M326762 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種治具，特別是關於一種製造IC基板的治具。 【先前技術】 傳統製造IG基板的治妓二件式，触上妓將綠安裝於軌道 上，然後女裝1C基板在底板上定位，塗佈錫膏。在輸送帶上移動 安裝電子零件於1C基板，上板壓上底板，進錫爐作業。因此，當 行基板作業時，由於IC基板係為薄板，且為配合生產，使用 此在高溫下作業容易不規則變形。如果使用材質不 基板’在27(TC〜280〇c高溫下作業容易變形，上錫不容易，合 基板上而造成空焊問題，良率無法提升。^ ^，即’ 1C基板的成本，IC基板的材質品質不良， 形*所以抑在現有狀況下改善治具，使ic基板可^平坦 地女裝在底板與上板間是急思解決的問題。 - 【新型内容】 具。本創作之主要目的是提供—種改善1C基板變形，提升良率的治 形的g作之次—目的是提供—種進錫爐前後均可鱗決1C基板變 持與麼片的問題。目的疋提供一種使用磁鐵設計解決過去1C基板夾 表面==:=牛基板-的治具， $括：一底板，於該底板 位元件的位置設有複兀β,一上板，於該上板對應於該第一定 M326762 上。因此 巧有夕數個弟二階部；及—壓板，具有—基 的弟-階部上，該基部的關分別設有至少 該長孔 , IC基板夾持在該底板與上板間時，可以改盖ΤΓ 形，而且利用壓板壓制該IC基板，於進 :1C基板變 板變形，使良率接弁。 繩引後均咸有效解決1C基 此，當ic基板央掊扁玆處妬盥f•也„ηΓ L供5又於該弟二階部 該^板表面上設有複數個第三定位元件，而該壓板對應 第：γ立 設置於該耳部。 ，@部’而該第四定位元件 而該第二階部係 較佳地，該第—階部储於職孔的長側兩端， 設於該長孔的短側兩端。 較佳地，該底板設有多數個散熱孔。 【實施方式】 請參閲第-圖為本創作製造IC基板的 分解圖，林_找狀低件絲二每二二、—二體 被爽持定位於治具内，在進h 使1C基板 細基嫌本創作 10表面上設有複數個第一定位元件1卜12、13、14，H該^板 應於該第-定位元件n、12、13、14 ' ^ 20對 ^ 22； 23 ^24，π 弟-疋位元件U、12、13、14係為一定位 二:_ /、中該 "：V 20 ii； 21«M326762 VIII. New description: [New technical field] This creation is about a fixture, especially a fixture for manufacturing an IC substrate. [Prior Art] A conventional two-piece IG substrate is manufactured by attaching green to a rail, and then the 1C substrate of the lacquer is positioned on the bottom plate to apply a solder paste. Moving on the conveyor belt Mount the electronic components on the 1C substrate, press the upper plate onto the upper plate, and put it into the tin furnace. Therefore, when the substrate is operated, since the IC substrate is a thin plate and is used for production, it is easy to irregularly deform at a high temperature. If the material is not used, the substrate is easily deformed at 27 (TC~280〇c high temperature, the soldering is not easy, and the soldering problem is caused by the combination of the substrate, the yield cannot be improved. ^ ^, ie the cost of the 1C substrate, IC The material quality of the substrate is poor, and the shape is improved. Therefore, the fixture can be improved under the existing conditions, so that the ic substrate can be flatly placed between the bottom plate and the upper plate. This is a problem that is urgently solved. - [New content] The main purpose is to provide a method for improving the deformation of the 1C substrate and improving the yield. The purpose is to provide the problem that the 1C substrate can be changed and the film can be placed before and after the tin furnace. Using a magnet design to solve the past 1C substrate holder surface ==:= cattle substrate-the jig, $ includes: a bottom plate, at the position of the bottom plate member is provided with a 兀β, an upper plate, the upper plate corresponding to the The first M326762 is on. Therefore, there is a second-order part of the corpus; and the pressure plate has a base-stage, and the base is respectively provided with at least the long hole, and the IC substrate is clamped on the bottom plate. When it is between the upper plates, it can be changed into a shape and pressed by a platen. The IC substrate, in the 1C substrate, is deformed to make the yield of the board. After the rope is introduced, it is effective to solve the 1C basis. When the ic substrate is in the middle, it is 妒盥f•also „ηΓ L for 5 and The second-order portion of the second-stage portion is provided with a plurality of third positioning elements on the surface thereof, and the pressing plate corresponds to the first: γ is disposed on the ear portion, and the fourth portion is the fourth positioning member and the second-order portion is Preferably, the first step is stored at both ends of the long side of the hole, and is disposed at both ends of the short side of the long hole. Preferably, the bottom plate is provided with a plurality of heat dissipation holes. - Figure is an exploded view of the IC substrate for the creation of the creation, Lin _ looking for a low piece of silk two every two two, - two bodies are positioned in the fixture inside, in the h made 1C substrate fine base suspected on the surface 10 a plurality of first positioning elements 1 12, 13, 14 are provided, and the board should be at the first positioning element n, 12, 13, 14 ' ^ 20 pairs ^ 22; 23 ^ 24, π 疋 - 疋The components U, 12, 13, 14 are positioned as two: _ /, the middle ":V 20 ii; 21«
在該二1〇上，然後疋將該：2:置=板將二基，Z 10的第-定位元件U、12、n以由 44對應於該底板 1C ^ 40 1〇 6 M326762 id:設為一定位孔’而該第二定位元件係為-定位柱，亦可達 到4效結構，此亦為本創作所保護的精神。 運 為，善1C基板40變形’提升良率，且在進錫爐前後可以有 ^置’本創作為三件式治具’包括有—壓板30 決fc基板4ί題使該IC基板40可以有效被顺 魅上板20與該壓板30能順利貼合，該上板20表面上設有禮 元件m件25、26、27、28 ’而該壓板3〇對應於該第三定位 7 三定位元件25、26、27、28結合。當然如上之篆 件，例如磁鐵等。本實施例之底板1Q與上板20使用定 ίΐ疋位孔設計，及該上板20與該壓板30使用磁性元件設ί，除 Ζ 2^板夾持與壓片的問題外，且當將該壓板30靠近該^ f 20 -士疋距離時，兩者的磁性元件就會自紐附而快速貼緊，安震容 ϋ ίΪ上板2G與該壓板3G的金屬則需使用非磁性金屬材質， 位ni不ί於使該壓板3〇的磁性元件吸附在該上板20的其它 32、33、34在本創作的創作精神内是可以一 ^ 磁〖生兀件，另一為具被磁性吸引的金屬。 “上板20具有至少一長孔29且於該長孔29的長側兩右$ | -第-階箱，及輸L 29 _兩端設有至有^ 該紐30具有-基部35可設置於該長孔四的第一階 部35的兩侧分別設有至少一耳部351供設於該 ^ 一階部291與該第二階部292係提供該敵3〇料白部:2上= i ;〇使合於該上板20上’如第一圖所示。為使該2 ϊί- it = 1，該第一’291 或該第：_ ϊϊί = i=^27、28 ’而該壓板30的耳部351設有對應 於該弟二疋位兀件25、26、27、28的第四定位元件31、q9、w 本實施例的定位元件所設置的位置可依實際狀態設計。該第三定位元 M326762 .件25、26、27、28與該第四定位元件31、32、33、34如上所 為磁性元件，如磁鐵，所以該第二階部292與該耳部351的設計，再 加上磁性元件的設計可以讓該壓板30快又順利與該上板2〇結合。 另，該長孔29設有多數個區域，使對應該IC基板4〇的^一 板’可適當地提供電子零件安裝的空間。 該底板10設有多數個散熱孔15，方便提供在高溫工作環 迅速散熱。而該底板10上設以多數個穿孔16，係可提供使且= 中未示）自該穿孔16將1C基板40夾持定位。 ^圖 由上知，本實施縦該雜1G與社板2G是使狀位柱 孔的設計，而該上板20與該壓板30是使用磁性元件 ^ 件式治具的結合效果。 ~ $^二 請參閱第二圖為本創作製造Ic基板的治具的第二實施 分解圖，本實施織本上結構如第—實_，獨處是在於：該招 10上設有複數個第-定位元件u、12、13、14 ^ 該第-定位元件U、12、13、14的位置設有複數個第二定 ==於 22、23、24，使與該第一定位元件u、12、13、u結合 壓板30能結合，該第一階部291或該第二階部2至=^ ?元件、26、27、28，而該壓板3〇的耳部351設^^3二 疋位兀件25、26、27、28的第四定位元件31、32、33、34"。、" 其中該第-定位元件U、12、13、14係為一定位 ° — 位兀件2卜22、23、24係為-定位孔，所以當該上板^ 一= 結合時，該定位孔就會套入該定位柱上結合 = =定位Ϊ上定位。另—實施方式是該第-定位 又為一疋位孔，而該第二定位元件21、22 亦可達到等效結構。 Μ係為一疋位柱， M326762 • ι〇上設有複數個第一定位元侏1! 10 , _ 該第一定位元件11、12、n 1 L 14 ’而該上板20對應於 -22、23、24 ’使與該第—二置設有複數個第二^位元件2卜 壓板30能結合，該第一階A = 、13、14結合。該上板20、 位元件25、26、27 28H^弟二階部292設有至少該第三定 定位元件25、26、27、28 ^ 的耳部351設有對應於該第三 甘士## _^8的弟四定位元件31、32、33、34。 定位i件ϊι弟22H/1、、12、13、14係為一磁性元件，而該第二 板士1時，今磁I·生：為一磁性元件，所以當該上板20與該底 12 吸引結合。另一實施方式是該第一定 ίΓίϋί為一具被磁性吸引的金屬，或該第一定位元件1卜12、 金屬，崎第二定侃件21、22、23、 Z4係為一磁性兀件，亦可達到等效結構。 外ίΐ知’本實施例是該底板10與該上板20是使用磁性元件的設 清參閱第四圖為本鱗製造Ic基板的治具_立體示意圖， 作‘造ic基板的治具首先是將該底板10安裝於一軌道（圖中未示 上，然後將1C基板40安裝於該底板10上定位並塗佈一錫膏，接 丨該上板20裝置於該1C基板40上，再使一電子零件裝設於該Ic美板 • 40上，並添加該壓板3〇於該上板2〇上並使該電子零件定位，最彳^ 入錫爐中。所以當將1C基板40夾持定位在該底板10、上板2〇間， 最後再將壓板30壓上貼合，利用此三件式治具可將IC基板壓平坦， 而改善1C基板於進錫爐前後的變形問題，使良率能夠提升。 綜上所述，本創作使用三件式治具可以改善1(:基板變形，而且利 用壓板壓制該1C基板，於進錫爐前後均能有效解決IC基板變形，使 良率提升，符合新型專利要件，爰依法提出申請。 9On the two 〇, then 疋: 2: set = plate will be two base, Z 10 of the first positioning element U, 12, n with 44 corresponding to the bottom plate 1C ^ 40 1 〇 6 M326762 id: The positioning element is a positioning hole and the second positioning element is a positioning post, which can also achieve a 4-effect structure, which is also the spirit of the protection of the present invention. As the operation, the good 1C substrate 40 deformation 'improves the yield, and before and after entering the tin furnace can have ^ set 'this creation is a three-piece jig' including the - platen 30 ffc substrate 4 题 the problem makes the IC substrate 40 can be effective The upper plate 20 and the pressure plate 30 can be smoothly fitted. The upper plate 20 is provided with a gift element m 25, 26, 27, 28' on the surface of the upper plate 20, and the pressure plate 3A corresponds to the third positioning 7 25, 26, 27, 28 combination. Of course, such as the above, such as magnets. The bottom plate 1Q and the upper plate 20 of the embodiment are designed with a positioning hole, and the upper plate 20 and the pressing plate 30 are provided with a magnetic component, in addition to the problem of clamping and pressing the plate, and When the pressure plate 30 is close to the distance of the ^f 20 - gentry, the magnetic components of the two plates are quickly attached to the core, and the metal of the upper plate 2G and the plate 3G is made of a non-magnetic metal material. In the creative spirit of the present invention, the magnetic elements of the platen 3 are not adsorbed in the creation of the upper plate 20, and the other is magnetic. Attractive metal. "The upper plate 20 has at least one long hole 29 and the right side of the long hole 29 is two right $ | - the first-stage box, and the input L 29 _ both ends are provided to have ^ the button 30 has - the base 35 can be set At least one ear portion 351 is respectively disposed on the two sides of the first step portion 35 of the long hole 4 for providing the first step portion 291 and the second step portion 292 for providing the enemy 3 white material: 2 = i ; 合 合 on the upper plate 20 ' as shown in the first figure. For the 2 ϊ ί - it = 1, the first '291 or the first : _ ϊϊ ί = i = ^ 27, 28 ' The ear portion 351 of the pressure plate 30 is provided with a fourth positioning member 31, q9, w corresponding to the second jaw member 25, 26, 27, 28. The position of the positioning member of the embodiment can be designed according to the actual state. The third positioning element M326762. The pieces 25, 26, 27, 28 and the fourth positioning element 31, 32, 33, 34 are magnetic elements, such as magnets, as described above, so the second step 292 and the ear portion 351 The design, together with the design of the magnetic component, allows the pressure plate 30 to be quickly and smoothly combined with the upper plate 2 。. Moreover, the long hole 29 is provided with a plurality of regions, so that the corresponding plate of the IC substrate 4 can be Properly provide electronic parts The bottom plate 10 is provided with a plurality of heat dissipation holes 15 for facilitating rapid heat dissipation in the high temperature working ring, and the bottom plate 10 is provided with a plurality of perforations 16 which can be provided and = not shown) from the perforations 16 The 1C substrate 40 is clamped and positioned. ^ The figure shows that the hybrid 1G and the social panel 2G are designed to make the pillar holes, and the upper plate 20 and the pressure plate 30 are treated by magnetic components. The combined effect of the product. ~ $^二 Please refer to the second figure for the second implementation of the fixture for the manufacture of the Ic substrate. The structure of the implementation is as follows: the _ is _, the solitude lies in: a plurality of first positioning elements u, 12, 13, 14 ^ The positions of the first positioning elements U, 12, 13, 14 are provided with a plurality of second predetermined == 22, 23, 24, and the first The positioning member u, 12, 13, u can be combined with the pressure plate 30, the first step portion 291 or the second step portion 2 to the component 26, 27, 28, and the ear portion 351 of the pressure plate 3 ^^3 The fourth positioning elements 31, 32, 33, 34 ", " of the two clamping elements 25, 26, 27, 28, wherein the first positioning elements U, 12, 13, 14 are a positioning ° — Positioning element 2, 22, 23, 24 are - positioning holes, so when the upper plate ^ = =, the positioning hole will be placed on the positioning post combined with = = positioning on the positioning. The embodiment is that the first positioning is a clamping hole, and the second positioning elements 21, 22 can also reach an equivalent structure. The Μ system is a 疋 position, and the M326762 • ι 设有 is provided with a plurality of first positioning elements 侏1! 10, _ the first positioning element 11, 12, n 1 L 14 ' and the upper plate 20 corresponds to -22, 23, 24 ' with the second and second plurality of second position elements 2 The platen 30 can be combined, and the first order A = , 13, 14 is combined. The upper plate 20, the positional elements 25, 26, 27, 28H, the second-order portion 292 are provided with at least the third positioning member 25, 26, 27, 28 ^ of the ear portion 351 is provided corresponding to the third Gans ## The four fourth positioning elements 31, 32, 33, 34 of _^8. Positioning the i pieces ϊ 弟 brother 22H/1, 12, 13, 14 is a magnetic element, and when the second board is 1, the current magnetic I: is a magnetic element, so when the upper plate 20 and the bottom 12 attracts the combination. In another embodiment, the first predetermined component is a magnetically attracted metal, or the first positioning component 1 12, the metal, and the second stator 21, 22, 23, and Z4 are magnetic components. , can also achieve the equivalent structure. In this embodiment, the bottom plate 10 and the upper plate 20 are provided with magnetic components. Referring to the fourth figure, the jig for manufacturing the Ic substrate is a three-dimensional schematic view, and the jig for making the ic substrate is first The bottom plate 10 is mounted on a track (not shown), and then the 1C substrate 40 is mounted on the bottom plate 10 to be positioned and coated with a solder paste, and the upper plate 20 is attached to the 1C substrate 40, and then An electronic component is mounted on the Ic board 40, and the platen 3 is added to the upper plate 2, and the electronic component is positioned and finally inserted into the tin furnace. Therefore, when the 1C substrate 40 is clamped Positioned between the bottom plate 10 and the upper plate 2, and finally press and press the pressing plate 30. The three-piece jig can be used to flatten the IC substrate, thereby improving the deformation of the 1C substrate before and after entering the soldering furnace. The yield can be improved. In summary, the creation of the three-piece jig can improve 1 (: substrate deformation, and the 1C substrate is pressed by the pressing plate, and the deformation of the IC substrate can be effectively solved before and after entering the tin furnace, so that the yield is improved. Upgrade, in line with new patent requirements, and apply in accordance with the law.