TW201235140A - Adjustment apparatus, laser machining apparatus, and adjustment method - Google Patents

Adjustment apparatus, laser machining apparatus, and adjustment method Download PDF

Info

Publication number
TW201235140A
TW201235140A TW101100184A TW101100184A TW201235140A TW 201235140 A TW201235140 A TW 201235140A TW 101100184 A TW101100184 A TW 101100184A TW 101100184 A TW101100184 A TW 101100184A TW 201235140 A TW201235140 A TW 201235140A
Authority
TW
Taiwan
Prior art keywords
shape
laser
workpiece
pattern
laser light
Prior art date
Application number
TW101100184A
Other languages
English (en)
Chinese (zh)
Inventor
Ryuichi Yamazaki
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW201235140A publication Critical patent/TW201235140A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
TW101100184A 2011-01-18 2012-01-03 Adjustment apparatus, laser machining apparatus, and adjustment method TW201235140A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011008119A JP5791908B2 (ja) 2011-01-18 2011-01-18 調整装置、レーザ加工装置および調整方法

Publications (1)

Publication Number Publication Date
TW201235140A true TW201235140A (en) 2012-09-01

Family

ID=46519495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101100184A TW201235140A (en) 2011-01-18 2012-01-03 Adjustment apparatus, laser machining apparatus, and adjustment method

Country Status (4)

Country Link
JP (1) JP5791908B2 (ja)
KR (1) KR20120083854A (ja)
CN (1) CN102601519A (ja)
TW (1) TW201235140A (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
CN102922133B (zh) * 2012-11-09 2015-09-16 武汉市楚源光电有限公司 一种自动光学检测激光焊接系统
CN103192165A (zh) * 2013-03-20 2013-07-10 黑龙江科技学院 基于视觉跟踪的六自由度焊接机器人
JP6305013B2 (ja) * 2013-10-28 2018-04-04 株式会社ディスコ 加工装置
CN103639599B (zh) * 2013-12-20 2016-07-06 大族激光科技产业集团股份有限公司 一种激光去毛刺系统及方法
JP6341731B2 (ja) * 2014-04-07 2018-06-13 三菱日立パワーシステムズ株式会社 肉盛溶接装置、エロージョンシールドの形成方法及び動翼製造方法
JP2016146403A (ja) * 2015-02-06 2016-08-12 株式会社ディスコ レーザー加工装置
JP6355580B2 (ja) * 2015-03-20 2018-07-11 株式会社キーエンス レーザマーキング装置、該レーザマーキング装置を用いて印字結果を確認する印字確認方法及びコンピュータプログラム
JP6831302B2 (ja) * 2017-06-21 2021-02-17 トヨタ自動車株式会社 レーザ加工品の製造方法および電池の製造方法
KR102511543B1 (ko) 2018-03-09 2023-03-17 삼성디스플레이 주식회사 표시 장치
CN109027974B (zh) * 2018-06-20 2020-05-26 Oppo（重庆）智能科技有限公司 一种光源位置调整装置及调整方法
JP6904927B2 (ja) * 2018-07-30 2021-07-21 ファナック株式会社 ロボットシステムおよびキャリブレーション方法
JP7180245B2 (ja) * 2018-09-27 2022-11-30 日本電産株式会社 加工機械用データ処理装置及び加工機械用データ管理システム
CN111872544B (zh) * 2020-07-31 2022-01-18 深圳市学而用科技有限公司 激光出光指示点的标定方法、装置和振镜同轴视觉系统
KR102465812B1 (ko) * 2021-04-08 2022-11-11 주식회사휴비스 레이저 가공장치 보정 시스템 및 레이저 가공장치 보정방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置
JP5090121B2 (ja) * 2007-10-01 2012-12-05 オリンパス株式会社 調整装置、レーザ加工装置、調整方法、および調整プログラム

Also Published As

Publication number Publication date
JP2012148302A (ja) 2012-08-09
CN102601519A (zh) 2012-07-25
JP5791908B2 (ja) 2015-10-07
KR20120083854A (ko) 2012-07-26

Similar Documents

Publication Publication Date Title
TW201235140A (en) Adjustment apparatus, laser machining apparatus, and adjustment method
TWI422452B (zh) Adjustment device, laser processing device, adjustment method and adjustment program
US9964401B2 (en) Inspection system for inspecting an object and inspection method for same
JP5185617B2 (ja) リペア方法及びその装置
CN108598032B (zh) 一种晶圆接合对准系统及对准方法
US10563977B2 (en) Three-dimensional measuring device
TW594435B (en) Pattern writing apparatus and pattern writing method
TWI484283B (zh) 影像計算量測方法、影像計算量測裝置及影像檢查裝置
WO2009008605A2 (en) Maskless exposure method
US11619591B2 (en) Image inspection apparatus and image inspection method
CN115837747B (zh) 用于光源模组拼接的标定方法、投影方法及3d打印方法
US20080292304A1 (en) Projection Type Image Display Apparatus And Projection Type Image Display System
TWI781052B (zh) 將一光敏層曝光之裝置及方法
JP2014035261A (ja) 情報処理方法、情報処理装置、プログラム、撮像装置、検査方法、検査装置、及び基板の製造方法
KR101234932B1 (ko) 마스크리스 노광 장치와 방법, 및 평판 디스플레이 패널의제조 방법
JP2011075336A (ja) ３次元形状計測装置、３次元形状計測方法
Sugimoto et al. Directionally decomposing structured light for projector calibration
JP5235062B2 (ja) 露光装置
CN102829956B (zh) 图像检测方法,图像检测装置以及图像检查装置
WO2021053852A1 (ja) 外観検査装置、外観検査装置の較正方法及びプログラム
KR20180040316A (ko) 광학 3d 스캐너
JP7318190B2 (ja) 形状測定装置、形状測定方法及び形状測定プログラム
CN112838018B (zh) 光学量测方法
JP7459525B2 (ja) 三次元形状計測装置、三次元形状計測方法及びプログラム
JP7188176B2 (ja) プロジェクター、画像表示システム及び画像表示システムの制御方法