TW201240185A - Display device manufacturing apparatus, display device manufacturing method, and display device - Google Patents

Abstract

An object of the invention is to provide a display device manufacturing apparatus, a display device manufacturing method and a display device which offer favorable throughput, are capable of temporarily storing a provisionally sealed body of the display device in a state that is exposed to the atmosphere, and yield a display device finished product having any of a variety of layered structures depend on the performance requirements. A first sealing film is formed on the surface of an organic EL element by a first sealing film forming device 27, thus yielding a provisionally sealed body. The provisionally sealed body is removed by an LL28 from a reduced pressure space to a provisionally sealed body storage section 29 in an atmospheric pressure space. Provisionally sealed bodies, having been temporarily stored in the provisionally sealed body storage section 29 with moisture permeation resistance maintained by the first sealing film, are then conveyed to each of the SiN film forming devices 30 in each second sealing film forming section 6 by a conveying device with predetermined timing. A second sealing film is formed on the provisionally sealed bodies within each of the SiN film forming devices 30.

Description

201240185 VI. Description of the invention: [Technical field to which the invention pertains] [0001] (4) The display device k device, the display device manufacturing method, and the display device of the sealing film of the lion-forming wire-tight component. [Prior Art] In recent years, we have developed an organic component such as electroluminescence (muscle; for use as a display part. The organic EL power is smaller than that of a cathode ray tube, and has self-luminous characteristics. Make basin [0003]

Intrusion display parts are very afraid of moisture, and the degree of damage is reduced from the defect area of the part, and a non-light-emitting area called a dark spot is formed to form a sealing film having moisture permeability resistance (hereinafter, organic EL i organic EL organic The surface of the part is formed with a sealing film, and it is called (4) =====. The structure of the material is [innocent technical literature] / [patent literature] [0004] 曰本特开平10 — 312883号 曰本特开平4 — Japanese Patent Publication No. 267097 (Patent Document 1) Patent Document 2 Patent Document 3 [Summary of the Invention] 8 201240185 [Problems to be Solved by the Invention] [0005] However, in order to ensure sufficient resistance of the organic EL element Thirsty, the sealing film covering the particles adhering to the surface of the substrate has a defect portion which is required to be inferior, and moisture may invade from the defect portion. "The layer is formed to evaluate the resistance of the organic EL element. Moisture permeability, and whoever conducts environmental experiments, but in order to pass the environmental test., (4) (emical Vapor Deposition > 40 minutes or so, even if it is taught that the door is formed into a film, it must be manufactured. The purpose is to provide a display element in the display element that is exposed to a large size; and to provide a display of various film structures capable of manufacturing the process. The display element of the present invention is sufficient for achieving excellent output [Technical means for solving the problem] [0007] The display element of the present invention has a sealing film 2 for the display part formed on the display part Sealing = package r;, sealing medium; two = reducing parts, forming a first sealing film; second, i, forming a second sealing film on the surface film of the 3H display part; The first sealing member that has been formed conveys the display film forming mechanism in which the first sealing film is formed from the first sealing film # to the storage mechanism; and the second moving device 1240185 is operated by the storage mechanism The storage of the second sealing film is formed _. ·^・・・・・・^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ .materials, f pieces of 彳, material 1 sealing film forming mechanism to carry the sealing film open ^ (four). v handling steps ' Carrying the wire-showing parts to the second dense track into the lining, and the sealing mechanism into a poorly-formed mechanism, the display of the moving parts is displayed in the seal, and the second is in the seal shape [_ The second sealing film is formed on the film of the material 1 (10). The characteristic member of the invention is characterized by: the manufacturing method of the above-mentioned component [cf. the effect of the prior art] [0010] temporary sealing body (below) It is called temporary ^ display, and the parts are temporarily stored, and in response to the display I, the large rolling air film. Even in the job of the wealth of each fresh 2 seal, ηί directly depends on the Wei face Lin, riding before riding 35 Sealing the film on the shore to form a film, you can improve the output of reading. [Numpressed embodiment of the invention] [Embodiment] [Best Mode for Carrying Out the Invention] [0012] The present invention will be described in detail with reference to the embodiments of the present invention. The handle of the stalk can be used to reduce the moisture permeability of the stencil on the __, surface. 8 201240185 2 ΐ, to form a thin piece of the first sealing film ^if if 2 ^, the material and layer structure of the sealing film and the second sealing film (single and then, the surface of the i-blocking substrate and the temporary sealing body can be joined. After the second dense film, the second =? The surface of the sealing film on the first sealing film of the sealing body. The α-body 卩1^ substrate hunter adhesive layer is bonded to the second dense layer [0013], but the display part is composed of mechanical materials. , showing the positive of the part;; ^ the chemical reaction of the order, more good resistance to penetration) wet = look at the ^ and consist of painful materials. (10) The film and the second film are formed by the upper layer 2; the hydrocarbon film is composed of the physical vapor (10): pf by the plasma CVI)

It is formed; the Ai film and the _3 film system are made of Lai Gua (10) and the thickness of X is sufficient. In other words, as long as it is not made of a material that is resistant to moisture, it is temporarily protected from titanium in a large space. The thickness of the field. The thickness of the second sealing film can be appropriately set depending on the desired moisture permeability resistance and the like. In the case where the second sealing film is formed by (10) in accordance with the use of the first sealing film, the sealing property can be removed by the moisture of the surface of the first sealing film. The adhesion between the sealing film and the 苐2 surface is improved, and the mechanism can be improved [0015], and the film is temporarily sealed to obtain a temporary sealing body; the device is taken out; the first sealing film stored is formed by the wheeling mechanism. The seal is separated in the film forming portion. The display element material seals the shaft seal portion 2 of the sealing film portion. In this case, a plurality of second sealing layers of the same type of second sealing film may be formed; and the opening sealing body storage portion is transported to the side-by-side body in a straight line connection. When there are a plurality of EL elements & mei and yushu trees, there are [0017] [implementation 1] ιοί "^ΤΖΊί EL ^ map. FIG. 2 is a schematic diagram illustrating the manufacturing method of the NF-turned rn in the organic EL element 1 [; [in the glass (Indium Tin Oxide; πό) film, for example, an indium tin oxide layer and a cathode layer 12g of the anode layer mountain and the stacked light-emitting sealing film 14 are sealed. Here, the first sealing film 13 and the second sealing film 13 are provided with the first sealing film 13 and the organic EL component 12 from the case where the second sealing layer 13 and the second sealing layer 13 are formed by the second single layer structure. The viewpoint of producing a chemical reaction 201240185 The second poor composition. Examples of the inorganic material include (10), s, and the like. Etc. sin, leaks and other inorganic materials, and carbonized nitrogen, materials. ΐ ΐ 耐 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The layer is the fifth layer of the green light-emitting layer 12/, the j=12c, and the fourth layer is the red light-emitting layer 12d, the first! In the case of the first layer 11a, the glass substrate of the first layer 11a is formed by the silver and the silver, the Shao, the alloy, the _Lu alloy or the [0019], and the organic EL element 101. ^2Α, in the formation of an anode in the formation of the tree layer 1Ia ^ zero (four) after the word 2β, formed; Γ 3. In this case, the thickness of the first sealing film 13 is taken as the thickness of the first sealing film 13, and the thickness of the sealing body 102 is formed to have a thickness which is resistant to moisture permeability. That is, when t is temporarily kept, it can be confirmed.

Degree can be. The material of the film can be made to absorb moisture and deteriorate due to the atmosphere. Set the appropriate thickness. As in the case of this embodiment, the time for temporary storage is the same as that of the time. # = Temporary storage for 24 hours, left two = 3 for no material, ie SiN [0021] 7 for the sigh is 50~5 〇〇 . On the other hand, as shown in Fig. 2C, the first sealing film forming the second dense body (10) is called the organic EL element 101. The second seal 9 [0022] 201240185 The valve is made to be resistant to moisture permeability. The structure of the manufacturing apparatus 2 is a transporting device 2 in which the glass substrate η is conveyed. , vacuum chamber (to make device 25, TM26, j-th dense_2, #下=TM) 24, electrode-shaped storage portion 29, and three second poor seals 27, (10) and temporary sealing film device device magic The TM24 and the portion 6 are composed of the loader 21, the LL22, and the 27, and the temporary sealing body forming portion is #2, T = the first sealing film forming device LL62, and the second sealing film "including: the loader 61 and the SiN. An example of the formation of the SiN film of the film is by the plasma (10) method ^ ^ UIml SiN 〇 shape is not limited to the film of the 6 (10) film. 〇 21, LL22, film forming dream 9q Two / < In the case of in-line connection, as long as the film is placed in the line, the film forming apparatus 23, the electrode forming apparatus 25, and the second stage are arranged in the vicinity of the common transfer chamber. In the film forming apparatus 27 [0023] 11==反=will ϊ ίί plate 11 'for example, forming an anode on the surface in advance =:,,,,,,,,,,,,,,,,,,,,,,,,, Forming a positive hole in the plate 11 (4), an electron first layer i2c, a red light emitting (four), and a green light emitting electrode forming device 25 using a pattern mask for, for example, silver, Shao, Shao alloy, 201240185 lithium aluminum alloy or manganese and silver The alloy or the like is vapor-deposited or sputtered to form a cathode layer i2g on the electron transport layer 12f. The first sealing-forming device 27 side forms a first sealing film 13 such as an inorganic film as a side GVD or a vapor deposition method to form a glass. A device in which various film layers formed on the substrate u are densely sealed. - The glass substrate 11 is fed from the loader 21 through one of the gate valves to a state in which it is decompressed, and then the glass substrate 11 is placed. By the other gate ill 23, the film forming apparatus 23, the TM24, the electrode forming apparatus 25, and the forming apparatus 27 are sequentially held in a state of decompression, and the second (1) is formed on the surface of the eucalyptus 12 to form the first _ [0024] 】 By attaching H, (4), and the temporary sealing body storage unit 29, that is, the temporary sealing body LL28 of the body. Then, the LL28 door-to-door rabbit sealing device 27 is sent to the temporary sealing body. The temporary sealing body 102 is placed in the LL28 box. The body U 29 is housed in the substrate E. The substrate of the mounting portion is not limited to the 'temporary sealing member storage portion 29'. The temporary sealing member g-mounting portion may be placed one by one, and the temporary sealing body protecting portion is placed on the sealing body. Molybdenum, etc., remain mixed; no need to reduce the state, or because of the enclosed Ϊ: 〇: the first fine forming device 27 sends out 14 2:; = seal " ΐ ΐ Τ 密封 密封 密封 密封 密封 密封 密封 密封 密封Not sealed and tS9/box π

S [0025] 201240185 may also include temporary arm storage unit 29 outer arm, age delivery book, 勹, upper σ ^ by AGV (Auto Guided Vehicle), robotic gas: float: move Jin: secret _ 102 The gas ejecting mechanism that moves up and down transports each bowl of the device to the temporary sealed body storage unit. Ξ S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S 6 sets the %, give the person to take care of the 61' through the state of the SiN Kang silk to set 3 〇. Fig. 4 is a schematic side view of the first seal forming device 27 formed as a second sealing film forming device (plasma CVD device) 3 (hereinafter referred to as "10) device" Sectional view. (10) Device 3 ' is for example a light ray slot antenna

The Sl0t Antenna; leg type device has a gas-tight and grounded "shovel-like processing chamber 301. The processing chamber 301' is, for example, a slab having a circular opening portion 31 at a central portion. The annular bottom wall 3 and the side wall provided around the bottom wall 301a, and the upper portion is formed with an opening. Alternatively, quartz, A-, etc., may be provided around the inner periphery of the processing chamber 301. [0027] An annular gas introduction member 315 is provided on the side wall of the processing chamber 301, and the gas introduction member 315 is connected to the processing gas supply system 316. The gas introduction member 315 is disposed, for example, in a shower curtain shape. The predetermined processing of the processing gas supply system 316. The gas is introduced into the processing chamber 301 through the gas introduction member 315. The processing gas can be selected according to the type and content of the plasma treatment. For example, in the case of forming a SiN film by plasma CVD, 'cerane (SiH4) gas can be used, A gas such as ammonia gas (N2), etc. Further, on the side wall of the processing chamber 301, a transfer port for loading or unloading the glass substrate 11 between the transfer modules 26 and 28 that the CVD device 3 is obsessed with is provided. 32 5. The opening and closing gate valves 326 and 356 of the delivery port 325 and the delivery port 355 are delivered 12 8 201240185. The bottom wall 3〇1a of the processing chamber 301 is provided with a bottomed cylindrical shape projecting downward from the opening 3 Exhaust chamber 311. In the exhaust chamber 311, there is an exhaust pipe 323 'exhaust pipe 323 and a ventilating device equipped with a high-speed vacuum pump. The exhaust device 324 operates to allow the processing chamber 3 〇 1 gas to pass through the exhaust The tube 323 is discharged. If so, the treatment === can be depressurized to a predetermined degree of vacuum, for example, 133 133 Pa. The inner same speed [0029] is in the bottom of the exhaust chamber 311 *, by the like, the ceramic is vertical In the front end of the remaining member, the outer edge of the 302 〇 ^ / J302 is used to hold the glass substrate. [0030] The opening formed by the annular S ^ portion is provided along the surrounding portion. The sulfur support portion 327. The dielectric member is provided on the support portion 327 through the sealing member 3, for example, a disk-shaped dielectric window 328 made of quartz or ruthenium, and is permeable to microwaves. 0031] On the upper side of the dielectric window 328, the opposite sample is torn to the surface of the dielectric body. It is composed of a conductor, such as a hole 332, which forms a predetermined figure. A plurality of microwave radiation groove wave radiation grooves i'U兕 are interposed and have two/in and 卩, and the slot plate 331 constitutes an RLSA antenna. According to the microwave wavelength ^ radiation slot 3 2 == [0032] 201240185 t number of dielectric plates 333 face each other in contact with the square disk portion: in the dielectric plate portion of the plate = dielectric portion from The circumference of the hole portion is slightly sag with respect to the dielectric disk (4) = [0033], the top surface of the _^ 301 is covered with the slot plate 331 and the dielectric plate 333, and δ is set again. A disc-shaped protective cover 334.葚^ ^ ^ ^ ^ ^ ^ ^ Made of stainless steel and other metals. The processed $=== is sealed by the sealing member 335. [0034] However, the inside of the water ί ί 334 forms a cover-side cooling water flow path 334a, allowing the cold body ΪΪ 2 Ϊ water flow path _ to circulate, and the slot plate 331 , dielectric body = ground & The 333 'guard cover 334 is cooled. In addition, the center of the upper wall of the protective cover [0035] is formed with an opening D portion 336 having a distance 336 from the opening portion 336 of the protective cover 334. =: A rectangular guide that is stretched and has a rectangular cross section. The microwaves of the microwave generating device 339, for example, the frequency microwaves, are transmitted to the slot plate 331 through the waveguide 337. In addition, the frequency of the skin can also be 8.35GHz, h, 915, etc. Rectangular guide wave 34f). The end portion of the side of the shaft and the tube is connected to the shaft of the mode converter, and has a cylindrical coaxial outer conductor 342, and is disposed along the center line of the same The coaxial inner conductor 34 and the coaxial inner conductor 34] are fixed to the center of the slot plate 331. In addition, the dielectric/^ is incident on the coaxial waveguide 337a. 14 8 [0036] 201240185 In addition, the CVD apparatus 3 is provided with a device 350 for controlling (10) the device 3. The program controller 350 is connected to a program control keyboard and a display component of the sigma structure of the user's eight. The keyboard can be set by the f interface 351, and the display can display (10) | The 350 is connected to the memory unit 352 to check the status of the memory unit. Further, the program control realizes a program control program that performs various processes in the OT) device 3, and a poor program control program such as the program controller 350. The program 'and the optional memory unit 352 that records the instruction corresponding to the user interface 351 is read under the control of the program controller 350, and the program is executed and executed. [0037] The attack device 3 has the same configuration.

^ The description will be given to the operation of the organic EL as described above, in which the pre-game is flattened by the loader 21 and the LL22. The first = substrate η is carried into the film forming apparatus 2 and the anode layer na is formed to form the organic EL part 12. Next, the device = a cathode layer 12g on the glass substrate 11. Then, the electrode is formed in the electrode forming device 25, and the shape-sealing film is formed into the polymerization unit 27, and the first glass substrate 11 is sequentially conveyed to the first resistance-resistant core. "The first sealing film is secured by the first sealing film. 102: Integral, after P29, for example, it is transported to each SiN film to form, and the display device is loaded into the SiN film device 61*(10) by the transfer device body (10) to temporarily seal the sealing film 14. The device 30 is temporarily suspended. The second seal is formed on the seal 102. The film thickness is 5=m or less, and the second seal is about the time. However, in the case of the H1 f, one organic EL part requires 40. In the sample, a plurality of SiN films are used to form the device 15 201240185 30. The SiN film is formed approximately at the same time. Therefore, the organic EL device of the display element has the same reference numeral to omit the detail. A ^ 中 '. Then, the phase sealing film 6 is the same as the third layer, and the temporary sealing film taken from the organic EL element is composed of the second layer of the first inorganic film i, and is composed of the first inorganic material. The first organic film 13 is composed of the first organic film 13 (the first inorganic film 13 is described as nc:Hx#. Hereinafter, the 15th class of the material family is used as the hydrocarbon. When the organic EL element 104 is manufactured by molecular fineness &= c4h,ch,c2h2 ti, first, L ^ is not formed on the glass substrate u of the layer 11a, and the anode is formed in the glass A having the anode layer 11a. After that, as shown in Fig. 5B, the first inorganic film 3 is formed. Further, the mi5 on the surface of the EL member 12 is obtained, whereby the temporary sealing body 103 is formed on the inorganic film 13 as an example. : In the i-th benefit broadcast U can not find. Also 疋 suitable thickness. As M0 coffee 'the first organic film 15 is composed of sarcophagus === i 16 8 201240185 lOOOnm. [0042] And as shown in Figure 5D, The first organic film second inorganic film 16 as the temporary sealing body 1〇3 is formed on the temporary sealing technique (hydrocarbon film) 15, thereby obtaining a filling film, for example, a SiN film.乩 Element 104° Fig. 6 is a schematic block diagram of an embodiment of the present invention. In the figure, the structure of the fish 虬兀 制造 manufacturing apparatus 201 is described in detail. In addition, the same symbol is attached to the RH_ portion to save the device. 61 and LL62 (the same applies hereinafter). The mounting of the second sealing film forming portion is omitted, and the first surface forming device 27 is formed. The formed S1N film forming apparatus 3, recommended, by the blanking 詈 == Γ:; the device 5 is arranged in an in-line arrangement. The organic (3) nuisance is made of Pb u, and the temporary sealing body 1 〇 3 is taken out, and is taken out to the location. Atmosphere ^_^ = _ part 2_ after the balance of the 'transport separately two [0044] Fig. 7 is a top view showing a structural example of the hydrocarbon film forming apparatus (vaporizing apparatus) 5. The steaming wire is provided with 5 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is made of a material such as aluminum or stainless steel as the long-side square T-shaped square. In the processing chamber 5 讥 = the side surfaces on both end sides in the longitudinal direction, a transfer port 511 and a delivery port 515 for transporting the glass substrate 内部 to the inside or the outside of the processing chamber 5〇1 are provided, and the gate valves 512 and 516 are used. The carry-in port 511 and the delivery port 515 are opened or closed. An exhaust pipe 513' is disposed at an appropriate position in the processing chamber 5'', and the exhaust pipe 513 is connected to an exhaust pipe 514 including a high-speed vacuum pump. The venting device 514 is operated to set a pressure inside the processing chamber 5〇1, for example, 103⁄4. [0045] 17 201240185 At the bottom of the processing chamber 501, a glass substrate U for transporting the scorpion processing chamber 5 (U is placed in the direction of the pure side, and is subjected to ^2=1). The bottom direction; that is, the moving structure in which the longitudinal direction moves ===, f supports the support table of the glass plate U in a horizontal manner. In H 2 . ^ , its force heater, cold series u linear motor moves ♦ mouth (10) 3 hunted by [0046] shank strict ί, in the direction of the transport about the central part, set the base ΙΐΓ ^ ^ : L, into the first organic film 15 瘵 plating head 541; on the glass substrate 11 The shape i or the film 15 softens or dissolves the hardened portion of the 敝^ 3=3 illuminates the electron beam or the ultraviolet ray to harden the hydrocarbon ii sample/' exemplifies the tomb of the first organic film 15 The equipment for the treatment of the ore, the heavy-duty treatment, and the hardening treatment may be separately provided separately from the steam-steaming device of the first, the, and the machine film 15 and the hardening treatment device for the hardening treatment. The present invention is not limited to the post-steaming shape of the first organic film 15. However, When the i-th organic film 15 is subjected to the re-dissolution treatment, it is preferable that the second inorganic film 16 can be formed in the first depression when the defect portion is generated. The crucible plating head 541 is disposed in the processing chamber 5 by a glass substrate 21 in which the vapor of the stone-hydrogen material is transported through the transport tube to the processing chamber 5G1. The external steam generating unit 5 is connected. The helium gas generating unit 545 includes, for example, a stainless steel container and a heating mechanism disposed inside. The heating mechanism is provided with a accommodating body capable of accommodating a hydrocarbon material: a power source for supplying power to the hydrocarbon material Heating. The second heat of the charcoal hydrogen material can be heated by 18 8 201240185. So 'the inner container of the heating mechanism and the plate i; 3m, to, the vapor of the raw hydrocarbon material. The other 'construction of the two gas A gas such as a argon gas, such as argon (Ar), is supplied through the transfer pipe to the 'transfer body. The steam generating unit 545 is provided with a regulating valve for transporting the gas supply pipe and the transfer pipe. Supply amount flow adjustment valve 544 546. After the traffic is subject to her 5^^. _, 546 opening and closing [0048] Taiwan two Ϊ ίίΞ ίίΤ mangrove lights 'infrared because of the support for fi;:ife 11 5 EL 12 source connection, power supply outside lights And the electric power supply of the organic EL part ^ does not have the 15 scale heating to soften or dazzle and 15 into the f heating surface scale to replace the infrared i irradiation head U material 1 organic film [0049] M ^ hardening treatment head 543 With electronic robbing, the electron beam 11 f is set to rob the 'electronic Yang's action by program control ^, with the UV hardening characteristics of the hydrocarbon material forming the second = so that the hardening treatment head 543 can be equipped with a glass substrate Illumination line 201240185 Light [0050] In addition, the distillation unit 5 is provided with a control base unit &^ & controller 55〇. The program controller 550 is connected to the user interface 551 of the step configuration portion and the user interface 551 to which the command is input, and the memory unit 552 is connected, and the program controller 550 and the control program for executing various processes are stored. The device 550 controls the money device 5 ^ program. The program controller 550 reads and executes an arbitrary program control program based on the user's program conditional control program, and does not cause the steaming unit 5 to perform desired processing from the redundancy unit 552. Under the control of the controller & 550, [0051] (4) 卜 'here' sharpens the glass substrate 11 * to the example of transport, push m 帚 σ 503 fixed and the substrate _ 504 relative to the glass substrate ====15th organic film=3 is a plasma_formed amorphous carbon_^_== Thus, the formation of amorphous carbon and the hardening of the first organic film 15 can be performed. Although it is described that the formed carbon nitride film is hardened or smashed, the hardened hydrocarbon hydrazine can further suppress the defect due to softening and moisture immersion, and thus it is preferable. In the EL element manufacturing apparatus 201, the first sealing film is applied to the organic EL element 12 by the first inorganic film 13 and the first organic film, and the sealing body (10). The temporary sealing body 1G3 is self-reduced and sealed by (10) to the temporary sealed body storage portion 29 located in the atmospheric pressure space. In the temporary densely-formed temporary temporary film 13 and the first surface 15 to ensure moisture permeability, the temporary sealing body storage unit 29 is transported to each of the S1N film forming apparatuses 30 by the above-described time. A second inorganic film 16 of 20 8 201240185 is formed on the sealing body 103 to obtain an organic anal element 104. As described above, the film thickness of the first inorganic film 13 is not more than 10 nm, and is very thin. Further, when the film formation rate of the first organic film 15 is, for example, a thickness of 500 (10), the film formation rate can be formed in a short time. In the case of the i-th organic=CH field, the same CVD apparatus as that of the sub-film forming apparatus of FIG. 4 is used to form a film by using Q16, CEL, or a hydrogen gas such as 3⁄4 as a processing gas, which is nearly 10 times. In the same manner as the hydrocarbon film, it can be temporarily stored after the (four) time (4), and therefore the second sealing film can be made into a two-layer structure. The embodiment of the layer is more limited. Therefore, the overall output can be improved. [Embodiment 3] Example: The structure of the organic EL device manufacturing apparatus 202 of the aspect 3 is slightly detailed. The same parts in Fig. 3 are denoted by the same reference numerals. The organic EL element manufacturing apparatus 2〇2 includes: as a second 宓 = = = = 暂时 的 的 体 = = = = 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬2, 34, sequentially transported to (10) as a single layer, in the thickness direction, sequentially forming 1/3 of the sealing body 102, which is formed on the second inorganic film 13 of the gram, to be thick, 2 2. When the second inorganic film 14 is formed, a temporary sealing body (10) which is transported by a film formation and formed by a film is formed by a single film, and is connected to [0056] 2 01240185 202 in the temporary sealing body 1. = face = two-layer structure - temporary and the second seal is lightly placed, and the shape of the moon is t-shaped, and other film forming can be arranged in line, straight = configuration of the SiM film forming device film forming device ). And (a CHx film forming device, hydrocarbon [0057] [embodiment 4], the schematic block diagram of the side profile of the ship lake 5, and the structure of the component manufacturing device is omitted. The same part is attached with the same symbol element = 亀 2 17 ^ 2 18 3 ^ rt2T, m$ 105 ^ 13, f 2''^1 ; el 3B > T as the second sealing film forming device ^ 8 ' = forming device: the temporary two-in-one device 36 temporarily stored in the dense portion 29 is sequentially transported to the second to fourth (4) and (10) the film forming device 4 using TM37 and 39. Hereinafter, the device is shown as 38. It is a_CHx. T is inconvenient for the drawing. The ^CHX film is formed in this embodiment, so that the second dense_ is a three-layer structure, so the organic is further enhanced.

(D 22 201240185 Resistance to moisture permeability of the EL element 105. [0059] A schematic block diagram of a structural example of another organic EL Μ t _ for manufacturing the organic EL element 1G5. In the figure, the fish table w device 204 is omitted. In the same manner as in FIG. 1A, the EL device manufacturing apparatus 204 includes the in-line matching device and the core CHX film forming device 43 as a second device example. The temporary device is temporarily stored by the carrier device. The portion 29 Ji 〇 2 is taken out and transported to the SlN film forming device 41, and the IB: , TM42 SlN ^ 41, ί ί 制造 制造 制造 制造 , , 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封 密封The number of devices. [0060] Another organic laser device manufacturing device for manufacturing organic EL device 1 () 5 ===block (four) towel, fine (four) saki _ upper identical for 205 inclusion: 3 SiN film formation In the apparatus 4, the third inorganic film 19 which is the uppermost layer of the 29th sealing film is formed, and the temporary sealing body is transported by the α-CHx film forming apparatus 38. The number of the SiN film shapes is not limited to three. Therefore, the organic EL element manufacturing apparatus 2〇5 can be manufactured with the organic EL element 2 A plurality of SiN film forming apparatuses 4 are used for the sample, and the film of (10) is formed approximately at the same time. For example, even if the thickness is 100 to 300 nm, 1 〇〇 nm, 8 〇〇 nm, and 1 〇〇〇, respectively, the first The case of the ore 13, the second inorganic film 17, the second hydrocarbon film 18, the third inorganic material 19, etc. can increase the total output per unit time of the third inorganic film 丨9. [0061] Fig. 13 is the manufacture of organic Another organic EL element manufacturing apparatus of EL element 1〇5 2〇6 23 201240185 ===颜. In the figure, 'the same as the figure _ minute _ the same character U* 灭二 2 film to take the upper third inorganic film 19 and Kyrgyzstan (10) The number of the devices 40 to be formed is not limited to three. The arrangement of the J is arranged. In the organic EL τ ο manufacturing device 2 〇 6, the device 43 is formed with the second carbon oxychloride film 18 Temporary sealing body = QL qing film forming device 47, which is transported to SiN 依 in the same manner as TMN, 50, and is transported to S1N 51. Therefore, the third inorganic film 19 can be formed in the thickness direction by the device 49 at a thickness of l_nm. When, =::=9. For example, about 33 〇 , , , , , , , , , 接 接 接 = = = = = = = = = = = = = = = = = = = = = = = = = 3

In addition, in the case of the present embodiment, although the case where the right seal # Τ _ 203 to 206 is used to move the temporary seal body to the ϋ 枝 EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL The surface of the second sealing film sealing body 103 which is formed is formed of a temporary sealing film forming device 27 composed of three layers 2 and a second sealing agent. That is, the situation described in the jth aspect. The structure of the 7 flat arrangement is not limited to this embodiment. [0063] [Embodiment 5] A schematic block diagram of an example. In the drawings, the configuration of the drawing manufacturing apparatus 207 will be omitted. The same parts are attached with the same reference numerals to the organic EL element 106 of the present embodiment, and the gold seals _ and 105 are different, and the second sealing film is composed of 2/households, and the organic organic EL elements of the table 1 and 4 are in the organic It is composed of 乩曰. The first inorganic film 13 of the first inorganic film 13 is obtained, and the second organic film 70 and 02 are sequentially formed as the first dense surface, and the inorganic film 71 is obtained from the temporary sealing body 102 to obtain the organic germanium 24 201240185 'piece (10). Here, the first inorganic film...the second inorganic film 71 is composed of an S1N film and the second organic film 70 is composed of a-CHx. It is composed of an S1N film, and the organic EL element manufacturing apparatus 2A7 includes a straight portion 44 and a SiN film forming skirt 46 as a second dense package. The sealing body 102 of the sealing film forming apparatus is taken out by the conveyance device, and conveyed to the temporary formation device 46 temporarily stored in the a_CH film shape. y1. The CHx film forming apparatus 44 is transported by using TM45. [0065] In the present embodiment, the number of layers of the organic EL element film according to the fourth embodiment is two layers, so that the present embodiment is In the sample, it is explained that the surface of the temporary sealing body 102 is formed by two layers of organic devices, and the C is not limited thereto, and the surface of the first layer of the first sealing film may be formed. The temporary sealing crucible forming device 27 and the second sealing film formed by the two layers are formed into a film. That is, the case described in the first seal. The configuration is not limited to the present embodiment [0066] [Implementation 6]. In the drawings, the component manufacturing apparatuses are the same, and the detailed description is omitted. In the same parts as in Figs. 1 and 3, the organic EL element 107 of the present embodiment is attached, and the disk-^ device is made up of A: ^=^ The temporary storage device temporarily stored in the storage unit 29 The second mask 72 is formed by temporarily setting "4" to 52'. = Body 102 is taken out and transported to the illusion. For the convenience of illustration, A1 Qingcheng Farming is marked as Ai in Figure 25 201240185. [0068] --2 - The seal is divided into right and left, and the surface is temporarily bonded to the second sealing film. A] The inorganic film containing the inorganic film composed of SiN in the upper layer, and the most layer structure and The layer structure is such that the same is the same as the second sealing film 2 EL ^ 1 〇 8 = 0 = a schematic block of the configuration example: the EL element is manufactured with the same reference numerals to omit the detailed description. In the same part of the T/, the circle 1 and the third, the organic EL device manufacturing apparatus 2〇9 includes: a phantom, and a 膜1 film forming apparatus 55 ff α film forming and mounting, and a temporary sealing body storage unit ,: Sealing film forming device. The ft inorganic film 73 is formed by taking out the 'transported to the α-CIL film to form a temporary sealing body 102 to the A1 film forming device 55. As an example of the use of the film, the case can be exemplified, the film is 4, the film is 2, the film is 2, the film is 2, and the second film is [0070] 'nm. FIG. 20 shows the second layer having a three-layer structure. = sectional view 'Fig. 21 is a schematic block diagram showing a configuration example of the device 210 of the right EL element 109 of the organic EL element *Vl09. In the drawings, the 盥 organic EL tl member is attached with the same reference numerals to omit the detailed description. In the same portion as the third embodiment, the organic EL element manufacturing apparatus 21A includes a film forming device 58 and a film forming device (10), which are film-shaped. The removal will be temporarily carried out to the SiN$ as a temporary seal (10) as the 2nd official. . The second inorganic film 75 composed of 29 is temporarily protected. The TM57 is used to form the film 76 by the si LHx film forming device 26 8 201240185. Then, using the ®9, it is transported to the A1 film-shaped gamma, and the second organic film 76 composed of the a_CHx film is described, and the 【 【 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ Inorganic film

Ai2 reports L f ? to u alloy to form an inorganic film. Further, it is also possible to use the case where the organic component manufacturing apparatus film obtained as the upper layer has an inorganic sealing film 22C composed of α1, but it is not limited thereto. The first film of the U-film formed by 対纟A1 can be formed on the surface of the first dense film of the machine, which is formed by the 対纟A1 film. That is, the first seal is not formed again. Twenty-two density [embodiment 7] FIG. 22 is a side cross-sectional view showing the organic EL element 11Q of the seventh embodiment of the present invention.

81 mtilJ ester, Polyethylene panicin body 102. The gas barrier substrate 81 is formed, for example, on a substrate 79 composed of h (10) or %. The composition of the warfare "., the skin 80. The inorganic film may be a single layer or the bonding layer 78 made of an acrylic resin for the evening sealing body, so that the surface of the T〇〇723f and the gas barrier substrate 81 are treated. The back surface of the substrate 79 is joined. The organic EL element lio can be easily manufactured by temporarily sealing the temporary sealing body 27 201240185 102 in a temporary sample. [0074] Sealing is performed with Sf: and is temporarily attached to the temporary sealing body. 103. The emulsion barrier substrate 81 is bonded to each other. Further, the structure of the gas barrier substrate is not limited to the one described in the actual silk sample [0075] [embodiment 8]. In the side view of the organic EL element ΐπ of the eighth embodiment of the invention, the first element 111' of the outer surface of the temporary sealing body 102 is attached to the second sealing film 14 of the temporary sealing body 102, and the above-mentioned =13 upper bonding is performed. On the surface side of the second sealing film 14, the stalker bonding layer 78 is bonded to the gas barrier substrate 81, and the right J has the following structure: the second sealing film 14. Organic EL element 1〇1 [0076] In the zipper, the second sealing film 14 has been formed, and the disk gas am 8 When the bonding is performed, the moisture permeability is further improved. /, the hole resistance I1 is the same as the substrate, and the second inorganic film 16 of the organic barrier element (10) of the gas barrier substrate 81蕻2 can also be laminated/implemented. On the third inorganic film 19 of the sample element 105, the organic EL second inorganic film 71 which can be used for the fourth embodiment, and the organic EL device of the aspect 6 are formed. [0077] ' Temporary: body conversion 28 201240185 [Performance Evaluation Test 1] Using the embodiment of the present invention, the organic component manufacturing apparatus 2 as the first sealing film forming device 27 is used, and the organic EL component formed on the 11 is used. The film was placed on the glass substrate, and the relationship between the first sealing film and the first sealing film was not formed, and the moisture permeability-resistant atmospheric pressure space was evaluated. The number of turns and the light-emitting surface were examined. The results are shown in the graph of FIG. /1 The number of days passed through the gas, the vertical axis is the luminous surface of the retracement = in the table, and the horizontal axis is placed at 100%. The organic EL part 12 is prepared by k. The outer edge of the light-emitting area when the number of days is 0. The non-light-emitting area is generated, and the light-emitting area is formed on the surface of the organic EL element 12 as shown in Fig. 24, and the light-emitting area is not formed when the third layer is not formed. Significantly reduced; relative to the mountain, the situation of '13, after the 3rd shape' even after 3 曰, the luminous area is almost no: = earth, the thickness of the film 13 is 30 〇 nm, although the ratio = / /. The amount of time-dependent reduction of the sealing film 13 of the younger brother 1 is slightly larger, but in the case of silk, the case of _nm is about 1 day, and the time of the first sealing film 13 is usually wet. In view of the above, the moisture permeability resistance of the first EIJ member H formed in the organic EIJ member H in a short period of time is sufficiently ensured at 3 〇〇 nm. [0080] [Performance Evaluation Test 2] The organic first sealing film forming device 27 of the second aspect of the invention is related to the Siw amine V and the second lunch. The hydrogen film forming device 5, but using the plasma CVDf into the device 3', does not use a carbonized in-line configuration. In the glass substrate 21, the second a-CHx film forming apparatus is formed by the SiN film forming apparatus 3 to form a surface of the thicker 'Electrical EL part 12' and a third inorganic film (SiN film) having a degree of 30 〇 nm. On the surface of 29, 2012, the thickness of 500 nm, 2 nm, and (^CHX film) 15 were respectively formed, and three types of temporary sealing bodies 103 were produced. Each temporary sealing body 103 of the investigation was placed in an atmospheric pressure space, and the relationship between the two areas was measured, and the thirst resistance was evaluated. Figure 25 of the gas in the chart. In the graph of Fig. 25, the horizontal axis is placed on the job and the vertical axis is the light-emitting area. The light-emitting area when the number of turns is 0 [0081] When the light-emitting f is over 3 days, the thickness of the first organic (four) is reduced, and the area of several cores is reduced. Further, it is found that at least the strictness is formed in the degree of Fig. 24, and the first organic film 15 which is resistant to ii m by the first inorganic film 13 is surely obtained, so that it is more preferable.

The second type of the film of the type, the number, and the thickness of the second type of the film is formed, and the film formation amount per unit time is increased, and the film formation amount per unit time is increased, so that the reverse fit is temporarily It is easy to seal the body": the gas can be used to improve the overall output, and the organic EL7t^^ is improved. [0083] In addition, in the above-described first to eighth embodiments, the temporary sealing body (10) is described. 201240185 ^ 103 is temporarily stored in the temporary sealed body storage unit 29, but the room is reserved. On the other hand, the case where the temporary sealed body storage portion 29 or the vacuum preparation chamber is in the same state may be under the dry gas. The type, the number, and the thickness of the sealing film are not limited to the real one. J J_ The use of each of the organic EL elements in a predetermined configuration is used to manufacture the device. BRIEF DESCRIPTION OF THE EMBODIMENT OF THE INVENTION [0011] FIG. 1 is a side cross-sectional view showing an embodiment of the present invention. <Important organic EL device Fig. 2 is a schematic diagram of an organic EL device manufacturing method. Fig. 3 is a schematic block diagram of an organic EL'f° according to a first embodiment of the present invention. FIG. 4 is a structural example of a manufacturing device for a rainbow member.

In the case of the SiN film forming apparatus of the film, SiN is used as the first sealing film. Figs. 5A to 5D are cross-sectional views of the embodiment of the present invention. A schematic illustration of the manufacturing method. Organic EL Element of 乍Fun Display Element Fig. 6 is a schematic block diagram of Embodiment 2 of the present invention. Fig. 7 is a schematic cross-sectional side view showing an example of the embodiment 3 of the present invention. Fig. 7 is a schematic side view showing an example of the embodiment 3 of the present invention. Schematic block diagram. A schematic diagram of the 201240185 _ m 构造 configuration example of the Russian EL component manufacturing apparatus. Configuration Example of Rainbow Element Manufacturing Apparatus =-=3⁄4 block diagram. Fig. 13 is a block diagram showing an example of another organic EL element. The figure shows a schematic block diagram of an example of the embodiment of the present invention. Figure 15 is a side cross-sectional view showing an EL member of the embodiment of the present invention. Schematic block diagram.示意 _ _ EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL EL A schematic block diagram of a structural example. Profile.=. Side of the organic component of the second sealing film having a three-layer structure. Fig. 21 is a structure of the organic EL device manufacturing apparatus. Ξ f3 = side view of the organic EL S of the seventh embodiment. A side cross-sectional view of an organic EL element. Chart of the survey results of the relationship /, the number of days and the area of the light-emitting area = 彳 = check the placement of the silk body in the atmosphere by the number of days and the first [main symbol description] [0085] Components m, m, 1G5, Employment, 1 () 7, 1 {) 8, (10), other, m... organic anal 102, 103... temporary sealing body 32 201240185 2, 201, 202, 203, 204, 205, 206, 207, 208 209, 210... Organic EL device manufacturing device

3, 30, 31, 33, 35, 36, 40, 41, 46, 47, 49, 51, 56... SiN film forming devices 4, 24, 26, 32, 34, 37, 39, 42, 45, 48, 50, 54, 57, 59... Transfer Module (TM) 5. Hydrocarbon film forming device 6. Second sealing film forming portion 11. Glass substrate 11a... Anode layer 12 .. Organic EL part 12a... Positive hole transport layer 12b... Positive hole injection layer 12c... Blue light emitting layer 12d... Red light emitting layer 12e... Green light emitting layer 12f... Electron transport layer 12 g...cathode layer first inorganic film 13.. first sealing film 14: second sealing film, 17, 71, 72, 74, 75... second inorganic film 18, 70, 73, 76 ... 2nd hydrocarbon film 19, 77... 3rd inorganic film 21. Loader 22: Vacuum preparation chamber (LL) 23.. Film forming apparatus 24··. Transfer module (TM) 25.. Electrode forming device 26: Transfer module (TM) 15.. First organic film 16 33 201240185 27.. First sealing film forming device 28.. Vacuum preparation chamber (LL) 29 Temporary sealed body storage portions 38, 43, 44, 53, 58... α-CL film forming devices 52, 55, 60, . . . A1 film forming device 61.. Loader 62.. Vacuum preparation Room (LL) 78.. .Adhesive layer 79.. base Plate 80.. Inorganic film 81.. Gas barrier substrate 301.. Process chamber 301a... Bottom wall 302.. Sample table 303.. Column member 304.. Guide portion 306.. . Heater power supply 308.. DC power supply 310.. opening 311.. exhaust chamber 311a... space 315.. gas introduction member 316.. processing gas supply system 323.. exhaust pipe 324 .. .Exhaust device 325.. Move inlet 326, 356... Open and close gate valve 327.. Support 328.. Dielectric window 329.. Sealing member 34 8 201240185 331.. Slot plate 332.. Microwave radiation slot 333.. Dielectric plate 334.. Protective cover 334a... Cover side cooling water flow path 335.. Sealing member 336.. Opening 337.. Wave tube 337a... coaxial waveguide 337b... rectangular waveguide 338.. matching circuit 339.. microwave generating device 340.. mode converter 341.. coaxial inner conductor 342.. coaxial Outer conductor 350.. Program controller 351.. User interface 352.. Memory unit 355.. Delivery port 501.. Processing chamber 502.. Portion device 503.. Support table 504.. Substrate processing head 511.. Portion 512, 516... Gate valve 513.. Exhaust pipe 514.. Exhaust device 515.. 541.. . evaporation head 542.. infrared ray head 35 201240185 543.. hardening treatment head 544, 546... flow adjustment valve 545.. steam generation part 550.. program controller 551.. User interface 552.. Memory unit 36 8

Claims (1)

201240185 VII. Patent application scope: 1. A display component manufacturing device, which comprises: a sealing film of a component on a display part to manufacture a display component; the display component is manufactured by: a first film forming mechanism under decompression a seal sealing mechanism is formed on the surface of the display part, and the first sealing film is formed on the first time of the first sealing, and the display part stored in the sealing mechanism is stored. The display element of the 11th patent of the above-mentioned storage 2 package is manufactured, and 1 is made up of a plurality of the second sealing film forming means. τ shows that the casting material is sealed to seal the sheet. The method for manufacturing the component is characterized in that: the film forming mechanism is configured to seal the first thin display part from the first piece under reduced pressure; In the step s, the film forming step of transporting the display member stored in the storage unit to the second sealing film by the storage unit for a predetermined period of time is formed by the second sealing film.乂Handling 4, if ordered, fill in the age of the second 谤 谤 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 山 山 山 山 山 山 山 山 山 山 山 山The second sealing film is formed approximately simultaneously. The method of manufacturing a display device according to claim 3, wherein the first sealing film contains an inorganic film made of an inorganic material. The method for manufacturing a display device according to the fifth aspect of the patent application, wherein the sealing seal is stacked on the inorganic film by an organic material composed of an organic material, and the middle of the patent application is in the third to sixth embodiments. A display component manufacturer: machine film. If the component manufacturing is not completed, # ^ is as shown in any of the third to seventh patent applications: 亀1 1 No. 3 to 8 of the Fan Park is composed of inorganic materials; the seal is composed of organic materials. There are _ items of the display component manufacturing method to make food, _ species: 70 members, characterized by: patent application 38