TW201229500A - Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon - Google Patents

Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon Download PDF

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Publication number
TW201229500A
TW201229500A TW100138492A TW100138492A TW201229500A TW 201229500 A TW201229500 A TW 201229500A TW 100138492 A TW100138492 A TW 100138492A TW 100138492 A TW100138492 A TW 100138492A TW 201229500 A TW201229500 A TW 201229500A
Authority
TW
Taiwan
Prior art keywords
image
inspection
magnification
field
unit
Prior art date
Application number
TW100138492A
Other languages
English (en)
Chinese (zh)
Inventor
Yoji Kato
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW201229500A publication Critical patent/TW201229500A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW100138492A 2010-11-09 2011-10-24 Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon TW201229500A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010250948A JP5653724B2 (ja) 2010-11-09 2010-11-09 位置合わせ装置、位置合わせ方法および位置合わせプログラム

Publications (1)

Publication Number Publication Date
TW201229500A true TW201229500A (en) 2012-07-16

Family

ID=46267519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100138492A TW201229500A (en) 2010-11-09 2011-10-24 Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon

Country Status (4)

Country Link
JP (1) JP5653724B2 (enExample)
KR (1) KR20120049826A (enExample)
CN (1) CN102565082A (enExample)
TW (1) TW201229500A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819658B (zh) * 2021-08-27 2023-10-21 日商斯庫林集團股份有限公司 描繪系統、描繪方法以及記錄有程式的程式產品

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9852500B2 (en) * 2015-07-15 2017-12-26 GM Global Technology Operations LLC Guided inspection of an installed component using a handheld inspection device
CN110268266B (zh) * 2017-02-08 2022-11-29 富士胶片株式会社 免疫检查装置
CN113125434B (zh) * 2019-12-31 2024-11-19 深圳迈瑞生物医疗电子股份有限公司 图像分析系统和控制拍摄样本图像的方法
CN112919106A (zh) * 2021-01-29 2021-06-08 中山市美鼎机械制造有限公司 一种线路板光学智能检测设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634233B2 (ja) * 1987-05-26 1994-05-02 株式会社安川電機 階層化構造的テンプレ−ト・マッチング方法
JP3246616B2 (ja) * 1992-10-01 2002-01-15 株式会社ニコン 位置合わせ方法
JP2001201338A (ja) * 2000-01-20 2001-07-27 Jeol Ltd 座標リンク機構
JP3993817B2 (ja) * 2002-12-11 2007-10-17 株式会社日立製作所 欠陥組成分析方法及び装置
JP4847685B2 (ja) * 2004-04-16 2011-12-28 株式会社日立ハイテクノロジーズ パターンサーチ方法
JP5059297B2 (ja) * 2005-05-09 2012-10-24 株式会社日立ハイテクノロジーズ 電子線式観察装置
JP2008152555A (ja) * 2006-12-18 2008-07-03 Olympus Corp 画像認識方法及び画像認識装置
JP2008311668A (ja) * 2008-07-07 2008-12-25 Hitachi High-Technologies Corp 基板又は半導体ウエーハに形成されたパターンの，重ね合わせ誤差検査装置及び重ね合わせ誤差検査方法
JP2010107412A (ja) * 2008-10-31 2010-05-13 Toshiba Corp 欠陥観察装置、欠陥観察方法
JP5315076B2 (ja) * 2009-02-06 2013-10-16 株式会社日立ハイテクノロジーズ 電子線の影響を考慮した半導体検査方法及び装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819658B (zh) * 2021-08-27 2023-10-21 日商斯庫林集團股份有限公司 描繪系統、描繪方法以及記錄有程式的程式產品

Also Published As

Publication number Publication date
JP5653724B2 (ja) 2015-01-14
JP2012103072A (ja) 2012-05-31
KR20120049826A (ko) 2012-05-17
CN102565082A (zh) 2012-07-11

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