201230413 發明說明： 【發明所屬之技術領域】 [0001] [0002] [0003] 本發明係有關於-種L E D封裝固化方法，尤其是 指-種能有效大幅減少LED封裝固化時所耗費的時= ’相對能縮短整體L ED製程„，連帶降低led製 作成本，而在其整體施行使用上更增實用功效特性之L E D封裝固化方法創新設計者。 【先前技術】 按’ led〔發光二極體〕在使用上僅需耗用極小 之電能’即可使其發出光亮，使得其相對所消耗之功率 較小，能有效大幅降低電能資源之使用，加上其具有體 積小、壽命長、反應速率快'耐震特性佳及單色性佳等 優點，而令其逐漸廣為受到各界所接受雀用，也因此業 界皆開始致力於該發光二極體之各種研發、改良。 而該L E D在製作上，其主要步驟可分為：清洗' 裝架、壓焊、封裝、銲接、切膜、裝配、測試、包裝等 步驟；其中，就該L E D封褒步驟而言，請_併參閱第 二圖現有之實施狀態示意圖所示，該L E D ( 3 )係於 將晶片（3 1)固设於支架（32)上，且利用為環氧 樹脂〔Ε ρ ο X y〕或矽膠〔Si 1 ic〇ne〕之固 化層（33)封裝於支架（32)上，使該固化層（3 3)將晶片（3 1)連同支架（32)包覆固定，再予 以置於對流式熱風烤箱（4 )中，於1 2 〇〇c的溫度下 ’令熱能由流動之氣體f動至固化層（3 3)表面，熱 能再經由該固化層（3 3)本身的熱傳導性傳導至其内 100101451 表單編號A0101 第4頁/共10頁 1002002599-0 201230413 部，約4小時後完成封裝固化步驟β [0004] Ο [0005] 然而，上述封裝固化步驟方式雖可達到於晶片連同 支架外包覆固化層之預期功效，但也在其實際操作施行 使用上發現，該方式之熱能係先由流動之氣體帶動至固 化層表面，再經由該固化層本身的熱傳導性傳導至其内 部，使得其熱能需經過兩次轉換，不僅較為耗費能量， 且熱傳導速度亦較為緩慢，而需花費極多時間方能讓該 固化層完成固化動作，連帶造成令led整體製程時間 極長，相對同樣讓該L E D之製作成本無法有效降低， 致令其在整體操作施行上猶存有改進之空間。 緣是，發明人有鑑於此，秉持多年該相關行業之豐 富設計開發及實際製作經驗，針對現有之結構及缺失予 以研究改良’提供一種L ED封裝固化方法，以期達到 更佳實用價值性之目的者。 [0006]❹ 【發明内容】 本發明之主要目的在提供一種L E D封裝固化方法 ’該L E D主要係將晶片固設於支架上，且利用固化層 封裝於支架上，使該固化層將晶片連同支架包覆固定， 100101451 再以紅外線幅射器直接照射，使得紅外線幅射器所發出 的紅外線熱能可直接以輻射方式導入L E D之固化層内 部’該固化層之分子即可與紅外線幅射器所發出之紅外 線波長產生共振，加速該固化層之固化速度；藉此，以 能有效大幅減少L E D封裝固化時所耗費的時間，相對 能縮短整體L E D製程時間，連帶降低L E D製作成本 ’而在其整體施行使用上更增實用功效特性者。 表單蝙號A0101 第5頁/共10頁 1002002599-0 201230413 【實施方式】 [_ 為令本發明所運狀技術内容、發明目的及其達成 之功效有更完整且清楚的揭露，茲於下詳細說明之，並 請一併參閱所揭之圖式及圖號： 百先，請參閱第-圖本發明之實施狀態示意圖所示 ’本發明之L E D ( 1 )主要係將晶片（丄丄）固設於 支架（1 2 )上，且利用為環氧樹脂〔E p 〇 χ y〕或 矽膠〔S i 1 i c 〇 n e〕之固化層（丄3 )封裝於支 架（1 2 )上，使該固化層（1 3 )將晶片（：l !)連 同支架（1 2)包覆固定。 再將該包覆有固化層（1 3 )之LED (丄）以紅 外線幅射II (2)直接照射’該紅外線幅射器（2)所 發出之紅外線波長約在卜3 · 5um，使得紅外線幅 射器（2)所發出的紅外線熱能可直接以輻射方式導入 L E D ( 1 )之固化層（3 )内部，該固化層（1 3 )之分子即可與紅外線幅射器（2)_出之紅外線波 長產生共振，加速該固化層（1 3 )之固化速度，使得 封裝固化能更為快速在短時間内即達成。 藉由以上所述，本發明之元件組成與使用實施說明 可知，本發明與現有結構相較之了，本發明主要係能有 效大幅減少LED封裝固化時所耗費的時間，相對能縮 短整體LED製程時間，連帶降低Led製作成本，而 在其整體施行使用上更增實用功效特性者。 [0011] 然而前述之實施例或圖式並非限定本發明之產品名士 1或使用方式，任何所屬技術領域中具有通常 = 表早編號Αοιηι 苐δ頁/共10頁 [0008] [0009] [0010] 100101451 1002002599-0 201230413 適當變化或修飾，皆應視為不脫離本發明之專利範疇。 [0012] 綜上所述，本發明實施例確能達到所預期之使用功 效，又其所揭露之具體構造，不僅未曾見諸於同類產品 中，亦未曾公開於申請前，誠已完全符合專利法之規定 與要求，爰依法提出發明專利之申請，懇請惠予審查， 並賜准專利，則實感德便。 【圖式簡單說明】 [0013] 第一圖··本發明之實施狀態示意圖 〇 [0014] 第二圖：現有之實施狀態示意圖 【主要元件符號說明】 [0015] ( 1 ) LED ( 1 1 )晶片 [0016] ( 1 2 )支架 （1 3 )固化層 [0017] [0018]201230413 Description of the invention: [Technical field of the invention] [0001] [0002] The present invention relates to a method for curing an LED package, in particular, a type capable of effectively reducing the time required for curing of an LED package. 'Comparatively able to shorten the overall L ED process „, with the LED package curing method that reduces the cost of LED production and the practical application of the LED package curing method. [Previous technology] Press 'led [light emitting diode] In use, it only needs to use very little electric energy' to make it emit light, so that it consumes less power, which can effectively reduce the use of electric energy resources, plus its small size, long life and fast reaction rate. 'The advantages of good shock resistance and good monochromaticity make it gradually accepted by all walks of life. Therefore, the industry has been working on various R&D and improvement of the LED. The main steps can be divided into: cleaning 'mounting, pressure welding, packaging, welding, film cutting, assembly, testing, packaging and other steps; wherein, in terms of the LED sealing step, please _ and referring to the schematic diagram of the prior implementation state of the second figure, the LED (3) is used to fix the wafer (31) on the bracket (32) and utilizes epoxy resin [Ε ρ ο X y] or The cured layer (33) of the silicone (Si 1 ic〇ne) is packaged on the support (32), so that the cured layer (33) coats and fixes the wafer (31) together with the support (32), and then places the convection In the hot air oven (4), at a temperature of 1 2 〇〇c, heat is transferred from the flowing gas f to the surface of the solidified layer (3 3), and the thermal energy is further conducted through the heat conduction of the solidified layer (3 3) itself. To the inside of the 100101451 Form No. A0101 Page 4 / Total 10 Page 1002002599-0 201230413, the package curing step is completed after about 4 hours [0004] Ο [0005] However, the above-mentioned package curing step can be achieved in the wafer together with the support The expected effect of the outer cladding cured layer, but also found in its practical operation, the thermal energy of the method is first driven by the flowing gas to the surface of the solidified layer, and then transmitted to the inside through the thermal conductivity of the solidified layer itself. So that the heat energy needs to be converted twice, not only costly Energy, and the heat conduction speed is also relatively slow, and it takes a lot of time to complete the curing action of the solidified layer, which causes the LED overall processing time to be extremely long, and the manufacturing cost of the LED can not be effectively reduced. There is still room for improvement in the overall operation. The reason is that, in view of this, the inventors have been researching and improving the existing structure and the lack of experience in the design and development of the relevant industries for many years. Curing methods for the purpose of achieving better practical value. [0006] The main purpose of the present invention is to provide a method for curing an LED package. The LED is mainly used to fix a wafer on a support, and is packaged on the support by using a cured layer, so that the cured layer can be used together with the support. Covered and fixed, 100101451 is directly irradiated by infrared radiator, so that the infrared heat energy emitted by the infrared radiator can be directly radiated into the solidified layer of the LED. The molecules of the solidified layer can be emitted from the infrared radiator. The infrared wavelength resonates to accelerate the curing speed of the cured layer; thereby, the time taken for curing the LED package can be greatly reduced, and the overall LED process time can be shortened, and the LED manufacturing cost can be reduced. Use more practical features. Form bat number A0101 Page 5 / Total 10 pages 1002002599-0 201230413 [Embodiment] [_ For a more complete and clear disclosure of the technical content, the object of the invention and the effects achieved by the present invention, Illustrated, and please refer to the drawings and drawings of the drawings: pp., please refer to the first embodiment of the present invention. The LED (1) of the present invention mainly focuses on the wafer (丄丄). It is disposed on the support (1 2 ) and is encapsulated on the support (1 2 ) by a cured layer (丄 3 ) which is an epoxy resin (E p 〇χ y) or a silicone rubber (S i 1 ic 〇ne), so that the The cured layer (13) coats the wafer (:l!) with the support (12). The LED (丄) coated with the cured layer (13) is directly irradiated with infrared radiation II (2). The infrared wavelength emitted by the infrared radiator (2) is about 3 · 5 um, so that the infrared ray The infrared heat energy emitted by the radiator (2) can be directly radiated into the solidified layer (3) of the LED (1), and the molecules of the solidified layer (13) can be combined with the infrared radiator (2) The infrared wavelength resonates to accelerate the curing speed of the cured layer (13), so that the package curing can be achieved more quickly in a short time. As described above, the component composition and the implementation description of the present invention show that the present invention is mainly in comparison with the existing structure, and the present invention is mainly capable of effectively reducing the time taken for curing the LED package, and relatively shortening the overall LED process. Time, in conjunction with lowering the cost of Led production, and adding more practical features to its overall implementation. [0011] However, the foregoing embodiments or drawings do not limit the product name 1 or the use mode of the present invention, and any one of the technical fields in the art has the usual = table early number Α ο ι ι / ι 页 页 页 页 / / / 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 0008 100101451 1002002599-0 201230413 Appropriate changes or modifications are considered to be within the scope of the invention. [0012] In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has completely complied with the patent. The provisions and requirements of the law, the application for invention patents in accordance with the law, and the application for review, and the grant of patents, are truly sensible. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 is a schematic view showing an implementation state of the present invention. [0014] FIG. 2 is a schematic view of an existing implementation state [Description of main component symbols] [0015] (1) LED (1 1 ) Wafer [0016] (1 2 ) Stent (13) cured layer [0017] [0018]
[0019] (2 ) 紅外線幅射器 （3 ) LED (3 1 )晶片 （3 2 )支架 (3 3)固化層 （4) 對流式熱風烤箱 100101451 表單編號A0101 第7頁/共10頁 1002002599-0[0019] (2) Infrared Radiator (3) LED (3 1 ) Wafer (3 2 ) Bracket (3 3) Solidified Layer (4) Convection Hot Air Oven 100101451 Form No. A0101 Page 7 / Total 10 Page 1002002599- 0