TW200538885A - Exposure device, exposure method, and exposure treating program - Google Patents

Abstract

The subject of the invention is to provide an exposure apparatus for improving the yield. The exposure apparatus which carries out alignment and exposure in the entire region of a substrate or in each region preliminarily segmented is equipped with: a means 36 to judge whether the substrate can be exposed or not based on a substrate mark and a mask mark formed on the substrate and a mask 10 having a pattern to be formed in the substrate, respectively, both marks photographed by a photographing means 20; a memory means 32 to memorize the information about the substrate judged as inappropriate for exposure and the information about a region not exposed which is the region judged as inappropriate for exposure, as error information; and an exposure controlling means 31 which controls to carry out alignment and exposure in the unexposed region based on the error information memorized in the memory means 32 when a substrate having an unexposed region is again introduced after completing the alignment and exposure on a series of substrates in a predetermined number.

Description

200538885 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to an exposure device, an exposure method, and an exposure processing method. The integration processing and the exposure processing are performed in the entire area of the substrate or each pre-divided area. [Prior art] An exposure device is known in which a photomask is closely adhered to a printed circuit board (hereinafter referred to simply as a substrate), and a pattern drawn on the photomask is exposed by projecting light from a light irradiation mechanism onto the substrate (for example, refer to Patent Document 1). Although this exposure device is known to those skilled in the art, a simple explanation is provided. In the exposure device, a machine for mounting a substrate and a mask for exposing a predetermined pattern to the substrate are juxtaposed to provide a light irradiation mechanism. Then, in order to carry out the integration process of integrating the photomask to a predetermined position of the substrate, the machine can be moved in the plane direction (X0 direction), or even in the vertical direction (z direction). Therefore, the substrate is moved in the Z direction to bring it into close contact with the photomask. The substrate is transferred from the front production line by a loading device, and is placed on a machine. After the whole process is performed, exposure is performed (pattern exposure), and it is sent to the next process by the loading device. The substrate is divided into a plurality of regions (for example, four) for performing exposure. The patterns drawn on the mask are sequentially exposed to individual areas. Photomask is located on the machine '. A CCD camera is set above the photomask. In order to detect the positions of the photomask and the substrate on the table, alignment marks (photomask marks and substrate marks) are set at appropriate positions on the photomask and the substrate, respectively. The machine moves the mask mark and the substrate mark in the direction of 0 2036-6851-PF; Chentf 5 200538885, and aligns the images by CCD camera. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-0017, Fig. 1) No. 2520027 (Paragraph 005) [Summary of the Invention] Problems to be Solved by the Invention However, in the integration process, the substrate is identified The position of the mark is used to calculate the center of the entire substrate mark. The substrate is moved according to the amount of deviation from the center position. Due to the lack of the substrate mark and the deviation of the formation position, when the position of the substrate mark cannot be identified, integration processing cannot be performed. Therefore, the exposure process cannot be performed. Even when the integration process is available, the substrate size changes due to the high temperature, and the exposure process cannot be performed when the deviation between the mask mark and the substrate mark exceeds the allowable range. Substrates in areas (unexposed areas) are discarded as unqualified spring products in the conventional technology. Therefore, the conventional exposure device has a problem of low yield. Here, in order to solve the above-mentioned problems An object of the present invention is to provide an exposure device capable of improving yield. [Means for solving problems] The exposure device of the present invention In order to solve the above-mentioned problems, the following structure is provided: 'the integration processing and the exposure processing are performed in the entire area of the substrate or each area pre-divided for the exposure, including a judgment device, a memory device and a Exposure processing control device. The judging device uses photographing equipment 2036-6851-PF; Chenf 6 200538885 to position the substrate marks and mask marks formed on the substrate and a mask with a pattern formed on the substrate for photography, According to the above two marks, it is determined whether the substrate is an exposed person. The memory device is information of a substrate determined by the determination device as non-exposure, and information of an unexposed processing area of the substrate determined as non-exposed. It is stored in the memory device as an error message. The exposure processing control device has the above-mentioned unexposed substrates. For a series of substrate pieces, when the integration processing and exposure processing are completed and then re-entered, the memories are stored in the memory according to the memories. Device error message to control the above unexposed processing area Integration process and exposure process. With such a configuration, the exposure apparatus determines that the information not be exposed substrate

The message and the information of the unexposed processing area judged to be non-exposed on the substrate are memorized by the memory device as error messages. Then, after the integration process and the exposure process are completed for a series of substrate pieces, when the substrate recorded by the error message is re-input, the integration process is performed only for the unexposed areas on the substrate according to the error message memorized by the memory device. And exposure processing. In addition, the exposure device further includes a display section that displays information on the unexposed processing area on the substrate based on the area of the substrate previously divided in the memory device and the error message. With such a structure, the exposure device memorizes the memory device as an error message for a defective substrate judged to be non-exposed, which is called an “unexposed processing area”, and “means that the substrate area divided in advance is also memorized in the memory device. Middle 'display can distinguish and display the unexposed processing area and the exposed area. 〃 ,,, °, * When a bad substrate is re-inserted, even if it is difficult to look at 2036-6851-PF; Chentf 7 200538885 T to determine whether to expose After that, it is easy to judge that area is the unprocessed area by the display unit. In addition, an exposure method that performs integration processing and exposure processing on the entire area of the substrate or each area that is pre-scratched includes the following steps: a judging step, which is formed on the substrate by a photographing device pair and has a formation The substrate mark and the mask mark on the mask of the pattern of the substrate are used for photography, and according to the above two marks, it is determined whether the substrate is an exposed person; a memory step, which will determine the information of the substrate that is not exposed by the determination step. And the information of the unexposed processing area of the substrate that is judged to be non-exposed, which is memorized as an error message; and an exposure processing control step, in which the above-mentioned unexposed processing substrate exists, and for a series of substrate pieces, When the integration process and the exposure process are completed and then re-entered, according to the memorized error message, the unexposed processing area is controlled to implement the integration process and the exposure process. In such an exposure method, since there is a step of recording information related to a substrate that is judged to be non-exposure and information related to an unexposed processing area of the substrate as an error message, a series of substrates are integrated and exposed in the above-mentioned integration process. After the processing is completed, when the substrate memorized by the error message is re-entered, for the error message, integration processing and exposure processing are performed on the unexposed processing area. In order to implement the integration processing and the exposure processing in the entire area of the substrate or each pre-divided area, the exposure processing program enables the computer to have the following functions: It becomes a judgment device, and the imaging device is formed on the substrate separately. 2036-6851-PF; Chentf 8 200538885

The substrate mark and the mask mark on U and a mask having a pattern formed on the substrate are photographed, and based on the above two marks, it is determined whether the substrate is an exposed person. 'Becoming an error message generating device' will be determined by the determining device. Is a negative signal of a non-exposure substrate 'and information of an unexposed processing area of the substrate that is determined as non-exposure is generated as an error message; and it becomes an exposure processing control device having the above-mentioned unexposed processing substrate. The number of substrates in a series is controlled to cause the unexposed processing area to perform the integration processing and exposure processing according to the error message generated by the error message generating device after the integration processing and exposure processing are completed. Such an exposure processing program uses the substrate information determined by the error message generating device to be non-exposed and the information related to the unexposed processing area of the substrate as the error message. Therefore, for the number of consecutive substrates, the above integrated processing and exposure are performed. After the processing is completed, when the substrate generating the error message is re-entered, according to the error message, integration processing and exposure processing are performed for the exposed area. [Effects of the Invention] In the present invention, for the substrate subjected to the integration processing and the exposure processing, since the integration processing and the exposure processing are performed only on the unexposed processing area of the substrate, the defective substrate can be reduced and the yield can be improved. [Embodiment] Next, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is an external view of an exposure apparatus of the present invention. 2036-6851-PF; Chentf 9 200538885 The exposure device 1 performs an exposure process on both sides of a substrate (workpiece) carried in, and discharges the substrate after the exposure process. As shown in FIG. 1, the exposure device 1 includes a surface exposure section 2 (2A), a back exposure section 2 (2B), a workpiece reversing section 3, a stocker 4, a control device 5, and an exposure status display 6 (6A , 6B) and integrated status display 7 (7A, 7B). The surface exposure section 2 (2A) performs exposure processing on one side of the substrate, and includes a substrate mounting machine 9 (9A) and a photomask 10 (IOA) having a pattern formed on the substrate. The inside exposure section 2 (2B) The other side of the substrate is subjected to an exposure process, and includes a substrate mounting machine 9 (9B) and a photomask 10 (10B) having a pattern formed on the substrate. The work reversing section 4 reverses the substrate subjected to the exposure processing by the surface exposure section 2A, and sends the substrate to the back exposure section 2B. The storage unit 4 is used to store a substrate that has been normally subjected to an exposure process. The control device 5 is used to control the front exposure section 2A, the back exposure section 2B φ, and the accumulation section 4. The exposure status display 6 (6 A, 6 B) is used to display information on a portion of the substrate that is an unexposed processing area, and is arranged on the surface exposure portion 2A and the inside exposure portion 2 B. The integrated status display 7 (7A, 7B) is used to display the image of the alignment marks (mask marks and substrate marks) on the integration position of the substrate and the mask 10 (10A, 10B) on the machine 9 (9A, 9B). 'It is also arranged in the front exposure part 2A and the back exposure part 2B. The ID (identification number) of the substrate is affixed near the substrate mark. 2036-6851-PF; Chentf 10 500538885 Next, the structure of the surface exposure section 2A and the back exposure section 2B will be described with reference to FIG. 2. Fig. 2 is a block diagram showing the structure of the surface exposure section 2a (the back exposure section 2B). In addition, since the surface exposure portion ^ has the same structure as the inside exposure portion 2B, the following description only describes the structure of the surface exposure portion ㈣. As shown in FIG. 2, the surface exposure section 2A 'includes a photographing device 20, a CCD driving device 21, an exposure device 22, a machine driving device 23, a vacuum pump 24, a vacuum system driving device 25, and a display screen output device 26. These components are controlled by the control device 5. The shirt device 20 is composed of a CCD camera, and outputs multi-valued data from an image captured by the CCD camera to the control device 5. In addition, four ccd cameras are provided corresponding to the four corners of a predetermined area of the substrate. The CCD driving device 21 is used to drive the photographing device 20 to move the CCD camera constituting the photographing device 20 in the up, down, left and right, and front and rear directions via a movement track 'above the table 9 on which the substrate is placed. The exposure device 22 is used to perform exposure processing on a substrate placed on the table 9. The exposure device 22 is composed of a light transmitting plate and a light irradiation mechanism (not shown). The light-transmitting plate set at the exposure position is composed of an acrylic plate, a quartz glass plate, or a synthetic quartz glass plate that transmits ultraviolet rays of a predetermined wavelength. A frame is provided on the periphery of the light-transmitting plate, and the side of the light-transmitting plate 9 A photomask 10 is mounted on the surface. The light irradiation mechanism includes a discharge lamp such as a projection arc light bulb that irradiates light with a predetermined wavelength of ultraviolet light, an elliptical reflector covering the discharge lamp from behind, and applies energy from the discharge lamp and the elliptical reflector to the irradiation surface. A fly-eye lens for equalization adjustment, and a plurality of mirrors that reflects the irradiation light from the fly-eye lens as parallel light to an exposure position. In addition, in order not to allow 2036-6851-PF; Chenf 11 200538885 to reach the predetermined double w existing area of the substrate from the light irradiation mechanism, a shielding plate for shielding is movably disposed above the light transmitting plate. The machine driving device 23 drives the machine 9 according to a control signal from the control device 5, so that the substrate on the machine 9 is integrated and moved to the integrated position of the photomask. The machine driving device 23 is provided on the machine 9 and includes a mechanism for moving a mounting plate (the upper part of the machine 9) on which the substrate is placed in the X direction of one of the horizontal directions ^ v ^ ^ X-direction moving section, a γ-direction moving section that supports the X-direction moving section to move the mounting plate in a γ direction that is orthogonal to the horizontal movement direction of the X-direction moving section, and supports the γ-direction蒋 移动 # At the same time, the 0-Seller direction moving portion that moves the mounting plate in the 0 direction in the direction around the vertical line. In addition, in order to bring the substrate into contact with the photomask 10, a Z-direction shift movement σ 卩 'is provided to move the vertical direction in the ζ direction to support the 0-direction moving portion. The vacuum pump 24 directly connects the substrate and the photomask 10, and vacuum-absorbs the substrate onto the mounting plate. That is, although there is no need to go to the garden-W wu Zhen M 24 includes a main vacuum pump that vacuum-adsorbs the front cover 10 of the light-transmitting plate and the substrate double J on the mounting plate, and in the loading and unloading position, Gan Shangzai When a substrate is placed on a mounting plate, a vacuum pump for a substrate that vacuum-absorbs the substrate on the mounting plate and holds the substrate. The vacuum pump driving device 25 is used to drive the vacuum pump ... Display screen output device 2 6 Sun 4th μ ^ Μ ia Bfl ^ ^ ^, X information and exposure processing related to the substrate area provided by the control device 5 1 ^ A ^ ^ ^ d, related Beixun, for example, output the exposure device mm ^ H f material to the exposed silk state display b. The position during the substrate transportation is η μ y ^, fork into the handle (not shown substrate handle mechanism), input conveyor (roller roller (roller U), etc.). Machine 9), discharge, batter surface output device 26 is based on photography 2036-6851-PF; Chentf 200538885 device 20 outputs to the control device

The position of the calibration mark is used as a calibration mark for the mask and the substrate (the mask is placed. The information detected by the image processing unit 33 is output to the mark position error calculation unit 34 and the distance calculation unit 35 between the marks. Private position The error calculation unit 34 calculates the integration distance of the position error of the calibration mark based on the position signal output from the image processing unit 33 (for example, the X direction and L of the center position of the mask & Mm and the center position of the substrate mark Wm). Deviation of the direction). The whole a distance calculated by the mark position error calculation unit 34 is output to the judgment unit 36 as the integrated distance information. The inter-mark distance calculation unit 35 calculates based on the position information output by the image processing unit 33. The distances (X direction, γ direction, and diagonal direction) between the substrate marks Wm provided at the four corners of the substrate are obtained. The distance calculated by the distance calculation unit 3 $ between the marks is output to the judgment unit 36 as distance information. The judging unit 36 (judgment device, error message generating device) is used to judge whether the integration distance calculated by the target position error calculation unit 34 is within the allowable range. The breaking section 36 judges whether the expansion and contraction error of the substrate is within the allowable range based on the distance between the substrate marks Wip calculated by the inter-mark distance calculating section 35. When the error exceeds the allowable range during the above determination, 2036 -6851-PF; centf 13 200538885 η is wrong. Fl heart and save the error message generated in the memory 32 2. Then,> ,,, and 3, the structure of the storage unit 4 is explained. Storage The structure of the part 4 is shown in Figures 3 (a) and 3 (magic). The storage part 4 includes: four circular pillars standing upright, and four top pillars fixed at the predetermined positions above and below, respectively. 42 and the bottom frame 43. One of the four pillars 41 is a transportation pillar 4U 'and has a transportation thread 44 on its surface. The other three pillars are the guide pillars with smooth surfaces. The top frame 42 Between the bottom frame 43 and the bottom frame 43, the guide rollers 45 carrying the substrate W are spaced apart from the top frame 42 by a predetermined interval, and are arranged in parallel with the top frame 42 and pass through the storage portion "on the top frame 42 and the bottom frame." Between 43, a plate-shaped bracket that accommodates defective substrates 46 penetrates the four pillars and is provided approximately parallel to the guide roller 45. As shown in FIG. 3, the bracket 46 has a hole portion 47 having a size from which the guide roller 45 can be drawn out. Around the hole portion 47 In the direction of travel of the substrate w, a stepped substrate carrier portion core is formed on both sides, and the substrate fixing P 48b extending from the -end (moving-out direction) of the substrate bearing _48a in the horizontal and vertical direction enters the hole 邛 47. The substrate ψ can be carried and fixed. Four corners of the bracket 46 are not provided with four through-holes 49 through which the pillars 41 pass. The through-holes 49 are engaged with the through-holes 49a of the conveying pillar 41a, and are provided with conveyance. The thread is screwed with the thread 44 of the support 41a. The brackets 46 are arranged in plural via the spacers 50 arranged on the pillar 41. As shown in FIG. 3 (a), the conveyance pillar 41a is connected to a carriage driving device 27 having gears and a motor. The carriage driving device 27 rotates the conveying pillar 41a and is screwed to the conveyance through the through hole 49a. The conveying screw 2036-6851-PF of the pillar 4la is used; the bracket 46 of the centf 14 200538885% and the document 44 moves on the conveying thread. The carriage driving device 27 is driven under the control of the control device 5. In the exposure apparatus 1 having the above-mentioned structure, the substrate of the exposure apparatus 1 is carried in, as shown in the figure, carried on a roller 8 (8A), and integrated with light | 10A on the machine 9A of the surface exposure section 2A ( After the calibration) process, a surface exposure process is performed, and it is transferred to the workpiece reversing section 3 and reversed. Then, it is transported on the roller 8B, and integrated with the photomask 10β on the machine table 里面 of the inner exposure section 2B, and then the inner exposure is performed, and it is carried out through the storage section 4 adjacent to the inner exposure section 2B to The outside of the device 1. On the other hand, when the defective substrate W is transferred to the guide roller 45 (refer to FIG. 3), the carriage driving device 27 is driven by the control of the control device 5, and the carriage 46 at a predetermined position is in contact with the guide roller. The carrier 45 is moved by screw conveyance at the same height position, and the defective substrate is recovered by the carriage 46 moved at the same height position as the guide roller 45, and the carriage 46 for recovering the defective substrate w is moved to a predetermined height. position. Next, each time the defective substrate is conveyed, the 0-bracket 46 is moved by screw conveyance, and the defective substrate w is sequentially recovered. In this manner, the defective substrates w carried out one after another are stored in the storage unit 4. Next, the operation of the control unit 31 of the control device 5 will be described with reference to Fig. 4. Fig. 4 is a flowchart showing the processing performed by the control unit M in the case where the exposure processing is performed on each of the areas in advance by dividing the substrate into a plurality of areas for exposure. At the start of the process, first, the exposure apparatus 1 receives a substrate from an input port (not shown) (step 401). In addition, as the number of substrates in a series of substrates, for example, 100 to 1,000 substrates are sequentially inserted. The inserted substrate is carried on roller 8 and 2036-6851-PF; Chenff 15 200538885 is placed on machine 9 i. The control unit 3 increments the input substrate number m with an initial value of 0 (+1 step), and writes the value into the memory 32 while writing the surface variable i = 1 and the area variable j = 1 into the memory. Body 32 (step 402). Here, the surface variable 1 = 1 is displayed on the surface of the substrate, and the surface variable i = 2 is displayed on the inside of the substrate. Further, in this embodiment, the substrate (rectangular) is divided into four regions of a field shape, corresponding to the four regions (region i to region 4), and the region variable j is set to j = 1 to 4. Next, the exposure device 1 moves the table 9 upward in the 2 direction by the table driving device 23 and abuts the substrate on the mask i 0 (step. In this state, the CCD driving device 21 makes the imaging device 2 〇4cC]) The camera slides on the track and takes pictures of the calibration marks (substrate mark- and mask mark Mm) at the four corners of area j. The calibration marks at the four corners of the shot are displayed on the integrated status display 7 as shown in FIG. 7. # Returning to the flowchart in FIG. 4 again, the mark position error of the control unit 31 is out of the P 34 / bayonet mask! The mask mark of 〇—the distance from the substrate mark _ * of the substrate (step 406). Next, it is judged whether or not the calibration condition is correct (step 407). The calibration conditions include, for example, a deviation in the X direction between the center position of the mask mark and the center position of the substrate mark Wm within a predetermined range, and a deviation in the γ direction of the center position of the force mask mm from the center position of the substrate mark · Within range. In addition, due to the absence of the calibration mark (substrate mark ffm), the formation of two positions, etc., when the position of the calibration mark cannot be identified, the calculation of the integration distance cannot be performed, and it is determined that the calibration conditions are abnormal. In step 407, when the calibration condition 敎 is normal, the exposure is 2036-685l.pF; centf 16 200538885. The device 1 performs exposure processing on the area and the field J by the exposure means 22 (step 408). . In addition, before the exposure process is performed, the cover J is brought into close contact with the substrate. That is, the space between the light-transmitting plate and the machine table 9 is mounted with a photomask 10 ❹0. The edge seal between the machine table 9 'is sucked by the vacuum pump 24 (main vacuum pump). In addition, a masking plate that shields #M, 、, and outer portions outside the region j of the substrate can be moved on the light-transmitting plate to shield the portion other than the region j. Missing start, τ Λ J 丨 knife, then, the light irradiation mechanism does the predetermined time

After the exposure ', the shielding plate is moved to the original position where the film is too A-cut, and the substrate and the photomask 10 are released from the vacuum state. 411). In the case where the surface variable is "2", "Brother, work", the substrate is discharged as a good product because the exposure processing on both sides has been completed (step 412). The β control unit 31 determines whether the input substrate number m has reached a predetermined value ( The number of pieces in a batch) (step 413). If the input substrate number m reaches a predetermined value (the number of wafers in a batch), after processing is completed, if not, it returns to step 401. After step 408, the control unit 31 writes a processing completion message indicating that the exposure of the area gj has been completed to the memory 32 (step 409), and determines whether the area variable j has reached the maximum value ⑷ (step 410) <) If the area variable reaches the maximum value (4) 'Because the exposure processing of the surface of the substrate is completed, the control section 31 then determines whether the surface variable is "2" (whether the substrate being processed is inside) (step one, step 411 In the case where the surface variable i is not "2" (1 = 1), the exposure device 1 transfers the substrate to the workpiece reversing section 3 for reversing processing (step 414), and sends the substrate to the inner exposure section 2β. Next, the control unit 31 writes the surface variable 1 = 2, the area variable j =; [writes to the memory 32 (step 415), and returns to step 404 in order to perform the exposure processing therein. In step 410, the area variable is When j does not reach the maximum value 2036-6851-PF / Chentf 17 200538885 Under 'In order to perform exposure processing on the next unexposed processing area, the control section 31 increments the area variable j (+1 step) and The value is written to the memory 32 (step 416), and returns to step 4 04. In the integration process of step 407, if it is determined that the calibration condition is abnormal, the ID (identification number) of the substrate and the unexposed processing area are obtained as the error message: On the surface (i = 1 ) Still inside (i = 2), area ·) · 疋, what is the reason for the error information (Is it possible to identify the calibration mark, etc.). The ID may be used as the input substrate number. In this case, the control unit 31 performs processing according to the flowchart shown in FIG. 5. That is, when the calibration conditions are abnormal, the control unit 31 increments (+1 step) the number of retry times R with an initial value of 0, and writes the value into the memory µ (step 501). Further, the number of retry attempts ^: R represents the number of trial adjustment steps 511) of the machine 9 described later. After step 501 ', the control unit 31 determines whether the number of retries q has reached the number of times (for example, three times) (step 5G2). When the number of retries R reaches a predetermined number (for example / time), the above-mentioned error message is written into the memory 32 (step 503). In step 50t), Γ "the manufacturing unit 31 judges whether the regional variable β has reached the maximum value ⑷ (step i is" 2 2:), and then 1 cross-sectional variable number is pretty high. Rabbit "is a substrate inside?" (Step 505). In the case that the good number 1 is 2 ”, the control unit ^ writes the information that it expects in the storage unit ^ as a storage message in order to reprocess the processing“ stored in the storage unit 4 times ” In the processing hidden body 32 shown in the step technique (the step is called and returns to one side) In step 505, in the case where the surface variable 1 is not "2" 2〇36-6851-PF; under Chentf 200538885 (i = 1 Case), the exposure device 1 transfers the substrate to the workpiece reversing unit 3 and performs the reversing process (step 508), and then sends the substrate to the inner exposure unit 2β. After that, the control unit 31 sets the surface variable i = 2 and the area variable. j = 1 is written into the memory 32 (step 509), and the process returns to step 404. In step 504, in the case where the regional variable j does not reach the maximum value (4), The exposure processing area performs exposure processing, and the control section 31 increments the area variable j (+1 step), and writes its value into the memory In the body 32 (step 510), the process returns to step 404 shown in Fig. 4. In step 502, when the number of retries R does not reach a predetermined number, the exposure device 1 makes the machine by the machine driving device 23. 9 moves downward in the 2 direction, and separates the substrate placed on the table 9 from the mask 10. Then, the exposure device 1 calculates the position error (integration distance) calculated by the mark position error calculation unit 34 using the machine. The stage driving device 23 adjusts the positions of the tables 9 and 9 in the center direction (step 5). Thereby, the mounting plate on which the substrate is placed on the ± side is moved by the X-direction moving portion and the γ-direction moving portion below the table 9 ... direction: The movement of the moving part 'moves to a new integration position in the horizontal direction. Next, it returns to the process of step 403 for calculating the integration distance again as shown in FIG. 4. Next, the control will be described with reference to FIG. Another embodiment of the operation of the control unit 31 of the device 5. This embodiment is an implementation type in which the entire area of the substrate is subjected to exposure processing. The substrate is divided into a plurality of (for example, four) areas. Figure 6 shows the garden for this situation A flowchart showing the processing performed by the control unit 31. When the processing is started, the f coupon 100 exposure device 1 receives a substrate from an input port (not shown) (step 601). The center of the input ▲ * Only the input substrate is on the roller It is carried on 8 and placed on the machine 2036-6851-PF; Chenf 19 200538885 • i on stage 9. At this time, the control unit 31 increments the substrate number Mayang with the initial value of Q (+1 step) And its value is written into the memory 32, the surface variable i = 1 is written into the memory 32 (step 6 0 2). Next, the exposure device 1 makes the machine 9 by the machine driving device 23. Move upward in 2 directions, and make the substrate abut on the mask 10 (step 603b. In this state, the CCD driving device 21 slides the four CCD cameras on the track, and stops at the predetermined positions of the four corners of the substrate. Next, the camera _ 20 is used to perform calibration on the calibration mark (step 605). The position calculation between markers 35 of the control unit 31 calculates the distance between the calibration markers (X direction, Y direction, diagonal direction) (step 606). The judging unit 36 judges whether or not the conditions for the calibration I 8 are normal (step 607). That is, judging the substrate mark

Whether the distance between Wm is within the predetermined range (normal). When the calibration mark condition is determined to be normal, the exposure apparatus 1 performs exposure processing on the entire substrate (step 608). Immediately after step 608, the control unit 31 writes the processing completion message of _exposure Ribbi on one side of the substrate to the human memory + (step_). Then, it is judged whether the surface variable 1 is "2" (whether the substrate being processed is inside) (step 61). When the surface variable is "2", the exposure device 1 ejects the substrate as a good print (step 61). The control unit 31 judges whether or not the number of input substrates has reached a predetermined value (the number of pieces in a batch) (step 6? 2). If the input substrate number reaches a predetermined value (the number of pieces in a batch), the processing is completed, and if it does not reach, the processing returns to step 601. On the other hand, in step 610, when the surface variable i is not "2", the exposure device 1 carries the substrate to the workpiece reversing section 3 and performs reversing processing 2036-685l-pp.chentf 200538885 section 2B. Next, the control unit 3 1 (step 61 4), in order to implement the inside (step 61 3), and sends the substrate to the inside for exposure and writes the surface variable i = 2 into the memory 32 (step exposure processing and returns to step 60). In step 6 07, the conditions of calibration 4 to T are determined to be abnormal.

Then proceed to step 601. That is, the “exposure setup 1 pair of substrates” performs exposure processing on the entire area of the substrate, and only performs integration processing and exposure processing on each of the divided areas for the areas where the calibration mark conditions of the entire substrate are not correct *. In this case, the 'exposure device 1 performs integration processing and exposure processing on each of the four areas (j = i ~ 4) that are distinguished. Therefore, the control unit 31 sets the area variable to 1 and writes it to the memory 32 (step 615). Then, the process proceeds to the process at step 404 shown in the first figure and the subsequent processes are performed. However, when the process proceeds from step 615 to step 404, when the process after step 404 is NO in step 413, the process proceeds to step 601, at the same time as step claw, and at step 6 above. In 6, the mark position calculation unit 35 of the control unit 31 may calculate the mask without the calculation of the distance between the calibration marks (the χ direction, the γ direction, and the diagonal direction) by the mark position error calculation unit 34. Integration distance between the mask mark Mm and the substrate mark of the substrate. In this case, the calibration conditions in step 607 include, for example, a deviation in the χ direction between the center position of the mask mark ^ and the center position of the substrate mark Wm within a predetermined range, and the center position of the mask mark Mm and the substrate mark Wm The deviation of the center position in the Y direction is within a predetermined range. As mentioned above, the case where integration processing and exposure processing are performed on the area divided by the substrate from the beginning (the processing shown in the flowcharts in FIGS. 4 and 5) is described. Implementation of 2036-6851-PF; Chentf 21 200538885 Type, and from the beginning, i.e., "exposing the entire area of the substrate as a premise, and performing integration processing and exposure processing on the divided small areas (the processing shown in the flowchart in Fig. 6 and the fourth and The flowchart shown in Fig. 5) is an implementation mode. In the above two implementation modes, although a substrate is thrown in, the exposure process is performed and discharged or expected to be stored in the storage unit 4, and then the next one is thrown in. Substrate, but the next substrate may be inserted when the exposure processing of the surface of the front-injector substrate is completed.

In the above two implementation modes, after the integration processing and the exposure processing are performed, the substrate having an unexposed processing area exists, and is stored in the storage section 4 by the carriage driving device 27 under the control of the control device 5. An error message is written into the memory 32 of the control device 5. An example of the error message written in the memory 32 is shown in FIG. In this example, the substrate number (the error message for the substrate is the surface area i is the unexposed process (xprint in the figure), and the other areas are exposed (printed in the figure)). During the integration process, the calibration The mark indicates correct identification (0K in the figure). In the integration process, 'Although calibration ^ indicates the correct identification, the judgment section 36 of the control device 5 determines that the integration distance exceeds the range of Guxu will produce an error message, And the area 1 on the surface will become the unexposed processing area. Similarly, the error message with the substrate number No 2 and the inside area 3 and the area 4 are unexposed processing, and the calibration mark is unrecognizable (ng in the figure), other The area is marked as exposed. In this integration process, the integration distance cannot be calculated due to the lack of calibration marks and other reasons. Therefore, an error occurs, and the area 3 and area 4 on the inside become unexposed processors. Also, the substrate The error message of No. N is that the surface area 2 and area 3 are unexposed 22 2036-6851-PF; Chentf 200538885 is light processed, and the area 2 inside is unexposed. The other areas are after the exposure process is completed, and the calibration mark indicates correct identification (0K in the figure). In this integration process, 'Although the calibration mark is correctly recognized, the integration distance exceeds the allowable range and an unexposed area is generated. Next, Referring to FIG. 9, description will be made on another implementation mode of the operation of the control unit 31 of the control device 5. This embodiment is to store in the storage unit after the integration processing and exposure processing of a batch (a series) of substrate pieces are completed. The substrate 4 (the substrate with the unexposed processing area) is put into the exposure device again. 帛 9 is a flowchart showing the processing performed by the control unit 31 in this state. Furthermore, it is stored in the storage unit in the order of removal. The substrates of 4 are put into the exposure device again in the order of carrying out (storage order). The method of transferring the substrates that have been put back to the substrate insertion line before the exposure device 1 is also possible: it can be transported together with the storage unit 4, The operator can take it out of the storage unit 4 and do it again. When the substrate is put in, the error message (step 9 01) is the surface or the inside. Why read.

The control device 31 reads in the memory 32. That is, with the error message, what kind of area is the unexposed processing area, and the error message is recorded as a pot: from ::: 31 will determine whether the calibration mark can be recognized at the time of the last error. Error (step 902). At the time of the last error time zone :: when the calibration mark is recognized (step 902, perform the calibration operation for the entire area of the centering plate (step 1)

The camera moves to the four corners of the substrate, and each P: 31 is taken to make the distance between the CCD marks in the X direction. It is calculated by calculating the calibration target γ direction and the diagonal direction. 2036-6851-PF; 23 200538885 Within a predetermined range (whether it is normal) (step and judge whether the distance between individual marks is in step 904). In step 904, when it is judged that: when the distance between the quasi-marks of the Huai 4 field A scoring technique is within a predetermined range (normal), the exposure device 1 performs a calibration operation on the area of the front rule—the wrong iron (step 905). ). That is, the control unit 31 takes the spleen rrn! 1Move the CCD camera to the four corners of this area of the substrate (j area of the blade) to take the calibration marks of each corner, and calculate the distance between the center of the substrate mark wm and the center of the mask mark ⑽ in the χ direction and ¥ direction. Call away to determine whether it is within the established range (whether it is normal) (step 906). If the integration distance between the substrate 'Z Wm and the mask mark is within a predetermined range (normal) (YES in step 906), the control unit 31 performs exposure processing in this area (step 9G7), and completes the processing indicating that the exposure processing is completed. The message is written into the memory 32 (step 908). Next, the control unit 31 refers to the error message to determine whether the substrate currently being processed includes an unexposed processing area (step 009). If there are other unexposed processing areas, return to step 905, and if there are no other unexposed processing areas, the substrate is discharged as a good product (step "0." Then, control P 31 determines whether there is any The processed substrate (whether the substrate to be inserted has been inserted) (step 9 11). If the substrate to be inserted has been inserted, the processing is completed, otherwise return to step 901 to process the next substrate. Also in step 906, When the integration distance between the substrate mark Wm and the mask mark Mm is not within a predetermined range (normal), the control unit 31 refers to an error message to determine whether the substrate currently being processed is included in the exposure processing area (step 912). Including other unexposed processing In the case of an area, return to step 905. If the other unexposed processing areas are not included, remove the substrate as a defective product 24 2036-6851-PF; centf 200538885 is discharged (step 913), and return to step 901. In step 904, when the distance between the calibration marks is abnormal (not normal), whoever touches it halfway Λ 隹 隹 隹 the processing of step 91 2 and uses the substrate as a mouth row In addition, in step g ^? ^ 良 口 口 跳 iSA 柘 入 #, the calibration mark could not be recognized when the error occurred, skip the integration process of the substrate royal body, and proceed to step 905. Area for integrated processing.

In addition, in the above step 903, the “marker position error calculating section 34 of the control section 31 may not calculate the distance between the calibration marks (χ direction, γ direction, diagonal direction)”, and the marker position error calculation section 34 may be used. The integration distance between the mask mark 5 μm of the mask 10 and the substrate marks at the four corners of the substrate is calculated. In this case, the judgment processing in step 904 judges that the calibration is normal. At this time, the calibration conditions include, for example, the deviation of the x direction of the center position of the plate mark h within the predetermined range, and the deviation of the γ direction of the center position of the mask mark Mm from the center position of the substrate mark Wm within the predetermined range. In the range. As described above, after the integration processing and the exposure processing for the number of substrates in a batch are completed, the substrate with the unexposed processing area stored in the storage unit 4 is again put into the exposure device 1, and only in the unexposed processing area Implementation of integration processing and exposure processing. Therefore, the control device 5 restores the substrate that was judged to be unexposed, and the yield can be improved. Next, the exposure status display 6 (6A, 6B) of the exposure apparatus 1 will be described with reference to Figs. 10 and 11. Figures 10 and Π are examples of the daylight display on the exposure status display 6. The example of the daytime surface shown in Fig. 10 shows any one of the positions during the substrate transportation in the processing process from the input to the discharge of the substrate. 2036-6851-PF; Chentf 25 200538885 See if there is a message on the substrate. . In order to display the position during the substrate transportation, the input handle position display area 丨 〇 丨, the input conveyor position display area 1 002, the exposure part fixed position display area ι〇03, and the discharge conveyor position display area 100 are set. 4. Put the handle position display area 005. As a result, the exposure status display 6 displays the position of the substrate where the substrate having the predetermined id (identification number) is currently processed, and it also indicates which area of the substrate is the unexposed processing area at that position. In this example, with the display of the exposure section fixed position 1003, the substrate with id No. 6 exists at the position of the exposure section fixed plate (machine 9). At the same time, the substrate is identified as the entire surface is exposed Finished, unprocessed inside. The example of the daylight surface shown in FIG. 11 shows only the information related to the substrate located on the plate in the exposure section. When the screen has an exposure processing area, a noticeable display area i i 0 丨, operation buttons i i 0 2 to 1104, and a substrate display area 1105 are provided. For example, through the display of the substrate display area 1105, it is recognized that a quarter of the surface of the substrate is not exposed, and the inside is completely exposed. As described above, in the exposure device of this embodiment type, the information and error messages related to the area of the substrate that is divided in advance are stored in the memory 32 of the control device 5, and according to the area of the substrate and the error message, the exposure can be performed in the exposure area. The status display 6 shows that the portion on the substrate is an unexposed processing area. Therefore, the first person can easily determine which area is unprocessed from the exposure status display 6 when the substrate (the substrate having the unexposed processing area) is incorrectly integrated and exposed. Although the above is a description of the implementation mode of the present invention, the present invention is not limited to 20 2036-6851-PF; Chentf 200538885 is not limited to the above implementation mode. For example, in the native mode, in the processing of the control unit 31 when the substrate is first pressed (筮 ^ s #) (Figures 4 to 6), the calibration is marked by the center of the mask Mm # w ^ A / 、 牛 ”τ u The deviation from the X direction or Y direction in the substrate mark Wn] is at the knee ~-The tu position is within the target range, but the calibration conditions can also be the shape of the substrate Dimensions, shape of 4 ^ Ma ^ Fengfeng Period, image sampling information such as calibration mark color, reflectance, distance from the edge of the substrate to the weight mark, vacuum during substrate adsorption (during transportation) Pressure value, etc.

Also, the calibration condition can also set a strict first condition and a looser second condition than the first condition. In this case, the exposure device 1 satisfies the first condition and performs the exposure processing accordingly. 'When the condition is not satisfied, determines whether the second condition is satisfied and then' If the second condition is satisfied, the exposure processing is performed. When the second condition is not satisfied, Is stored in the storage unit 4. In this way, when the so-called: exposure error occurs, the cause of the error can be specified. The reasons for this error include: contamination around the substrate substrate mark Wm on the substrate, foreign matter adhering to the mark, and bending recovery of the substrate (abnormal vacuum). Among them, in the case of If that is contaminated and foreign matter adhered, by removing the cause of the error, the exposure process can be performed normally when the substrate is put into the exposure device 1 again, so that the yield can be improved. [Brief Description of the Drawings] FIG. 1 is an external view of an exposure device of the present invention. Fig. 2 is a block diagram showing the structure of a surface exposure portion of the exposure apparatus of the present invention. Fig. 3 is a schematic diagram of a storage section. Fig. 3a is a structural diagram of a storage section. Figure 3b is a partially exploded perspective view of the storage section. 2036-685l.PP; chentf 27 200538885 FIG. 4 is a flowchart of a process performed by a control unit that performs exposure processing on each of a plurality of areas divided in advance by the substrate. Fig. 5 is a flowchart of processing performed by a control unit that performs exposure processing on each of a plurality of areas divided in advance by the substrate (continued from Fig. 4). Fig. 6 is a flowchart of a process performed by a control unit that collectively exposes the entire area of the substrate. Fig. 7 shows an example of a display day surface in which the positions of the mask mark and the substrate mark are combined. Figure 8 shows an example of error messages stored in memory. FIG. 9 is a flowchart of a process performed by the control unit when the substrate is reloaded. Fig. 10 shows one of the display screens of the processing stroke from the input to the discharge. Fig. 11 shows an example of the display screen of the exposure unit's fixed plate. [Explanation of symbols of main components] 1 ~ exposure device; 2B ~ inside exposure section; 4 ~ storage section; 6 ~ exposure status display; 8,11 ~ roller; 20 ~ photographing device; 22 ~ exposure means; 24 ~ vacuum pump; 27 ~ Carriage drive; 2A ~ Surface exposure unit; 3 ~ Workpiece reversing unit; 5 ~ Control unit; 7 ~ Integrated status display; 9 ~ Machine; 21 ~ CCD drive; 23 ~ Machine drive; 2 5 ~ Vacuum pump driving device · 26 ~ Display day-round wheel output device; 2036-6851-PF; Chentf 28 200538885 33 ~ Image processing section; 32 ~ Memory (memory device) 4 1 ~ Pillar, 34 ~ Mark position error calculation 41a ^ ^ Transportation struts; 35 to mark distance calculation unit 42 to top frame; 41b-41d to guide reference struts; 43 to bottom frame; 44 to thread; 45 to guide rollers; 46 to bracket; 4 7 to Hole portion; 48a '-substrate carrying portion; 48b--substrate fixing portion; 49 ~ through holes; 49a ~ through holes; 50 ~ spacers; 31 ~ control unit (exposure processing control device); 3 6 ~ judgment unit ( Judge device, error message Generating means);

2036-6851-PF; Chentf 29

Claims (1)

200538885 X. Patent application scope · An exposure device that implements integration processing and exposure processing in the entire area of the substrate or each of the pre-divided areas, including: a judging device that is formed on the substrate by a photographing device pair The substrate mark and the mask mark 5 on the mask with the pattern formed on the substrate have been photographed, and according to the two marks, it is determined whether the substrate is an exposed person; if you look at the memory device, it will be determined by the judgment device. Information of a non-exposed substrate, and information of an unexposed processing area of the substrate determined to be non-exposed, stored as an error message in the memory device; and an exposure processing control device having the above-mentioned unexposed For the substrates to be processed, when the integration process and the exposure process are completed and then re-entered, based on the error message memorized in the memory device, the unexposed processing area is controlled to implement the integration process and the exposure process. 2. The exposure device as described in item 1 of the scope of patent application, which further includes a preview display. According to the area of the pre-divided substrate stored in the memory device and the above-mentioned error message, that part of the display substrate is the above-mentioned Information on the exposure processing area. 3. An exposure method that implements integration processing and exposure processing in the entire area of the substrate or in each pre-divided area, including the following steps: A judgment step, which is formed on the substrate by a photographing device pair and has The substrate mark and the mask mark on the mask of the pattern of the substrate are used for photography, and according to the above two marks, it is determined whether the substrate is an exposed person; 2036-6851-PF; Chenf 30 200538885 A memory step will be performed by Xi Xi + ^ Field 4 The information of the substrate that was judged to be non-exposure at the step of 4 μM and the unexposed processing area of the substrate that was judged to be non-exposure are memorized as error messages; and the exposure processing control step, which has the above For unexposed substrates, for the number of substrates in a series, when the integration process and exposure process are completed and then re-entered, according to the memorized error message, control the unexposed processing area to implement the integration process and exposure process. . 4. An exposure processing program that implements integration processing and exposure processing in the entire area of the substrate or each of the areas that are pre-delineated, so that the computer has the following functions: Become a judgment device, formed by the photographing device pair The substrate mark and the mask mark on the substrate and the photomask having a pattern formed on the substrate are used for photography, and based on the two marks, it is determined whether the substrate is an exposed person; becoming an error message generating device, which will be determined by the determining device Information on a substrate determined to be non-exposed, and information on unexposed processing areas of the substrate determined to be non-exposed, as an error message; and becoming an exposure processing control device 'the substrate having the above-mentioned unexposed processing exists 'For a series of substrates, when the integration process and the exposure process are completed and then re-input, based on the error message generated by the error message generating device, control is performed to implement the integration process and the exposure process in the unexposed processing area. 2036-6851-PF; Chentf 31