201215549201215549
[0001] [0002] 099134683 發明說明： 【發明所屬之技術領域】 本發明係關於一種前開式晶圓盒，特別是有關於一種於 前開式晶圓盒中配置有可充氣之支撐件模組，並於可充 氣之支撐件模組中配置有一緩衝氣室，使得氣體可以在 前開式晶圓盒中形成一均勻氣體流場。 【先前技冬好】 在半導體製程當中，由於半導體晶圓需經過各種不同製 程與製程設備，經由自動化系統搬運到不同的製程工作 站。為了方便晶圓的撤運且避免晶圓受到外界的污染， 常會利用一密封容器以供自動化設備輸送。請參考第1圖 所示，係習知技術之晶圓盒示意圖。此晶圓盒是一種前 開式晶圓盒（Front Opening Unified Pod, FOUP)， 係具有一盒體10及一門體20，盒體10係由一對側壁10L 及相鄰該對側壁10L之一頂面10T及一底面1 0B所組成， 並於一側邊形成一開口 12，而相對開口 12之另一侧邊形 成一後壁10B’ ，其中在這對側壁10L上係各設有複數個 插槽11以水平容置複數個晶圓，而門體20具有一個外表 面21及一個内表面22，門體20係藉由内表面22與盒體10 的開口 12相結合，用以保護盒體10内部的複數個晶圓。 此外，在門體20的外表面21上配置至少一個門閂開孔23 ，用以開啟或是封閉前開式晶圓盒。在上述之前開式晶 圓盒中，由於半導體晶圓係水平地置於盒體10内部，因 此，在前開式晶圓盒搬運過程中需配有晶圓限制件，以 避免晶圓因震動而產生異位或往盒體10的開口 12方向移 動。 表單編號A0101 第4頁/共30頁 0992060572-0 201215549 [0003] Ο [0004] ❹ :參:第2圖所示’係一美國公告專利6 736肩揭露 ，門體二開式晶圓盒之門體20結構示意圖。如第2圖所示 ㈣2配置有—凹陷區賴，此凹陷區域 ㈣2_端2叫_底端Μ2且係在左右二 (於門體内部)之間，而在凹陷區_中再 ^配置有晶圓限制件禮纟 七七一 、，、，此晶圓限制件模組係由 友右二個晶圓限制件100所組 100上係且右…曰、成而在母-個晶圓限制件 頭頂持其相她圓，避用此晶圓接觸 而異位或往錢之移f傳錢財因震動 上述盒體1〇_壁10L上的插槽U及門㈣内表面22的 晶圓限制件模組分別係用來支擇及限制盒链1〇内部所乘 f的複數個晶圓’然而’這些支擇件及限制件都容易在 Ba圓盒運送的過程中與晶圓產生摩擦，造成微粒 (Particle)的產生。當晶圓盒的盒體10内部有微粒出現 時:微粒可能會停留在晶•面或汙染晶圓造成後續 的曰曰片產生其良率的下降。因此’在晶圓盒其支揮件及 限制件的設計上，通常會使用具耐磨特性的材質，以避 免支揮件及限制件與晶圓接觸時產生太多的微粒。如第3 圖所示，係美國公開專利2006/0283774所揭露之—種置 於晶圓盒兩側壁之支撐件模組之刮面示意圖。此支撐件 模組係由複數個垂直間隔排列的支撐件500所組成，而在 支撐件500的表面係包覆著一層樹酯5〇1，這層樹酯5〇1 具有低摩擦特性，因此可以避免支撐件500和晶圓摩擦而 產生微粒。然而，在此種設計當中，由於樹酯5〇1具有一 099134683 表單編號A0101 第5頁/共30頁 0992060572-0 201215549 斜面，因此當晶圓支撐於樹酯5〇1時，僅能支柃 邊緣附近，而當晶圓的尺寸較大時，則容易使曰ja曰圓的 或下沉，除了容易造成晶圓產生裂痕外，機器手^下垂 出晶圓時，亦容易使晶圓產生破片或遭受破枣。在輪 [0005] 此外，也有些設計係在晶圓盒的内部，例如： 述支撐件或限制件模組接觸的附近，提供一 /、上[0001] [0002] 099134683 Description of the Invention: [Technical Field] The present invention relates to a front opening type wafer cassette, and more particularly to an inflatable support module disposed in a front opening wafer cassette. A buffer chamber is disposed in the inflatable support module such that the gas can form a uniform gas flow field in the front open wafer cassette. [Previous winters] In semiconductor manufacturing, semiconductor wafers are transported to different process stations via automated systems because of the various process and process equipment. In order to facilitate wafer evacuation and avoid contamination of the wafer from the outside world, a sealed container is often used for automated equipment delivery. Please refer to Figure 1 for a schematic diagram of a wafer cassette of the prior art. The wafer cassette is a Front Opening Unified Pod (FOUP) having a box body 10 and a door body 20. The box body 10 is formed by a pair of side walls 10L and a top side of the pair of side walls 10L. The surface 10T and the bottom surface 10B are formed, and an opening 12 is formed on one side, and a rear wall 10B' is formed on the other side of the opening 12. The plurality of insertions are respectively arranged on the pair of side walls 10L. The slot 11 accommodates a plurality of wafers horizontally, and the door body 20 has an outer surface 21 and an inner surface 22, and the door body 20 is combined with the opening 12 of the casing 10 by the inner surface 22 for protecting the casing. 10 internal multiple wafers. In addition, at least one latch opening 23 is disposed on the outer surface 21 of the door body 20 for opening or closing the front opening wafer cassette. In the above-mentioned open-type wafer cassette, since the semiconductor wafer is horizontally placed inside the casing 10, a wafer restriction member is required in the front opening wafer cassette transportation process to prevent the wafer from being shaken. The ectopic position is generated or moved toward the opening 12 of the casing 10. Form No. A0101 Page 4/Total 30 Page 0992060572-0 201215549 [0003] Ο [0004] ❹: Reference: Figure 2 shows a US-issued patent 6 736 shoulder disclosure, door open-open wafer cassette Schematic diagram of the structure of the door body 20. As shown in Fig. 2, (4) 2 is arranged with a recessed area, the recessed area (4) 2_end 2 is called _ bottom end Μ2 and is between left and right (inside the door body), and in the recessed area _ Wafer Restricted Parts 七七一,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The top of the piece holds its own circle, avoiding the contact of the wafer and ectopic or transferring money to the money. The wafer limitation of the inner surface 22 of the slot U and the door (4) on the wall 10L is vibrated. The modules are used to select and limit the plurality of wafers multiplied by f inside the box chain. 'However, these selections and restrictions are easy to rub against the wafer during the transport of the Ba round box. Causes the production of particles. When particles appear inside the cassette 10 of the wafer cassette: the particles may stay on the crystal face or contaminate the wafer causing subsequent bucks to produce a drop in yield. Therefore, in the design of the support and the restricting member of the wafer cassette, the material of the wear-resistant property is usually made to avoid excessive particles generated when the support member and the restricting member are in contact with the wafer. As shown in Fig. 3, it is a schematic view of a scraping surface of a support module disposed on both side walls of a wafer cassette as disclosed in U.S. Patent Publication No. 2006/0283774. The support module is composed of a plurality of vertically spaced support members 500, and the surface of the support member 500 is covered with a layer of resin 5〇1, which has low friction characteristics. It is possible to prevent the support member 500 and the wafer from rubbing to generate particles. However, in this design, since the resin ester 5〇1 has a 099134683 form number A0101 page 5/total 30 page 0992060572-0 201215549 bevel, when the wafer is supported by the resin 5〇1, it can only support Near the edge, when the size of the wafer is large, it is easy to make the 曰ja round or sink. In addition to the easy cracking of the wafer, when the robot hangs down the wafer, it is easy to cause the wafer to be fragmented. Or suffer from breaking dates. In the wheel [0005] In addition, some designs are located inside the wafer cassette, for example: near the contact of the support or the restriction module, providing a /, upper
’、 夏氣的開D 或刀口，則可將摩擦產生的微粒帶離晶圓。如 弟4圖所》 ，係一美國公告專利US6, 899, 145所揭露之一 不 種 晶圓盒内部之可充氣支撐件模組之示意圖。 ； 兄氣支^ 件模組包括一中空主體600，中空主體㈣〇係固定於曰牙 盒之盒體的侧壁並向盒體的内部延伸有複數個垂、B曰圓 樓件601 ’以利用支撐件的上表面602支撐金體内^的支 數個晶圓。而在支撐件的侧表面603具有一橫條狀^的複 ，可將中空主體600内部的氣體由此橫條狀開口 的開口 赁出，以 避免因摩擦產生的微粒形成於晶圓表面。上述結構 於橫條狀開口置於支撐件601的側表面603，交且 由 I易造成彡 撐力道不足進而使晶圓發生異位或重疊，造成晶圓 。。 重的損壞。此外，當晶圓承載於支撐件6〇1其上表.面6 時’晶圓與支撐件601之間的接觸面積係相當的 2 ’這使 微粒更容易產生。且’由於橫條狀的開口其長斤盘曰 又與晶圓 相當’因此，可能造成氣流微弱或是需要使用較大的充 氣设備來提供較大的氣流重，方此形成有效的氣體节γ 。因此，目前的晶圓盒的内部係需要一種設計較周全的 可充氣支撐件模組，可有效地避免微粒產生及形成於曰 '曰曰 圓表面。 099134683 表單編號Α0101 第6頁/共30頁 〇992〇6〇572.〇 201215549 【發明内容】 [0006] 依據先前技術之晶圖八*人祕 曰曰圓盒其盒體内部之可充氣支撐件极， 容易造成晶圓支撐+ σ 又诨件槔組 微粒等問題Ϊ 接觸面積過大及容易產生 微粒#門題，本發明之一主要目的在於提供 充氣支律件模組之前開式晶圓盒，可充氣支撑 配置於盒體側壁及後壁相鄰之處且其具有至少_1面: 開口方向的長縫，長縫係可喷出氣體用以控制前開式晶 圓盒其内部環境的壯能 曰 例如：㈣的大氣動、濕度 或氣體的種類等。 ο [0007] 本發月2 3主要目的在於提供一種具有可充氣支撑件 模組之㈣式晶圓盒，可充氣支赫模組係具有至少一 個面向開α方向的長縫，長缝可喷出⑽朗成一氣體 流場’可將晶圓上的微粒帶走，以避免形成於晶圓 上方。 [0008] ο 本發明^再—主要目的在於提供—種具有可充氣支推件 模組之則開式晶圓盒，可充氣夫锋件模組係具一緩衝氣 室且於緩衝氣室之一端配置，氣〆緩衝氣室與出氣 通道之長縫相連通，當緩衝氣室處於飽壓狀態時，可藉 由長縫噴出—均勻之氣流並形成一氣體流場，將晶圓上 的微粒帶走’以避免微粒形成於晶圓上方。 [0009] 本發明之還有—主要目的在於提供—種具有可充氣支樓 牛棋、·且之别開式晶圓盒，於晶圓盒之侧壁上配置有支推 件模組’其具有複數個垂直間隔排列的支撐件或支撐肋 ，且支撐件或支撐肋上具有一耐磨的支撐圓頭，支撐件 或支擇肋可利用此耐磨的支撐圓頭與晶圓接觸，除了可 099134683’, the opening of the D or the knife edge of the summer, can bring the particles generated by the friction away from the wafer. A schematic diagram of an inflatable support module inside the wafer cassette is disclosed in US Pat. No. 6,899,145. The brother support module includes a hollow body 600. The hollow body (4) is fixed to the side wall of the box of the box and extends to the inside of the box with a plurality of hanging, B曰 round pieces 601 ' The upper surface 602 of the support member supports a plurality of wafers in the gold body. On the side surface 603 of the support member, a cross-shaped strip is formed to allow the gas inside the hollow body 600 to be withdrawn from the opening of the horizontal strip opening to prevent the particles generated by the friction from being formed on the surface of the wafer. The above structure is placed on the side surface 603 of the support member 601 in the horizontal strip opening, and the wafer is easily caused by the entanglement of the wafer and the wafer is eccentric or overlapped. . Heavy damage. In addition, when the wafer is carried on the support member 6〇1 on the surface 6 of the surface, the contact area between the wafer and the support member 601 is equivalent to 2', which makes the particles easier to produce. And 'because the horizontally-shaped opening is the same as the wafer, it may cause a weak airflow or a large inflatable device to provide a large airflow weight, thus forming an effective gas section. γ. Therefore, the interior of the current wafer cassette requires a more well-designed inflatable support module, which can effectively prevent the generation of particles and the formation of a circular surface. 099134683 Form No. Α0101 Page 6 of 30 〇992〇6〇572.〇201215549 [Invention] [0006] According to the prior art, the crystal figure 八*人秘曰曰 round box has an inflatable support inside the box Extremely, it is easy to cause problems such as wafer support + σ and 槔 槔 微粒 Ϊ Ϊ Ϊ 接触 接触 接触 接触 过 过 过 过 接触 接触 接触 接触 接触 接触 接触 接触 接触 接触 接触 接触 接触 接触 接触 # # # # # # # # , , , , , The inflatable support is disposed adjacent to the side wall and the rear wall of the casing and has at least _1 faces: long slits in the opening direction, and the long slits can eject gas to control the growth of the internal environment of the front open wafer cassette For example: (4) The type of large aerodynamics, humidity or gas. ο [0007] The main purpose of this month is to provide a (four) type wafer cassette with an inflatable support module, the inflatable hollow module has at least one long slit facing the α direction, and the long slit can be sprayed Out (10) into a gas flow field 'can carry particles on the wafer to avoid formation above the wafer. [0008] The present invention further provides an open wafer cassette having an inflatable pusher module, the inflatable front module having a buffer chamber and a buffer chamber. At one end, the gas buffering buffer chamber communicates with the long slit of the outlet passage. When the buffer chamber is in a saturated state, the gas can be sprayed through the long slit—a uniform gas flow and a gas flow field is formed to form the particles on the wafer. Take away 'to avoid particles formed above the wafer. [0009] Still another object of the present invention is to provide a different type of wafer cassette having an inflatable branch, and a pusher module is disposed on a side wall of the wafer cassette. a plurality of vertically spaced support members or support ribs, and the support member or the support rib has a wear-resistant support round head, and the support member or the support rib can contact the wafer by the wear-resistant support round head, except Can be 099134683
第7頁/共30 I 0992060572-0 表單編號Α0101 201215549 圓摩擦時產生 減少跟晶圓接觸的面積外，亦能避免與曰 微粒。 [0010] [0011] [0012] 本發明之再一主要目的在於提供―種具有可充氣支稽件 模組之前開式晶社，可充氣切件模組係、配置於各體 侧壁及後壁相鄰之處且其具有-排複數㈣直間隔^ 的支樓件或支禮肋以及-排複數個垂直間隔排列的限制 件，此複數個支撑件係靠近盒體的側壁而複數個限制件 則係靠近盒體的後壁’因此，此可充氣域件模組除了 可支撐晶圓外，也能避免晶圓往後壁的方向移動，以減 少微粒產生。 本發明之再一主要目的在於择供—種具有可充氣支撐件 模組之前開式晶圓盒，此可充氣支撐件模組上的每—支 標肋前端可以配置-凸出塊，用以與晶圓之背面接觸， 因此可藉由支撐肋的長度使得較大的晶圓能得到較佳的 支撑而不會產生形變或下沉’舞胸增加晶圓製程上的 " . ... .... 良率。 " ..I：.' ... 為達上述之各項目的，本發明揭露厶種前開式晶圓盒， 包括一盒體，係由一對側壁、分別相鄰於一對側壁之一 頂面及一底面所組成，並於一側邊形成一開口，而相對 於開口之另一側邊形成—後壁於一對側壁上各配置一 支撐件模組以容置複數個晶圓，並於一對側壁與後壁相 鄰處各配置一可充氣支撐件模組，以及一門體，具有一 外表面及一内表面，門體係以内表面與盒體之開口相結 合，並用以保護盒體内部之複數個晶圓，其中前開式晶 圓盒之特徵在於：每一可充氣支撐件模組具有一緩衝氣 099134683 表單編號A0101 第8頁/共30頁 0992060572-0 201215549 〇 v/ [0013] 至且於緩衝氣室之—端配置―進氣口，此進氣口係與底 面之一氣閥相連接，在可充氣支擇件模組之面對開口之 方向上配置有一出氣通道且於出氣通道之一側配置有一 長縫’出氣通道與緩衝氣室之間具有一氣流通道以使出 氣通道與緩衝氣室可相互連通，以及於長縫之-侧邊上 配置複數個垂直於長縫而間隔排列的支撐肋。此外，可 充氣支揮件模組亦可以進—步包含複數個垂直間隔排列 的限制件’以限制晶圓往盒體後壁的方向移動。 【實施方式】 為使本發明所運用之技術内容、發明目的及其達成之功 效有更完整且清楚的揭露，茲於下詳細說明之，並請一 併參閱所揭之圖示及圖號。 ，，， [0014] ❹ 首先，請參閱第5圖、第6圖及第7圖，係本發明之一種前 開式晶圓盒之盒體透視圖、盒體僅保留可充氣支撐件模 組之示意圖以及其側視圖。:前開式晶圓盒之盒體1 0係由 一對側壁10L及相鄰此對側壁i〇l之一頂面ι〇τ及一底面 10B所組成，並於—側籩形成一開口 12，而相對開口 12之 另一侧邊形成一後壁10B，，其中在這對側壁l〇L接近開 口 12的附近各配置有一支撐件模組3 〇 〇，而在這對側壁 10L與後壁10B’相鄰的地方各配置有一可充氣支撐件模 組200。前述的支撐件模組3〇〇可以是習知支撐件的形式 ，在此並不加以限制。 [0015] 清接者參考第8A圖及第8B圖所示，係本發明之一種可充 氣支撐件模組之一種實施例示意圖。首先，如第8A圖所 示，本發明之可充氣支撐件模組200主要係包括一主體 099134683 表單編號A0101 第9頁/共30頁 0992060572-0 201215549 200B及由主體200B延伸出去的兩個可用來支撐晶圓之部 分，其中第一個部分係由複數個垂直間隔排列的支撐肋 201所組成，而第二部分係由複數個垂直間隔排列的限制 件202所組成，且在這些支撐肋201與這些限制件202的 間隔之間係設有一出氣通道208b，且於出氣通道208b之 一侧配置有一長縫203a ;藉由此氣通道208b及長缝203a 之設計，使得氣體可以由長縫203a向盒體10内部充氣； 此外，也藉由複數個支撐肋201及複數個限制件202並與 一對側壁10L上之支撐件模組300的相互配置下，可以共 同支撐複數個晶圓。而本發明所述之可充氣支撐件模組 200，係為一體成型之結構，並可以射出成型之方式所製 成。 [0016] 接著，請繼續參考第8A圖、第8B圖及第9A圖，在上述的 主體200B内部係有一緩衝氣室206，且其高度約可以與主 體200B相同（如第9A圖所示），或是缓衝氣室206之高度 可以為整個主體200B的一半（如第8A圖所示）。請參考第 8A圖與第9A圖，在緩衝氣室206的一端係皆配置有一進氣 口 207，其可進一步與盒體10底面10B之一氣閥或進氣閥 401 (顯示於第10圖中）連接。而不論緩衝氣室206之高度 約與主體200B相同（如第9A圖所示），或為整個主體200B 的一半（如第8A圖所示），在緩衝氣室206具有進氣口 207 的一端皆配置有一氣流通道208a，而當緩衝氣室206之高 度約可以與主體200B相同時（如第9A圖所示），則可進一 步於緩衝氣室206之相對兩端皆各配置一氣流通道208a， 由於氣流通道208a係配置於出氣通道208b與緩衝氣室 099134683 表單編號A0101 第10頁/共30頁 0992060572-0 201215549 ❹ Ο 206之間，故緩衝氣室206可藉由氣流通道208a而與出氣 通道208b相互連通。因此，當盒體10底面10B的氣閥或 進氣閥401連接一充氣裝置（未顯示於圖中）時，氣體可經 由進氣口 207進入緩衝氣室206中，當進入緩衝氣室206 内之氣體達到飽壓狀態時，由於進氣口 207與氣閥或進氣 閥401端已經接觸並封閉，故緩衝氣室206中氣體僅能經 由氣流通道208a進入出氣通道208b，再由出氣通道208b 上的長縫203a噴出；在此特別要強調，由於此長缝203a 之口徑相對於氣流通道208a是非常小，其口徑之寬度約 為0.01mm~5min，故當充入緩衝氣室206中氣體經由氣流 通道208a再充入出氣通道208b時，大部份的氣體會先進 入至與出氣通道208b相通的氣流通道208a中，當氣流通 道208a再次充滿氣體後，最後會流入出氣通道208b並經 由長縫203a喷出氣體；因此，藉由本發明長縫203a的設 計，使得從長縫203a喷出氣體係類似風刀，並且在長縫 203a兩端所喷出的氣體壓力梯度之差異不會太大，使得 從長縫203a喷出之氣體具有一定的壓力，可在每一支撐 於支撐肋201及每一限制件202之間形成氣體之流場，故 可將分佈於支撐肋201及限制件202之間以及晶圓附近的 微粒，藉由此氣體之流場帶往開口 12的方向，以避免這 些微粒汙染晶圓。 [0017] 此外，在本發明之實施例中，長縫203a之口徑亦可以是 由下到上（即從晶圓第1片到第25片）逐漸變小或變大，請 參考第9A圖，為長縫203a之口徑由下到上逐漸變大實施 方式之示意圖，在靠近進氣口 207之一端，其長縫203a之 099134683 表單編號A0101 第11頁/共30頁 0992060572-0 201215549 口徑較小’而往進氣口 207相反一端之方向延伸，其長縫 203a之口徑則逐漸變大，再請參考第98圖，為長縫別％ 之口徑由下到上逐漸變小實施方式之示意圖，在靠近進 氣口 207之一端，其長縫20 3a之口徑較大’而往進氣口 2 0 7相反一端之方向延伸，其長縫2 〇 3 a之口徑則逐漸變小 ’然而在較為符合物理現象的前提下，長縫2〇ga之口徑 由晶圓第1片到第25片逐漸變大之設計會優於由晶圓第1 片到第25片逐漸變小之設計，以使其噴出的氣體之壓力 較為一致。同樣地，上述長縫2〇3a的形式可以為長條形 ’如第8A圖所示，或於長縫2〇33中配置有複數個隔板 204垂直間隔以形成複數個出氣口205，如第9C圖所示 ;於長縫203a上縱向延伸形成複數個橫缝2〇3b，在這 些橫縫203b之間都具有一間距，本發明在此並不限定這 些間距之間的距離是否為相同，而橫縫2〇3b可以是以長 縫203a為中心’分別向左右兩側縱向延伸形而成，如第 9D圖所示，也可以僅向左或向右其中縱向延伸形而 成’为別如第9 E圖與第9 F圖所示由於第9A圖至第9F圖 所不之可充氣支撐件模組之操作過卷與第8A圖及第⑽圊 相同，其差異處僅為長縫2〇3a之設計不同，故不再重覆 贅述之。此外，長縫2〇3a喷出的氣體可以係是惰性氣體 、乾燥冷空氣、氮氣或以上氣體的組合。 [0018] 在上述的第8A圖至第8B圖以及第9A圖至第9F圖之實施例 當中，亦可在盒體1〇的底面1〇B靠近開口12的附近配置至 少另一氣閥或出氣閥（未顯示於第1〇圖中），當充氣裝置 在對盒體10充氣時，可允許盒體1〇内部些微的氣體經開 099134683 表單編號A0101 第12頁/共30頁 0992060572-0 201215549 口 12附近的氣閥或出氣閥流出，除了可以將盒體1 〇内部 的微粒移除外，也縮短充飽盒體10所需的時間。當然’ 本發明的盒體1〇亦可以包含有兩對有別於上述的進氣閥 及出氣閥，以符合前開式晶圓盒的標準。 卿]請再參考第丨丨圖，係本發明之可充氣支撐件模組之放大 示意圖。可充氣支撐件模組2〇〇係由複數個支撐肋2〇1所 組合而成，其中每一支撐肋201係類似一平台的結構，支 撐肋201可以係—耐磨耗材、熱塑性材質、高分子材質戈 0 彈性材質等材料，因此，當晶圓被支撐於支撐肋201或平 台上時’能避免因為摩榛而產產微粒。當然，如第丨1圖 所示，支撐肋201上係可以係包含有一支撐圓頭2〇9，使 支撐肋201利用此支撐圓頭2〇9與晶圓接觸以減少和晶圓 接觸的面積，可更進—步地減少微粒的產生。當然，支 撐肋201可安排為僅有此支撐圓頭2〇9係一耐磨耗材，而 其他未跟晶圓接觸的地方都不是对磨耗材，以降低生產 所需的成本。而可充氣支撐存模組2〇〇的複數個限制件 ❹ 202由於係靠近或懸浮於後壁1〇Β，之前方（如第12圖所 示），故可以限制支撐於支撐肋2〇1或支撐肋2〇1其支撐圓 頭209上的晶圓往後壁1〇3，的方向移動，以避免晶圓撞 擊後壁10Β’ 。而限制件202可以係由緩衝材料或耐磨耗 材所製成的平板，亦或係由上述材料所形成的淺凹槽結 構，以容納晶圓進入此淺凹槽結構。此外，在前開式晶 圓盒的門體内表面亦會進一步包含至少—限制件模組（未 顯示於圖中），此限制件模組則係用來限制晶圓往開口Μ 的方向移動。 099134683 表單編號Α0101 第13頁/共30頁 0992060572-0 201215549 [0020] 099134683 前述可充氣支撐件模組200係包含有—主體2_、複數個 垂直間隔排列的支撐肋201、複數個垂直間隔排列的限制 件202及一長缝203a，其可以係—體成形的結構，以降低 生產的成本。當然，可充氣支撐件模組2〇〇係可以由這些 兀件互相組裝而成，如第13A圖及第13B圖所示，可充氣 支撐件模組2〇〇的主體200B的兩個側面係具有複數個垂直 間隔排列的插孔210，以允許複數個支撐肋2〇1插入並組 裝及固定於主體200B上，以形成複數個間隔排列的支撐 肋201。而由於支撐肋201係以組裝的方式固定於主體 2 00B上，因此，每·Γ支攮肋2〇1都具有一固定基座Hi， 可與支撐件模組200的主體200Β袓嵌合此外，每一個支 撐肋201亦可以係具有一圓形孔洞212，可讓一原本分離 的支撐圓頭209塞入並固定於支撐肋201上，使支樓肋 2〇1可以利用此支撐圓頭209與晶圓接觸。而此支撐圓頭 209可以係一耐磨耗材、熱塑性材質、高分子材質或彈性 材質等材料，而其他未跟晶圓接觸钓地方都不是耐磨耗 材，以降低生產所需的成本。此外，本發明之前開式晶 圓盒其可充氣支撐件模組200係可以係僅由一主體2〇〇Β、 複數個垂直間隔排列的支撐肋2〇1及一長缝2〇3a所組成， 這樣的結構，同樣可以兼具支撐晶圓及排除晶圓附近的 微粒。此外，亦可在複數個垂直間隔排列的支撐肋2〇1之 間形成複數個出氣孔（未顯示於圖中），使可充氣支撐件 模組200除了能利用長縫203a喷出氣體外，也可利用此複 數個出氣孔將晶圓附近的微粒帶離。當然，可充氣支偉 件模組20 0亦可以係由一主體2〇〇B、一排複數個垂直間隔 排列的支撐肋2 01、另一排複數個垂直間隔排列的支撐肋 0992060572- 表單編號A0101 第14頁/共30頁 201215549 201及一長縫203a所組成，本發明不加以限制。此外，本 發明之前開式晶圓盒其門體可以如習知技術之門體，於 門體内表面設有一凹陷區域，且在門體外表面及内表面 之間配置至少一門閂結構，使晶圓盒能順利運作。 [0021] Ο [0022] [0023] [0024] [0025] [0026] ο [0027] [0028] [0029] [0030] 099134683 雖然本發明以前述之較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習相似技藝者，在不脫離本發明 之精神和範圍内，當可作些許之更動與潤飾，因此本發 明之專利保護範圍須視本說明書所附之申請專利範圍所 界定者為準。 【圖式簡單說明】 第1圖係習知之前開式晶圓盒之示意圖。 第2圖係習知之前開式晶圓盒之門體示意圖。 第3圖係習知之支撐件模組之剖面示意圖。 第4圖係習知之可充氣支撐件模組之示意圖。 第5圖係本發明之一種前開式晶圓盒其盒體之透視圖。 第6圖係本發明之一種前開式晶圓盒其盒體僅保留可充氣 支撐件模組之示意圖。 第7圖係本發明之一種前開式晶圓盒其盒體之示意圖。 第8 A圖與第8 B圖係本發明之一種前開式晶圓盒其可充氣 支撐件模組之示意圖。 第9人圖~第9F圖係本發明之一種前開式晶圓盒其可充氣 支撐件模組之長縫的實施方式示意圖。 表單編號A0101 第15頁/共30頁 0992060572-0 201215549 [0031] 第1 0圖係本發明之一種前開式晶圓盒其尚未安裝可充氣 支撐件模組之示意圖。 [0032] 第11圖係本發明之一種前開式晶圓盒其可充氣支撐件模 組之放大示意圖。 [0033] 第1 2圖係本發明之一種前開式晶圓盒其配置有可充氣支 撐件模組之局部示意圖。 [0034] 第1 3 A圖及第1 3B圖係本發明之一種前開式晶圓盒其可充 氣支撐件模組之另一設計。 【主要元件符號說明】 [0035] 10 盒體 [0036] 10L 侧壁 [0037] 10T 頂面 [0038] 10B 底面 [0039] 10B’ 後壁 [0040] 100 晶圓限制件 [0041] 110 晶圓接觸頭 [0042] 11 插槽 [0043] 12 開口 [0044] 20 門體 [0045] 21 外表面 [0046] 221 頂端 表單編號A0101 099134683 第16頁/共30頁 0992060572-0 201215549 Ο ❹ [0047] 222 底端 [0048] 22内表面 [0049] 23門閂開孔 [0050] 230 鎖存機構 [0051] 2 4凹陷區域 [0052] 200 可充氣支撐件模組 [0053] 200B 主體 [0054] 201 支撐肋 [0055] 202 限制件 [0056] 203a 長縫 [0057] 203b 橫縫 [0058] 204 隔板 [0059] 205 出氣口 [0060] 206 緩衝氣室 [0061] 207 進氣口 [0062] 208a 氣流通道 [0063] 208b |出氣通道 [0064] 209 支撐圓頭 [0065] 210 插孔 099134683 表單編號Α0101 第17頁/共30頁 0992060572-0 201215549 [0066] 211 固定基座 [0067] 212 圓形孔洞 [0068] 300 支撐件模組 [0069] 401 進氣閥 [0070] 500 支撐件 [0071] 501 樹S旨 [0072] 600 中空主體 [0073] 601 支撐件 [0074] 602 上表面 [0075] 603 側表面 099134683 表單編號 A0101 第 18 頁/共 30 頁 0992060572-0Page 7 of 30 I 0992060572-0 Form No. 1010101 201215549 Generated by Friction When the area in contact with the wafer is reduced, it is also possible to avoid particles. [0012] [0012] Another main object of the present invention is to provide a type of inflatable module, an inflatable cutting module, and a side wall and a rear portion of the body. a wall member adjacent to the wall and having a plurality of rows (four) of straight spacers or a rib and a plurality of vertically spaced restriction members, the plurality of supports being adjacent to the side wall of the casing and having a plurality of restrictions The piece is close to the back wall of the case. Therefore, in addition to supporting the wafer, the inflatable field device module can prevent the wafer from moving toward the back wall to reduce particle generation. A further main object of the present invention is to provide an open-type wafer cassette having an inflatable support module, and each of the front ends of the support ribs on the inflatable support module can be configured with a protruding block for Contact with the back side of the wafer, so that the larger length of the wafer can be better supported by the length of the support rib without deformation or sinking. The dance chest is increased on the wafer process. .... yield. " ..I:.' ... In order to achieve the above objects, the present invention discloses a front opening wafer cassette comprising a box body, a pair of side walls, respectively adjacent to one of the pair of side walls The top surface and the bottom surface are formed, and an opening is formed on one side, and is formed on the other side of the opening. The rear wall is provided with a support module on each of the pair of side walls to accommodate a plurality of wafers. And an inflatable support member module disposed adjacent to the pair of side walls and the rear wall, and a door body having an outer surface and an inner surface, the door system is combined with the inner surface and the opening of the box body, and is used for protecting the box A plurality of wafers inside the body, wherein the front open wafer cassette is characterized in that each inflatable support module has a buffer gas 099134683 Form No. A0101 Page 8 / Total 30 Page 0992060572-0 201215549 〇v/ [0013 And the air inlet is connected to the end of the buffer air chamber, and the air inlet is connected to one of the air valves of the bottom surface, and an air outlet passage is disposed in the direction facing the opening of the inflatable support module; One side of the outlet passage is provided with a long slit 'exhaust passage and Having a gas flow channel between the gassing chamber and the intake passage to exert buffer air chamber may communicate with each other, and to the slit - a plurality of support ribs disposed within and spaced slit on the vertical sides. In addition, the inflatable support module can further include a plurality of vertically spaced restriction members to limit the movement of the wafer toward the rear wall of the casing. [Embodiment] For a more complete and clear disclosure of the technical content, the object of the invention, and the effects thereof, the present invention will be described in detail below, and reference should be made to the accompanying drawings and drawings. [0014] ❹ First, please refer to FIG. 5, FIG. 6 and FIG. 7 , which is a perspective view of a box of the front opening wafer cassette of the present invention, and the box body only retains the inflatable support module. Schematic and its side view. The box 10 of the front open type wafer cassette is composed of a pair of side walls 10L and a top surface ι τ of a pair of adjacent side walls i 及1 and a bottom surface 10B, and an opening 12 is formed on the side ,. The other side of the opening 12 defines a rear wall 10B, wherein a support member module 3 is disposed in the vicinity of the pair of side walls 10L near the opening 12, and the pair of side walls 10L and the rear wall 10B are disposed. An inflatable support module 200 is disposed adjacent to each other. The aforementioned support module module 3 can be in the form of a conventional support member, which is not limited herein. [0015] The cleaners are shown in FIGS. 8A and 8B, which are schematic views of an embodiment of an inflatable support module of the present invention. First, as shown in FIG. 8A, the inflatable support module 200 of the present invention mainly includes a main body 099134683, a form number A0101, a 9th page, a total of 30 pages 0992060572-0 201215549 200B, and two available extensions from the main body 200B. To support a portion of the wafer, wherein the first portion is composed of a plurality of vertically spaced support ribs 201, and the second portion is composed of a plurality of vertically spaced restriction members 202, and at the support ribs 201 An air outlet passage 208b is disposed between the spacers 202, and a long slit 203a is disposed on one side of the air outlet passage 208b. By the design of the air passage 208b and the long slit 203a, the gas can be made of a long slit 203a. The inside of the casing 10 is inflated; in addition, a plurality of wafers can be supported together by a plurality of supporting ribs 201 and a plurality of limiting members 202 and a plurality of supporting members 300 on the pair of side walls 10L. The inflatable support member module 200 of the present invention is an integrally formed structure and can be formed by injection molding. [0016] Next, referring to FIG. 8A, FIG. 8B and FIG. 9A, a buffer plenum 206 is disposed inside the main body 200B, and the height thereof can be the same as that of the main body 200B (as shown in FIG. 9A). Alternatively, the height of the buffer plenum 206 may be half of the entire body 200B (as shown in FIG. 8A). Referring to FIGS. 8A and 9A, an air inlet 207 is disposed at one end of the buffer chamber 206, which may further be connected to a valve or intake valve 401 of the bottom surface 10B of the casing 10 (shown in FIG. 10). )connection. Regardless of whether the height of the buffer plenum 206 is about the same as that of the main body 200B (as shown in FIG. 9A), or half of the entire main body 200B (as shown in FIG. 8A), the buffer plenum 206 has one end of the intake port 207. An air flow channel 208a is disposed, and when the height of the buffer gas chamber 206 is about the same as that of the main body 200B (as shown in FIG. 9A), an air flow channel 208a may be further disposed at opposite ends of the buffer gas chamber 206. Since the air flow passage 208a is disposed between the air outlet passage 208b and the buffer air chamber 099134683, Form No. A0101, Page 10/30 pages 0992060572-0 201215549 ❹ Ο 206, the buffer air chamber 206 can be ventilated by the air flow passage 208a. The passages 208b are in communication with each other. Therefore, when the air valve or the intake valve 401 of the bottom surface 10B of the casing 10 is connected to an inflator (not shown), the gas can enter the buffer air chamber 206 via the air inlet 207 when entering the buffer air chamber 206. When the gas reaches the saturated state, since the air inlet 207 is in contact with and closed by the gas valve or the intake valve 401 end, the gas in the buffer gas chamber 206 can only enter the air outlet passage 208b via the air flow passage 208a, and then the air outlet passage 208b. The upper slit 203a is ejected; in particular, since the diameter of the slit 203a is very small with respect to the air flow passage 208a, the width of the slit is about 0.01 mm to 5 min, so that the gas is filled into the buffer chamber 206. When refilling the air outlet passage 208b via the air flow passage 208a, most of the gas first enters the air flow passage 208a communicating with the air outlet passage 208b. When the air flow passage 208a is again filled with the gas, it finally flows into the air outlet passage 208b and is long. The slit 203a ejects gas; therefore, by the design of the slit 203a of the present invention, the gas system from the slit 203a is similar to the air knife, and the difference in gas pressure gradients ejected at both ends of the slit 203a If the gas ejected from the slit 203a has a certain pressure, a gas flow field can be formed between each of the support ribs 201 and each of the restricting members 202, so that it can be distributed on the support ribs 201 and The particles between the restriction members 202 and in the vicinity of the wafer are brought to the direction of the opening 12 by the flow field of the gas to prevent the particles from contaminating the wafer. [0017] In addition, in the embodiment of the present invention, the diameter of the slit 203a may also be gradually reduced or enlarged from bottom to top (ie, from the first wafer to the twenty-fifth wafer), please refer to FIG. 9A. A schematic diagram of the embodiment in which the diameter of the long slit 203a gradually increases from bottom to top. At one end of the air inlet 207, the long slit 203a is 099134683. Form No. A0101 Page 11/Total 30 Page 0992060572-0 201215549 Small 'and extending toward the opposite end of the air inlet 207, the diameter of the long slit 203a gradually becomes larger, and then refer to Fig. 98, which is a schematic diagram of the embodiment in which the diameter of the long slit is gradually reduced from bottom to top. Near one end of the air inlet 207, the long slit 20 3a has a larger diameter 'and extends toward the opposite end of the air inlet 2 0 7 , and the diameter of the long slit 2 〇 3 a gradually becomes smaller. Under the premise of physical phenomena, the design of the long slit 2〇ga from the first wafer to the 25th wafer will be better than the design from the first wafer to the 25th wafer, so that The pressure of the gas ejected is relatively uniform. Similarly, the long slit 2〇3a may be in the form of a long strip as shown in FIG. 8A, or a plurality of partitions 204 may be vertically spaced apart in the slit 2〇33 to form a plurality of air outlets 205, such as FIG. 9C shows a plurality of transverse slits 2〇3b extending longitudinally on the slit 203a, and a spacing between the transverse slits 203b. The present invention does not limit whether the distance between the spacings is the same. The transverse slits 2〇3b may be formed by longitudinally extending to the left and right sides, respectively, centering on the long slits 203a. As shown in FIG. 9D, the longitudinal slits may be extended only to the left or right. As shown in Figures 9E and 9F, the operation of the inflatable support module is the same as that of Figures 8A and (10), as shown in Figures 9A to 9F. The difference is only long. The design of the slit 2〇3a is different, so it will not be repeated. Further, the gas ejected by the slit 2〇3a may be a combination of an inert gas, dry cold air, nitrogen or the like. [0018] In the above embodiments of FIGS. 8A to 8B and 9A to 9F, at least another gas valve or gas may be disposed in the vicinity of the bottom surface 1B of the casing 1〇 near the opening 12. The valve (not shown in Fig. 1), when the inflator is inflated to the casing 10, allows the gas inside the casing 1 to be opened. 099134683 Form No. A0101 Page 12/Total 30 Page 0992060572-0 201215549 The gas valve or the outlet valve near the port 12 flows out, in addition to removing the particles inside the casing 1 and shortening the time required to fill the casing 10. Of course, the casing 1 of the present invention may also include two pairs of intake valves and outlet valves different from those described above to meet the standards of the front opening wafer cassette. Qing] Please refer to the figure again for an enlarged schematic view of the inflatable support module of the present invention. The inflatable support module 2 is composed of a plurality of support ribs 2〇1, wherein each support rib 201 is similar to a platform structure, and the support rib 201 can be a wear-resistant consumable, a thermoplastic material, and a high Molecular material Ge 0 elastic material and other materials, therefore, when the wafer is supported on the support rib 201 or platform, 'can avoid the production of particles due to friction. Of course, as shown in FIG. 1, the supporting rib 201 may include a supporting round head 2〇9, so that the supporting rib 201 contacts the wafer by the supporting round head 2〇9 to reduce the area in contact with the wafer. , can further reduce the generation of particles. Of course, the support ribs 201 can be arranged such that only the support round head 2〇9 is a wear resistant material, and other places that are not in contact with the wafer are not for the wear material, so as to reduce the cost of production. The plurality of restriction members 202 of the inflatable support module 2 are adjacent to or suspended in the rear wall 1〇Β, as shown in the front view (as shown in FIG. 12), so that the support can be restricted to the support ribs 2〇1. Or the support ribs 2〇1 support the wafer on the round head 209 to move in the direction of the back wall 1〇3 to prevent the wafer from striking the back wall 10'. The restricting member 202 may be a flat plate made of a cushioning material or a wear resistant material, or a shallow groove structure formed of the above materials to accommodate the wafer into the shallow groove structure. In addition, the inner surface of the front opening wafer box further includes at least a restriction module (not shown) for limiting the movement of the wafer in the direction of the opening Μ. 099134683 Form No. 101 0101 Page 13 / Total 30 Page 0992060572-0 201215549 [0020] 099134683 The aforementioned inflatable support module 200 includes a main body 2_, a plurality of vertically spaced support ribs 201, and a plurality of vertically spaced arrangement The restriction member 202 and a slit 203a can be formed into a body-formed structure to reduce the cost of production. Of course, the inflatable support module 2 can be assembled from each other. As shown in FIGS. 13A and 13B, the two sides of the main body 200B of the inflatable support module 2〇〇 are A plurality of vertically spaced receptacles 210 are provided to allow a plurality of support ribs 2〇1 to be inserted and assembled and secured to the body 200B to form a plurality of spaced apart support ribs 201. Since the support ribs 201 are fixed to the main body 2 00B in an assembled manner, each of the sill ribs 2 〇 1 has a fixed base Hi which can be fitted to the main body 200 of the support module 200. Each of the supporting ribs 201 may also have a circular hole 212 for inserting and fixing an originally separated supporting round head 209 to the supporting rib 201, so that the supporting rib 2〇1 can utilize the supporting round head 209. Contact with the wafer. The support head 209 can be made of a wear-resistant consumable, a thermoplastic material, a polymer material or an elastic material, and other places that are not in contact with the wafer are not wear-resistant materials, so as to reduce the cost of production. In addition, the inflatable support module 200 of the open wafer cassette of the present invention may be composed of only one main body 2〇〇Β, a plurality of vertically spaced support ribs 2〇1 and one long slit 2〇3a. Such a structure can also support the wafer and exclude particles in the vicinity of the wafer. In addition, a plurality of air outlet holes (not shown) may be formed between the plurality of vertically spaced support ribs 2〇1, so that the inflatable support module 200 can emit gas by using the long slit 203a. The plurality of vents can also be used to carry particles away from the wafer. Of course, the inflatable support module 20 0 can also be a main body 2〇〇B, a row of a plurality of vertically spaced support ribs 2 01, and another row of a plurality of vertically spaced support ribs 0992060572 - form number A0101 is composed of a total of slabs 203a and a long slit 203a, and the present invention is not limited thereto. In addition, the front opening of the wafer cassette of the present invention may be a door body as in the prior art, and a recessed area is disposed on the inner surface of the door, and at least one latch structure is disposed between the outer surface of the door and the inner surface to make the crystal The round box works smoothly. [0020] [0023] [0024] [0025] [0030] [0030] [0030] [0030] [0030] Although the present invention is disclosed above in the preferred embodiment, it is not used In order to limit the invention, it is intended that the invention may be modified and modified without departing from the spirit and scope of the invention. Subject to it. [Simple description of the drawings] Fig. 1 is a schematic diagram of a conventional open wafer cassette. Fig. 2 is a schematic view of the door of the open wafer cassette before the conventional method. Figure 3 is a schematic cross-sectional view of a conventional support module. Figure 4 is a schematic illustration of a conventional inflatable support module. Figure 5 is a perspective view of a box of a front opening wafer cassette of the present invention. Figure 6 is a schematic illustration of a front open wafer cassette of the present invention in which the cartridge retains only the inflatable support module. Figure 7 is a schematic view showing a casing of a front opening wafer cassette of the present invention. 8A and 8B are schematic views of an inflatable support module of a front opening wafer cassette of the present invention. Fig. 9 to Fig. 9F are schematic views showing an embodiment of a slit of an inflatable support module of a front open type wafer cassette of the present invention. Form No. A0101 Page 15 of 30 0992060572-0 201215549 [0031] Figure 10 is a schematic view of a front open wafer cassette of the present invention with no inflatable support module installed. [0032] Figure 11 is an enlarged schematic view of an inflatable support module of a front open wafer cassette of the present invention. [0033] Figure 12 is a partial schematic view of a front open wafer cassette of the present invention with an inflatable support module. [0034] Figures 1 3A and 1 3B illustrate another design of an inflatable support module of a front open wafer cassette of the present invention. [Main component symbol description] [0035] 10 box [0036] 10L side wall [0037] 10T top surface [0038] 10B bottom surface [0039] 10B' rear wall [0040] 100 wafer limiter [0041] 110 wafer Contact Head [0042] 11 Slot [0043] 12 Opening [0044] 20 Door [0045] 21 Outer Surface [0046] 221 Top Form No. A0101 099134683 Page 16 of 30 0992060572-0 201215549 Ο ❹ [0047] 222 Bottom [0048] 22 Inner surface [0049] 23 Latch opening [0050] 230 Latch mechanism [0051] 2 4 recessed area [0052] 200 Inflatable support module [0053] 200B Main body [0054] 201 Support Rib [0055] 202 Restriction [0056] 203a Long slit [0057] 203b Transverse seam [0058] 204 Separator [0059] 205 Air outlet [0060] 206 Buffer chamber [0061] 207 Air inlet [0062] 208a Air flow Channel [0063] 208b | Air outlet [0064] 209 Support round head [0065] 210 Jack 099134683 Form number Α 0101 Page 17 / Total 30 page 0992060572-0 201215549 [0066] 211 Fixed base [0067] 212 Circular hole 300 support member module [0069] 401 intake valve [0070] 500 support member [0071] 501 tree S 600 hollow body [0073] 601 support [0074] 602 upper surface [0075] 603 side surface 099134683 Form number A0101 page 18 of 30 0992060572-0