CN211297136U - Copper-clad plate and power device - Google Patents
Copper-clad plate and power device Download PDFInfo
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- CN211297136U CN211297136U CN202020136391.0U CN202020136391U CN211297136U CN 211297136 U CN211297136 U CN 211297136U CN 202020136391 U CN202020136391 U CN 202020136391U CN 211297136 U CN211297136 U CN 211297136U
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- Prior art keywords
- copper
- substrate
- bonding portion
- base plate
- clad plate
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims description 68
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
The utility model relates to a circuit board technical field particularly, relates to a copper-clad plate and power device, including base plate and copper sheet layer, the laminating of copper sheet layer the base plate is and the parcel the extension end of the relative both sides of base plate, the copper sheet layer include parcel portion, laminate in the first bonding portion and the second bonding portion of the tow sides of base plate, parcel portion parcel the extension end is connected respectively first bonding portion and second bonding portion, parcel portion offers and is used for holding the open slot of extension end, just the thickness of the relative both sides wall of open slot the thickness homogeneous phase of first bonding portion and second bonding portion is the same, and in this scheme, copper sheet parcel base plate forms the copper sheet layer in week of base plate, and in copper sheet and base plate bonding process, the extension end of base plate can not take place the warpage by the parcel of copper sheet layer.
Description
Technical Field
The utility model relates to a circuit board technical field particularly, relates to a copper-clad plate and power device.
Background
With the further increase of current density of the current power device, a higher requirement is put forward on the heat dissipation capability of the device, in a DBC product, the inductance on the surface is increased due to the increase of the current density, the purpose is achieved by increasing the thickness of a substrate, the substrate produced by the traditional manufacturing process cannot achieve the heat dissipation requirement, the purpose can be achieved by reducing the thickness of the substrate and increasing the thickness of a copper-clad plate, but in the conventional technology, in the process of bonding the copper sheet and the substrate for two times, the edge part of the substrate is easy to warp due to the huge stress generated between the copper sheet and the substrate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a copper-clad plate and power device, it can solve copper sheet layer and base plate bonding in-process, and the marginal portion of base plate produces the warpage problem.
The embodiment of the utility model is realized like this:
the copper-clad plate comprises a substrate and a copper plate layer, wherein the copper plate layer is attached to the substrate and wraps the extending ends on two opposite sides of the substrate.
Further, in an embodiment of the present invention, the copper plate layer includes a wrapping portion, a first bonding portion and a second bonding portion attached to the front and back sides of the substrate, and the wrapping portion wraps the extending end and is connected to the first bonding portion and the second bonding portion respectively.
Further, in an embodiment of the present invention, the wrapping portion has an opening slot for accommodating the extending end, and the thickness of the two opposite sides of the opening slot is the same as the thickness of the first bonding portion and the second bonding portion.
Further, in an embodiment of the present invention, the substrate is an aluminum substrate.
Further, in an embodiment of the present invention, the substrate is a ceramic substrate.
Further, in an embodiment of the present invention, the thickness of the substrate is 0.2mm to 2 mm.
Furthermore, in an embodiment of the present invention, the substrate and the copper plate layer are disposed with an insulating oxide film therebetween, and the insulating oxide film is located on the front and back sides of the substrate.
Further, in an embodiment of the present invention, the thickness of the insulating oxide film is 0.5mm to 1 mm.
Further, in an embodiment of the present invention, the rear thickness of the copper plate layer is 0.3mm to 2 mm.
A power device is provided with the copper-clad plate.
The embodiment of the utility model provides a beneficial effect is:
the copper sheet wraps the substrate, a copper sheet layer is formed on the peripheral side of the substrate, and when the copper sheet is bonded with the substrate, the extending end of the substrate is wrapped by the copper sheet layer and cannot be warped.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic view of an embodiment of the present invention;
fig. 2 is another schematic structural diagram of the embodiment of the present invention.
Icon:
100-a substrate; 200-a copper plate layer; 300-insulating oxide film;
110-an extension end; 210-a wrapping section; 220 — a first bond; 230-a second bond; 211-open slot.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined. In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The scheme provides a copper-clad plate and a power device, wherein a copper sheet wraps a substrate 100, a copper sheet layer 200 is formed on the periphery of the substrate 100, when the copper sheet is bonded with the substrate 100, the extending ends 110 on two opposite sides of the substrate 100 are wrapped by the copper sheet layer 200 and cannot warp, the copper-clad plate is mounted on the power device, and the heat dissipation effect of the power device is ensured.
Example 1:
referring to fig. 1, the present embodiment provides a copper-clad plate and a power device, the copper-clad plate includes a substrate 100 and a copper sheet layer, the copper sheet layer includes a wrapping portion 210, a first bonding portion 220 and a second bonding portion 230, the first bonding portion 220 and the second bonding portion 230 are attached to the front and back sides of the substrate, the wrapping portion 210 wraps the extending end 110 of the substrate 100 and is connected to the first bonding portion 220 and the second bonding portion 230, respectively.
In fig. 1, the first bonding portion 220 and the second bonding portion 230 are bonded on the front and back sides of the substrate 100, the first bonding portion 220 and the second bonding portion 230 are smaller than the substrate 100, when the first bonding portion 220 and the second bonding portion 230 are bonded on the front and back sides of the substrate 100, an area of the substrate 100 close to the extending end 110 is exposed, the wrapping portion 210 is provided with an open slot 211, the extending end 110 of the substrate 100 is placed in the open slot 211, thicknesses of two opposite side walls of the open slot 211, the thickness of the first bonding portion 220 and the thickness of the second bonding portion 230 are the same, and end portions of two side walls of the open slot 211 are respectively bonded and connected with end portions of the first bonding portion 220 and the second bonding portion 230.
This application scheme also can adopt a copper parcel base plate 100, forms copper sheet layer 200 in base plate 100 week side, and parcel portion 210 is connected with first bonding portion 220 and second bonding portion 230 an organic whole respectively, guarantees that base plate 100 and copper bonding in-process, and the extension region of base plate 100 receives the parcel of copper sheet layer 200 can not take place the warpage.
In this embodiment, the substrate 100 may be a ceramic substrate 100 or an aluminum substrate 100, the thickness of the substrate 100 is 0.2mm to 2mm, the thicknesses of the substrates 100 are different, the thermal resistances are different, and the thickness of the substrate 100 can be changed according to the use requirement.
In this embodiment, the thickness of the copper plate layer 200 may be 0.3mm to 2 mm.
The embodiment also provides a power device, and the power device is provided with the copper-clad plate, so that the copper-clad plate cannot generate edge warping, and the heat dissipation effect of the power device is ensured.
Example 2:
referring to fig. 2, the present embodiment provides a copper-clad plate and a power device, the copper-clad plate includes a substrate 100, a copper plate layer 200 and an insulating oxide film 300, the copper plate layer 200 is wrapped around the substrate 100, the insulating oxide film 300 is disposed between the copper plate layer 200 and the substrate 100, the insulating oxide film 300 is disposed on two sides of the substrate 100,
in fig. 2, the first bonding portion 220 and the second bonding portion 230 are bonded on the front and back sides of the substrate 100, the first bonding portion 220 and the second bonding portion 230 are smaller than the substrate 100, when the first bonding portion 220 and the second bonding portion 230 are bonded on the front and back sides of the substrate 100, a region of the substrate 100 close to the extending end 110 is exposed, the wrapping portion 210 is provided with an open slot 211, a region near the extending end 110 of the substrate 100 and portions of the insulating oxide films 300 on the two sides of the substrate 100 are disposed in the open slot 211, thicknesses of two opposite side walls of the open slot 211, the thickness of the first bonding portion 220 and the thickness of the second bonding portion 230 are the same, and end portions of two side walls of the open slot 211 are respectively bonded and connected with end portions of the first bonding portion 220 and the second bonding portion 230.
This application scheme also can adopt a copper parcel base plate 100, forms copper sheet layer 200 in base plate 100 week side, and parcel portion 210 is connected with first bonding portion 220 and second bonding portion 230 an organic whole respectively, guarantees that base plate 100 and copper bonding in-process, and the extension region of base plate 100 receives the parcel of copper sheet layer 200 can not take place the warpage.
The insulating oxide film 300 may be provided with an insulating paste on both sides thereof, and the insulating oxide film 300 is respectively adhered to the substrate 100 and the copper plate layer 200.
In this embodiment, the substrate 100 may be a ceramic substrate 100 or an aluminum substrate 100, the thickness of the substrate 100 is 0.2mm to 2mm, the thickness of the substrate 100 is different, the thermal resistance is different, the thickness of the substrate 100 can be changed according to the use requirement, the thickness of the copper plate layer 200 can be 0.3mm to 2mm,
the embodiment also provides a power device, and the power device is provided with the copper-clad plate, so that the copper-clad plate cannot generate edge warping, and the heat dissipation effect of the power device is ensured.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Claims (10)
1. The copper-clad plate is characterized by comprising a substrate (100) and a copper plate layer (200), wherein the copper plate layer (200) is attached to the substrate (100) and wraps extension ends (110) on two opposite sides of the substrate (100).
2. The copper-clad plate according to claim 1, wherein the copper plate layer (200) comprises a wrapping portion (210), a first bonding portion (220) and a second bonding portion (230) attached to the front and back surfaces of the substrate (100), and the wrapping portion (210) wraps the extending end (110) and is connected with the first bonding portion (220) and the second bonding portion (230) respectively.
3. The copper-clad plate according to claim 2, wherein the wrapping portion (210) is provided with an open slot (211) for accommodating the extending end (110), and the thickness of the two opposite side walls of the open slot (211) and the thickness of the first bonding portion (220) and the second bonding portion (230) are the same.
4. The copper-clad plate according to claim 1, wherein the substrate (100) is an aluminum substrate (100).
5. The copper-clad plate according to claim 1, wherein the substrate (100) is a ceramic substrate (100).
6. The copper-clad plate according to claim 5, wherein the thickness of the substrate (100) is 0.2 mm-2 mm.
7. The copper-clad plate according to claim 1, wherein an insulating oxide film (300) is arranged between the substrate (100) and the copper plate layer (200), and the insulating oxide films (300) are positioned on the front surface and the back surface of the substrate (100).
8. The copper-clad plate according to claim 7, wherein the thickness of the insulating oxide film (300) is 0.5mm to 1 mm.
9. The copper-clad plate according to claim 1, wherein the copper plate layer (200) has a rear thickness of 0.3mm to 2 mm.
10. A power device characterized by being equipped with the copper-clad plate according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020136391.0U CN211297136U (en) | 2020-01-20 | 2020-01-20 | Copper-clad plate and power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020136391.0U CN211297136U (en) | 2020-01-20 | 2020-01-20 | Copper-clad plate and power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211297136U true CN211297136U (en) | 2020-08-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020136391.0U Active CN211297136U (en) | 2020-01-20 | 2020-01-20 | Copper-clad plate and power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211297136U (en) |
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2020
- 2020-01-20 CN CN202020136391.0U patent/CN211297136U/en active Active
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