201232916 五、發明說明： 【發明所屬之技術領域】 本發明的領域係有關於行動裝置之天線的製程，尤其 是應用高壓轉印（0MD)包覆模塑互連電路元件(MID)天線 的方法。 【先前技術】 由於資訊科技的蓬勃發展’帶動了無線通信技術 的進步’行動裝置慑然成為現代人必備的溝通工具。 因此對行動電話功能需求也日益增加。由於無線通 訊的電波必須升頻，載波，才可以做有效的多工傳送， 所以必須借助天線才能進行這些動作。因此天線是無 線通訊設備中相當重要的元件。傳統的天線主要是外 置式的天線，如採用helical天線或dipole型式的天 線。唯這些款式的天線外露在機殼的外部，所以很容 易折相’再者也會使得機體的體積增加。近來慢慢的 使用内置型的天線取代傳統的外置式天線。傳統的内 置式天線主要是PIFA天線的型式，通常是由射頻元件 及其基體固定支架組成。射頻元件是一定形狀的金屬 件或軟印刷電路板或剛性印刷電路板。近來已開發在_ 模塑互連電路元件(MID)天線的製造技術，以在行動裝置 的機殼上配置天線。 傳統上在模塑互連電路元件（MID)製造天線一般可有 兩種不同的方式：分別為雙射鎮模（Two Shot Molding)法及 雷射活化（Laser Direct Structuring，LDS)法。 201232916 其中雙射鑄模顧名思義即做兩次的射出作業，其步驟 為：先以塑膠射出作業形成一底材（一般即為一電子裝置的 機殼），在射出作業中同時在該底材預留形成一凹陷區，即 天線之線路。再進行第二次射出作業，將可鲁鍵的塑膠注 入該凹陷區。然後應用化學鍍的方式在該第二次射出之塑 膠的表面上鍍導電金屬，此導電金屬即為天線。至於雷射 活化(LDS)的方式，其步驟為：先以塑膠射出作業形成一基 底，其中該基底為掺雜金屬添加物的塑膠材料。在基底表 面上預定形成天線處以雷射活化，經活化的基底表面即可 鑛上金屬。 為了使基材表面的天線與基材背面的電路連通，不管 是採用雙射鑄模法或雷射活化法(LDS)製作天線，通常都會 在基材表面上安排連通基材兩面之通孔，再以化鍍於通孔 内壁之表面產生金屬層，達成基材兩面之電路連通。因此 以雙射鑄模法或雷射活化法（LDS)製作天線，便會於基材外 表上產生孔洞，影響觀瞻。 此外，如果採用雙射鑄模法，容易在兩次射出的接合 處產生斷差’或結合力不足’容易造成基材表面不平整， 或該零件使用過程中，也可能因為外力因素，或工件本身 内應力，造成兩次射出的接合處出現翹曲不平的狀態，影 響天線特性以及外觀。 另外，不管是採用雙射鑄模法或雷射活化法(LDS)製作 天線，通常都必須在基材表面再喷漆，以保護基材表面， 並裝飾外觀或改變觸感。 201232916 【發明内容】 本發明的目的為提出一種應用高壓轉印（OMD)包覆模 塑互連電路元件(MID)天線的方法，其可改進模塑互連電路 元件(MID)天線習知技術之缺點，而提供更為平坦美觀且对 用的零件。 為達到上述目的，本發明中提出一種應用高壓轉印 (OMD)包覆模塑互連電路元件(MID)天線的方法，該方法包 含下列步驟:取一 MID基材及一塑膠薄膜；其中該MID基 鲁 材上已形成一金屬層，該金屬層為一天線電路；該塑膠薄 膜可以是素面的，或者可於其上印刷圖案，並塗佈接著材 料；將該薄膜夹置於一夾座上，然後以加熱器加熱軟化該 薄膜；隨後將該夾座連同該薄膜覆蓋在MID基材的上方， 並於該薄膜的下方抽真空，並於薄膜的上方加高壓空氣， 而使得該薄膜受壓，以致緊緊地附著在該MID基材上方， 達成遮蔽基材上的通孔、高度斷差，以美化基材外觀，並 保護天線的目的。 【實施方式】 茲謹就本案的結構組成，及所能產生的功效與優點， 配合圖式’舉本案之一較佳實施例詳細說明如下。須了解 下列說明僅適用於本案之一例’並未用於限制本案之範 圍。本發明係有關於應用高壓轉印（OMD)技術在模塑互連 電路元件(MID)天線上覆膜的方法。茲說明本發明的製程如 下： $ 〇 取一 MID基材1〇及一薄膜20(較佳者為塑膠膜）；其 [s] 5 201232916 中該MID基材10 —般為塑膠射出件，且其上已形成一金 屬層50，該金屬層50為一天線電路；該薄膜20可以是素 面的，或於其上印刷圖案21，並塗佈接著材料22。該薄膜 20係夾置於一夾座30上，且該MID基材10谢·安置於一 定位支撐治具36上，定位支撐治具36則安裝於一基座35 上（圖一）； 然後以加熱器40加熱軟化該薄膜20 (圖二）。 隨後移開加熱器40，將該夾座30連同該薄膜20覆蓋 在該MID基材10的上方，並於夾座30與基座35閉合後， 於該薄膜20的下方形成下空腔62 (圖三）。 首先對下空腔62抽真空，然後隔離腔60與夾座30閉 合，並於該薄膜20上方形成上空腔61，接著對上空腔61 注入高溫高壓氣體，而使得該薄膜20受壓，以致緊緊地附 著在該基材10上方（圖四）。 打開上下兩空腔，取出已包覆薄膜20之MID基材 1〇(圖五）；再以裁切工具37裁切MID基材10邊緣之薄膜 (圖六）。 在本步驟中，也可以不同時使用抽真空及注入高壓氣 體，而僅在上方的空腔61中注入高壓氣體，或僅在下方的 空腔62中抽真空。 本發明中製造MID基材10的方法有兩種，茲一一說 明如下： 第一種為雙射鑄模，顧名思義即經做兩次射出作業， 201232916 其步驟為： 先以塑膠射出作業形成一底材100(—般即為一電子裝 置的機殼）’在射出作業中同時在該底材100上預留形成一 凹陷區110,該凹陷區110的圖形即為天線的圖形（圖七）。 再進行第二次射出作業，將可鍍的塑膠120注入該凹 陷區110的上方表面（圖八）。 然後應用化學鍍的方式在可鍍的塑膠120表面上鍍金 屬層130，此導電金屬層130即為天線（圖九），如此即形成 基材10。 為了使底材100上下兩面的電路導通，通常會於第一 及第二次射出時，於底材100上預留形成通孔140，以利 化鍍時於通孔140之内壁表面形成金屬層，而達成底材100 上下兩面電路導通（圖七、八、九）。 另一種方式為應用雷射活化(LDS)的方式形成本發明 中的MID基材1〇，該方法包含下列步驟： 先以塑膠射出作業形成一基底200，該基底200之材 料為掺雜金屬添加物之塑膠材料，其中的金屬添加物可被 雷射活化（圖十）。 在基底200表面上預定形成天線處進行雷射活化。於 雷射活化的區域表面再鍍上金屬層210做為天線（圖十一）。 為了使基底200上下兩面的電路導通，通常會於基底 200上另形成通孔14〇，以雷射活化通孔14〇之内壁表面， 以及化鍍方法於通孔14〇之内壁表面形成金屬層21〇，而 201232916 達成基底200上下兩面電路導通（圖十二）。 本發明中應用高壓轉印（OMD)所包覆的薄膜可能相當 的薄（厚度甚或小於50μιη)，加上薄膜於加熱過程中軟化， 以至於當薄膜20貼附在通孔14〇上方並於其上注入高溫高 壓氣體時，該薄膜20將會於通孔140所對應之仅置產生; 陷。因此於高壓轉印（OMD)前，可在通孔140内加入填充 材料150 (較佳者為點膠），以防止該薄膜下陷（圖十三十 四）〇 另一種方式為在加壓程序時，引一導管300,該導管 3〇〇的一端開口位在該高壓氣體的空腔61中，另—端伸入 抽真空的空腔62 ’而其開口則通過定位支撐治具36，密接 於通孔140下方’並將高壓側的壓力導向通孔14〇，使得 該通孔140於薄膜上下兩邊的壓力平衡，以致該薄膜不會 產生下陷（圖十五）。 ^ 本發明的方式可適用於各種不同的可攜式電子裝置， 如手機，PDA，手提電腦等。 本發明的優點為應用OMD的技術，在MID基材上覆 上一層膜’此一膜層可以覆蓋基材上的孔洞及高度斷差， 使基材具有平整的外觀，同時也可創造多樣化圖案及質感 的外觀’此外也保s蔓該基材及其上的天線不會受到傷害。 對於採用雙射鑄模法製作的天線，此一膜層更可以緊 緊包覆二次射出之天線結構，避免兩次射出的接合處出現 翹曲不平的情況。 綜上所述，本案人性化之體貼設計，相當符合實際；s] 8 201232916 求。其具體改進現有缺失，相較於習知技術明顯具有突破 性之進步優點，確實具有功效之增進，且非易於達成。本 案未曾公開或揭露於國内與國外之文獻與市場上，已符合 專利法規定。上列詳細說明係針對本創作之一可行實施例 之具體說明，惟該實施例並非用以限制本創作之專利範 圍，凡未脫離本創作技藝精神所為之等效實施或變更，均 應包含於本案之專利範圍中。 201232916 【圖式簡單說明】 第一圖示本發明之MID基材及塑膠膜的示意圖。 第二圖示本發明中以加熱器加熱該薄膜的示意圖。 第三圖示本發明中將該薄膜覆蓋在該鍍有天線的MID 基材的示意圖。 第四圖示本發明中抽真空及加高壓作業的示意圖。第 五圖示本發明中打開上下兩空腔取出已包覆薄膜之MID基 材示意圖。 第六圖示本發明中以裁切工具裁切MID基材邊緣之薄 膜示意圖。 第七圖示雙射鑄模中射出具有凹陷區之底材的示意 圖。 第八圖示雙射鑄模中第二次射出可鍍塑膠的示意圖。 第九圖示雙射鑄模中在可鍍塑膠上鍍金屬之作業的示 意圖。 第十圖示基底為掺雜金屬添加物的塑膠材料示意圖。 第十一圖示基底經雷射活化並鍍上金屬的示意圖。 第十二圖示基底設置通孔以導通兩面電路的示意圖。 第十三圖示對基底通孔置入填充材料的示意圖。 第十四圖示對基底通孔置入填充材料的示意圖。 第十五圖示高壓轉印作業中對基底通孔連接壓力導管 201232916 的示意圖。 【主要元件符號說明】 10 MID基材 61 上空腔 20 薄模 62 下空腔 21 印刷圖案 100 底材 22 接著材料層 110 凹陷區 30 夾座 120 可鍍塑膠層 35 基座 130 金屬層 36 定位支撐治具 140 通孔 37 裁切工具 150 填充材料 40 加熱器 200 基底 50 金屬層 210 金屬層 60 隔離腔 300 導管201232916 V. OBJECTS OF THE INVENTION: FIELD OF THE INVENTION The field of the invention relates to the process of antennas for mobile devices, and more particularly to methods for overmolding interconnected circuit component (MID) antennas using high voltage transfer (0MD) . [Prior Art] Due to the booming of information technology, 'the advancement of wireless communication technology' has become a necessary communication tool for modern people. Therefore, the demand for mobile phone functions is also increasing. Since the radio wave of the wireless communication must be up-converted, the carrier can be effectively multiplexed, so the antenna must be used for these actions. Antennas are therefore a very important component in wireless communication equipment. Conventional antennas are mainly external antennas, such as antennas with ahelical antenna or dipole type. Only these types of antennas are exposed on the outside of the case, so they are easy to fold. In addition, the volume of the body will increase. Recently, the built-in antenna has been slowly used to replace the conventional external antenna. Conventional built-in antennas are primarily of the type of PIFA antenna and are typically comprised of a radio frequency component and its base mounting bracket. The RF component is a shaped metal or flexible printed circuit board or rigid printed circuit board. Recently, a manufacturing technique of a molded interconnect circuit component (MID) antenna has been developed to configure an antenna on a casing of a mobile device. Antennas have traditionally been fabricated in molded interconnect circuit components (MIDs) in two different ways: the Two Shot Molding method and the Laser Direct Structuring (LDS) method. 201232916 The two-shot casting mold, as its name suggests, does two injection operations. The steps are as follows: firstly, a plastic injection operation is used to form a substrate (generally an electronic device casing), and the substrate is reserved in the injection operation. A recessed area, that is, an antenna line is formed. Then, the second injection operation is performed, and the plastic of the button is injected into the recessed area. Then, a conductive metal is plated on the surface of the second shot plastic by electroless plating, and the conductive metal is an antenna. As for the laser activation (LDS) method, the steps are as follows: a plastic injection operation is first performed to form a substrate, wherein the substrate is a plastic material doped with a metal additive. The antenna is intended to be formed on the surface of the substrate to be activated by laser, and the surface of the activated substrate can be metal on the surface. In order to make the antenna on the surface of the substrate communicate with the circuit on the back surface of the substrate, whether the antenna is fabricated by two-shot molding or laser activation (LDS), the through-holes connecting the two sides of the substrate are usually arranged on the surface of the substrate. The metal layer is formed on the surface of the inner wall of the through hole by plated to achieve circuit communication on both sides of the substrate. Therefore, the antenna is fabricated by two-shot molding or laser activation (LDS), which creates holes on the outer surface of the substrate and affects the viewing. In addition, if the two-shot casting method is used, it is easy to cause a gap on the joint of the two shots, or the joint force is insufficient, which may cause the surface of the substrate to be uneven, or the use of the part may be due to an external force factor or the workpiece itself. The internal stress causes a warp state at the joint where the two shots are emitted, affecting the antenna characteristics and appearance. In addition, whether the antenna is fabricated by two-shot molding or laser activation (LDS), it is usually necessary to repaint the surface of the substrate to protect the surface of the substrate and to decorate the appearance or change the touch. 201232916 SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of applying a high voltage transfer (OMD) overmolded interconnect circuit component (MID) antenna that can improve molded interconnect circuit component (MID) antenna conventional techniques The disadvantages are that it provides a flatter, more aesthetically pleasing part. In order to achieve the above object, the present invention provides a method for applying a high voltage transfer (OMD) overmolded interconnect circuit component (MID) antenna, the method comprising the steps of: taking a MID substrate and a plastic film; A metal layer is formed on the MID base material, and the metal layer is an antenna circuit; the plastic film may be plain or may be printed thereon and coated with a bonding material; the film is sandwiched by a holder And then heating the film by heating with a heater; then covering the holder with the film over the MID substrate, vacuuming the film, and applying high pressure air over the film, so that the film is subjected to The pressure is tightly attached to the MID substrate to achieve a through hole and a height difference on the shielding substrate to beautify the appearance of the substrate and protect the antenna. [Embodiment] In view of the structural composition of the present invention, and the functions and advantages that can be produced, a preferred embodiment of the present invention will be described in detail below. It should be understood that the following instructions are only applicable to one of the cases in this case' and are not intended to limit the scope of this case. SUMMARY OF THE INVENTION The present invention is directed to a method of coating a molded interconnect circuit component (MID) antenna using high pressure transfer (OMD) technology. The process of the present invention is illustrated as follows: $ 〇 a MID substrate 1 〇 and a film 20 (preferably a plastic film); [s] 5 201232916, the MID substrate 10 is generally a plastic injection member, and A metal layer 50 has been formed thereon, and the metal layer 50 is an antenna circuit; the film 20 may be plain or have a pattern 21 printed thereon and coated with a bonding material 22. The film 20 is placed on a holder 30, and the MID substrate 10 is disposed on a positioning support fixture 36, and the positioning support fixture 36 is mounted on a base 35 (Fig. 1); The film 20 is softened by heating with a heater 40 (Fig. 2). Then, the heater 40 is removed, the holder 30 is covered with the film 20 over the MID substrate 10, and after the holder 30 and the base 35 are closed, a lower cavity 62 is formed under the film 20 ( Figure 3). First, the lower cavity 62 is evacuated, then the isolation cavity 60 and the holder 30 are closed, and an upper cavity 61 is formed above the film 20. Then, the upper cavity 61 is injected with high temperature and high pressure gas, so that the film 20 is pressed to tighten Tightly attached to the substrate 10 (Fig. 4). The upper and lower cavities are opened, and the MID substrate 1 of the coated film 20 is taken out (Fig. 5); and the film of the edge of the MID substrate 10 is cut by the cutting tool 37 (Fig. 6). In this step, it is also possible to use vacuuming and injecting a high-pressure gas at the same time, and to inject only high-pressure gas into the upper cavity 61 or to evacuate only the lower cavity 62. There are two methods for manufacturing the MID substrate 10 in the present invention, which are described as follows: The first one is a two-shot casting mold, which, as the name implies, is subjected to two injection operations, 201232916. The steps are as follows: First, a plastic injection operation is performed to form a bottom. The material 100 (that is, the casing of an electronic device) is simultaneously formed on the substrate 100 to form a recessed area 110 in the injection operation, and the pattern of the recessed area 110 is the pattern of the antenna (FIG. 7). A second ejection operation is performed to inject the plateable plastic 120 into the upper surface of the recessed region 110 (Fig. 8). Then, a metal layer 130 is plated on the surface of the plateable plastic 120 by electroless plating, and the conductive metal layer 130 is an antenna (Fig. 9), so that the substrate 10 is formed. In order to make the circuit on the upper and lower sides of the substrate 100 conductive, a through hole 140 is formed in the substrate 100 during the first and second ejections to form a metal layer on the inner wall surface of the through hole 140 during plating. And the substrate 100 is turned on and off on both sides of the substrate (Figures 7, 8, and 9). Another way is to form the MID substrate 1〇 in the present invention by applying laser activation (LDS). The method comprises the following steps: First, a substrate 200 is formed by a plastic injection operation, and the material of the substrate 200 is doped metal. The plastic material of the material, in which the metal additive can be activated by laser (Fig. 10). Laser activation is performed at a predetermined formation of an antenna on the surface of the substrate 200. The surface of the laser activated region is further plated with a metal layer 210 as an antenna (Fig. 11). In order to make the circuit on the upper and lower sides of the substrate 200 conductive, a through hole 14 is formed on the substrate 200 to activate the inner wall surface of the through hole 14 , and a metal layer is formed on the inner wall surface of the through hole 14 . 21〇, and 201232916 reached the upper and lower sides of the base 200 circuit (Figure 12). The film coated with high pressure transfer (OMD) in the present invention may be relatively thin (thickness or even less than 50 μm), and the film is softened during heating so that when the film 20 is attached over the through hole 14〇 When the high temperature and high pressure gas is injected thereon, the film 20 will be formed only in the corresponding hole 140; Therefore, before the high pressure transfer (OMD), a filling material 150 (preferably dispensing) may be added to the through hole 140 to prevent the film from sinking (Fig. 13). Another way is in the pressurizing procedure. At the same time, a conduit 300 is introduced, one end of the conduit 3 is open in the cavity 61 of the high-pressure gas, the other end is extended into the vacuumed cavity 62' and the opening is passed through the positioning support fixture 36, and is closely connected. Below the through hole 140' and directing the pressure on the high pressure side to the through hole 14〇, the pressure of the through hole 140 on the upper and lower sides of the film is balanced so that the film does not sink (Fig. 15). The method of the present invention can be applied to various portable electronic devices such as mobile phones, PDAs, laptop computers and the like. The advantage of the present invention is that the technology of applying OMD is coated with a film on the MID substrate. This film layer can cover the holes and height deviations on the substrate, so that the substrate has a flat appearance and can also be diversified. The appearance of the pattern and texture 'also protects the substrate and the antenna on it from damage. For an antenna fabricated by a two-shot casting method, the film layer can be tightly wrapped around the antenna structure of the second shot to avoid warping of the joint at the two shots. In summary, the humanized design of this case is quite realistic; s] 8 201232916. The specific improvement of the existing defects, compared with the obvious advancement advantages of the prior art, does have an improvement in efficacy and is not easy to achieve. The case has not been disclosed or disclosed in domestic and foreign literature and market, and has complied with the provisions of the Patent Law. The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiment is not intended to limit the scope of the patents, and the equivalent implementations or modifications that are not included in the spirit of the present invention should be included in The patent scope of this case. 201232916 [Simplified description of the drawings] First, a schematic diagram of a MID substrate and a plastic film of the present invention is shown. The second diagram is a schematic view of the present invention in which the film is heated by a heater. Third Embodiment A schematic view of the film covering the antenna-coated MID substrate in the present invention. The fourth diagram is a schematic view of the vacuuming and high pressure operation in the present invention. The fifth embodiment is a schematic view of the MID substrate in which the upper and lower cavities are opened to take out the coated film in the present invention. Fig. 6 is a view showing a film of the edge of the MID substrate cut by a cutting tool in the present invention. The seventh diagram shows a schematic view of a substrate having a recessed portion in a double shot mold. The eighth illustration shows a second shot of the moldable plastic in the double shot mold. The ninth illustration shows the operation of metallizing a plateable plastic in a two-shot mold. The tenth illustration substrate is a schematic representation of a plastic material doped with a metal additive. The eleventh illustration shows a schematic diagram of the substrate being laser activated and plated with metal. The twelfth illustration shows a schematic view in which the substrate is provided with a through hole to turn on the two-sided circuit. A thirteenth diagram is a schematic view of placing a filling material into a through-substrate via. The fourteenth diagram shows a schematic view of the placement of the filling material into the substrate through holes. The fifteenth is a schematic diagram showing the connection of the base through-hole pressure conduit 201232916 in a high-pressure transfer operation. [Main component symbol description] 10 MID substrate 61 Upper cavity 20 Thin mold 62 Lower cavity 21 Printed pattern 100 Substrate 22 Next material layer 110 Recessed area 30 Clamping seat 120 Plastic plated layer 35 Base 130 Metal layer 36 Positioning support Fixture 140 Through Hole 37 Cutting Tool 150 Filling Material 40 Heater 200 Substrate 50 Metal Layer 210 Metal Layer 60 Isolation Chamber 300 Catheter