TW201009986A - A wafer container with at least one supporting module having a long slot - Google Patents

A wafer container with at least one supporting module having a long slot Download PDF

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Publication number
TW201009986A
TW201009986A TW097132635A TW97132635A TW201009986A TW 201009986 A TW201009986 A TW 201009986A TW 097132635 A TW097132635 A TW 097132635A TW 97132635 A TW97132635 A TW 97132635A TW 201009986 A TW201009986 A TW 201009986A
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TW
Taiwan
Prior art keywords
wafer cassette
open wafer
support
inflatable
module
Prior art date
Application number
TW097132635A
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Chinese (zh)
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TWI371076B (en
Inventor
Ming-Long Chiu
Kuo-Chun Hung
Original Assignee
Gudeng Prec Industral Co Ltd
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Application filed by Gudeng Prec Industral Co Ltd filed Critical Gudeng Prec Industral Co Ltd
Priority to TW097132635A priority Critical patent/TWI371076B/en
Priority to US12/202,389 priority patent/US8047379B2/en
Publication of TW201009986A publication Critical patent/TW201009986A/en
Priority to US12/952,528 priority patent/US8413814B2/en
Priority to US13/034,477 priority patent/US8413815B2/en
Priority to US13/183,522 priority patent/US8387799B2/en
Application granted granted Critical
Publication of TWI371076B publication Critical patent/TWI371076B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A wafer container includes a container body that having an opening portion, a back wall opposing the open portion, and two pairs of side walls, and storing a plurality of wafers between the side walls; and a door having an inner surface and an outer surface, in which the inner surface of the door is joined with the opening portion of the container body for protecting the plurality of wafers therein, the characteristic in that: a supporting module is disposed between the each side wall and the back wall to support the wafers inside the container body; wherein the supporting module has a long slot configured to direct a flow of purge gas.

Description

201009986 - 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種前開式晶圓盒，特別是有關於一種於前開式晶 圓盒中配置有可充氣之支撐件，使得氣體可以在前開式晶圓盒中形成 一氣體流場（Gas flow)。 【先前技術】 半導體晶圓由於需經過各種不同流程的處理且需配合製程設 φ備，因此會被搬運到不同的工作站。為了方便晶圓的搬運且避免受到 外界的污染，常會利用一密封容器以供自動化設備輸送。請參考第1 圖所示，係習知技術之晶圓盒示意圖。此晶圓盒是一種前開式晶圓盒 (Front Opening Unified Pod, FOUP)，係具有一盒體 10 及一門體 20， 盒體10係由一對側壁10L及相鄰該對側壁10L之一頂面10T及一底 面10B所組成，並於一側邊形成一開口 12，而相對開口 12之另一侧 邊形成一後壁（未顯示於圖中），其中在這對側壁10L上係各設有複數 個插槽11以水平容置複數個晶圓，而門體20具有一個外表面21及 一個内表面22，門體20係藉由内表面22與盒體10的開口 12相結 ® 合，用以保護盒體10内部的複數個晶圓。此外，在門體20的外表面 21上配置至少一個門閂開孔23，用以開啟或是封閉前開式晶圓盒。 在上述前開式晶圓盒中，由於半導體晶圓係水平地置於盒體10内 部，因此，在前開式晶圓盒搬運過程中需有一晶圓限制件，以避免晶 圓因震動而產生異位或往盒體10的開口 12方向移動。 請參考第2圖所示，係一美國公告專利6,736,268所揭露之一種 前開式晶圓盒之門體20結構示意圖。如第2圖所示，門體20之内侧 面22配置有一凹陷區域24,此凹陷區域24係從内側面22的頂端221 延伸到底端222且係在左右二個鎖存機構230(於門體内部）之間，而 5 201009986 -在凹陷區域24中再進一步 組係由左右二個晶圓限制件限制件模組，此晶圓限制件棋 上係具有複數個晶圓接觸頭110 而在母一個晶圓限制件100 對的晶圓，避免晶圓在傳送過程中因雷:此晶圓接觸頭110頂持其相 移動。 震動而異位或往盒體之開口方向 上述盒體10兩側壁1〇L上 ❹ 限制件模組分别係用來支撺及二及門體20内表面22的晶圓 支樓件及限制件都容易在晶圓 ^ ^内部的複數個晶圓，·這些 微粒(―的產生。當晶;程中與晶圓產生摩擦，造成 粒可能會㈣在晶圓表面或⑭γΓ' 有微粒出現時，微 下降。因此，在晶圓盒其支標^曰圓’^成後續的晶片產生其良率的 耐磨特性的材質，以避免支 限制件的設計上，係可以使用-具 教。如第3圖所示，係美國 ^件與晶圓接觸時產生太多的微 ❹ 於晶圓盒兩側壁之支律件“面2:。283774所揭露之一種置 個垂直間隔排列的支撐件不意圖°此支推件模組係由複數 著一層樹醋501，這層樹§在且成，而在支撐件5〇0的表面係包覆 _和晶圓摩擦產生微粒曰势有較低的摩擦特性以避免支揮件 面，當晶圓支撲_旨_5〇1係具有一斜 當晶圓的尺+把、其僅i支撐到晶圓的邊緣附近；因此， 外火播、、，容易使晶圓下垂或下沉，除使晶圓容易有裂痕 外，當機器手臂在輸出晶圓時，亦容易產生破片或破壞晶圓易有裂痕 赤限!i外也有些設計係在晶圓盒的内部，例如：晶圓與上述支樓件 生的微粒帶離晶圓。如第= 或 則可將摩擦產 第4圖所不，係一美國公告專利US6,899，145 之-種可置於晶圓盒内部之可充氣支撐件模組之示意圖。此充 =人擇件模組係包括-中空主體_，中空主體_係固定於晶圓盒 讀的側壁並向盒趙的内部延伸有複數個垂直的支撐件6〇ι，以利 6 201009986 用支樓件的上表面602支撑盒體内部的複數個晶圓。而在支播件的側 表面6〇3係-橫條狀的開口，可將中空域δ〇〇内部的氣體由此橫條 狀開口嘴出，以避免因摩擦產生的微粒形成於晶 面。上述結構， 由於橫條狀開口置於支撐件601的侧面6〇3，^易造成支撐力道不足 進而使晶圓發生異位或重疊，造成晶圓更嚴外，當晶圓 其上表面6〇2時，晶圓與切件601之間的接觸面 積係相當的大’這使微粒更容易產生H 度 與晶圓相當，因此，可能造成氣流微弱或是：= ❹ ❹ 來提供較大的氣流量，方能形成有效的氣體流場：二晶圓 盒的^係f要-種設計_全的可充氣切件亀 微粒產生及形成於晶圓表面。 男 【發明内容】 依據先前技術之晶圓盒其盒體内部之可 成晶圓，不足、接觸面積過大及容易產生微粒撑等=㈣ 於提供-種具有可充氣支擇件模組之前開式晶圓 益，可充1讀件模組係配置於盒體㈣及後壁之間且模组係具有至 長縫’長縫係可喷出氣體用以控制前開式晶圓 本發明之-另主要目的:::=、二或_種類等。 -μ -V a m ^ 、杈供種具有可充氣支撐件模組之 别開式曰曰圓盒，可充氣支撐件模組係具有至少一個面向 縫’長缝可噴出氣體並形成—氣體流場，可將 、 避免微粒形纽晶圓上方。 ㈣粒帶走’以 本發明之再-主要目的在於提供一種具有可充氣 前=式晶圓盒，此支撐件模組係具有複數㈣直間 撐件^ 支撐肋，且支撐件或支撐肋上有-•的支撲圓頭，支樓或 可利用此耐細支撐8頭舆“接觸’除了可減少跟晶圓接 7 201009986 " 外，亦能避免與晶圓摩擦時產生微粒。 义本，明之還有-主要目的在於提供—種具有可充氣讀 之則開式㈣盒，可充氣支射独係配置於盒體側 且 排複數個垂直間隔排列的支揮件或支撐肋 ==Γ限制件，此複數個支擇件係靠近盒趙的侧壁而複 數個限制件貝J係靠近盒體的後壁，因此， 支樓曰II外，也能避免晶圓往後壁的方向移動，以減少微粒=生了。可 前門H之主要目的在於提供—種具有可充氣支撐件模組之 ❻二可充氣支撐件模組上的每一支揮肋前端可以配置-==之背面接觸;因此可藉由支撐肋的長度使得較大 ==到較佳的支撐而不會產生下垂或下沉故可以增加晶圓製 a . ahiem-pn 底面所組成，並於一側邊形成一開 去擔杜磁έ开《另—側邊形成—後壁’同時於該對側壁上配置一對 表® 以容置複數個晶圓；以及一門體，具有-外表面及-内 ❹福數個曰圓，、Γ内ί面與盒體之開口相結合，並用以保護盒體内部之 柏郝二士 、中别開式晶圓盒之特徵在於：盒體之該對側壁與後壁 纟配置一可充氣支撲件模組，可充氣支擇件模組之面對 二/上配f有一長缝且於可充氣支撐件模組之一端配置一進氣 排刻沾氧間連接，其中可充氣支撐件模組係由複數個垂直間隔 势袖击*牙肋所组成。此外，可充氣支撐件模組亦可以進—步包含複 間隔排列的限制件，以限制晶圓往盒艘後壁的方向移動。 【實施方式】 1日為H發明所運用之技術内容、發明目的及其達成之功效有更 '的揭露’茲於下詳細說明之並請一併參閱所揭之圖示及 8 201009986 - 圖號. 首先，請參閱第5圖及第6圖，係本發明之一種前開式晶圓盒其 ，體=透視圖以及其盒體僅保留可充氣支撐件模組之示意圖》前開式 曰曰圓益其盒體1〇係由一對侧壁1〇L及相鄰此對側壁l〇L之一頂面ι〇τ 及底面10Β所組成，並於一侧邊形成一開口 12，而相對開口 12之 另側邊形成一後壁10Β’，其中在這對側壁1〇ί接近開口 12的附近 配置有對支揮件模組300,而在這對側壁1〇L與後壁1〇B，相鄰的地 =係各配置有—可充氣支撲件模組細。此支樓件模組_係可以係 ❹ 知支撑件的形式，並不加以限制。 撐株2著參考第7A圖及第7B圖所示，係本發明之一種可充氣支 之正視圖及下視圖。首先，如第7A圖所示，本發明之可充 主要係、包括—主體2_及由主體2麵延伸出去 的兩個部分，其中，第一個邱八 201 ^ ^刀係由複數個垂直間隔排列的支撐肋 ^ , 0 . _ L 银歎個垂直間隔排列的限制件203所組 成，且在這些支撐肋201與這此 2〇5 β 一制件203的間隔之間係設有一長縫 此外，請參考第7Β圖，在上述的 β管，中空導管的-端係形成—進氣體2GGB内部係有一中空導 10B之-氣閥或進氣閥4G1(請參考第’可進—步與盒趙1〇底面 上述長縫205相通，因此，當盒體圖）連接；且，中空導管係跟 連接-充氣裝置（未顯示於圖中）時，^面咖的氣閥或進氣閥401 管並由長縫205喷出。由於此長縫2〇5=可經线氣口 207及中空導 係類似風刀，係具有一足夠的壓力，可、〇徑相當的小，喷出的氣體 上的晶圓其附近的微粒帶往開口'，支撐於支撐肋201及限制件 染晶圓。此外，長縫205其口徑亦可以2的方向，以避免這些微粒汙 出的氣體之壓力較為一致。上述長縫係由下到上逐漸變小，使其喷 05的形式可以係長條形，或是 9 201009986 近似S之彎曲形’以改變氣體喷出的方向；而長縫205所喷出的氣體 可以係包括惰性氣體、乾燥冷空氣或氮氣或以上氣體的組合。 當然，亦可在盒體10的底面10B其靠近開口 12的附近配置至少 另一氣閥或出氣閥（未顯示於第8圖中），當充氣裝置在對盒體1〇充氣 時，可允許盒體10内部些微的氣體經開口 12附近的氣閥或出氣閥流 出，除了可以將盒體10内部的微粒帶離外，也縮短充飽盒體1〇所需 的時間。當然，本發明的盒體10亦係可以包含有兩對有別於上述的 進氣閥及出氣閥，以符合前開式晶圓盒的標準。 ❹201009986 - IX. Description of the Invention: [Technical Field] The present invention relates to a front opening type wafer cassette, and more particularly to an inflatable support member disposed in a front opening type wafer cassette, so that gas can be opened in front A gas flow field is formed in the wafer cassette. [Prior Art] Semiconductor wafers are transported to different workstations because they need to be processed by various processes and need to be matched with the process. In order to facilitate the handling of wafers and to avoid contamination from the outside world, a sealed container is often used for automated equipment delivery. Please refer to Figure 1 for a schematic diagram of a known wafer cassette. The wafer cassette is a Front Opening Unified Pod (FOUP) having a box body 10 and a door body 20, and the box body 10 is formed by a pair of side walls 10L and a top side of the pair of side walls 10L. The surface 10T and the bottom surface 10B are formed, and an opening 12 is formed on one side, and a rear wall (not shown) is formed on the other side of the opening 12, wherein the pair of side walls 10L are respectively provided. There are a plurality of slots 11 for accommodating a plurality of wafers horizontally, and the door body 20 has an outer surface 21 and an inner surface 22, and the door body 20 is coupled to the opening 12 of the casing 10 by the inner surface 22 A plurality of wafers for protecting the inside of the casing 10. Further, at least one latch opening 23 is disposed on the outer surface 21 of the door body 20 for opening or closing the front opening wafer cassette. In the above-mentioned front-opening wafer cassette, since the semiconductor wafer is horizontally placed inside the casing 10, a wafer restriction member is required during the front opening wafer cassette transportation process to prevent the wafer from being different due to vibration. The position moves toward the opening 12 of the casing 10. Please refer to FIG. 2, which is a schematic structural view of a door body 20 of a front opening wafer cassette disclosed in US Pat. No. 6,736,268. As shown in FIG. 2, the inner side surface 22 of the door body 20 is provided with a recessed area 24 extending from the top end 221 of the inner side surface 22 to the bottom end 222 and attached to the left and right latching mechanisms 230 (in the door body) Between the internal) and 5 201009986 - further in the recessed area 24 is a combination of two wafer restriction members, the wafer restriction member having a plurality of wafer contacts 110 and A wafer limiter 100 pairs of wafers prevents the wafer from being bumped during transport: the wafer contact head 110 is held in its phase. Vibrating and eccentric or toward the opening of the casing, the two side walls of the casing 10 are disposed on the upper side of the casing 10, and the limiting member modules are respectively used for supporting the wafer supporting members and the limiting members of the inner surface 22 of the door body 20 It is easy to have multiple wafers inside the wafer ^··················································································· Therefore, in the wafer cassette, the support of the wafer is a material that produces a yield-resistant wear characteristic of the subsequent wafer, so as to avoid the design of the support member, the system can be used. As shown in Fig. 3, it is not the intention to produce a vertically spaced support member when the contact between the US and the wafer is too much micro-small on the two side walls of the wafer cassette. ° This support module consists of a layer of tree vinegar 501, this layer of § is in the same, and the surface of the support 5 〇 0 is covered _ and the wafer friction produces particles and has a lower friction The feature is to avoid the support surface, when the wafer is smashed, the _5〇1 system has a slanting wafer, the ruler + handle, and only i Near the edge of the wafer; therefore, the external fire, it is easy to make the wafer sagging or sinking, in addition to making the wafer easy to crack, when the robot arm is output wafer, it is easy to produce fragments or damage the wafer It is easy to have cracks and red limit! Some designs are also inside the wafer cassette. For example, the wafers and the particles of the above-mentioned branch buildings are carried away from the wafer. If the = or the friction can be produced in Figure 4 A schematic diagram of an inflatable support module that can be placed inside a wafer cassette, which is a hollow body _, a hollow body _ system, is disclosed in US Pat. No. 6,899,145. Fixed to the side wall of the wafer cassette reading and extending to the inside of the box Zhao with a plurality of vertical support members 6〇, to facilitate the use of the upper surface 602 of the support member to support a plurality of wafers inside the casing. The side surface of the supporting member is 6〇3-bar-shaped opening, and the gas inside the hollow domain δ〇〇 can be opened by the horizontal strip opening to prevent the particles generated by the friction from being formed on the crystal plane. , because the horizontal strip opening is placed on the side of the support member 601 6 〇 3, ^ easy to cause supporting force Insufficiently, the wafer is ectopic or overlapped, resulting in a more severe wafer. When the upper surface of the wafer is 6〇2, the contact area between the wafer and the cutting member 601 is relatively large, which makes the particles easier. The H degree is equivalent to the wafer, so it may cause a weak airflow or := ❹ ❹ to provide a large gas flow to form an effective gas flow field: the two wafer cassettes are required to be designed. The entire inflatable cutting piece 亀 particles are generated and formed on the surface of the wafer. [Inventive content] According to the prior art wafer cassette, the inside of the cassette can be wafer-formed, insufficient, contact area is too large, and it is easy to generate micro-pillars, etc. (4) In the case of providing an open-type wafer with an inflatable support module, the rechargeable 1-read module is disposed between the casing (four) and the rear wall and the module has a long-slit 'long slit system The gas can be ejected for controlling the front opening wafer of the present invention - another main purpose::: =, two or _ type, and the like. -μ -V am ^, 杈 别 别 别 别 别 杈 杈 杈 杈 杈 杈 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可Can avoid and avoid the top of the particle shaped wafer. (4) Removal of the particles - in addition to the present invention - the main object is to provide an inflatable front-type wafer cassette having a plurality of (four) straight spacers, support ribs, and support members or support ribs There is a •·············································································· And there is also the main purpose of providing - an open type (four) box with inflatable reading, the inflatable branch is arranged on the side of the box and arranged in a plurality of vertically spaced support members or support ribs ==Γ The limiting member, the plurality of supporting members are close to the side wall of the box Zhao and the plurality of limiting members are close to the rear wall of the box body, so that the movement of the wafer to the rear wall can be avoided even outside the branch 曰 II To reduce the amount of particles = raw. The main purpose of the front door H is to provide a front side of each ribbed rib on the second inflatable support module with an inflatable support module can be configured -== back contact Therefore, the length of the support rib can be made larger == to the better branch Without sagging or sinking, it is possible to increase the wafer a. Ahiem-pn is composed of the bottom surface, and forms an opening on one side to open the "other side forming - back wall" while A pair of meters is arranged on the side wall to accommodate a plurality of wafers; and a door body has an outer surface and a plurality of inner circumferences, and the inner surface of the inner surface is combined with the opening of the box body to protect The inside of the box is characterized in that: the pair of side walls and the rear wall of the box body are provided with an inflatable member, and the inflatable member module faces The second/upper f has a long slit and is disposed at one end of the inflatable support module with an air intake engraved oxygen connection, wherein the inflatable support module is composed of a plurality of vertical spacer sleeves* ribs In addition, the inflatable support module can further include a plurality of spaced-apart restriction members to limit the movement of the wafer toward the rear wall of the box. [Embodiment] The technical content of the invention is used on the 1st. The purpose of the invention and the effect achieved by it have a more 'exposure' and are explained in detail below. Please refer to the illustrated diagram and 8 201009986 - figure number. First, please refer to FIG. 5 and FIG. 6 , which is a front open type wafer cassette of the present invention, the body = perspective view and the box body only retains inflatable The front part of the support module is composed of a pair of side walls 1〇L and a top surface ι〇τ and a bottom surface 10Β of the pair of side walls l〇L, and An opening 12 is formed on one side, and a rear wall 10Β' is formed on the other side of the opening 12, wherein the pair of side walls 1 is disposed near the opening 12, and the pair of support modules 300 are disposed. For the side wall 1〇L and the rear wall 1〇B, the adjacent ground=systems are respectively arranged with an inflatable inflatable member module. The support member module _ can be in the form of a known support member, and is not Limit it. Fig. 7 is a front view and a bottom view of an inflatable branch of the present invention, as shown in Figs. 7A and 7B. First, as shown in FIG. 7A, the main body of the present invention includes a main body 2_ and two parts extending from the main body 2, wherein the first Qiu 8 201 ^ ^ knife system is composed of a plurality of vertical lines. The spaced-apart support ribs ^ , 0 . _ L are composed of a vertically spaced-apart restriction member 203, and a long slit is formed between the support ribs 201 and the interval of the 2 〇 5 β-piece 203. In addition, please refer to the figure 7 in the above-mentioned β tube, the end of the hollow tube is formed - the inside of the gas 2GGB is equipped with a hollow guide 10B - the air valve or the intake valve 4G1 (please refer to the section 'accessible step and The bottom surface of the box Zhao 1〇 is connected to the long slit 205, and therefore, when the box is connected); and the hollow duct is connected with the inflator (not shown), the air valve or the intake valve 401 of the face coffee The tube is ejected by the slit 205. Since the long slit 2〇5=the warp port 207 and the hollow guide are similar to the air knife, the pressure is sufficient, and the diameter of the wafer is relatively small, and the particles on the discharged gas are brought to the vicinity of the wafer. The opening 'supports the support rib 201 and the limiting member to dye the wafer. In addition, the slit 205 may have a diameter of 2 in order to prevent the pressure of the gas contaminated by the particles from being relatively uniform. The long slit system is gradually reduced from bottom to top, so that the form of the spray 05 can be elongated, or 9 201009986 approximates the curved shape of S to change the direction in which the gas is ejected; and the gas ejected by the long slit 205 It may be a combination of an inert gas, dry cold air or nitrogen or a gas of the above. Of course, at least another gas valve or an outlet valve (not shown in FIG. 8) may be disposed in the vicinity of the opening 12 of the bottom surface 10B of the casing 10. When the inflator is inflated to the casing 1 , the casing may be allowed. A small amount of gas inside the body 10 flows out through the gas valve or the outlet valve near the opening 12, except that the particles inside the casing 10 can be taken away, and the time required to fill the casing 1 is also shortened. Of course, the casing 10 of the present invention may also include two pairs of intake and exhaust valves different from those described above to meet the standards of the front open wafer cassette. ❹

請再參考第9 ®，係本發明之可充氣支撐件模組之放大示意圖。 可充氣支撐件模組200係由複數個支撐肋2〇1所組合而成其中每一 支撐肋20i係類似-平台的結構，支撑肋2〇1可以係一耐磨耗材，例 如.PEEK材質’因此’當晶圓被支撐於支撐肋2〇1或平台上時能 避免因為摩擦而產生微粒。當然，如第9圖所示，支撐肋2gi上係可 以係包含有-支撐圓頭2〇9,使支撐肋2〇1則此支撐圓頭與晶 圓接觸以減少和晶圓接觸的面積’可更進—步地減少微粒的產生。告 ，支撐肋加可安排為僅有此支擇圓頭咖係-对磨耗材，而其二 未跟晶圓接觸的地方都不是耐磨耗材，以降低生產所 ：： 充氣支撐件模組200的複數個限& i 而可 “ 3由於係靠近或懸浮於後壁 二。:上：件203，由緩衝材 千板，亦或係由上特料卿成的淺 π所製烕的 凹槽結構。此外’在前開式晶圓盒的門體内：二進入此淺 一限制件模組（未顯示於圖中），此 φ亦會*纟包含至少 口 12的方向移動。 |模組則係用來限制晶圓往開 前述可充氣支撐件模組200 、L含有一主體2〇〇Β、複數個垂直 201009986 ® 模組200除了能利用長縫205喷出氣體外， -間隔排列的支撐肋201、複數個垂直間隔排列的限制件2〇3及一長縫 205 ’其可以係一體成形的結構，以降低生產的成本。當然，可充氣 支撐件模組200係可以由這些元件互相組裝而成；如第11A圖及第 11B圖所示’可充氣支撐件模組2〇〇的主體20〇b的兩個側面係具有 複數個垂直間隔排列的插孔211，以允許複數個支撐肋2〇1插入並組 裝及固定於主體200B上，以形成複數個間隔排列的支撐肋2〇1。而 由於支撐肋201係以組裝的方式固定於主體2〇〇b上，因此，每一支 撐肋201都具有一固定基座213，可與支撐件模組2〇〇的主體2〇〇b ❹相嵌合。此外，每一個支撐肋201亦可以係具有一圓形孔洞215，可 讓一原本分離的支撐圓頭2〇9塞入並固定於支撐肋2〇1上，使支律肋 201可以利用此支撐圓頭2〇9與晶圓接觸。而此支撐圓頭2〇9可以係 一耐磨耗材，例如：PEEK材質，而其他未跟晶圓接觸的地方都不是耐 磨耗材，以降低生產所需的成本。此外，本發明之前開式晶圓盒其可 充氣支撐件模組200係可以係僅由一主體2〇〇b、複數個垂直間隔排 列的支撐肋201及一長縫205所組成，這樣的結構，同樣可以兼具支 撲晶圓及排除晶圓附近的微粒。此外，亦可在複數個垂直間隔排列的 支樓肋201之間形成複數個出氣孔（未顯示於圖中），使可充氣支撐件 ’也可利用此複數個出氣孔Please refer to Section 9 again for an enlarged schematic view of the inflatable support module of the present invention. The inflatable support module 200 is composed of a plurality of support ribs 2〇1, wherein each support rib 20i is a platform-like structure, and the support ribs 2〇1 can be a wear-resistant consumable, for example, PEEK material. Therefore, particles can be prevented from being generated by friction when the wafer is supported on the support rib 2〇1 or the stage. Of course, as shown in Fig. 9, the support rib 2gi may include a support-supported round head 2〇9 such that the support rib 2〇1 supports the round head to contact the wafer to reduce the area in contact with the wafer. It can further reduce the generation of particles. It can be said that the support ribs can be arranged to be only the ones selected for the round heads-to-wear materials, and the places where the two are not in contact with the wafers are not wear-resistant consumables, so as to reduce the production:: Inflatable support module 200 The multiple limits & i can be "3 because the system is close to or suspended in the back wall 2.: Upper: 203, from the cushioning material, or from the shallow π of the special material. Slot structure. In addition, 'in the door of the front open wafer cassette: two into the shallow one limit module (not shown), this φ will also contain at least the direction of movement of the mouth 12. The method is used to restrict the wafer from opening to the inflatable support module 200, the L comprises a main body 2, and the plurality of vertical 201009986 ® modules 200 are arranged in a space apart from the gas discharged by the long slit 205. The support rib 201, the plurality of vertically spaced restriction members 2〇3 and a long slit 205' may be integrally formed to reduce the cost of production. Of course, the inflatable support module 200 may be mutually Assembled; as shown in Figures 11A and 11B, 'inflatable support The two sides of the main body 20〇b of the group 2 have a plurality of vertically spaced insertion holes 211 to allow a plurality of support ribs 2〇1 to be inserted and assembled and fixed on the main body 200B to form a plurality of spaced arrangements. The supporting ribs 2〇1, and since the supporting ribs 201 are fixed to the main body 2〇〇b in an assembled manner, each supporting rib 201 has a fixing base 213 which can be combined with the supporting member module 2 The main body 2〇〇b is fitted with each other. In addition, each of the supporting ribs 201 may have a circular hole 215 for inserting and fixing the originally separated supporting round head 2〇9 to the supporting rib 2〇1. In the above, the support rib 201 can be contacted with the wafer by the support round head 2〇9, and the support round head 2〇9 can be a wear-resistant consumable, for example, PEEK material, and other places not in contact with the wafer. They are not wear-resistant consumables, so as to reduce the cost required for production. In addition, the inflatable support module 200 of the open wafer cassette of the present invention can be arranged only by a main body 2〇〇b, a plurality of vertical intervals. The support rib 201 and a long slit 205 are formed, and the structure can also be The utility model can also be used for supporting the wafer and eliminating particles in the vicinity of the wafer. In addition, a plurality of air outlet holes (not shown) can be formed between the plurality of vertically spaced branch ribs 201 to make the inflatable support member' Can also use this plurality of vents

閂結構，使晶圓盒能順利運作。The latch structure allows the wafer cassette to operate smoothly.

明，任何熟習相像技藝者， 在不脫離本發明之精神和範圍内，當可作 11 201009986 - 些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之 申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖 係習知一種前開式晶圓盒之示意圖； 第2圖 係習知一種前開式晶圓盒之門體結構示意圖； 第3圖 係習知一種晶圓盒其支撐件模組之剖面示意圖； 第4圖 係習知一種晶圓盒其可充氣支撐件模組之示意圖； 第5圖 係本發明之一種前開式晶圓盒其盒體之透視圖； ® 第6圖 係本發明之一種前開式晶圓盒其盒體僅保留可充氣支撐件 模組之不意圖， 第7A圖係本發明之一種前開式晶圓盒其可充氣支撐件模組之正視 意圖； 第7B圖係本發明之一種前開式晶圓盒其可充氣支撐件模組之下視 圖； 第8圖 係本發明之一種前開式晶圓盒其尚未安裝可充氣支撐件模 組之示意圖； φ 第9圖 係本發明之一種前開式晶圓盒其可充氣支撐件模組之放大 不意圖， 第10圖係本發明之一種前開式晶圓盒其配置有可充氣支撐件模組 之局部示意圖；及 第11A圖及第11B圖係本發明之一種前開式晶圓盒其可充氣支撐 件模組之另一設計。 【主要元件符號說明】 10 盒體 12 201009986It is to be understood that those skilled in the art will be able to make 11 201009986 - a few changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention is defined by the scope of the patent application attached to the present specification. Subject to it. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a front open type wafer cassette; FIG. 2 is a schematic view showing a structure of a front open type wafer cassette; FIG. 3 is a conventional wafer cassette Schematic diagram of a support module; FIG. 4 is a schematic view showing a module of an inflatable support member of the wafer cassette; FIG. 5 is a perspective view of a box of the front open wafer cassette of the present invention; 6 is a front view of a front open wafer cassette of the present invention, wherein the box body only retains the inflatable support module, and FIG. 7A is a front view of the inflatable support module of the front open type wafer cassette of the present invention. 7B is a bottom view of an inflatable support module of a front open type wafer cassette of the present invention; FIG. 8 is a schematic view of a front open type wafer cassette of the present invention, which has not been installed with an inflatable support module; Φ FIG. 9 is an enlarged view of an inflatable support module of a front open type wafer cassette of the present invention, and FIG. 10 is a front open type wafer cassette of the present invention, which is provided with a part of an inflatable support module. Schematic; and Figures 11A and 11B Another design of an inflatable support module of a front opening wafer cassette of the present invention. [Main component symbol description] 10 box 12 201009986

10L 侧壁 10T 頂面 10B 底面 10B? 後壁 11 插槽 12 開口 20 門體 21 外表面 22 内表面 200 可充氣支撐件模組 200B 主體 201 支撐肋 203 限制件 205 長縫 207 進氣口 209 支撐圓頭 211 插孔 213 固定基座 215 圓形孔洞 300 支撐件模組 201009986 401 進氣閥10L side wall 10T top surface 10B bottom surface 10B? rear wall 11 slot 12 opening 20 door body 21 outer surface 22 inner surface 200 inflatable support module 200B main body 201 support rib 203 restricting member 205 long slit 207 air inlet 209 support Round head 211 Jack 213 Fixed base 215 Round hole 300 Support module 201009986 401 Intake valve

Claims (1)

201009986 -十、申請專利範圍： L -種前開式晶圓盒’包括—盒體，係由一對側壁及相鄰該對側壁 口 及底面所組成，並於一侧邊形成一開口，而相對該開 之另一側邊形成一後壁，同時於該對側壁上配置一對支撐件模 組，以容置複數個晶圓；以及一門體，具有一外表面及一内表面: 該門體係以該内表面與該盒體之該開口相結合並用以保護該盒 體内部之該複數個晶圓’其中該前開式晶圓盒之特徵在於： 該盒體之該對側壁與該後壁相鄰之處，各配置一可充氣支撐 ❹ 件模組’該可充氣支撲件模組之面對該開σ方向上8&置有一長縫 且於該可充氣支撐件模組之_端配置_進氣口與該底面之一氣間 連接’其中該可充氣支撐件模組係由複數個垂直間隔排列 肋所組成。 2. 如申請專利範圍第！項所述之前開式晶圓盒，其中該複數個垂直間隔排 列的支撐肋之間進一步配置有出氣孔。 3. 如申請專利範圍第i項所述之前開式晶圓盒，其中該可充氣支撐 件模組之内部包含有—中空導管，該中空導管係與該長缝相通。 4. 如申請專利範圍第i項所述之前開式晶圓盒，其中該盒體之該底面上進一 P 步配置有至少一進氣閥及—出氣閥。 5. 如申請專利範圍第i項所述之前開式晶圓盒，其中該長縫可喷出 體。 、 6. 如申物_第5項所述之前開式晶圓盒，其中魏體係由下列群組中 擇-或組合而成.惰性氣體、乾燥冷空氣及氮氣。 7. 如申請專利範圍第1項所述之前開式晶圓盒，其中該可充氣支撐 件模組係一體成型的結構。 8. 如申請專利範圍第！項所述之前開式晶圓盒，其中該可充氣支撑 件模組係具有複數軸孔，以使該複數個支撐肋以插人級裝的方 式固定於該可充氣支撐件模組上。 15 201009986 - 9.如申請專利範圍第1項所述之前開式晶圓盒，其中該複數個支撐 肋之材質係一耐磨耗材。 10. 如申請專利範圍第1項所述之前開式晶圓盒，其中該複數個支撐 肋之材質係PEEK材質。 11. 如申請專利範圍第1項所述之前開式晶圓盒，其中該複數個支撐 肋之每一支撐肋係具有一支撐圓頭，以利用該支撐圓頭與晶圓接 觸。 12. 如申請專利範圍第1項所述之前開式晶圓盒，其中該複數個支撐 ^ 肋之每一支撐肋係具有一圓形孔洞，以供一支撐圓頭插入組裝。 13. 如申請專利範圍第11或12項所述之前開式晶圓盒，其中該支撐 圓頭之材質係一耐磨耗材。 14. 如申請專利範圍第11或12項所述之前開式晶圓盒，其中該支撐 圓頭之材質係PEEK材質。 15. 如申請專利範圍第1項所述之前開式晶圓盒，其中該門體之該内 表面係進一步設有至少一限制件模組。 16. 如申請專利範圍第1項所述之前開式晶圓盒，其中該門體之該内 表面係進一步具有一凹陷區域。 © 17.如申請專利範圍第1項所述之前開式晶圓盒，其中該門體之該外 表面及該内表面之間配置至少一門閂結構。 18.—種前開式晶圓盒，包括一盒體，係由一對側壁及相鄰該對侧壁 之一頂面及一底面所組成，並於一侧邊形成一開口，而相對該開 口之另一側邊形成一後壁，同時於該對側壁上配置一對支撐件模 組，以容置複數個晶圓；以及一門體，具有一外表面及一内表面， 該門體係以該内表面與該盒體之該開口相結合，並用以保護該盒 體内部之該複數個晶圓，其中該前開式晶圓盒之特徵在於： 該盒體之該對側壁與該後壁相鄰之處，各配置至少一可充氣 201009986 支撲件模組，該 a 面之一氣閥連接，^支撑件模組之—端配置—進氣口並與該底 部份組成j«該第=可充氣續件模組由—第—部份及-第二 可充氣切件模㉖#及該第二部份相鄰處形成—長縫，其中該 直間隔排列的支^該第—部份及該第二部份各配置有複數個垂 19.如申請專利範圍第18項所述之前開式晶圓盒 排列的支撐肋之間進—步配置有出氣孔。 其中該複數個垂直間隔201009986 - X. Patent application scope: L-type front open wafer cassette 'includes-box body, which is composed of a pair of side walls and adjacent pairs of side wall openings and a bottom surface, and forms an opening on one side, and opposite The other side of the opening forms a rear wall, and a pair of support modules are disposed on the pair of side walls to accommodate a plurality of wafers; and a door body having an outer surface and an inner surface: the door system The plurality of wafers are combined with the opening of the casing and for protecting the inside of the casing. The front open wafer cassette is characterized in that: the pair of side walls of the casing are opposite to the rear wall Adjacent to each, an inflatable support member module is disposed. The inflatable member of the inflatable member is disposed in the direction of the opening σ 8& and has a long slit and is disposed at the end of the inflatable support module. An air-to-air connection between the air inlet and the bottom surface, wherein the inflatable support module is composed of a plurality of vertically spaced ribs. 2. If you apply for a patent scope! The prior open wafer cassette, wherein the plurality of vertically spaced row of support ribs are further provided with an air outlet. 3. The open wafer cassette of claim i, wherein the interior of the inflatable support module comprises a hollow conduit, the hollow conduit being in communication with the slit. 4. The open wafer cassette as described in claim i, wherein the bottom surface of the box is provided with at least one intake valve and an air outlet valve. 5. The open wafer cassette as described in claim i, wherein the slit can be ejected. 6. For the open wafer cassette described in the _ _ item 5, the Wei system is selected or combined from the following groups: inert gas, dry cold air and nitrogen. 7. The open wafer cassette of claim 1, wherein the inflatable support module is an integrally formed structure. 8. If you apply for a patent scope! The previously opened wafer cassette, wherein the inflatable support module has a plurality of shaft holes, so that the plurality of support ribs are fixed to the inflatable support module in a plug-in manner. 15 201009986 - 9. The open wafer cassette of claim 1, wherein the material of the plurality of support ribs is a wear resistant material. 10. The open wafer cassette as described in claim 1 wherein the plurality of support ribs are made of PEEK. 11. The prior open wafer cassette of claim 1, wherein each of the plurality of support ribs has a support round head for contacting the wafer with the support round head. 12. The open wafer cassette of claim 1, wherein each of the plurality of support ribs has a circular hole for insertion of a support round insert. 13. The open wafer cassette as described in claim 11 or 12, wherein the material of the support round head is a wear resistant material. 14. The open wafer cassette as described in claim 11 or 12, wherein the material of the support round head is made of PEEK. 15. The open wafer cassette of claim 1, wherein the inner surface of the door body is further provided with at least one restriction module. 16. The open wafer cassette of claim 1, wherein the inner surface of the door further has a recessed area. 17. The prior open wafer cassette of claim 1, wherein at least one latch structure is disposed between the outer surface of the door body and the inner surface. 18. A front open wafer cassette comprising a box body comprising a pair of side walls and a top surface and a bottom surface adjacent to the pair of side walls, and forming an opening on one side opposite to the opening The other side of the other side forms a rear wall, and a pair of support modules are disposed on the pair of side walls to accommodate a plurality of wafers; and a door body having an outer surface and an inner surface, the door system The inner surface is combined with the opening of the casing to protect the plurality of wafers inside the casing, wherein the front opening wafer cassette is characterized in that: the pair of side walls of the casing are adjacent to the rear wall Wherever, each configuration has at least one inflatable 201009986 flapping module, one of the a side of the valve connection, the end of the support module - the air inlet and the bottom part of the composition j« the first = The inflatable continuation module is formed by a first portion and a second inflatable cutting member die 26# and a second portion of the second portion, wherein the first portion is arranged in a straight interval The second part is configured with a plurality of vertical rows. 19. The open wafer cassette row as described in claim 18 of the patent application scope An air outlet is arranged between the support ribs of the column. Where the plurality of vertical intervals 件;㈣第18項所述之前開式晶圓盒，其中該可充氣支擇 内部包含有—中空導管，該中空導管係、與該長縫相通。 21.如申請專利範圍第18項所述之前開式晶圓盒，其中該盒體之該底面上進 一步配置有至少一進氣閥及一出氣閥。 22.如申請專利範圍第丨8項所述之前開式晶圓盒，其中該長縫可喷出一氣 體。 23. 如申請專利範圍第22項所述之前開式晶圓盒，其中該氣體係由下列群組 中擇一或組合而成：惰性氣體、乾燥冷空氣及氮氣。 24. 如申請專利範圍第18項所述之前開式晶圓盒’其中該可充氣支擇 件模組係一體成塑的結構。 參25.如申請專利範圍第18項所述之前開式晶圓盒，其中該可充氣支摟 件模組之該第一部分及該第二部分係各具有複數個插孔，以使該 複數個支撐肋以插入組裝的方式固定於該可充氣支撐件模組上。 26·如申請專利範圍第18項所述之前開式晶圓盒，其中該複數個支撐 肋之材質係一耐磨耗材。 27.如申請專利範圍第18項所述之前開式晶圓盒，其中該複數個支撐 肋之材質係PEEK材質。 28·如申請專利範圍第18項所述之前開式晶圓盒，其中該複數個支撐 肋之每一支撐肋係具有一支撐圓頭，以利用該支撐圓頭與晶圓接 17 201009986 觸0 29. 如申請專利範圍第18項所述之前開式晶圓盒，其中該複數個支撐 肋之每一支撐肋係具有一圓形孔洞，以供一支撐圓頭插入組裝。 30. 如申請專利範圍第28或29項所述之前開式晶圓盒，其中該支撐 圓頭之材質係一耐磨耗材。 31. 如申請專利範圍第28或29項所述之前開式晶圓盒，其中該支撐 圓頭之材質係PEEK材質。 32. 如申請專利範圍第18項所述之前開式晶圓盒，其中該可充氣支撐 ^ 件模組之該第二部份係懸浮於該後壁之前。 33. 如申請專利範圍第18項所述之前開式晶圓盒，其中該門體之該内 表面係進一步設有至少一限制件模組。 34. 如申請專利範圍第18項所述之前開式晶圓盒，其中該門體之該内 表面係進一步具有一凹陷區域。 35. 如申請專利範圍第18項所述之前開式晶圓盒，其中該門體之該外 表面及該内表面之間配置至少一門閂結構。 36. —種前開式晶圓盒，包括一盒體，係由一對侧壁及相鄰該對侧壁 之一頂面及一底面所組成，並於一側邊形成一開口，而相對該開 © 口之另一侧邊形成一後壁，同時於該對側壁上配置一對支撐件模 組，以容置複數個晶圓；以及一門體，具有一外表面及一内表面， 該門體係以該内表面與該盒體之該開口相結合，並用以保護該盒 體内部之該複數個晶圓，其中該前開式晶圓盒之特徵在於： 該盒體之該對側壁與該後壁相鄰之處，各配置至少一可充氣 支撐件模組，該可充氣支撐件模組之一端配置一進氣口並與該底 面之一氣閥連接，而該可充氣支撐件模組由一第一部份及一第二 部份組成且該第一部份及該第二部份相鄰處形成一長縫，其中該 可充氣支撐件模組之該第一部份係配置有複數個垂直間隔排列的 201009986 支撐肋，而該第二部份係配置有複數個垂直間隔排列的限制件。 37. 如申請專利範圍第36項所述之前開式晶圓盒，其中該複數個垂直間隔 排列的支撐肋之間進一步配置有出氣孔。 ° 38. 如申請專利範圍第36項所述之前開式晶圓盒，其中該可充氣支撐 件模組之内部包含有一中空導管，該中空導管係與該長縫相通。 39. 如申請專利範圍第36項所述之前開式晶圓盒，其中該盒體之該底面上進 一步配置有至少一進氣閥及一出氣閥。 40. 如申請專利範圍第36項所述之前開式晶圓盒，其中該長縫可噴出—产 體。 氧 礼如申請專利範圍第40項所述之前開式晶圓盒’其中該氣體係由下列群組 中擇一或組合而成：惰性氣體、乾燥冷空氣及氮氣。 42. 如申請專利範圍第36項所述之前開式晶圓盒，其中該可充氣支擇 件模組係一體成塑的結構。 43. 如申請專利範圍第36項所述之前開式晶圓盒，其中該可充氣支撐 件模組之該第一部分係具有複數個插孔，以使該複數個支撐肋以 插入組裝的方式固定於該可充氣支撐件模組上。 44. 如申請專利範圍第36項所述之前開式晶圓盒，其中該複數個支撐 肋之材質係一耐磨耗材。 45. 如申請專利範圍第36項所述之前開式晶圓盒，其中該複數個支樓 肋之材質係PEEK材質。 46. 如申請專利範圍第36項所述之前開式晶圓盒，其中該複數個支律 肋之母一支撐肋係具有一支撑圓頭，以利用該支撐圓頭與晶圓接 觸。 47. 如申請專利範圍第36項所述之前開式晶圓盒，其中該複數個支撐 肋之每支律肋係具有一圓形孔洞，以供一支樓圓頭插入組裝。 48. 如申請專利範圍第46或47項所述之前開式晶圓盒，其中該支撐 19 201009986 圓頭之材質係一耐磨耗材β 49.如申請專利範圍第46或47項所、十、 50 ^頭之材質係ΡΕΕΚ材質。以之前開式晶圓盒’其中該支撐 件樓組之二：第36項所述之前開式晶圓盒，其中該可充氣支撐 51該複數個限制件係-耐磨耗材。 .如申請專利範圍第36項所述 件模開式晶81盒，其中該可充氣支樓 52.如申：：該複數個限制件係P咖材質。 甲晴專利範圍第36項所述之針叫* © 53:面係進一步設有至少一限制件：式晶圓盒，其中該門體之該内 表面36項所述之前開式晶圓盒’其中該"體之該内 54 哭步具有一凹陷區域。 表利範圍第36項所述之前開式晶圓盒，其中該門體之該外 表面之間配置至少一間結構。 之一頂式日日圓jS’包括一盒體’係由—對側壁及相鄰該對側壁 口之底面所組成，並於-側邊形成-開π，而相對該開 組，以容成一後壁’同時於該對側壁上配置-對支撐件模 該門艘係以外1晶圓；以及—門體，具有—外表面及一内表面， 體内部之兮面與該盒體之該開口相結合’並用以保護該盒 :之談複數個晶圓’其中該前開式晶圓盒之特徵在於· 支標it之=壁與該後壁相鄰之處，各配置至少-可充氣 配置4二：: 件模組係包括一主體’該主艘之-端 組具有底面之—氣_接，同時該可充氣支樓件模 排列的限tr:隔排列的支樓肋及一排複數個垂直間隔 揮肋及;ΐ:: 同支撐該複數個晶圓，其中在該複數個支 得肋及該複數個限制件之間係有至少一長縫。 20 201009986 〜 56.如申請專利範圍第％項所述之前開式晶圓盒，其中該複數個垂直間隔 排列的支撐肋之間進一步配置有出氣孔。 57. 如申請專利範圍第55項所述之前開式晶圓盒，其中該主體之内部 包含有一中空導管，該中空導管係與該長縫相通。 58. 如申請專利範圍第55項所述之前開式晶圓盒，其中該盒體之該底面上進 一步配置有至少一進氣閥及一出氣閥。 59·如申請專利範圍第55項所述之前開式晶圓盒，其中長縫可喷出一氣體。 6〇_如申請專利範圍第59項所述之前開式曰曰曰圓盒，其中該氣體係由下列群組 ❹ 中擇一或組合而成：惰性氣體、乾燥冷空氣及氮氣。 61. 如申請專利範圍第55項所述之前開式晶圓盒，其中該可充氣支撐 件模組係一體成型的結構。 62. 如申請專利範圍帛55項所述之前開式晶圓盒，其中該可充氣支揮 件模組係具有複數個插孔，以使職數個續肋讀人組裝的方 式囵定於該可充氣支撐件模組上。 63. 如申請專利範圍第55項所述之前開式晶圓盒，其中該複數個支撑 肋之材質係一财磨耗材。 64. 如中請專利範圍第55項所述之前開式晶圓盒，其中該複數個支樓 肋之材質係PEEK材質。 65. 如申請專利範圍第55項所述之前開式晶圓盒，其中該複數個支揮 肋之每-支撐肋係具有-支撲圓頭，以利用該支撐圓頭與晶圓接 觸。 66. 如申，專利範圍第55項所述之前開式晶圓盒，其中該複數個支撐 肋之每支樓肋係具有一圓形孔洞，以供一支撐圓頭插入組裝。 Μ.如申請專利範圍第65或Μ項所述之前開式晶圓盒，其中該支樓 圓頭之材質係一耐磨耗材。 68.如申請專利範圍第65或66H张、a向 凡項所述之前開式晶圓盒，其中該支揮 21 201009986 - 圓頭之材質係PEEK材質。 69. 如申請專利範圍第55項所述之前開式晶圓盒，其中該可充氣支撐 件模組之該複數個限制件係一耐磨耗材。 70. 如申請專利範圍第55項所述之前開式晶圓盒，其中該可充氣支撐 件模組之該複數個限制件係PEEK材質。 71. 如申請專利範圍第55項所述之前開式晶圓盒，其中該門體之該内 表面係進一步設有至少一限制件模組。 72. 如申請專利範圍第55項所述之前開式晶圓盒，其中該門體之該内 ^ 表面係進一步具有一凹陷區域。 73. 如申請專利範圍第55項所述之前開式晶圓盒，其中該門體之該外 表面及該内表面之間配置至少一門閂結構。 22(4) The pre-opening wafer cassette of item 18, wherein the inflatable portion internally comprises a hollow conduit, the hollow conduit being in communication with the slit. 21. The open wafer cassette of claim 18, wherein the bottom surface of the casing is further provided with at least one intake valve and one outlet valve. 22. The open wafer cassette of claim 8, wherein the slit is capable of ejecting a gas. 23. The open wafer cassette as described in claim 22, wherein the gas system is selected from the group consisting of inert gas, dry cold air, and nitrogen. 24. The prior open wafer cassette as described in claim 18, wherein the inflatable support module is integrally formed into a plastic structure. The front open wafer cassette of claim 18, wherein the first portion and the second portion of the inflatable support module each have a plurality of jacks to enable the plurality of jacks The support ribs are fixed to the inflatable support module in an insert assembly manner. 26. The prior open wafer cassette as described in claim 18, wherein the plurality of support ribs are made of a wear resistant material. 27. The open wafer cassette of claim 18, wherein the plurality of support ribs are made of PEEK. 28. The prior open wafer cassette of claim 18, wherein each of the plurality of support ribs has a support round head for utilizing the support round head to be connected to the wafer 17 201009986 29. The prior open wafer cassette of claim 18, wherein each of the plurality of support ribs has a circular hole for insertion of a support round insert. 30. The open wafer cassette as described in claim 28 or 29, wherein the material of the support round head is a wear resistant material. 31. The open wafer cassette as described in claim 28 or 29, wherein the material of the support round head is made of PEEK. 32. The open wafer cassette of claim 18, wherein the second portion of the inflatable support module is suspended in front of the rear wall. 33. The open wafer cassette of claim 18, wherein the inner surface of the door body is further provided with at least one restriction module. 34. The open wafer cassette of claim 18, wherein the inner surface of the door further has a recessed area. 35. The prior open wafer cassette of claim 18, wherein at least one latch structure is disposed between the outer surface of the door body and the inner surface. 36. A front opening wafer cassette comprising a casing comprising a pair of side walls and a top surface and a bottom surface adjacent to the pair of side walls, and forming an opening on one side opposite to the side The other side of the open port forms a rear wall, and a pair of support modules are disposed on the pair of side walls to accommodate a plurality of wafers; and a door body having an outer surface and an inner surface, the door The system combines the inner surface with the opening of the casing and protects the plurality of wafers inside the casing, wherein the front opening wafer cassette is characterized by: the pair of side walls of the casing and the rear Adjacent to the wall, each of the at least one inflatable support module is disposed, one end of the inflatable support module is configured with an air inlet and is connected to a gas valve of the bottom surface, and the inflatable support module is a first portion and a second portion are formed, and a first slit is formed adjacent to the first portion and the second portion, wherein the first portion of the inflatable support module is configured with a plurality of Vertically spaced 201009986 support ribs, and the second part is configured with a plurality of Straight spacer limiter arrangement. 37. The prior open wafer cassette of claim 36, wherein the plurality of vertically spaced support ribs are further provided with an air vent. ° 38. The prior open wafer cassette of claim 36, wherein the interior of the inflatable support module comprises a hollow conduit that communicates with the slit. 39. The open wafer cassette of claim 36, wherein the bottom surface of the casing is further provided with at least one intake valve and one outlet valve. 40. The open wafer cassette as described in claim 36, wherein the slit can be ejected as a product. Oxygen is as in the prior open wafer cassette described in claim 40, wherein the gas system is selected from the group consisting of inert gas, dry cold air, and nitrogen. 42. The open wafer cassette as described in claim 36, wherein the inflatable support module is integrally formed into a plastic structure. 43. The prior open wafer cassette of claim 36, wherein the first portion of the inflatable support module has a plurality of receptacles for securing the plurality of support ribs in an insert assembly manner On the inflatable support module. 44. The open wafer cassette as described in claim 36, wherein the plurality of support ribs are made of a wear resistant material. 45. The open wafer cassette as described in claim 36, wherein the plurality of branch ribs are made of PEEK material. 46. The prior open wafer cassette of claim 36, wherein the plurality of support ribs of the plurality of support ribs have a support round head for contacting the wafer with the support round head. 47. The open wafer cassette of claim 36, wherein each of the plurality of support ribs has a circular hole for inserting and assembling a round head. 48. The open wafer cassette as described in claim 46 or 47, wherein the support 19 201009986 round head material is a wear resistant material β 49. As claimed in claim 46 or 47, The material of the 50 ^ head is made of ΡΕΕΚ material. In the case of the prior open wafer cassette, wherein the support member group 2: the front open wafer cassette described in item 36, wherein the inflatable support 51 comprises the plurality of restraining members - wear resistant materials. The mold-opening crystal 81 box, as described in claim 36, wherein the inflatable branch 52. If: the plurality of restrictions are made of P coffee material. The needle described in item 36 of the patent scope of the patent is called * © 53: the face is further provided with at least one restriction member: a wafer cassette, wherein the inner surface of the door body is 36 pieces of the previously open wafer cassette Among them, the inner crying step has a recessed area. The front open wafer cassette of claim 36, wherein at least one structure is disposed between the outer surfaces of the door body. A top type Japanese yen jS' includes a box body consisting of a pair of side walls and a bottom surface adjacent to the pair of side wall openings, and forming a - opening π on the side, and opposing the opening group to accommodate one The wall 'is disposed on the pair of side walls at the same time - the support member molds one wafer other than the door line; and the door body has an outer surface and an inner surface, and the inner surface of the body is opposite to the opening of the box body Combine 'and use to protect the box: talk about a plurality of wafers', wherein the front open wafer cassette is characterized by the fact that the wall of the front panel is adjacent to the rear wall, and each configuration is at least - an inflatable configuration 4 :: The module module includes a main body 'the main ship's end group has a bottom surface - gas_connection, and the inflatable branch member molds are arranged in a limit tr: a plurality of vertical ribs arranged in a row and a plurality of vertical rows The plurality of wafers are supported by the plurality of wafers, wherein at least one slit is formed between the plurality of support ribs and the plurality of restriction members. 20 201009986 〜 56. The prior open wafer cassette of claim 1 , wherein the plurality of vertically spaced support ribs are further provided with an air outlet. 57. The open wafer cassette of claim 55, wherein the interior of the body comprises a hollow conduit that communicates with the slit. 58. The open wafer cassette of claim 55, wherein the bottom surface of the casing is further provided with at least one intake valve and one outlet valve. 59. The open wafer cassette as described in claim 55, wherein the long slit can eject a gas. 6〇_ As in the open-ended round box described in claim 59, the gas system is selected or combined from the following groups: inert gas, dry cold air and nitrogen. 61. The prior open wafer cassette of claim 55, wherein the inflatable support module is an integrally formed structure. 62. The open wafer cassette as described in claim 55, wherein the inflatable support module has a plurality of jacks, so that the method of assembling the number of ribs is determined On the inflatable support module. 63. The open wafer cassette as described in claim 55, wherein the plurality of support ribs are made of a consumable material. 64. The prior open wafer cassette as described in claim 55 of the patent scope, wherein the plurality of branch ribs are made of PEEK material. 65. The prior open wafer cassette of claim 55, wherein each of the plurality of support ribs has a whip head for contacting the wafer with the support head. 66. The prior open wafer cassette of claim 55, wherein each of the plurality of support ribs has a circular hole for inserting and assembling a support round head. Μ The open wafer cassette as described in claim 65 or above, wherein the material of the round head of the branch is a wear resistant material. 68. If the patent application scope is 65 or 66H, a to the open wafer cassette before the item, wherein the branch 21 201009986 - the material of the round head is made of PEEK material. 69. The prior open wafer cassette of claim 55, wherein the plurality of restriction members of the inflatable support module are a wear resistant material. 70. The open wafer cassette of claim 55, wherein the plurality of restriction members of the inflatable support module are made of PEEK. 71. The open wafer cassette of claim 55, wherein the inner surface of the door body is further provided with at least one restriction module. 72. The open wafer cassette of claim 55, wherein the inner surface of the door further has a recessed area. 73. The open wafer cassette of claim 55, wherein at least one latch structure is disposed between the outer surface of the door body and the inner surface. twenty two
TW097132635A 2008-08-27 2008-08-27 A wafer container with at least one supporting module having a long slot TWI371076B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW097132635A TWI371076B (en) 2008-08-27 2008-08-27 A wafer container with at least one supporting module having a long slot
US12/202,389 US8047379B2 (en) 2008-08-27 2008-09-01 Wafer container with purgeable supporting module
US12/952,528 US8413814B2 (en) 2008-08-27 2010-11-23 Front opening unified pod disposed with purgeable supporting module
US13/034,477 US8413815B2 (en) 2008-08-27 2011-02-24 Wafer container with at least one purgeable supporting module having a long slot
US13/183,522 US8387799B2 (en) 2008-08-27 2011-07-15 Wafer container with purgeable supporting module

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TW097132635A TWI371076B (en) 2008-08-27 2008-08-27 A wafer container with at least one supporting module having a long slot

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CN111092038A (en) * 2019-12-10 2020-05-01 许正根 Combined wafer box
CN111457692A (en) * 2019-01-18 2020-07-28 弘塑科技股份有限公司 Batch substrate drying equipment and substrate drying air knife device thereof
TWI833637B (en) * 2022-06-01 2024-02-21 家登精密工業股份有限公司 Substrate retaining assembly and door device

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TWI409198B (en) * 2010-12-27 2013-09-21 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
CN111457692A (en) * 2019-01-18 2020-07-28 弘塑科技股份有限公司 Batch substrate drying equipment and substrate drying air knife device thereof
CN111457692B (en) * 2019-01-18 2021-08-24 弘塑科技股份有限公司 Batch substrate drying equipment and substrate drying air knife device thereof
CN111092038A (en) * 2019-12-10 2020-05-01 许正根 Combined wafer box
TWI833637B (en) * 2022-06-01 2024-02-21 家登精密工業股份有限公司 Substrate retaining assembly and door device

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US8047379B2 (en) 2011-11-01

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