201223403 [0001] [0002] [0003] 099141350 發明說明： 【發明所屬之技術領域】 本發明涉及柔性電路板製作技卿領域，尤其涉及-種用 於固持柔性電路板進行輕射加為之固持裝置。 【先前彳支術】 隨著數位產品往短小輕便方 之發展’表面貼裝技術（ Surface Mounted Technoi 插裝技術之新-Μ 认SMT)成為替代通孔 位組裝技術。採用表面貼裝技術可 大幅縮減數位元器件體藉，亡 奴 體積有刊於實現高密度'小型化 數位產品組裝。 =面貼裝技術主要包括錫膏録器献 至^序。料印㈣指將騎•航卿之範本印刷 ?1 。件薏放係指將數位元器件之 引腳放置於已印好錫膏之$ H 之系改電路板之焊墊上，回流馊 接係指將柔性電路板置於炫 坏 置於口蛘壚中加熱，從而熔化錫膏 使得數位元器件引腳盥牟性 兩*、 一系性電路板焊墊之間實現機械與 氣連接表面貼裝技術對錫膏印刷圖形、器件置放位 置均有非*精確之要求，—旦錫膏印刷圖形、器件置放 位置不夠準確’將引起數位元器件引腳與柔性電路板焊 塾之間連接不良’嚴重地將導致產品報廢。由於柔性電 路板加熱時易發生翹曲變形’造成放置於柔性電路板表 面之數位元器件亦發生偏位，如此，通常弓I起2〇%~3()%之 不良率’降低了柔性電路板表面貼裝之效率，增加 產成本。 s σ 生 【發明内容】 表早編號Α0101 第4頁/共16頁 0992071942-0 201223403 [0004] [0005] Ο [0006]201223403 [0001] [0001] [0003] [0003] 099141350 Description of the Invention: [Technical Field] The present invention relates to the field of flexible circuit board manufacturing technology, and more particularly to a holding device for holding a flexible circuit board for light shot addition . [Previous 彳 】] With the development of digital products in a short and light way, Surface Mounted Technoi (SMT) is an alternative to through-hole assembly technology. The use of surface mount technology can significantly reduce the number of components, and the volume of the slaves is published in the high-density 'small-scale digital product assembly. = Surface mount technology mainly includes solder paste recorders to the order. Material printing (4) refers to the printing of the model of riding and aviation. The device is placed on the solder pad of the printed circuit board of the printed circuit board. The reflow connection means that the flexible circuit board is placed in the mouth. Heating, thus melting the solder paste to make the digital components lead two-fold*, mechanical and gas connection between the ones of the circuit board pads. Surface mount technology is not suitable for solder paste printing patterns and device placement positions. Accurate requirements, such as the solder paste printing graphics, the placement of the device is not accurate enough 'will cause poor connection between the digital component pins and the flexible circuit board soldering' seriously will lead to product retirement. Since the flexible circuit board is prone to warpage when heated, the digital components placed on the surface of the flexible circuit board are also misaligned. Thus, the defect rate of the bow I is usually 2% to 3%, which reduces the flexible circuit. The efficiency of board surface mounting increases production costs. s σ 生 【Contents】 Table early number Α0101 Page 4 of 16 0992071942-0 201223403 [0004] [0005] Ο [0006]
[0007] [0008] 099141350 有鑑於此，提供一種固持裝置，以提高柔性電路板輻射 加熱時之加工良率實屬必要。 —種固持襞置，用於固持具有待輻射加熱區之柔性電路 板以對所述柔性電路板輻射加熱。所述固持裝置包括一 承栽板、複數磁性件及一覆蓋板。所述承載板用於承載 柔性電路板。所述覆蓋板包括<被磁力吸引之頂板及形 成於頂板表面之反射膜。所述覆蓋板開設有與待輻射加 熱區對應之開口，所述開口貫贫所述頂板及反射膜。所 述反射膜用於反射輻射光線。所述複數磁性件均嵌設於 所述承載板，用於產生磁力吸弓丨所述頂板’以將所述柔 性電路板固持於所述承載板與覆蓋板之間。 +F .. 本技術方案之固持裝置之承栽板条設有磁性件，覆蓋板 具有反射膜。使用該固持裝置固持柔性電路板進行輻射 加熱時，覆蓋板與磁性件之相互吸引作用可平整地固持 柔性電路板。反射膜可保護柔性電路板之待輻射加熱區 以外之部分區域不文熱，寸節省能量，避免柔性電路板 發生翹曲變形’提高柔性電路板輻射加熱時之加工良率 〇 【實施方式】 以下將結合附圖及實施例，許本技術方案之固持裝置進 行詳細說明。 請一併參閱圖1及圖2，本技術方案提供一種固持裝置1〇 ，用於固持具有待㈣加熱區之柔性電路板以對所述柔 性電路板輻射加熱。所述固持裝置1〇包括一承載板u、 複數磁性件12及一覆蓋板13。 表單編號A0101 第5頁/共16頁 0992071942-0 201223403 [_所述承載板11祕承載錄電路板m載板U包括 一底板110及自所述底板110延伸之複數定位柱1U。所 述底板110可為長方體形板，其厚度為4毫米至5毫米。所 述底板110具有用於承載柔性電路板之承載面112。所述 底板110自所述承載面112開設複數收容孔113。所述複 數收容孔113均為盲孔，即沒有貫穿底板11〇與所述承載 面11 2相對之表面。每一收容孔u 3均包括相連接之側壁 114及底壁11 5。本實施例中，所述定位柱丨丨丨之數量為 四個，每一定位柱111均自靠近所述承載面112之一頂角 處垂直延伸。 [0010] 所述複數磁性件12均嵌設於所述承載板】i，用於產生磁 力吸引所述覆蓋板13,以將所述柔性逢蹲麵固持於所述 覆蓋板13與承載板11之間。所述複數磁性件12與所述複 數收容孔113--對應，每一磁性件12均收容於一收容孔 11 3内。所述複數磁性件12均為磁鐵，所述磁鐵可以為鈥 鐵硼稀土合金等稀土永磁材料，亦可以為鋁鎳鈷系永磁 合金、鐵路銘系_永磁合金等金屬永磁材料，還可以為鋇 鐵氧體系永磁合金、鳃鐵氧體系永磁合金等鐵氧體永磁 材料。本實施例中，磁性件1 2全部由鉉鐵蝴製成。 [0011] 所述覆蓋板13包括可被磁力吸引之頂板130及形成於所述 頂板130表面之反射膜131。所述頂板130及反射膜131之 厚度之和優選為〇. 12毫米至0. 15毫米。所述頂板130全 部或部分由磁性材料製成，因此頂板130具有磁性，能被 磁性件12之磁力吸引。本技術方案中’所述磁性材料包 括鐵磁性材料、亞鐵磁性材料及其他磁有序性材料。具 099141350 表單編號A0101 第6頁/共16頁 0992071942-0 201223403 體地’本技術方案中之磁性材料是指相對磁導率大於等 於10之材料。本實施例中，頂板130之材料為具有磁性之 不錄鋼’如鐵素體不錢鋼、馬氏體不銹鋼等。本實施例 中’與所述底板110形狀相對應地，所述頂板13〇亦為長 方體形板。所述頂板130包括第一表面132、第二表面 133、第一連接面134、第二連接面135、第三連接面136 及第四連接面137 °所述第二表面i33與第一表面132相 對。所述第一連接面134、第二連接面135、第三連接面In view of this, it is necessary to provide a holding device to improve the processing yield of the flexible circuit board during radiant heating. A holding device for holding a flexible circuit board having a heating zone to be irradiated to radiantly heat the flexible circuit board. The holding device comprises a bearing plate, a plurality of magnetic members and a covering plate. The carrier plate is used to carry a flexible circuit board. The cover sheet includes < a top plate that is attracted by the magnetic force and a reflective film formed on the surface of the top plate. The cover plate is provided with an opening corresponding to the heating zone to be irradiated, and the opening is rich in the top plate and the reflective film. The reflective film is used to reflect radiation. The plurality of magnetic members are embedded in the carrier plate for generating a magnetic attraction to the top plate to hold the flexible circuit board between the carrier plate and the cover plate. +F .. The slats of the holding device of the present technical solution are provided with a magnetic member, and the cover plate has a reflective film. When the holding device is used to hold the flexible circuit board for radiation heating, the mutual attraction of the cover plate and the magnetic member can flatly hold the flexible circuit board. The reflective film can protect part of the area of the flexible circuit board except the radiant heating zone, which saves energy and avoids warping deformation of the flexible circuit board. [Improving the processing yield of the flexible circuit board during radiant heating 实施 [Embodiment] The holding device of the present invention will be described in detail with reference to the accompanying drawings and embodiments. Referring to FIG. 1 and FIG. 2 together, the technical solution provides a holding device 1 固 for holding a flexible circuit board having a heating zone to be radiantly heated to the flexible circuit board. The holding device 1A includes a carrier plate u, a plurality of magnetic members 12 and a cover plate 13. Form No. A0101 Page 5 of 16 0992071942-0 201223403 [The carrier board 11 carrier board m carrier board U includes a bottom board 110 and a plurality of positioning posts 1U extending from the bottom board 110. The bottom plate 110 may be a rectangular parallelepiped plate having a thickness of 4 mm to 5 mm. The bottom plate 110 has a bearing surface 112 for carrying a flexible circuit board. The bottom plate 110 defines a plurality of receiving holes 113 from the bearing surface 112. The plurality of receiving holes 113 are blind holes, that is, there is no surface penetrating the bottom plate 11 相对 opposite to the bearing surface 11 2 . Each of the receiving holes u 3 includes a connecting side wall 114 and a bottom wall 11 5 . In this embodiment, the number of the positioning posts is four, and each of the positioning posts 111 extends perpendicularly from a top corner of the bearing surface 112. [0010] The plurality of magnetic members 12 are respectively embedded in the carrier plate i for generating a magnetic force to attract the cover plate 13 to hold the flexible bonnet surface to the cover plate 13 and the carrier plate 11 between. The plurality of magnetic members 12 are corresponding to the plurality of receiving holes 113-, and each of the magnetic members 12 is received in a receiving hole 113. The plurality of magnetic members 12 are all magnets, and the magnets may be rare earth permanent magnet materials such as neodymium iron boron rare earth alloy, or may be metal permanent magnet materials such as aluminum nickel cobalt permanent magnet alloys and railway Ming _ permanent magnet alloys. It can also be a ferrite permanent magnet material such as a neodymium iron alloy permanent magnet alloy or a neodymium iron oxide permanent magnet alloy. In this embodiment, the magnetic members 12 are all made of neodymium iron. [0011] The cover plate 13 includes a top plate 130 that can be attracted by a magnetic force and a reflective film 131 formed on a surface of the top plate 130. The thickness of the top plate 130 and the reflective film 131 is preferably from 12 mm to 0.15 mm. The top plate 130 is entirely or partially made of a magnetic material, so that the top plate 130 is magnetic and can be attracted by the magnetic force of the magnetic member 12. In the present technical solution, the magnetic material includes a ferromagnetic material, a ferrimagnetic material, and other magnetic order materials. 099141350 Form No. A0101 Page 6 of 16 0992071942-0 201223403 Body The magnetic material in this technical solution refers to a material with a relative magnetic permeability greater than or equal to 10. In the present embodiment, the material of the top plate 130 is magnetic non-recorded steel such as ferritic stainless steel, martensitic stainless steel or the like. In the present embodiment, the top plate 13A is also a rectangular parallelepiped plate corresponding to the shape of the bottom plate 110. The top plate 130 includes a first surface 132, a second surface 133, a first connecting surface 134, a second connecting surface 135, a third connecting surface 136, and a fourth connecting surface 137. The second surface i33 and the first surface 132 relatively. The first connecting surface 134, the second connecting surface 135, and the third connecting surface
136及第四連接面137首尾相接’且岣連接於所述第一表 面132及第二表面133之間》所述第一表面132用於與所 述柔性電路板相接觸。所述反射膜lf l形成於所述第二表 面133 °所述反射膜131用於反射輻射光線以保護所述柔 性電路板之待輻射加熱區以外之區域。所述反射膜131之136 and the fourth connecting surface 137 are connected end to end and the crucible is connected between the first surface 132 and the second surface 133. The first surface 132 is for contacting the flexible circuit board. The reflective film lf l is formed on the second surface 133 °. The reflective film 131 is for reflecting radiation to protect an area of the flexible circuit board outside the heating zone to be irradiated. The reflective film 131
材料優選為銀’藉由氣相沈積等方式形成於所述頂板13〇 上。當所述固持裝置10固持著柔性電路板進行輻射加熱 時’反射膜131可以反射掉加熱光線，從而使得柔性電路 板被反射膜131保護之部分不受熱’節省能量，避免柔性 電路板發生翹曲。所述覆蓋板13還具有複數定位孔138及 複數開口 139。所述複數定位孔138及複數開〇139均貫 穿所述頂板130及反射膜131 »所述複數定位孔138&~ 述複數定位柱111：—•對應，每一定位孔138均靠近所述 頂板130之一頂角開設，從而可套設於一對應之定位柱 1Π。所述複數開口 139與柔性電路板之待輻射加熱區對 應’用於暴露柔性電路板之待輻射加熱區以進行加熱。 所述複數開口 139之大小及分佈情況可根據實際生產之= 性電路板上待貼裝之數位元件之不同而作相應之設計。 099141350 0992071942-0 表單編號A0101 第7頁/共16頁 201223403 [0012] [0013] [0014] [0015] [0016] 優選之，所述收容孔11 3及磁性件12之分佈避開正對開口 139之部分。 當然，所述反射膜131還可以進一步覆蓋第一連接面134 、第二連接面135、第三連接面136及第四連接面137 , 從而可以進一步節省能量。 請一併參閱圖1及圖3，以下將以使用本技術方案之固持 裝置10固持柔性電路板進行表面貼裝為例，說明本技術 方案提供之固持裝置10之使用方法，具體地，可採取以 下步驟： 首先，提供柔性電路板100，其具有複數對位孔1〇1及複 數待輻射加熱區102。所述複數對位孔1〇1之數量為四個 ，每一對位孔101均靠近所述柔桂電路板1〇{)之一頂角。 所述待輻射加熱區102可事先以印刷等方式形成錫膏。 其次，使柔性電路板100之複數對位孔1〇1對準所述承載 板11之複數定位柱ill，將柔性電路板100承載於承載板 11 ° 再次，使覆蓋板13之複數定位孔138對準所述承載板Hi 複數疋位柱111，將覆蓋板13覆蓋於承載板η上之柔性電 路板1〇〇上方。由於複數磁性件12具有磁場，對覆蓋板13 產生磁力吸引作用，该磁力吸引作用可壓制柔性電路板 10 0，使柔性電路板1 〇 〇平整地置於覆蓋板丨3與承載板j i 之間。柔性電路板100之待輻射加熱區102暴露於覆蓋板 13之開口 139。 [0017] 099141350 食後’在所述柔性電路板1 0 〇之待輪射加熱區1 〇 2放置數 表單編號A0101 第8頁/共16頁 0992071942-0 201223403 位兀件’並將固持於固持裝置1〇之柔性電路板⑽進行輯 射加熱，以熔錫並固定數位元件，實贱位元件之貼裝 圆當加熱光線，如，紅外料照射固縣㈣及柔性電路 板100時，由於反射膜13丨之反射作用，柔性電路板丨 ^堇待輕射加熱區1()2被充分加熱，而其他區域不受熱， 攸而可即省能量’避免柔性電路板1〇〇其他區域發生姐曲 變形。 〇 _]=技術方案之固持裝置10之承載板叙設有磁性件12，覆 蓋板13具有反射膜131。烤用該同持裝置固持柔性電路 板100進行輻射加熱時，覆篆板13與磁性㈣I〗之相互吸弓丨 作用可平整地固持柔性電路板1〇〇。反射膜Ml可保護柔 性電路板1〇〇之待輻射加熱區以外之部分區域不被加熱， 可即省能量’避免柔性電路板發生翹曲變形，提高柔性 電路板輕射加熱時之加工良率。 〇 [0020].综上所述’本發明確已符合發明專利之要件，遂依法提 出專利申請。惟’以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0021 ] ® 1係本技術方案提供之固持裝置之分解狀態之結構示意 圖。 [0022] @ 2係本肠方案提供 < 固持裝置之組裝狀態之結構示意 099141350 表單編號A0I01 $ 9頁/共16頁 0992071942-0 201223403 圖。 [0023] [0024] [0025] [0026] [0027] [0028] [0029] [0030] [0031] [0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] 圖3係使用上述固持裝置固持柔性電路板之結構示意圖。 【主要元件符號說明】 固持裝置：10 承載板：11 底板：110 定位柱：111 承載面：112 收容孔：11 3 側壁：114 底壁：115 磁性件：12 覆蓋板：13 頂板：130 反射膜：131 第一表面：1 3 2 第二表面：1 3 3 第一連接面：134 第二連接面：135 第三連接面：136 099141350 表單編號A0101 第10頁/共16頁 0992071942-0 [0040] 137 201223403 [0041] 第四連接面： [0042] 定位孔：138 [0043] 開口 ： 1 3 9 100 [0044] 柔性電路板： [0045] 對位孔：101 ：102 [0046] 待輻射加熱區The material is preferably silver' formed on the top plate 13A by vapor deposition or the like. When the holding device 10 holds the flexible circuit board for radiant heating, the reflective film 131 can reflect the heating light, so that the portion of the flexible circuit board protected by the reflective film 131 is not protected from heat, thereby avoiding warpage of the flexible circuit board. . The cover plate 13 further has a plurality of positioning holes 138 and a plurality of openings 139. The plurality of positioning holes 138 and the plurality of openings 139 are respectively penetrated through the top plate 130 and the reflective film 131 » the plurality of positioning holes 138 and the plurality of positioning columns 111: −•, each positioning hole 138 is adjacent to the top plate One of the top corners of the 130 is opened so as to be sleeved on a corresponding positioning post 1Π. The plurality of openings 139 correspond to the radiant heating zone of the flexible circuit board for exposing the radiant heating zone of the flexible circuit board for heating. The size and distribution of the plurality of openings 139 can be designed according to the difference in digital components to be mounted on the actual printed circuit board. 099141350 0992071942-0 Form No. A0101 Page 7 / Total 16 Page 201223403 [0012] [0015] [0016] [0016] Preferably, the arrangement of the receiving hole 11 3 and the magnetic member 12 avoids the opening Part 139. Of course, the reflective film 131 can further cover the first connection surface 134, the second connection surface 135, the third connection surface 136, and the fourth connection surface 137, so that energy can be further saved. Please refer to FIG. 1 and FIG. 3 together. The following uses the holding device 10 of the present invention to hold the flexible circuit board for surface mounting, and illustrates the use of the holding device 10 provided by the technical solution. Specifically, the method can be adopted. The following steps: First, a flexible circuit board 100 having a plurality of alignment holes 1 〇 1 and a plurality of radiant heating zones 102 is provided. The number of the plurality of registration holes 1〇1 is four, and each of the pair of holes 101 is close to one of the top corners of the soft circuit board 1〇{). The heating zone 102 to be irradiated may form a solder paste in advance by printing or the like. Next, the plurality of alignment holes 1〇1 of the flexible circuit board 100 are aligned with the plurality of positioning posts ill of the carrier board 11, and the flexible circuit board 100 is carried on the carrier board 11° again, so that the plurality of positioning holes 138 of the cover board 13 are provided. The plurality of clamping posts 111 are aligned with the carrier plate Hi, and the cover plate 13 is overlaid on the flexible circuit board 1A on the carrier substrate η. Since the plurality of magnetic members 12 have a magnetic field, a magnetic attraction is generated to the cover plate 13, which can press the flexible circuit board 100, so that the flexible circuit board 1 is evenly placed between the cover plate 3 and the carrier plate ji. . The radiant heating zone 102 of the flexible circuit board 100 is exposed to the opening 139 of the cover panel 13. [0017] 099141350 After eating 'on the flexible circuit board 10 0 to be rotated heating zone 1 〇 2 placement number form number A0101 page 8 / total 16 page 0992071942-0 201223403 bit condition 'will be held in the holding device 1〇The flexible circuit board (10) performs the incident heating to melt the tin and fix the digital components, and the mounting circle of the actual clamping component heats the light, for example, when the infrared material illuminates Guxian (4) and the flexible circuit board 100, due to the reflective film 13 丨 reflection, flexible circuit board 堇 堇 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻 轻Deformation.承载 _] = The carrier plate of the holding device 10 of the technical solution is provided with a magnetic member 12 having a reflecting film 131. When the same holding device holds the flexible circuit board 100 for radiant heating, the cover plate 13 and the magnetic (four) I can mutually hold the flexible circuit board 1 . The reflective film M1 can protect a portion of the flexible circuit board 1 other than the heating zone to be heated from being heated, which can save energy, avoiding warpage of the flexible circuit board, and improving the processing yield of the flexible circuit board during light heating. . 〇 [0020] In summary, the invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention is not limited thereto. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0021] ® 1 is a schematic structural view of an exploded state of a holding device provided by the present technical solution. [0022] @ 2系肠肠方案 Provided < Structure of the assembly state of the holding device 099141350 Form No. A0I01 $9 page / Total 16 pages 0992071942-0 201223403 Figure. [0023] [0028] [0029] [0039] [0039] [0038] [0039] [0039] [0039] FIG. 3 is a schematic structural view of holding a flexible circuit board by using the above holding device. [Main component symbol description] Holding device: 10 Carrier plate: 11 Base plate: 110 Positioning post: 111 Bearing surface: 112 Housing hole: 11 3 Side wall: 114 Bottom wall: 115 Magnetic parts: 12 Covering plate: 13 Top plate: 130 Reflecting film : 131 First surface: 1 3 2 Second surface: 1 3 3 First connection surface: 134 Second connection surface: 135 Third connection surface: 136 099141350 Form number A0101 Page 10/Total 16 page 0992071942-0 [0040 ] 137 201223403 [0041] Fourth connection surface: [0042] Positioning hole: 138 [0043] Opening: 1 3 9 100 [0044] Flexible circuit board: [0045] Registration hole: 101: 102 [0046] Heating to be irradiated Area
099141350 表單編號A0101 第Π頁/共16頁 0992071942-0099141350 Form No. A0101 Page / Total 16 Pages 0992071942-0