201238101 六、發明說明： 【發明所屬之技術領域】 ⑽οι] 本發明涉及一種發光晶片導線架，尤其係一種表面黏著 型發光晶片導線架。 【先前技術】 [0002] 發光晶片是一種固態的半導體元件，不同於鎢絲燈泡發 光原理，屬於冷光發光，只需極小電流就可以發光。發 光晶片不但具有壽命長、省電、耐用、耐震、牢靠、適 合量產、體積小及反應快等優點，更普遍應用在生活中 €5 多項產品，如：手機、Ρί)Α產品的背光源、信息與消費性 電子產品的指示燈、工業儀表設備、汽車用儀表指示燈 與煞車燈及大型廣告看板等。 [0003] 習知之發光晶片導線架通常包括一膠座、兩個金屬接腳 、一發光晶片及二條導線。膠座具有一中空狀之功能區 ，金屬接腳埋設於膠座中，其中金屬接腳部分暴露於功 能區底部，部分延伸出膠座相對兩側，並且沿膠座外側 Q 彎折至膠座底面以作為後續製程之接點。 [0004] 習知之發光晶片導線架之膠座係射出成型於金屬接腳上 ，在射出成型的過程中，塑膠往往在成型後因為材料收 縮，導致膠座與金屬接腳之連接處產生較大的縫隙，而 此縫隙往往是無法避免，因此導致金屬接腳與膠座的氣 密性較差，封裝體外界的水氣很容易沿著膠座與金屬接 腳之連接處進入封裝體内部’進而影響發光晶片的發光 亮度的可靠度’甚至降低發光晶片導線架的使用壽命。 [0005] 100107491 鑒於此，實有必要克服上述發光晶片導線架之缺陷。 表單編號A0101 第3頁/共13頁201238101 VI. Description of the Invention: [Technical Field of the Invention] (10) οι The present invention relates to a light-emitting chip lead frame, and more particularly to a surface-adhesive light-emitting chip lead frame. [Prior Art] [0002] A light-emitting chip is a solid-state semiconductor component, which is different from the tungsten light bulb illuminating principle and is a luminescent light that emits light with a very small current. The light-emitting chip not only has the advantages of long life, power saving, durability, shock resistance, firmness, suitable for mass production, small size and fast response, and is more commonly used in the life of more than 5 products, such as: mobile phone, Ρί) 背光 product backlight Indicators for information and consumer electronics, industrial instrumentation, vehicle indicator lights and brake lights, and large advertising billboards. [0003] Conventional light-emitting chip leadframes typically include a rubber mount, two metal pins, a light-emitting chip, and two wires. The rubber seat has a hollow functional area, and the metal pin is buried in the rubber seat, wherein the metal pin portion is exposed to the bottom of the functional area, partially extends from opposite sides of the rubber seat, and is bent along the outer side of the rubber seat to the rubber seat. The bottom surface serves as the contact point for subsequent processes. [0004] The plastic seat of the conventional light-emitting chip lead frame is injection molded on the metal pin. In the process of injection molding, the plastic tends to shrink due to the material shrinkage, resulting in a larger joint between the rubber seat and the metal pin. The gap is often unavoidable, which results in poor airtightness between the metal pins and the rubber seat. The moisture outside the package can easily enter the inside of the package along the joint between the rubber seat and the metal pin. The reliability that affects the luminance of the illuminating wafer 'even reduces the lifetime of the luminescent wafer leadframe. [0005] 100107491 In view of this, it is necessary to overcome the defects of the above-mentioned light-emitting chip lead frame. Form No. A0101 Page 3 of 13
201238101 【發明内容】 [0006] 本發明所解決之技術問題係提供一種可防止水氣進入之 發光晶片導線架。 [0007] 為解決前述技術問題，本發明提供一種發光晶片導線架 ，組裝於印刷電路板之上用於連接發光晶片，其包括： 設有中空之功能區的膠座及位於功能區内的金屬接腳， 金屬接腳包括第一接腳及第二接腳，所述第一接腳及第 二接腳的上表面填充有由不具有烷基的聚矽氧化合物組 成的密封矽膠。 [0008] 與習知技術相比，本發明之發光晶片導線架之金屬接腳 之上表面填充有由不具有烷基的聚矽氧化合物組成的密 封矽膠，該密封矽膠可有效阻止外界的水氣進入封裝體 内。 【實施方式】 [0009] 請參閲第一圖至第二圖所示，本發明為一種發光晶片導 線架100，其包括一絕緣之膠座1及固持於膠座1中之一對 金屬接腳2。 [0010] 請參閱第二圖所示，膠座1大致呈長方體結構，通過塑膠 射出成型於金屬接腳2上。膠座1包括位於其外側之外膠 壁11及自膠座1之中部向下凹設形成中空狀之功能區10。 所述功能區10大致為長方形狀，亦可為圓形狀、橢圓形 狀或其它多邊形狀。其中，於功能區10的下底面設有一 將兩金屬接腳2分隔開來的隔塊12。 [0011] 請具體參閱第二圖至第五圖所示，本發明之金屬接腳2係 100107491 表單編號A0101 第4頁/共13頁 1002012716-0 201238101 Ο 通過銅或者銅合金等導電金屬材料製成。所述金屬接腳2 包括位於膠座1之隔塊12 —側的第一接腳2〇及位於膠座i 之隔塊12另外一側的第二接腳21。所述第一接腳2〇的上 表面202向上延伸設有第一凸台2〇〇及位於第一凸台2〇{) 之側邊並具有-定距離的第二凸台2(n，所述第二接⑽ 的上表面212向上延伸設有第三凸台21〇。其中，發光晶 片（未圖示）承載於第一接腳2〇的第二凸台2〇ι之上兩 根導線（未圖示）之其中—端分別連接於第一接腳20的 第一凸台200及第二接腳21之第三凸台21〇之上，另外一 :連接㈣光晶片（编）m第—接卿 及第二接腳21之端部分別設有複數向下凹陷且截面呈“ v 形之凹槽2U，該凹槽211可增加金屬接腳2與膠座w 結合力。201238101 SUMMARY OF THE INVENTION [0006] The technical problem to be solved by the present invention is to provide a light-emitting chip lead frame that prevents moisture from entering. In order to solve the foregoing technical problems, the present invention provides a light-emitting chip lead frame assembled on a printed circuit board for connecting a light-emitting chip, comprising: a rubber seat provided with a hollow functional area and a metal located in the functional area The pin includes a first pin and a second pin, and the upper surfaces of the first pin and the second pin are filled with a sealing silicone composed of a polyoxynitride having no alkyl group. [0008] Compared with the prior art, the surface of the metal pin of the light-emitting chip lead frame of the present invention is filled with a sealing silicone composed of a polyoxynitride compound having no alkyl group, and the sealing silicone can effectively block external water. Gas enters the package. [0009] Referring to the first to second figures, the present invention is a light-emitting wafer lead frame 100 comprising an insulating rubber seat 1 and a metal-to-metal joint held in the rubber seat 1. Foot 2. [0010] Referring to the second figure, the rubber seat 1 has a substantially rectangular parallelepiped structure and is molded on the metal pin 2 by plastic injection. The rubber seat 1 includes a rubber wall 11 on the outer side thereof and a functional area 10 recessed downward from the middle of the rubber seat 1 to form a hollow shape. The functional area 10 is substantially rectangular and may be round, elliptical or other polygonal. Therein, a spacer 12 separating the two metal pins 2 is disposed on the lower bottom surface of the functional area 10. [0011] Please refer to the second to fifth figures, the metal pin 2 of the present invention is 100107491. Form No. A0101 Page 4 / Total 13 pages 1002012716-0 201238101 Ο Made of conductive metal materials such as copper or copper alloy to make. The metal pin 2 includes a first pin 2 位于 on the side of the spacer 12 of the rubber seat 1 and a second pin 21 on the other side of the spacer 12 of the rubber seat i. The upper surface 202 of the first pin 2〇 extends upwardly with a first boss 2〇〇 and a second boss 2 (n, located at a side of the first boss 2〇{) and having a fixed distance The upper surface 212 of the second connection (10) extends upwardly to be provided with a third boss 21〇. The light-emitting chip (not shown) is carried on the second protrusion 2〇 of the first pin 2〇. The ends of the wires (not shown) are respectively connected to the first boss 200 of the first pin 20 and the third boss 21 of the second pin 21, and the other one is connected to the (four) optical chip (editor) The ends of the m-thickness and the second pin 21 are respectively provided with a plurality of recesses 2U which are recessed downwardly and have a cross section of a v-shape, and the recesses 211 can increase the bonding force between the metal pins 2 and the rubber seat w.
[0012] G =體參閲第四圖及第五圖所示，將膠座!射出成型於金 =2上，第凸台_、第二凸台2〇ι及第三凸台21。 之間均具有-定的距離，第一凸台2〇〇及第二 自第—接腳2°的上表爾向上延伸出-定的距離十 凸台2_自第二接腳21的上表面212向上延伸出—定的 距離。將—種耐熱性好且透明的密封石夕膠22填入璆幻之 ^區1〇内的第一接腳2〇的上表面如及第二接腳21的 聚石夕=1 之上。其中’密封卿22由-種不具有院基的 ^ S物組成，其具有黏度低且流動性高的特性。 [0013] 狀的密神膠22填心力謎_時，卿液體 —娜账細1的上表面 的同時，㈣液體還相其特性流人金屬接腳2與谬 100107491 表單編號A0101 1002012716-0 第5頁/共13頁 201238101 座1所有的缝隙中並加以密封，如：第一接腳2 0及第二接 腳21之側邊分別與膠座1之隔塊12的連接處、金屬接腳2 兩端之上表面與膠座1兩端之下底面的連接處。其中，矽 膠液體的液面的高度不高於第一凸台200、第二凸台201 及第三凸台210的高度，以利於發光晶片（未圖示）及導 線（未圖示）與第一凸台200、第二凸台201及第三凸台 210的連接；再對矽膠液體進行烘烤使其硬化成形。因密 封矽膠22可長時間發揮密封效果可有效阻止外界的水氣 進入封裝體内。另，因密封矽膠22係一種透明的膠體從 而不會影響發光晶片（未圖示）的發光效果，故，可大 幅提升發光晶片導線架100的使用壽命。 [0014] 綜上所述，本發明確已符合發明專利之要件，爰依法提 出專利申請。惟，以上所述者僅係本發明之較佳實施方 式，本發明之範圍並不以上述實施方式為限舉凡熟習本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0015] 第一圖為本發明發光晶片導線架之立體組合圖； [0016] 第二圖為本發明發光晶片導線架未注入密封矽膠前之立 體分解圖； [0017] 第三圖沿第一圖中之IV-IV線之剖視圖； [0018] 第四圖為本發明發光晶片導線架中填充密封樹脂之剖視 示意圖；及 [0019] [0019] 第五圖係第四圖中圈内標示部分之局部放大圖。 100107491 表單編號Α0101 第6頁/共13頁 1002012716-0 201238101 【主要元件符號說明】 [0020] 發光晶片導線架：100 [0021] 膠座：1 [0022] 功能區：10 [0023] 外膠壁：11 [0024] 隔塊：12 [0025] 金屬接腳：2 Ο [0026] 第一接腳：20 [0027] 第一凸台：200 [0028] 第二凸台：201 [0029] 第二接腳：21 [0030] 第三凸台：210 [0031] 上表面：202、212 〇 [0032] 凹槽：211 [0033] 密封矽膠：22 100107491 表單編號A0101 第7頁/共13頁 1002012716-0[0012] G = body Referring to the fourth and fifth figures, the rubber seat! is injection molded on gold = 2, the first boss _, the second boss 2 〇 and the third boss 21. Between each having a predetermined distance, the first boss 2 〇〇 and the second leg of the second leg from the first leg extend upwardly by a predetermined distance from the ten boss 2_ from the second pin 21 Surface 212 extends upwardly a predetermined distance. A heat-resistant and transparent sealing stone 22 is filled in the upper surface of the first pin 2'''''''''''''' Among them, the seal seal 22 is composed of a kind of material having no hospital base, and has the characteristics of low viscosity and high fluidity. [0013] The shape of the secret gel 22 filled the heart puzzle _ when, the liquid liquid - Na account fine 1 of the upper surface at the same time, (four) liquid also its characteristics flow people metal pin 2 and 谬 100107491 Form No. A0101 1002012716-0 5 pages / total 13 pages 201238101 Block 1 is sealed in all the gaps, such as: the connection between the side of the first pin 20 and the second pin 21 and the spacer 12 of the rubber seat 1, the metal pin 2 The joint between the upper surface of the two ends and the bottom surface of the two ends of the rubber seat 1. Wherein, the height of the liquid surface of the silicone liquid is not higher than the height of the first boss 200, the second boss 201 and the third boss 210, so as to facilitate the light-emitting chip (not shown) and the wires (not shown) and the first The connection of a boss 200, the second boss 201 and the third boss 210; the silicone liquid is baked to be hardened. Due to the sealing effect of the sealant 22 for a long time, the external moisture can be effectively prevented from entering the package. Further, since the sealing silicone 22 is a transparent colloid so as not to affect the light-emitting effect of the light-emitting chip (not shown), the life of the light-emitting wafer lead frame 100 can be greatly improved. [0014] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention should be It is covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0015] The first figure is a perspective assembled view of a lead frame of a light-emitting chip of the present invention; [0016] The second figure is an exploded perspective view of the lead frame of the light-emitting chip of the present invention before being injected into the sealed silicone; [0017] 3 is a cross-sectional view taken along the line IV-IV in the first drawing; [0018] FIG. 4 is a cross-sectional view showing a filling sealing resin in the lead frame of the light-emitting chip of the present invention; and [0019] A partial enlarged view of the marked portion in the circle in the four figures. 100107491 Form No. 1010101 Page 6 of 13 1002012716-0 201238101 [Main component symbol description] [0020] LED wafer lead frame: 100 [0021] Plastic seat: 1 [0022] Functional area: 10 [0023] :11 [0024] Spacer: 12 [0025] Metal pin: 2 Ο [0026] First pin: 20 [0027] First boss: 200 [0028] Second boss: 201 [0029] Second Pin: 21 [0030] Third boss: 210 [0031] Upper surface: 202, 212 〇 [0032] Groove: 211 [0033] Sealed silicone: 22 100107491 Form number A0101 Page 7 / Total 13 pages 1002012716- 0