ss3 to change relative positions in the direction along the XY plane, but also allow the X-axis floating members 35A and XY to be adjusted. The plate 36 is relatively rotated about the Z axis (refer to FIG. 6 and the like). As shown in Fig. 9, the third connecting portion 53 includes a first rail 53a fixed to the X-axis floating member 35A, a first rail holding portion 53b that slidably holds the first rail 53a, and is fixed to the first rail. a fixing plate portion 53c on the holding portion 53b; a second rail holding portion 53d fixed to the fixing plate portion 53c; a second rail 53e slidably held by the second rail holding portion 53d; fixed to the second rail A rotating shaft portion 53f on the 53e; and a rotating portion 53g provided in a rotatable manner relative to the rotating shaft portion 53f. The first rail 53a has a rod shape extending in the Y-axis direction. The first rail holding portion 53b holds the first rail 53a so as to slide in the extending direction. The fixing plate portion 53c has a rod shape, and a first rail holding portion 53b is provided on the lower surface side thereof, and a second rail holding portion 53d is provided on the upper surface side, and the first rail holding portion 53b and the second rail holding portion are provided. The positional relationship of 53d is fixed. The second rail holding portion 53d holds the second rail 53e so as to slide in the X-axis direction. The second rail 53e has a rod shape extending in the X-axis direction, and is slidable in the extending direction thereof and held by the second rail holding portion 53d. The rotating shaft portion 53f has a cylindrical shape, and the central axis is fixed to the second rail 53e along the Z axis. The rotating portion 53g is an annular shape that surrounds the rotating shaft portion 53f, and is rotatable around the central axis of the rotating shaft portion 53f. Further, the rotating portion 53g is fixed to the XY adjustment plate 36.

In the third connecting portion 53, the first rail 53a and the first rail holding portion 53b are relatively movable in the Y-axis direction, and the second rail holding portion 53d and the second rail 53e are relatively movable in the X-axis direction, and are rotated. The shaft portion 53f and the rotating portion 53g are relatively rotated about a central axis of the rotating shaft portion 53f provided on the second rail 53e. Therefore, the third coupling portion 53 connects the X-axis floating member 35A and the XY adjustment plate 36 in such a manner that not only the X-axis floating member 35A provided with the first rail 53a but also the XY adjustment plate provided with the rotating portion 53g are allowed. The relative position is changed toward the direction along the XY plane, and the X-axis floating member 35A and the XY adjustment plate 36 are also allowed to relatively rotate about the central axis of the rotating shaft portion 53f. Therefore, in the third connecting portion 53, the center position of the first rail 53a is the floating member side third support point Ss3, and the center position of the rotating portion 53g is the board side third support point Sb3. The third connecting portion 53 is provided such that the plate-side third support point Sb3 and the floating member-side third support point Ss3 are respectively disposed on the X-axis floating member 35A and the XY adjustment plate 36, and when X When the shaft floating member 35A and the X-axis floating member 35B are located at the reference position of the drive control, the third support point Sb3 on the plate side and the third support point Ss3 on the side of the floating member are located on the same straight line from the positive side of the Z-axis (rotational axis) The central axis of the portion 53f coincides with a straight line passing through the center position of the first track 53a along the Z axis. In other words, the third connecting portion 53 is viewed from the positive side of the Z-axis, and the interval between the third support point Sb3 on the plate side and the third support point Ss3 on the floating member side does not fluctuate (the interval is maintained at a predetermined size). The plate-side third support point Sb3 and the floating member-side third support point Ss3 are oriented in a relative position along the XY plane. Make changes.

The fourth coupling portion 54 connects the X-axis floating member 35B and the XY adjustment plate 36 in such a manner that not only the plate-side fourth support point Sb4 but also the floating member-side fourth support point Ss4 are opposed to each other in the direction along the XY plane. The position is changed, and the X-axis floating member 35B and the XY adjustment plate 36 are also allowed to relatively rotate about the Z-axis (refer to FIG. 6 and the like). As shown in Fig. 10, the fourth connecting portion 54 includes a first rail 54a fixed to the X-axis floating member 35B, a first rail holding portion 54b that slidably holds the first rail 54a, and is fixed to the first rail. a fixing plate portion 54c on the holding portion 54b; a second rail holding portion 54d fixed to the fixing plate portion 54c; a second rail 54e slidably held by the second rail holding portion 54d; fixed to the second rail A rotating shaft portion 54f on the 54e; and a rotating portion 54g provided in a rotatable manner relative to the rotating shaft portion 54f. The first rail 54a has a rod shape extending in the X-axis direction. The first rail holding portion 54b holds the first rail 54a so as to slide in the extending direction. The fixing plate portion 54c has a rod shape, and a first rail holding portion 54b is provided on the lower surface side thereof, and a second rail holding portion 54d is provided on the upper surface side, and the first rail holding portion 54b and the second rail holding portion are provided. The positional relationship of 54d is fixed. The second rail holding portion 54d holds the second rail 54e so as to slide in the Y-axis direction. The second rail 54e has a rod shape extending in the Y-axis direction, and is slidably held in the extending direction thereof and held by the second rail holding portion 54d. The rotating shaft portion 54f has a cylindrical shape, and the central axis is fixed to the second rail 54e along the Z axis. The rotating portion 54g is in the shape of a ring that surrounds the rotating shaft portion 54f and can surround the rotating shaft. The central axis of the portion 54f is free to rotate. Further, the rotating portion 54g is fixed to the XY adjustment plate 36.

In the fourth connecting portion 54, the first rail 54a and the first rail holding portion 54b can be relatively moved in the X-axis direction, and the second rail holding portion 54d and the second rail 54e can be relatively moved in the Y-axis direction. It is also possible to relatively rotate the rotating portion 54g and the rotating shaft portion 54f around the central axis of the rotating shaft portion 54f provided on the second rail 54e. Therefore, with respect to the fourth joint portion 54, one side allows the X-axis floating member 35B provided on the first rail 54a and the XY adjustment plate 36 provided on the rotating portion 54g to change the relative position in the direction along the XY plane. The relative rotation about the central axis of the rotating shaft portion 54f is also allowed, and the other side connects the X-axis floating member 35B and the XY adjustment plate 36. Therefore, in the fourth connecting portion 54, the center position of the first rail 54a is the fourth support point Ss4 on the floating member side, and the center position of the rotating portion 54g is the fourth support point Sb4 on the board side. The fourth joint portion 54 is provided such that the plate-side fourth support point Sb4 and the floating member-side fourth support point Ss4 are respectively disposed on the X-axis floating member 35A and the XY adjustment plate 36, and when X When the shaft floating member 35A and the X-axis floating member 35B are located at the reference position of the drive control, the plate-side fourth support point Sb4 and the floating member-side fourth support point Ss4 are located on the same straight line from the Z-axis positive side (rotation axis) The central axis of the portion 54f coincides with a straight line passing through the center position of the first track 54a along the Z axis. In other words, the fourth connecting portion 54 is viewed from the positive side of the Z-axis, and the interval between the fourth support point Sb4 on the plate side and the fourth support point Ss4 on the floating member side does not change (the interval is maintained at a predetermined size). The plate-side fourth support point Sb4 and the floating member-side fourth support point Ss4 can be changed in a direction toward the X-Y plane.

Therefore, with respect to the XY adjustment plate 36, the Y-axis floating member 33 can be appropriately moved in the Y-axis direction on the base member 31, and the position in the Y-axis direction can be adjusted. Further, by using the two X-axis floating members 35 (35A, 35B) Moving together in the X-axis direction, the position in the X-axis direction can be adjusted, whereby the XY adjustment plate 36 can freely move in the direction of the XY plane. Further, as shown in FIG. 6, the XY adjustment plate 36 is appropriately moved in the X-axis direction on the base member 31 by the X-axis floating member 35A and the X-axis floating member 35B, so that the XY adjustment plate 36 can be wound around the reference axis Ba as a rotation center. Adjustment of the rotational attitude of the Z axis (refer to arrow A1). At this time, the XY adjustment plate 36 is rotated by the reference axis Ba as a base point, and the fluctuation amount is the plate-side second support point Sb2, the floating member-side second support point Ss2, and the plate-side third support. The point Sb3, the third support point Ss3 on the floating member side, the fourth support point Sb4 on the plate side, and the fourth support point Ss4 on the floating member side are in a direction along the XY plane, and the fluctuation portion is in the direction of the second connection portion 52. The displacement in the third direction and the third connecting portion 53 and the fourth connecting portion 54 are absorbed in the displacement in the XY plane direction, and thus can be supported by the two X-axis floating members 35 (35A, 35B). In addition, since only the second coupling portion 52 is allowed to perform the displacement in the third direction in the XY adjustment plate 36, the positional relationship between the X-axis floating member 35B and the X-axis floating member 35A and the XY adjustment plate can be made. 36 establishes a one-to-one correspondence with the rotational attitude of the reference axis Ba. Therefore, in the present embodiment, the XY adjustment plate 36 functions as a plane adjustment plate, and two X-axis drives The moving mechanism 34 and the two X-axis floating members 35 function as a rotation drive mechanism.

In the XY adjustment plate 36, three support insertion holes 36a, 36b, and 36c which are provided to surround the center position, and a central through hole 36d provided in the center thereof are provided. The three support insertion holes 36a, 36b, and 36c are provided corresponding to the three Z-axis drive mechanisms 37. The size of the central through hole 36d is smaller than that of the through hole 33a of the Y-axis floating member 33 when viewed from the positive side of the Z-axis, and when the X-axis floating member 35A and the X-axis floating member 35B are located at the reference position of the drive control, the center The through hole 36d is located at the center of the through hole 33a.

Each of the three Z-axis drive mechanisms 37 is disposed on the lower side (back side) of the XY adjustment plate 36 (refer to FIGS. 1 and 12). Each of the Z-axis drive mechanisms 37 is set to set (adjust) the position of the workpiece 22 (refer to FIG. 1) in the Z-axis direction and the inclination with respect to the Z-axis. In the present embodiment, three Z-axis driving mechanisms 37 are as shown in Fig. 11, one (referred to as 37A in the description) is located above the X-axis floating member 35A, and the remaining two are referred to as separate descriptions. 37B, 37C) are located above the X-axis floating member 35B. Since the respective Z-axis drive mechanisms 37 have the same basic configuration, the schematic configuration of the Z-axis drive mechanism 37A will be described below, and the other portions will be omitted.

As shown in Fig. 12, the Z-axis drive mechanism 37A includes a drive motor 37a, a conversion unit 37b, a transmission shaft 37c, a moving bearing portion 37d, a first moving portion 37e, a first guide portion 37f, a second guide portion 37g, and a second guide. Holding portion 37h, second moving portion 37i, third guiding portion 37j, and third guiding holding portion 37k, a ball joint shaft 37l, a spherical bearing portion 37m, and a Z-axis moving portion 37n.

The drive motor 37a is appropriately controlled by the drive control unit 43 (refer to FIG. 14) provided inside the mounting table 30 to be driven to rotate. A stepping motor is employed in the drive motor 37a. The output shaft of the drive motor 37a is connected to the conversion portion 37b. The transmission shaft 37c is connected to the conversion portion 37b, and converts the rotational motion of the drive motor 37a into the forward and backward movement of the transmission shaft 37c in the Y-axis direction. The transmission shaft 37c has a rod shape extending in the Y-axis direction, and is held by the moving bearing portion 37d in the Y-axis direction. The moving bearing portion 37d is fixed to the back surface of the XY adjustment plate 36, and the moving bearing portion 37d serves to advance and retract the transmission shaft 37c that is subjected to the driving force output from the drive motor 37a in the Y-axis direction.

The first moving portion 37e is fixed to the transmission shaft 37c. The first moving portion 37e has a so-called wedge shape in which the upper surface is inclined with respect to the X-Y plane along the X-Y plane and the lower surface, and the upper surface is slidably held by the first guiding portion 37f. The first guide portion 37f has a rod shape extending in the Y-axis direction and is fixed to the back surface of the XY adjustment plate 36. Therefore, the first moving portion 37e can move forward and backward in the Y-axis direction in accordance with the forward and backward movement of the transmission shaft 37c in the Y-axis direction.

The second guiding portion 37g is fixed along the lower surface of the first moving portion 37e. The second guiding portion 37g has a rod shape and extends in a direction oblique to the Y-axis along the Y-Z plane. The second guiding portion 37g is held by the second guiding holding portion 37h. The second guide holding portion 37h holds the second guide portion 37g so as to be slidable in the extending direction, and the second guide holding portion 37h is fixed to the second moving portion 37i.

The second moving portion 37i has a columnar shape and has an arm portion 37o extending in the Y circumferential direction. The upper surface of the arm portion 37o is parallel to the lower surface of the first moving portion 37e. The second guide holding portion 37h is fixed to the upper surface of the arm portion 37o. In the second moving portion 37i, the third guiding portion 37j is fixed to the side opposite to the side from which the arm portion 37o extends, as viewed from the positive side of the Y-axis. The third guiding portion 37j has a rod shape and extends in the Z-axis direction. The third guiding portion 37j is held by the third guiding holding portion 37k. The third guide holding portion 37k slidably holds the third guide portion 37j in the extending direction, and is fixed to the extension wall 36e of the XY adjustment plate 36. The extension wall 36e extends from the back surface of the XY adjustment plate 36 toward the lower side along the Z axis.

When the first moving portion 37e moves forward and backward in the Y-axis direction, the second moving portion 37i is connected to the first moving portion 37e via the second guiding portion 37g and the second guiding holding portion 37h. The guide direction of the guide portion 37j and the third guide holding portion 37k, that is, the Z-axis direction advances and retreats. In other words, when the transmission shaft 37c advances (the first moving portion 37e is separated from the drive motor 37a), the second moving portion 37i moves in the negative direction of the Z-axis; and when the transmission shaft 37c moves backward (the first moving portion 37e approaches the drive motor 37a) Then, the second moving portion 37i moves in the positive direction of the Z-axis. It is the respective Z-axis drive mechanism 37 that can realize this movement, since each Z-axis drive mechanism 37 is a so-called wedge mechanism. The second moving portion 37i and the third guiding portion 37j that move forward and backward in the Z-axis direction, and the extending wall 36e and the third guiding holding portion 37k that are fixed to the XY adjusting plate 36 and have a constant height in the Z-axis direction are constant. Their lower portions are located in the space between the X-axis floating member 35A and the X-axis floating member 35B.

A ball joint shaft 37l is provided at an upper portion of the second moving portion 37i. The ball hinge shaft 37l extends in the Z-axis direction, and the extended end is formed in a spherical shape (37p). The spherical portion 37p of the ball joint shaft 37l is held by the spherical bearing portion 37m. The spherical bearing portion 37m slidably holds the spherical portion 37p of the ball joint shaft 37l along its spherical shape. A Z-axis moving portion 37n is provided above the spherical bearing portion 37m. The Z-axis moving portion 37n has a columnar shape. The Z-axis moving portion 37n swings freely around the center position of the spherical portion 37p of the ball joint shaft 37l with respect to the second moving portion 37i.

Therefore, in the Z-axis drive mechanism 37A, the first moving portion 37e moves forward and backward in the Y-axis direction by the drive shaft 37a appropriately driving the rotation, and the second moving portion 37e moves forward and backward in the Y-axis direction. The moving portion 37i moves forward and backward in the Z-axis direction, and passes through the ball joint shaft 37l and the spherical surface with respect to the XY adjustment plate 36 attached via the moving bearing portion 37d, the first moving portion 37e, and the third guiding holding portion 37k. The Z-axis moving portion 37n attached to the second moving portion 37i by the bearing portion 37m moves forward and backward in the Z-axis direction.

As described above, each of the Z-axis drive mechanisms 37 is provided in each of the support portion insertion holes (36a, 36b, 36c) of the XY adjustment plate 36. Specifically, as shown in FIG. 11, the Z-axis moving portion 37n of the Z-axis driving mechanism 37A is inserted into the support portion insertion hole 36a, and the Z-axis moving portion 37n of the Z-axis driving mechanism 37B is inserted into the support portion insertion hole. In 36b, the Z-axis moving portion 37n of the Z-axis drive mechanism 37C is inserted into the support portion insertion hole 36c. Above the Z-axis moving portions 37n of the Z-axis driving mechanisms 37, adjustment plate support portions (37q, 37r, 37s) for supporting the Z-axis adjustment plates 38 are provided. Thus, in this In the embodiment, the Z axis is the fourth direction orthogonal to the reference plane, the Z axis adjustment plate 38 functions as the fourth direction adjustment plate, and each Z axis drive mechanism 37 functions as the fourth direction drive mechanism. Further, in each of the Z-axis drive mechanisms 37, the drive motor 37a, the conversion unit 37b, the transmission shaft 37c, the moving bearing portion 37d, the first moving portion 37e, the first guiding portion 37f, the second guiding portion 37g, and the second guiding holding are provided. The portion 37h, the second moving portion 37i, the third guiding portion 37j, the third guiding holding portion 37k, the ball joint shaft 37l, the spherical bearing portion 37m, and the Z-axis moving portion 37n all function as a driving main portion.

The adjustment plate support portion 37q provided on the Z-axis moving portion 37n of the Z-axis drive mechanism 37A has a columnar shape and is fixed to a predetermined position on the back surface of the Z-axis adjustment plate 38. In other words, since the adjustment plate support portion 37q is provided on the Z-axis moving portion 37n that is swingable by the ball joint shaft 37l and the spherical bearing portion 37m, the adjustment plate support portion 37q allows the Z-axis adjustment plate 38 to be opposed to the XY. The inclination of the plane changes, and the Z-axis adjustment plate 38 is supported at a predetermined position. Further, the adjustment plate support portion 37q functions as a first support portion of the fourth direction drive mechanism.

The adjustment plate support portion 37r provided in the Z-axis moving portion 37n of the Z-axis drive mechanism 37B has a long guide rail, and the guide rail is slidably held by a guide rail holding portion provided on the back surface of the Z-axis adjustment plate 38 (not shown). Thereby connected to the back side of the Z-axis adjustment plate 38. The guide rail is disposed in such a manner that the axis of the adjustment plate support portion 37q (Z-axis moving portion 37n) of the Z-axis drive mechanism 37A is located in the extending direction of the guide rail, in other words, extends toward the axis. An adjustment plate support portion 37r is provided on the Z-axis moving portion 37n that is swingable by the ball joint shaft 37l and the spherical bearing portion 37m, and the adjustment plate is provided. The support portion 37r supports the back surface of the Z-axis adjustment plate 38 so as to be freely displaceable in the extending direction of the guide rail while allowing the inclination of the Z-axis adjustment plate 38 to the X-Y plane. Further, the adjustment plate support portion 37r functions as a second support portion of the fourth direction drive mechanism.

The adjustment plate support portion 37s provided on the Z-axis moving portion 37n of the Z-axis drive mechanism 37C is slidably abutted against the back surface of the Z-axis adjustment plate 38 in a cylindrical shape. In other words, the adjustment plate support portion 37s is provided on the Z-axis moving portion 37n that is swingable by the ball joint shaft 37l and the spherical bearing portion 37m, and the adjustment plate support portion 37s allows the inclination of the Z-axis adjustment plate 38 with respect to the XY plane. The Z-axis adjustment plate 38 is supported while moving freely. Further, the adjustment plate support portion 37s functions as a third support portion of the fourth direction drive mechanism.

As shown in FIG. 2, the Z-axis adjustment plate 38 is a plate-like member that can hold the suction plate 40 that adsorbs and holds the workpiece 22 (refer to FIG. 1). The Z-axis adjustment plate 38 adjusts the height in the Z-axis direction by synchronously driving each of the Z-axis drive mechanisms 37. Further, by individually driving each of the Z-axis driving mechanisms 37 in an appropriate manner, the inclination change of the Z-axis adjustment plate 38 with respect to the X-Y plane can be adjusted. At this time, in the Z-axis adjustment plate 38, a portion where the adjustment plate support portion 37q of the Z-axis drive mechanism 37A is fixed is used as a base point, and the adjustment plate support portion 37q and the adjustment plate support portion 37r of the Z-axis drive mechanism 37B and The fluctuation portion of the respective intervals caused by the difference in height of the adjustment plate support portion 37s of the Z-axis drive mechanism 37C, the displacement of the guide rail on the adjustment plate support portion 37r in the extending direction and the change in the adjustment plate support portion 37s Position to absorb, thus, it is possible to use each Z-axis drive mechanism 37 Row support. Further, in the Z-axis adjustment plate 38, since the adjustment plate support portion 37r allowing only the Z-axis drive mechanism 37B is changed in position in the extending direction of the guide rail, the adjustment plate support portion of the Z-axis drive mechanism 37A is provided. The 37q is used as a base point to prevent rotation around the Z axis.

As shown in FIG. 3, a tool microscope 41 and an ultrasonic sensor 42 are provided in the Z-axis adjustment plate 38. The tool microscope 41 and the ultrasonic sensor 42 are fixed to the inner peripheral edge portion of the center insertion hole 38a (not shown). The tool microscope 41 extends downward from the center insertion hole 38a, and extends in a space between the X-axis floating member 35A and the X-axis floating member 35B and a central through hole 36d of the XY adjustment plate 36. The tool microscope 41 is a microscope for adjusting the reference position of the Z-axis adjustment plate 38 (XY adjustment plate 36) facing the projection optical system of the exposure apparatus 10, and is adjusted in the Z-axis fixed by the center insertion hole 38a. In a state where the plate 38 is in the reference posture, the optical axis of the tool microscope 41 coincides with the Z axis. The "reference posture of the Z-axis adjustment plate 38" means that the heights supported by the respective Z-axis drive mechanisms 37 (the adjustment plate support portions (37q, 37r, 37s)) are equal, that is, the base member 31 is used as the base member 31. The state of the reference along the XY plane. The tool microscope 41 is disposed such that the optical axis of the tool microscope 41 coincides with the optical axis of the projection optical system of the exposure device 10, and the Z-axis adjustment plate 38 (XY adjustment plate 36) is viewed from a direction orthogonal to the XY plane. The position of the ) is used as the reference position. Further, when the workpiece 22 has been adsorbed and held on the suction plate 40, the workpiece 22 is defined along the reference plane, and thus, the tool microscope 41 can also be used for the Z-axis adjustment plate 38 to which the suction plate 40 is mounted. The position (height) along the Z-axis direction.

The ultrasonic sensor 42 extends downward from the central insertion hole 38a of the Z-axis adjustment plate 38, and extends in the space between the X-axis floating member 35A and the X-axis floating member 35B and the central through hole 36d of the XY adjustment plate 36. . The ultrasonic sensor 42 is for discriminating whether or not the workpiece 22 is adsorbed (placed) on the suction plate 40. The ultrasonic sensor 42 has a detection direction equivalent to the Z axis in a state where the Z-axis adjustment plate 38 is in the reference posture.

As shown in FIGS. 2 and 3, the elevating mechanism 39 (refer to FIGS. 2 and 3) is disposed below the Z-axis adjustment plate 38. The lifting mechanism 39 is for moving the workpiece 22 (refer to FIG. 1) on the suction plate 40 in the Z-axis direction. As shown in FIG. 13, the elevating mechanism 39 has a lifting base 39a, a plurality of lifting pins 39b, a vertical driving portion 39c, a lift pin first suction portion 39d (refer to FIG. 14), and a lift pin second suction portion 39e (refer to FIG. 14). . The lifting base 39a is a frame member that is held by the vertical driving portion 39c so as to be freely movable in the Z-axis direction. The illustration of the vertical drive unit 39c is omitted, and the upper end surface of the vertical drive unit 39c is fixed to the back surface of the Z-axis adjustment plate 38. Therefore, the elevation base 39a is not limited to the inclination of the Z-axis adjustment plate 38 with respect to the XY plane, and the XY adjustment plate 36 is opposed to the Z by the vertical drive portion 39c as viewed in a direction orthogonal to the plate surface of the Z-axis adjustment plate 38. The position of the shaft adjustment plate 38 (the position on the Z axis) is freely changed. Each of the lift pins 39b is provided on the lift base 39a.

Each of the lift pins 39b is a cylindrical member that protrudes from the lift base 39a on the positive side of the Z-axis, and a lift pin suction surface 39f is provided at the upper end. The lift pin suction surface 39f is formed of a flexible material and has a bowl shape that is open at the top. (Refer to Fig. 15A, etc.). The following description is omitted, and each of the lift pins 39b is connected to the lift pin first suction portion 39d or the lift pin second suction portion 39e (refer to FIG. 14). The lift pin first suction portion 39d or the lift pin second suction portion 39e communicates with the internal space of the corresponding lift pin 39b from the base end portion thereof, thereby evacuating the vacuum and releasing the vacuum. In the lift pins 39b, the inner space is pumped by the lift pin first suction portion 39d or the lift pin second suction portion 39e in a state where the workpiece 22 (refer to FIG. 1) is placed on the lift pin suction surface 39f. Vacuum is applied to hold the workpiece 22 (refer to Figure 1). In the present embodiment, two lift pins 39b (also referred to as lift pins 39b1) are disposed inside the lift base 39a, and four lift pins 39b (also referred to as lift pins 39b2) are disposed outside, and the lift pins are first. The suction portion 39d is connected to the two lift pins 39b1, and the lift pin second suction portion 39e is connected to the four lift pins 39b2 (refer to Fig. 14). Therefore, in the elevating mechanism 39, the two lift pins 39b1 and the four lift pins 39b2 can be evacuated.

Each of the lift pins 39b can pass through a pin insertion hole 38b (refer to FIG. 3 and the like) provided on the Z-axis adjustment plate 38, and a pin insertion hole 40a (refer to FIG. 3 and FIG. 15A, etc.) provided on the suction plate 40, It protrudes toward the upper side of the suction plate 40 (the mounting surface 40b mentioned later). This elevating mechanism 39 is controlled by a drive control unit 43 (refer to FIG. 14) provided inside the mounting table 30. As shown in FIG. 14, the drive control unit 43 can control two Y-axis drive mechanisms 32, two X-axis drive mechanisms 34, each Z-axis drive mechanism 37, a lift mechanism 39, a fixed suction mechanism 60 to be described later, and a plane suction mechanism. 70, a detection signal transmitted from the posture obtaining means 44 to be described later can be obtained. In the lifting mechanism 39 In the state in which the lift pins 39b have been extended toward the upper side of the suction plate 40 (refer to FIG. 15), the workpiece 22 (refer to FIG. 1) placed on the upper end surface of each of the lift pins 39b is sucked and held, and thereafter The lift base 39a is lowered, and the lift pins 39b are pulled toward the suction plate 40 side (refer to Fig. 16), so that the workpiece 22 sucked and held can be placed on the suction plate 40 (the mounting surface 40b to be described later).

As shown in FIG. 15 and FIG. 16, the suction plate 40 has a rectangular plate shape, and a mounting surface 40b for placing the workpiece 22 (refer to FIG. 1) is formed on the upper surface of the high-precision flat surface. The suction plate 40 is set such that the mounting surface 40b is along the reference plane (X-Y plane) in a state where the Z-axis adjustment plate 38 is in the reference posture. The fixed adsorption mechanism 60 and the planar adsorption mechanism 70 are disposed in the suction plate 40.

In the fixed suction mechanism 60, when the workpiece 22 (refer to FIG. 1) sucked and held by the elevating mechanism 39 (each lift pin 39b) is placed on the mounting surface 40b of the suction plate 40, the posture is not changed, and the relative load is carried. The position of the face 40b is fixed and held. The fixed suction mechanism 60 has a plurality of flange adsorption portions 61 as fixed adsorption portions. As shown in Fig. 15A, the flange suction portions 61 are respectively provided in the respective adsorption recesses 40c, and the respective adsorption recesses 40c are provided on the suction plate 40 such that the mounting surface 40b is recessed. Each of the flange suction portions 61 has a tubular shape, and the upper end serves as the flange suction surface 61a, and the workpiece 22 can be sucked and held by the flange suction surface 61a by the action of the flange suction portions (62 to 65 (refer to FIG. 14)) which will be described later. (Refer to Figure 1). The flange suction portion 61 can change the position of the flange suction surface 61a (holding position) in the direction of the mounting surface 40b in a state where the workpiece 22 has been adsorbed and held. Further, in a state in which the flange suction surface 61a (holding position) protrudes from the mounting surface 40b in the orthogonal direction (Z-axis direction) of the mounting surface 40b, the workpiece 22 can be suction-held, and In a state where the workpiece 22 is sucked and held, the flange suction surface 61a (holding position) and the mounting surface 40b can be flush with each other. Each of the flange suction portions 61 is formed of a flexible resin material, and constitutes a bellows-like tubular member that extends in the orthogonal direction (Z-axis direction) of the mounting surface 40b.

As shown in Fig. 15 and Fig. 16, the flange suction portion 61 is provided in total of twelve, that is, three sides are provided on each side along the side of the mounting surface 40b, and are divided into four groups in accordance with each side. Hereinafter, when the flange adsorption portion 61 is described for each group, for convenience, it is referred to as an n-th group of flange adsorption portions 61A, 61B, 61C, 61D as shown in Fig. 17 (n means an integer of 1 to 4) ). In other words, each of the first group flange suction portion 61A, the second group flange suction portion 61B, the third group flange suction portion 61C, and the fourth group flange suction portion 61D has three flange adsorption portions 61.

Each of the flange suction portions 61 is connected to a flange suction portion (62 to 65 (refer to FIG. 14)) (not shown). The flange suction portions (62 to 65) communicate with the space at the base end portion of each of the flange suction portions 61 corresponding thereto, and can evacuate the space and release the vacuum. In a state where the workpiece 22 (refer to FIG. 1) is placed on the flange suction surface 61a, the space inside each of the flange adsorption portions 61 is evacuated by the flange suction portions (62 to 65), so that it can be adsorbed and held. Workpiece 22 (refer to Figure 1). Further, each of the flange adsorption portions 61 is formed into a flexible bellows-like tubular member, and therefore, not only its flange suction surface 61a (holding position) but also It is displaced in the direction along the mounting surface 40b, and can be folded and contracted along the Z-axis by the suction of the flange suction portions (62-65). In the present embodiment, as described above, each of the flange suction portions 61 is folded and contracted, so that the flange suction surface 61a (holding position) and the placement surface 40b can be positioned on the same plane.

In the present embodiment, as shown in FIG. 14, the flange first suction portion 62 is connected to the first group flange suction portion 61A, and the flange second suction portion 63 is connected to the second group flange suction portion 61B. The suction portion 64 is connected to the third group flange suction portion 61C, and the flange fourth suction portion 65 is connected to the fourth group flange suction portion 61D. Therefore, in the fixed suction mechanism 60, each of the n-th group of the flange adsorption portions 61A, 61B, 61C, and 61D (n is an integer of 1 to 4) can be evacuated. The workpiece 22 is sucked and held by the plurality of flange adsorption portions 61 (at least two), so that the change in the posture of the workpiece 22 can be prevented. Here, the "attitude of the workpiece 22" is expressed by the relative inclination of the workpiece 22 with respect to the reference plane in the X, Y, and Z axis directions. Further, in the position where the flange suction surface 61a (holding position) of each of the flange suction portions 61 is changed in the direction of the mounting surface 40b, the force in the direction along the mounting surface 40b does not act on the workpiece held by the suction and holding. The self of 22, the direction of movement is not uniform and remains elastic, so that the workpiece 22 that has been adsorbed and held is not moved in the direction along the XY plane. Thus, with respect to the fixed suction mechanism 60, the holding position of each of the flange adsorption portions 61 that has been sucked and held by the workpiece 22 is allowed to change in the direction along the mounting surface 40b, and it is also possible to be orthogonal to the mounting surface 40b. The direction moves to the side of the mounting surface 40b. Therefore, the fixed suction mechanism 60 can place the workpiece 22 that is adsorbed and held separately from the mounting surface 40b on the mounting surface 40b.

The plane suction mechanism 70 flattens the workpiece placed on the mounting surface 40b, and adsorbs and holds the workpiece on the mounting surface 40b. The plane adsorption mechanism 70 has a plurality of planar adsorption holes 71. Each of the plane adsorption holes 71 is a through hole (see FIG. 3) that penetrates the suction plate 40 in the height direction, and is disposed so as to be distributed over the entire area of the placement surface 40b. In the present embodiment, the planar adsorption holes 71 are disposed on the plurality of annular grooves 72. The annular grooves 72 are disposed on the mounting surface 40b, and the planar adsorption holes 71 on the same annular groove 72 are connected to each other (refer to the figure). 15A, etc.). Each of the annular grooves 72 is provided in a rectangular shape centering on the center position of the mounting surface 40b, and is located from a position near the center of the mounting surface 40b to a position near each side, thereby making the inside The area is expanded in stages. When the annular grooves 72 are separately shown, they are sequentially referred to as annular grooves 72A to 72G from the inside.

The planar hole suction portions (73 to 75 (refer to FIG. 14)) (not shown) are connected to the respective planar adsorption holes 71. On the back side of the suction plate 40, the plane hole suction portions (73 to 75 (refer to FIG. 14)) communicate with the corresponding plane adsorption holes 71, and the internal space can be evacuated and evacuated. In each of the planar adsorption holes 71, in a state where the workpiece 22 (refer to FIG. 1) is placed on the placement surface 40b, the internal space is evacuated by the planar hole suction portion (73 to 75 (refer to FIG. 14)). Thereby, the workpiece 22 (refer to Fig. 1) can be adsorbed and held on the mounting surface 40b. In the present embodiment, since the plane adsorption holes 71 are provided in the annular groove 72A to the annular groove 72G, the flat hole suction portions (73 to 75 (refer to FIG. 14)) are evacuated by the respective plane adsorption holes 71. The annular groove 72A to the annular groove 72G can carry the workpiece 22 ( Referring to Fig. 1), the adsorption is held on the mounting surface 40b. Thereby, the suction plate 40 functions as a suction stage that can hold and hold the workpiece 22 (refer to FIG. 1) on the mounting surface 40b by the fixed adsorption mechanism 60 and the plane adsorption mechanism 70.

As shown in FIG. 18, each annular groove 72 is divided into three groups of an inner annular groove 72A to an annular groove 72C, an intermediate annular groove 72D to an annular groove 72F, and an outer annular groove 72G (refer to the reference numeral). 77, 78, 79). Therefore, three planar hole suction portions (73, 74, 75 (refer to FIG. 14)) corresponding to the respective groups are provided, and the planar first hole suction portion 73 is connected to the inner annular groove 72A to the annular groove 72C, and the plane is The two-hole suction portion 74 connects the intermediate annular groove 72D to the annular groove 72F, and the planar third hole suction portion 75 connects the outer annular groove 72G. A plurality of suction chambers 76 (refer to FIG. 19) are formed on the back side of the suction plate 40 for connection.

As shown in Fig. 19, each of the suction chambers 76 is formed such that the back surface of the suction plate 40 has a concave shape, and the concave portion divided by the ribs is sealed by a sealing member (not shown). Each of the suction chambers 76 has an inner suction chamber 76A, a suction chamber 76B that surrounds the inner suction chamber 76A, and four suction chambers 76C that surround each side. The drawing room omits the following, and the suction chamber 76A communicates with each of the plane adsorption holes 71 (refer to FIG. 18 and the like) on the annular groove 72A to the annular groove 72C, and the suction chamber 76B and the annular groove 72D to the annular groove 72F. Each of the plane adsorption holes 71 (refer to FIG. 18 and the like) communicates, and the four suction chambers 76C communicate with the respective plane adsorption holes 71 (refer to FIG. 18 and the like) on the annular groove 72G. Further, the illustration omits the following, the plane first hole suction portion 73 is connected to the suction chamber 76A, and the planar second hole suction portion 74 is connected to the suction chamber 76B. The plane third hole suction portion 75 is connected to the suction chamber 76C (refer to FIG. 14).

Therefore, as shown in FIG. 18, the plane adsorption mechanism 70 is evacuated by the planar first hole suction portion 73 (refer to FIG. 14), and may be adsorbed through the suction chamber 76A (refer to FIG. 19) and the planes communicating therewith. The hole 71 draws a vacuum into the annular groove 72A to the annular groove 72C. At this time, the annular groove 72A to the annular groove 72C are adjacent to each other on the mounting surface 40b so as to surround the center position. Therefore, the predetermined area from the center position of the mounting surface 40b to the peripheral position of the annular groove 72C (predetermined) In the first adsorption zone 77), a vacuum can be drawn between the placement surface 40b and the workpiece 22 placed thereon. Thereby, the planar adsorption mechanism 70 is evacuated by the planar first hole suction portion 73, whereby the workpiece 22 can be adsorbed and held by the center position of the mounting surface 40b by the cooperation with the mounting surface 40b. The first adsorption zone 77 is located in the vicinity of the circumferential position of the annular groove 72C. Similarly, the plane adsorption mechanism 70 evacuates the planar second hole suction portion 74, passes through the suction chamber 76B and the respective plane adsorption holes 71 communicating therewith, and evacuates the annular groove 72D to the annular groove 72F. Therefore, the workpiece 22 can be adsorbed and held in the second adsorption zone 78 from the outside of the first adsorption zone 77 to the peripheral position of the annular groove 72F by the cooperation with the placement surface 40b. Further, in the plane adsorption mechanism 70, the flat third hole suction portion 75 is evacuated, and the four suction chambers 76C and the respective plane adsorption holes 71 communicating therewith are evacuated to evacuate the annular groove 72G. The workpiece 22 can be adsorbed and held in the third adsorption zone 79 from the outside of the second adsorption zone 78 to the peripheral position of the annular groove 72G by the cooperation with the placement surface 40b.

Further, in the present embodiment, the respective suction portions (39d, 39e, 62-65, 73-75) located in the elevating mechanism 39, the fixed suction mechanism 60, and the plane suction mechanism 70 are omitted, and a single vacuum pump is used. A plurality of pipes connected to each other and a valve mechanism provided in each pipe are configured, and the valve mechanism is appropriately opened and closed, so that each of the suction portions can be evacuated and evacuated. The operation of the plane suction mechanism 70, the operation of the elevating mechanism 39, and the fixed suction mechanism 60 are all performed under the control of the drive control unit 43 provided inside the mounting table 30 (refer to FIG. 14). This control will be described in detail later.

In the mounting table 30, the workpiece 22 (refer to FIG. 1) placed on the upper end surface of each of the lift pins 39b projecting above the suction plate 40 is sucked and held, and the workpiece 22 is sucked by the action of the lift mechanism 39. It is held on the suction plate 40. Thereafter, in the mounting table 30, the workpiece 22 is placed in an appropriate posture along the imaging surface (reference plane) of the projection optical system of the exposure device 10, in accordance with the posture of the workpiece 22 sucked and held by the suction plate 40, while being placed in a relative posture. The projection optics is in a suitable position. Specifically, on the base member 31, the two Y-axis floating members 33 are appropriately moved in the X-axis direction along the Y-axis direction, and the two X-axis floating members 35 (35A, 35B) are appropriately moved in the X-axis direction, thereby passing through the suction plate 40 and the Z-axis. The adjustment plate 38 and each of the Z-axis drive mechanisms 37 adjust the position and the rotational posture of the workpiece 22 provided on the XY adjustment plate 36 along the XY plane. Further, by appropriately changing the position supported by each Z-axis drive mechanism 37, the position (height) in the Z-axis direction of the workpiece 22 provided on the XY adjustment plate 36 through the suction plate 40 and the Z-axis adjustment plate 38 and Inclination relative to the XY plane Degree adjustment. Thereby, the mask pattern can be appropriately exposed on the workpiece 22.

Next, a process of adsorbing and holding the workpiece 22 on the suction plate 40 (mounting surface 40b) in a flat state by the elevating mechanism 39, the fixed suction mechanism 60, and the plane suction mechanism will be described with reference to FIG. 1 to FIG. Further, as described above, this step is performed by the drive control unit 43 provided inside the mounting table 30 (refer to FIG. 14). In addition, in FIGS. 2, 3, and 15 to 18, the illustration of the workpiece 22 is omitted in order to facilitate understanding of the structure and operation.

The workpiece 22 placed on the mounting surface 30 (see FIG. 1) is omitted, and is conveyed to the suction plate 40 while being held by the transfer arm (transport arm). This transfer arm has a well-known structure, and can be adsorbed and held so that the workpiece 22 can be supported from below, and this hold state can be maintained all the time. The ultrasonic sensor 42 (refer to FIG. 3) can be used to detect whether the workpiece 22 has been transported to the suction plate 40 by the transfer arm (transport arm).

When the workpiece 22 is transported on the suction plate 40, as shown in Fig. 15, on the mounting table 30, the elevating mechanism 39 projects the lift pins 39b above the suction plate 40 (mounting surface 40b) and lifts them up and down. The pin suction surface 39f abuts against the back surface of the workpiece 22. Then, the elevating mechanism 39 sucks and holds the vicinity of the center of the workpiece 22 by the two lift pins 39b1 by vacuuming the lift pin first suction portion 39d (refer to FIG. 14), and then uses the lift pin second suction portion 39e (refer to FIG. 14). The vacuum is sucked and held by the four lift pins 39b2 to hold the vicinity of the four corners of the workpiece 22. Thereby, the elevating mechanism 39 can maintain the posture of the workpiece 22 adsorbed and held on the transport arm (not shown) at all times. The workpiece 22 is sucked and held by each of the lift pins 39b (lifting pin suction surface 39f). Further, in the exposure apparatus 10 of the present embodiment, the attitude obtaining means 44 obtains the posture of the workpiece 22 in a state where the workpiece 22 is suction-held on the transfer arm (not shown). Thereafter, as shown in Fig. 16, the elevating mechanism 39 pulls the lift pins 39b toward the suction plate 40 side, and the back surface of the flange suction surface 61a of each of the lip-shaped suction portions 61 abuts against the back surface of the workpiece 22 that is suction-held. .

As shown in FIG. 16 and FIG. 17, the fixed suction mechanism 60 performs vacuuming by each of the flange suction portions 62 to 65 (refer to FIG. 14), and each of the lip-shaped adsorption portions 61 ( The flange adsorption surface 61a) adsorbs and holds the workpiece 22. Thereafter, the elevating mechanism 39 releases the suction holding by the lift pins 39b, and pulls the lift pins 39b into the suction plate 40. In the fixed suction mechanism 60, the vacuuming by the respective flange suction portions 62 to 65 is continued, and the flange suction portion 61 is always contracted (folded) and reaches the following height in a state in which the workpiece 22 is always held and held. That is, at this height, the flange suction surface 61a (holding position) and the mounting surface 40b are flush with each other. Thus, in the fixed suction mechanism 60, the workpiece 22 can be placed on the mounting surface while being held by the respective lip-shaped adsorption portions 61 while maintaining the workpiece 22 adsorbed and held in the elevating mechanism 39. 40b. Further, although the fixed adsorption mechanism 60 is configured to be divided into the n-th group of the flange adsorption portions 61A, 61B, 61C, and 61D (n is an integer of 1 to 4), in the present embodiment, they may be Perform all adsorption actions together.

Thereafter, in the mounting table 30, it is determined by the plane adsorption mechanism 70. The phased adsorption action. As shown in FIG. 18, in the first embodiment, the plane suction mechanism 70 first performs the workpiece 22 on the first adsorption section 77 of the mounting surface 40b by vacuuming the planar first hole suction portion 73 (refer to FIG. 14). Adsorption is maintained. Thus, in the plane adsorption mechanism 70, the workpiece 22 can be adsorbed on the first adsorption section 77 of the placement surface 40b while maintaining the posture of the workpiece 22 adsorbed and held in the fixed adsorption mechanism 60. Next, in the plane adsorption mechanism 70, the suction of the workpiece 22 is performed on the second adsorption section 78 of the mounting surface 40b by vacuuming the planar second hole suction portion 74 (refer to FIG. 14). Then, in the plane adsorption mechanism 70, the suction of the workpiece 22 is performed on the third adsorption section 79 of the placement surface 40b by evacuation of the planar third hole suction portion 75 (refer to FIG. 14). By the stepwise adsorption operation by the plane adsorption mechanism 70, the workpiece 22 maintains the posture of the workpiece 22 adsorbed and held in the fixed adsorption mechanism 60, and is in a flat state and is adsorbed on the mounting surface 40b (the suction plate 40). )on. This is explained below.

In some cases, the workpiece 22 is deflected while being held on the elevating mechanism 39 (each lift pin 39b). The term "flexure" means that the flat workpiece 22 itself is considered to be curved as a whole or in a part, and may mean undulation or warpage. Such deflection prevents the projection optical system of the exposure apparatus 10 from normally exposing the mask pattern, and therefore, it is preferable to hold the mounting surface 40b (suction plate 40) in a state where the deflection has been eliminated, that is, The workpiece 22 is held in a flat state on the mounting surface 40b (suction plate 40).

As described above, in the plane adsorption mechanism 70, the workpiece 22 is initially placed. The first adsorption zone 77 is adsorbed on the flat mounting surface 40b. This is because, in a state where the workpiece 22 is adsorbed and held by the fixed suction mechanism 60, the workpiece 22 is bent due to its own weight and bent like a central sag. Thereby, the workpiece 22 maintains the posture of being adsorbed and held by the fixed suction mechanism 60 as it is, and the vicinity of the center thereof is adsorbed on the mounting surface 40b to be flat. Thereafter, the plane adsorption mechanism 70 maintains the adsorption in the first adsorption zone 77, and the workpiece 22 is adsorbed on the second adsorption zone 78 of the placement surface 40b. Then, the workpiece 22 is adsorbed on the mounting surface 40b so as to be outward from the vicinity of the center of the first adsorption, so that the floating of the workpiece 22 due to the deflection is directed toward the center of the center. The outer side escapes, and the portion (the region corresponding to the second adsorption zone 78) surrounded by the center is adsorbed on the mounting surface 40b to be flat. At this time, the workpiece 22 is sucked and held by each of the flange suction portions 61 of the fixed suction mechanism 60. However, each of the flange suction portions 61 forms a flexible bellows-shaped tubular member, and the flange suction surface 61a (holding position) is allowed. Since the position is changed in the direction along the mounting surface 40b, there is no problem in the adsorption holding by the respective flange suction portions 61. Thereafter, the plane adsorption mechanism 70 maintains the adsorption in the first adsorption zone 77 and the second adsorption zone 78, and thus the workpiece 22 is adsorbed on the third adsorption zone 79 of the placement surface 40b. Then, the workpiece 22 is adsorbed on the mounting surface 40b from the vicinity of the center of the first adsorption and the outside and then to the outside in the radial direction. Therefore, the portion 22 that has been adsorbed is centered, and the workpiece 22 caused by the deflection is made. The floating portion escapes to the outside in the radial direction, whereby the portion surrounding the center (the region corresponding to the third adsorption zone 79) is adsorbed on the mounting surface 40b. It becomes flat on the top. In other words, in the present embodiment, the outer peripheral edge portion from the center position of the mounting surface 40b to the outer side in the radial direction is sequentially subjected to the adsorption operation.

Thereby, the suction plate 40 does not change the posture of the workpiece 22 sucked and held by the transfer arm (not shown), and the workpiece 22 can be adsorbed (adsorbed and held) on the placement surface 40b while being kept flat.

As described above, the mounting table 30 of the present embodiment obtains the posture of the workpiece 22 by the posture obtaining mechanism 44 (refer to FIG. 14) in a state where it has been sucked and held by the transfer arm (not shown). As described above, even after passing through the elevating mechanism 39 and the fixed suction mechanism 60 and being flattened by the plane suction mechanism 70, the posture of the workpiece 22 obtained does not change. For this reason, in the mounting table 30, the two Y-axis are floated on the base member 31 in accordance with the posture of the workpiece 22 obtained by the posture obtaining mechanism 44 (refer to FIG. 14) after the suction and holding of the workpiece 22 by the suction plate 40. The member 33 is appropriately moved in the X-axis direction along the Y-axis direction and the X-axis floating member 35 (35A, 35B), and the support position of each Z-axis driving mechanism 37 is changed, so that the projection optical system by the exposure device 10 can be used to face the workpiece 22. The portion where the exposure is performed is placed on the reference plane which is the imaging surface of the projection optical system in an appropriate state. Thereby, the mask pattern can be appropriately exposed on the workpiece 22 by the exposure device 10.

In this manner, the plane adsorption mechanism 70 sequentially moves toward the outer edge through the second adsorption zone 78 from the first adsorption zone 77 including the center position to the third adsorption zone 79, even in the workpiece. 22 In the case of deflection, it is also possible to cause the work caused by the deflection. The floating of the member 22 escapes outward in the radial direction, so that the workpiece 22 can be attracted to the flat mounting surface 40b. Therefore, the suction plate 40 as the stage according to the present invention can hold and hold the workpiece 22 in a flat state.

Further, in the suction plate 40, the plane suction mechanism 70 sucks (vacuums) the plurality of plane adsorption holes 71 formed in the placement surface 40b to bring the workpiece 22 into a flat state. Therefore, it is possible to prevent deterioration in product accuracy. The reason for this is that, for example, when the workpiece 22 is pressed against the mounting surface 40b by the claw to be flat, the surface of the workpiece 22 is scratched by the claw, and the card is stuck. The action of the claws causes the workpiece 22 to be contaminated with dust, and there is a possibility that the accuracy of the product is lowered.

Further, in the suction plate 40, the plane suction mechanism 70 sucks (vacuums) the plurality of plane adsorption holes 71 formed in the placement surface 40b to bring the workpiece 22 into a flat state. Therefore, once the workpiece 22 is placed on the workpiece On the surface 40b, suction (vacuum) by the respective plane adsorption holes 71 can be performed immediately, and the time (processing amount) required for the formation of the mask pattern can be shortened. The reason for this is that, for example, in a configuration in which the workpiece 22 is pressed against the mounting surface 40b by the claws to be flat, it is necessary to place the claws on the bearing surface 40b. The workpiece 22 is extended and placed, which is a major factor in the increase in the time (processing amount) required to form the mask pattern.

Since the plane adsorption mechanism 70 causes the floating caused by the deflection to escape to the outside of the rectangular third adsorption section 79, the workpiece can be dispersed. Since the suction plate 40 is floated, the suction plate 40 can maintain the position and posture which have been determined by the suction of the respective flange suction portions 61 of the fixed suction mechanism 60, thereby achieving flattening. In particular, in the present embodiment, since the floating of the workpiece 22 is released from the center position of the mounting surface 40b to the outside in the radial direction, it is possible to avoid the biasing of the workpiece 22 during the floating of the workpiece 22, and thus the fixed suction mechanism 60 can be utilized. The adsorption of each of the flange adsorption portions 61 maintains the position and posture that have been determined, and is more reliably maintained to achieve flattening.

Since a plurality of adsorption zones (77 to 79 in the above embodiment) are provided on the plane adsorption mechanism 70, the control for the adsorption operation can be performed according to different adsorption zones, so that the suction plate 40 can make the workpiece with simple control. 22 becomes a flat state.

Since the respective plane adsorption holes 71 as the plane adsorption mechanism 70 are distributed over the entire area of the placement surface 40b, the suction plate 40 can hold the workpiece 22 in a flat state and can hold and hold the workpiece 22.

In the plane adsorption mechanism 70, the plurality of planar adsorption holes 71 formed in the placement surface 40b are connected by the annular groove 72, so that the suction plate 40 does not cause the suction holes of the planar holes (73 to 75 (refer to FIG. 14). The load of the )) is increased, so that the workpiece 22 can be adsorbed in a wide area on the mounting surface 40b.

Since the plurality of annular grooves 72 (the annular grooves 72A to 72G in the above embodiment) are provided on the plane adsorption mechanism 70, the suction plate 40 can be formed with a simple structure to have at least the mounting surface 40b. A plurality of adsorption zones (77 to 79 in the above embodiment) of one planar adsorption hole 71.

Since the plurality of annular grooves 72 (the annular grooves 72A to 72G in the above embodiment) are provided in the plane adsorption mechanism 70, the suction plate 40 can be configured in a simple manner from the center of the mounting surface 40b. The adsorption operation is sequentially performed toward the outer side in the radial direction.

In the state in which the workpiece 22 is sucked and held by the plurality of flange adsorption portions 61 in the fixed suction mechanism 60, the suction plate 40 is allowed to change position in the direction of the mounting surface 40b of the flange suction surface 61a (holding position). Therefore, the posture of the workpiece 22 is maintained and the phase-adsorption operation employed by the plane adsorption mechanism 70 is utilized, so that the occurrence of the floating of the workpiece 22 caused by the deflection to the outside in the radial direction can be avoided.

In a state where the flange suction surface 61a (holding position) is extended from the mounting surface 40b in the orthogonal direction (Z-axis direction) of the mounting surface 40b, each of the flange suction portions 61 of the fixed suction mechanism 60 can be attached to the workpiece. Since the adsorption holding state of the workpiece 22 is performed between the lifting mechanism 39 and the elevating mechanism 39, the suction plate 40 can suppress the application of the load to the workpiece 22.

By the flange suction portion 61 in the fixed suction mechanism 60, the flange suction surface 61a (holding position) is extended from the mounting surface 40b in the orthogonal direction (Z-axis direction) of the mounting surface 40b. Then, the workpiece 22 is sucked and held, and the flange suction surface 61a (holding position) and the mounting surface 40b are formed in the same plane in a state where the workpiece 22 has been sucked and held, so that the suction plate 40 can be left intact. The posture of the workpiece 22 is maintained and the workpiece 22 is quietly placed on the mounting surface 40b.

The workpiece 22 is sucked and held by the plurality of flange adsorption portions 61 in the fixed suction mechanism 60, and thus, the suction plate 40 can prevent the change in the posture of the workpiece 22.

The fixed suction mechanism 60 sucks and holds the workpiece 22 that has been sucked and held by the lift pins 39b of the lift mechanism 39 by the plurality of flange suction portions 61. Therefore, the suction plate 40 can be maintained by the lift mechanism 39 at all times. The posture of the workpiece 22 held by the adsorption is sucked and held by the workpiece 22.

In the suction plate 40, the plane suction mechanism 70 sucks and holds the workpiece 22 sucked and held by the respective flange suction portions 61 of the fixed suction mechanism 60 by the plurality of plane adsorption holes 71, so that the workpiece 22 can be always fixed by the fixing. The suction mechanism 60 adsorbs and maintains the posture, that is, the posture in which the workpiece 22 is adsorbed and held by the elevating mechanism 39, and sucks and holds the workpiece 22.

In the suction plate 40, the elevating mechanism 39 sucks and holds the workpiece 22 sucked and held by the transfer arm (not shown) by the plurality of lift pins 39b, so that the posture of the workpiece 22 being adsorbed and held by the transfer arm can be maintained at all times. The workpiece 22 is adsorbed and held.

In the suction plate 40, each of the flange suction portions 61 of the fixed suction mechanism 60 is formed of a flexible resin material, and constitutes a bellows-like tubular member that extends in the orthogonal direction (Z-axis direction) of the mounting surface 40b. Therefore, the flange suction surface 61a (holding position) can be changed in the direction of the mounting surface 40b in a state where the workpiece 22 is suction-held and held, and the flange suction surface 61a (holding position) can be changed. The workpiece 22 can be adsorbed and held in a state in which the mounting surface 40b protrudes in the orthogonal direction (Z-axis direction) of the mounting surface 40b; and the flange can be adsorbed while the workpiece 22 has been adsorbed and held. The surface 61a (holding position) and the mounting surface 40b are flush with each other.

In the suction plate 40, the ultrasonic sensor 42 is for discriminating whether or not the workpiece 22 is suction-held (placed) above the suction plate 40, and thus, it is not restricted by the height on the suction plate 40 (position on the Z-axis) It is detected whether there is a workpiece 22.

Since the workpiece 22 is in a flat state with great precision on the suction plate 40, the exposure device 10 can appropriately expose the mask pattern onto the workpiece 22.

In the exposure apparatus 10, the posture of the workpiece 22 in the holding state by the transfer arm (not shown) obtained by the posture obtaining mechanism 44 (refer to FIG. 14) is obtained, and after the workpiece 22 is sucked and held by the suction plate 40, The posture of the workpiece 22 obtained by the posture obtaining mechanism 44 is changed while the two Y-axis floating members 33 are appropriately moved in the X-axis direction along the Y-axis direction and the X-axis floating members 35 (35A, 35B) on the base member 31. The position supported by each of the Z-axis drive mechanisms 37 allows the portion of the workpiece 22 to be exposed by the projection optical system of the exposure apparatus 10 to be positioned on the reference plane as the imaging surface of the projection optical system in an appropriate state, thereby shortening the coverage. The time required for the mask pattern to form (processing amount).

Therefore, the suction plate 40 (adsorption stage) according to the present invention can hold the workpiece 22 in a flat state without causing an increase in work time and a decrease in product accuracy.

Further, in the above-described embodiment, the suction plate 40 as an example of the adsorption stage according to the present invention has been described. However, the present invention is not limited to the above embodiment, and the adsorption stage may be used to keep the workpiece flat. On the mounting surface, the exposure light on the workpiece is imaged to provide a predetermined mask map The shape exposure includes a fixed adsorption mechanism that can adsorb the workpiece to fix the posture of the workpiece relative to the mounting surface, and the plane adsorption mechanism can adsorb the workpiece to bring the surface of the workpiece to the mounting surface. The planar adsorption mechanism has a plurality of planar adsorption holes formed on the mounting surface, and the outer edge of the mounting surface faces from any point on the mounting surface, and is sequentially determined according to the planar adsorption hole. Adsorption action.

Further, in the above-described embodiment, the planar adsorption mechanism 70 is configured to sequentially perform the adsorption operation by dividing the three adsorption zones 77 to 79 on the mounting surface 40b. However, the present invention is not limited to the above embodiment. When any point on the surface 40b faces the outer edge of the mounting surface and the adsorption operation by the plane adsorption holes 71 is performed in order, the floating of the workpiece due to the deflection can be released to the outside. It is also possible not to set the adsorption partition. In addition, the meaning of "the outer edge of the mounting surface from any point on the mounting surface 40b" means that the mounting surface 40b has a rectangular shape as described in the above embodiment, and any point The center position of the mounting surface 40b indicates that the interval from the center position is large from small to large (radiation direction from the center position); if any point is near the corner of the mounting surface 40b, the arrow in FIG. A2 indicates a direction pointing in the diagonal direction; if any point is in the vicinity of the side of the mounting surface 40b, the side facing the opposite side is indicated by an arrow A3 in Fig. 20 .

Further, in the above embodiment, although the plane adsorption mechanism 70 is divided into three adsorption zones 77 to 79 on the mounting surface 40b, the first adsorption zone 77, the second adsorption zone 78, and the third adsorption zone 79 are used. The structure of the adsorption operation is sequentially performed, but is not limited to the above embodiment. When any point on the surface 40b faces the outer edge of the mounting surface and the adsorption operation is performed in order, the number of adsorption zones (although at least one planar adsorption hole 71) and the direction in which the adsorption operation is performed can be appropriately set ( For example, it is set according to the tendency of the deflection occurring in the workpiece 22, etc.).

In the above embodiment, the planar adsorption holes 71 are connected to each other by the plurality of annular grooves 72 (72A to 72G). However, the present invention is not limited to the above embodiment, and the annular grooves 72 may not be provided. .

In the above embodiment, a plurality of annular grooves 72 (72A to 72G in the above embodiment) are concentrically arranged in the plane adsorption mechanism 70, but the invention is not limited to the above embodiment, and the annular groove is used only. When the plurality of planar adsorption holes 71 forming the adsorption zone are in communication, the shape and the number of the annular grooves can be appropriately set.

In the above embodiment, the configuration is such that the adsorption operation is performed in the order of the first adsorption zone 77, the second adsorption zone 78, and the third adsorption zone 79 in the plane adsorption mechanism 70. However, it is also possible to adopt a configuration in which the adsorption operation of the next adsorption zone is performed in accordance with the adsorption state of the adsorption zone in which the adsorption operation has been performed. This can be realized by, for example, a double-dotted chain line in FIG. 14 and an adsorption state obtaining means 45 which can obtain an adsorption state of each adsorption zone, based on an output signal transmitted from the adsorption state obtaining means 45, In other words, the drive control unit 43 (refer to FIG. 14) appropriately drives and controls each of the plane hole suction portions 73, 74, and 75 (refer to FIG. 14). The adsorption state obtaining means 45 transmits a pressure change in each of the plane adsorption holes 71, the flat hole suction portions 73, 74, 75 or each of the suction chambers 76. The measurement is achieved with a simple composition. In the case of adopting such a configuration, in the adsorption zone in which the adsorption operation is performed first, after the workpiece 22 is appropriately adsorbed on the mounting surface 40b, the adsorption operation in the next adsorption zone is performed, thereby making it possible to The flat state of the workpiece 22 is particularly suitable.

In the above embodiment, the configuration is such that the mounting surface 40b is divided into three concentric sections 77 to 79 in the plane adsorption mechanism 70, and according to the first adsorption section 77 and the second adsorption section 78, The adsorption operation is performed in the order of the third adsorption zone 79. However, on the premise that the adsorption operation is performed in order from the arbitrary point on the mounting surface 40b toward the outer edge, a configuration may be adopted in which the placement surface 40b is divided into arbitrary adsorption zones, and according to the transfer arm ( Not shown), the elevating mechanism 39 or the deflection of the workpiece 22 adsorbed and held by the fixed suction mechanism 60 is appropriately set in the order in which the adsorption operation is performed in each adsorption zone. In this case, the at least two adsorption zones may be divided into the mounting surface 40b so as to include the mounting surface 40b, or may be divided into the same interval even from the center position of the mounting surface 40b. At least two adsorption zones having different positions in the X-axis direction and/or the Y-axis direction. Further, the deflection of the workpiece 22 can be detected using the attitude obtaining mechanism 44 (refer to FIG. 14) or an optical system (not shown) for pin adjustment of the illumination optical system. In the case of the configuration, the planar hole suction portion corresponding to each adsorption zone can be appropriately driven and controlled by the drive control unit 43 (refer to FIG. 14) according to the position and directivity of the deflection of the workpiece 22, thereby realizing . In the case of adopting such a configuration, the adsorption operation of each adsorption zone is performed in order according to the deflection of the workpiece 22, and the workpiece 22 can be made flat in a particularly suitable state. This is the same as the case where the adsorption operation is performed in a plurality of plane adsorption holes 71 in order without providing the adsorption partition.

In the above embodiment, although the six flange suction portions 61 are provided in the fixed suction mechanism 60, this is not limited to the above embodiment, and may have at least two convexities from the viewpoint of maintaining the posture of the workpiece 22. The edge adsorption unit 61.

In the above-described embodiment, in the fixed adsorption mechanism 60, the adsorption operation by the four n-th group of the flange adsorption portions 61A, 61B, 61C, and 61D (n is an integer of 1 to 4) can be performed together, however, The adsorption operation may be sequentially performed according to the actual deflection of the workpiece 22 and the deflection tendency of the workpiece 22, and thus is not limited to the above embodiment.

In the above-described embodiment, each of the flange suction portions 61 of the fixed suction mechanism 60 is formed of a flexible resin material, and constitutes a bellows-like tubular member that extends in the orthogonal direction (Z-axis direction) of the mounting surface 40b. However, as long as the following can be achieved, it is also possible to adopt other adsorption means for providing the flange adsorption surface on the elastically deformable hollow sphere and the suction hole for evacuation, that is, holding and holding the workpiece 22 In the state, the flange suction surface 61a (holding position) can be changed in the direction of the mounting surface 40b, and the flange suction surface 61a (holding position) is placed on the mounting surface 40b from the mounting surface 40b. In the state in which the intersecting direction (Z-axis direction) is extended, the workpiece 22 can be sucked and held, and the flange suction surface 61a (holding position) can be made the same as the mounting surface 40b in a state where the workpiece 22 has been sucked and held. The plane is therefore not limited to the above embodiment.

The above adsorption stage of the present invention based on the embodiment, using the adsorption stage The mounting table and the exposure apparatus using the same have been described. However, the specific configuration is not limited to the embodiment, and design changes or additions are allowed without departing from the gist of the present invention.

10‧‧‧Exposure device

22‧‧‧Workpiece

30‧‧‧Station

39b‧‧‧lifting pin

40‧‧‧ (as the suction table) suction plate

40b‧‧‧Loading surface

60‧‧‧Fixed adsorption mechanism

61‧‧‧ (as a fixed adsorption part) flange adsorption section

70‧‧‧ Planar adsorption mechanism

71‧‧‧ Planar adsorption holes

Fig. 1 is an explanatory view schematically showing the configuration of an exposure apparatus 10 according to the present invention.

FIG. 2 is a perspective view schematically showing the configuration of the mounting table 30.

Figure 3 is a cross-sectional view taken along line I-I of Figure 2 .

4 is a perspective view similar to FIG. 2, showing a state of the base member 31, the two Y-axis drive mechanisms 32, the Y-axis movers 33, the two X-axis drive mechanisms 34, and the two X-axis movers 35 in the mounting table 30.

Fig. 5 is a perspective view similar to Fig. 2, showing a state in which the XY adjustment plate 36 and the joint portions (51, 52, 53, 54) are further added to Fig. 4 .

FIG. 6 is an explanatory view for explaining the positional relationship between the two X-axis moving members 35, the XY adjusting plate 36, and the respective connecting portions (51, 52, 53, 54).

FIG. 7 is a perspective view schematically showing the configuration of the first connecting portion 51.

FIG. 8 is a perspective view schematically showing the configuration of the second connecting portion 52.

FIG. 9 is a perspective view schematically showing the configuration of the third connecting portion 53.

FIG. 10 is a perspective view schematically showing the configuration of the fourth connecting portion 54.

Fig. 11 is a perspective view similar to Fig. 2, showing the state of each Z-axis drive mechanism 37 added to Fig. 5.

Fig. 12 is a perspective view similar to Fig. 3, showing an enlarged view of the periphery of the drive main body portion for explaining the configuration of the Z-axis drive mechanism 37A.

FIG. 13 is a perspective view schematically showing the configuration of the elevating mechanism 39.

FIG. 14 is a block diagram showing a functional configuration of the mounting table 30.

Fig. 15 is a perspective view schematically showing the configuration of the periphery of the suction plate 40, showing a state in which the lift pins 39b project upward from the mounting surface 40b.

Fig. 15A is a perspective view similar to Fig. 15 and showing an enlargement of a range surrounded by a single-dot chain line shown in Fig. 15.

16 is a perspective view schematically showing the configuration of the periphery of the suction plate 40, and shows a state in which the respective lift pins 39b are pulled downward from the mounting surface 40b.

Figure 17 is a schematic front elevational view of the suction plate 40 as viewed from above.

18 is a front view for explaining three adsorption division zones (77 to 79) in the same manner as FIG.

Fig. 19 is a schematic perspective view of the suction plate 40 viewed from the back side.

20 is a front view for explaining a direction in which the adsorption operation of another example is performed, similarly to FIG. 17.

39b‧‧‧lifting pin

39f‧‧‧ Lifting pin adsorption surface

40‧‧‧ suction plate

40b‧‧‧Loading surface

61‧‧‧Flange adsorption department

61a‧‧‧Flange adsorption surface

61A‧‧‧Group 1 flange adsorption section

61B‧‧‧Group 2 Flange Adsorption Section

61C‧‧‧Group 3 Flange Adsorption Section

61D‧‧‧Group 4 Flange Adsorption Section

71‧‧‧ Planar adsorption holes

72A~72G‧‧‧ring groove

77‧‧‧1st adsorption zone

78‧‧‧2nd adsorption zone

79‧‧‧3rd adsorption zone

Claims (11)

An adsorption table for holding a workpiece on a flat mounting surface, wherein the workpiece is exposed to light by exposure light to expose a predetermined mask pattern; and the method comprises: a fixed adsorption mechanism capable of adsorbing the workpiece and causing the foregoing a posture of the workpiece fixed to the mounting surface, and a plane adsorption mechanism capable of adsorbing the workpiece to abut the surface of the workpiece and the mounting surface; the plane adsorption mechanism has a plurality of planes formed on the mounting surface The adsorption hole is subjected to an adsorption operation by the planar adsorption hole in order from an arbitrary point on the mounting surface toward the outer edge of the mounting surface. The adsorption stage according to claim 1, wherein the plane adsorption mechanism has a plurality of adsorption zones on the placement surface, and at least one of the planar adsorption holes in the adsorption zones, and the foregoing adsorption zones are performed in accordance with each of the adsorption zones. The adsorption action of each plane adsorption hole. The adsorption stage according to claim 1 or 2, wherein the fixed adsorption mechanism has at least two fixed adsorption portions on the mounting surface, and each of the fixed adsorption portions can be adsorbed onto the workpiece by an upper end surface thereof. The adsorption stage according to claim 3, wherein the upper end surface of the fixed adsorption portion is changeable in a direction along the mounting surface in a state in which the fixed adsorption portion has been adsorbed and held by the workpiece position. The adsorption stage according to claim 3, further comprising: a lift pin having an adsorption surface that is advanced and retractable in an orthogonal direction of the mounting surface with respect to the mounting surface; and the fixed adsorption unit is capable of causing the fixed adsorption The upper end surface of the fixed adsorption unit is adsorbed and held in a state in which the upper end surface of the portion is protruded from the mounting surface in the orthogonal direction, and the upper end surface of the fixed adsorption unit and the mounting surface can be held while the workpiece is being sucked and held. Become the same plane. The adsorption stage according to claim 1 or 2, wherein the plane adsorption means performs an adsorption operation using the plane adsorption holes in order from a center position of the placement surface toward a peripheral portion of the placement surface. The adsorption stage according to claim 1 or 2, wherein the plane adsorption means performs the adsorption operation by the plane adsorption holes in order from the edge of the placement surface toward the center position of the placement surface. The adsorption stage according to claim 1 or 2, wherein the plane adsorption means performs an adsorption operation using the next plane adsorption hole based on an adsorption state of the plane adsorption hole that has been subjected to the adsorption operation. The adsorption stage according to claim 1 or 2, wherein the plane adsorption means sets the order of the adsorption operation of each of the planar adsorption holes in accordance with the deflection of the workpiece held by the fixed adsorption mechanism. A mounting table that controls a position and a posture of a reference plane on which the workpiece is imaged with respect to the exposure light, and is characterized in that an adsorption stage as claimed in claim 1 or 2 is employed. An exposure apparatus characterized by using an adsorption stage as claimed in claim 1 or 2.