TW201302441A - 樹脂薄膜接合體之製造方法（二） - Google Patents

樹脂薄膜接合體之製造方法（二） Download PDF

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Publication number
TW201302441A
TW201302441A TW101119944A TW101119944A TW201302441A TW 201302441 A TW201302441 A TW 201302441A TW 101119944 A TW101119944 A TW 101119944A TW 101119944 A TW101119944 A TW 101119944A TW 201302441 A TW201302441 A TW 201302441A
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Taiwan
Prior art keywords
resin film
light absorbing
resin
joined body
light
Prior art date
Application number
TW101119944A
Other languages
English (en)
Inventor
Naoyuki Matsuo
Mayu Shimoda
Nobuyuki Takami
Original Assignee
Nitto Denko Corp
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Publication of TW201302441A publication Critical patent/TW201302441A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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    • B29C65/245—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool the heat transfer being achieved contactless, e.g. by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316—Surface properties
    • B29C66/73161—Roughness or rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/1683—Laser beams making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/733—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
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    • B29C66/73773—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline the to-be-joined area of at least one of the parts to be joined being semi-crystalline
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    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
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Abstract

一種樹脂薄膜接合體之製造方法係將樹脂薄膜構件之端面彼此對接，並使用對於使用之雷射光波長其光吸收率比前述樹脂薄膜構件高，且具有算術平均粗糙度(Ra)小於0.5μm之表面的光吸收構件，使前述端面彼此業已對接之部份抵接於前述表面，且將雷射光照射在前述光吸收構件上使其發熱，藉此使前述樹脂薄膜構件之端面彼此熱熔接，然後由前述光吸收構件剝離前述業已對接之部份，作成樹脂薄膜接合體。

Description

樹脂薄膜接合體之製造方法(二) 發明領域
本發明係有關於一種樹脂薄膜接合體之製造方法，例如，有關於一種將帶狀樹脂薄膜構件彼此接合而製作樹脂薄膜接合體之樹脂薄膜接合體之製造方法。
發明背景
以往，在如將帶狀樹脂薄膜構件連續地供給至加工機實施加工時，為接續於先行之樹脂薄膜構件而將新樹脂薄膜構件供給至加工機，實行在先行之樹脂薄膜構件之末端部份接合新樹脂薄膜構件之前端部份(所謂的疊接)。又，不限於如此之情形，亦廣泛地實施在端部將樹脂薄膜構件彼此接合且製作樹脂薄膜接合體之樹脂薄膜接合體之製造方法。
作為此種樹脂薄膜接合體之製造方法，有人提出，如第4(a)圖所示，透過光吸收劑104使對於雷射光100R顯示透過性之樹脂薄膜構件101、102重疊，且將雷射光100R照射在該重疊部份上，使該樹脂薄膜構件101、102彼此熱熔接而接合之方法(請參照專利文獻1)。
又，作為其他方法，如第4(b)圖所示，使對於雷射光100R顯示透過性之樹脂薄膜構件101、102之端部彼此對接，且藉經塗布光吸收劑104之接合構件105，以使光吸收劑104位在樹脂薄膜構件101、102與接合構件之界面之方式 被覆該業已對接之部份，接著將雷射光100R照射在藉該接合構件105被覆之地方，使樹脂薄膜構件101、102與接合構件105熱熔接而接合之方法等亦是習知的。
先前技術文獻 專利文獻
專利文獻1：日本專利第3682620號
發明概要
但是，在該等方法中，將樹脂薄膜構件彼此重疊，或使樹脂薄膜構件與接著構件熱熔融，因此有時會在製造之樹脂薄膜接合體之接合部份產生段差。此時，例如，藉由外側送出將樹脂薄膜接合體捲取成卷狀者且捲取在另一卷上之所謂卷對卷搬送該樹脂薄膜接合體時，接合部份(接頭、接合構件等)之段差(邊緣)通過搬送用之輥，有損傷該輥之虞。又，捲取該樹脂薄膜接合體成卷狀時，由於會在該段差之周邊部份上產生該段差造成之刮痕，因此有製品之取出效率變差之虞。
因此，如第5圖所示，考慮在發熱介質106上塗布光吸收劑104，且使樹脂薄膜構件101、102對接，並且在使光吸收劑104位在樹脂薄膜構件101、102與發熱介質106之界面的情形下藉發熱介質106被覆上述業已對接之部份，接著將雷射光100R照射在藉該發熱介質106被覆之地方且只使樹脂薄膜構件101、102彼此熱熔接並接合，然後由發熱 介質106剝離上述業已對接之部份，藉此製作樹脂薄膜接合體107之方法。
但是，在該方法中，熱熔接後，塗布在發熱介質106上之光吸收劑104會附著在樹脂薄膜接合體107上而由發熱介質106消失，因此需要每次熱熔接都在發熱介質106上塗布光吸收劑104之步驟，有使前置時間變長之問題。又，由於需要塗布光吸收劑104之塗布裝置，因此初期成本增加，且亦有僅該等塗布裝置便會使製造樹脂薄膜接合體之裝置本身變龐大之問題。又，在欲塗布光吸收劑之部份以外不小心附著光吸收劑104而成為異物時，亦有製品產率降低之虞。
因此，為了解決該等問題，例如，考慮使用具有光吸收性之材料成形為例如膜狀等之光吸收構件，取代如所述地塗布光吸收劑之發熱介質的方法。該方法係，例如，使上述光吸收構件抵接於如上所述之2個樹脂薄膜構件業已對接的部份，且由上述光吸收構件剝離上述業已對接之部份，藉此製作樹脂薄膜接合體之方法。
但是，在該方法中，有時熱熔融之樹脂薄膜構件會附著在光吸收構件之表面上，且發生如此附著時，由上述表面剝離經熱熔接之樹脂薄膜構件會變困難，或附著之樹脂薄膜構件固定在上述表面上且再利用上述光吸收構件會變困難，效率變差。
本發明鑒於上述問題，課題在於提供一種減少接合部份之段差，且不需要塗布光吸收劑之步驟，又，抑制 光吸收劑附著成為異物，且可有效率地將樹脂薄膜構件彼此接合而製作樹脂薄膜接合體的製造方法。
本發明之樹脂薄膜接合體之製造方法係將樹脂薄膜構件之端面彼此對接並接合而作成樹脂薄膜接合體者，其特徵在於：使用對於使用之雷射光波長其光吸收率比前述樹脂薄膜構件高，且具有算術平均粗糙度(Ra)小於0.5μm之表面的光吸收構件，並使前述端面彼此業已對接之部份抵接於前述表面，且將雷射光照射在前述光吸收構件上使其發熱，藉此使前述樹脂薄膜構件之端面彼此熱熔接，然後由前述光吸收構件剝離前述業已對接之部份，作成樹脂薄膜接合體。
依據該樹脂薄膜接合體之製造方法，藉由上述光吸收構件吸收雷射光發熱而將樹脂薄膜構件之端面彼此熱熔接，藉此可達成以下作用效果。
即，成為樹脂薄膜構件彼此只互相透過端面接合之狀態，因此可製造在接合部份段差少之樹脂薄膜接合體。又，由於可如此地減少接合部份之段差，所以在使用搬送用之輥搬送樹脂薄膜接合體時，可防止該搬送用之輥之損失。又，捲取樹脂薄膜接合體時，不易產生刮痕，可提高製品之取出效率。
又，可在不需要塗布光吸收劑之情形下製作樹脂薄膜接合體。因此，可縮短前置時間塗布光吸收劑之步驟部份。 又，可抑制伴隨塗布設備產生之成本。此外，可抑制光吸收劑附著於樹脂薄膜接合體而成為異物，因此可提高製品產率。
此外，藉由上述表面之算術平均粗糙度(Ra)小於0.5μm，上述表面之凹凸變少，因此可抑制錨固效果。因此，可抑制熱熔融之樹脂薄膜構件附著在光吸收構件之表面上。因此，可由光吸收構件輕易地剝離經熱熔接之樹脂薄膜構件，且可重覆使用光吸收構件，所以是有效率的。
因此，依據該樹脂薄膜接合體之製造方法，可減少接合部份之段差，且不需要光吸收劑之塗布步驟，又可抑制光吸收劑附著成為異物，且有效率地製造將樹脂薄膜構件彼此接合並製造樹脂薄膜接合體。
在上述製造方法中，前述表面之十點平均粗糙度(Rz)宜小於10μm。
如此，藉由表面之十點平均粗糙度(Rz)小於10μm，可進一步減少上述表面之凹凸，因此可進一步抑制錨固效果。
在上述製造方法中，前述光吸收構件宜對前述雷射光之波長具有10%以上之光吸收率。
如此，藉由光吸收構件具有10%以上之光吸收率，可更確實地，將樹脂薄膜構件彼此更效率良好地熱熔接。
在上述製造方法中，前述光吸收構件宜含有類鑽碳、玻璃碳或碳石墨。
如此，藉由光吸收構件含有類鑽碳、玻璃碳或碳石墨，可更有效率地吸收雷射光而發熱。又，上述表面之算術平均粗糙度容易在上述範圍內。
在上述製造方法中，前述雷射光宜具有800nm以上且2000nm以下之波長。
如此，藉由雷射光之波長在近紅外線區域，能量轉換成熱之效率良好，且容易得到安定之雷射光。
在上述製造方法中，前述樹脂薄膜構件宜具有150μm以下之厚度。
如此，藉由前述樹脂薄膜構件具有150μm以下之厚度，藉雷射光照射產生之熱更容易遍及樹脂薄膜構件之厚度方向全部區域傳遞，因此使樹脂薄膜構件容易更充分地熱熔融。
在上述製造方法中，前述樹脂薄膜構件宜含有具有300℃以下之熔點或玻璃轉移溫度之熱可塑性樹脂。
如此，藉由前述樹脂薄膜構件含有具有300℃以下之熔點或玻璃轉移溫度之熱可塑性樹脂，使樹脂薄膜構件容易熱熔融。
在上述製造方法中，前述樹脂薄膜構件宜含有下述中任一種以上之樹脂：三乙醯纖維素樹脂、聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、聚甲基丙烯酸甲酯樹脂、環烯烴聚合物、降冰片烯樹脂或聚乙烯醇樹脂。
該等樹脂都具有300℃以下之熔點或玻璃轉移溫度，因此如上所述地，使樹脂薄膜構件容易熱熔融。
圖式簡單說明
第1(a)~(c)圖是顯示一實施形態之樹脂薄膜接合體之製造方法中端面形成步驟及對接步驟的概略步驟圖。
第2圖是顯示一實施形態之樹脂薄膜接合體之製造方法中接合步驟的圖。
第3圖是顯示一實施形態將樹脂薄膜接合體捲取成卷狀之步驟的圖。
第4(a)、(b)圖是顯示習知技術之使用雷射光之樹脂薄膜接合體之製造方法的圖。
第5圖是顯示可思及之使用雷射光之樹脂薄膜接合體之製造方法的圖。
用以實施發明之形態
以下，一面參照圖式一面說明本發明之一實施形態。
本實施形態之樹脂薄膜接合體之製造方法係將樹脂薄膜構件之端面彼此對接並接合而作成樹脂薄膜接合體者，且係使用對於使用之雷射光波長其光吸收率比前述樹脂薄膜構件高，且具有算術平均粗糙度(Ra)小於0.5μm之表面的光吸收構件，並使前述端面彼此業已對接之部份抵接於前述表面，且將雷射光照射在前述光吸收構件上使其發熱，藉此使前述樹脂薄膜構件之端面彼此熱熔接，然後由前述光吸收構件剝離前述業已對接之部份，作成樹脂薄膜接合體之方法。
具體而言，在本實施形態之樹脂薄膜接合體之製造方法中，實施重疊第一樹脂薄膜構件與第二樹脂薄膜構件，且同時切斷該重疊之兩端部，藉此在該等端部形成互相一致之端面之切口的端面形成步驟；對接藉該端面形成步驟形成之其中一端面與另一端面，且使業已對接之部份抵接於光吸收構件之表面的對接步驟；將該業已對接之部份與光吸收構件固定在一起的步驟；及，將雷射光照射在該光吸收構件上使其發熱，藉此使樹脂薄膜構件之端面彼此熱熔接，且由上述光吸收構件剝離上述業已對接之部份，作成樹脂薄膜接合體之接合步驟。
上述第一樹脂薄膜構件及第二樹脂薄膜構件一般是含有同種類熱可塑性樹脂者，但是不限於同種類者之情形，只要是可互相熱熔接之材料，亦可為不同種類者，例如，可使用具有相熔性之不同種類之熱可塑性樹脂。
又，如此之熱可塑性樹脂宜具有300℃以下之熔點，且具有250℃以下之熔點更佳。藉由上述熱可塑性樹脂具有300℃以下之熔點，使樹脂薄膜構件容易熱熔融。
又，如上述之熱可塑性樹脂係沒有熔點之非晶質性熱可塑性樹脂時，上述熱可塑性樹脂宜具有300℃以下之玻璃轉移溫度，且具有250℃以下之玻璃轉移溫度更佳。藉由上述熱可塑性樹脂具有300℃以下之玻璃轉移溫度，使樹脂薄膜構件容易熱熔融。
如此，藉由上述熱可塑性樹脂具有300℃以下之熔點或玻璃轉移溫度，使樹脂薄膜構件容易熱熔融。
如此之熱可塑性樹脂可舉例如：聚碳酸酯樹脂、聚乙烯醇樹脂、聚乙烯樹脂、聚丙烯樹脂、聚對苯二甲酸乙二酯樹脂、聚氯乙烯樹脂、熱可塑性聚醯亞胺樹脂、三乙醯纖維素樹脂、聚甲基丙烯酸甲酯樹脂、環烯烴聚合物、降冰片烯樹脂、聚氧乙烯樹脂、聚醚醚酮樹脂、聚醚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚丁二烯樹脂、聚胺基甲酸酯樹脂、聚苯乙烯樹脂、聚甲基戊烯樹脂、聚醯胺樹脂、聚縮醛樹脂、聚對苯二甲酸丁二酯、乙烯乙酸乙烯酯等。又，上述熱可塑性樹脂可使用其中任一種，亦可混合使用兩種以上。
又，上述熱可塑性樹脂宜為該等樹脂中，三乙醯纖維素樹脂、聚甲基丙烯酸甲酯樹脂、聚碳酸酯樹脂、聚甲基丙烯酸甲酯樹脂、環烯烴聚合物、降冰片烯樹脂或聚乙烯醇樹脂中至少一種以上。該等樹脂都具有300℃以下之熔點或玻璃轉移溫度，因此，如上所述，使樹脂薄膜構件容易熱熔融。
又，上述樹脂薄膜構件可為單層，亦可積層複數層，只要至少一層係以熱可塑性樹脂構成即可，沒有特別限制。
積層多數層之樹脂薄膜構件係可舉堆疊基材層及具有黏著劑之保護薄膜層者為例。
此外，熱熔接如此之積層多數層之樹脂薄膜構件時，可暫時地剝離各層且逐一熱熔接各層，亦可依積層多數層之原樣熱熔接。例如，基材層及保護薄膜層之相熔性不佳， 即使熱熔接兩層亦不會形成混合層時，即使將積層兩層之樹脂薄膜構件彼此熱熔接，亦可能在熱熔接後剝離該基材層及保護薄膜層。
又，上述樹脂薄膜構件之厚度宜為150μm以下，且100μm以下更佳。由於該厚度為150μm以下，藉雷射光之照射而由光吸收構件產生之熱能更容易遍及樹脂薄膜構件之厚度方向(深度方向)全部區域傳遞，且使樹脂薄膜構件彼此容易更充分地熱熔融。
另一方面，樹脂薄膜構件之厚度宜為5μm以上，且20μm以上更佳。由於該厚度為5μm以上，僅厚度部份便可更充分地提高樹脂薄膜接合體之接合強度。
又，前述樹脂薄膜構件宜為對前述雷射光之透光率為30%以上，且50%以上更佳。
此外，「透光率」係以「100%-“光吸收率(%)”」表示之值，且係依據下述式(1)求得之值。
光透過強度÷入射光強度×100%………(1)
(其中，「入射光強度」係依據「照射光強度-表面反射光強度」求得。)
在上述端面形成步驟中，如第1(a)圖所示，在重疊第一樹脂薄膜構件10之端部及第二樹脂薄膜構件20之端部的狀態下固定配置兩樹脂薄膜構件10、20，且藉由使用刀具40等之一般樹脂薄膜構件10、20之切斷方法，一次切斷該兩重疊端部，藉此在該等端部形成互相一致之端面的切口。樹脂薄膜構件10、20之固定方法可使用，例如，使 用藉吸附樹脂薄膜構件10、20固定之吸附裝置30等固定之方法等，一般之固定方法。
又，在上述端面形成步驟中，如第1(b)圖所示，將第一樹脂薄膜構件之切除端10a與第二樹脂薄膜構件之切除端20a移送至切除端回收部(未圖示)。
本實施形態之樹脂薄膜接合體之製造方法係藉由實施上述端面形成步驟，在上述對接步驟中，可令業已對接之端面彼此呈大略平行之狀態地對接其中一端面與另一端面。
在上述對接步驟中，如第1(c)圖所示，以吸附裝置30分別固定樹脂薄膜構件10、20，且使其移動至載置樹脂薄膜構件10、20之台座50(台座50係顯示在第2圖中)上，又，依需要將該吸附裝置30微調整以形成所需間隙，且對接在該端面形成步驟中形成之其中一端面及另一端面。
又，在上述對接步驟中，宜令樹脂薄膜構件10、20間之間隙長度(與樹脂薄膜構件10、20間形成之間隙之端面呈垂直方向之長度中最大者)小於樹脂薄膜構件之厚度，且小於樹脂薄膜構件之厚度的一半更佳，並且小於樹脂薄膜構件之厚度的1/3特佳。本實施形態之樹脂薄膜接合體之製造方法係藉由令上述間隙之長度小於樹脂薄膜構件之厚度，樹脂薄膜構件之樹脂因藉雷射光照射而由光吸收構件產生之熱能熱熔接而流動化，因此，可填埋間隙，且得到良好之接合狀態及強度。
此外，在上述對接步驟中，使用具有照相機(未 圖示)等之間隙監視器(未圖示)測量上述間隙之長度，且亦可在該間隙長度由於不合常規之原因(例如，地震等)成為規定值以上時，使固定樹脂薄膜構件10、20之吸附裝置30之至少任一者移動進行微調，使該間隙長度比規定值小。
在上述對接步驟中，如第2圖所示，在配置成光吸收構件50a抵接於業已對接部份之台座50上，以透明玻璃之加壓構件60推壓且加壓固定該業已對接之部份，且使上述業已對接之部份抵接於光吸收構件50a。又，在如此加壓固定之狀態下，將雷射光R照射在光吸收構件50a上而使其發熱，藉此使樹脂薄膜構件10、20之端面彼此熱熔接而接合，且由光吸收構件50a剝離上述業已對接之部份，製作樹脂薄膜接合體80。
又，除了將上述業已對接之部份載置且使其抵接在光吸收構件50a上面之方法(第2圖)以外，使上述業已對接之部份抵接於光吸收構件50a之方法可舉將上述業已對接之部份壓在且使其抵接在光吸收構件50a之下面之方法(不圖示)等為例。
上述加壓固定時之加壓強度在照射雷射光R之部份業已對接之部份中宜為0.5~100kgf/cm2，且10~70kgf/cm2更佳。
加壓構件60之形狀只要在業已對接之部份上施加負載即可，沒有特別限制，但是該形狀可使用例如，平板、圓筒、球狀等。
加壓構件60之厚度宜為3mm以上且小於30mm， 且5mm以上且小於20mm更佳。在上述接合步驟中，藉由使用厚度3mm以上之加壓構件60，加壓構件60本身在加壓固定時會不易變形，因此可進行良好之加壓固定。又，在上述接合步驟中，藉由使用厚度小於30mm之加壓構件60，雷射光R透過加壓構件60時雷射光R會不易損失，因此可將樹脂薄膜構件10、20彼此效率良好地輕易熱熔接。
舉例表示構成加壓構件60之透明玻璃時，可舉例如：以商品名「TMEPAX」在市面販售之硬質硼矽酸玻璃，以商品名「PYREX」在市面販售之硬質硼矽酸玻璃，以商品名「VYCOL」在市面販售之96%氧化矽玻璃，以「D263」在市面販售之鋇硼矽酸玻璃，以「OA10」在市面販售之無鹼玻璃，以「AF45」在市面販售之氧化鋁硼矽酸玻璃，熔融石英，無鹼玻璃，鉛鹼玻璃，鈉鈣玻璃，石英玻璃等。
加壓構件60在雷射光R透過加壓構件60時雷射光R會不易損失且會將樹脂薄膜構件10、20彼此效率良好地輕易熱熔接，由此觀點來看，宜對雷射光R之波長具有比50%高之透光率，且具有比70%高之透光率更佳。
在上述接合步驟中，由以加壓構件60均一地加壓業已對接部份之大面積而遍及全部區域進行良好之接合的觀點來看，亦可在業已對接之部份與加壓構件60之間，安裝對雷射光R透過性佳且具有比加壓構件60優異之緩衝性之中介構件70。
中介構件70之材料可舉橡膠材料(例如，矽橡膠，胺基甲酸酯橡膠等)及樹脂材料(例如，聚乙烯等)等為 例。
又，中介構件70可為單層，亦可為積層多數層者。
又，中介構件70對於使用之雷射光R之波長宜具有比50%高之透光率，且更宜具有比70%高之透光率。
此外，中介構件70之厚度宜為50μm以上且小於5mm，且1mm以上且小於3mm更佳。在上述接合步驟中，藉由使用厚度50μm以上之中介構件70，可更充分地分散因加壓而產生之力。因此，可以加壓構件60均一地加壓業已對接部份之大面積且遍及全部區域進行更進一步之良好接合。又，藉由使用小於5mm之中介構件70，雷射光R透過中介構件70時雷射光R會不易損失，且會將樹脂薄膜構件10、20彼此效率良好地輕易熱熔接。
在上述接合步驟中使用之雷射光R具有使光吸收構件50a發熱之作用，只要在不損及本發明效果之範圍內，雷射之種類沒有特別限制。由具有對熱之能量轉換效率良好之波長之可見光區域或紅外線區域之光的觀點來看，該雷射宜為半導體雷射，光纖雷射，飛秒雷射，皮秒雷射，YAG雷射等之固體雷射，CO2雷射等之氣體雷射。其中，由容易得到便宜且空間性面內均一強度之雷射光束之觀點來看，半導體雷射或光纖雷射更佳。在如飛秒雷射或皮秒雷射之程序等透過多光子吸收過程之程序中，可在樹脂薄膜構件10、20之透明性與雷射波長無關之情形下，藉由將雷射之焦點位置或投入能量最適當化，達成接合。又，由避免樹脂薄膜構件10、20之分解且促進熔融之觀點 來看，連續波之CW雷射比瞬間投入高能量之脈衝雷射好。
關於上述雷射，輸出(功率)、功率密度、光束形狀、照射次數、掃描速度、照射時間及累計照射量等亦可依據樹脂薄膜構件10、20及光吸收構件50a之光吸收率之類的光學特性及熔點、玻璃轉移溫度(Tg)之類的熱特性等之差異適當地設定。
此外，由藉由雷射光R透過光吸收構件熱熔融樹脂薄膜構件10、20之業已對接之部份，使其流動化且得到強固接合之觀點來看，照射之雷射功率密度宜為50W/cm2~3,000W/cm2，且200W/cm2~1,500W/cm2更佳，並且250W/cm2~1,000W/cm2特佳。
又，由同樣之觀點來看，累計照射量宜為10J/cm2~300J/cm2，且20J/cm2~150J/cm2更佳，並且30J/cm2~100J/cm2特佳。
在上述接合步驟中，藉由沿樹脂薄膜構件10、20彼此對合之部份照射雷射光R，透過樹脂薄膜構件10、20之雷射光R照射在光吸收構件50a上。
此外，在上述接合步驟中，可將藉聚光透鏡聚光成所希望之雷射尺寸之點光束一面掃描一面照射在業已對接之部份上。又，可藉由圓柱形透鏡及繞射光學元件等之光學構件產生線狀之雷射光束，且照射在業已對接之部份上。此外，亦可沿業已對接之部份配置多數雷射光源，且不掃描地全部照射。
雷射光之波長為800nm~2000nm更佳。如此，藉 由雷射光之波長在近紅外線區域，對熱之能量轉換效率良好，且會容易得到安定之雷射光。
光吸收構件50a係對於使用之雷射光波長其光吸收率比樹脂薄膜構件高，且具有算術平均粗糙度(Ra)小於0.5μm之表面。
該光吸收構件50a藉由構成為對於使用之雷射光波長其光吸收率比樹脂薄膜構件高，可具有吸收照射之雷射光R且發熱，並且將熱傳至作為對象之樹脂薄膜構件10、20且使樹脂薄膜構件10、20彼此熱熔接的作用。
又，光吸收構件50a宜對於使用之雷射光波長具有10%以上之光吸收率，且具有20%以上之光吸收率更佳，並且具有30%以上之光吸收率特佳。
光吸收構件50a藉由具有上述10%以上之光吸收率，可使樹脂薄膜構件更確實地熱熔融。又，即使雷射光之雷射功率比較低，亦可使樹脂薄膜構件充分地熱熔融，且更提高能量效率。
該光吸收率可藉由分光光度計(JASCO公司製，V-670，使用積分球)測量。
又，上述光吸收率可依據光吸收構件50a之厚度或成分比率等調整。
又，上述光吸收構件50a藉由具有算術平均粗糙度(Ra)小於0.5μm之表面，該表面之凹凸變少，因此可抑制錨固效果。因此，熱熔融之樹脂薄膜構件10、20會不易附著在光吸收構件50a之表面上。因此，可由光吸收構件50a 輕易地剝離熱熔接之樹脂薄膜構件10、20。又，可防止熱熔接樹脂薄膜構件附著固定在光吸收構件50a上，因此可重覆使用光吸收構件50a。因此，樹脂薄膜構件之接合會是有效率的。
由如上述地可減少表面凹凸之觀點來看，上述算術平均粗糙度宜小於0.3μm，且小於0.1μm更佳。
此外，上述算術平均粗糙度(Ra)可藉由非接觸式表面粗糙度計(Veeco公司製，WYKO，NT-9100，物鏡倍率50倍)測量。
又，上述算術平均粗糙度(Ra)可藉由在光吸收構件50a之表面上實施化學研磨法或物理研磨法等之研磨處理等來調整。
又，光吸收構件50a之表面之十點平均粗糙度(Rz)宜小於10μm，且小於7μm更佳。藉由該十點平均粗糙度(Rz)小於10μm，可進一步減少該表面之凹凸，因此可抑制錨固效果之發生。因此，熱熔融之樹脂薄膜構件10、20會更難附著。因此，可由光吸收構件50a更容易剝離熱熔融之樹脂薄膜構件。又，可進一步防止熱熔融之樹脂薄膜構件附著固定在光吸收構件50a上，且可更容易重覆用光吸收構件50a。因此，樹脂薄膜構件之接合會是更有效率的。
此外，上述十點平均粗糙度(Rz)可藉由非接觸式表面粗糙度計(Veeco公司製，WYKO，NT-9100，物鏡倍率50倍)測量。
又，上述十點平均粗糙度(Rz)可藉由在光吸收構件50a 之表面上實施化學研磨法或物理研磨法等之研磨處理等來調整。
又，光吸收構件50a宜具有比樹脂薄膜構件10、20優異之耐熱性，使得樹脂薄膜構件10、20藉由雷射光照射而熔化時不會一起熔化。具體而言，光吸收構件50a之熔點宜比樹脂薄膜構件10、20之熔點高，且光吸收構件50a之熔點宜為300℃以上。光吸收構件50a之氧化溫度宜為300℃以上，且350℃以上更佳。藉由該氧化溫度為300℃以上，可輕易防止由於為使樹脂薄膜構件10、20熱熔融而產生之熱，光吸收構件50a氧化，因此可防止光吸收性降低及特性之變化，且可更確實地重覆使用。又，該特性之變化可舉例如在光吸收構件50a含有後述之類鑽碳時，因表面之氧化反應而使該表面構造石墨化，且因該石墨化，光吸收性變化或導電性變化等。
又，由將藉雷射光照射產生之熱效率良好地傳送至樹脂薄膜構件10、20之觀點來看，光吸收構件50a宜導熱率為低，具體而言，導熱率宜比100W/m/K低，且導熱率比50W/m/K低更佳，並且導熱率比20W/m/K低又更佳。
如此之光吸收構件50a宜含有類鑽碳(DLC)，玻璃碳或碳石墨。因此，可有效率地吸收雷射光R而發熱。又，上述表面之算術平均粗糙度會容易在上述範圍內。
此外，類鑽碳係意味石墨構造與鑽石構造混合之非晶質碳。
光吸收構件50a之形狀只要具有抵接於上述業已 對接部份之下面或上面之表面即可，沒有特別限制。在本實施形態中，光吸收構件50a形成膜狀，且配置於基座部50b之表面，並且與該基座部50b一起設置在台座50上。
具體而言，藉由PVD法(例如，真空蒸鍍法，離子植入法，濺鍍法，雷射剝蝕法，離子束沈積法及離子注入法等)及CVD法(例如，熱CVD法，電漿CVD法)等之方法，膜狀之光吸收構件50a設置在前述基座部50b上。如此，由於光吸收構件50a呈膜狀，容易將藉雷射光R照射產生之熱留在光吸收構件50a之表層，即不易逸散至基座部50b側，因此可將熱有效率地傳送至樹脂薄膜構件且將樹脂薄膜構件彼此接合。
又，上述光吸收構件50a之表面宜對水1μL之接觸角為60°以上，且70°以上更佳。藉由上述接觸角為60°以上，上述表面具有優異撥水性，因此熱熔融之樹脂薄膜構件10、20不易附著在光吸收構件50a上。因此，可由光吸收構件50a輕易剝離熱熔融之樹脂薄膜。又，可進一步防止熱熔接之樹脂薄膜構件附著固定在光吸收構件50a上，且可更確實地重覆使用光吸收構件50a。因此，樹脂薄膜構件之接合會是更有效率的。
光吸收構件50a之表面之維氏硬度宜為1000Hv以上，且2000Hv以上更佳，並且3000Hv以上特佳。當該表面之維氏硬度小於1000Hv時，該表面無法耐受因吸收雷射光而產生之熱造成的應力，且變形，並且有製作之樹脂薄膜接合體品質降低之虞。相對於此，藉由維氏硬度1000Hv 以上，上述表面可充分耐受因上述熱造成之應力，且可抑制製作之樹脂薄膜接合體品質之降低。
又，由可防止污垢轉印之觀點來看或具有優異撥水性之觀點來看，光吸收構件50a之表面亦可進行表面處理。如此之表面處理可舉例如氟處理等。
光吸收構件50a之厚度宜為0.1μm~5.0μm，且0.3μm~2.0μm更佳，並且0.5μm~1.5μm特佳。由於該厚度為0.1μm以上，所以光吸收構件50a會容易吸收雷射光R，且會效率良好地輕易熱熔接樹脂薄膜構件10、20。又，由於該厚度為5.0μm以下，所以如本實施形態地配置光吸收構件50a在基座部50b之表面上時，當光吸收構件50a改變溫度時，可抑制光吸收構件50a因基座部50b及光吸收構件50a之線膨脹係數之差異而由基座部50b剝離。
此外，上述光吸收構件50a可含有氟元素以使撥水性提高，且亦可依據所要求之規格而含有適當之最適元素。此外光吸收構件50a含有氟時之一態樣可舉如上所述之光吸收構件50a之表面的氟處理為例。
又，如上所述，本實施形態之台座50包含基座部50b，及配置在該基座部50b表面上之光吸收構件50a。
基座部50b之材質只要在不損及本發明效果之範圍內即可，沒有特別限制，但是該基座部50b之材質可舉金屬、玻璃、樹脂、橡膠、陶瓷等為例。其中，玻璃是最好的。由於基座部50b之材質為玻璃，而玻璃之導熱率比較低，因此藉照射雷射光R而由光吸收構件50a產生之熱不易 移動至基座部50b側，且可將該熱效率良好地傳至樹脂薄膜構件10、20。又，由於玻璃之耐熱性高，所以基座部50b之耐久性會變高。
又，台座50亦可在光吸收構件50a與基座部50b之間具有底漆層(未圖示)。底漆層之材質可舉聚矽氧系材料等為例。如此，藉由具有底漆層，光吸收構件50a對基座部50b之密接性提高，且光吸收構件50a會不易由基座部50b剝離。
如上所述，依據本實施形態之樹脂薄膜接合體之製造方法，可減少接合部份80a之段差，且不需要塗布光吸收劑之步驟，又，抑制光吸收劑附著成為異物，且有效率地將樹脂薄膜構件10、20彼此接合並製造樹脂薄膜接合體80。
此外，在本實施形態之樹脂薄膜接合體之製造方法中，可不使用光吸收劑，但是，另一方面，亦可使用比習知少之量的光吸收劑。
又，本實施形態之樹脂薄膜接合體之製造方法是特別適合在包含送出捲取成卷狀之原料薄膜，且捲取送出之原料薄膜之所謂卷對卷搬送步驟的原料薄膜製造方法中，藉由在先行之原料薄膜之終端側上接合下一原料薄膜之前端側，依序連續地作成帶狀之長條薄膜之所謂疊接的方法。
又，藉由本實施形態之樹脂薄膜接合體之製造方法製作之樹脂薄膜接合體中，接合部份(即，受到因藉由雷 射照射產生之熱造成之影響的部份)之厚度與未接合部份(即，未受到因藉由雷射照射產生之熱造成之影響的部份)之厚度的差宜為20μm以下，且10μm以下更佳。由於該厚度差為20μm以下，可進一步抑制將樹脂薄膜接合體捲取成卷取時，產生由於該厚度差造成之刮痕等。又，由進一步抑制刮痕之觀點來看，上述接合部份對上述未接合部份之比率(比率=上述接合部份/上述未接合部份)宜為1.5以下，且1.2以下更佳。
此外，該厚度差可，例如，藉由適當設定雷射照射條件、加壓條件、加壓構件之硬度等來調整。
，藉由本實施形態之樹脂薄膜接合體之製造方法製作之樹脂薄膜接合體可為，如第3圖所示，藉由樹脂薄膜接合體80捲成卷狀得到之卷體90。
又，上述樹脂薄膜接合體或卷體可，例如，適用於具有該等樹脂薄膜接合體或卷體之光學薄膜。該光學用薄膜係可舉例如使用供液晶顯示裝置等使用之偏光板用保護薄膜(例如，三乙醯纖維素、環烯烴聚合物等)之2個以上之平條作為本實施形態之樹脂薄膜接合體之製造方法之樹脂薄膜構件進行接合，藉此得到之長條原料。此外，該光學用薄膜可，例如，適用於具有該光學用薄膜之偏光薄膜。該偏光薄膜係可舉例如透過黏著劑黏合前述長條原料及染色且進一步延伸聚乙烯醇薄膜得到之偏光子，藉此得到之偏光板。
<其他實施形態之樹脂薄膜接合體之製造方法>
本發明之樹脂薄膜接合體之製造方法不限於上述實施形態之樹脂薄膜接合體之製造方法，且可適當變更設計。
例如，上述實施形態之樹脂薄膜接合體之製造方法係在第一樹脂薄膜構件10之端面上對接第二樹脂薄膜構件20之端面，但是本發明之樹脂薄膜接合體之製造方法亦可另外在一樹脂薄膜構件10之端面上對接該樹脂薄膜構件10之另一端面。具體而言，本發明之樹脂薄膜接合體之製造方法亦可實施重疊一樹脂薄膜構件10之一端面與該樹脂薄膜構件10之另一端部，且一次切斷該兩重疊端部，藉此在該等端部形成互相一致之端面之切口的端面形成步驟；對接藉該端面形成步驟形成之其中一端面與另一端面的對接步驟；及前述接合步驟。
又，在本發明之樹脂薄膜接合體之製造方法中，亦可回收例如2個以上所謂平條之原料終端部，且使用該等平條作為樹脂薄膜構件。
平條具有以往在未充分再利用之情形下廢棄之問題，但是由抑制材料損失或減少生產廢料之觀點來看，如該樹脂薄膜接合體之製造方法地製造再利用平條作為樹脂薄膜構件，且即使捲取亦不易產生刮痕之樹脂薄膜接合體是理想的。
本發明之樹脂薄膜接合體之製造方法不限於上述實施形態之構成。又，本發明之樹脂薄膜接合體之製造方法之作用效果不限上述作用效果。本發明之樹脂薄膜接合體之製造方法在不脫離本發明要旨之範圍內可進行種種 變更。
實施例
以下，舉出實施例及比較例更具體地說明本發明。
(實施例1)
使用下述樹脂薄膜構件，雷射，加壓構件，台座。
樹脂薄膜構件1 三乙醯纖維素(TAC)薄膜(Fuji Film公司製)
樹脂薄膜構件2 與該樹脂薄膜構件1相同者
將樹脂薄膜構件1之端面與樹脂薄膜構件2之端面對接在DLC構件上，且以加壓構件將業已對接之部份推壓在台座之DLC構件表面上，且將前述雷射光掃描照射在該DLC構件之1直線上而使其發熱，藉此使樹脂薄膜構件之端面彼此熱熔接，且由業已對接之部份剝離DLC構件，製作樹脂薄膜接合體。
結果，可在不使用塗布光吸收劑之步驟的情形下，製作無段差之樹脂薄膜接合體。又，得到之樹脂薄膜接合體顯示拉伸強度為110N/30mm之良好接合性。此外，沒有發現在DLC構件表面上附著樹脂薄膜構件，且可由熱熔接之樹脂薄膜構件輕易地剝離DLC構件。
(實施例2)
除了使用聚乙烯醇薄膜(KURARAY公司製，厚度75μm，寬度30mm，熔點230℃，光吸收率1%以下)作為樹 脂薄膜構件以外，與實施例1同樣地製作樹脂薄膜接合體。
結果，可在不使用光吸收劑之情形下，製作無段差之樹脂薄膜接合體。又，得到之接合體顯示拉伸強度為90N/30mm寬之良好接合性。此外，沒有發現在DLC構件表面上附著樹脂薄膜構件，且可由熱熔接之樹脂薄膜構件輕易地剝離DLC構件。
(實施例3)
除了使用玻璃碳構件(IBIDEN公司製，厚度：1mm，光吸收率：82%，對水1μL之接觸角：66.8°，氧化溫度500℃，算術平均粗糙度：0.173μm，十點平均粗糙度：8.01μm)作為台座之光吸收構件，且在未設置基座部之情形下使用片狀之玻璃碳構件作為台座以外，與實施例1同樣地製作樹脂薄膜接合體。
結果，可在不使用光吸收劑之情形下，製作無段差之樹脂薄膜接合體。又，得到之接合體顯示拉伸強度為100N/30mm寬之良好接合性。此外，沒有發現在玻璃碳構件表面上附著樹脂薄膜構件，且可由熱熔接之樹脂薄膜構件輕易地剝離玻璃碳構件。
(實施例4)
使用下述樹脂薄膜構件，雷射，加壓構件，台座。
樹脂薄膜構件1 環烯烴聚合物薄膜(日本Zeon公司製)
光吸收率 1%以下
樹脂薄膜構件2 與該樹脂薄膜構件1相同者
除了使用如此條件以外，與實施例1同樣地接合樹脂薄膜構件1及樹脂薄膜構件2。
結果，可在不使用光吸收劑之情形下，製作無段差之樹脂薄膜接合體。又，得到之接合體顯示拉伸強度為120N/30mm寬之良好接合性。此外，沒有發現在碳石墨構件表面上附著樹脂薄膜構件，且可由熱熔接之樹脂薄膜構件輕易地剝離碳石墨構件。
(比較例1)
在聚醯亞胺薄膜(Dupont公司製，KaptonV，厚度75μm)之上面塗布光吸收劑(Gentex公司製之Clearweld(註冊商標)LD120C，10nL/mm2)，製作由聚醯亞胺薄膜及上述光吸收劑層構成之積層體，藉此將上述光吸收劑在940nm之光吸收率設定為30%。又，使用未設置光吸收構件之單一基座部作為台座，將上述積層體載置於基座部上面上使上述光吸收劑層配置在上側後，在光吸收劑層上接合樹脂薄膜構件1之端面及樹脂薄膜構件2之端面。又，令雷射功率為50W，且掃描速度為40mm/秒。除此以外，與實施例1同樣地得到樹脂薄膜接合體。
結果，得到之接合體顯示拉伸強度為90N/30mm寬之良好接合性。但是，以織物(布)簡易地擦去得到之樹脂薄膜接合體之接合部份周邊後，確認由於光吸收劑產生之污垢。因此，了解到的是該光吸收劑在以所謂卷對卷搬送樹脂薄膜接合體時，光吸收劑會產生成為污垢附著至夾持軋輥等之原因等的缺點。
(參考例)
除了令光吸收構件之厚度為0.2μm，光吸收構件之表面 之算術平均粗糙度為0.08μm，十點平均粗糙度為0.61μm，在波長940nm之光吸收率為8%以外，與實施例1同樣地製作樹脂薄膜接合體。
結果，藉雷射光照射光吸收構件而產生之熱能不足，因此，樹脂薄膜接合體之拉伸強度降低為10N/30mm，且接合不足。
(實施例5)
除了令光吸收構件之厚度為0.2μm，光吸收構件之表面之算術平均粗糙度為0.08μm，十點平均粗糙度為0.61μm，在波長940nm之光吸收率為8%，雷射功率為80W以外，與實施例1同樣地製作樹脂薄膜接合體。
結果，得到之接合體顯示拉伸強度為90N/30mm寬之良好接合性。但是，接合所需之能量多，無法謀求省能化。
(比較例2)
除了使用未設置光吸收構件之單一基座部作為台座以外，與實施例1同樣地製作樹脂薄膜接合體。此時，作為基座部之石英玻璃板中之在波長940nm之光吸收率小於1%，且對水1μL之接觸角：67°，氧化溫度1600℃，算術平均粗糙度：0.038μm，十點平均粗糙度：0.33μm)。
結果，石英玻璃板之光吸收性不足，因此無法產生足夠熱能使樹脂薄膜構件1與2熱熔融，故無法接合樹脂薄膜構件1與2。
(比較例3)
除了使用碳石墨構件(厚度：1.2μm，在波長940nm之光 吸收率：91%，對水1μL之接觸角：120°，氧化溫度500℃，算術平均粗糙度：0.580μm，十點平均粗糙度：6.5μm)作為光吸收構件，且在基座部上面形成該碳石墨層且製作台座以外，與實施例1同樣地熱熔接樹脂薄膜構件1之端面與樹脂薄膜構件2之端面。
又，由光吸收構件剝離如此熱熔接之樹脂薄膜構件1及樹脂薄膜構件2後，附著有由於樹脂薄膜構件1及樹脂薄膜構件2中至少任一者產生之TAC。
因此，該光吸收構件無法再利用。
(比較例4)
除了使用碳石墨構件(厚度：1μm，在波長940nm之光吸收率：90%，對水1μL之接觸角：121°，氧化溫度500℃，算術平均粗糙度：0.51μm，十點平均粗糙度：12.6μm)作為光吸收構件，且在基座部上面形成該碳石墨層且製作台座以外，與實施例1同樣地熱熔接樹脂薄膜構件1之端面與樹脂薄膜構件2之端面。
又，由光吸收構件剝離如此熱熔接之樹脂薄膜構件1及樹脂薄膜構件2後，附著有由於樹脂薄膜構件1及樹脂薄膜構件2中至少任一者產生之TAC。
因此，該光吸收構件無法再利用。
10‧‧‧(第一)樹脂薄膜構件
10a‧‧‧(第一)樹脂薄膜構件之切除端
20‧‧‧(第二)樹脂薄膜構件
20a‧‧‧(第二)樹脂薄膜構件之切除端
30‧‧‧吸附裝置
40‧‧‧刀具
50‧‧‧台座
50a‧‧‧光吸收構件
50b‧‧‧基座部
60‧‧‧加壓構件
70‧‧‧中介構件
80‧‧‧樹脂薄膜接合體
80a‧‧‧接合部份
90‧‧‧卷體
100R‧‧‧雷射光
101,102‧‧‧樹脂薄膜構件
104‧‧‧光吸收劑
105‧‧‧接合構件
106‧‧‧發熱介質
107‧‧‧樹脂薄膜接合體
R‧‧‧雷射光
第1(a)~(c)圖是顯示一實施形態之樹脂薄膜接合體之製造方法中端面形成步驟及對接步驟的概略步驟圖。
第2圖是顯示一實施形態之樹脂薄膜接合體之製造方 法中接合步驟的圖。
第3圖是顯示一實施形態將樹脂薄膜接合體捲取成卷狀之步驟的圖。
第4(a)、(b)圖是顯示習知技術之使用雷射光之樹脂薄膜接合體之製造方法的圖。
第5圖是顯示可想到之使用雷射光之樹脂薄膜接合體之製造方法的圖。
10‧‧‧(第一)樹脂薄膜構件
20‧‧‧(第二)樹脂薄膜構件
50‧‧‧台座
50a‧‧‧光吸收構件
50b‧‧‧基座部
60‧‧‧加壓構件
70‧‧‧中介構件
80‧‧‧樹脂薄膜接合體
R‧‧‧雷射光

Claims (8)

  1. 一種樹脂薄膜接合體之製造方法，係將樹脂薄膜構件之端面彼此對接並接合而作成樹脂薄膜接合體者，其特徵在於：使用對於使用之雷射光波長其光吸收率比前述樹脂薄膜構件高，且具有算術平均粗糙度(Ra)小於0.5μm之表面的光吸收構件，並使前述端面彼此業已對接之部份抵接於前述表面，且將雷射光照射在前述光吸收構件上使其發熱，藉此使前述樹脂薄膜構件之端面彼此熱熔接，然後由前述光吸收構件剝離前述業已對接之部份，作成樹脂薄膜接合體。
  2. 如申請專利範圍第1項之樹脂薄膜接合體之製造方法，其中前述表面之十點平均粗糙度(Rz)係小於10μm。
  3. 如申請專利範圍第1或2項之樹脂薄膜接合體之製造方法，其中前述光吸收構件對前述雷射光之波長具有10%以上之光吸收率。
  4. 如申請專利範圍第1或2項之樹脂薄膜接合體之製造方法，其中前述光吸收構件含有類鑽碳、玻璃碳或碳石墨。
  5. 如申請專利範圍第1或2項之樹脂薄膜接合體之製造方法，其中前述雷射光具有800nm以上且2000nm以下之波長。
  6. 如申請專利範圍第1或2項之樹脂薄膜接合體之製造方法，其中前述樹脂薄膜構件具有150μm以下之厚度。
  7. 如申請專利範圍第1或2項之樹脂薄膜接合體之製造方法，其中前述樹脂薄膜構件含有具有300℃以下之熔點或玻璃轉移溫度之熱可塑性樹脂。
  8. 如申請專利範圍第1或2項之樹脂薄膜接合體之製造方法，其中前述樹脂薄膜構件含有下述中任一種以上之樹脂：三乙醯纖維素樹脂、聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、聚甲基丙烯酸甲酯樹脂、環烯烴聚合物、降冰片烯樹脂或聚乙烯醇樹脂。
TW101119944A 2011-07-12 2012-06-04 樹脂薄膜接合體之製造方法（二） TW201302441A (zh)

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