201243503 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種曝光機，尤指一種達到精準對位之曝光機 台及其操作方法。 【先前技術】 按’由於印刷電路板在發展的演進上’朝向輕薄的路線發展 下，不斷的將印刷電路板的面積變小，重量變的更輕，也導致於 在印刷電路板於曝光之製程中越顯的難度提高。印刷電路板的曝 光技術，係將印刷電路板置於曝光機之曝光框内，並經由上底片 與下底片的定位，然後將待曝光之印刷電路板，夾置於上底片與 下底片之間，而依據CCD攝影機所榻取之對位影像，需將印刷電 路板相對於曝光位置，與上、下底片進行對位，再進行曝光之工 作。然而，上底片與下底片在定位於曝光框上框與下框之前，亦 必須先進行對位之工作，才能確保印刷電路板之曝光品質。 在-般曝光機之底片對位方法中，由於底片為軟性材質之特性， 藉由對位裝置進行上、下底片的對位王針分不^，常會底片造 成損毀或是對㈣誤差献，若以人王姚底片蝴整位置，勢 必要以較長之時聰取對位之精細度，献犧牲對位之精準度以 縮短底片之對位時間，而無法有效率地完成底片對位之工作，更 因為-般曝光機是半自動顧，難在對位上都是軸對之對位 梢穿設於電路板之對位孔，並依據CCD攝影機觸取之對位影 201243503 像，控制對位梢移動而帶動電路板，進行電路板與上、下底片間 之對位工作，因此雖然使用到CCD光學技術輔助對位，但主要是 用於協助對位梢之對位，而非直接使電路板與光罩對準。相關習 知技術請參閱如圖5之日本專利S63__47，該專利揭露一種將 陶竟基板置紋學絲上方，II由下絲基板本體之 孔洞而使之與上方光罩對準，以完成單面陶i基板曝光之技術， 但就該曝光方絲說絲能達錢面啊曝光，且未敎示在曝光 時而要使用外力將喊基減光罩緊躲合，故紐先前技術來 說並無法於_基板的二面同時形成高密度關樣；又如圖6之 美國專利5,548,372所示’料露可_觸與光學方式使上 下基板對準’ JUX抽真空的手法使印職路板與光罩緊密結合後 再進行雙面曝光’但由於陶板具有微小⑽，真空結合法並 無法將喊基板與光罩緊密結合，故曝絲準度會下降而無法形 成高密度之圖樣。 另外’習知對位裝置之成對之對位梢需要一定之體積，當線 路圖案不斷縮小時，對位梢相對而言就變的相當巨大，其補微偏 移就可能使得線路圖案完全錯位使得圖案化失敗，因此使用對位 梢對位在雜的精準度上也—直難以提升。再者，於對位完成後 或進打印刷電路板曝光的同時’印刷電路板與底#的相對位置有 可能會因為地震、操作人員不小心撞到曝光機或其他原因而發生 偏移，導致印刷電路板曝光失敗’增加廠商的成本。 若無法精準曝光，將致使乾膜殘留於陶曼基板上(如第7圖所 201243503 τ);又’由於電路導體依乾膜圖案沈積於陶瓷基板上而形成電路 圖案，若未能精準曝光而得一精準、無乾膜殘留電路圖案，將無 法獲得一精準導體電路圖案，將導致電路線路過窄、過寬、圖案 失敗等問題；進-步將導致導體與基板接合面縮小，影響結合力、 降低導體拉力值與可靠度性能；並增加高頻電性訊號之阻抗偏移 里’更影響後續製程對位（如裝晶、打線、切割等製程），增加產 品製作的誤差率等問題。又，由於殘留於陶竟基板上之乾膜僅能 以二次曝光方式移除，若將有乾膜殘留的陶竞基板進行二次曝 光’又將產生對位不精準、電路圖案錯位等問題。因此，若能提 供一種能提高對位醉度且可排除雜完舰發生偏移狀況的曝 光機，實為-刻不容軸魏。 【發明内容】 本發明之-目的在雜供—辦賴自，以 及排除對喊錢發生偏微社撤。 為達上述目的，本發明之實現技術如下： 曝光機台，包含：一承載平台，其用以承载一電路板， :電路板上配置至少二對位標記；一第一光源，係位於電路 板之一側，用以提供曝光所需之光源； 201243503 片與該電路板緊密壓合；至少二對位鏡頭，該至少二對位鏡頭 係位於該第-光罩體之一側相對於該電路板，用以侧該對位 標記與該對位乾點是否對應重疊；以及一控制單元，該控制單 元係根據該至少二對位鏡頭來偵測該第一底片上之該至少二對 位歡點與該電路板上之該至少二對位標記是否分別對應重疊， 並移動該承載平台’直到該至少二對位乾點與該至少二對位標 3己为別對應重疊後，再控制該限位單元將該第一光罩體、該第 一底片與該電路板緊密壓合，並啟動該第一光源，並根據該第 一底片對該電路板進行曝光。 上述之電路板，係陶瓷基板、FPCB軟板、軟硬複合板、雙 層板、多層板、鍍金板、化金板、喷錫板或鋁基板等電路板，但 不限於此。較佳為陶瓷基板。 上述之第一光源，係為一紫外線光源。 上述之對位靶點為至少一凹孔標記或一平面圖樣標記。 上述之對位標記為至少一凹孔標記或一平面圖樣標記。 上述之該凹孔標記或平面圖樣標記之形狀係選自圓形、一字 形、十字形、方形、梯形、正多邊形、橢圓形、弧形及其組合所 構成之群組，但不限於此。 上述之該對位鏡頭為習知攝像裝置，如CCD攝像機或CM〇s 攝像機等。 上述之限位單元，係進一步具有複數個加壓汽缸，以將該第 一光罩體、該第一底片以及該電路板緊密壓合。 201243503 上述之曝光機台，於該電路板另一侧進一步包含一第二光 源、一第二光罩體及其包含之第二底片，且該第二底片上具有至 少二對位娜；其中，該控制單元係根據該至少二對位鏡頭來悄 測該第一底片上之該至少二對位靶點、該電路板上之該至少二對 位標記與該第二底片上之該至少二對錄點是否分別對應重疊， 並移動該承載平台’直到該第—底片上之至少二對錄點、^電 路板上之至少二對位標記與該第二底片上之該至少二對位乾點分 別對應重疊後，再控繼紐單元賴二光罩體、該二底片與= 電路板緊密壓合，並啟動該第—光源與該第二光源，並根據該第 —底片以及該第二底片對該電路板進行雙面曝光。 上述第-底片之至少二對位乾點以及第二底片之至少二對位 靶點，係對應重疊。 工迹炙曝光 = 〇〇 〜ό 曰切択即科機構，係受_… 这控制早7〇，以對躲辭台進行該電啸進行供料與卸料。 本發明同時包括一種曝光機台操作方法，該操作方法包括Ί =步驟：⑻將具有至少二對位標記之—電路板配置於一承斯 2上’且該魏板之至少—取有—光源。⑻於 3間^置—咖，缺概含—槪少二對位_ U _斷該底片上之至少二對蛛點是否與該電路板上$ ,,、Ι=Γ記分卿應重疊；（d)移動該承載平台，直細 二元將少二對位標記分別對_; _一阳 Ά罩體、麵)ί舰電顿f _合； 201243503 該光源，並根據該底片對該電路板進行曝光。 上述之曝賴台操作方法，進—步包含於該電路板二側均設 有光源’且於該電路板之二側與該二光源間均設置一光罩體， 該一光罩體均包含—具有至少二對絲點之底片以及判斷該二 底片上之至少二對錄點是否與該電路板上之至少二對位標記分 別對應重疊的步驟，再控制—限位單元將該二光罩體、該二底片 與該電路板緊密壓合’並根據該二底片對該電路板進行雙面曝光 的步驟。 為使本發明之曝光機台及其操作方法與上述其他目的、特徵 及功效能更明顯祕，紐由下述具體之實關，並配合所附之 圖式，對本發明一詳細說明如下。 【實施方式】 參閱第1圖、第2圖與第3圖，係分別為依據本發明之曝光 機台之實施例侧面剖視圖、限位單元實施例圖以及該實施例之外 觀示意圖，如圖所示：本發明之曝光機台1〇，主要由一承載平台 15，其用以承載一電路板30，且該電路板30上配置至少二對位標 記(圖未示）；一第一光源11，係位於電路板3〇之一侧，用以提供 曝光所需之光源；一第一光罩體13(由光罩框οι與光罩132所構 成）’係位於該電路板30與該光源11之間，且該第一光罩體13 包含一具有至少二對位靶點(圖未示)之第一底片14; 一限位單元 18，該限位單元18係位於該第一光罩體13之一侧相對於該電路 201243503 $用乂將該第-光罩體13、該第一底片14與該電路板洲緊 密壓合；至少二對位鏡頭12，該至少二對位鏡頭12係位於該第- 光罩體13之—側相對於該電路板30，用以制該對位標記與該對 位鞋點是否對應重疊；以及一控制單元19，該控制單元Μ係根據 該至少二對位鏡頭12來偵測該第—底片14上之該至少二對位乾 點與該電路板30上之該至少二對位標記是否分職於二對位鏡頭 12之對位_基線⑵上，關斷是否分卿應重疊，若為否， 該控制單元19即移動該承載平台15，直到該至少二對絲點與該 至少二對位標記分別對應重叠後，再控制該限位單元18將該第一 光罩體13、該第一底片14與該電路板30緊密壓合，以避免該第 一底片14與該電路板3〇之相對位置有可能會因為地震、操作人 員不小心制曝光機或其他賴而發生偏移，Μ，該控制單元 Ν啟動該第-光源u，並根據該第_底片14_電路板加進行 曝光。 另’上述之對位她以及雜標記可選自獅、—字形、十 字形、方形、梯形、正多邊形、橢圓形、弧形之凹孔標記、複數 個凹孔標記、平面圖樣標記及其所構成之群組，但較佳地係均為 相同之凹孔標記、複數個凹孔標記組成之特定標記或平面圖樣標 記，如相同的圓形凹孔標記，以增加該二對位鏡頭12攝影的效果， 且上述之對位鏡頭12係為—(xD(ehafge e_ed 合震置)攝像機。上狀單元ls係具魏數個加壓汽紅⑻， 於該第-光罩體13之解框131上加壓，並透過該第—光罩體u 201243503 之光罩132將力量傳遞至該第一底片14以及該電路板30,以將三 者緊密壓合，達到限位的目的。 又’上述該底片為帶有欲定義於電路板30之電路佈局圖案之 το件，為一可透光材料，以習知簡易方式黏貼在該光罩體上，或 直接形成於該光罩體。 本發明之曝光機台10適用於電路板的單面曝光，亦可適用於 電路板的雙_光’其找電路板為喊基板、FPCB軟板、軟硬 複合板、懸板、多層板、鍍錢、化金板、搞減紹基板等 習知之電路板，但不限於此。 為實現電路板雙面曝光的目的，本發明之曝錢台1G進一步 包含一第二光源17、一第二光罩體16(由光罩框161與光罩162 所構成)及其包含之第二底片141，第二底片i4i上具有二對 鍊點(圖㈣爾鮮元19 __二對魏㈣來偵測該 第-底片Η上之二對位無點、該電路板％上之二對位標記與該 第二底片Ml上之二對錄點是否分職於二對位制12之對位 感測基線m上，料爾物_重疊，並移_承載平台 15 ’直到該二對絲點、該二對位標記與該二對絲點分別對應 重疊後，再控制舰位單元18將該第—光罩體13、該第一底片 14、該電路板30、該第二光罩體16與該第二底片141㈣壓合， 並啟動該第一光源11血該筮·《水 弟一先源口，根據該第一底片14以及 該第二底# 141 _電路板進行雙面曝光。 上述之第-光罩體13與第二光罩體16的相對位置係不可改 201243503 變的’即代表第一底片14上之二對錄點以及第二底片上之二對 位數點係為永久性的分別對應重疊(位於對位感測基線 121上），如 此可減少機械構件，節省本發明曝光機台1〇的製造成本，簡化對 位步驟，又能確保對位的精確度與穩定度。 本發明之曝光機台10 _於半自動的電路祕光，亦可適用 於全自動的電路板曝光。所謂的半自動，即代表電路板於曝光時， 部分的操作需要手域理’如對位_整或板的供料與卸料 2等。於本發明中，對位的操作係自動完成，故本發明之曝光機 :10進步包含-自動供卸料機構2〇，係受控於該控制單元19， 當刚-電路板30完成曝光後，即將其自該承载平台15上卸除， 並將下-電路板置放於該承载平台15上，完成自動進行供料與卸 料的操作，進而使本發明之曝賴台1G達到全自轉域理的功 效。 參閱第4圖，係為本發明種曝光機台操作方法之實施流程 圖。如圖所示：本發明之曝光機台操作方法，係包含下列步驟·· 首先，將具有至少二對位標記之-電路板3G配置於—承载平台Μ 上，且該電路板30之至少-側設有一光源u(步驟⑽），於該電 路板30與該光源u間設置一光罩體13，該光罩體^包含一具有 至少二對位乾點之底片H(步驟S20)，判斷該底片14上之至少二 對位她是錢魏職3〇上之至少二騎標記分卿應^ (步驟S3G) ’移触承餅台15，直_至少二對錄點與該至二 二對位標記分別對應重疊(步驟S4G)，控制—限位單元Μ將該光 12 201243503 罩13、今广 &片14與該電路板30緊密壓合(步驟S50)，啟動該光 、 根據觀# 14對該電路板進行曝光(步驟S6G)，將該 ， 自》亥承載平台15上卸除(步驟S7〇)，並決定是否繼續曝 光(步驟SS0) ’若要繼續，則回到步驟_進行下一電路板的曝光 流程；若不繼續，縣束本:欠的操作。 為實見電路板雙面曝光的功效’於上述之曝光機台30操作方 中進v包含判斷配置於該電路板兩側之該第一光罩體13 斤匕3之該第—底片14、第二光罩體16所包含之第二底片141 上之至少二對蛛財否與該電路板30上之至少二對位標記分別 對應重疊的步驟，並移動該承餅台15，直職二底片上之至少 :對錄點與該電路板3〇上之至少二對位標記分別對應重疊，以 完成對位操作，並控制該限位單元18職第-光罩體13、該第一 &片14 „亥電路板3〇、該第二光罩體16與該第二底片⑷緊密 壓合，再啟動該第-光源U與一第二光源17，崎據該第一底片 14以及該第二底片141對該電路板3〇進行雙面曝光。 其中’判斷該第-底片U是否與該電路板3〇以及該第二底 片H1分珊應重疊的步驟錢過至少二對位綱a將該至少二 對位乾點、駐少二雜標記以及該至少二對錄闕影像傳輸 至-控制單元19，並藉㈣控制單元19來麟其衫分職應重 疊。此外，為增加至少二對位鏡頭攝影12的效果，上述之至少二 對位乾點以及至少二對位標記’係均為—凹孔標記、均為一由複 數凹孔標記組紅特定標記或均為—平_樣標記科，且上述 201243503 之至少二對位鏡頭12俩為—⑽㈣啼咖㈣如以，電荷 搞合裝置)齡機。又，將具註彡二對簡記板30配置 於-承載平台15上與將該電路板自該承載平台15上卸除的步驟 係透過-自動供㈣機構來完成，以實現全自動的電路板曝光操 作再者，上述之限位單元18係具有複數加壓汽缸181，以提供 該第一底片與該電路板緊密壓合的效果。 依上述本發明曝光機台對陶瓷基板進行曝光，可得一曝光精 準、無乾膜殘留之陶瓷基板(如第8圖），解決了因曝光不精準而導 致電路線路過窄、過寬、圖案失敗等問題，也聽高頻電性訊號 之阻抗偏移，減少後續製程的對位問題（如裝晶、打線、切割等製 程）’降低產品製作的誤差率等問題，並增進基板與導體結合力、 增加拉力、增加可靠度。 在詳細說明上述本發明的各項較佳實施例之後，熟悉該項技 術人士可清楚的瞭解，在不脫離下述申請專利範圍與精神下衧進 行各種變化與改變，如限位單元的各種實施態樣等等，亦不受ρ艮 於說明書之實施例的實施方式。 【圖式簡單說明】 第1圖為本發明曝光機台之側面刮視圖。 第2圖為本發明曝光機台之限位單元實施例圖。 第3圖為本發明曝光機台之側面剖視圖。 第4圖為本發明曝光機台操作方法之實施流程圖。 14 201243503 第5圖為一習知雙面曝光印刷電路板側面剖視圖。 第6圖為一習知印刷電路板對位裝置。 第7圖為習知陶瓷基板曝光結果照片。 第8圖為利用本發明之曝光機陶瓷基板曝光結果照片。 【主要元件符號說明】 10 :曝光機台 11 :第一光源 12 :對位鏡頭 121 :對位感測基線 13 :第一光罩體 131 :光罩框 132 :光罩 14:第一底片 141 :第二底片 15 :承載平台 16 :第二光罩體 161 :光罩框 162 :光罩 17 :第二光源 18 :限位單元 181 :加壓汽缸 15 201243503 19 :控制單元 20 :自動供卸料機構 3〇 :電路板 上 sio .將具有至少二對位標記之1路板配置於—承載平台 ’且該電路板之至少一側設有一光源。 :於該電路板與該光關設置—光罩體，該光罩體包含一 具有至少二對位靶點之底片 ⑽：判斷該底片上之至少二對絲點是否與該電路板上之至 少二對位標記分別對應重疊 S你移動該承載平台，直到該至少二對絲點與該至少二對 位標記分別對應重疊 S50 :控制-限位單元_光罩體、該底片與該電路板緊密壓 合 S60 :啟動該光源，並根據該底片對該電路板進行曝光 S70 .將該電路板自該承载平台上却除 S80 :判斷是否繼續曝光201243503 VI. Description of the Invention: [Technical Field] The present invention relates to an exposure machine, and more particularly to an exposure machine that achieves accurate alignment and an operation method thereof. [Prior Art] According to the development of the printed circuit board in the direction of development, the area of the printed circuit board is reduced and the weight is lighter, which also leads to exposure on the printed circuit board. The more difficult the process is in the process. The exposure technology of the printed circuit board is to place the printed circuit board in the exposure frame of the exposure machine, and to position the upper and lower negative films, and then sandwich the printed circuit board to be exposed between the upper and lower negative films. According to the alignment image taken by the CCD camera, the printed circuit board needs to be aligned with the upper and lower negative films with respect to the exposure position, and then the exposure work is performed. However, before the upper and lower negatives are positioned in the upper frame and the lower frame of the exposure frame, the alignment must be performed first to ensure the exposure quality of the printed circuit board. In the film alignment method of the general exposure machine, since the negative film is a soft material, the alignment of the upper and lower negative films by the alignment device is not enough, and the negative film often causes damage or (4) error contribution. If the Wang Yao Yao film is used for the whole position, it is necessary to take the fineness of the alignment for a long time, and sacrifice the precision of the alignment to shorten the alignment time of the negative film, and it is impossible to efficiently complete the alignment of the negative film. Work, but because the general exposure machine is a semi-automatic care, it is difficult to put the alignment of the shaft pair on the alignment hole of the circuit board in the alignment position, and according to the CCD camera touch the shadow of the shadow 201243503 image, control pair The bit moves to drive the circuit board to perform the alignment work between the circuit board and the upper and lower negative films. Therefore, although the CCD optical technology is used to assist the alignment, it is mainly used to assist the alignment of the position, rather than directly The board is aligned with the mask. For related art, please refer to Japanese Patent No. S63__47 as shown in FIG. 5, which discloses a method for arranging a ceramic substrate above a wire, and aligning it with the upper mask by a hole of the lower substrate body to complete a single side. Tao i substrate exposure technology, but the exposure of the square wire said that the wire can reach the surface of the exposure, and did not show the use of external forces to use the external force to close the shatter-resistant hood, so the New Zealand technology It is not possible to form a high-density sample on both sides of the substrate. In addition, as shown in the U.S. Patent No. 5,548,372, the material is exposed to the optical substrate to align the upper and lower substrates. The JUX vacuum method is used to make the printed circuit board and The photomask is tightly bonded and then double-sided exposed. However, since the ceramic plate has a small size (10), the vacuum bonding method cannot closely bond the shim substrate to the photomask, so the accuracy of the exposure wire is lowered to form a high-density pattern. In addition, the paired pairs of conventional alignment devices require a certain volume. When the line pattern is continuously reduced, the position of the bit is relatively large, and the micro offset may make the line pattern completely misaligned. The patterning fails, so the use of the alignment of the alignment is also difficult to improve. Furthermore, the relative position of the printed circuit board to the bottom # after the alignment is completed or when the printed circuit board is exposed may be offset due to an earthquake, an operator accidentally hitting the exposure machine, or other reasons. Printed circuit board exposure failed 'increased the cost of the manufacturer. If the exposure is not accurate, the dry film will remain on the Tauman substrate (as shown in Fig. 7 201243503 τ); and 'the circuit conductor is deposited on the ceramic substrate according to the dry film pattern to form a circuit pattern, if it is not accurately exposed A precise, dry film-free residual circuit pattern will not be able to obtain a precise conductor circuit pattern, which will lead to problems such as too narrow circuit line, too wide, and pattern failure. The step-by-step will lead to a reduction in the bonding surface between the conductor and the substrate, affecting the bonding force. Reducing the tensile strength and reliability of the conductor; and increasing the impedance offset of the high-frequency electrical signal, which affects the subsequent process alignment (such as wafer mounting, wire-cutting, cutting, etc.), and increases the error rate of product manufacturing. Moreover, since the dry film remaining on the ceramic substrate can only be removed by double exposure, if the ceramic substrate with residual dry film is subjected to double exposure, it will cause inaccurate alignment and misalignment of the circuit pattern. . Therefore, if it is possible to provide an exposure machine that can improve the intoxication of the counterpoint and eliminate the offset of the miscellaneous ship, it is true that the axis is not acceptable. SUMMARY OF THE INVENTION The object of the present invention is to provide for the misappropriation of the miscellaneous supply and the exclusion of the money. In order to achieve the above object, the implementation technology of the present invention is as follows: The exposure machine includes: a carrying platform for carrying a circuit board, wherein: the circuit board is configured with at least two alignment marks; and a first light source is located on the circuit board. One side for providing a light source required for exposure; 201243503 piece is tightly pressed with the circuit board; at least two alignment lenses are located on one side of the first photomask body with respect to the circuit And a control unit that detects the at least two pairs of the first photo on the first negative film according to the at least two alignment lenses; Whether the point overlaps with the at least two alignment marks on the circuit board respectively, and moves the loading platform ' until the at least two pairs of dry points overlap with the at least two pairs of the target 3, and then control the The limiting unit tightly presses the first mask body, the first film and the circuit board, activates the first light source, and exposes the circuit board according to the first film. The above circuit board is a circuit board such as a ceramic substrate, an FPCB flexible board, a soft and hard composite board, a double layer board, a multilayer board, a gold plate, a gold plate, a tin plate or an aluminum substrate, but is not limited thereto. A ceramic substrate is preferred. The first light source described above is an ultraviolet light source. The above-mentioned alignment target is at least one pit mark or a plan view mark. The alignment mark described above is at least one pit mark or a plan view mark. The shape of the recessed mark or plan-like mark described above is selected from the group consisting of a circle, a figure, a cross, a square, a trapezoid, a regular polygon, an ellipse, an arc, and a combination thereof, but is not limited thereto. The alignment lens described above is a conventional imaging device such as a CCD camera or a CM〇s camera. The above-mentioned limiting unit further has a plurality of pressing cylinders for tightly pressing the first mask body, the first film and the circuit board. 201243503, the exposure machine of the above-mentioned circuit board further comprises a second light source, a second light cover body and a second negative film thereof on the other side of the circuit board, and the second film has at least two alignments on the second film; The control unit quietly measures the at least two alignment targets on the first film, the at least two alignment marks on the circuit board, and the at least two pairs on the second film according to the at least two alignment lenses Whether the recording points respectively overlap, and move the carrying platform 'up to at least two pairs of recording points on the first film, at least two alignment marks on the circuit board, and the at least two opposite dry points on the second film After the corresponding overlap, the control unit further presses the second mask, the two negatives and the circuit board are tightly pressed, and activates the first light source and the second light source, and according to the first negative film and the second negative film The board is exposed on both sides. At least two pairs of dry spots of the first sheet and the at least two pairs of targets of the second sheet are overlapped. Work track 炙 exposure = 〇〇 ό ό 曰 択 択 択 択 択 択 科 科 科 科 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这 这The invention also includes an exposure machine operating method, the operation method comprising: Ί = step: (8) arranging a circuit board having at least two alignment marks on a carrier 2 and at least - taking the light source . (8) In 3 sets of - coffee, lack of summary - 槪 less two alignment _ U _ break at least two pairs of spider points on the film and the board, $,, Ι = Γ scores should overlap; (d) moving the carrying platform, the direct binary binary will be less than two alignment marks respectively _; _ a yang Ά 、, face) 舰 电 电 ;; 201243503 the light source, and according to the negative film The board is exposed. In the above method for operating the exposure station, the method further comprises: providing a light source on both sides of the circuit board; and providing a light cover body between the two sides of the circuit board and the two light sources, the light mask body comprises a step of having at least two pairs of dots and determining whether at least two pairs of recording points on the two negative films respectively overlap with at least two alignment marks on the circuit board, and then controlling the limiting unit to the two masks The body, the two negative films are tightly pressed with the circuit board and the double-sided exposure step is performed on the circuit board according to the two negative films. In order to make the exposure machine of the present invention and its operation method more apparent with the above other objects, features and functions, the present invention will be described in detail below with reference to the accompanying drawings. [Embodiment] FIG. 1 , FIG. 2 and FIG. 3 are respectively a side cross-sectional view of an embodiment of an exposure machine according to the present invention, an embodiment of a limiting unit, and a schematic view of the appearance of the embodiment. The exposure machine 1 of the present invention is mainly composed of a carrying platform 15 for carrying a circuit board 30, and the circuit board 30 is provided with at least two alignment marks (not shown); a first light source 11 Is located on one side of the circuit board 3 , to provide a light source required for exposure; a first reticle body 13 (consisting of the reticle frame οι and the reticle 132) is located on the circuit board 30 and the light source 11 , and the first mask body 13 includes a first film 14 having at least two alignment targets (not shown); a limiting unit 18, the limiting unit 18 is located in the first mask One side of the body 13 is used to press the first mask body 13 and the first film 14 tightly with the circuit board with respect to the circuit 201243503 $; at least two alignment lenses 12, the at least two alignment lenses 12 Is located on the side of the first mask body 13 relative to the circuit board 30 for making the alignment mark and the alignment shoe Whether it corresponds to overlap; and a control unit 19, which detects the at least two pairs of dry points on the first film 14 and the at least two on the circuit board 30 according to the at least two alignment lenses 12 Whether the alignment mark is assigned to the alignment of the two-alignment lens 12_baseline (2), whether the division should overlap, if not, the control unit 19 moves the carrier platform 15 until the at least two pairs of dots And correspondingly overlapping the at least two alignment marks, and then controlling the limiting unit 18 to press the first mask body 13 and the first film 14 tightly with the circuit board 30 to prevent the first film 14 from being The relative position of the circuit board 3 may be offset due to an earthquake, an operator accidentally making an exposure machine or the like, and the control unit Ν activates the first light source u, and according to the first photo film 14_ The board is exposed for exposure. In addition, the above-mentioned alignment and miscellaneous markings may be selected from the group consisting of a lion, a zigzag, a cross, a square, a trapezoid, a regular polygon, an ellipse, a curved recessed hole mark, a plurality of concave hole marks, a plan view type mark and the like. The group of constituents, but preferably all of the same recessed mark, a plurality of concave mark marks, or a plan-like mark, such as the same circular recess mark, to increase the photography of the two-alignment lens 12 The effect of the above-mentioned alignment lens 12 is - (xD (ehafge e_ed) camera. The upper unit ls has a number of pressurized vapor red (8), and the de-frame of the first mask member 13 Pressing on the 131, and transmitting the force to the first negative film 14 and the circuit board 30 through the photomask 132 of the first mask body u 201243503, the three are tightly pressed to achieve the purpose of limiting. The negative film is a permeable member having a circuit layout pattern to be defined on the circuit board 30, and is a light transmissive material adhered to the reticle body in a simple manner or directly formed on the reticle body. The exposure machine 10 of the invention is suitable for single-sided exposure of a circuit board, Applicable to the circuit board's double _ light', the circuit board is a known circuit board such as shouting board, FPCB soft board, soft and hard composite board, suspension board, multi-layer board, plated money, gold plate, and subtracting the substrate, but The exposure desk 1G of the present invention further includes a second light source 17 and a second mask body 16 (consisting of the mask frame 161 and the mask 162) for the purpose of double-sided exposure of the circuit board. The second negative film 141 includes two pairs of chain points (Fig. 4), the fresh element 19 __ two pairs of Wei (four) to detect the second alignment on the first film, no dots, the circuit board Whether the two upper registration marks and the two pairs of recorded points on the second negative film M1 are assigned to the alignment alignment m of the binary alignment 12, the material _ overlaps, and shifts the carrier platform 15 ' Until the two pairs of dots, the two alignment marks and the two pairs of dots respectively overlap, the control unit 18 controls the first mask body 13, the first film 14, the circuit board 30, the The second mask body 16 is pressed together with the second film piece 141 (four), and the first light source 11 is activated to generate the blood source, and the first source piece is according to the first film piece 14 And the second bottom # 141 _ circuit board is double-sided exposed. The relative position of the first photomask body 13 and the second mask body 16 is not changed to 201243503, that is, two pairs on the first film 14 The recording point and the two-digit point on the second film are permanently overlapped respectively (on the alignment sensing baseline 121), thereby reducing mechanical components and saving the manufacturing cost of the exposure machine of the present invention. Simplifying the alignment step, and ensuring the accuracy and stability of the alignment. The exposure machine 10 of the invention is semi-automatic circuit secret light, and can also be applied to fully automatic circuit board exposure. The so-called semi-automatic means the circuit When the board is exposed, part of the operation requires hand-handling, such as the alignment or the feeding and unloading of the board. In the present invention, the operation of the alignment is performed automatically, so the exposure machine of the present invention: 10 progress includes - the automatic feeding and unloading mechanism 2 is controlled by the control unit 19, when the rigid-board 30 is exposed That is, it is removed from the carrying platform 15, and the lower-circuit board is placed on the carrying platform 15, and the automatic feeding and unloading operations are completed, so that the exposed table 1G of the present invention reaches full rotation. The efficacy of the domain. Referring to Fig. 4, there is shown a flow chart for implementing the operation method of the exposure machine of the present invention. As shown in the figure, the operation method of the exposure machine of the present invention comprises the following steps: First, a circuit board 3G having at least two registration marks is disposed on the carrier platform ,, and at least the circuit board 30 is A light source u is disposed on the side (step (10)), and a light mask body 13 is disposed between the circuit board 30 and the light source u. The light mask body includes a negative film H having at least two alignment dry points (step S20). At least two pairs on the negative film 14 she is at least two riding on the 3rd position of the Qian Wei job. (Step S3G) 'Shifting the cake table 15, straight _ at least two pairs of recorded points and the two to two The alignment marks are respectively overlapped (step S4G), and the control-limit unit 紧密 tightly presses the light 12 201243503 cover 13 and the Jinguang & sheet 14 with the circuit board 30 (step S50), and activates the light and the view. #14 Exposing the board (step S6G), dismounting from the boarding platform 15 (step S7〇), and deciding whether to continue the exposure (step SS0) 'If it is to continue, return to step _ Carry out the exposure process of the next board; if not continue, the county bundle: the operation of the owed. In order to realize the effect of the double-sided exposure of the circuit board, the first film 14 of the first mask body 13 disposed on both sides of the circuit board is included in the operation of the exposure machine 30. The step of overlapping at least two pairs of spiders on the second film 141 included in the second mask body 16 with at least two alignment marks on the circuit board 30 respectively, and moving the carrier table 15, the straight job two At least on the negative film: the recording point and the at least two alignment marks on the circuit board 3 are respectively overlapped to complete the alignment operation, and control the positional unit 18 - the mask body 13, the first & a sheet 14 „ 电路 电路 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The second negative film 141 performs double-sided exposure on the circuit board 3, wherein 'the step of judging whether the first-back film U should overlap with the circuit board 3〇 and the second negative film H1 is at least two pairs of bits a Transmitting the at least two pairs of dry points, the second and second miscellaneous marks, and the at least two pairs of recorded images to the control unit 19, And by means of (4) the control unit 19, the division of the shirts should be overlapped. In addition, in order to increase the effect of at least two alignment lens photography 12, the above-mentioned at least two alignment dry points and at least two alignment marks are all-recessed holes. The markings are all marked by a plurality of concave holes, or are all - flat-like markings, and the above two at least two pairs of lenses of 201243503 are - (10) (four) 啼 ( (4) 如 电荷 电荷 电荷 电荷 电荷 电荷 电荷Further, the step of disposing the two pairs of the briefing board 30 on the carrying platform 15 and the step of removing the circuit board from the carrying platform 15 are performed through an automatic (four) mechanism to realize automatic operation. Circuit board exposure operation, the above-mentioned limiting unit 18 has a plurality of pressing cylinders 181 to provide an effect of tightly pressing the first film with the circuit board. According to the exposure apparatus of the present invention, the ceramic substrate is exposed. A ceramic substrate with accurate exposure and no dry film residue (such as Figure 8) can be obtained, which solves the problem that the circuit line is too narrow, too wide, the pattern fails due to inaccurate exposure, and also listens to the impedance of the high frequency electrical signal. Offset, reduce follow-up Process alignment problems (such as wafer mounting, wire bonding, cutting, etc.) 'reduce the error rate of product manufacturing and other issues, and improve substrate-to-conductor bonding force, increase tensile force, increase reliability. Detailed description of the above various aspects of the present invention After the preferred embodiment, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the scope and spirit of the inventions described herein. BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of the present invention are schematically illustrated in the first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 4 is a side view showing the implementation of the exposure machine of the present invention. 14 201243503 FIG. 5 is a side cross-sectional view of a conventional double-sided exposure printed circuit board. Figure 6 is a conventional printed circuit board alignment device. Figure 7 is a photograph of the exposure results of a conventional ceramic substrate. Fig. 8 is a photograph showing the result of exposure of the ceramic substrate of the exposure machine of the present invention. [Main component symbol description] 10: Exposure machine 11: First light source 12: Registration lens 121: Alignment sensing baseline 13: First mask body 131: Mask frame 132: Mask 14: First film 141 : second negative film 15 : carrying platform 16 : second reticle body 161 : reticle frame 162 : reticle 17 : second light source 18 : limiting unit 181 : pressurized cylinder 15 201243503 19 : control unit 20 : automatic loading and unloading The material mechanism 3〇: sio on the circuit board. The one-way board having at least two alignment marks is disposed on the “bearing platform” and at least one side of the circuit board is provided with a light source. Providing a light shield body on the circuit board and the light cover body, the light mask body comprising a negative film (10) having at least two alignment targets: determining whether at least two pairs of silk dots on the negative film are at least on the circuit board The two alignment marks respectively correspond to the overlap S. You move the carrier platform until the at least two pairs of dots correspond to the at least two alignment marks respectively corresponding to the overlap S50: the control-limit unit_the mask body, the film is tightly close to the circuit board Pressing S60: starting the light source, and exposing the circuit board according to the negative film S70. The circuit board is removed from the carrying platform except S80: determining whether to continue exposure