201243357 六、發明說明： 【發明所屬之技術領域】 本發明係有關於-種檢測與分類裝置，尤指一種用於 檢測並分類發光元件的發光元件檢測與分類裝置。 【先前技術】 在半導體製程中，往往會因為一些無法避免的原因而 生成細小的微粒或缺陷，而隨著半導體製程中元件尺寸的 ==路密極度的不斷提高，這些極微小之缺陷或 體電路品質的影響也曰趨嚴重，因此為維持產品 半;==各:半導體製程的同時，亦須針 =造成這些缺陷之根本原因，之後才能二 驟：陷檢測方法’其包括下列步 續缺陷檢顺:析工作；;==本來進行後 ，大多係利用唬〆^仃缺陷檢測，一般而言 來偵測半導體晶粒上之台:大，掃描的方式， 缺陷個數多半相當大，因此在;務上二 =體晶粒上之 =行掃描式電子顯微鏡再檢測，因此Cl人工的 多半會先進行一人 ' 因此為了方便起見， ，抽樣取出 括由所偵測到的所有缺陷中 人工的方―缺陷類型，再讓工程師以 該些缺陷進行缺陷原因分析，‘:陷再檢測，以—步對 的方法。 戈出抑制或減少這些:缺陷201243357 VI. Description of the Invention: [Technical Field] The present invention relates to a detection and classification device, and more particularly to a light-emitting element detection and classification device for detecting and classifying a light-emitting element. [Prior Art] In the semiconductor manufacturing process, fine particles or defects are often generated for some unavoidable reasons, and these extremely small defects or bodies are constantly increasing as the size of the components in the semiconductor process is continuously increased. The influence of circuit quality is also becoming more and more serious. Therefore, in order to maintain the product half; == each: semiconductor process, it is also necessary to pin the root cause of these defects, and then the second step: the detection method of the trapping method Inspection: analysis work;; == After the original, most of them use 唬〆^仃 defect detection, generally to detect the semiconductor die on the platform: large, scanning method, the number of defects is quite large, so On the second = body grain = row scanning electron microscope re-detection, so most of the artificial Cl will be carried out first. 'For the sake of convenience, the sample is taken out of all the defects detected. The party--defect type, and then let the engineer analyze the cause of the defect with these defects, ': trap again, to step-by-step method. Ge out suppress or reduce these: defects
S 4/17 201243357 【發明内容】 本發明在於提供—種發統件檢顺分類. 用於檢測並分類發光二極體封裝晶片。 、、/、叮 本發明提供-種發光元件檢測與分類裝置， :用=輸送多個發光讀的旋轉單元、—檢測單^、及一 Μ早元。其中，旋轉單元包括至少 設ΐ於;Γ旋轉轉盤上的容置部、及多個上^ 個合置相的吸排氣兩用開口，其中每 發光元件中的至少—個，= 对為曰底口 p具有一正極焊替及—負極焊塾的發 極脱封裝晶片。檢測單元包括至少一鄰近 / 一 檢測每一個發先元件之檢_1^ f於 =:::類上述多個經過檢“ -極性對調單元、—檢測 極性測試皁元、 類單元。其中，旋轉單元包括至少二及-分 置於可旋轉轉盤上的容置部、及多個分另'多個設 容置部内的吸排氣兩用開口，並 t置於上述多個 性地容納上述多個發光元件中的固谷内可選擇 元件為一底部具有—正耦押拙 個，且母一個發光 體封裝晶片。極性列气單1及—負極焊塾的發光二極S 4/17 201243357 SUMMARY OF THE INVENTION The present invention is directed to providing a hairline inspection classification. It is used to detect and classify a light-emitting diode package wafer. The present invention provides a light-emitting element detecting and sorting apparatus: a rotating unit that transmits a plurality of light-emitting readings, a detecting unit, and a detecting unit. Wherein, the rotating unit comprises at least a receiving portion on the rotating turntable, and a plurality of upper and lower combined phases of the intake and exhaust openings, wherein at least one of each of the light-emitting elements, = a pair The bottom port p has a positive electrode soldering and a negative electrode soldering chip. The detecting unit comprises at least one adjacent/one detecting each of the first detecting elements in the =::: class of the above-mentioned plurality of tested "-polarity swapping units, detecting polarity testing soap elements, class units. The unit includes at least two and a receiving portion disposed on the rotatable turntable, and a plurality of intake and exhaust openings in the plurality of plurality of receiving portions, and t is disposed to accommodate the plurality of the plurality of openings The optional elements in the solid-gullar in the light-emitting element are a positive-coupling one at the bottom, and one illuminator-packed wafer of the parent-emitting body. The polar column 1 and the negative electrode of the negative electrode pad
1王叫5式早兀鄰近旋轉罩分甘H -單元包括至少兩個位於發光二極體封裝曰曰片、=性測試 檢測發光二極體封罗B y 曰曰片下方以用於 是否正確之焊塾極性檢㈣負極焊墊的位置 也針。極性對調單元包括-鄰近 5/17 201243357 ，试早凡且用於反轉發光二 對調正極與負極料 、—的位置以 元包括至少-鄰近旋^置之極性對調模組。檢測單 -峨高封 :轉單==與=元之間。表面檢查單元鄰近 發光二極體m晶片上方之包:至少-位於 包括5 W、一如^ 心止面〜像擷取疋件。分類單元 模租的轉早7°且用於分類上述多個經過檢測 分類2 件的檢查後的發光元件之 間。 中表面仏查早讀於檢測單元與分類單元之 ，盆發明所提供的發光元件檢測與分類裝置 人旋轉單元、檢測單元與分類單元，，的配 ::=:=r測與分類裝置可_測 閱以步瞭解本發明之特徵及技術内容，請參 供參考^ r明之詳細說明與附圖，然而所附圖式僅提 二…兄賴’並㈣來對本發明加以限制者。 I貫施方式】 产,>ΐΐίΓ圖1至圖5C所示’本發明提供一種發光元件 :單？，，置’ί包括：一用於輪送多個發光元件的旋 凡 仏測單元2、及一分類單元3。 先’配合圖1及圖2所示’旋轉單元1包括至少- σ疋轉盤η、多個設置於可旋轉轉盤η上的容置部u 及夕個刀別设置於上述多個容置部·12内的吸排氣兩用 幵口 13，其中每—個容置部12内可選擇性地容納上述多s 6/17. 201243357 個發光7C件令的至少一個 — 具有一正極烊塾C1及-負極^發光元件可為一底部 月C。舉例來說，上述多個 的發光二極體封裝晶 轉轉盤η的外周圍(如圖 σίΜ2可環繞地設置於可旋 產生-朝外的·，而每=以使得每-個容置部ι2 通過=個朝外•而進八每晶内片C則可 另外，本翻的發# μ# 12内。 括：-承载單元4及一輸送單，，與分類裝置更進-步包 一承载底盤4〇，且可旋 Ζ。承载單Μ包括至少 。輸送單元5包括至少一設置於承載底㈣上 以依序對應每—個容置部早元】且依據不同時序 母—個發光二極體封裳 队讀。舉例來說， ”可透過多個螺絲(圖未示)而鎖固：二二。可旋轉轉盤 過可旋轉轉般】〗AA 、 殍栽底盤40上，且透 裝晶片c進行順時針功能來將每—個發光二極體封 傳送。 叫針方向(如圖〗中箭頭所指示的方向）的 -鄰轉ST 1及圖3A所示，檢測單元2包括至少 用於檢測每一個發光元物 個檢測模組本發明亦可同時使用多 體封裂晶片c 欢’、'昇組20包括-位於發光二極 電源之供電元件2=:供給發光ί極體封裝晶片C所需 以判斷每m _位=發光一極體封裝晶片c上方 封穿曰片c "—極體封裝晶片c為發亮的發光二極體 件光二極體封裝晶片C，，之檢測元 ί、私凡件20A可為兩個分別供應正電 7/17 201243357 源與負極源的供電接腳200A，且檢測元件2〇β :判斷每—個發光二極體封裝晶^是否被點糾光« σσ 其卜關於檢測模組20的檢測方式，配合圖3Α至圖 封^示檢聰組2G錢顺，發光二極體 封L曰片c谷置於旋轉單元】的容置部u内且位於供電 凡=〇/的上方。圖3B顯示檢測模組20在檢測中，供電 的兩個供電接腳應一同向上移動(如圖财 向上的前頭所示的方向)且穿過承載底盤40的開口 4〇〇， 個供電接腳2〇〇A分別電性接觸發光二極體封裝 二片c，正^墊α與負極焊塾C2。此時，當發光二極 二時’則判斷此發光二極體封裝晶片C為 -=發先主二極體封裳晶片c，，而當發光二極體封裝晶 免時’則判斷此發光二極體封裝晶片C為-非發 光^體封裂晶片c，，。圖3C顯示檢測模組如在 =，件2,個供電接腳_ -同向下移 20A 丨肖下的箭頭所示的方向），以使得供電元件 2〇A回復到原來圖3八所顯示的位置。 轉軍再^ ’配合圖1所示，分類單元3包括至少一鄰近旋 料疋此且用於分類上述多個經過檢測模組20檢測後的 =分類模組30。此外，分類模組％包括至少一 接收母—個發亮的發光二極體封裝晶片C,之第一通 i丁 及至少—用於接收每一個非發亮的發光二極體封 ί = 般來說，當每-個發亮的 亮的發光二極體封裝aam 口遍後，每一個發 衣曰曰乃L將依序被安置於一捲帶T的包s 8/17 201243357 裝槽丁】内，以進行後續的包裝程序。當每一 發光二極體封裝晶片c，，通過第二通行部3〇b後，二:的 非發亮的發光二極體封裝晶片c,將被收集起來，’:個 後續的相關處理程序。 '^仃 另外，配合圖1及圖4A所示，本發 ，分類裝置更進-步包括:-極性測試單元“： 试=6鄰近輸送單元5與旋轉單元】，其令極性測 疋6包括至少兩個位於發光二極體封裝晶片c 極:封裝晶片c的正極焊墊c】與 ; 的位置疋否正確之焊墊極性檢測探針6Q。 - 至少兩個焊墊極性檢測探針60可 未况，上述 :觸;:當上述至少兩個焊塾極性檢測探二電 ,^, 电l疋舍逋過發先二極體封梦曰H r 知發光二極體封裝晶片了日片C ’以得 兩者的位置是倾置正錢是_；^；1與貞極焊塾c2 二極體封裝晶片C容置於旋轉；6/檢測前’發先 於極性測試單元6的上方 凡的容置部12内且位 檢測中，極性測試單元6的^:顯示極性測試單元6在 同向上移動(如圖4B中向上的1 焊塾極性檢測探針60 -栽底盤40的開口 _ 卜則頭所示的方向)且穿過承 分別電性接觸 發光二極體^焊墊極性檢測探針⑼ _墊匸2。此時，當發 曰曰c.的正極焊塾α與負 而發亮時，則判斷此發有電流通過 粗封裝晶片C的正極焊墊 9/17 201243357 ' ci與負極焊墊C2處於正確的位 晶片C沒有電流通過而务 當發先一極體封裝 肤曰Η Γ认T 儿可則判斷此發光二極體封 裝a曰片C的正極焊墊C1與負極焊 喊 顛倒)的位置。圖4C顯示極性測 ^不霍(互相 測試單元6的兩個焊塾極性檢測探針後’極性 圖扣中向下的箭頭所示的方向），以使如 回復到原來圖4A所顯示的位置。1付"从早疋6 另外’配合圖1、及圖5a 光元件檢測與分類裝置更進—純括：=性發 =性Γ調單元7包括-鄰近極性測試單元」用3轉 兔光一極體封裝晶片C的/fr罢、》轉 焊墊C2的位¥ L對調正極焊塾C1與負極 ]+性對調模'组70。極性對調模組70包括 及;成形在極性對調總 。、1+ 連通至另外一容置部^之迴轉通道70Β r當極性測試單元6檢測到發光二極體封裝晶片 位置r=ci與負極焊塾C2處於不正確(互相颠倒)的 體鮮H —站的極性對調單元7來旋轉發光二極 二以使得發光二極體縣晶片C的正極谭塾 C1與負極焊墊C2處於正確的位置。 舉，來S兑，當正極谭塾C1與負極焊塾C2的位置 7目二^的發光二極體封裝晶片c被傳送到極性對調單元 本口圖5A所示）’透過其中一個吸排氣兩用開口】3將 體封裝晶片C從其卜容置部12吹入迴轉通道1 King called 5 type early 兀 兀 旋转 H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H The polarity of the soldering 检 (4) The position of the negative electrode pad is also pin. The polarity reversal unit includes - adjacent to 5/17 201243357, which is used to reverse the illuminating two-position positive and negative materials, and the position of the element includes at least - adjacent polarity switching module. Test order - 峨 high seal: transfer order == and = yuan. The surface inspection unit is adjacent to the package above the LED of the light-emitting diode m: at least - located at 5 W, such as a stop surface - like a pick-up element. The classification unit is 7° earlier than the model rent and is used to classify the light-emitting elements after inspection of the above-mentioned plurality of tested and classified 2 pieces. The middle surface inspection is performed early on the detection unit and the classification unit, and the light-emitting element detection and classification device provided by the basin invention is a human rotation unit, a detection unit and a classification unit, and the matching::=:=r measurement and classification device can be _ The features and technical contents of the present invention are described in the following paragraphs, and the detailed description and drawings of the present invention are hereby incorporated by reference. I. PRODUCTION, > ΐΐίΓ shown in Figures 1 to 5C The present invention provides a light-emitting element: single? The setting includes: an arc detecting unit 2 for rotating a plurality of light emitting elements, and a sorting unit 3. First, the 'rotating unit 1 shown in FIG. 1 and FIG. 2 includes at least a σ 疋 turntable η, a plurality of accommodating portions u provided on the rotatable turntable η, and a plurality of shims are disposed in the plurality of accommodating portions. The intake and exhaust dual-purpose port 13 in the 12, wherein each of the accommodating portions 12 can selectively accommodate at least one of the above-mentioned multiple s 6/17. 201243357 illuminating 7C pieces - having an positive electrode C1 and - The negative electrode ^ illuminating element can be a bottom month C. For example, the outer circumferences of the plurality of light-emitting diode package crystal turntables η (as shown in FIG. σίΜ2 may be circumferentially disposed on the spin-producing-outward side, and each of the=-- each of the accommodating parts Ι2 through = one outwards • into the eight crystals inside the film C can be additionally, the turn of the hair # μ # 12. Including: - the carrying unit 4 and a delivery sheet, and the classification device is more advanced - step one Carrying the chassis 4〇, and can be rotated. The carrying unit includes at least. The conveying unit 5 includes at least one disposed on the carrying bottom (4) to sequentially correspond to each of the receiving parts, and according to different timings, the light-emitting two For example, "It can be locked by a plurality of screws (not shown): 22. Rotating turntable can be rotated and rotated] AA, 殍 底 chassis 40, and translucent The wafer c performs a clockwise function to transfer each of the light-emitting diode packages. The direction of the needle (as indicated by the arrow in the figure) is adjacent to ST 1 and FIG. 3A, and the detecting unit 2 includes at least In the detection of each illuminating element detecting module, the present invention can also simultaneously use a multi-body sealing chip c hua ', ' 升 group 20 Including - the power supply element 2 of the light-emitting two-pole power supply is required to supply the light-emitting body package wafer C to determine that every m _ bit = the light-emitting one-pole package wafer c is over the crust plate c " - the polar package wafer c is a light-emitting diode photodiode package wafer C, and the detection element ί, the private component 20A can be two power supply pins 200A respectively supplying positive and negative 7/17 201243357 source and negative source, and Detecting element 2 〇β: determining whether each of the light-emitting diode package crystals is spot-corrected « σσ 其 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 , , , , , The light-emitting diode package L-cutter c valley is placed in the accommodating portion u of the rotating unit and located above the power supply 〇=〇/. FIG. 3B shows that the detecting module 20 is in the detection, the two power supply pins of the power supply should be Moving upward together (in the direction shown in the front of the financial direction) and passing through the opening 4 of the carrying chassis 40, the power supply pins 2〇〇A are electrically contacted with the two pieces of the LED package, respectively. Pad α and negative electrode pad C2. At this time, when the light-emitting diode is two, it is judged that the light-emitting diode package wafer C is -= The precursor diode is used to seal the wafer c, and when the LED package is free, it is judged that the LED package C is a non-emissive wafer c, and FIG. 3C shows the detection. The module is in the direction indicated by the arrow, the power supply pin _ - the downward direction of the arrow 20A, so that the power supply element 2 〇 A returns to the position shown in the original Figure 3-8. As shown in FIG. 1, the classification unit 3 includes at least one adjacent spinner and is used to classify the plurality of sorting modules 30 that have been detected by the detecting module 20. Further, the sorting module % includes at least one Receiving a mother-lighted LED package C, the first pass and at least - for receiving each non-bright LED package ί = generally, when each shines After the light-emitting diode package aam mouth, each hairpin will be placed in a roll of T package s 8/17 201243357 for subsequent packaging procedures. . When each of the light-emitting diode packages the wafer c, after passing through the second pass portion 3〇b, the two non-bright light-emitting diode package wafers c will be collected, ': a subsequent related processing program . In addition, as shown in FIG. 1 and FIG. 4A, in the present invention, the classification device further includes: - a polarity test unit ": test = 6 adjacent transport unit 5 and a rotary unit", which causes the polarity test 6 to include At least two of the positive polarity pads c of the packaged wafer c are: the correct position of the pad polarity detection probe 6Q. - at least two pad polarity detection probes 60 Unexpectedly, the above: touch;: When at least two of the above-mentioned soldering poles are detected to detect the second power, ^, the electric 疋 逋 逋 逋 先 先 先 先 先 曰 r r r 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光'The position of both is the dumping of the positive money is _; ^; 1 and the bungee soldering c2 diode package C is placed in the rotation; 6 / before the test 'before the polarity test unit 6 above In the position detection of the accommodating portion 12, the display polarity detecting unit 6 of the polarity testing unit 6 moves in the same direction (as shown in FIG. 4B, the upward direction of the welding polarity detecting probe 60 - the opening of the chassis 40) Then the direction shown in the head) and through the respective electrical contact light-emitting diodes ^ pad polarity detection probe (9) _ pad 2. At this time, when the hairpin When the positive electrode tab α of the c.c. is negative and bright, it is judged that the positive electrode pad 9/17 201243357' ci and the negative electrode pad C2 are in the correct position. And when the first pole package is used, the position of the positive electrode pad C1 and the negative electrode of the LED package can be judged to be reversed. Figure 4C shows the polarity measurement. Huo (the direction of the downward arrow in the polarity of the two soldering polarity detection probes of the mutual test unit 6), so as to return to the position shown in the original Figure 4A. 1 pay "疋6 In addition, 'in conjunction with Figure 1 and Figure 5a, the optical component detection and classification device is further advanced - pure: = sexuality = sexual modulation unit 7 includes - adjacent polarity test unit" with three-turn rabbit light-pole package wafer C /fr, "Transfer pad C2 bit ¥ L to adjust the positive electrode welding C1 and negative electrode] + sex to mode adjustment 'group 70. The polarity matching module 70 includes and is formed in a polarity-to-polarity total. 1+ is connected to the other of the accommodating portions of the slewing channel 70 Β r when the polarity testing unit 6 detects that the illuminating diode package wafer position r=ci and the negative electrode pad C2 are in an incorrect (inverted) body H The polarity matching unit 7 of the station rotates the light-emitting diodes 2 so that the positive electrode C1 and the negative electrode C2 of the LED chip C of the light-emitting diode are in the correct position. Lifting, to S, when the positive Tan 塾 C1 and the negative electrode 塾 C2 position 7 目 2 ^ LED package wafer c is transferred to the polarity swap unit port shown in Figure 5A) 'through one of the suction and exhaust The dual-purpose opening 3 is used to blow the body package wafer C from the bubbling portion 12 into the revolving channel
S 離開：:二，5B.所示)内。當發光二極體封裝晶片C 主二处八中一谷置部】2後，可旋轉轉盤】I即可預備順 0-知轉或直接進行順時針旋轉。當發光二極體封裳晶片 i〇/J7 201243357 卜一，12時，則由另外-個吸排氣兩用開Π 二裝晶片c從迴轉通道观吸入另ΓS leaves: 2, 5B. When the light-emitting diode package wafer C is in the middle of the eight-in-one valley portion 2, the turntable can be rotated to perform a clockwise rotation or a direct clockwise rotation. When the light-emitting diode is sealed, the wafer is i〇/J7 201243357, and at 12 o'clock, it is opened by another-intake and exhaust. The second package c is sucked from the rotary passage.
的正極焊塾α與負極焊墊C2 極d衣曰曰片C 再者，咖與圖6所：位太:可被調換過來。 與嶋置更進一步包括:一表面檢發=測 =3™模組2。與分類二間= :包括至少―位於發光二極體封裝晶片^ 影像娜场⑽。舉例來說，當位於容置部12 二極體封裝W C經過檢解元2的檢測後 裝晶片c可透過可旋轉轉盤11的帶動而傳送 像擷取元件δ〇的下方(如圖6所示），以進行發光 &㈣晶片C上表面的影像概。換言之，本發明可 影像擷取元件8_如數位相機)來得到發光二極 Ϊ元C ί表面的影像訊。因此，透過正面影像擷 2件80的使用，以篩選出具有正確上表面影像資訊的 1先二極體封裝晶片C。 τ'上所述’本發明所提供的發光元件檢測與分類裝置 2至少可透過“旋轉單元、檢測單元與分類單元，，的配 :、以使侍本發明的發光元件檢測與分類裝置可用於檢測 亚为類發光二極體封裝晶片。 以上所述僅為本發明之較佳可行實施例，非因此偏限 毛月之專利範圍，故舉凡運用本發明說明書及圖式内容 所為之等效技術變化，均包含於本發明之範圍内。 【圖式簡單說明】 - 圖1為本發明發光元件制與分類m視示意圖； Π/17 201243357 圖2為本發明發光元件檢測與分喊_旋轉單元的立 體示意圖； 圖3A為本發明檢測單^來檢測競二極體 的側視剖面示意圖； x 圖3B為本發明檢卿元料檢·光二極 的側視剖面示意圖； 裝B日片時 圖3C為本發明檢解元用來檢測發光二極體封 的側視剖面示意圖； 、 圖4A ^本發明極性測試單元用來檢測 片前的側視剖面示意圖； 姐封褒 圖4B為本發明極性測試單元用來檢測發光 片時的側視剖面示意圖； 圖4C為本發明極性測試單元用來檢測發光 片後的側視剖面示意圖； 片前 片後 B曰 •极體封裝 aa ‘極體封裝晶 圖5A為本發明發光二極體 上視示意圖； 封裝晶片被吹入迴轉通道前的Positive electrode welding 塾α and negative electrode pad C2 pole d 曰曰 曰曰 C Further, coffee and Figure 6: bit too: can be exchanged. Further with the device: a surface inspection = measurement = 3TM module 2. Between the two categories = : including at least "in the LED package wafer ^ image field (10). For example, when the second package WC of the accommodating portion 12 passes the detection of the detecting element 2, the loaded wafer c can be transported through the rotatable turntable 11 to be conveyed under the image capturing element δ〇 (as shown in FIG. 6). ) to perform illumination & (4) image overview of the upper surface of the wafer C. In other words, the present invention can image capture component 8_ such as a digital camera to obtain an image of the surface of the light-emitting diode C ί. Therefore, through the use of the front image 撷 2 pieces 80, a first diode package wafer C having the correct upper surface image information is screened out. The light-emitting element detecting and sorting device 2 provided by the present invention is at least permeable to the "rotating unit, detecting unit and sorting unit", so that the light-emitting element detecting and sorting device of the present invention can be used for Detecting a sub-light-emitting diode package wafer. The above description is only a preferred embodiment of the present invention, and thus is not limited to the patent range of Maoyue, so the equivalent technology using the specification and the content of the present invention is used. The present invention is included in the scope of the present invention. [Fig. 1 is a schematic view showing the manufacture and classification of light-emitting elements according to the present invention; Π/17 201243357 Figure 2 is a light-emitting element detecting and shouting_rotating unit of the present invention 3A is a side cross-sectional view of the detection unit of the present invention; x FIG. 3B is a side cross-sectional view of the inspection material and photodiode of the present invention; 3C is a side cross-sectional view of the detecting element used for detecting the light emitting diode package; FIG. 4A is a schematic side view of the front side of the present invention for detecting the front view of the light; FIG. 4C is a side cross-sectional view of the polar test unit used for detecting the illuminating sheet according to the present invention; FIG. 4C is a side cross-sectional view of the polar test unit for detecting the illuminating sheet; Body package crystal Figure 5A is a schematic top view of the light emitting diode of the present invention; before the package wafer is blown into the rotary channel
圖5B 光二極體封裝晶片被吹入迴轉通道後的 圖5C為本刺發光二鋪 視示意圖；以及 裝β曰片離開迴轉通道後的上 6為tr表面檢查單元用來檢測發光二極， 上表面的側視剖面示意圖。 【主要元件符號說明】 旋轉單元 I π . 轉轉盤 容置部 °及挪氣兩用開口 圖 :體封裝晶片 11 12 13 s 12/17 201243357 檢測單元 2 檢測模組 20 供電元件 20A 供電接腳 200A 檢測元件 20B 分類單元 3 分類模組 30 第一通行部 30A 弟一通行部 30B 承載早兀 4 承載底盤 40 開口 400 輸达早兀 5 輸送元件 50 極性測試單元 6 焊墊極性檢測探針 60 極性對調單元 7 極性對調模組 70 極性對調底座 70A 迴轉通道 70B 表面檢查單元 8 正面影像擷取元件 80 捲帶 T 包裝槽 T1 發光二極體封裝晶片 C 正極焊塾 C1 負極焊墊 C2 發亮的發光二極體封裝晶片 C ’ 非發亮的發光二極體封裝晶片 C” 13/17FIG. 5C is a schematic view of the light-emitting diode after the optical diode package wafer is blown into the rotary channel; and the upper 6 is a tr surface inspection unit for detecting the light-emitting diode after the β-chip is separated from the rotary channel. A schematic side view of the surface. [Description of main component symbols] Rotating unit I π. Turntable housing part ° and air-moving dual-purpose opening diagram: Body package wafer 11 12 13 s 12/17 201243357 Detection unit 2 Detection module 20 Power supply component 20A Power supply pin 200A detection element 20B classification unit 3 classification module 30 first passage part 30A first passage part 30B carrying early stage 4 carrying chassis 40 opening 400 transmission early 5 conveying element 50 polarity test unit 6 pad polarity detecting probe 60 polarity Alignment unit 7 Polarity adjustment module 70 Polarity adjustment base 70A Swivel channel 70B Surface inspection unit 8 Front image capture component 80 Tape T Tray T1 Light-emitting diode package wafer C Positive electrode 塾 C1 Negative pad C2 Bright illuminating Diode package wafer C 'non-bright LED package wafer C" 13/17