CN211959181U

CN211959181U - Substrate and solid-state relay

Info

Publication number: CN211959181U
Application number: CN202020127993.XU
Authority: CN
Inventors: 仝维仁; 钟劲松; 陈建
Original assignee: SENSATA TECHNOLOGY (CHANGZHOU) CO LTD
Current assignee: SENSATA TECHNOLOGY (CHANGZHOU) CO LTD; Sensata Technologies Changzhou Co Ltd
Priority date: 2020-01-20
Filing date: 2020-01-20
Publication date: 2020-11-17
Anticipated expiration: 2030-01-20

Abstract

The present disclosure relates to a substrate for a solid state relay, wherein the substrate comprises: a substrate main body on which an accommodating portion is formed; and a plate portion received in the accommodating portion, wherein a thermal conductivity of the plate portion is higher than a thermal conductivity of the substrate main body, and an electronic component in the solid-state relay is disposed on the plate portion. The present disclosure also relates to a solid-state relay comprising a substrate as described above.

Description

Substrate and solid-state relay

Technical Field

The present disclosure generally relates to a substrate for a solid state relay. The disclosure also relates to a solid-state relay comprising the substrate.

Background

Solid State Relays (SSRs) are very widely used elements in the electrical field. When the solid-state relay works, electronic components in the solid-state relay generate a large amount of heat. In order to ensure the normal operation of the solid-state relay, it is necessary to dissipate the heat generated by the electronic components in time.

In the prior art, the substrate for heat dissipation in the solid-state relay is usually a single plate, which is usually made of aluminum or aluminum alloy, and such a material is relatively inexpensive. To facilitate heat dissipation, the substrate is typically joined to the electronic component, such as by a copper clad layer that is soldered to the substrate. However, since an oxide layer is naturally formed on the surface of aluminum, the bonding property with solder paste is not good, and the aluminum cannot be directly soldered to the solder paste, a layer of nickel is generally coated on the outer surface of the plate. The price of nickel is relatively high, resulting in a relatively high cost of the substrate. Meanwhile, the plating process is complex and difficult to process, which also increases the cost of the substrate.

SUMMERY OF THE UTILITY MODEL

One of the objects of the present disclosure is to provide a substrate for a solid-state relay, which can efficiently and timely dissipate heat generated from electronic components in the solid-state relay.

It is another object of the present disclosure to provide a substrate that is inexpensive to manufacture and simple to assemble.

It is still another object of the present disclosure to provide a solid-state relay including the above substrate, which is low in cost, simple in assembly, and excellent in heat dissipation effect.

According to a first aspect of the present disclosure, there is provided a substrate for a solid state relay, wherein the substrate comprises:

a substrate main body on which an accommodating portion is formed; and

a plate portion received in the receiving portion,

wherein the thermal conductivity of the plate portion is higher than that of the substrate main body, and the electronic component in the solid-state relay is disposed on the plate portion.

In one embodiment of the substrate, the plate portion is made of copper and the substrate body is made of aluminum.

In an embodiment of the base plate, the receptacle is in the form of a groove, into which the plate portion is embedded.

In one embodiment of the base plate, the plate portion is embedded in the receiving portion by means of a cold press fit.

According to another aspect of the present disclosure, there is provided a solid state relay comprising a housing, the solid state relay further comprising a substrate as described above disposed within the housing.

In one embodiment of the solid-state relay, the solid-state relay further comprises an electronic component housed within the housing and disposed on the substrate, wherein the electronic component is at least partially or fully secured to the plate portion.

In one embodiment of the solid-state relay, the electronic component is a semiconductor element.

In one embodiment of the solid state relay, the electronic component is a thyristor.

In one embodiment of the solid state relay, the solid state relay further comprises an electronic component and a base housed within the housing and disposed on the substrate.

In one embodiment of the solid-state relay, the electronic component is arranged on the base, which is at least partially or completely fixed on the plate portion.

In one embodiment of the solid-state relay, the base is fixed to the plate portion by welding.

In one embodiment of a solid state relay, the base includes a base body, a top coating layer disposed on a top of the base body, and a bottom coating layer disposed on a bottom of the base body.

In one embodiment of the solid-state relay, the electronic component is fixed to the top coating layer, and the bottom coating layer is fixed to the plate portion, whereby the electronic component and the base are fixed to the plate portion.

In one embodiment of the solid-state relay, the undercoat layer is fixed to the plate portion by welding.

In one embodiment of the solid-state relay, the top coating layer is a copper clad layer.

In one embodiment of the solid-state relay, the undercoat layer is a copper clad layer.

According to the solid-state relay and the substrate thereof disclosed by the invention, the plate part with higher heat conductivity is arranged on the substrate, so that heat generated by electronic components in the solid-state relay can be effectively dissipated in time. Meanwhile, since the plate portion having a high thermal conductivity can ensure a good heat dissipation effect, a step of plating can be omitted, cost can be saved, and a process can be simplified, compared with the substrate of the prior art. In addition, due to the existence of the plate part, the assembly between the electronic component and the substrate is more convenient and reliable, and the process is simplified. Further, due to the presence of the plate portion on the substrate, the performance of the solid-state relay is improved.

Drawings

Various aspects of the disclosure will be better understood upon reading the following detailed description in conjunction with the drawings in which:

fig. 1 is a schematic perspective view of a solid state relay according to one embodiment of the present disclosure with an upper cover removed for clarity;

FIG. 2 is a schematic perspective view of a substrate according to one embodiment of the present disclosure;

FIG. 3 is a schematic perspective view of a substrate with electronic components and a base disposed thereon according to one embodiment of the present disclosure;

FIG. 4 is a front view of the base plate shown in FIG. 3; and

fig. 5 is an enlarged view of a portion C in fig. 3.

Detailed Description

The present disclosure will now be described with reference to the accompanying drawings, which illustrate several embodiments of the disclosure. It should be understood, however, that the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, the embodiments described below are intended to provide a more complete disclosure of the present disclosure, and to fully convey the scope of the disclosure to those skilled in the art. It is also to be understood that the embodiments disclosed herein can be combined in various ways to provide further additional embodiments.

It should be understood that like reference numerals refer to like elements throughout the several views. In the drawings, the size of some of the features may be varied for clarity.

It is to be understood that the terminology used in the description is for the purpose of describing particular embodiments only, and is not intended to be limiting of the disclosure. All terms (including technical and scientific terms) used in the specification have the meaning commonly understood by one of ordinary skill in the art unless otherwise defined. Well-known functions or constructions may not be described in detail for brevity and/or clarity.

As used in this specification, the singular forms "a", "an" and "the" include plural referents unless the content clearly dictates otherwise. The terms "comprising," "including," and "containing" when used in this specification specify the presence of stated features, but do not preclude the presence or addition of one or more other features. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items. The terms "between X and Y" and "between about X and Y" as used in the specification should be construed to include X and Y. The term "between about X and Y" as used herein means "between about X and about Y" and the term "from about X to Y" as used herein means "from about X to about Y".

In the description, when an element is referred to as being "on," "attached" to, "connected" to, "coupled" to, or "contacting" another element, etc., another element may be directly on, attached to, connected to, coupled to, or contacting the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly on," "directly attached to," directly connected to, "directly coupled to," or "directly contacting" another element, there are no intervening elements present. In the description, one feature is disposed "adjacent" another feature, and may mean that one feature has a portion overlapping with or above or below an adjacent feature.

In the specification, spatial relations such as "upper", "lower", "left", "right", "front", "rear", "high", "low", and the like may explain the relation of one feature to another feature in the drawings. It will be understood that the spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, features originally described as "below" other features may be described as "above" other features when the device in the figures is inverted. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the relative spatial relationships may be interpreted accordingly.

A solid-state relay and a substrate thereof according to the present disclosure will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1, which shows a schematic perspective view of a solid state relay 1 according to one embodiment of the present disclosure, with an upper cover removed to expose the internal structure of the solid state relay 1 for clarity.

The solid-state relay 1 includes a housing 100, a substrate 200, and an electronic component assembly 300, wherein the substrate 200 and the electronic component assembly 300 are accommodated in the housing 100 and may be fixed in the housing 100 by fixing means known in the art, such as bolts.

In the prior art, the substrate for heat dissipation in solid state relays is typically a single sheet of material, typically made of aluminum or an aluminum alloy, such as 3003-H14 or 6061-T6, which is relatively inexpensive. To facilitate heat dissipation, the substrate is typically joined to the electronic component, such as by a copper clad layer that is soldered to the substrate. However, since the aluminum surface naturally forms an oxide layer, which has poor adhesion to solder paste and cannot be directly soldered to solder paste, the outer surface of the plate is usually coated with a nickel layer, for example by electroless deposition, which is usually 5 to 8 μm thick. The price of nickel is relatively high, resulting in a relatively high cost of the substrate. Meanwhile, the plating process is complex and difficult to process, which also increases the cost of the substrate.

As shown in fig. 2, a substrate 200 within the solid state relay 1 is shown according to one embodiment of the present disclosure. The substrate 200 includes a substrate main body 210 and a plate portion 220. The size and shape of the substrate main body 210 are determined according to the size and shape of the case 100 so that the substrate main body 210 can be conveniently received in the case 100. The substrate main body 210 is formed with a receiving portion 211 for receiving the plate portion 220. According to the embodiment of the present disclosure, the electronic components of the solid-state relay 1 are disposed on the board portion 220, so that heat generated by the electronic components is dissipated through the board portion 220.

The plate portion 220 may be made of a material having a good thermal conductivity such that the thermal conductivity of the plate portion 220 is higher than that of the substrate main body 210, so that heat generated from the electronic component can be effectively dissipated through the plate portion 220. In one embodiment, the substrate body 210 may be made of, for example, aluminum or an aluminum alloy, such as 1060-H18, and the plate portion 220 may be made of, for example, copper, such as T2 copper. The heat conductivity of copper is higher than that of aluminum, so that the heat dissipation effect of the substrate 200 can be ensured, and on this basis, since the substrate main body 210 is made of aluminum, which is low in price (i.e., most of the substrate 200 is made of aluminum), and only the position where the electronic component is placed (i.e., the plate portion 220) is made of copper, which is high in price, the cost of the substrate 200 is greatly reduced. Meanwhile, since the plate portion 220 on the substrate 200 can ensure good heat dissipation, the substrate 200 according to the present disclosure does not need to be plated, i.e., nickel plating on the outer surface of the substrate as in the prior art, which on the one hand saves cost and on the other hand also reduces process complexity.

In one embodiment, the receptacle 211 may be in the form of a recess, which may be formed, for example, by removing a portion of material on the substrate body 210. The plate portion 220 may be fixed to the receiving portion 211 in various suitable manners, for example, may be inserted into the receiving portion 211 in the form of a groove. In a further embodiment, the plate portion 220 may be embedded in the receptacle 211 by, for example, a cold press fit. Of course, it will be understood by those skilled in the art that the plate portion 220 may be received in the receptacle 211 in any other suitable manner.

As shown in fig. 3-5, which illustrate a substrate 200 and an electronic component assembly 300 in a solid state relay according to the present disclosure, wherein fig. 3 shows a perspective view, fig. 4 shows a front view, and fig. 5 shows an enlarged schematic view of a portion C in fig. 4.

The electronic component assembly 300 includes an electronic component 310, and the electronic component 310 may be a Semiconductor element, such as a thyristor (SCR).

In one embodiment, the electronic component 310 may be disposed on the substrate 200, and specifically, the electronic component 310 may be at least partially or entirely fixed on the plate portion 220 of the substrate 200, so that heat generated by the electronic component 310 during operation can be dissipated through the plate portion 220. The electronic components 310 may be secured to the plate portion 220 by soldering or any other suitable means known in the art.

In the illustrated embodiment, the electronic component assembly 300 further includes a base 320, as shown in fig. 3-4, the electronic component 310 is disposed on the substrate 200 together with the base 320, specifically, the electronic component 310 is disposed on the base 320, and then the base 320 is at least partially or entirely fixed on the plate portion 220 of the substrate 200. The base 320 may be secured to the plate portion 220 by welding or any other suitable means known in the art.

In further embodiments, the base 320 may be a composite structure including a base body 321, a top coating layer 322, and a bottom coating layer 323. As shown in fig. 5, a top coating layer 322 is disposed on the top or upper surface of the susceptor body 321, and a bottom coating layer 323 is disposed on the bottom or lower surface of the susceptor body 321.

The electronic component 310 may be secured to the top coating layer 322 of the base 320 as shown in fig. 4. Top coating layer 322 may be a copper clad layer such that a portion of the heat generated by electronic component 310 may be dissipated through top coating layer 322.

The undercoat layer 323 is used to be fixed at least partially or entirely to the plate portion 220 of the base plate 200, so that the electronic component assembly 300 including the electronic component 310 and the base 320 is fixed to the base plate 200, specifically, to the plate portion 220 of the base plate 200. The bottom coating layer 323 may be secured to the plate portion 220 by welding or any other suitable means known in the art.

The bottom coating layer 323 may also be a Copper clad layer to facilitate heat dissipation, so that the structure formed by the base body 321, the top coating layer 322, and the bottom coating layer 323 may also be referred to as a "Copper clad laminate" (DBC). In addition, in the prior art, for example, in the case where the substrate is composed of aluminum or an aluminum alloy, or in the case where the substrate is composed of aluminum or an aluminum alloy and the surface thereof is plated with a nickel layer, when the undercoat layer, which is a copper-clad layer, is welded to the substrate, the process treatment is difficult. Whereas according to the embodiment of the present disclosure, the substrate 200 is provided with the plate portion 220 composed of, for example, copper, in which case, when the undercoat layer 323, which is a copper clad layer, is welded to the plate portion 220 of the substrate 200, the process treatment becomes easier and reliable due to the same material.

As shown in fig. 5, the base body 321, which is located between the top coating layer 322 and the bottom coating layer 323, may be made of, for example, ceramic, which may allow the base 320 to be made of less copper, which may reduce costs, while the ceramic may increase insulating properties in addition to heat conduction.

The solid-state relay 1 according to the present disclosure achieves unexpected effects in addition to the above-described advantages. It has been confirmed through experiments that, in the case where the plate portion 220 of the substrate 200 is made of copper, in addition to ensuring a good heat dissipation effect, the overcurrent of the current flowing through the electronic component 310 can be intensified, further improving the performance of the solid-state relay 1.

Although exemplary embodiments of the present disclosure have been described, it will be understood by those skilled in the art that various changes and modifications can be made to the exemplary embodiments of the present disclosure without substantially departing from the spirit and scope of the present disclosure. Accordingly, all changes and modifications are intended to be included within the scope of the present disclosure as defined in the appended claims. The disclosure is defined by the following claims, with equivalents of the claims to be included therein.

Claims

1. A substrate for a solid state relay, the substrate comprising:

a substrate main body on which an accommodating portion is formed; and

a plate portion received in the receiving portion,

2. The substrate according to claim 1, wherein the plate portion is made of copper and the substrate main body is made of aluminum.

3. The baseplate of claim 1, wherein the receptacle is in the form of a groove into which the plate portion is inserted.

4. The baseplate of claim 3, wherein the plate portion is embedded in the receptacle by a cold press fit.

5. A solid state relay comprising a housing, characterized in that it further comprises a substrate according to any of claims 1-4, said substrate being arranged within said housing.

6. The solid state relay according to claim 5, further comprising an electronic component housed within the housing and disposed on the substrate, wherein the electronic component is at least partially or fully secured to the plate portion.

7. The solid-state relay according to claim 6, wherein the electronic component is a semiconductor element.

8. The solid state relay according to claim 6, wherein the electronic component is a thyristor.

9. The solid state relay according to claim 5, further comprising electronics and a base housed within the housing and disposed on the substrate.

10. The solid state relay according to claim 9, wherein the electronic component is disposed on the base, the base being at least partially or fully fixed on the plate portion.

11. The solid state relay according to claim 10, wherein the base is fixed to the plate portion by welding.

12. The solid state relay of claim 9, wherein the base comprises a base body, a top coating layer disposed on a top of the base body, and a bottom coating layer disposed on a bottom of the base body.

13. The solid state relay according to claim 12, wherein the electronic component is fixed to the top coating layer and the bottom coating layer is fixed to the plate portion, whereby the electronic component and the base are fixed to the plate portion.

14. The solid-state relay according to claim 13, wherein the bottom coating layer is fixed to the plate portion by welding.

15. The solid-state relay according to any one of claims 8 to 14, wherein the electronic component is a semiconductor element.

16. The solid-state relay according to any one of claims 9 to 14, wherein the electronic component is a thyristor.

17. The solid state relay according to any one of claims 12-14, wherein the top coating layer is a copper clad layer.

18. The solid state relay according to any one of claims 12-14, wherein the bottom coating layer is a copper clad layer.