CN102480839A

CN102480839A - Holding device

Info

Publication number: CN102480839A
Application number: CN201010554550XA
Authority: CN
Inventors: 郑建邦
Original assignee: Fukui Precision Component Shenzhen Co Ltd; Zhending Technology Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Zhending Technology Co Ltd
Priority date: 2010-11-24
Filing date: 2010-11-24
Publication date: 2012-05-30

Abstract

The invention relates to a holding device for holding a flexible circuit board with a region to be radiated and heated so as to radiate and heat the flexible circuit board. The holding device comprises a bearing plate, a plurality of magnetic parts and a covering plate. The bearing plate is used for bearing the flexible circuit board. The covering plate comprises a top plate capable of attracted by a magnetic force and a reflective film formed on the surface of the top plate. The covering plate is provided with an opening corresponding to the region to be radiated and heated. The opening runs through the top plate and the reflective film. The reflective film is used for reflecting radiation rays. A plurality of magnetic parts are all embedded on the bearing plate and are used for generating the magnetic force to attract the top plate so as to hold the flexible circuit board between the bearing plate and the covering plate and improve the processing yield when the flexible circuit board is radiated and heated.

Description

Holding unit

Technical field

The present invention relates to the flexible PCB manufacture technology field, relate in particular to a kind of holding unit that the fixing flexible PCB carries out radiation heating that is used for.

Background technology

Along with the development of electronic product toward short and small light direction, (Surface MountedTechnology SMT) becomes the technological electronics packaging technology of new generation of instead through-holes plug-in mounting to surface mounting technology.Adopt surface mounting technology can reduce the volume of electronic devices and components significantly, help realizing the electronic product assembling of high density, miniaturization.

Surface mounting technology mainly comprises operations such as paste solder printing, device storing, reflow soldering.Paste solder printing is meant on the weld pad of tin cream through mould printing to the flexible PCB of predetermined pattern; Device is put on the weld pad of flexible PCB that the pin be meant electronic devices and components is positioned over tin cream out of the press; Reflow soldering is meant and places the reflow stove to heat flexible PCB, realizes machinery and is electrically connected between electronic devices and components pin and the flexible circuit board weld pad thereby the fusing tin cream makes.Surface mounting technology all has point-device requirement to paste solder printing figure, device storing position; In case it is not accurate enough that paste solder printing figure, device are put the position; Bad connection between electronic devices and components pin and the flexible circuit board weld pad will be caused, seriously product rejection will be caused.Owing to be prone to take place buckling deformation during the flexible PCB heating; Cause the electronic devices and components that are positioned over the flexible PCB surface that off normal also takes place, so, cause 20%～30% fraction defective usually; Reduce the surface-pasted efficient of flexible PCB, increased production cost.

Summary of the invention

Therefore, be necessary to provide a kind of holding unit, the processing yield during with raising flexible PCB radiation heating.

A kind of holding unit is used for fixing and has the flexible PCB of treating the radiation heating district with to said flexible PCB radiation heating.Said holding unit comprises a loading plate, a plurality of magnetic part and an overlay.Said loading plate is used to carry flexible PCB.Said overlay comprises can be by the top board of magnetic attraction and the reflectance coating that is formed at the top board surface.Said overlay offers and treats radiation heating district corresponding opening, and said opening runs through said top board and reflectance coating.Said reflectance coating is used for reflected radiation light.Said a plurality of magnetic part all is embedded at said loading plate, is used to produce the said top board of magnetic attraction, so that said flexible PCB is immobilizated between said loading plate and the overlay.

The loading plate of the holding unit of present technique scheme is embedded with magnetic part, and overlay has reflectance coating.When using this holding unit fixing flexible PCB to carry out radiation heating, the adelphotaxy of overlay and magnetic part is the fixing flexible PCB entirely.Reflectance coating can protect the subregion beyond the radiation heating district of treating of flexible PCB not to be heated, and can save energy, avoids flexible PCB generation buckling deformation, the processing yield when improving the flexible PCB radiation heating.

Description of drawings

Fig. 1 is the structural representation of the decomposing state of the holding unit that provides of present technique scheme.

Fig. 2 is the structural representation of the assembled state of the holding unit that provides of present technique scheme.

Fig. 3 is to use the structural representation of above-mentioned holding unit fixing flexible PCB.

The main element symbol description

Holding unit 10

Loading plate 11

Base plate 110

Reference column 111

Loading end 112

Accepting hole 113

Sidewall 114

Diapire 115

Magnetic part 12

Overlay 13

Top board 130

Reflectance coating 131

First surface 132

Second surface 133

First joint face 134

Second joint face 135

The 3rd joint face 136

The 4th joint face 137

Location hole 138

Opening 139

Flexible PCB 100

Registration holes 101

Treat radiation heating district 102

Embodiment

Below will combine accompanying drawing and embodiment, the holding unit of present technique scheme will be elaborated.

Please consult Fig. 1 and Fig. 2 in the lump, the present technique scheme provides a kind of holding unit 10, is used for fixing and has the flexible PCB of treating the radiation heating district with to said flexible PCB radiation heating.Said holding unit 10 comprises a loading plate 11, a plurality of magnetic part 12 and an overlay 13.

Said loading plate 11 is used to carry flexible PCB.Said loading plate 11 comprises a base plate 110 and a plurality of reference columns 111 that extend from said base plate 110.Said base plate 110 can be the cuboid plate, and its thickness is 4 millimeters to 5 millimeters.Said base plate 110 has the loading end 112 that is used to carry flexible PCB.Said base plate 110 is offered a plurality of accepting holes 113 from said loading end 112.Said a plurality of accepting hole 113 is blind hole, does not promptly run through base plate 110 and said loading end 112 facing surfaces.Each accepting hole 113 includes the sidewall 114 and diapire 115 that is connected.In the present embodiment, the quantity of said reference column 111 is four, and each reference column 111 is all from a drift angle place vertical extent near said loading end 112.

Said a plurality of magnetic part 12 all is embedded at said loading plate 11, is used to produce the said overlay 13 of magnetic attraction, so that said flexible PCB is immobilizated between said overlay 13 and the loading plate 11.Said a plurality of magnetic part 12 is corresponding one by one with said a plurality of accepting holes 113, and each magnetic part 12 all is contained in the accepting hole 113.Said a plurality of magnetic part 12 is magnet; Said magnet can be rare earth permanent-magnetic materials such as NdFeB rear-earth alloy; Can also be that permanent-magnet alloy, strontium ferrite are ferrite permanent-magnet materials such as permanent-magnet alloy for barium ferrite also for Al-Ni-Co series permanent-magnet alloy, siderochrome cobalt are metal permanent magnetic materials such as permanent-magnet alloy.In the present embodiment, magnetic part 12 is all processed by neodymium iron boron.

Said overlay 13 comprises can be by the top board 130 of magnetic attraction and the reflectance coating 131 that is formed at said top board 130 surfaces.The thickness sum of said top board 130 and reflectance coating 131 is preferably 0.12 millimeter to 0.15 millimeter.Said top board 130 is all or part of to be processed by magnetic material, so top board 130 has magnetic, can be by the magnetic attraction of magnetic part 12.In the present technique scheme, said magnetic material comprises ferrimagnet, ferrimagnetic material and other magnetically ordered materials.Particularly, the magnetic material in the present technique scheme is meant that relative permeability is more than or equal to 10 material.In the present embodiment, the material of top board 130 is the stainless steel with magnetic, like ferritic stainless steel, martensitic stain less steel etc.In the present embodiment, with said base plate 110 shapes accordingly, said top board 130 also is the cuboid plate.Said top board 130 comprises first surface 132, second surface 133, first joint face 134, second joint face 135, the 3rd joint face 136 and the 4th joint face 137.Said second surface 133 is relative with first surface 132.Said first joint face 134, second joint face 135, the 3rd joint face 136 and the 4th joint face 137 are end to end, and all are connected between said first surface 132 and the second surface 133.Said first surface 132 is used for contacting with said flexible PCB.Said reflectance coating 131 is formed at said second surface 133.Said reflectance coating 131 is used for reflected radiation light to protect the zone beyond the radiation heating district of treating of said flexible PCB.The material of said reflectance coating 131 is preferably silver, is formed on the said top board 130 through modes such as vapour depositions.When said holding unit 10 fixings flexible PCB and carried out radiation heating, reflectance coating 131 can reflect away heating light, thereby made the be reflected part of film 131 protections of flexible PCB can not be heated, and saved energy, avoided flexible PCB generation warpage.Said overlay 13 also has a plurality of location holes 138 and a plurality of openings 139.Said a plurality of location hole 138 all runs through said top board 130 and reflectance coating 131 with a plurality of openings 139.Said a plurality of location hole 138 is corresponding one by one with said a plurality of reference columns 111, and each location hole 138 is all offered near a drift angle of said top board 130, thereby can be sheathed on the reference column 111 of a correspondence.Said a plurality of opening 139 treats that with flexible PCB the radiation heating district is corresponding, and what be used to expose flexible PCB treats that the radiation heating district is to heat.The difference of the size of said a plurality of opening 139 and distribution situation electronic component to be mounted on can the flexible PCB according to actual production is done corresponding design.Preferably, the distribution of said accepting hole 113 and magnetic part 12 is avoided over against the part of opening 139.

Certainly, said reflectance coating 131 can also further cover first joint face 134, second joint face 135, the 3rd joint face 136 and the 4th joint face 137, thereby can further save energy.

Please consult Fig. 1 and Fig. 3 in the lump, below will carry out surface mount and be example, the method for using of the holding unit 10 that the present technique scheme provides is described, particularly, can take following steps with the holding unit 10 fixing flexible PCBs that use the present technique scheme:

At first, flexible PCB 100 is provided, it has a plurality of registration holes 101 and a plurality of radiation heating district 102 that treats.The quantity of said a plurality of registration holes 101 is four, and each registration holes 101 is all near a drift angle of said flexible PCB 100.The said radiation heating district 102 that treats can form tin cream through modes such as printings in advance.

Secondly, make a plurality of reference columns 111 of the said loading plate 11 of a plurality of registration holes 101 alignings of flexible PCB 100, flexible PCB 100 is carried on loading plate 11.

Once more, make a plurality of reference columns 111 of the said loading plate 11 of a plurality of location holes 138 alignings of overlay 13, overlay 13 is covered in flexible PCB 100 tops on the loading plate 11.Because a plurality of magnetic parts 12 have magnetic field, overlay 13 is produced the magnetic attraction effect, this magnetic attraction effect can be suppressed flexible PCB 100, and flexible PCB 100 is entirely placed between overlay 13 and the loading plate 11.The radiation heating district 102 that treats of flexible PCB 100 is exposed to the opening 139 of overlay 13.

At last, place electronic components, and the flexible PCB 100 that will be immobilizated in holding unit 10 carries out radiation heating,, realize mounting of electronic component with molten tin and fixed electronic element toward the radiation heating district 102 of treating of said flexible PCB 100.

When heating light; As, when irradiation holding unit 10 such as infrared ray and flexible PCB 100, because the reflex of reflectance coating 131; Only treat on the flexible PCB 100 that radiation heating district 102 is by fully heating; And other zones can not be heated, thereby can save energy, avoid flexible PCB 100 other zones that buckling deformation takes place.

The loading plate of the holding unit 10 of present technique scheme is embedded with magnetic part 12, and overlay 13 has reflectance coating 131.When using these holding unit 10 fixing flexible PCBs 100 to carry out radiation heating, the adelphotaxy of overlay 13 and magnetic part 12 is fixing flexible PCB 100 entirely.Reflectance coating 131 can protect the subregion beyond the radiation heating district of treating of flexible PCB 100 not to be heated, and can save energy, avoids flexible PCB generation buckling deformation, the processing yield when improving the flexible PCB radiation heating.

It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection range that all should belong to present technique scheme claim with distortion according to the technical conceive of present technique scheme.

Claims

1. holding unit; Be used for fixing and have the flexible PCB of treating the radiation heating district with to said flexible PCB radiation heating; Said holding unit comprises a loading plate, a plurality of magnetic part and an overlay, and said loading plate is used to carry flexible PCB, and said overlay comprises can be by the top board of magnetic attraction and the reflectance coating that is formed at the top board surface; Said overlay offers and treats radiation heating district corresponding opening; Said opening runs through said top board and reflectance coating, and said reflectance coating is used for reflected radiation light, and said a plurality of magnetic parts all are embedded at said loading plate; Be used to produce the said top board of magnetic attraction, so that said flexible PCB is immobilizated between said loading plate and the overlay.

2. holding unit as claimed in claim 1 is characterized in that said top board is processed by magnetic material, and said magnetic material comprises ferrimagnet, ferrimagnetic material and magnetically ordered materials, and said a plurality of magnetic parts are magnet.

3. holding unit as claimed in claim 1 is characterized in that, the material of said reflectance coating is a silver.

4. holding unit as claimed in claim 1; It is characterized in that; Said loading plate comprises a base plate and a plurality of reference columns that extend from said base plate, and said overlay also has a plurality of location holes that run through said top board and reflectance coating, and said a plurality of location holes are corresponding one by one with said a plurality of reference columns.

5. holding unit as claimed in claim 4 is characterized in that, the thickness of said base plate is 4 millimeters to 5 millimeters.

6. holding unit as claimed in claim 1; It is characterized in that; Said loading plate has the loading end that is used to carry flexible PCB; Said loading plate is offered a plurality of accepting holes from said loading end, and said a plurality of accepting holes are corresponding one by one with said a plurality of magnetic parts, and each magnetic part all is contained in the accepting hole.

7. holding unit as claimed in claim 1; It is characterized in that said top board comprises opposite first and second surface, said first surface is near said loading plate; Be used for contacting with said flexible PCB, said reflectance coating is formed at said second surface.

8. holding unit as claimed in claim 7 is characterized in that said top board also comprises a plurality of joint faces, and said a plurality of joint faces are end to end, and all is connected between said first surface and the second surface, and said reflectance coating also is formed at said a plurality of joint face.

9. holding unit as claimed in claim 1 is characterized in that, the thickness sum of said top board and reflectance coating is 0.12 millimeter to 0.15 millimeter.