201237300 、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光二極體燈，及一種可封裝一 發光一極體晶粒成發光二極體燈的封裝杯。 【先前技術】 參閱圖1，為目前發光二極體燈1，包括一封裝杯u、 一谷置於該封裝杯11内的發光二極體晶粒12，及一封裝膠 體13。 該封裝杯11具有一可固著於外界且與外界電連接的底 座111 (在圖示中外界以一電路板14為例），及一自該底座 111往上延伸的圍繞壁112，該底座1U及該圍繞壁112界 疋可谷置該發光二極體晶粒12的填膠空間。該圍繞壁 112以聚鄰笨二曱醯胺（p〇lyphthalamide，以下簡稱ΜΑ) 或雙馬來醯亞-二氮雜苯樹脂（bismaieimide_triazine resin，以下簡稱BT樹脂）為主要材料所構成。ppA及 樹月曰為熱塑性及半結晶型的塑膠材料，在發光二極體燈工 所發出光的照射下為白色或乳白色且幾乎不透光。 該發光二極體晶粒12固著於該底座ηι表面且位於該 填膠空間中，該發光二極體晶粒12與該底座111電連接， 且在接受電旎時可將電能轉換為光能而發光。 *亥封裝膠體13為透明可透光，並填覆於該填膠空間 中，且隔絕該發光二極體晶粒12與外界。 备外界自該底座111提供電能給該發光二極體晶粒12 時，该發光二極體晶粒12以電能致光反應而產生光；又， 201237300 根據光學定理，光在兩相異介質介面有折射、反射，及吸 收二種光的行進路線。因此，部份向上的光透過該封裝膠 體13而可正向發光，其餘部份往該封裝杯u的圍繞壁112 的光則由於該圍繞壁112為白色且幾乎不透明，所以大部份 往該圍繞壁112的光是被該圍繞壁丨i 2所吸收，少部份往該 圍繞壁112的光是被該圍繞壁112反射，且由於該圍繞壁 112疋環圍該發光二極體晶粒12，故經由該圍繞壁丨12反射 的光最終仍被該圍繞壁112所吸收。 該發光二極體燈1隨著作動時間的累積，該圍繞壁112 已吸改大量的光能而產生質變並黃化，甚至容易碎裂，導 致無法支撐該發光二極體晶粒12,造成該發光二極體燈i 的使用壽命短。 此外，該發光二極體燈1的發光亮度僅是來自該發光 二極體晶粒12正向發出的光，往該封裝杯^的圍繞壁n2 方向的光被該封裝杯11所吸收，亦使該發光二極體燈1的 發光效率低落。 【發明内容】 因此，本發明之目的，即在提供一種可以提高發光效 率及元件壽命的發光二極體燈。 此外’本發明之另一目的，即在提供一種與一發光二 極體晶粒相配合後可延長所構成的發光二極體燈的使用壽 命的封裝杯。 於是，本發明一種發光二極體燈，包含：一封裝杯、 發光一極體晶粒，即一封裝膠體。 201237300 該封裝杯包括-對外固著並電連接的底座’及—自該 底座延伸並具有-内周面的圍繞壁，關繞壁以透明可= 光且折射率為1〜h7的第-材料構成，該内周面與該底座 共同界定-填膠空間’該發光二極體晶粒固著並電連接於 該底座且位於該填膝空間中，包括—讓光向外射出的正向 出光面’且該正向出光面延伸後與該圍繞壁的内周面的夾 角大於90度且小於180《。該封裝膠體以透明可透光且折 射率大於L3,並大於該第一材料的折射率的第二材料構 成’該封裝膠體容置且包覆該發光二極體晶粒地填置於該 填膠空間而使該發光二極體晶粒與外界隔絕。 本發明-種用於容填一透明可透光且折射率大於Μ的 封裝膝體的封裝杯’而與該封裝膠體共同封裝至少一發光 :極體晶粒使該發光二極體晶粒與外界隔絕。該封裝‘包 ^一底座’及-圍繞壁。該底座對外固著並電連接且供固 者並電連接該發光二極體晶粒，以透明可透光且折射率為】 〜1.7並小於該封裝膠體的折射率的第一材料構成，且自該 底座延伸而具有—關自，該内周面與該底座共同界定一 供该發光二極體晶粒容置的填膠空間，且該内周面與設置 ;I底座上的發光一極體晶粒的正向出光面延 大於90度且小於18〇度 灭冉 本發明之功效：利用該第一材料的折射率小於該第二 材枓的折射率，增進該發光二極體晶粒產生並往該圍繞壁 :向的光導正為正向發光的機率，而可增加整體的發光亮 度，並減少積存於該圍繞壁内的光能，延長該圍繞壁因光 201237300 線照射而老化的時間。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之較佳實施例的詳細說明中，將可清楚 的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中’類似的元件是以相同的編號來表示。 參閱圖2，本發明是一發光二極體燈2的較佳實施例， 該較佳實施例包含一封裝杯21、一發光二極體晶粒22，及 一封裝膠體23 ^ 該封裝杯21包括一底座211，及一圍繞壁212。該底座 211與外界電連接，在本較佳實施例中，外界以一可提供電 能的電路板24為例，且該底座211固著於該電路板24表 面。 該圍繞壁212自該底座211的周緣往上延伸，且是以透 明可透光的第一材料所形成，該第一材料的透明度為不小 於90% ,且不大於100% ,該第一材料的折射率大於丨，且 不大於1.7。該圍繞壁212形成一環圍且朝向内聚方向的内 周面213，該内周面213與該底座211共同界定一填膠空 間，该發光二極體晶粒22固著於該底座211頂面且容置於 該填膠空間中，並與該底座211電連接，而可透過該底座 211接受外界所提供的電能。 該發光二極體晶粒22在接受電能時可將電能轉換為光 能而發光，且具有一遠離該底座211頂面的正向出光面 6 201237300 221，該正向出光面221延伸後與該圍繞壁2i2的内周面 213延伸後形成一灸角彡，該央角0大於90度，且小於 180 度。 ' 该封裝膠體23以第二材料為主要材料所組成，該第二 材料的折射率大於i.3,且該第二材料的折射率需大於第一 材料的折射率，該第二材料的透明度的範圍不小於慨， 且不大於1GG% 〇將該封裝膠體23填人該填膠空間並包覆 該發光—極體晶粒22 ’直到該封裝膠體U覆滿該填膠空 門使該發光一極體晶粒22與外界隔絕，以減少氧氣及水 氣接觸該發光二極體晶粒22的機會。 田底座211自該電路板24接受電能並傳送至該發光二 "體曰曰粒22 ’該發光二極體晶粒22將電能轉換為光能而發 光’部份光自該發光二極體晶粒22的正向出光面221往正 向發光’部份往該圍繞I 212内周自213的光行至該封裝 〃 3及該圍繞壁212的界面時，由於該圍繞壁犯的内 周面213延伸後與該正向出光面221延伸後的夾角0大於 90度，故往該界面的光具有一入射角，再藉由構成圍繞壁 2U的第一材料的折射率小於構成該封裝膠體23的第二材 料的折射率’使行進至該透明的圍繞@ 212的折射角大於 /入射角，即，若自該發光二極體晶粒22產生的光與該正 °光面221的角度大於〇度，則可調整光的方向為往正 :的方：偏折而增加整體正向發光亮度；而就目前已知的 201237300 23的第二材料包括折射率大於i 3，且大於第_材料的折射 率的具有至少一苯基的石夕化合物’兩者供該發光二極體晶 粒22產生的光偏折，達到該較佳實施例提升正向發光亮度 及減少該圍繞壁212所吸收光能的目的。 儿又 特別地，若該圍繞壁212的内周面213與該正向出光 面221延伸後的夾角0增大至15〇度，則來自該發光二極 體晶粒22側面的光所形成的入射角會較夾角0為9〇度時 的入射角大，再經由該圍繞壁212的偏折，則依照斯乃耳 定理，該折射角在增大至90度時會轉變為全反射，光不再 進入該圍繞壁212,而是利用該圍繞壁212的内周面213全 反射後直接正向發光，降低光進入該圍繞壁212的機率。 該較佳實施例發光二極體燈2是透過該圍繞壁212的 折射率小於該封裝膠體23的折射率，導引該發光二極體晶 粒22產生的光經過該圍繞壁212的折射後可增加正向發光 亮度；再配合該圍繞壁212的内周面213與該發光二極體 晶粒22的正向出光面221所延伸的炎角0大於15〇度，亦 可增加光全反射的機率，而直接增加整體的正向發光效 率〇 需說明的是，若該圍繞壁212的内周面213與該發光 二極體晶粒22的正向出光面221的夾角必為18〇度，即表 示該圍繞壁212與該正向出光面221平行，且該封裝杯21 的圍，类壁212與底座211無法形成一可容置該發光二極體晶 粒22的填膠” ’故該圍繞壁212的内周面213與該發光 二極體晶粒22的正向出光面221需小於⑽度。而若該圍 201237300 繞壁212的内周面213與該發光二極體晶粒 面221的爽角0小於90度時，該發光二極體晶粒正 生的光在經過該圍繞壁212的折射後僅可 2所產 出光的方向前進，而無法增加正向出光的機率。於該正向 參閱圖3,㈣地，該封|膠體23 的填膠空間外，還可繼續往上延伸、覆：㈣裝杯 垂d 玄圍繞壁212的頂 面並達到-預疋厚度，使該發光二極體燈2的頂面為一平 坦的平面，而不會由於該發光二極…的 =212及該封裝膠體23的頂面共同形成，造成頂面㈣ 平整的表面。 综上所述，利用該透明的圍繞壁212與封裝膠體23, 再配合構成該圍繞1212的第—材料的折射率小於構成該 封裝膠體23的第二材料的折㈣，增加該發光二極體晶粒 22正向發光的機率，提升該發光二極體燈2整體發光亮 度，故確實能達成本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一剖視圖，說明習知一發光二極體燈； 圖2是一剖視圖，說明本發明發光二極體燈的一較佳 實施例；及 圖3疋一剖視圖，說明該較佳實施例的封裝膠體可繼 201237300 續延伸而覆蓋一圍繞壁頂面。 10 201237300 【主要元件符號說明】 2 ....... •…發光二極體燈 22••… •…發光二極體晶粒 21…… …·封裝杯 221… —正向出光面 211 ··· •…底座 23 •…封裝膠體 212… •…圍繞壁 24"... •…電路板 213… —内周面 Φ ··' …·夾角 11201237300, invention: [Technical Field] The present invention relates to a light-emitting diode lamp, and a package cup which can encapsulate a light-emitting monopole die into a light-emitting diode lamp. [Prior Art] Referring to Fig. 1, a current LED lamp 1 includes a package cup u, a light-emitting diode die 12 placed in the package cup 11, and an encapsulant 13 . The package cup 11 has a base 111 (which is exemplified by a circuit board 14 in the figure) and a surrounding wall 112 extending upward from the base 111. The base has a base 111 that is fixed to the outside and electrically connected to the outside. 1U and the surrounding wall 112 define a filling space for the LED die 12 . The surrounding wall 112 is composed of poly(p〇lyphthalamide, hereinafter referred to as ΜΑ) or bismaieimide-triazine resin (hereinafter referred to as BT resin). ppA and sapphire are thermoplastic and semi-crystalline plastic materials that are white or milky white and almost opaque under the light emitted by a light-emitting diode lamp. The LED die 12 is fixed on the surface of the base ηι and located in the filling space, and the LED die 12 is electrically connected to the base 111, and converts electric energy into light when receiving electric power. Can shine. The galvanic encapsulant 13 is transparent and permeable to light, and is filled in the filling space, and isolates the luminescent diode die 12 from the outside. When the external body 111 supplies electric energy to the light-emitting diode die 12, the light-emitting diode die 12 generates light by electric light-induced reaction; and, 201237300, according to the optical theorem, the light is in the two-phase different medium interface. There are paths of refraction, reflection, and absorption of two kinds of light. Therefore, part of the upward light passes through the encapsulant 13 to be positively illuminated, and the rest of the light that surrounds the wall 112 of the encapsulation cup u is white and almost opaque due to the surrounding wall 112, so most of the surrounding The light of the wall 112 is absorbed by the surrounding wall i2, a portion of the light directed toward the surrounding wall 112 is reflected by the surrounding wall 112, and the light emitting diode die 12 is surrounded by the surrounding wall 112. Therefore, the light reflected by the surrounding wall 12 is still finally absorbed by the surrounding wall 112. The light-emitting diode lamp 1 accumulates with the development time, and the surrounding wall 112 has absorbed a large amount of light energy to cause a qualitative change and yellowing, and is even prone to chipping, resulting in failure to support the light-emitting diode die 12, resulting in The light-emitting diode lamp i has a short service life. In addition, the illuminating brightness of the illuminating diode lamp 1 is only the light from the forward direction of the illuminating diode die 12, and the light in the direction surrounding the wall n2 of the package cup is absorbed by the package cup 11. The luminous efficiency of the light-emitting diode lamp 1 is lowered. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a light-emitting diode lamp which can improve luminous efficiency and device life. Further, another object of the present invention is to provide a package cup which can extend the life of the formed light-emitting diode lamp in cooperation with a light-emitting diode die. Therefore, the light-emitting diode lamp of the present invention comprises: a package cup, a light-emitting one-pole crystal, that is, an encapsulant. 201237300 The package cup comprises a base which is fixedly and electrically connected to the base and a surrounding wall extending from the base and having an inner peripheral surface, and the first material which is closed to the wall and transparent to light and has a refractive index of 1 to h7 The inner peripheral surface and the base jointly define a filling space. The light emitting diode is fixed and electrically connected to the base and located in the knee filling space, including a positive light output for allowing light to be emitted outward. The angle 'and the angle between the positive exit surface and the inner peripheral surface of the surrounding wall is greater than 90 degrees and less than 180". The encapsulant is formed by a second material that is transparent and permeable to light and has a refractive index greater than L3 and greater than a refractive index of the first material. The encapsulant is filled and the photodiode is coated to fill the fill. The glue space isolates the light-emitting diode die from the outside. The invention relates to a package cup for filling a transparent permeable light-transmitting package with a refractive index larger than Μ, and co-packing at least one illuminating with the encapsulant: a polar body grain makes the illuminating diode die and Isolated from the outside world. The package 'packages a base' and - surrounds the wall. The pedestal is externally fixed and electrically connected to the illuminator and electrically connected to the illuminating diode die, and is formed of a first material which is transparent and permeable to light and has a refractive index of less than 1.7 and less than the refractive index of the encapsulant. Extending from the base, the inner circumferential surface and the base jointly define a filling space for accommodating the LED body, and the inner circumferential surface and the setting; The positive light exiting surface of the bulk crystal grains is greater than 90 degrees and less than 18 degrees. The effect of the present invention is: the refractive index of the first material is smaller than the refractive index of the second material, and the light emitting diode crystal grains are enhanced. Producing and going to the surrounding wall: the direction of the light guide is positively illuminating, and can increase the overall brightness of the light, and reduce the light energy accumulated in the surrounding wall, prolonging the surrounding wall due to the illumination of the light 201237300 line time. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 2, the present invention is a preferred embodiment of a light-emitting diode lamp 2. The preferred embodiment includes a package cup 21, a light-emitting diode die 22, and an encapsulant 23 ^ the package cup 21 A base 211 is included, and a surrounding wall 212 is included. The base 211 is electrically connected to the outside. In the preferred embodiment, the external circuit is exemplified by a circuit board 24 that can provide electric power, and the base 211 is fixed to the surface of the circuit board 24. The surrounding wall 212 extends upward from the periphery of the base 211 and is formed by a transparent, light transmissive first material having a transparency of not less than 90% and not more than 100%, the first material The refractive index is greater than 丨 and is not greater than 1.7. The surrounding wall 212 defines an inner circumferential surface 213 that surrounds the cohesive direction. The inner circumferential surface 213 and the base 211 define a filling space. The LED die 22 is fixed to the top surface of the base 211. And being placed in the filling space and electrically connected to the base 211, and the externally supplied electric energy can be received through the base 211. The light-emitting diode die 22 can convert the electrical energy into light energy to emit light when receiving electric energy, and has a positive light-emitting surface 6 201237300 221 away from the top surface of the base 211, and the forward light-emitting surface 221 extends and Extending around the inner peripheral surface 213 of the wall 2i2, a moxibustion angle 形成 is formed, which is greater than 90 degrees and less than 180 degrees. The encapsulant 23 is composed of a second material having a refractive index greater than i.3, and the refractive index of the second material is greater than the refractive index of the first material, and the transparency of the second material The range of the package is not less than 1 GG%, and the encapsulant 23 is filled in the filling space and covers the illuminating body-pole dies 22' until the encapsulant U covers the filling door to make the illuminating The polar body grains 22 are isolated from the outside to reduce the chance of oxygen and moisture contacting the light-emitting diode grains 22. The base 211 receives power from the circuit board 24 and transmits it to the illuminating two "body granules 22'. The illuminating diode dies 22 convert electrical energy into light energy to illuminate 'partial light from the illuminating diode When the positive light-emitting surface 221 of the die 22 is illuminating in the forward direction to the interface of the package 〃 3 and the surrounding wall 212 around the inner circumference of the I 212, the inner circumference of the surrounding wall After the surface 213 is extended, the angle 0 extending from the forward light-emitting surface 221 is greater than 90 degrees, so that the light toward the interface has an incident angle, and the refractive index of the first material constituting the surrounding wall 2U is smaller than that of the package. The refractive index ' of the second material of 23 is such that the angle of refraction traveled to the transparent surrounding @212 is greater than/incident angle, i.e., if the light produced from the light-emitting diode die 22 is at an angle to the positive grating 221 If it is larger than the twist, the direction of the light can be adjusted to be positive: the square is increased to increase the overall forward luminance; and the second material of the currently known 201237300 23 includes the refractive index greater than i 3 and larger than the first _ a refractive index of the material having at least one phenyl group Light deflecting the light diode 22 grains produced, the preferred embodiment to achieve lift and forward the purpose of reducing the emission luminance of the surrounding wall 212 to absorb light energy. In particular, if the angle 0 between the inner circumferential surface 213 of the surrounding wall 212 and the forward light-emitting surface 221 is increased to 15 degrees, the light from the side surface of the light-emitting diode die 22 is formed. The incident angle will be larger than the incident angle when the angle 0 is 9 ,, and then the deflection through the surrounding wall 212, according to the Snell's theorem, the angle of refraction will be converted to total reflection when the angle is increased to 90 degrees. Instead of entering the surrounding wall 212, the inner peripheral surface 213 of the surrounding wall 212 is totally reflected and directly directly illuminates, reducing the probability of light entering the surrounding wall 212. The light-emitting diode lamp 2 of the preferred embodiment has a refractive index smaller than the refractive index of the encapsulant 23 through the surrounding wall 212, and the light generated by the LED die 22 is refracted by the surrounding wall 212. The positive light emitting brightness can be increased; and the inner peripheral surface 213 of the surrounding wall 212 and the positive light emitting surface 221 of the light emitting diode die 22 extend at an angle of more than 15 degrees, which can also increase total light reflection. The probability of directly increasing the overall forward luminous efficiency. It should be noted that if the inner circumferential surface 213 of the surrounding wall 212 and the positive light emitting surface 221 of the light emitting diode die 22 are at an angle of 18 degrees. That is, the surrounding wall 212 is parallel to the forward light-emitting surface 221, and the surrounding of the package cup 21, the wall 212 and the base 211 cannot form a glue that can accommodate the light-emitting diode die 22" The inner peripheral surface 213 of the surrounding wall 212 and the forward light emitting surface 221 of the light emitting diode die 22 need to be less than (10) degrees. If the outer circumference of the wall 212 is around the inner peripheral surface 213 of the wall 212 and the light emitting diode die When the refresh angle 0 of the surface 221 is less than 90 degrees, the light of the light-emitting diode grain is passing through the surrounding wall. The refraction of 212 can only advance in the direction of the two generated light, and can not increase the probability of positive light emission. In the forward direction, refer to Figure 3, (4), the sealing space of the seal 23 can continue to The upper extension and the cover: (4) the top surface of the wall 212 and the pre-twist thickness is obtained, so that the top surface of the light-emitting diode lamp 2 is a flat plane without being due to the light-emitting diode... And the top surface of the encapsulant 23 is formed together to form a flat surface of the top surface (four). In summary, the transparent surrounding wall 212 and the encapsulant 23 are used to form the first material surrounding the 1212. The refractive index is smaller than the fold (four) of the second material constituting the encapsulant 23, increasing the probability of the light-emitting diode die 22 being positively illuminating, and improving the overall illuminating brightness of the illuminating diode lamp 2. Therefore, the present invention can be achieved. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change of the patent application scope and the description of the invention is Modifications, all still belong to the invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a conventional light-emitting diode lamp; FIG. 2 is a cross-sectional view showing a preferred embodiment of the light-emitting diode lamp of the present invention; 3 is a cross-sectional view showing that the encapsulant of the preferred embodiment can be extended to cover a top surface of the wall following the 201237300. 10 201237300 [Signature of main components] 2 ....... • Light Emitting Diode Lamp 22••... •...Light-emitting diode die 21...... ...·Packing cup 221...—positive light-emitting surface 211 ····...base 23 •...package body 212... •...around wall 24"... •...Circuit board 213... — Inner peripheral surface Φ ··' ...· angle 11