TW201230067A - Conductive composition, conductive film, and method for forming a conductive film - Google Patents

Abstract

This invention provides a conductive composition which can be baked in an atmospheric environment and a method for forming a conductive film using such conductive composition. The conductive composition of the present invention contains (A) a metal powder of a base metal as a main component, (B) an amine compound represented by the following chemical formula (1) or an aliphatic amine having two or more than two amino groups, and (C) an aliphatic hydroxy acid: R2-HN-R1-O-R3...(1) Wherein R1 represent an alkylene group having 2 to 8 carbon atoms, R2 and R3 respectively represents a H atom, or an alkyl group having 1 to 4 carbon atoms.

Description

[Technical Field] The present invention relates to a conductive composition which can be used, for example, in the formation of a conductive film of an electronic component, and a method of forming a conductive film using the conductive composition. [Prior Art] As a method of forming a conductive circuit of various electronic components, a subtraction method or an addition method is known. In the addition method, a conductive composition is applied onto a substrate by a technique such as screen printing to form a pattern. The conductive composition is fired at a predetermined temperature to form a conductive film (conductive circuit). Patent Document 1 discloses a conductive composition containing a solvent of a polyol having two or more OH groups such as copper powder, ethylene glycol or diethylene glycol, and a solvent derived from malic acid or citric acid. An additive made up of two or more COOH and a compound having one or more OH groups. This conductive composition can be fired not only in an inert gas atmosphere but also in an air atmosphere at a low temperature. Further, according to this conductive composition, it is possible to prevent the oxidation of the copper particles of the filler, and it is possible to form a conductive film having good conductivity. [Prior Art] (Patent Document) Patent Document 1: JP-A-2007-258123 SUMMARY OF INVENTION [Problems to be Solved by the Invention] However, the conductive composition disclosed in Patent Document 1 can be large. 323621 201230067 The temperature range for firing in a gaseous environment is extremely limited in the range of 150 to 200 °C. Therefore, in the conductive composition disclosed in Patent Document 1, it is difficult to control the firing temperature, and there is a problem that it is difficult to put it into practical use. The present invention has been made in view of the above circumstances, and an object thereof is to provide a conductive composition which can be fired in an air atmosphere, and a method of forming a conductive film using the conductive composition. [Means for Solving the Problems] As a result of intensive studies to solve the above problems, the present inventors have found that by adding a specific carboxylic acid and a specific amine compound to a metal powder mainly composed of a base metal such as copper, A conductive composition that is fired in an atmospheric environment. In other words, the conductive composition of the present invention is characterized in that it contains (A) a metal powder mainly composed of a base metal, and (B) an amine compound represented by the following general formula (1), or An aliphatic amine having two or more amine groups, and (C) a fatty hydroxy acid. ^-HN-^-O-Rs * *(1) (wherein, Ri represents a C 2 to 8 alkyl group, and R 2 and R 3 ' respectively represent a deuterium atom or an alkyl group having 1 to 4 carbon atoms. In the conductive composition of the present invention, the (Β) component is preferably an aliphatic amine having a mercapto group. The aforementioned (Β) component is at least 1 selected from the group consisting of 3-amino-1-propanol, 3-anthoxypropylamine, hydrazine-methylethanolamine, and 1,3-diaminopropane.

4 323621 S 201230067 is preferred, and 3-amino-1-propanol is preferred. > In the conductive composition of the present month, the component (c) is preferably at least one selected from the group consisting of: ethanol and citric acid, and particularly preferably glycolic acid. The conductive composition of the present invention is preferably a linear epoxy resin having at least one or more OH groups in the molecule. The component (A) is preferably one selected from the group consisting of copper, bromine, zinc, tin, and solder. Further, the present invention k provides a conductive film which is coated at 70 after the conductive composition is applied onto a substrate. (The above 50 (the one obtained by heating below TC. Further, the present invention provides a method of forming a conductive film which has a coating composition of any one of the above-mentioned conductive compositions on a substrate, at 7 ° C The above 500. (The method of forming the conductive film in the heat treatment step of the following heating. In the method, the heat treatment step is preferably carried out in an atmosphere. [Effect of the Invention] According to the present invention, it is possible to provide an atmosphere at the atmosphere. A conductive composition which is fired in a medium and a method of forming a conductive film using the conductive composition. [Embodiment] [Best Mode for Carrying Out the Invention] Hereinafter, a mode for carrying out the present invention will be described in detail. The conductive composition contains: (A) a bismuth powder mainly composed of a base metal, and (B) an amide compound 323621 5 201230067 represented by the following general formula (1), or two or more Amino-based aliphatic amine, and aliphatic hydroxy acid. R2 - HN - Ri - Ο - R3 (1) (wherein, Ri represents a carbon number of 2 to 8, and R2 and R3 represent Atom or an alkane with 1 to 4 carbon atoms The "metal powder mainly composed of a base metal" of the component (A) means that the base metal is contained in an amount of 50% by weight or more, more preferably 7% by weight or more, more preferably 90% by weight or more. The meaning of the metal powder. Therefore, it is not only the metal powder formed by the soap metal, but also the metal powder formed by the mixture of the base metal and other metals, and as long as the base metal is more than 5% by weight, That is, it is referred to herein as "metal powder based on soap metal." Alternatively, it may be a metal powder made of an alloy of a base metal and another metal (for example, a solder of an alloy of tin and other metals). The tin-based tin contains more than 5% by weight, which is referred to herein as "the metal powder with the base metal as the main body". The term "pepper metal" is generally used as the relative name of "precious metal". "Peer metal" means all the metals other than gold and silver. "Bashing metal" also refers to a metal that has a high chemical tendency and a high ionization tendency and is easily deuterated in a high temperature environment. In this For example, iron, cobalt, nickel, copper, zinc, molybdenum, tungsten, cadmium, indium, tin, antimony, etc., which are used in the Ming Dynasty, are preferably copper. The resistance is low and high conductivity can be obtained, 'at the same time, when the conductive circuit on the printed circuit board t is formed, it is not easily affected by the movement of electrons. 323621 5 6 201230067 The above-mentioned component (A) is based on the base metal. The average particle diameter of the metal powder is not particularly limited, and is preferably 1 nm or more and 100 # m or less, and more preferably 100 nm or more and 10 # m or less. When the average particle diameter is within this range, the conductive composition can be used as the conductive composition. In the present specification, the average particle diameter is measured by a laser diffraction scattering type particle size distribution, and is referred to as an average particle diameter on a number basis. The metal powder mainly composed of a base metal can be produced by a known method such as an electrolytic method, a reduction method or an atomization method. As the amine compound represented by the above formula (1), specifically, for example, 2-aminoethanol, 3-amino-1-propanol, 4-amino-1-butanol, and 3-methoxyoxypropylamine can be exemplified. , N-methylethanolamine, N-mercaptopropanolamine and the like. As the compound represented by the above formula (1), an aliphatic amine having an OH group is preferably used. That is, it is preferred that R2 and R3 in the above formula (1) are both ruthenium atoms. As the compound of the above formula (1), it is preferred to use 3-amino-1-propanol. The "aliphatic amine having two or more amine groups (mono-2)" of the above (Β) component means a compound in which a ruthenium atom of a linear or branched saturated hydrocarbon is substituted with two or more amine groups. meaning. Namely, a diamine in which a halogen atom of a saturated hydrocarbon having a linear or branched shape is substituted with two amine groups is used as an example of the compound represented by the following general formula (2). H2N - R4 - NH2 Formula (2) (wherein R4 represents an alkylene group.) In the above formula (2), R4 is preferably an alkylene group having 2 to 12 carbon atoms, and 7 323621 201230067 carbon number 2 The alkyl group to 8 is more preferred. Specific examples of the compound represented by the above formula (2) include 1, 3-diamine propane, 1,4-diamine butane, 1,5-diamine pentane, and 1,8-diamine octane. 1,10-diamine decane, and the like. Among them, the use of 1,3-diamine propane is preferred. The "aliphatic hydroxy acid" of the component (C) refers to an aliphatic carboxylic acid having an OH group, and specific examples thereof include glycolic acid, lactic acid, glyceric acid, hydroxybutyric acid, malic acid, tartaric acid, and citric acid. 3-hydroxypropionic acid and the like. Among them, it is preferred to use at least one selected from the group consisting of glycolic acid, lactic acid, and citric acid, and glycolic acid is preferred. Further, the conductive composition of the present invention preferably contains a linear epoxy resin having one or more OH groups in the (D) molecule. The term "linear" as used herein means that there is no benzene ring in the molecule, and at least three or more carbons have a linear structure in addition to the terminal epoxy group. The epoxy resin which can be used in the present invention is not particularly limited, and for example, sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, diglycerin polyglycidol, glycerol polyglycidyl ether, and the like can be used. Polyglycidyl ether, etc. by methyl propylene. These are respectively the structures of the following formulas (3) to (7) (again, η in the formula (4) is 1 to 10). 323621 5 (3)201230067 1

°^\7 ο ο

(5) ο °^\7 ο

(6)

ΟΗ

(7) By adding the above-mentioned (D) component "linear epoxy resin having an OH group" to the above (Α) to (C) components, the coating property and adhesion of the conductive composition to the substrate can be improved. On the other hand, when "the epoxy resin without 9 323621 201230067 OH group" is added to the above components (A) to (C), the compatibility of the epoxy resin with the above components (B) and (C) is not good. Therefore, it is impossible to fully obtain such an effect. Further, when the (〇) component "linear epoxide having an OH group" is added to the above components (A) to (C), the surface of the soap metal particles can be prevented by blocking the oxygen by the epoxy resin. Oxidation. Thereby, it becomes possible to burn the conductive composition at a high temperature, and it is possible to form a conductive film having high conductivity. The paste-like conductive composition can be obtained by mixing the above components (A) to (C) and the component (D) added as needed. Further, the above components (A) to (C) may be mixed in an arbitrary order, for example, 'the components (A) to (C) may be simultaneously mixed', or the components (B) and (C) may be previously mixed. The component (A) is then added to the mixture from the back. The mixing ratio of the components (A) to (C) in the conductive composition of the present invention is not particularly limited, but is 1 to 50 parts by weight based on 1 part by weight of the component (A). The component (c) is preferably 1 to 50 parts by weight. It is preferably 5 parts by weight to 25 parts by weight of the component (B) and 5 parts by weight to 25 parts by weight of the component (C). It is preferably 5 parts by weight to 10 parts by weight of the component (B) and 5 parts by weight to 10 parts by weight of the component (C). When the mixing ratio of the components (B) and (C) is less than the above range, a conductive film having high conductivity may not be obtained. When the mixing ratio of the components (B) and (C) is more than the above range, the viscosity of the conductive composition becomes too low, which may adversely affect the coating performance of the substrate during screen printing. The conductive composition of the present invention may be added as needed to adjust the viscosity suitable for printing on a substrate, in addition to the above components (A) to (D).

10 323621 S 201230067 Solvent or organic binder, etc. As a solvent or an organic binder, for example, those disclosed in JP-A-2007-258123 and the like can be used. As the solvent for diluting the conductive composition for lowering the viscosity, for example, methanol, ethanol, 1,3-propanediol, ethylene glycol monoacetate or hydroxyacetic acid ethyl acetate can be used. Next, a method of forming a conductive film using the conductive composition obtained as described above on a substrate will be described. After mixing the above components (A) to (C) and the component (D) as needed, and preparing a paste-like conductive composition, the conductive composition is applied onto a substrate. As the coating method, for example, a known method such as a screen printing method can be used. After the paste-like conductive composition is applied onto the substrate, the conductive composition is fired at a temperature of 7 G ° C or more and 5 GGt or less (heat treatment step). When the firing temperature is lower than the above range, the volatilization or thermal decomposition of the organic substance in the conductive composition is insufficient, and the conductivity of the conductive film is inhibited by the organic matter. On the other hand, when the firing temperature is higher than this range, the surface of the base metal in the conductive composition is easily oxidized, and a conductive film having high conductivity cannot be obtained. The firing temperature is preferably in the range of 15 Å or more and 5 Å or less (rc or less). The preferred range of the firing temperature differs depending on the type of the soap metal of the above component (4). Further, whether or not the conductive composition contains the above ( For example, although copper is used as the base metal of the component (A), and in the case of the component (D), it is preferable to burn at 15 〇 to gamma. It is more preferable to burn in 200 to 35 Torr. When copper is used as the base metal of the above (4) component, and in the form of the above (9) component (four), 323621 201230067 is fired at 250 to 500 ° C to form ruthenium. In the range of 35 〇 to 5 〇〇. (: The middle sinter becomes better. When it is the bismuth metal of the above (A) component, it is made of bismuth nickel, and in the case where the above (D) component is not contained, it is ΐ5〇. β (: to 400 °c, the firing is preferably performed at 200 to 35 (the TC is more preferably burned. When the bismuth metal is used as the above-mentioned (A) component, and the above-mentioned (D) component is contained, Next, it is preferred to burn at 250 to 500 ° C, and it is more preferable to burn at 35 ° to 5 ° C. When used as the soap metal of the above (A) component In the case where the above-mentioned (D) component is not used, the conductive composition is preferably burned at 80 ΐ: to 3 〇〇C to be in the range of 8 〇 to 15 〇. When tin is used as the base metal of the above component (A), and in the case where the above component (D) is not contained, it is preferable to burn at 8 (TC to 23 〇t, to be 80 to 15 〇C). Further, it is preferable to form a conductive film by drying the conductive composition to a temperature of about m (2 (TC), depending on the type of the base metal of the above (A) component. For example, as the above (A) When zinc is used as the base metal of the component, the conductive film can be formed by drying only the conductive composition at room temperature. ^ As a base metal of the above component (A), the above-mentioned (D) is not included. In the case of bismuth, 'the conductive composition should be dried at room temperature or 'at 300'. (: The following temperature is preferred, and it is better to burn at 80 to 150 ° C. Zinc is used as the base metal of the above component (A), and 'in the case of containing the above component (D)' is in the range of 100 to 3 Å. It is better to burn in 15 〇 to 300 。. Further, 'the conductive composition is 50 ° C or more and 50 〇. (The following steps of heating and firing can be carried out in the atmosphere (oxygen) around the conductive composition). Atmospheric ring 323621

S 12 201230067 is carried out in the environment, and can also be carried out in a nitrogen atmosphere that is excluded from the atmosphere. The step of drying the conductive composition at around room temperature may be carried out in an atmospheric environment in which atmospheric (oxygen) is present around the conductive composition, or in a nitrogen atmosphere in which oxygen is removed by atmospheric gas. The conductive film thus obtained has high conductivity in the film because of the presence of particles made of a base metal. In particular, when copper is used as the component (4): since the electrical resistance of copper is low and the material is hardly affected by the movement of electrons, a conductive film having high conductivity and mobility can be obtained. The conductive film obtained by burning the conductive composition of the invention can be used for forming a circuit pattern in a conductive circuit of various electronic components, for example, a printed substrate. The conductive composition of the present invention can be fired in an atmosphere in which oxygen is present. Therefore, it is not necessary to burn a conductive composition at a low cost in order to make the inside of the firing furnace a bulky facility for a nitrogen atmosphere. According to the conductivity and the composition of the present invention, a conductive film having high conductivity can be formed. The reason why the conductive composition of the present invention is applied to such an effect is considered to be as follows. That is, in the conductive composition, since the component (c) is contained, the thin oxide layer on the surface of the particles formed of the base metal is removed by the flux effect of the organic acid. In the surface of the particles from which the oxide layer is removed, the above components (B) and (C) are considered to form a certain complex. Then, when the conductive composition is heated in the atmosphere, the complex becomes a protective layer, and it is considered that thermal decomposition is performed while suppressing oxidation of the surface of the particles formed by the base metal. By this, 323621 13 201230067, when a conductive composition is fired in an atmosphere, a conductive film having high conductivity can be formed. Further, the reason for obtaining the effects of the present invention described above is not limited by the scope of the present invention as estimated by the inventors of the present invention based on the knowledge obtained by the current field observation. EXAMPLES Hereinafter, Examples 1 to 12 of the present invention will be described, but the present invention is not limited thereto. Example 1 100 parts by weight of copper powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of glycolic acid as the component (C). The conductive composition is modulated. As the copper powder, a spherical powder having an average particle diameter of 1 # m is used. After the obtained composition was coated on a substrate, it was heated at 200 ° C for 10 minutes to form a conductive film. Further, similarly, the prepared composition was applied onto a substrate, and then heated at 300 ° C for 5 minutes to form a conductive film. When the specific resistance values of the two conductive films thus obtained were measured, the results of 0.8 χ 10_4 [Ω·cm] and 0.5 χ 10_4 [Ω·cm] were obtained. Example 2 100 parts by weight of copper powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of lactic acid as the component (C) were prepared. Conductive composition. As the copper powder, a spherical powder having an average particle diameter of 1/m is used. After the obtained composition was coated on a substrate, it was heated at 300 ° C for 5 minutes to form a conductive film. When the specific resistance value of the thus obtained conductive film was measured, the result of 2.5 χ 10_4 [Ω · οιη] was obtained.

14 323621 S 201230067 • Example 3 100 parts by weight of copper powder as the component (A), and 10 parts by weight of 3-amino-1-propanol as the component (B), and lemon as the component (C) 10 parts by weight of the acid was used to prepare a conductive composition. As the copper powder, a spherical powder having an average particle diameter of l#m was used. After the obtained composition was coated on a substrate, it was heated at 300 ° C for 5 minutes to form a conductive film. When the specific resistance value of the conductive film thus obtained was measured, a result of 1.5 χ 10_4 [Ω * cm] was obtained. Example 4 100 parts by weight of copper powder as the component (A), 5 parts by weight of 1,3-diaminopropane as the component (B), and 10 parts by weight of glycolic acid as the component (C) were prepared. Conductive composition. As the copper powder, a spherical powder having an average particle diameter of 1 / z m is used. After the obtained composition was coated on a substrate, it was heated at 300 ° C for 5 minutes to form a conductive film. When the specific resistance value of the thus obtained conductive film was measured, a result of 1.0 χ 10_4 [Ω πιη] was obtained. Example 5: 100 parts by weight of copper powder as the above (Α) component, 10 parts by weight of 3-methoxypropylamine as the above (Β) component, and 10 parts by weight of glycolic acid as the component (C), and conductivity were prepared. Composition. As the copper powder, a spherical powder having an average particle diameter of 1 # m is used. After the obtained composition was coated on a substrate, it was heated at 300 ° C for 5 minutes to form a conductive film. When the specific resistance value of the thus obtained conductive film was measured, a result of 0.9 χ 10_4 [Ω ππι] was obtained. Example 6 100 parts by weight of copper powder as the above (Α) component was mixed, and 10 parts by weight of N-mercaptoethanolamine as a component of the above (C) 15 323621 201230067, and 10 parts by weight of glycolic acid as the component (C) was prepared. Conductive composition. As the copper powder, a spherical powder having an average particle diameter of 1 is used. After the obtained composition was coated on a substrate, it was heated at 300 ° C for 5 minutes to form a conductive film. When the specific resistance value of the conductive film thus obtained was measured, a result of 1.1 χ 1 〇 4 [? · <: ηη] was obtained. Example 7 100 parts by weight of copper powder as the above (Α) component, 2 parts by weight of 3-amino-J-propanol as the above (Β) component, and 5 parts by weight of glycolic acid as the component (C), Further, 10 parts by weight of sorbitol polyglycidyl ether as the component (D) was prepared to prepare a conductive composition. As the copper powder, a spherical powder having an average particle diameter of 1 # m was used. After the obtained composition was coated on a substrate, it was heated at 500 ° C for 10 minutes to form a conductive film. When the specific resistance value of the conductive film thus obtained was measured, the result of 〇.2χ10_4 [Ω·(πη] was obtained. Example 8 100 parts by weight of nickel powder as the above (Α) component was mixed, and 3 of the above (Β) component was obtained. - 10 parts by weight of an amine-1-propanol, and 10 parts by weight of glycolic acid as the component (C), and a conductive composition is prepared. As the nickel powder, a spherical powder having an average particle diameter of 1/m is used. After the obtained composition was applied onto a substrate, it was heated at 150 ° C for 5 minutes to form a conductive film. When the specific resistance value of the conductive film thus obtained was measured, a result of 5·0 χ 10_4 [Ω · οηη] was obtained. 9 100 parts by weight of the zinc powder as the above (Α) component, and 10 parts by weight of the 3-aminol-1-propanol of the above-mentioned (Β) 16 323621 2 201230067 ", as the component (C) 10 parts by weight of acid was used to prepare a conductive composition. As a powder, a spherical powder having an average particle diameter of 4 # m was used. After the obtained composition was coated on a substrate, it was heated at 150 ° C for 5 minutes to form a spherical powder. Conductive film. When the specific resistance value of the conductive film thus obtained was measured, 0.2 χ 1 (Γ4) was obtained. The result of [Ω · <: ηη]. Example 10: 100 parts by weight of the solder powder as the above (Α) component, and 10 parts by weight of 3-amino-1-propanol as the above (Β) component, as the above 10 parts by weight of glycolic acid of the component (C), and a conductive composition is prepared. As the solder powder, an average particle diameter of an alloy of a weight ratio of Sn : Ag : Cu = 96.5 : 3 : 0.5 is 4 // Spherical powder of m. After the obtained composition was coated on a substrate, it was heated at 150 ° C for 10 minutes to form a conductive film. When the specific resistance value of the conductive film thus obtained was measured, 0.6 χ 10_4 [Ω · οιη] was obtained. As a result, 100 parts by weight of zinc powder as the above (Α) component, 10 parts by weight of 3-amino-1-propanol as the above (Β) component, and 10 parts by weight of glycolic acid as the component (C) were mixed. A conductive composition is prepared as a zinc powder, and a spherical powder having an average particle diameter of 4 # m is used. After the obtained composition is coated on a substrate, it is placed at room temperature (2 (TC)). The conductive film was formed by drying for 24 hours. When the specific resistance value of the conductive film thus obtained was measured, 2.0 χ 10_4 [Ω was obtained. Example 12: 100 parts by weight of the tin powder as the component (A), and 10 parts by weight of 3-amino-1-propanol as the component (B) 17 323621 201230067, as the above (C) 10 parts by weight of the component of glycolic acid to prepare a conductive composition. As the tin powder, a spherical powder having an average particle diameter of 5 am was used. After the obtained composition was coated on a substrate, it was heated at 150 ° C. A conductive film is formed in minutes. When the specific resistance value of the thus obtained conductive film was measured, the result of 〇.6χ10_4 [Ω πιη] was obtained. Hereinafter, Comparative Examples 1 to 4 relating to the present invention will be described. Comparative Example 1 100 parts by weight of a copper powder, 10 parts by weight of 3-amino-1-propanol, and 10 parts by weight of propionic acid were mixed to prepare a composition. As the copper powder, a spherical powder having an average particle diameter of 1 /zm is used. After the obtained composition was coated on a substrate, it was heated at 200 ° C for 10 minutes to form a film. The film thus obtained is a substance having no conductivity and cannot be called a [conductive film]. Comparative Example 2 100 parts by weight of a copper powder, 10 parts by weight of 3-amino-1,3-propanol, and 10 parts by weight of p-hydroxybenzoic acid were mixed to prepare a composition. As the copper powder, a spherical powder having an average particle diameter of 1 is used. After the obtained composition was coated on a substrate, it was heated at 200 ° C for 10 minutes to form a film. The film thus obtained is a substance having no conductivity and cannot be called a [conductive film]. Comparative Example 3 100 parts by weight of a copper powder, 10 parts by weight of 1-aminopropane, and 10 parts by weight of glycolic acid were mixed to prepare a composition. As the copper powder, a spherical powder having an average particle diameter of 1 / z m is used. After the obtained composition was coated on a substrate, it was heated at 200 ° C for 10 minutes to form a film. The film thus obtained is not electrically conductive

18 323621 S 201230067 . Sexual substances cannot be called [conductive film]. Comparative Example 4 100 parts by weight of copper powder and 10 parts by weight of lactic acid were mixed to prepare a composition. As the copper powder, a spherical powder having an average particle diameter of 1 /zm is used. After the obtained composition was coated on a substrate, it was heated at 300 ° C for 5 minutes to form a film. The film thus obtained is a substance having no conductivity and cannot be called a [conductive film]. The results of the above Examples 1 to 12 and the above Comparative Examples 1 to 4 were sorted and shown in Tables 1 and 2 below. 19 323621 201230067

20 323621 S 201230067 [Table 2] \ Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Copper powder 100 100 100 100 3-Amino-1-propanol 10 10 - -1 -Aminopropyl condensate - 10 - Glycolic acid - - 10 - lactic acid - - - 10 citric acid - - - - propionic acid 10 - - - p-hydroxybenzoic acid - 10 - - temperature conditions 200 ° C 200 ° C 200 ° C 300 ° C (using hot plate) 10 min 10 m in 10 m in 5 min specific resistance (Ω·cm) non-conductive, non-conductive, non-conductive, non-conductive, and it can be seen from the results of Examples 1 to 12 that the conductive composition according to the present invention can be judged to have a lower specific resistance value (that is, It is said that the conductive film is high in conductivity. As a result of comparing the results of Examples 1, 2, and 3, it was found that the conductive composition of glycolic acid as the component (C) was used, and it was judged that higher conductivity was obtained when other hydroxy acids (lactic acid, citric acid) were used. Conductive film. As a result of comparing the results of Examples 1, 4, 5, and 6, it was found that the conductive composition of 3-amino-1-propanol as the component (B) was used, and it was judged that the ratio of other amine compounds was used (1, 3 - 2). When amine alkane, 3-methoxyl propylamine, or N-mercaptoethanolamine), a conductive film having high conductivity can be obtained. As a result of the comparison of the examples 1 and 7, it is understood that the conductive composition containing the component (D) other than the above components (A) to (C) has a ratio of the component (D). The conductive composition (Example 1) can be fired at a higher temperature, and a conductive film having high conductivity can be obtained. 21 323621 201230067 The results of Comparative Example 1 and Comparative Example 1 show that when the component (C) is substituted with an aliphatic carboxylic acid having no OH group, it is judged that a conductive film having high conductivity is not obtained. As a result of the comparison between the first embodiment and the comparative example 2, it was found that when the aromatic hydroxy acid was added as the component (C), it was judged that a conductive film having high conductivity was not obtained. As a result of the comparison between the first embodiment and the comparative example 3, it was found that when the component (B) was substituted with an amine compound having one amine group and no OH group, it was judged that a conductive film having high conductivity was not obtained. As a result of observing the results of Comparative Example 4, it was found that when the composition containing only the components (A) and (C) was fired, it was judged that a conductive film having high conductivity was not obtained. [Simple description of the diagram] None. [Main component symbol description] None.

22 323621 S

Claims (1)

201230067 VII. Patent application scope: 1. A conductive composition characterized by containing: (A) a metal powder mainly composed of a base metal, and (B) an amine represented by the following general formula (1) a compound, or an aliphatic amine having two or more amine groups, and (C) an aliphatic hydroxy acid, R2_HN-Ri_0 - R3 (1) (wherein Ri represents a carbon number of 2 to 8 The alkyl group, R2 and R3, respectively represent a halogen atom or an alkyl group having 1 to 4 carbon atoms. 2. The conductive composition according to claim 1, wherein the (Β) component is an aliphatic amine having a mercapto group. 3. The conductive composition according to claim 1, wherein the (Β) component is selected from the group consisting of: 3-amino-1-propanol, 3-methoxyoxypropylamine, fluorenylethanolamine And at least one of 1,3 -diaminopropane. The conductive composition according to any one of claims 1 to 3, wherein the component (C) is at least one selected from the group consisting of glycolic acid, lactic acid, and citric acid. 5. The conductive composition according to any one of claims 1 to 4, which further comprises a linear epoxy resin having one or more mercapto groups in the molecule. The conductive composition according to any one of claims 1 to 5, wherein the (Α) component is at least one selected from the group consisting of copper, nickel, rhodium, tin, and solder. 1 323621 201230067 7. A conductive film which is coated on a substrate after applying the conductive composition according to any one of claims 1 to 6 by 70 ° C or more and 500 ° C or less Heated. 8. A method of forming a conductive film, which comprises applying the conductive composition according to any one of claims 1 to 6 to a substrate, and heating at 70 ° C or higher and 500 ° C or lower. Heat treatment step. 9. The method of forming a conductive film according to claim 8, wherein the heat treatment step is performed in an atmospheric environment. 201230067 IV. Designated representative map: There is no schema in this case. (1) The representative representative of the case is: No. (2) A brief description of the symbol of the representative figure: None. 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: R2_ HN — Ri_ Ο — R3 · · · (1) 323621 S