201237422 六、發明說明： 【發明所屬之技術領域】 本發明係關於檢查用接觸，尤其關於能夠提升與檢查 對象元件之端子之接觸性的檢查用接觸探針。 【先前技術】 近年來，半導體積體電路（以下，稱爲1C)更加地大規 0 模化，以外部連接端子而言，對於採用 BGR(Ball Grid Array)之1C也有在底面具有1000個以上之焊球者。 如此大規模之1C係在安裝於印刷基板之前進行功能 試驗及預燒試驗，在該些試驗中，爲了電性連接IC和IC 測試機，使用檢查用插槽。 該檢査插槽具備1C之焊球之數量和總數量之接觸探 針，發揮電性連接1C之焊球和1C測試機之端子的功能。 因此，要求接觸探針之前端部與1C之焊球確實接觸 〇 性，已提案有各種形狀之接觸探針（例如，參照專利文獻 1及專利文獻2)。 即是，在專利文獻1揭示有在接觸探針之外緣上具有 複數之頂部，稜線朝向接觸中心下降之冠狀之接觸部的接 觸探針。 再者，在專利文獻2，於接觸探針之外緣上具有複數 之頂部，在從頂部延伸之棱線偏離接觸探針之中心的位置 ，具有以少於1 80度之角度交叉之冠狀接觸部的接觸探針 -5- 201237422 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2010-038612號公報（[0019]、 第2圖、第3圖） [專利文獻2]日本特開20 06- 1 8405 5號公報（[〇〇29]、 第3圖） 【發明內容】 [發明所欲解決之課題] 但是，揭示於上述專利文獻之接觸探針因係焊球和接 觸探針線接觸之構成，故於焊球表面被氧化覆膜覆蓋之時 ，無法確保電性充分的接觸性，有可能於檢查產生阻礙。 也存在有將冠狀之頂部數量增至8個之接觸探針，但 是當增加頂部數量，從加工技術之制約來看，不得不降低 頂部之高度，故稜線所構成之角度成爲平緩，於焊球表面 存在氧化覆膜之時接觸性反而惡化。 再者，於將接觸探針之前端設爲槍狀之時，有可能刺 破氧化覆膜而直接與焊球接觸，接觸面積端變小不僅有在 檢查時損傷焊球之情形’也必須嚴格地定位焊球和接觸探 針。 本發明係鑒於上述課題而硏究出’其目的爲提供即使 焊球和接觸探針之定位具有誤差之時，亦可以與焊球確實 接觸，並且可以確保某程度之接觸面積的檢查用接觸探針 -6 - 201237422 [用以解決課題之手段] 與本發明有關之檢查用接觸探針具有在與檢查對象元 件之端子接觸之接觸面的內側形成具有銳角之頂部的複數 之錐體的構成。 若藉由本構成，提供即使具有焊球和接觸探針之定位 誤差時，亦可以確實與靜球接觸’並且可以確保某程度之 接觸面積。 與本發明有關之檢查用接觸探針具有連結錐體之頂部 的面構成凹面之構成。 若藉由本構成時，因頂部沿著焊球之曲面而接觸’故 可以降低焊球之損傷。 與本發明有關之檢查用接觸探針具有錐體之數量爲9 以上之構成。 若藉由本構成時，則能夠增大頂部和銲球之接觸面積 〇 與本發明有關之檢查用接觸探針具有錐體之頂角爲 60度以下之構成。 若藉由本構成時，即使於焊球表面形成有氧化覆膜之 時，亦可以使檢查用接觸探針確實地接觸於焊球。 [發明效果] 若藉由本發明，提供即使具有焊球和接觸探針之定位 誤差時’亦可以確實與銲球接觸，並且可以確保某程度之 接觸面積的檢查用接觸探針。 201237422 【實施方式】 (第1實施型態） 第1圖爲裝入與本發明有關之接觸探針的檢查用插槽 1之部分剖面圖，接觸探針2被儲存於插槽本體10之中 〇 接觸探針2係由檢查元件側導電部3、印刷基板側導 電部4、芯軸5及彈簧6所構成’芯軸5係滑動自如地與 檢查元件側導電部3及印刷基板側導電部4接觸。彈簧6 係被配置在檢查元件側導電部3及印刷基板側導電部4之 凸緣間，捲繞芯軸5之周圍。 然後，檢查元件側導電部3與檢查對象之1C之焊球（ 無圖示）接觸，印刷基板側導電部4與印刷基板上之銲墊（ 無圖示）接觸。 第2圖爲與本發明有關之接觸探針之檢查元件側導電 部3之上視圖（a)及A-A剖面圖（b)，第3圖爲與本發明有 關之接觸探針之檢查元件側導電部3之斜視圖。 在上視圖（a)中，黑圓圈31〜39係表示頂部’實線表 示稜線，虛線表示谷線。 即是，與本發明有關之接觸探針之檢查元件側導電部 與檢查元件之接觸面，形成頂角Θ爲銳角（少於90度）之 複數個之錐體。 由A-A剖面圖（b)可知，使與本發明有關之接觸探針 之檢查元件側導電部3與1C接觸時，因複數之錐體之頂 部與被檢查對象之1C之焊球2〇接觸，故即使以氧化覆膜 -8- 201237422 覆蓋焊球20表面之時，頂部亦刺破氧化覆膜而能與導電 體之焊錫接觸。 並且，因複數之頂部與焊球20接觸，故不僅與焊球 20之接觸面積增大，即使焊球20和接觸探針之位置多少 偏離，亦可以達成確實之接觸。 本發明雖然規定錐體之形狀、數量及頂部之角度，但 是以形狀爲四角錐體、錐體之數量爲9個以上，頂部之角 0 度爲60度以下爲佳。 如第2圖所示般，爲了在檢查元件側導電部3之上面 形成9個頂角爲60度之四角錐體，如第2圖所示般，藉 由頂角60度以下之圓錐體之切削具，沿著切削線VI〜V4 及Η 1〜H4而切削檢査元件側導電部3之上面，依此進行 製作。 (第2實施型態） 〇 第4圖爲本發明之第2實施型態之接觸探針之檢查元 件側導電部3之上視圖（c)及Β-Β剖面圖（d)。 在第2實施型態中’最初將接觸探針之檢查元件側導 電部3之上面事先加工成接近於焊球20之曲率的曲率之 凹面後，形成錐體。 若藉由該實施型態時，如第4圖（d)所示般，因錐體 之頂部沿著接近於焊球20之曲率的曲率之曲面而連接， 故不僅與焊球20接觸之錐體頂部之數量增加，因複數之 頂部均等與焊球2 0接觸，不會有少數之頂部較深地刺穿 -9- 201237422 ，故亦可以抑制基於檢查之的焊球損傷。 [產業上之利用可行性] 與本發明有關之檢查用接觸探針可用於具有BGA端 子之1C的功能試驗、預燒試驗等，具有產業上之利用可 行性。 【圖式簡單說明】 第1圖爲裝入本發明之第1實施型態之接觸探針的檢 查用插槽之部分剖面圖。 第2圖爲本發明之第1實施型態之接觸探針之檢查元 件側導電部之上視圖（a)及A - A剖面圖（b)。 第3圖爲本發明之第1實施型態之接觸探針之檢查元 件側導電部的斜視圖， 第4圖爲本發明之第2實施型態之接觸探針之檢查元 件側導電部之上視圖（a)及B-B剖面圖（b)。 【主要元件符號說明】 1 :檢查用插槽 2 :接觸探針 3 :檢查元件側導電部 4 :印刷基板側導電部 5 :芯軸 6 :彈簧 -10- 201237422 1 〇:插槽本體 2 0 :焊球[Technical Field] The present invention relates to an inspection contact, and more particularly to an inspection contact probe capable of improving contact with a terminal of an inspection target element. [Prior Art] In recent years, the semiconductor integrated circuit (hereinafter referred to as 1C) has been more widely patterned, and the external connection terminal has 1000 or more on the bottom surface for the 1C using BGR (Ball Grid Array). Solder ball player. The 1C system of such a large scale performs a function test and a burn-in test before being mounted on a printed circuit board. In these tests, an inspection socket is used for electrically connecting the IC and the IC tester. The inspection slot has a number of 1C solder balls and a total number of contact probes, which function to electrically connect the 1C solder balls and the terminals of the 1C tester. Therefore, it is required that the tip of the contact probe and the solder ball of 1C are in contact with each other, and contact probes of various shapes have been proposed (for example, refer to Patent Document 1 and Patent Document 2). Namely, Patent Document 1 discloses a contact probe having a plurality of top portions on the outer edge of the contact probe and a ridge line facing the contact portion of the crown which is lowered toward the contact center. Further, in Patent Document 2, a plurality of tops are provided on the outer edge of the contact probe, and a ridge line extending from the top is offset from the center of the contact probe, and has a crown contact intersecting at an angle of less than 180 degrees. 。 。 。 。 。 。 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 20 06- 1 8405 No. 5 (No. 29, No. 3). [Problems to be Solved by the Invention] However, the contact probe disclosed in the above patent document is caused by solder balls and contacts. Since the probe wire is in contact with each other, when the surface of the solder ball is covered with the oxide film, sufficient electrical contact property cannot be ensured, and there is a possibility that the inspection is hindered. There are also contact probes that increase the number of tops of the crown to eight. However, when the number of tops is increased, the height of the top has to be lowered from the constraints of the processing technique, so that the angle formed by the ridge lines becomes gentle, and the solder balls are When the oxide film is present on the surface, the contact property is rather deteriorated. Furthermore, when the front end of the contact probe is formed into a gun shape, it is possible to pierce the oxide film and directly contact the solder ball, and the contact area end becomes small, and there is a case where the solder ball is damaged at the time of inspection. Position the solder balls and contact probes. The present invention has been made in view of the above problems, and its object is to provide a contact probe for inspection which can be surely contacted with a solder ball even when the positioning of the solder ball and the contact probe has an error, and which can secure a certain contact area. Needle-6 - 201237422 [Means for Solving the Problem] The inspection contact probe according to the present invention has a configuration in which a plurality of cones having an acute top portion are formed inside the contact surface in contact with the terminal of the inspection target element. According to this configuration, it is possible to surely contact the static ball even when there is a positioning error of the solder ball and the contact probe, and it is possible to secure a certain contact area. The inspection contact probe according to the present invention has a configuration in which a surface connecting the tops of the cones constitutes a concave surface. According to this configuration, since the top is contacted along the curved surface of the solder ball, the damage of the solder ball can be reduced. The contact probe for inspection relating to the present invention has a configuration in which the number of the cones is 9 or more. According to this configuration, the contact area between the top portion and the solder ball can be increased. 检查 The inspection contact probe according to the present invention has a configuration in which the apex angle of the cone is 60 degrees or less. According to this configuration, even when an oxide film is formed on the surface of the solder ball, the inspection contact probe can be surely brought into contact with the solder ball. [Effect of the Invention] According to the present invention, it is possible to provide a contact probe for inspection which can surely contact the solder ball even when there is a positioning error of the solder ball and the contact probe, and can secure a certain contact area. [Embodiment] (First embodiment) FIG. 1 is a partial cross-sectional view showing an inspection slot 1 in which a contact probe according to the present invention is incorporated, and the contact probe 2 is stored in the socket body 10. The 〇 contact probe 2 is composed of the inspection element side conductive portion 3, the printed circuit board side conductive portion 4, the mandrel 5, and the spring 6. The mandrel 5 is slidably attached to the inspection element side conductive portion 3 and the printed circuit board side conductive portion. 4 contact. The spring 6 is disposed between the inspection element side conductive portion 3 and the printed circuit board side conductive portion 4, and is wound around the mandrel 5. Then, the inspection element side conductive portion 3 is in contact with the solder ball (not shown) of the 1C to be inspected, and the printed circuit board side conductive portion 4 is in contact with a pad (not shown) on the printed circuit board. Fig. 2 is a top view (a) and a cross-sectional view (b) of the inspection element side conductive portion 3 of the contact probe relating to the present invention, and Fig. 3 is a view showing the side of the inspection element of the contact probe relating to the present invention. An oblique view of the section 3. In the upper view (a), the black circles 31 to 39 indicate that the top 'solid line indicates the ridge line, and the broken line indicates the valley line. Namely, the contact surface of the inspection element side conductive portion of the contact probe of the present invention and the inspection element form a plurality of cones having an acute angle (less than 90 degrees). As is clear from the AA cross-sectional view (b), when the inspection element side conductive portion 3 of the contact probe according to the present invention is brought into contact with 1C, the top of the plurality of cones is in contact with the 1C solder ball 2 of the object to be inspected, Therefore, even when the surface of the solder ball 20 is covered with the oxide film-8-201237422, the top portion pierces the oxide film and can be in contact with the solder of the conductor. Further, since the top of the plurality of contacts is in contact with the solder ball 20, not only the contact area with the solder ball 20 is increased, but also the actual contact can be achieved even if the positions of the solder ball 20 and the contact probe are somewhat deviated. Although the shape, the number, and the angle of the top of the cone are specified in the present invention, the shape is a quadrangular pyramid, the number of the cones is 9 or more, and the angle of the top is 0 degrees or less. As shown in FIG. 2, in order to form nine quadrangular pyramids having an apex angle of 60 degrees on the inspection element side conductive portion 3, as shown in Fig. 2, a cone having a vertex angle of 60 degrees or less is used. The cutting tool is formed by cutting the upper surface of the inspection element side conductive portion 3 along the cutting lines VI to V4 and Η 1 to H4. (Second Embodiment) Fig. 4 is a top view (c) and a cross-sectional view (d) of the inspection element side conductive portion 3 of the contact probe according to the second embodiment of the present invention. In the second embodiment, the upper surface of the inspection element side conduction portion 3 of the contact probe is first processed into a concave surface close to the curvature of the curvature of the solder ball 20, and then a cone is formed. According to this embodiment, as shown in Fig. 4(d), since the top of the cone is connected along a curved surface close to the curvature of the curvature of the solder ball 20, not only the cone in contact with the solder ball 20 is used. The number of tops of the body increases, because the top of the plural is equal to the contact of the solder ball 20, and a few of the tops are not deeply pierced -9-201237422, so the solder ball damage based on the inspection can also be suppressed. [Industrial Applicability] The inspection contact probe according to the present invention can be used for a functional test, a calcination test, etc. of the 1C having a BGA terminal, and has industrial applicability. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional view showing a socket for inspection in which a contact probe according to a first embodiment of the present invention is incorporated. Fig. 2 is a top view (a) and an A-A sectional view (b) of the inspection element side conductive portion of the contact probe according to the first embodiment of the present invention. Fig. 3 is a perspective view showing a conductive portion on the inspection element side of the contact probe according to the first embodiment of the present invention, and Fig. 4 is a view showing the conductive portion on the inspection element side of the contact probe according to the second embodiment of the present invention. View (a) and BB sectional view (b). [Explanation of main component symbols] 1 : Inspection slot 2 : Contact probe 3 : Inspection element side conductive portion 4 : Printed substrate side conductive portion 5 : Mandrel 6 : Spring -10- 201237422 1 〇 : Slot body 2 0 : solder balls