TW201238716A - Abrasive article with replicated microstructured backing and method of using same - Google Patents

Abrasive article with replicated microstructured backing and method of using same Download PDF

Info

Publication number
TW201238716A
TW201238716A TW101102916A TW101102916A TW201238716A TW 201238716 A TW201238716 A TW 201238716A TW 101102916 A TW101102916 A TW 101102916A TW 101102916 A TW101102916 A TW 101102916A TW 201238716 A TW201238716 A TW 201238716A
Authority
TW
Taiwan
Prior art keywords
abrasive
adhesive
abrasive article
flexible backing
microstructure
Prior art date
Application number
TW101102916A
Other languages
English (en)
Chinese (zh)
Inventor
Paul Stuart Lugg
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201238716A publication Critical patent/TW201238716A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B24D3/002Flexible supporting members, e.g. paper, woven, plastic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245Pads with fixed abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02Backings, e.g. foils, webs, mesh fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Magnetic Heads (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
TW101102916A 2011-01-26 2012-01-30 Abrasive article with replicated microstructured backing and method of using same TW201238716A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161436407P 2011-01-26 2011-01-26

Publications (1)

Publication Number Publication Date
TW201238716A true TW201238716A (en) 2012-10-01

Family

ID=45755505

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101102916A TW201238716A (en) 2011-01-26 2012-01-30 Abrasive article with replicated microstructured backing and method of using same

Country Status (7)

Country Link
US (1) US20130295821A1 (enExample)
JP (1) JP2014508650A (enExample)
KR (1) KR20140018880A (enExample)
CN (1) CN103328158A (enExample)
SG (1) SG191978A1 (enExample)
TW (1) TW201238716A (enExample)
WO (1) WO2012102978A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015100220A1 (en) * 2013-12-23 2015-07-02 3M Innovative Properties Company A coated abrasive article maker apparatus
CN104369120B (zh) * 2014-09-15 2016-11-09 西安德谦新材料科技发展有限公司 一种基于磨削单元植入的金刚石或cbn磨具制备方法
BR112017011164B1 (pt) * 2014-11-26 2021-10-05 3M Innovative Properties Company Artigo abrasivo, conjunto abrasivo e método para sua utilização
CN104403575B (zh) * 2014-12-23 2016-09-21 包头市华辰稀土材料有限公司 一种高精度氧化铝抛光粉的制备方法
WO2016209651A1 (en) * 2015-06-22 2016-12-29 3M Innovative Properties Company Abrasive articles, assemblies, and methods with gripping material
CN105500186A (zh) * 2016-01-21 2016-04-20 苏州新美光纳米科技有限公司 晶片抛光用抛光垫及抛光垫的自吸附方法
CN105751090A (zh) * 2016-04-15 2016-07-13 常州市金牛研磨有限公司 防滑强化砂带
US10849660B2 (en) * 2017-02-21 2020-12-01 Diamabrush Llc Sanding screen device
WO2019026021A1 (en) 2017-08-04 2019-02-07 3M Innovative Properties Company MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY
TWI674947B (zh) * 2018-04-19 2019-10-21 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
CN108747876B (zh) * 2018-06-11 2021-03-19 河北思瑞恩新材料科技有限公司 一种漆面研磨砂碟的制备方法
US10954803B2 (en) * 2019-01-17 2021-03-23 Rolls-Royce Corporation Abrasive coating for high temperature mechanical systems

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318083A (en) * 1976-08-04 1978-02-18 Sankyo Rikagaku Co Grinding instruments of multiilayer structure
US4629473A (en) * 1985-06-26 1986-12-16 Norton Company Resilient abrasive polishing product
US5152917B1 (en) * 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
CA2113318A1 (en) * 1993-01-28 1994-07-29 Robert J. Jantschek Abrasive attachment system for rotative abrading applications
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
ATE302092T1 (de) * 2000-04-28 2005-09-15 3M Innovative Properties Co Schleifmittel und verfahren zum schleifen von glas
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6838142B2 (en) * 2001-05-18 2005-01-04 3M Innovative Properties Company Specular laminates
US6846232B2 (en) * 2001-12-28 2005-01-25 3M Innovative Properties Company Backing and abrasive product made with the backing and method of making and using the backing and abrasive product
CN1411038A (zh) * 2002-05-30 2003-04-16 株式会社日立制作所 抛光方法和设备
US6755878B2 (en) * 2002-08-02 2004-06-29 3M Innovative Properties Company Abrasive articles and methods of making and using the same
JP5020333B2 (ja) * 2006-12-20 2012-09-05 スリーエム イノベイティブ プロパティズ カンパニー コーティングされた研磨材ディスク及びその作製方法
WO2008079932A2 (en) * 2006-12-21 2008-07-03 Saint-Gobain Abrasives, Inc. Abrasive article with cured backsize layer
US20100022174A1 (en) * 2008-07-28 2010-01-28 Kinik Company Grinding tool and method for fabricating the same

Also Published As

Publication number Publication date
CN103328158A (zh) 2013-09-25
KR20140018880A (ko) 2014-02-13
WO2012102978A1 (en) 2012-08-02
US20130295821A1 (en) 2013-11-07
JP2014508650A (ja) 2014-04-10
SG191978A1 (en) 2013-08-30

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