201226288 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種前開式晶圓盒，更特別地，是有關於 一種於前開式晶圓盒中配置有可充氣之支撐件模組，並 於可充氣之支撐件模組中配置有一緩衝氣室，使得氣體 可以在前開式晶圓盒中形成一均勻氣體流場。 【先前技術】 [0002] 在半導體製程當中，由於半導體晶圓需經過各種不同製 程與製程設備，經由自動化系統搬運到不同的製程工作 站。為了方便晶圓的搬運且避免晶圓受到外界的污染， 常會利用一密封容器以供自動化設備輸送。請參考圖1所 示，係習知技術之晶圓盒示意圖。4晶圓盒是一種前開 式晶圓盒（Front Opening Unified Pod，FOUP)，係 具有一盒體10及一門體20，盒體10係由一對側壁10L及 相鄰一對側壁10L之一頂面10T及一底面10B所組成，並 於一侧邊形成一開口 12，而相對開口 12之另一側邊形成 一後壁10B’ ，其中在這對側壁10L上係各設有複數個插 槽11以水平容置複數個晶圓，而門體20具有一個外表面 21及一個内表面22，門體20係藉由内表面22與盒體10的 開口 12相結合，用以保護盒體10内部的複數個晶圓。此 外，在門體20的外表面21上配置至少一個門閂開孔2 3， 用以開啟或是封閉前開式晶圓盒。在上述之前開式晶圓 盒中，由於半導體晶圓係水平地置於盒體10内部，因此 ，在前開式晶圓盒搬運過程中需配有晶圓限制件，以避 免晶圓因震動而產生異位或往盒體10的開口 12方向移動 099146185 表單編號A0101 第4頁/共33頁 0992079401-0 201226288 [_ _參考圖2所示，俜—墓…· 一 係吳國公告專利6, 736, 268所揭露之 體/開式晶圓盒之門體20結構示意圖。如圖2所示’門 從内内侧面22配置有一凹陷區域24 ’此凹陷區域24係 存嫵1則面22的了頁端221延伸到底端222且係在左右二個鎖 步配毒230(於門體内部）之間’而在凹陷區域24中再進一 二Z有晶圓限制件模組，此晶圓限制件模組係由左右 上係罝圓限制件100所組成，而在每一個晶圓限制件100 11〇、具有複數個晶圓接觸頭110，以利用此晶圓接觸頭 〇 、$’、相對的晶圓，避免晶圓在傳送過程中因震動而 立或往盒體之開口方向移動。 [0004]上述冬 曰取 兩侧壁10[上的插槽11及門體20内表面22的 =圓限制件模組分職絲支似限制盒㈣内部所乘 ，的複數個晶圓，然而，這些支撐件及限制件都容易在 圓^運送的過程中與晶圓產生摩擦，造成微粒 (Partlcle)的產生。當晶眉盒的盒體10内部有微粒出現 微粒了能會停留在晶圓表面或汙染晶崮，造成後續 ϋ 的β曰片產生其良率的下降。因此，在晶圓盒其支推件及 限制件的設計上’通常會使用具耐磨特性的材質，以避 免支撑件及限制件與晶圓接觸時產生太多的微粒。如圖3 所不’係美國公開專利2〇〇6/〇283774所揭露之一種置於 晶圓盒兩側壁之支撐件模組之剖面示意圖。此支撐件模 組係由複數個垂直間隔排列的支撐件500所組成，而在支 撑件500的表面係包覆著一層樹酯5〇1，這層樹酯5〇1具 有低摩擦特性，因此可以避免支撐件500和晶圓摩擦而產 生微粒。然而，在此種設計當中’由於樹酯501具有一斜 099146185 表單編號Α0101 第5頁/共33頁 0992079401-0 201226288 面，因此當晶圓支撐於樹酯5〇1時，僅能支撐到晶圓的邊 、彖附近，而當Bai)的尺寸較大時，則容易使晶圓下垂或 下冰’除了容易造成晶圓產生裂痕外，機器手臂在 晶圓時，亦容易使晶圓1生破片或遭受破壞。^ [0005] 此外，也有些設計係在晶社的”，例如：晶圓 述支揮件或_件模組賴_近，提供—噴氣的開口 或刀口，則可將摩擦產生的微粒帶離晶圓。如圖作汗示口， 係一美國公告專利US6,899，145所揭露之—種可置= 曰’ 圓盒内部之可充氣支#件模組之示意圖。此充Μ#: 模組包括一中空主體_ ’中空主體_係固定於晶二 之盒體的側壁並向盒體的内部延伸有複數個垂直的 件6〇卜以利用支撐件的上表面602支樓盒趙内部的複#數 個晶圓。而在支撐件的侧表面603具有一橫條狀的開口 可將中空主體600内部的氣體由此橫條狀開σ噴出，γ 免因摩擦產生的微粒形成於晶圓表面。上述結構，由於 橫條狀開口置於支撐件601的侧表¢603，容易造成支广 力道不足進而使晶圓發生異位或重疊，造成晶圓更嚴重 的損壞。此外，當晶圓承載於支撐件6〇1其上表面6〇2時 ，晶圓與支撐件601之間的接觸面積係相當的大，, 足使微 粒更容易產生。且，由於橫條狀的開口其長度與晶圓相 當，因此，可能造成氣流微弱或是需要使用較大的充氣 s史備來提供較大的氣流Ϊ，方犯形成有效的氣體流場 因此，目前的晶圓盒的内部係需要一種設計較周全的可 充氣支撐件模組，可有效地避免微粒產生及形成於晶圓 表面。 099146185 表單編號A0101 第6頁/共33頁 〇992〇794〇1-〇 201226288 【發明内容】 [0006]依據先前技術之晶圓盒其盒體内部之可充氣支撐件r名 容易造成晶圓支撐力道不足、接觸面積過大及容易2 = 微粒等問題’本發明之-主要目的在於提供—種具有可 充氣支撐件模組之相式晶·，可絲支撐件模組係 配置於盒體側壁及後壁相鄰之處且其具有至少一個面向 開口方向的長縫，長縫係可喷出氣體用以控制前開式晶 圓盒其内部壤境的狀態，例如：内部的大氣壓力'濕度 或氣體的種類等。 〇 闺本發明之另-主要目的在於提供一種具有可充氣支撑件 模組之前開式晶圓盒，可充氣支撐件模組係具有至少一 個面向開口方向的長縫’長缝可喷出氣體並形成一氣體 流場，可將晶圓上的微粒帶走’以避免微粒形成於晶圓 上方。 [0008] 本發明之又一主要目的在於提供一種具有可充氣支撐件 模組之前開式晶圓盒，可充氣支撐件模組係具有至少一 〇 個面向開口方向的長縫，並於長縫中配置有一多孔性材 質之材料，當氣體經由長縫噴出時，多孔性材質可過濾 氣體中的雜質，可避免將氣體中的微粒吹入盒體内而造 成晶圓的污染，此外，當氣室處於飽壓狀態時，多孔性 材質亦可使氣體能均勻地的出氣。 [0009] 本發明之再一主要目的在於提供—種具有可充氣支撐件 模組之前開式晶圓盒，可充氣支撐件模組係具一缓衝氣 室且於緩衝氣室之一端配置一進氣口，緩衝氣室與出氣 通道之長縫相連通，當緩衝氣室處於飽壓狀態時，可藉 099146185 表單編號A0101 第7頁/共33頁 0 201226288 由長縫喷出一均勻之氣流並形成一氣體流場，將晶圓上 的微粒帶走，以避免微粒形成於晶圓上方。 \ [0010] 本發明之還有一主要目的在於提供一種具有可充氣支撐 件模組之前開式晶圓盒，於晶圓盒之側壁上配置有支撐 件模組，其具有複數個垂直間隔排列的支撐件或支撐肋 ，且支撐件或支撐肋上具有一耐磨的支撐圓頭，支撐件 或支撐肋可利用此耐磨的支撐圓頭與晶圓接觸，除了可 減少跟晶圓接觸的面積外，亦能避免與晶圓摩擦時產生 微粒。 [00113 本發明之再一主要目的在於提供一種具有可充氣支撐件 模組之前開式晶圓盒，可充氣支撐件模組係配置於盒體 側壁及後壁相鄰之處且其具有一排複數個垂直間隔排列 的支撐件或支撐肋以及一排複數個垂直間隔排列的限制 件，此複數個支撐件係靠近盒體的側壁而複數個限制件 則係靠近盒體的後壁，因此，此可充氣支撐件模組除了 可支撐晶圓外，也能避免晶圓往後壁的方向移動，以減 少微粒產生。 [0012] 本發明之再一主要目的在於提供一種具有可充氣支撐件 模組之前開式晶圓盒，此可充氣支撐件模組上的每一支 撐肋前端可以配置一凸出塊，用以與晶圓之背面接觸， 因此可藉由支撐肋的長度使得較大的晶圓能得到較佳的 支撐而不會產生形變或下沉，故可以增加晶圓製程上的 良率。 [0013] 為達上述之各項目的，本發明揭露一種前開式晶圓盒， 099146185 表單編號A0101 第8頁/共33頁 0992079401-0 201226288 Ο ❹ [0014] 包括一盒體，係由一對侧壁、分別相鄰於一對侧壁之一 頂面及一底面所組成，並於一側邊形成一開口，而相對 於開口之另一側邊形成一後壁，於一對側壁上各配置一 支撐件模組以容置複數個晶圓，並於一對側壁與後壁相 鄰處各配置一可充氣支撐件模組，以及一門體，具有一 外表面及一内表面，門體係以内表面與盒體之開口相結 合，並用以保護盒體内部之複數個晶圓，其中前開式晶 圓盒之特徵在於：每一可充氣支撐件模組具有一緩衝氣 室且於緩衝氣室之一端配置一進氣口，此進氣口係與底 面之一氣閥相連接，在可充氣支撐件模組之面對開口之 方向上配置有一出氣通道且於出氣通道之一端配置有一 長縫，並於長缝中配置有一多孔性.材質之材料，出氣通 道與緩衝氣室之間具有一氣流通道以使出氣通道與緩衝 氣室可相互連通，以及於長缝之一側邊上配置複數個垂 直於長缝而間隔排列的支撐肋。此外，可充氣支撐件模 組亦可以進一步包含複數個垂直間隔排列的限制件，以 限制晶圓往盒體後壁的方向移動。 :實施方式】 為使本發明所運用之技術内容、發明目的及其達成之功 效有更完整且清楚的揭露，茲於下詳細說明之，並請一 併參閱所揭之圖示及圖號。 [0015] 首先，請參閱圖5、圖6及圖7,係本發明之一種前開式晶 圓盒之盒體透視圖、盒體僅保留可充氣支撐件模組之示 意圖以及其侧視圖。前開式晶圓盒之盒體10係由一對侧 壁10L及相鄰此對側壁10L之一頂面10Τ及一底面10Β所組 099146185 表單編號Α0101 第9頁/共33頁 0992079401-0 201226288 成’並於-側邊形成—開口 u，而相對開Di2之另一側 邊形成-後壁1GB，，其中在這對側壁叫接近開口_ 附近各配置有—支擇件模組300，而在這對側壁i〇l斑後 相鄰的地方各配置有—可充氣切件模㈣〇。 别述的支撐件模組300可以是習知支撐件的形式，在此並 不加以限制。 [0016]請接著參考圖8A及圖8B所示，係本發明之—種可充氣支 撐件模組之一種實施例示意圖。首先，如圖8A所示，本 發明之可充氣支撐件模組200主要係包括一主體2〇〇B及由 主體200B延伸出去的兩個可用來支撐晶圓之部分，其中 第一個部分係由複數個垂直間隔排列的支撐肋2 〇丨所組成 ，而第二部分係由複數個垂直間隔排列的限制件2〇2所組 成’且在這些支撑肋2 01與這些限制件2 〇 2的間隔之間係 設有一出氣通道2〇8b，且於出氣通道2〇8b之一端配置有 一長縫203a，姐於長縫2〇3a中配置有一多孔性材質之材 料2 0 3c，如圖8C所示；其中，本發明所使用的多孔性材 - 質材料203c可為一種陶瓷材料;並且可以隨著使用者之 需求來選擇多孔性材料203c之孔徑大小；因此，當氣體 經由長縫203a噴出時’多孔性材質203c可過濾氣體中的 雜質’可避免將氣體中的微粒吹入盒體内而造成晶圓的 污染，此外，當氣室處於飽壓狀態時，多孔性材質亦可 使氣體能均勻地的出氣；藉由此氣通道208b及長縫203a 之設計，使得氣體可以由長縫203a向盒體10内部充氣； 此外，也藉由複數個支撐肋201及複數個限制件202並與 一對側壁1 0 L上之支撐件模組3 0 0的相互配置下’可以共 099146185 表單編號A0101 第10頁/共33頁 0992079401-0 201226288 同支撐複數個晶圓。而本發明所述之可充氣支撐件模組 200，係為一體成型之結構，並可以射出成型之方式所製 成。 [0017] Ο201226288 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a front opening type wafer cassette, and more particularly to an inflatable support mold module disposed in a front opening wafer cassette. And a buffer chamber is disposed in the inflatable support module such that the gas can form a uniform gas flow field in the front open wafer cassette. [Prior Art] [0002] In the semiconductor manufacturing process, semiconductor wafers are transported to different process stations via automated systems because of various process and process equipment. In order to facilitate wafer handling and to avoid contamination of the wafer from the outside world, a sealed container is often used for automated equipment delivery. Please refer to FIG. 1 , which is a schematic diagram of a conventional wafer cassette. The 4 wafer cassette is a front opening type pod (FOUP) having a box body 10 and a door body 20, and the box body 10 is formed by a pair of side walls 10L and a pair of adjacent side walls 10L. The surface 10T and the bottom surface 10B are formed, and an opening 12 is formed on one side, and a rear wall 10B' is formed on the other side of the opening 12, wherein a plurality of slots are formed on the pair of side walls 10L. 11 is to accommodate a plurality of wafers horizontally, and the door body 20 has an outer surface 21 and an inner surface 22, and the door body 20 is combined with the opening 12 of the casing 10 by the inner surface 22 for protecting the casing 10. Multiple wafers inside. In addition, at least one latch opening 2 3 is disposed on the outer surface 21 of the door body 20 for opening or closing the front opening wafer cassette. In the above-mentioned open-type wafer cassette, since the semiconductor wafer is horizontally placed inside the casing 10, a wafer restriction member is required in the front opening wafer cassette transportation process to prevent the wafer from being shaken. Eccentricity or movement to the opening 12 of the casing 10 099146185 Form No. A0101 Page 4 / Total 33 0992079401-0 201226288 [_ _ Refer to Figure 2, 俜 - tomb... · A series of Wu Guo announced patent 6, The structure of the door body 20 of the body/open wafer cassette disclosed in 736, 268. As shown in FIG. 2, the door is provided with a recessed area 24 from the inner inner side surface 22, and the recessed area 24 is disposed on the first end. The page end 221 of the surface 22 extends to the bottom end 222 and is attached to the left and right locks. Between the inside of the door body' and in the recessed area 24, there is a wafer limiter module, which is composed of left and right upper round limit members 100, and each A wafer limiting member 100 11 〇 has a plurality of wafer contact heads 110 for utilizing the wafer contact heads, $', and opposite wafers to prevent the wafer from standing or moving toward the box during transmission. Move in the direction of the opening. [0004] The above-mentioned winter raft takes the side walls 10 [the upper 11 of the slot 11 and the inner surface 22 of the door body 20], and the plurality of wafers are multiplied by the inside of the limit box (4). These support members and the restriction members are easy to rub against the wafer during the process of transporting the wafer, resulting in the generation of particles (Partlcle). When there are particles inside the box 10 of the eyebrow box, the particles may stay on the surface of the wafer or contaminate the crystal, causing the subsequent ruthenium β 曰 to produce a decrease in yield. Therefore, in the design of the pusher and the restricting member of the wafer cassette, the material of the wear-resistant property is usually made to avoid excessive particles generated when the support member and the restricting member come into contact with the wafer. Figure 3 is a schematic cross-sectional view of a support module disposed on both side walls of a wafer cassette as disclosed in U.S. Patent Application Serial No. 2/6/283,774. The support module is composed of a plurality of vertically spaced support members 500, and the surface of the support member 500 is covered with a layer of resin 5〇1, which has low friction characteristics. It is possible to prevent the support member 500 and the wafer from rubbing to generate particles. However, in this design, 'because the resin ester 501 has a slant 099146185 form number Α0101 5th page/33 pages 0992079401-0 201226288 face, when the wafer is supported by the resin 5 〇 1, it can only support the crystal Near the edge of the circle, near the cymbal, and when the size of the Bai) is large, it is easy for the wafer to sag or ice. In addition to the easy cracking of the wafer, the wafer is easy to make the wafer when the wafer is on the wafer. Fragmentation or damage. ^ [0005] In addition, there are also some designs in the Jingshe", for example, the wafers or the _pieces are close to each other, providing a jet opening or a knife edge to remove the particles generated by friction. Wafer. As shown in the US Patent No. 6,899,145, it is a schematic diagram of the inflatable module that can be placed inside the round box. The group includes a hollow body _ 'hollow body _ is fixed to the side wall of the box of the crystal two and extends to the inside of the box body with a plurality of vertical pieces 6 以 利用 to utilize the upper surface 602 of the support member to support the interior of the box Zhao A plurality of wafers are formed. The side surface 603 of the support member has a horizontal strip-shaped opening, so that the gas inside the hollow body 600 is ejected by the strip-shaped opening σ, and the γ-free particles generated by the friction are formed on the wafer. Surface. The above structure, because the horizontal strip opening is placed on the side surface 603 of the support member 601, it is easy to cause insufficient support and the wafer is ectopic or overlapped, resulting in more serious damage to the wafer. When the upper surface 6〇2 of the support member 6〇1 is carried, the wafer and the support member 601 are The contact area is quite large, which makes the particles easier to produce. Moreover, since the horizontal opening of the strip is equal in length to the wafer, it may cause a weak airflow or a large inflatable s Larger airflows create an effective gas flow field. Therefore, the interior of the current wafer cassette requires a more well-designed inflatable support module to effectively prevent particle formation and formation on the wafer surface. 099146185 Form No. A0101 Page 6 of 33 〇992〇794〇1-〇201226288 [Invention] [0006] According to the prior art wafer cassette, the inflatable support member inside the box body is easy to cause wafer support Insufficient force, excessive contact area and easy 2 = particle and other problems 'The present invention - the main purpose is to provide a phase crystal with an inflatable support module, the wire support module is arranged on the side wall of the box and The rear wall is adjacent to each other and has at least one long slit facing the opening direction, and the long slit is capable of ejecting gas for controlling the state of the interior of the front open wafer cassette, for example, the internal atmosphere Force 'humidity or type of gas, etc. 〇闺 Another object of the present invention is to provide a front open wafer cassette having an inflatable support module, the inflatable support module having at least one length facing the opening direction The slits can eject gas and form a gas flow field, which can carry the particles on the wafer to prevent the particles from forming on the wafer. [0008] Another main object of the present invention is to provide an inflatable body. The front module of the support module, the inflatable support module has at least one long slit facing the opening direction, and a porous material is arranged in the long slit when the gas is ejected through the long slit. The porous material can filter impurities in the gas to avoid contamination of the wafer by blowing particles in the gas into the casing. In addition, when the gas chamber is in a saturated state, the porous material can also make the gas uniform. The gas of the ground. [0009] Still another main object of the present invention is to provide an open-type wafer cassette having an inflatable support module, the inflatable support module having a buffer chamber and one end of the buffer chamber. The air inlet and the buffer air chamber are connected to the long slit of the air outlet passage. When the buffer air chamber is in the saturated state, the 099146185 can be used. Form No. A0101 Page 7 / Total 33 Page 0 201226288 A uniform air flow is sprayed from the long slit. A gas flow field is formed to carry the particles on the wafer to prevent particles from forming on the wafer. [0010] Another main object of the present invention is to provide a front open wafer cassette having an inflatable support module, and a support module disposed on a side wall of the wafer cassette, which has a plurality of vertically spaced arrays a support member or a support rib, and the support member or the support rib has a wear-resistant support round head, and the support member or the support rib can contact the wafer by the wear-resistant support round head, except that the area contacting the wafer can be reduced. In addition, it is possible to avoid the generation of particles when rubbed against the wafer. [00113] A further main object of the present invention is to provide a front open wafer cassette having an inflatable support module, and the inflatable support module is disposed adjacent to the side wall and the rear wall of the box body and has a row a plurality of vertically spaced support members or support ribs and a plurality of vertically spaced apart restriction members, the plurality of support members being adjacent to the side wall of the casing and the plurality of restriction members being adjacent to the rear wall of the casing, thereby In addition to supporting the wafer, the inflatable support module can also prevent the wafer from moving in the direction of the back wall to reduce particle generation. [0012] A further main object of the present invention is to provide a front open wafer cassette having an inflatable support module, and a front end of each support rib on the inflatable support module can be configured with a protruding block for The contact with the back side of the wafer allows the larger wafer to be better supported without deformation or sinking by the length of the support ribs, thereby increasing the yield on the wafer process. [0013] In order to achieve the above objects, the present invention discloses a front opening wafer cassette, 099146185 Form No. A0101 Page 8 / Total 33 Page 0992079401-0 201226288 Ο ❹ [0014] A box is included, consisting of a pair The sidewalls are respectively adjacent to a top surface and a bottom surface of the pair of sidewalls, and an opening is formed on one side, and a rear wall is formed on the other side of the opening, on each of the pair of sidewalls Configuring a support module to accommodate a plurality of wafers, and arranging an inflatable support module adjacent to a pair of side walls and a rear wall, and a door body having an outer surface and an inner surface, the door system The inner surface is combined with the opening of the casing to protect a plurality of wafers inside the casing, wherein the front opening wafer cassette is characterized in that each inflatable support module has a buffer chamber and a buffer chamber. One end is configured with an air inlet, and the air inlet is connected with one of the air valves on the bottom surface, an air outlet passage is disposed in a direction facing the opening of the inflatable support module, and a long slit is disposed at one end of the air outlet passage. And arranged in the long slit Porous material, material has an air flow passage between the air outlet passage and the buffer air chamber to allow the air outlet passage and the buffer air chamber to communicate with each other, and a plurality of vertical slits are arranged on one side of the long slit. Support ribs. In addition, the inflatable support module can further include a plurality of vertically spaced restriction members to limit the movement of the wafer toward the rear wall of the casing. The present invention has been described in detail with reference to the accompanying drawings and drawings. [0015] First, please refer to FIG. 5, FIG. 6, and FIG. 7, which are perspective views of a box of a front open type crystal box of the present invention, a box body only retaining the inflatable support member module, and a side view thereof. The box 10 of the front open wafer cassette is composed of a pair of side walls 10L and a top surface 10 Τ and a bottom surface 10 相邻 of the pair of side walls 10L. Form number Α0101, page 9 / total page 33, 0992079401-0 201226288 'and formed on the side-opening u, and the other side of the opposite Di2 forms a rear wall 1GB, wherein the pair of side walls are located near the opening_ each is provided with a support module 300, and The pair of adjacent sidewalls are arranged with an inflatable cutting die (four) 〇. The support member module 300 may be in the form of a conventional support member and is not limited herein. [0016] Referring to Figures 8A and 8B, there is shown a schematic view of an embodiment of an inflatable support module of the present invention. First, as shown in FIG. 8A, the inflatable support module 200 of the present invention mainly comprises a main body 2B and two parts extending from the main body 200B for supporting the wafer, wherein the first part is The plurality of vertically spaced support ribs 2 〇丨 are formed, and the second portion is composed of a plurality of vertically spaced restriction members 2 ' 2 and the support ribs 2 01 and the restriction members 2 〇 2 An air outlet passage 2〇8b is disposed between the intervals, and a long slit 203a is disposed at one end of the air outlet passage 2〇8b, and a porous material material 2 0 3c is disposed in the long slit 2〇3a, as shown in FIG. 8C. Herein, the porous material-material 203c used in the present invention may be a ceramic material; and the pore size of the porous material 203c may be selected as the user desires; therefore, when the gas is ejected through the slit 203a 'Porous material 203c can filter impurities in the gas' to avoid the contamination of the wafer by blowing particles in the gas into the casing. In addition, when the gas chamber is under full pressure, the porous material can also make the gas Evenly By means of the design of the gas passage 208b and the long slit 203a, the gas can be inflated into the inside of the casing 10 by the long slit 203a; in addition, by a plurality of supporting ribs 201 and a plurality of restricting members 202 and a pair of side walls 1 0 L on the support module 3 0 0 mutual configuration 'can be a total of 099146185 Form No. A0101 Page 10 / Total 33 0992079401-0 201226288 Support multiple wafers. The inflatable support member module 200 of the present invention is an integrally formed structure and can be formed by injection molding. [0017] Ο
接著，請繼續參考圖8Α、圖8Β及圖9Α，在上述的主體 200Β内部係有一緩衝氣室206，且其高度約可以與主體 200Β相同（如圖9Α所示），或是緩衝氣室20 6之高度可以 為整個主體200Β的一半（如圖8Α所示）。請參考圖8Α與圖 9Α，在緩衝氣室206的一端係皆配置有一進氣口 207，其 可進一步與盒體10底面10Β之一氣閥或進氣閥401(顯示 於圖10中）連接。而不論緩衝氣室206之高度約與主體 200Β相同（如圖9Α所示），或為整個主體200Β的一半（如 圖8Α所示），在緩衝氣室206具有進氣口 207的一端皆配 置有一氣流通道208a，而當緩衝氣室206之高度約可以與 主體200B相同時（如圖9A所示），則可進一步於緩衝氣室 206之相對兩端皆各配置一氣流通道208a，由於氣流通道 208a係配置於出氣通道208b與緩衝氣室206之間，故緩 衝氣室206可藉由氣流通道208a而與出氣通道208b相互 連通。因此，當盒體10底面10B的氣閥或進氣閥401連接 一充氣裝置（未顯示於圖中）時，氣體可經由進氣口 207進 入緩衝氣室206中，當進入緩衝氣室206内之氣體達到飽 壓狀態時，由於進氣口 207與氣閥或進氣閥401端已經接 觸並封閉，故緩衝氣室206中氣體僅能經由氣流通道208a 進入出氣通道208b，再由出氣通道208b上的長縫203a喷 出；在此特別要強調，由於此長縫203a之口徑相對於氣 流通道208a是非常小，其口徑之寬度約為0· 01mm~5mm， 099146185 表單編號A0101 第11頁/共33頁 0992079401-0 201226288 故當充人緩衝氣室206中氣體經由氣流通道208a再充入出 氣通道2G8b時，大部份的氣體會先進入至與出氣通道 2〇8b相通的氣流通道2，中，當氣流通和心再次充滿 氣體後，最後會流人出氣通道2_並經由長縫·a喷出 氣體；因此’藉由本發明長縫2〇3a的設計，使得從長縫 2〇38喷出氣體係類似風刀，並且在長縫2仏兩端所喷出 的乳體壓力梯度之差異不會太大’使得從長縫2〇3a喷出 之乳體具有-疋的壓力，可在每—支撐於支撐肋撕及每 -限制件202之間形成氣體之流場，故可將分佈於支樓肋 201及限制件202之間以及晶圓附近的微粒，藉由此氣體 之视場帶往卩^ σ 1 2的方向，以避免這些微粒汙染晶圓。 [0018] 此外，在本發明之實施例中，長縫2〇3&之口徑亦可以是 由下到上（即從晶圓第1片到第25片）逐漸變小或變大，請 參考圖9Α，為長縫2〇3a之口徑由下到上逐漸變大實施方 式之示意圖，在靠近進氣口 2〇7之一端，其長縫2〇33之口 徑較小，而往進氣口 2〇7相反一端之方向延伸，其長縫 203a之口徑則逐漸變大，再請參考圖9β，為長縫2〇3&之 口徑由下到上逐漸變小實施方式之示意圖，在靠近進氣 口 207之一端，其長縫2〇3a之口徑較大，而往進氣口 2〇7 相反一端之方向延伸，其長縫2〇3a之口徑則逐漸變小， 然而在較為符合物理現象的前提下，長縫2〇心之口徑由 晶圓第1片到第25片逐漸變大之設計會優於由晶圓第j片 到第25片逐漸變小之設計，以使其噴出的氣體之壓力較 為一致。同樣地，上述長縫2〇3a的形式可以為長條形， 如圖8A所示’或於長縫2〇3a中配置有複數個隔板2〇4垂 099146185 表單編號A0101 第12頁/共33頁 0992079401-0 201226288 直間隔以形成複數個出氣口2〇5，如圖9C所示；於長縫 2〇3a上縱向延伸形成複數個橫縫203b，在這些橫縫2〇扑 之間都具有一間距，本發明在此並不限定這些間距之間 的距離是否為相同，而橫縫2〇3b可以是以長縫2〇3a為中 '刀別向左右兩侧縱向延伸形而成，如圖⑽所干，也 可以僅向左或向右其中一侧縱向延伸形而成，分別如圖 9E與圖9F所示》由於圖η至圖9F所示之可充氣支撐件模 組之操作過程與圖8A及圖8B相同，其差異處僅為長縫 Ο [0019] Ο [0020] 203a之設計不同，故不再重覆贅述之。此外，長縫μ% 喷出的氣體可以係是情性氣體、乾燥冷空氣、氮氣或以 上氣體的組合。 在上述的圖8A至圖8B以及圖9A至圖9F之實施例卷中亦 可在盒體10的底面10B靠近開口 12的附近配置至小另一氣 閥或出氣閥（未顯示於圖1〇中），當充氣裝置在对盒體Μ 充氣時，可允許盒體10内部些微的氣體經開口12附近的 氣閥或出氣閥流出，除了可以將盒體1Q內部的微粒=除 外，也縮短充飽盒體10所需的時間。當麸 田‘、、、本發明的盒 體10亦可以包含有兩對有別於上述的進氣間及出氣闕， 以符合則開式晶圓盒的標準。 ’ 請再參考圖η，係本發明之可錢切件模組之放大示 意圖。可充氣域件模組係由複數個切㈣i所组 合而成’其中每-支撑·i係類似—平台的結構，支撑 助201可以係-耐磨耗材、熱塑性材質、高分子材質或彈 性材質等材料’因此’當晶圓被支擇於支撑賴i或平台 上時’能避免因為摩擦而產生微粒。當然、，如所示 099146185 表單編號A0101 第13頁/共33頁 0992079401-0 201226288 G1上係可以係包含有—切圓頭2〇9，你 肋201利用此支撑圓頭咖與晶圓接觸以減少和/支樓 的面積’可更進-步地減少微粒的產生。^，接觸 201可安排為僅有此支撑圓頭係-对磨:，切助 未跟晶圓接觸的地方都不是耐磨粍材， 而其他 的成本。而可充ϋ古护从i -生產所需 充乱支拉件模組200的複數個限制 於係靠近或料於後壁⑽，^方（如圖=如由 以限糊於支撐糊或機⑽切圓頭=可 的晶圓往後壁⑽，的方向移動，以避免擊 10B’ 。而限制^9η9_Γ 董辜後壁 _域衝材«耐磨耗材所製 成的平板，亦或係由上述材料所形成的淺凹槽斤衣 進入此淺凹槽結構。此外，在前開式晶圓盒的 門體内表面亦會進—步包含至少一限制件模組（未顯示於 圖中）此限制件模組則係用來限制晶圓往開口η的方向 移動。 [0021] 別述可充乱切件模組2_包含有_主體⑽β、複數個 垂直間隔排㈣讀賴1、複數Ϊ錄_排列的限制 件2〇2及一長縫2G3a，其可以係-體成形的結構，以降低 生產的成本。當'然，可充氣支撑件模㈣0係可以由這些 凡件互相組裝而成，如圖13Α及圖13Β所示，可充氣支擇 件拉組2GG的主體2剛的兩個側面係具有複數個垂直間隔 排歹J的插孔21G ’以允許複數個支撑肋201插人並組襄及 固疋於主體2刚上，以形成複數個間隔排列的支撐肋加 而由於支揮肋2〇1係以組裝的方式固定於主體別⑽上， 因此，每一支標肋201都具有一固定基座2U，可與支撐 099146185 表單鳊號A0I01 第丨4頁/共33頁 0992079401-0 201226288 件模組200的主體2〇〇B相嵌合。此外’每—個支撐肋2〇ι 亦可以係具有一圓形孔洞212，可讓一原本分離的支撐圓 頭209塞入並固定於支接肋2〇1上，使支撐肋201可以利 用此支標圓頭209與晶圓接觸。而此支撑圓頭可以係 一耐磨耗材、熱塑性材質、高分子材質或彈性材質等材 料，而其他未跟晶圓接觸的地方都不是耐磨耗材，以降 低生產所需的成本。此外，本發明之前開式晶圓盒其可 充氣支撐件模組2〇〇係可以係僅由一主體2〇〇Β、複數個垂 直間隔排列的支撐肋201及一長縫2〇33所組成，這樣的結 構，同樣可以兼具支探晶圓及排除晶圓附近的微粒。此 外，亦可在複數個垂直間隔排列的支撐助2〇1之間形成複 數個出氣孔（未顯示於圖中），使可充氣支撐件模組2〇〇除 了能利用長縫2〇3a喷出氣體外，也可利用此複數個出氣 孔將晶圓附近的微粒帶離。當然，可充氣支撐件模組2〇〇 亦可以係由一主體2〇〇b、一排複數個垂直間隔排列的支 撐肋201、另一排複數個垂直間隔排列的史撐肋2〇1及一 長縫203a所組成’本發明不加以限制。此外，本發明之 前開式晶圓盒其門體可以如習知技術之門體，於門體内 表面設有一凹陷區域，且在門體外表面及内表面之間配 置至少一門閂結構，使晶圓盒能順利運作。 [0022]雖然本發明以前述之較佳實施例揭露如上，然其並非用 以限疋本發明’任何熟習相似技藝者，在不脫離本發明 之精神和範圍内，當可作些許之更動與潤飾，因此本發 明之專利保護範圍須視本說明書所附之申請專利範圍所 界定者為準。 099146185 表單編號A0101 第15頁/共33頁 0992079401-0 201226288 【圖式簡單說明】 [0023] [0024] [0025] [0026] [0027] [0028] [0029] [0030] [0031] [0032] [0033] [0034] [0035] [0036] 099146185 圖1係習知之前開式晶圓盒之示意圖。 圖2係習知之前開式晶圓盒之門體示意圖。 圖3係習知之支撐件模組之剖面示意圖。 圖4係習知之可充氣支撐件模組之示意圖。 圖5係本發明之一種前開式晶圓盒其盒體之透視圖。 圖6係本發明之一種前開式晶圓盒其盒體僅保留可充氣支 撐件模組之示意圖。 圖7係本發明之一種前開式晶圓盒其盒體之示意圖。 圖8A與圖8B係本發明之一種前開式晶圓盒其可充氣支撐 件模組之示意圖。 圖8C係本發明之一種前開式晶圓盒其可充氣支撐件模組 之下視圖。 圖9A〜圖9F係本發明之一種前開式晶圓盒其可充氣支撐 件模組之長縫的實施方式示意圖。 圖10係本發明之一種前開式晶圓盒其尚未安裝可充氣支 撐件模組之示意圖。 圖11係本發明之一種前開式晶圓盒其可充氣支撐件模組 之放大示意圖。 圖1 2係本發明之一種前開式晶圓盒其配置有可充氣支撐 件模組之局部示意圖。 圖13A及圖13B係本發明之一種前開式晶圓盒其可充氣支 表單編號A0101 第16頁/共33頁 0992079401-0 201226288 撐件模組之另一設計。 【主要元件符號說明】Then, referring to FIG. 8A, FIG. 8A and FIG. 9A, a buffer gas chamber 206 is disposed inside the main body 200Β, and the height thereof can be about the same as that of the main body 200Β (as shown in FIG. 9A), or the buffer gas chamber 20. The height of 6 can be half of the entire body 200Β (as shown in Fig. 8A). Referring to Figures 8A and 9B, an air inlet 207 is disposed at one end of the buffer chamber 206, which can be further connected to a gas valve or intake valve 401 (shown in Figure 10) of the bottom surface 10 of the casing 10. Regardless of whether the height of the buffer plenum 206 is about the same as that of the main body 200Β (as shown in FIG. 9A), or half of the entire main body 200Β (as shown in FIG. 8A), one end of the buffer plenum 206 having the air inlet 207 is disposed. There is an air flow passage 208a, and when the height of the buffer air chamber 206 can be the same as that of the main body 200B (as shown in FIG. 9A), an air flow passage 208a can be further disposed at opposite ends of the buffer air chamber 206 due to the air flow. The passage 208a is disposed between the air outlet passage 208b and the buffer air chamber 206, so that the buffer air chamber 206 can communicate with the air outlet passage 208b through the air flow passage 208a. Therefore, when the air valve or the intake valve 401 of the bottom surface 10B of the casing 10 is connected to an inflator (not shown), the gas can enter the buffer air chamber 206 via the air inlet 207 when entering the buffer air chamber 206. When the gas reaches the saturated state, since the air inlet 207 is in contact with and closed by the air valve or the intake valve 401 end, the gas in the buffer air chamber 206 can only enter the air outlet passage 208b via the air flow passage 208a, and then the air outlet passage 208b. The upper slit 203a is ejected; it is particularly emphasized here that since the cavities of the long slits 203a are very small with respect to the air flow passage 208a, the width of the caliber is about 0. 01 mm to 5 mm, 099146185 Form No. A0101, page 11 / 33 pages 0992079401-0 201226288 Therefore, when the gas in the buffer chamber 206 is refilled into the outlet passage 2G8b via the air passage 208a, most of the gas first enters the air passage 2 communicating with the outlet passage 2〇8b. In the middle, when the airflow and the heart are filled with the gas again, the gas outlet channel 2_ is finally flowed out and the gas is ejected through the long slit·a; therefore, the design of the long slit 2〇3a of the present invention makes the long slit 2〇38 The gas system is similar to the wind Knife, and the difference in the pressure gradient of the milk sprayed at both ends of the long slit 2仏 is not too large, so that the milk sprayed from the long slit 2〇3a has a pressure of -疋, which can be supported on each support The rib tearing and the flow field of the gas are formed between each of the restricting members 202, so that the particles distributed between the rib 201 and the restricting member 202 and the vicinity of the wafer can be brought to the 卩^ σ by the field of view of the gas. The direction of 1 2 to avoid these particles contaminating the wafer. [0018] In addition, in the embodiment of the present invention, the diameter of the slit 2〇3& can also be gradually reduced or enlarged from bottom to top (ie, from the first wafer to the 25th wafer), please refer to Fig. 9A is a schematic view showing the embodiment in which the caliber of the long slit 2〇3a is gradually increased from bottom to top, and at the end of the inlet port 2〇7, the slit of the long slit 2〇33 is small, and the air inlet is small. 2〇7 extends in the opposite direction, and the diameter of the long slit 203a gradually becomes larger. Referring to Fig. 9β, the caliber of the long slit 2〇3& is gradually reduced from bottom to top. At one end of the port 207, the long slit 2〇3a has a larger diameter and extends toward the opposite end of the inlet port 2〇7, and the diameter of the long slit 2〇3a gradually becomes smaller, however, it is more in line with physical phenomena. Under the premise, the design of the long slit 2 core from the first wafer to the 25th wafer will be better than the design from the jth to the 25th wafer to make it squirt out. The pressure of the gas is relatively uniform. Similarly, the long slit 2〇3a may be in the form of a long strip, as shown in FIG. 8A or in the long slit 2〇3a, a plurality of partitions 2〇4 0 099146185 Form No. A0101 Page 12 / Total 33 pages 0992079401-0 201226288 Straightly spaced to form a plurality of air outlets 2〇5, as shown in Fig. 9C; longitudinally extending over the long slits 2〇3a to form a plurality of transverse slits 203b, between the transverse seams 2 The present invention does not limit whether the distance between the pitches is the same, and the transverse slits 2〇3b may be formed by longitudinally extending the long slits 2〇3a into the middle and the left and right sides. As shown in (10), it may also be formed by extending only longitudinally to one of the left or right sides, as shown in FIG. 9E and FIG. 9F, respectively, due to the operation of the inflatable support module shown in FIGS. η to 9F. The process is the same as that of FIG. 8A and FIG. 8B, and the difference is only the long slit Ο [0019] 00 [0020] 203a is different in design, so it will not be repeated. In addition, the gas ejected by the long slit μ% may be a combination of an inert gas, dry cold air, nitrogen gas or the like. In the above-mentioned embodiment of FIGS. 8A to 8B and FIGS. 9A to 9F, a small gas valve or an outlet valve may be disposed in the vicinity of the opening 12 of the bottom surface 10B of the casing 10 (not shown in FIG. When the inflator is inflated to the casing ,, a slight gas inside the casing 10 can be allowed to flow out through the air valve or the outlet valve near the opening 12, except that the particles inside the casing 1Q can be excluded, and the filling is shortened. The time required for the cartridge 10. When the bran field, the casing 10 of the present invention may also contain two pairs of air inlets and outlets different from those described above to meet the standard of the open wafer cassette. Please refer to FIG. η again for an enlarged view of the severable cutting module of the present invention. The inflatable domain module is composed of a plurality of cut (four) i, which is a structure in which each support-i is similar to the platform, and the support 201 can be a wear-resistant consumable, a thermoplastic material, a polymer material or an elastic material. The material 'so' can prevent particles from being generated by friction when the wafer is selected to support the substrate or the platform. Of course, as shown, 099146185 Form No. A0101 Page 13 / Total 33 Page 0992079401-0 201226288 The G1 system can contain a tangent head 2〇9, and your rib 201 uses this to support the wafer head to contact the wafer. Reducing the area of the //buildings' can further reduce the generation of particles. ^, contact 201 can be arranged to have only this support for the round head-pair grinding: the cut is not the wear-resistant coffin, and the other costs. However, the plurality of retaining pull-up module 200 required for the i-production can be close to or attached to the rear wall (10), as shown in the figure. (10) Circumferential head = the movable wafer moves in the direction of the back wall (10) to avoid hitting 10B'. The limitation is that the slab is made of the wear-resistant consumables, or the above materials are The formed shallow groove is inserted into the shallow groove structure. In addition, the inner surface of the front opening wafer cassette further includes at least one restriction module (not shown). The module is used to limit the movement of the wafer in the direction of the opening η. [0021] The reciprocable cutting module 2_ includes a body _ body (10) β, a plurality of vertical spacing rows (four) reading lag 1, a plurality of Ϊ _ Arrangement of the restriction member 2〇2 and a long slit 2G3a, which can be formed into a body-formed structure to reduce the cost of production. When the image of the inflatable support member (4) can be assembled from each other, such as 13A and 13B, the two sides of the main body 2 of the inflatable support member pull group 2GG have a plurality of vertical spaces. The jack 21G of the row J is configured to allow a plurality of support ribs 201 to be inserted and assembled and fixed to the main body 2 to form a plurality of spaced-apart support ribs and assembled by the support ribs 2〇1 The method is fixed on the main body (10). Therefore, each of the standard ribs 201 has a fixed base 2U, and can support the 099146185 form nickname A0I01 丨 4 page / 33 pages 0992079401-0 201226288 piece module 200 The main body 2〇〇B is fitted. Further, each of the support ribs 2〇1 may have a circular hole 212 for inserting and fixing an originally separated support head 209 to the support rib 2〇1. The support rib 201 can be contacted with the wafer by the support rib 201. The support round head can be made of a wear-resistant consumable, a thermoplastic material, a polymer material or an elastic material, and the other is not in contact with the wafer. The place is not wear-resistant consumables, so as to reduce the cost required for production. In addition, the inflatable support module 2 of the open wafer cassette of the present invention can be made up of only one main body and two a vertically spaced support rib 201 and a long slit 2〇33, Such a structure can also have both a probe wafer and a particle in the vicinity of the wafer. Further, a plurality of air outlets can be formed between a plurality of vertically spaced support supports 2 (not shown). In addition, the inflatable support module 2 can be used to remove the particles in the vicinity of the wafer by using the plurality of air outlets, in addition to being able to use the long slits 2〇3a to eject the gas. Of course, the inflatable support module 2 The crucible may also be composed of a main body 2〇〇b, a row of a plurality of vertically spaced support ribs 201, another row of a plurality of vertically spaced ribs 2〇1 and a long slit 203a. In addition, the front opening of the wafer cassette of the present invention may have a door body as in the prior art, and a recessed area is provided on the inner surface of the door, and at least one latch is disposed between the outer surface of the door and the inner surface. The structure allows the wafer cassette to operate smoothly. [0022] Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to be limited to the details of the present invention. The scope of patent protection of the present invention is defined by the scope of the patent application attached to the specification. 099146185 Form No. A0101 Page 15 of 33 0992079401-0 201226288 [Simplified Schematic] [0023] [0025] [0028] [0029] [0032] [0032] [0036] [0036] FIG. 1 is a schematic view of a conventional open wafer cassette. 2 is a schematic view of a door body of a conventional open wafer cassette. Figure 3 is a schematic cross-sectional view of a conventional support module. Figure 4 is a schematic illustration of a conventional inflatable support module. Figure 5 is a perspective view of a box of a front opening wafer cassette of the present invention. Fig. 6 is a schematic view showing a front open type wafer cassette of the present invention in which only the inflatable support member module is retained. Fig. 7 is a schematic view showing a casing of a front opening wafer cassette of the present invention. 8A and 8B are schematic views of an inflatable support module of a front opening wafer cassette of the present invention. Figure 8C is a bottom plan view of an inflatable support module of a front opening wafer cassette of the present invention. 9A-9F are schematic views showing an embodiment of a slit of an inflatable support module of a front opening wafer cassette of the present invention. Figure 10 is a schematic illustration of a front open wafer cassette of the present invention with no inflatable support module installed. Figure 11 is an enlarged schematic view of an inflatable support module of a front opening wafer cassette of the present invention. Figure 1 is a partial schematic view of a front open wafer cassette of the present invention with an inflatable support module. 13A and 13B are an inflatable sleeve of a front open type wafer cassette of the present invention. Form No. A0101 Page 16 of 33 0992079401-0 201226288 Another design of the support module. [Main component symbol description]
[0037] 10 盒體 [0038] 10L 側壁 [0039] 10T 頂面 [0040] 10B 底面 [0041] 10B’ 後壁 [0042] 100 晶圓限制件 [0043] 110 晶圓接觸頭 [0044] 11 插槽 [0045] 12 開口 [0046] 20 門體 [0047] 21 外表面 [0048] 221 頂端 [0049] 222 底端 [0050] 22 内表面 [0051] 23 門閂開孔 [0052] 230 鎖存機構 [0053] 24 凹陷區域 [0054] 200 可充氣支撐件模組 099146185 表單編號A0101 第17頁/共33頁 0992079401-0 201226288 [0055] [0056] [0057] [0058] [0059] [0060] [0061] [0062] [0063] [0064] [0065] [0066] [0067] [0068] [0069] [0070] [0071] [0072] [0073] 主體 支撐肋 限制件 長缝 橫縫 多孔性材質之材料 隔板 出氣口 緩衝氣室 進氣口 氣流通道 出氣通道 支撐圓頭 插孔 固定基座 圓形孔洞 支撐件模組 進氣閥 支撐件 099146185 表單編號A0101 第18頁/共33頁 0992079401-0 201226288 [0074] 501 [0075] 600 [0076] 601 [0077] 602 [0078] 603 樹醋 中空主體 支撐件 上表面 側表面10 Cartridge [0038] 10L Sidewall [0039] 10T Top Surface [0040] 10B Back Surface [0041] 10B' Back Wall [0042] 100 Wafer Restrictor [0043] 110 Wafer Contact Head [0044] 11 Insert Slot [0045] 12 opening [0046] 20 door [0047] 21 outer surface [0048] 221 top [0049] 222 bottom end [0050] 22 inner surface [0051] 23 door latch opening [0052] 230 latch mechanism [ 0053] 24 recessed area [0054] 200 inflatable support module 099146185 Form No. A0101 Page 17 / Total 33 0992079401-0 201226288 [0056] [0058] [0060] [0060] [0061 [0063] [0073] [0073] [0073] The main body supporting rib restricting member long slit transverse porous material Material partition air outlet buffer air chamber air inlet air passage air outlet passage support round head socket fixed base circular hole support member module intake valve support 099146185 Form No. A0101 Page 18 / Total 33 Page 0992079401-0 201226288 501 [0075] 600 [0078] 603 [0078] 603 vinegar hollow body support upper surface side surface
099146185 表單編號A0101 第19頁/共33頁 0992079401-0099146185 Form number A0101 Page 19 of 33 0992079401-0