JP2018093053A - Shield structure, electronic apparatus, and manufacturing method of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shield structure having a shield cover which can be easily removed while satisfactorily shielding an electronic component.SOLUTION: An electronic apparatus (1) mounted on a base plate (2), includes: a shield frame (11) which has a side wall enclosing an electronic component (3); and a shield cover (12) that covers an opening of a shield frame (11) being joined to the upper end of the shield frame (11) by means of solder (14).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a shield structure, an electronic device, and a method for manufacturing the electronic device.

  Conventionally, a shield structure for preventing emission of noise from an electronic component or inflow of noise into the electronic component is often provided on a substrate on which the electronic component is mounted. This shield structure can also prevent emission from the wiring pattern on the substrate or inflow of noise into the wiring pattern.

  Several different structures are known as conventional shield structures. For example, the conventional shield structure according to the first example includes a shield frame that is mounted at a position surrounding an electronic component on a substrate, and a shield cover that is fitted into the shield frame so as to close the opening above the shield frame. Such a shield structure is disclosed in Patent Document 1, for example. In the shield structure of the first example, since the shield cover is mechanically attached to the shield frame, the shield cover can be easily detached from the shield frame. Therefore, when it is necessary to repair or replace electronic components in the shield structure at the time of mass production of electronic equipment, it is possible to easily cope with it.

  The conventional shield structure according to the second example is manufactured by processing and molding a single metal plate or the like. Unlike the first example, the shield structure according to the second example does not have a fitting portion between the shield cover and the shield frame, so that a gap can be substantially eliminated in the upper part of the shield structure. Therefore, the shield structure can shield the electronic component with high shielding properties.

JP 2009-231343 A (released on October 8, 2009)

  In the electronic device having the shield structure of the first example, when the dimensions of the shield frame and the shield cover vary, a slight gap may occur between the shield frame and the shield cover. This gap may also occur when there is a variation in the accuracy of work when attaching the shield cover to the shield frame. Since high-frequency noise can easily pass through even a slight gap, the shielding of electronic components by the shield structure is not sufficient. Therefore, noise may adversely affect the behavior of electronic components in the shield structure.

  The shield structure of the first example has a mechanism for pressing the shield cover by a spring on the side surface of the shield cover. Therefore, if the shield structure becomes complicated (a shape that combines several square parts), the contact area of the shield cover with respect to the shield frame increases, and as a result, the fitting force between the shield cover and the shield frame. Become more powerful. This makes it difficult to remove the shield cover from the shield frame.

  In the electronic apparatus provided with the shield structure of the second example, when it is necessary to repair or replace an electronic component in the shield structure, it is necessary to remove the shield structure itself from the substrate. However, since the shield structure is directly soldered to the land of the board, the board land may be peeled off unless the shield structure is removed well, and as a result, the electronic device may become unreproducible. Thus, in the electronic device having the shield structure of the second example, the shield structure cannot be easily removed.

  An object of one embodiment of the present invention is to realize a shield structure that achieves both sufficient shielding of electronic components and easy removal of a shield cover.

  In order to solve the above problems, a shield structure according to an aspect of the present invention is joined to a shield frame having a side wall surrounding an electronic component mounted on a substrate, and an upper end of the shield frame via solder, And a shield cover for closing the opening of the shield frame.

  An electronic device according to one embodiment of the present invention includes the shield structure according to one embodiment of the present invention.

  In order to solve the above problems, an electronic device manufacturing method according to an aspect of the present invention includes an electronic component mounted on a substrate and a first solder installed at a position surrounding the electronic component on the substrate. A step of providing a substrate having a side wall that surrounds the electronic component, and a step of installing a shield frame on the upper end of the second solder on the first solder, and a shield cover On the second solder, and reflowing the substrate on which the shield frame and the shield cover are installed.

  In order to solve the above problems, an electronic device manufacturing method according to an aspect of the present invention includes an electronic component mounted on a substrate and a first solder installed at a position surrounding the electronic component on the substrate. Preparing a substrate having: a step of installing a shield frame having a side wall surrounding the electronic component on the first solder; a step of installing a second solder on the upper end of the shield frame; The method includes a step of installing a shield cover on the second solder, and a step of reflowing the substrate on which the shield frame and the shield cover are installed.

  According to one aspect of the present invention, it is possible to realize a shield structure that achieves both sufficient shielding of electronic components and easy removal of the shield cover.

It is a perspective view which shows the structure of the electronic device which concerns on Embodiment 1 of this invention. It is a figure explaining the manufacturing method of an electronic device. It is a figure explaining the advantage of the electronic device of Embodiment 1. FIG. It is a figure explaining the manufacturing method of the electronic device which concerns on Embodiment 2 of this invention. It is a figure showing the shield cover concerning Embodiment 3 of this invention.

  Hereinafter, embodiments of the present invention will be described in detail. However, the configurations and combinations thereof described in the following embodiments are merely illustrative examples, and are not intended to limit the scope of the present invention only to the configurations, unless otherwise specified. In the drawings described below, components having the same function are denoted by the same reference numerals, and repeated description thereof is omitted.

Embodiment 1
An embodiment of the present invention will be described with reference to FIGS.

(Configuration of electronic device 1)
FIG. 1 is a perspective view showing a configuration of an electronic apparatus 1 according to Embodiment 1 of the present invention. The electronic device 1 includes a substrate 2, an electronic component 3, and a shield structure 10. The shield structure 10 includes a shield frame 11 and a shield cover 12.

  The electronic device 1 is various portable terminal devices such as a mobile phone, a smartphone, and a tablet terminal. The substrate 2 is, for example, a hard (laminated) substrate. An electronic component 3 is mounted on the substrate 2. The electronic component 3 is various components that constitute an electronic circuit included in the electronic device 1. The electronic component 3 includes a plurality of electronic components (first electronic component 3A, second electronic component 3B, and third electronic component 3C). Not only this but the electronic component 3 may be a single electronic component.

  The shield structure 10 shields the electronic component 3 from the outside. The shield frame 11 and the shield cover 12 are both made of a conductive material such as metal. The shield frame 11 is mounted on the substrate 2. The lower end of the shield frame 11 is joined to the land of the substrate 2 (not shown) with solder 13. The shield frame 11 has a side wall that surrounds the electronic component 3. More specifically, the shield frame 11 includes a plurality of side walls (first side wall 11A, second side wall) that define a plurality of sections (first section 21A, second section 21B, and third section 21C) on the substrate. 11B and a third side wall 11C). The first electronic component 3A, the second electronic component 3B, and the third electronic component 3C are mounted on the first section 21A, the second section 21B, and the third section 21C of the substrate 2, respectively.

  The shield cover 12 is joined to the upper end of the shield frame 11 through the solder 14 without any gap. The shield cover 12 includes a plurality of flat shield covers (first shield cover 12A, second shield cover 12B, and third shield cover 12C). The first shield cover 12A closes the opening on the upper end side of the first side wall 11A. The second shield cover 12B closes the opening on the upper end side of the second side wall 11B. The third shield cover 12C closes the opening on the upper end side of the third side wall 11C.

(Method for manufacturing electronic device 1)
FIG. 2 is a diagram illustrating a method for manufacturing the electronic device 1. FIG. 2A shows the substrate 2. FIG. 2B shows the installation of the shield frame 11 on the substrate 2. FIG. 2C shows the installation of the shield cover 12 on the shield frame 11. FIG. 2D shows the manufactured electronic device 1.

  First, as shown in FIG. 2A, a substrate 2 is prepared. A plurality of electronic components 3 are mounted on the substrate 2. A land (not shown) is provided at a position surrounding each electronic component 3 on the substrate 2. Solder 15 (first solder) is provided on the land. The solder 15 is used for mounting the shield frame 11 on the substrate 2.

  Next, as shown in FIG. 2B, a shield frame 11 is prepared. A solder ball 16 (second solder) is provided in advance on the entire periphery of the upper end of the shield frame 11. More specifically, solder balls 16 are provided in advance on the entire periphery of each upper end of the first side wall 11A, the second side wall 11B, and the third side wall 11C. The solder ball 16 is used for joining the shield cover 12 to the shield frame 11. For example, a conductive adhesive is used for installing the solder balls 16. Specifically, a conductive adhesive may be applied to the upper end of the shield frame 11, and the solder ball 16 may be installed thereon. The solder ball 16 may be installed at the upper end of the shield frame 11 to such an extent that the solder ball 16 is held at the upper end of the shield frame 11 until the joining of the shield frame 11 and the shield cover 12 is started. The mounting may be such that the solder balls 16 are temporarily fixed to the upper end of the shield frame 11. That is, it is not necessary to firmly fix the solder ball 16 to the upper end of the shield frame 11.

  Next, as shown in FIG. 2B, the shield frame 11 on which the solder balls 16 are mounted is placed on the substrate 2. At this time, the shield frame 11 is installed on the substrate 2 so that the lower end of the shield frame 11 is in contact with the solder 15 on the substrate 2. Thus, as shown in FIG. 2C, the first side wall 11A surrounds the first electronic component 3A, the second side wall 11B surrounds the second electronic component 3B, and the third side wall 11C is the third electronic component. The part 3C is surrounded.

  Next, as shown in FIG. 2C, the shield cover 12 is installed on the upper end of the shield frame 11. More specifically, the first shield cover 12A is installed at the upper end of the first side wall 11A, the second shield cover 12B is installed at the upper end of the second side wall 11B, and the third shield cover 12C is installed at the upper end of the third side wall 11C. Install in.

  Next, the substrate 2 on which the shield frame 11 and the shield cover are installed is reflowed in a reflow furnace. Thereby, the solder 15 and the solder ball 16 are melted by being simultaneously heated. The melted solder 15 and solder balls 16 are hardened by a subsequent temperature drop. As a result, the land of the substrate 2 and the shield frame 11 are joined by the solder 13, and the shield frame 11 and the shield cover 12 are joined by the solder 14, and the electronic device 1 shown in FIG. 2D is obtained. .

  The solder ball 16 is installed over the entire upper end of the first side wall 11A, the second side wall 11B, and the third side wall 11C. For this reason, the openings of the first section 21A, the second section 21B, and the third section 21C are closed without gaps by the first shield cover 12A, the second shield cover 12B, and the third shield cover 12C, respectively.

(Advantages of shield structure 10)
FIG. 3 is a diagram illustrating advantages of the shield structure 10 according to the first embodiment. FIG. 3A shows an A-B cross section of the electronic apparatus 1 shown in FIG. FIG. 3B is a cross-sectional view of the electronic device 4 including the shield structure 40 in which the shield cover 42 is fitted to the shield frame 41 according to the related art.

  As shown in FIG. 3B, in the shield structure 40 according to the related art, a gap 43 may be generated between the shield frame 41 and the shield cover 42. This is due to variations in the dimensions of the shield frame 41 and the shield cover 42, or variations in accuracy when the shield cover 42 is attached to the shield frame 41. High frequency noise easily passes through the gap 43. Therefore, there is a possibility that noise from an electronic component arranged inside the shield structure 40 is emitted to the outside of the shield structure 40, or noise flows into the electronic device from the outside of the shield structure 40. Furthermore, the potential of the non-contact portion of the shield frame 41 in the shield cover 42 is higher than the ground potential in terms of high frequency. Unnecessary noise is radiated from a non-contact portion floating from the ground at a high frequency, which may adversely affect electronic components.

  On the other hand, as shown in FIG. 3A, in the shield structure 10 according to this embodiment, the shield cover 12 is joined to the shield frame 11 by solder 14. Thereby, since a gap does not occur between the shield cover 12 and the shield frame 11, the shield structure 10 can shield the electronic component 3 from the outside with high shielding properties. Accordingly, noise from the electronic component 3 can be prevented from being radiated to the outside of the shield structure 10. Furthermore, noise outside the shield structure 10 can be prevented from flowing into the electronic component 3. Further, since the shield cover 12 is completely in contact with the shield frame 11 at the upper end of the shield frame 11, noise is radiated from the shield cover 12, and there is no possibility that this adversely affects the electronic component 3.

  In the electronic device 1, when it is necessary to replace the electronic component 3, if the solder 14 is heated, the shield cover 12 can be removed from the shield frame 11 after the solder 14 is sufficiently melted. For example, a spot heater is used to heat the solder 14. After the solder 14 is melted by heating, the melted solder 14 is sucked by a jig capable of sucking the solder 14 at an arbitrary position on the upper end of the shield frame 11. As a result, the solder 14 at an arbitrary location between the shield frame 11 and the shield cover 12 can be removed. Therefore, the shield cover 12 can be easily removed from the shield frame 11. After the repair or the like is completed, the solder ball 16 is installed again on the upper end of the shield frame 11, the shield cover 12 is installed thereon, and the solder ball 16 is heated with a spot heater. Thereby, the shield cover 12 can be joined to the shield frame 11 again.

  In the electronic device 1, it is not necessary to remove the shield frame 11 from the substrate 2 for repairing the electronic component 3 or the like. Since the solder 13 on the land of the substrate 2 is not heated to remove the shield cover 12, there is no possibility that the land of the substrate 2 is peeled off when the shield cover 12 is removed from the shield frame 11. Therefore, the shield cover 12 can be easily removed.

  As described above, according to the present embodiment, it is possible to realize the shield structure 10 that achieves both sufficient shielding of the electronic component 3 and easy removal of the shield cover 12. Furthermore, the electronic device 1 including the shield structure 10 can also be realized.

  The first shield cover 12A, the second shield cover 12B, and the third shield cover 12C can be individually removed from the shield frame 11. For example, when the first electronic component 3A needs to be repaired, the second shield cover 12B and the third shield cover can be obtained by heating only the solder 14 between the first shield cover 12A and the first side wall 11A. In a state where 12C is bonded to the shield frame 11, only the first shield cover 12A can be removed. As described above, the operation of removing only the first shield cover 12 </ b> A that needs to be removed is simpler than the operation of removing the entire shield cover 12.

(Advantages of manufacturing)
The manufacturing method according to the present invention does not require a step of joining the shield cover 12 to the shield frame 11 mounted on the substrate 2. Therefore, the number of processes included in the method for manufacturing the electronic device 1 can be reduced as compared with the conventional manufacturing method that requires the shield cover to be fitted to the shield frame.

  The manufacturer of the shield frame 11 can deliver the shield frame 11 on which the solder balls 16 are installed to the manufacturer of the electronic device 1. Therefore, the manufacturer of the electronic device 1 does not need to install the solder ball 16 on the shield frame 11. Thereby, the manufacturing method of the electronic device 1 performed by the manufacturer of the electronic device 1 can be simplified.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIG.

  The present embodiment is different from the first embodiment in that cream solder 17 is used instead of the solder balls 16 when the electronic apparatus 1 is manufactured. The structure and function of the completed electronic device 1 are the same as those in the first embodiment.

  FIG. 4 is a diagram illustrating a method for manufacturing the electronic device 1 according to the second embodiment of the present invention. FIG. 4A shows the substrate 2. FIG. 4B shows the installation of the shield frame 11 on the substrate 2. FIG. 4C shows the application of the cream solder 17 to the shield frame 11. FIG. 4D shows the installation of the shield cover 12 on the shield frame 11.

  First, as shown in FIG. 4A, a substrate 2 is prepared as in the first embodiment. Subsequently, as shown in FIG. 4B, the shield frame 11 is installed on the land of the substrate 2. At this time, the cream solder 17 is not applied to the upper end of the shield frame 11. Next, as shown in FIG. 4C, cream solder 17 is applied over the entire circumference of the upper end of the shield frame 11 installed on the substrate 2. At this time, the cream solder 17 can be applied using, for example, a dispenser or a metal mask. Next, as shown in FIG. 4D, as in the first embodiment, the shield cover 12 is installed on the upper end of the shield frame 11 to which the cream solder 17 is applied. Finally, as in the first embodiment, the substrate 2 on which the shield frame 11 and the shield cover 12 are installed is reflowed. Thereby, the electronic device 1 is obtained.

  In the present embodiment, for example, when the first shield cover 12A is removed once and then attached to the shield frame 11 again, for example, for repair of the electronic component 3, it is attached again by appropriately adjusting the amount of cream solder 17 applied. The height of the subsequent first shield cover 12A can be easily adjusted to the height of the already installed second shield cover 12B and third shield cover 12C.

[Embodiment 3]
The following will describe another embodiment of the present invention with reference to FIG.

  FIG. 5 is a diagram illustrating the shield cover 12 according to the third embodiment of the present invention. FIG. 5A shows the first shield cover 12 </ b> A having the convex portion 31. FIG. 5B shows the first shield cover 12 </ b> A having the recess 32.

(Utilization of convex part 31)
In FIG. 5A, the first shield cover 12 </ b> A has a convex portion 31. The convex portion 31 protrudes in a direction away from the substrate 2 from the periphery of the convex portion 31 in the first shield cover 12A. The convex portion 31 can be formed, for example, by drawing a partial region of the flat plate-like first shield cover 12A.

  The position where the convex part 31 exists in the first section 21 </ b> A is higher than the position where the convex part 31 does not exist. Therefore, the electronic component 3 that is taller than the other electronic components 3 can be mounted at a position corresponding to the convex portion 31. Furthermore, the electronic component 3 whose characteristics deteriorate when approaching a metal can be mounted at a position corresponding to the convex portion 31. In this case, since a certain distance can be maintained between the electronic component 3 and the first shield cover 12A, it is possible to prevent the characteristics of the electronic component 3 from being deteriorated.

(Utilization of recess 32)
In FIG. 5B, the first shield cover 12 </ b> A has a recess 32. The concave portion 32 is recessed in a direction closer to the substrate 2 than the periphery of the convex portion 31 in the first shield cover 12A. The recess 32 can be formed, for example, by drawing a part of the flat first shield cover 12A.

  The position where the concave portion 32 exists in the first section 21 </ b> A is lower than the position where the concave portion 32 does not exist. In the electronic device 1, the recess 32 can be utilized as follows.

  In the electronic device 1, the shield structure 10 and a ground formed by a metal frame of the electronic device 1 (not shown) are often connected by a conductive gasket. The gasket mainly has two roles of bringing the shield structure 10 electrically close to the ground potential and releasing the heat generated by the substrate 2 to the ground.

  The gasket is usually fixed to the shield structure 10 using tape. If the tape is too large, the contact area of the gasket with the shield structure 10 is reduced. In this case, since the area where the shield structure 10 contacts the ground is also reduced, it is difficult to bring the potential of the shield structure 10 close to the ground. Furthermore, it becomes difficult for heat to escape from the shield structure 10 to the metal frame. On the contrary, if the tape is too small, the force for fixing the gasket to the shield structure 10 is weakened. In this case, the gasket may move due to an impact on the electronic device 1 or a change with time of the electronic device 1. As a result, in some cases, an electrical short occurs in another electronic circuit.

  Therefore, in this embodiment, a gasket is disposed in the recess 32. In this case, since the gasket can be prevented from moving, the tape for fixing the gasket to the shield structure 10 can be made smaller. Therefore, the area of the location where the gasket contacts the shield structure 10 can be further increased. As a result, the area where the shield structure 10 contacts the ground can be increased, and the heat generated from the substrate 2 can be released to the ground more effectively.

  The shield cover 12 can have at least one of the convex portion 31 and the concave portion 32. That is, the shield cover 12 may have both the convex portion 31 and the concave portion 32.

[Summary]
A shield structure (10) according to an aspect 1 of the present invention includes a shield frame (11) having side walls (11A to 11C) surrounding an electronic component (3) mounted on a substrate (2), and the shield frame. And a shield cover (12) that is joined to the upper end of the shield frame via solder (14) and closes the opening on the upper end side of the shield frame.

  According to the above configuration, the shield cover is joined to the shield frame via the solder. Further, the shield cover closes the opening on the upper end side of the shield frame. Thereby, the clearance gap between a shield frame and a shield cover can be eliminated. Therefore, the shield structure can shield the electronic component with high shielding properties.

  Furthermore, according to the above configuration, the shield cover can be removed from the shield frame by heating the solder. At this time, since it is not necessary to remove the shield frame from the substrate, it is easy to remove the shield cover.

  As described above, according to the above-described configuration, it is possible to realize a shield structure that achieves both sufficient shielding of electronic components and easy removal of the shield cover.

  The shield structure according to aspect 2 of the present invention is the shield structure according to aspect 1, wherein the shield frame has a plurality of the side walls defining a plurality of sections (21A, 21B, 21C) in a substrate, and a plurality of the electrons Each of the components (3A, 3B, 3C) is mounted on each of the plurality of sections of the substrate, and each of the plurality of shield covers (12A, 12B, 12C) is the upper end of each of the plurality of side walls. It is characterized by closing the opening on the side.

  According to the said structure, the removal operation | work of a shield cover can be simplified.

  The shield structure according to aspect 3 of the present invention is the shield structure according to aspect 1 or 2, wherein the shield cover protrudes in a direction away from the substrate from the periphery, and a direction toward the substrate from the periphery. It is characterized by having at least one of the depressed recess (32).

  According to the said structure, the space formed by a convex part or a recessed part can be utilized for various uses.

  An electronic device (1) according to aspect 4 of the present invention is characterized by including the shield structure according to any one of aspects 1 to 3.

  According to the above configuration, it is possible to realize an electronic apparatus that can sufficiently shield an electronic component and can easily remove the shield cover.

  According to a fifth aspect of the present invention, there is provided a method for manufacturing an electronic device, in which a substrate having an electronic component mounted on the substrate and a first solder (solder 15) installed at a position surrounding the electronic component on the substrate is prepared. A step of installing a shield frame having a side wall surrounding the electronic component on the first solder and having a second solder (solder ball 16) pre-installed on the upper end; and The method includes a step of installing a shield cover thereon, and a step of reflowing the substrate on which the shield frame and the shield cover are installed.

  According to the above configuration, it is possible to manufacture an electronic device that can sufficiently shield an electronic component and can easily remove the shield cover.

  According to a sixth aspect of the present invention, there is provided a method for manufacturing an electronic device, comprising: preparing a substrate having an electronic component mounted on the substrate and a first solder installed at a position surrounding the electronic component on the substrate; Installing a shield frame having a side wall surrounding the electronic component on the first solder, installing a second solder (cream solder 17) on an upper end of the shield frame, and the second solder And a step of reflowing the substrate on which the shield frame and the shield cover are installed.

  According to the above configuration, it is possible to manufacture an electronic device that can sufficiently shield an electronic component and can easily remove the shield cover.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

DESCRIPTION OF SYMBOLS 1 Electronic device, 2 Board | substrate, 3 Electronic components, 10 Shield structure, 11 Shield frame, 11A-11C Side wall, 12 Shield cover, 13 Solder, 14 Solder, 15 Solder (1st solder), 16 Solder ball (2nd solder) , 17 Cream solder (second solder), 21A to 21C partition, 31 convex part, 32 concave part

Claims (6)

A shield frame having a side wall surrounding an electronic component mounted on the substrate;
A shield structure comprising: a shield cover joined to an upper end of the shield frame via solder and closing an opening of the shield frame. The shield frame has a plurality of the side walls defining a plurality of sections in the substrate;
Each of the plurality of electronic components is mounted on each of the plurality of sections on the substrate,
The shield structure according to claim 1, wherein each of the plurality of shield covers is joined to an upper end of each of the plurality of side walls.   The said shield cover has at least one among the convex part protruded in the direction which leaves | separates from the said board | substrate rather than the circumference | surroundings, and the recessed part dented in the direction which goes to the said board | substrate rather than the circumference | surroundings. Shield structure described in.   The electronic device provided with the shield structure of any one of Claims 1-3. Preparing a substrate having an electronic component mounted on the substrate and a first solder installed at a position surrounding the electronic component on the substrate;
Installing a shield frame having a side wall surrounding the electronic component and pre-installed with a second solder at the upper end on the first solder;
Installing a shield cover on the second solder;
And reflowing the substrate on which the shield frame and the shield cover are installed. Preparing a substrate having an electronic component mounted on the substrate and a first solder installed at a position surrounding the electronic component on the substrate;
Installing a shield frame having a side wall surrounding the electronic component on the first solder;
Installing a second solder on the upper end of the shield frame;
Installing a shield cover on the second solder;
And reflowing the substrate on which the shield frame and the shield cover are installed.

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