TW201228784A - Low profile dual arm vacuum robot - Google Patents
Low profile dual arm vacuum robot Download PDFInfo
- Publication number
- TW201228784A TW201228784A TW100133251A TW100133251A TW201228784A TW 201228784 A TW201228784 A TW 201228784A TW 100133251 A TW100133251 A TW 100133251A TW 100133251 A TW100133251 A TW 100133251A TW 201228784 A TW201228784 A TW 201228784A
- Authority
- TW
- Taiwan
- Prior art keywords
- forearm
- actuator
- transfer robot
- substrate transfer
- arm
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/1005—Program-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
- B25J9/1015—Program-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means using additional, e.g. microadjustment of the end effector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38314010P | 2010-09-15 | 2010-09-15 | |
| US13/232,951 US20120063874A1 (en) | 2010-09-15 | 2011-09-14 | Low profile dual arm vacuum robot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201228784A true TW201228784A (en) | 2012-07-16 |
Family
ID=45806871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100133251A TW201228784A (en) | 2010-09-15 | 2011-09-15 | Low profile dual arm vacuum robot |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120063874A1 (https=) |
| JP (1) | JP2013541843A (https=) |
| KR (1) | KR20130100153A (https=) |
| CN (1) | CN103430296A (https=) |
| TW (1) | TW201228784A (https=) |
| WO (1) | WO2012037312A2 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101778519B1 (ko) | 2009-01-11 | 2017-09-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 전자 디바이스 제조시에 기판을 이송하기 위한 로봇 시스템, 장치 및 방법 |
| WO2014008009A1 (en) * | 2012-07-05 | 2014-01-09 | Applied Materials, Inc | Boom drive apparatus, multi-arm robot apparatus, electronic device processing systems, and methods for transporting substrates in electronic device manufacturing systems |
| US20140220777A1 (en) * | 2013-02-05 | 2014-08-07 | International Business Machines Corporation | Processing system for combined metal deposition and reflow anneal for forming interconnect structures |
| CN106015497B (zh) * | 2016-05-16 | 2017-11-14 | 太原理工大学 | 一种密闭空间定位操作机构 |
| US11270904B2 (en) * | 2016-07-12 | 2022-03-08 | Brooks Automation Us, Llc | Substrate processing apparatus |
| US10704142B2 (en) * | 2017-07-27 | 2020-07-07 | Applied Materials, Inc. | Quick disconnect resistance temperature detector assembly for rotating pedestal |
| CN109994358B (zh) * | 2017-12-29 | 2021-04-27 | 中微半导体设备(上海)股份有限公司 | 一种等离子处理系统和等离子处理系统的运行方法 |
| WO2021011229A1 (en) | 2019-07-12 | 2021-01-21 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| US11574826B2 (en) * | 2019-07-12 | 2023-02-07 | Applied Materials, Inc. | High-density substrate processing systems and methods |
| US11443973B2 (en) | 2019-07-12 | 2022-09-13 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| US11117265B2 (en) | 2019-07-12 | 2021-09-14 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| KR20230002355A (ko) * | 2020-03-02 | 2023-01-05 | 퍼시몬 테크놀로지스 코포레이션 | 소형 횡단 로봇 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4392776A (en) * | 1981-05-15 | 1983-07-12 | Westinghouse Electric Corp. | Robotic manipulator structure |
| US6428266B1 (en) * | 1995-07-10 | 2002-08-06 | Brooks Automation, Inc. | Direct driven robot |
| US5789878A (en) * | 1996-07-15 | 1998-08-04 | Applied Materials, Inc. | Dual plane robot |
| JPH10163296A (ja) * | 1996-11-27 | 1998-06-19 | Rootsue Kk | 基板搬送装置 |
| JP3562748B2 (ja) * | 1997-03-05 | 2004-09-08 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US6155768A (en) * | 1998-01-30 | 2000-12-05 | Kensington Laboratories, Inc. | Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput |
| JPH11277467A (ja) * | 1998-03-25 | 1999-10-12 | Mecs Corp | 薄型基板搬送ロボット |
| JPH11300663A (ja) * | 1998-04-24 | 1999-11-02 | Mecs Corp | 薄型基板搬送装置 |
| AU2041000A (en) * | 1998-12-02 | 2000-06-19 | Kensington Laboratories, Inc. | Specimen holding robotic arm end effector |
| JP4456725B2 (ja) * | 2000-05-24 | 2010-04-28 | 株式会社ダイヘン | 搬送装置 |
| JP2002158272A (ja) * | 2000-11-17 | 2002-05-31 | Tatsumo Kk | ダブルアーム基板搬送装置 |
| JP2002166376A (ja) * | 2000-11-30 | 2002-06-11 | Hirata Corp | 基板搬送用ロボット |
| US20020098072A1 (en) * | 2001-01-19 | 2002-07-25 | Applied Materials, Inc. | Dual bladed robot apparatus and associated method |
| US7281741B2 (en) * | 2001-07-13 | 2007-10-16 | Semitool, Inc. | End-effectors for handling microelectronic workpieces |
| JP4222068B2 (ja) * | 2003-03-10 | 2009-02-12 | 東京エレクトロン株式会社 | 被処理体の搬送装置 |
| JP2005032994A (ja) * | 2003-07-14 | 2005-02-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| US7244095B2 (en) * | 2004-12-16 | 2007-07-17 | Energent Corporation | Dual pressure Euler steam turbine |
| US9248568B2 (en) * | 2005-07-11 | 2016-02-02 | Brooks Automation, Inc. | Unequal link SCARA arm |
| CN100358097C (zh) * | 2005-08-05 | 2007-12-26 | 中微半导体设备(上海)有限公司 | 半导体工艺处理系统及其处理方法 |
| US7946800B2 (en) * | 2007-04-06 | 2011-05-24 | Brooks Automation, Inc. | Substrate transport apparatus with multiple independently movable articulated arms |
| CN103862463B (zh) * | 2007-05-31 | 2017-08-15 | 应用材料公司 | 延伸双scara机械手连接装置的伸出距离的方法及设备 |
| JP4971063B2 (ja) * | 2007-07-27 | 2012-07-11 | 株式会社ダイヘン | 搬送装置 |
-
2011
- 2011-09-14 US US13/232,951 patent/US20120063874A1/en not_active Abandoned
- 2011-09-15 TW TW100133251A patent/TW201228784A/zh unknown
- 2011-09-15 WO PCT/US2011/051699 patent/WO2012037312A2/en not_active Ceased
- 2011-09-15 JP JP2013529313A patent/JP2013541843A/ja active Pending
- 2011-09-15 CN CN2011800445226A patent/CN103430296A/zh active Pending
- 2011-09-15 KR KR1020137009365A patent/KR20130100153A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20120063874A1 (en) | 2012-03-15 |
| KR20130100153A (ko) | 2013-09-09 |
| WO2012037312A2 (en) | 2012-03-22 |
| JP2013541843A (ja) | 2013-11-14 |
| WO2012037312A3 (en) | 2012-06-21 |
| CN103430296A (zh) | 2013-12-04 |
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