TW201222884A - Manufacturing method of wavelength conversion component, wavelength conversion component and light source - Google Patents

Manufacturing method of wavelength conversion component, wavelength conversion component and light source Download PDF

Info

Publication number
TW201222884A
TW201222884A TW100125935A TW100125935A TW201222884A TW 201222884 A TW201222884 A TW 201222884A TW 100125935 A TW100125935 A TW 100125935A TW 100125935 A TW100125935 A TW 100125935A TW 201222884 A TW201222884 A TW 201222884A
Authority
TW
Taiwan
Prior art keywords
wavelength conversion
conversion member
inorganic phosphor
light
powder
Prior art date
Application number
TW100125935A
Other languages
Chinese (zh)
Other versions
TWI591862B (en
Inventor
Yoshio Umayahara
Original Assignee
Nippon Electric Glass Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co filed Critical Nippon Electric Glass Co
Publication of TW201222884A publication Critical patent/TW201222884A/en
Application granted granted Critical
Publication of TWI591862B publication Critical patent/TWI591862B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00Re-forming shaped glass
    • C03B23/04Re-forming tubes or rods
    • C03B23/047Re-forming tubes or rods by drawing
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/06Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • C03B19/063Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction by hot-pressing powders
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2211/00Chemical nature of organic luminescent or tenebrescent compounds
    • C09K2211/10Non-macromolecular compounds
    • C09K2211/1003Carbocyclic compounds
    • C09K2211/1014Carbocyclic compounds bridged by heteroatoms, e.g. N, P, Si or B
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Optical Filters (AREA)

Abstract

Provided is a manufacturing method of a wavelength conversion component, it could easily manufacture a high strength wavelength conversion component. By heating stretching a sintered perform (30) of an inorganic fluorescence powder and a glass powder to form a wavelength conversion component (10).

Description

201222884 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種波長蠻槔播 =長_件、 :末係關於一種在玻璃母材中分散有無機螢光 件之製造方法、藉由該方法製造之波長 k換構件、以及具有該波長變換構件之光源。 【先前技術】 近年來例如液晶顯示器之背光等用途所使用之白色光 源的開發;}:目自盛行。此等白色光源之—例,例如下述專利 文獻1中所揭示之光源,係於射出藍色光的LED(Light putting Diode)之光射出麻置_波長變換構件,該波長 支換構件吸收—部分前述藍色光而發出黃色光。此光源藉 由藍色光與黃色光之合成而發出白色光。 此波長變換構件以往使用在樹脂基質中分散有無機螢 光體籾末者。但是樹脂基質中分散有無機螢光體粉末之波 長變換構件會有因led的光而造成樹脂劣化,篡白色光源 的72度各易隨時間降低之問題。尤其源自led的光為藍光 等波長短、能量強的光時,樹脂容易劣化。 有繁於此等問題,例如下述專利文獻2、3中提出在玻 璃中分散有無機螢光體粉末之波長變換構件。專利文獻 2、3所記載之波長變換構件不含有樹脂而僅由無機固體構 成’故具有優異耐熱性及耐候性,因此,藉由使用此等波 長變換構件可實現亮度不易降低之白色光源。 3 323297 201222884 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2007-25285號公報 [專利文獻2]日本特開2005-11933號公報 [專利文獻3]日本特許第4158012號公報 [專利文獻4]日本特開2007-182529號公報 【發明内容】 (發明欲解決之課題) 但是’與以使用樹脂作為分散媒之波長變換構件相比, 以使用玻璃作為分散媒之波長變換構件有難以成形之問 題。尤其難以將以使用玻璃作為分散媒之波長變換構件成 形為板狀。 例如上述專利文獻4中提出一種製造波長變換構件的 方法’係將含有玻璃粉末與無機螢光體粉末膏(paste)製作 為生胚薄片(green sheet),且藉由燒成此生胚薄片而製造 板狀的波長變換構件。 但是’專利文獻4所記載的波長變換構件之製造方法 有難以製造尚強度波長變換構件的問題。 本發明係鑑於相關問題點而研究,其目的係提供一種 波長變換構件之製造方法’其可容易地製造高強度波長變 換構件。 (解決課題之方法) 本發明者等精心研究的結果發現,藉由將無機螢光體 粉末與玻璃粉末之預成形物(preform)加熱延伸,而可提高 4 323297 201222884 燒結體的強度,遂完成本發明。 亦即’本發明波長變換構件之製造方法係藉由將無機 螢光體粉末與玻璃粉末之燒結體預成形物加熱延伸,而成 形為波長變換構件。因此可容易地製造高強度波長變換構 件0 在本發明中’燒結體預成形物的加熱延伸係在玻璃粉 末的軟化點以上,較佳為在高於玻璃粉末軟化點溫度2〇〇 c以下的溫度進行。此時可適當地進行燒結體預成形物之 加熱延伸。此外可製造更高強度的波長變換構件。並且, 燒結體預成形物中無機螢光體含量多時,例如在5質量% 以上,尤其是8質量%以上時,以在高於玻璃粉末軟化點 溫度ioo°c,尤其在高於玻璃粉末軟化點溫度15(rc以上之 高溫進行加熱延伸為佳。 件 本發明中較佳為藉由形成含有無機螢光體與玻璃粉末 且不含結合劑(binder)之成形體’且在減壓環境中燒成此 成形體而成形為燒結體縣雜。此時,可使燒結體預成 形物内的空隙變少。因此,可製造更高強度之波長變換構 本發明之波長變換構件係無機螢麵粉末與玻璃粉 之燒結體預成形物加熱延伸成形所成。如上述,藉由加杂 延伸成形燒結贿成形物,可提高燒結體㈣度。因此 本發明之波長變換構件具有高強度。 本發明之波錢換構件㈣狀並無制限制 之波長變換構件例如可為板狀或棒狀。具體而言,例如^ 323297 5 201222884 厚度尺寸比例為 發明之波長變換構件可為長度尺寸與 100 : 1以上之板狀。 並且,本發明中「板狀」包括「薄片狀」及「薄膜狀」。 本發明之波長變換構件令,於波長變換構件的表面, 長度30_以上且深G.心m以上的線狀溝,較 0·25_2此線狀溝之平均存在數目為100條以下,更佳為在 5。條以下,又更佳為2。條以下,又再更佳為二為下在 以實質上不存在為特佳。此時,不易產生㈣於由外部麗 力所造成之録變換構件表面的線狀溝之裂縫(咖⑻,且 更不易產生破裂及強度降低之問題。此外,降低因線狀溝 以成之光散射損失(scattering loss)。因此減少波長變換 構件表面之損失,且提高將光取出至外部的效率。其結果 可付一具有高發光強度’且色再現性及發光強度的不一致 性非常小的波長變換構件。 線狀溝的長度例如可藉由使用掃描型電子顯微鏡(s E M ) 觀察波長變換構件表面的影像而測定。此外,線狀溝的深 度可使用觸針式表面粗度計而測定。此處,線狀溝深度係 指構件表面形狀的測定曲線中,由平均線至線狀溝前端為 止之距離。 本發明中無機螢光體粉末可對應所求之激發光及變換 光等而適宜選擇。無機螢光體粉末例如由選自氧化物無機 螢光體、氮化物無機螢光體、氧氮化物無機螢光體、硫化 物無機螢光體、氧硫化物無機螢光體、稀土金屬硫化物無 機螢光體、叙酸鹽化物無機螢光體、以及鹵素磷酸鹽化物 6 323297 201222884 :· 無機螢光體中之一種以上物質所構成。 ^ 轉狀光源係具備:上述本發明之波長㈣構件邀 發光元件,該發光元件對波長變換構件射出波長變換構;牛 之激發光。如上所述’本發明之波長變換構件且 因此,本發明光源具有高機械耐久性。 又 本發明中發光元件並無特別限定,例如可藉由⑽而 構成。藉由使用LED可實現製品壽命長、消耗電力低。 本發明之光源可為發出任何色調之光者。本發明之光 源例如具備發出藍色光的發光元件,以及吸收源自該咖 之藍色光而發出黃色光之波長變換構件,並藉由藍色光與 黃色光的合成而發出白色光者。 此外,本發明之光源可具備複數個發光元件。 並且,本發明中「藍务本 θ ,t ., _ 」疋#日波長區域為44〇nm至 48〇nm的光。「白色光」是指色度X為0.25至〇 45、色户 y為0.25至0.45的光。尤其其中較佳為接近黑_ -(Blackbody emission)執跡的光。 (發明之效果) 可 —根據本發明可提供-種波長㈣構件之製造方法 谷易地製造尚強度波長變換構件。 【實施方式】 厂 Λ光源1以朗實施本發明之較 ==1僅為例示。本發明之先源及波長變換構 光源1所含有之波長變換構件… 本發明»施示意側面圖。如 323297 7 201222884 第1圖所示,光源1具有波長變換構件10及複數個發光元 件20。光源1藉由波長變換構件10吸收一部分由發光元 件20所射出之激發光20a,同時由波長變換構件1〇射出 螢光10a。另一方面,激發光20a —部分未被波長變換構 件10所吸收而直接透過,且射出透過之激發光20a與螢光 10a之合成光2(例如白色光)。 發光元件20並無特別限定,例如可藉由LED及電漿發 光元件、電致發光(electroluminescence)發光元件等而構 成0 本實施型態中,波長變換構件10係在玻璃中分散有無 機螢光體粉末而成。 無機螢光體粉末係可對應由光源1所射出合成光2之 波長’及發光元件20所射出激發光20a之波長等而適宜選 擇。無機螢光體粉末例如可由選自氧化物無機螢光體、氮 化物無機螢光體、氧氮化物無機螢光體、硫化物無機螢光 體、氧硫化物無機螢光體、稀土金屬硫化物無機螢光體、 鋁酸鹽化物無機螢光體、以及齒素磷酸鹽化物無機螢光體 中之一種以上構成。 若以波長在300nm至440nm之紫外光至近紫外光的激 發光照射時發出藍色光的無機螢光體粉末可列舉出201222884 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for manufacturing a wavelength in which a fluorescent material is dispersed in a glass base material, and a method for manufacturing an inorganic fluorescent member dispersed in a glass base material The wavelength k-changing member produced by the method and the light source having the wavelength converting member. [Prior Art] Development of a white light source used for applications such as backlights of liquid crystal displays in recent years;}: The purpose is prevailing. For example, a light source disclosed in Patent Document 1 below is a light-emitting diode of a light-emitting diode that emits blue light, and a wavelength conversion member that absorbs a portion of the wavelength-receiving member. The aforementioned blue light emits yellow light. This light source emits white light by the combination of blue light and yellow light. In the wavelength conversion member, an inorganic phosphor powder is dispersed in a resin matrix. However, the wavelength conversion member in which the inorganic phosphor powder is dispersed in the resin matrix causes deterioration of the resin due to the light of the LED, and the 72-degree white light source easily has a problem of decreasing with time. In particular, when the light derived from LED is light having a short wavelength and high energy such as blue light, the resin is easily deteriorated. There are various problems, for example, in the following Patent Documents 2 and 3, a wavelength conversion member in which inorganic phosphor powder is dispersed in glass is proposed. The wavelength conversion member described in Patent Documents 2 and 3 does not contain a resin and is composed only of an inorganic solid. Therefore, it has excellent heat resistance and weather resistance. Therefore, a white light source whose luminance is not easily lowered can be realized by using the wavelength conversion member. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 4] Japanese Laid-Open Patent Publication No. 2007-182529 (Explanation of the Invention) However, the wavelength conversion member using glass as a dispersion medium is different from the wavelength conversion member using a resin as a dispersion medium. Difficult to form problems. In particular, it is difficult to form a wavelength conversion member using glass as a dispersion medium into a plate shape. For example, in the above-mentioned Patent Document 4, a method of manufacturing a wavelength conversion member is proposed in which a glass powder and an inorganic phosphor powder paste are produced as a green sheet, and are produced by firing the green sheet. A plate-shaped wavelength conversion member. However, the method for manufacturing a wavelength conversion member described in Patent Document 4 has a problem that it is difficult to manufacture a wavelength conversion member of a strong intensity. The present invention has been made in view of the related problems, and an object thereof is to provide a method of manufacturing a wavelength converting member which can easily manufacture a high-intensity wavelength converting member. (Means for Solving the Problem) As a result of careful study by the inventors of the present invention, it has been found that the strength of the sintered body of 4 323297 201222884 can be improved by heating and extending the preform of the inorganic phosphor powder and the glass powder. this invention. That is, the manufacturing method of the wavelength converting member of the present invention is formed into a wavelength converting member by heating and extending the sintered body preform of the inorganic phosphor powder and the glass powder. Therefore, the high-intensity wavelength conversion member 0 can be easily manufactured. In the present invention, the heating extension of the sintered body preform is above the softening point of the glass powder, preferably at a temperature higher than the softening point of the glass powder by 2 〇〇 c or less. The temperature is carried out. At this time, the heating extension of the sintered body preform can be suitably performed. In addition, higher intensity wavelength conversion members can be fabricated. Further, when the content of the inorganic phosphor in the sintered body preform is large, for example, at 5% by mass or more, particularly 8% by mass or more, at a temperature higher than the softening point of the glass powder, ioo ° C, especially higher than the glass powder. The softening point temperature 15 (high temperature above rc is preferably extended by heating. In the present invention, it is preferred to form a molded body containing an inorganic phosphor and a glass powder and containing no binder) and in a reduced pressure environment. The molded body is fired and formed into a sintered body. In this case, the voids in the sintered body preform can be reduced. Therefore, it is possible to produce a wavelength conversion member of the present invention having a higher intensity. The sintered body preform of the surface powder and the glass frit is formed by heat extension molding. As described above, the sintered body can be increased by the addition of the extrusion molding, so that the wavelength conversion member of the present invention has high strength. The wavelength conversion member of the invention may be in the form of a plate or a rod, for example, in particular, for example, ^ 323297 5 201222884 The thickness dimension ratio is the wavelength conversion of the invention. Further, in the present invention, the "plate shape" includes "sheet shape" and "film shape". The wavelength conversion member of the present invention has a length on the surface of the wavelength conversion member. The linear groove of 30_ or more and the deep G. heart m or more is more than 100 pieces of the linear groove of 0·25_2, more preferably 5 or less, and more preferably 2. It is more preferable that the second is not substantially present. In this case, it is not easy to produce (4) cracks in the linear groove on the surface of the recording member caused by external Lili (Cai (8), and it is less likely to occur. The problem of cracking and strength reduction. In addition, the scattering loss due to the linear groove is reduced. Therefore, the loss of the surface of the wavelength conversion member is reduced, and the efficiency of taking out light to the outside is improved. A wavelength conversion member having a high luminous intensity' and inconsistency in color reproducibility and luminous intensity. The length of the linear groove can be determined, for example, by observing an image of the surface of the wavelength conversion member using a scanning electron microscope (s EM ). Further, the depth of the linear groove can be measured using a stylus type surface roughness meter. Here, the linear groove depth means the distance from the average line to the tip end of the linear groove in the measurement curve of the surface shape of the member. The medium inorganic phosphor powder can be suitably selected in accordance with the desired excitation light, converted light, etc. The inorganic phosphor powder is, for example, selected from the group consisting of an oxide inorganic phosphor, a nitride inorganic phosphor, and an oxynitride inorganic fluorescent material. Body, sulfide inorganic phosphor, oxysulfide inorganic phosphor, rare earth metal sulfide inorganic phosphor, chemical salt inorganic phosphor, and halogen phosphate 6 323297 201222884 : · Inorganic phosphor The rotary light source includes: the wavelength (four) member-inducing light-emitting element of the present invention, wherein the light-emitting element emits a wavelength conversion structure to the wavelength conversion member; and excitation light of the cow. As described above, the wavelength conversion member of the present invention and therefore, the light source of the present invention has high mechanical durability. Further, the light-emitting element of the present invention is not particularly limited, and can be constituted, for example, by (10). By using LEDs, it is possible to achieve long product life and low power consumption. The light source of the present invention can be any light that emits any hue. The light source of the present invention includes, for example, a light-emitting element that emits blue light, and a wavelength conversion member that absorbs blue light from the coffee and emits yellow light, and emits white light by combining blue light and yellow light. Further, the light source of the present invention may be provided with a plurality of light emitting elements. Further, in the present invention, the "blue quotient θ , t . , _ 疋 疋 # daily wavelength region is light of 44 〇 nm to 48 〇 nm. "White light" refers to light having a chromaticity X of 0.25 to 〇 45 and a color y of 0.25 to 0.45. In particular, it is preferably light that is close to the black body. (Effect of the Invention) A method of manufacturing a wavelength (four) member can be provided according to the present invention. [Embodiment] The factory Λ light source 1 is exemplified by the implementation of the present invention. The wavelength conversion member included in the source of the present invention and the wavelength conversion light source 1 is a schematic side view of the present invention. As shown in Fig. 1 of 323297 7 201222884, the light source 1 has a wavelength converting member 10 and a plurality of light emitting elements 20. The light source 1 absorbs a part of the excitation light 20a emitted from the light-emitting element 20 by the wavelength conversion member 10, and simultaneously emits the fluorescent light 10a by the wavelength conversion member 1. On the other hand, the excitation light 20a is partially absorbed by the wavelength conversion member 10 and directly transmitted, and the combined light 2 (e.g., white light) of the excitation light 20a and the fluorescent light 10a is emitted. The light-emitting element 20 is not particularly limited, and can be formed, for example, by an LED, a plasma light-emitting element, an electroluminescence light-emitting element, or the like. In the present embodiment, the wavelength conversion member 10 is dispersed with inorganic fluorescent light in the glass. Made of body powder. The inorganic phosphor powder can be suitably selected in accordance with the wavelength " of the synthesized light 2 emitted from the light source 1 and the wavelength of the excitation light 20a emitted from the light-emitting element 20, and the like. The inorganic phosphor powder may be, for example, selected from the group consisting of an oxide inorganic phosphor, a nitride inorganic phosphor, an oxynitride inorganic phosphor, a sulfide inorganic phosphor, an oxysulfide inorganic phosphor, a rare earth metal sulfide. One or more of an inorganic phosphor, an aluminate inorganic phosphor, and a dentate phosphate inorganic phosphor. The inorganic phosphor powder which emits blue light when irradiated with ultraviolet light having a wavelength of from 300 nm to 440 nm to near-ultraviolet light can be exemplified.

Sr5(P〇4)3Cl : Eu2+> (Sr, Ba)MgAli〇Oi7 : Eu2+' (Sr, Ba)3MgSi2〇8 : Eu2+等。 若以波長在3〇〇nm至440nm之紫外光至近紫外光的激 發光照射時發出綠色螢光(波長500nm至540nm的螢光)的 323297 201222884 無機螢光體粉末可列舉出SrAl2〇4 : Eu2+、SrGa2S4 : Eu2+、 SrBaSi〇4 : Eu2+、CdS : In、CaS : Ce3+、Y3(A1,Gd)5〇12 : Ce2+、 Ca3Sc2Si3〇12: Ce3+、SrSiOn : Eu2+、ZnS:Al3+,Cu+、CaS : Sn2+、 CaS : Sn2+, F ' CaS〇4:Ce3+, Mn2+ ' L1AIO2 : Mn2+ > BaMgAhoOn : Eu2+, Mn2+、ZnS:Cu+, Cl-、Ca3W〇6 : U、Ca3Si〇4Cl2 : Eu2+、 Sro.2Bao.7Ch.1Al2O3.45 : Ce3+, Mn2+' Ba2MgSi2〇7 : Eu2+ > Ba2Si〇4 : Eu2+、Ba2Li2Si2〇7: Eu2+、ZnO : S、ZnO : Zn、Ca2Ba3(P〇4)3Cl : Eu2+、BaAl2〇4 : Eu2+等。 若以波長在440nm至480nm之藍色的激發光照射時發 出綠色螢光(波長500mn至540nm的榮光)的無機螢光體粉 末可列舉出 SrAl2〇4 : Eu2+、SrGa2S4 : Eu2+、SrBaSi〇4 : Eu2+、 CdS : In、CaS : Ce3+、Y3(A1, Gd)5〇12 : Ce2+、Ca3Sc2Si3〇12 : Ce3+、SrSiOn : Eu2+等。 若以波長在300nm至440nm之紫外光至近紫外光的激 發光照射時發出黃色螢光(波長540nm至595nm的螢光)的 無機螢光體粉末可列舉出ZnS : Eu2+、Ba5(P〇4)3Cl : U、 SnW〇6 : U、CaGa2S4 : Eu2+、SrS〇4 : Eu2+,Mn2+、ZnS : P、ZnS : P3_,Cr、ZnS : Mn2+等。 若以波長在440nm至480nm之藍色的激發光照射時發 出黃色螢光(波長540nm至595nm的螢光)的無機螢光體粉 末可列舉出 Y3(Al,Gd)5〇12: Ce2+、Ba5(P〇4)3Cl : U、CaGa2S4 : Eu2+、SnSi〇4 : Eu2+等。 若以波長在300nm至440nm之紫外光至近紫外光的激 發光照射時發出紅色螢光(波長600nm至700nm的螢光)的 9 323297 201222884 無機螢光體粉末可列舉出CaS : Yb2+,C1、Gd3Ga4〇12 : Cr3+、Sr5(P〇4)3Cl : Eu2+> (Sr, Ba)MgAli〇Oi7 : Eu2+' (Sr, Ba)3MgSi2〇8 : Eu2+ or the like. 323297 201222884 inorganic phosphor powder which emits green fluorescence (fluorescence with a wavelength of 500 nm to 540 nm) when irradiated with excitation light having a wavelength of from 3 Å to 440 nm to near-ultraviolet light can be exemplified by SrAl 2 〇 4 : Eu 2+ , SrGa2S4 : Eu2+ , SrBaSi〇4 : Eu2+ , CdS : In, CaS : Ce3+, Y3(A1, Gd)5〇12 : Ce2+, Ca3Sc2Si3〇12: Ce3+, SrSiOn: Eu2+, ZnS:Al3+, Cu+, CaS: Sn2+ CaS : Sn2+, F ' CaS〇4:Ce3+, Mn2+ ' L1AIO2 : Mn2+ > BaMgAhoOn : Eu2+, Mn2+, ZnS:Cu+, Cl-, Ca3W〇6 : U, Ca3Si〇4Cl2 : Eu2+, Sro.2Bao.7Ch .1Al2O3.45 : Ce3+, Mn2+' Ba2MgSi2〇7 : Eu2+ > Ba2Si〇4 : Eu2+, Ba2Li2Si2〇7: Eu2+, ZnO: S, ZnO: Zn, Ca2Ba3(P〇4)3Cl : Eu2+, BaAl2〇4 : Eu2+ and so on. The inorganic phosphor powder which emits green fluorescence (the glory of a wavelength of 500 nm to 540 nm) when irradiated with blue excitation light having a wavelength of 440 nm to 480 nm may be SrAl2〇4: Eu2+, SrGa2S4: Eu2+, SrBaSi〇4: Eu2+, CdS: In, CaS: Ce3+, Y3(A1, Gd)5〇12: Ce2+, Ca3Sc2Si3〇12: Ce3+, SrSiOn: Eu2+, and the like. The inorganic phosphor powder which emits yellow fluorescence (fluorescence of a wavelength of 540 nm to 595 nm) when irradiated with excitation light having a wavelength of from 300 nm to 440 nm to near-ultraviolet light may be exemplified by ZnS: Eu2+, Ba5 (P〇4). 3Cl : U, SnW〇6 : U, CaGa2S4 : Eu2+, SrS〇4 : Eu2+, Mn2+, ZnS: P, ZnS: P3_, Cr, ZnS: Mn2+. The inorganic phosphor powder which emits yellow fluorescence (fluorescence of a wavelength of 540 nm to 595 nm) when irradiated with blue excitation light having a wavelength of 440 nm to 480 nm can be exemplified by Y3(Al, Gd)5〇12: Ce2+, Ba5. (P〇4) 3Cl : U, CaGa2S4 : Eu2+, SnSi〇4 : Eu2+, and the like. 9 323297 201222884 Inorganic phosphor powder which emits red fluorescence (fluorescence with a wavelength of 600 nm to 700 nm) when irradiated with ultraviolet light of a wavelength of 300 nm to 440 nm to excitation light of near-ultraviolet light can be exemplified by CaS: Yb2+, C1, Gd3Ga4 〇12 : Cr3+,

CaGa2S4: Mn2+、Na(Mg,Mn)2LiSi4〇i〇F2: Mn、ZnS: Sn2+、Y3AI5O12: Cr3+、SrB8〇13: Sm2+、MgSr3Si2〇8: Eu2+,Mn2+、a -SrO · 3B2〇3 : Sm2+、ZnS-CdS、ZnSe : Cu+,Cl、ZnGa2S4 : Mn2+、ZnO : Bi3+、 BaS : Au,K、ZnS : Pb2+、ZnS : Sn2+,Li+、ZnS : Pb,Cu、CaTi〇3 : Pr3+、CaTi〇3 : Eu3+、Y2〇3 : Eu3+、(Y、Gd)2〇3 : Eu3+、CaS : Pb2+,Mn2+、YP〇4 : Eu3+、Ca2MgSi2〇7 : Eu2+,Mn2+、Y(P、V)〇4 : Eu3+、Y2〇2S : Eu3+、SrAia : Eu3+、CaYAlCU : Eu3+、La〇2S :CaGa2S4: Mn2+, Na(Mg, Mn)2LiSi4〇i〇F2: Mn, ZnS: Sn2+, Y3AI5O12: Cr3+, SrB8〇13: Sm2+, MgSr3Si2〇8: Eu2+, Mn2+, a-SrO · 3B2〇3 : Sm2+, ZnS-CdS, ZnSe: Cu+, Cl, ZnGa2S4: Mn2+, ZnO: Bi3+, BaS: Au, K, ZnS: Pb2+, ZnS: Sn2+, Li+, ZnS: Pb, Cu, CaTi〇3: Pr3+, CaTi〇3: Eu3+, Y2〇3: Eu3+, (Y, Gd)2〇3: Eu3+, CaS: Pb2+, Mn2+, YP〇4: Eu3+, Ca2MgSi2〇7: Eu2+, Mn2+, Y(P, V)〇4 : Eu3+, Y2〇2S : Eu3+, SrAia : Eu3+, CaYAlCU : Eu3+, La〇2S :

Eu3+ > LiW2〇8 : Eu3+, Sm3+ > (Sr, Ca, Ba? Mg)i〇(P〇4)6 Ch : Eu2+, Mn2+、Ba3MgSi2〇8 : Eu2+、Mn2+等。 若以波長在440nm至480nm之藍色的激發光照射時發 出紅色螢光(波長600ηιη至700nm的螢光)的無機螢光體粉 末可列舉出 ZnS : Mn2+,Te2+、Mg2Ti〇4 : Mn4+、K2SiF6 : Mn4+、 SrS : Eu2+、CaS : Eu2+、UuEumTiShO”、Eu3+ > LiW2〇8 : Eu3+, Sm3+ > (Sr, Ca, Ba? Mg)i〇(P〇4)6 Ch : Eu2+, Mn2+, Ba3MgSi2〇8 : Eu2+, Mn2+, and the like. The inorganic phosphor powder which emits red fluorescence (fluorescence of a wavelength of 600 nm to 700 nm) when irradiated with blue excitation light having a wavelength of 440 nm to 480 nm can be exemplified by ZnS: Mn2+, Te2+, Mg2Ti〇4: Mn4+, K2SiF6. : Mn4+, SrS: Eu2+, CaS: Eu2+, UuEumTiShO",

Nai.23K〇.42Eu〇.i2TiSi5〇i3 : Eu3+' CdS : In, Te ' CaAlSiNa : Euz+ >Nai.23K〇.42Eu〇.i2TiSi5〇i3 : Eu3+' CdS : In, Te ' CaAlSiNa : Euz+ >

CaSiN3 : Eu2+、(Ca, Sr)2SisN8 : Eu2+、EU2W2O7 等。 為了使激發光與發光的波長區域相合,亦可將複數的 無機螢光粉末混合並使用。例如以紫外光區域的激發光照 射可得白色光時,只要將發出藍色、綠色、紅色的無機螢 光體粉末混合使用即可。 發光元件20使用射出藍光之LED,藉由使用吸收藍光 而發出黃光之波長變換構件1〇,可實現例如作為液晶顯示 器光源有用的白色光源。 作為分散媒之玻璃只要可保持無機螢光體粉末安定者 323297 10 201222884 即無特別限制。可作為分散媒使用之玻璃的具體例,可列 舉出例如矽酸鹽系玻璃、硼酸鹽系玻璃、Si〇2-B2〇3-R〇系 玻璃(R代表Mg、Ca、Sr及Ba之至少一種)等硼矽酸鹽系 玻璃、SnO-PzOs系玻璃等磷酸鹽系玻璃、硼磷酸鹽系玻璃 等。其中較佳為使用Si〇2-B2〇3-R〇系玻璃及sn〇-P2〇5系玻 璃。 S1 〇2_B2〇3-R〇系玻璃例如可為含有以下莫耳%組成之 玻璃.Si〇2 為 30 至 80%、B2〇3 為 1 至 30%、MgO 為 〇 至 1 〇%、 CaO 為 〇 至 30%、SrO 為 〇 至 20%、BaO 為 〇 至 40%、 MgO+CaO+SrO+BaO 為 5 至 45%、Al2〇3 為 0 至 10%及 ZnO 為 0 至 10%。CaSiN3 : Eu2+, (Ca, Sr) 2SisN8 : Eu2+, EU2W2O7, and the like. In order to make the excitation light coincide with the wavelength region of the luminescence, a plurality of inorganic fluorescing powders may be mixed and used. For example, when white light is obtained by excitation light irradiation in an ultraviolet light region, it is sufficient to use a mixture of inorganic phosphor powders emitting blue, green, and red. The light-emitting element 20 uses an LED that emits blue light, and by using a wavelength conversion member 1 that emits yellow light by absorbing blue light, for example, a white light source useful as a light source of a liquid crystal display can be realized. The glass as the dispersion medium is not particularly limited as long as it can maintain the inorganic phosphor powder stabilizer 323297 10 201222884. Specific examples of the glass which can be used as the dispersion medium include, for example, citrate glass, borate glass, and Si〇2-B2〇3-R bismuth glass (R represents at least Mg, Ca, Sr, and Ba). One type is a borosilicate-based glass, a phosphate-based glass such as a SnO-PzOs-based glass, or a borophosphate-based glass. Among them, Si〇2-B2〇3-R lanthanum glass and sn〇-P2〇5 series glass are preferably used. The S1 〇2_B2〇3-R lanthanum glass may be, for example, a glass having the following composition of mole %. Si〇2 is 30 to 80%, B2〇3 is 1 to 30%, MgO is 〇 to 1 〇%, and CaO is 〇 to 30%, SrO is 〇 to 20%, BaO is 〇 to 40%, MgO+CaO+SrO+BaO is 5 to 45%, Al2〇3 is 0 to 10%, and ZnO is 0 to 10%.

Si〇2-B2〇HRO系玻璃除了上述成分以外,復可含有Li2〇、 Naz〇及LO等驗金屬氧化物等使玻璃軟化點降低可於低溫 燒成之成分、Ρζ〇5等提升玻璃熔融性之成分、Ta2〇5、Ti〇2、 NbA、Gd2〇3、La2〇3等提升玻璃的化學耐久性之成分等。 SnO-PAs系玻璃例如可為含有以下莫耳%組成之玻璃:In addition to the above-mentioned components, the Si〇2-B2〇HRO-based glass may contain a metal oxide such as Li2〇, Naz〇, or LO, etc., such that the glass softening point is lowered, the composition can be fired at a low temperature, and the glaze is melted. Sex components, Ta2〇5, Ti〇2, NbA, Gd2〇3, La2〇3, etc., which enhance the chemical durability of the glass. The SnO-PAs-based glass may be, for example, a glass having the following composition:

SnO 為 35 至 80%、P2〇5 為 5 至 40%、B2O3 為 〇 至 30%、Al2〇3 為 〇 至 10%、si〇4 〇 至刚、Li2〇 為 〇 至 1〇%、Na2〇 為 〇 至 10%、Κ2〇 為 0 至 10%、处〇 為 〇 至 i〇%、Ca〇 為 〇 至 10%、 SrO 為 0 至 10%、BaO 為 〇 至 ι〇〇/。SnO is 35 to 80%, P2〇5 is 5 to 40%, B2O3 is 〇 to 30%, Al2〇3 is 〇 to 10%, si〇4 〇 to just, Li2〇 is 〇 to 1〇%, Na2〇 It is 10%, Κ2〇 is 0 to 10%, 〇 is 〇 to i〇%, Ca〇 is 〇 to 10%, SrO is 0 to 10%, and BaO is 〇 to ι〇〇/.

Sn〇-P2〇5系玻璃除了上述成分以外,復可含有Ta2〇s、 Ti〇2、Nh〇5、Gd—、La^等提升玻璃的耐候性之成分、及 ZnO等使玻璃安定化之成分等。 由降低SnO-P2〇s系玻璃之軟化點且使玻璃安定化之觀 11 323297 201222884 點’ SnO與PA之莫耳比(Sn〇/P2〇5)較佳為在〇 9至 摩色圍,更佳為在1.5至1〇之範圍,又更佳為在2至$之 圍。若莫耳比(_/ p2〇〇過小則會使低溫燒成變^範 使燒成無機螢光體粉末時容易劣化/此外,若莫耳比難, P2〇5)過小則會使耐候性過於降低。另一方面,若莫耳(,0/ :SnO/ Ρζ〇5)過大則會使坡璃容易失透明化,使玻螭光 波長變換構件10中的無機螢光體粉末的含量並叙 別限定’例如較佳為質量%至3崎量%,圭^寺 質量%至25質量0/0,特佳為1質量%至20質量%。 * · 1 波長變換構件1〇之形狀並無特別限定。波長變換 1〇例如可為板狀或棒狀。本實施型態中,波長變換構件^ 以長度尺寸與厚度尺相為之板狀為例說In addition to the above components, the Sn〇-P2〇5-based glass may contain a component such as Ta2〇s, Ti〇2, Nh〇5, Gd—, La^, etc., which enhances the weather resistance of the glass, and ZnO or the like stabilizes the glass. Ingredients, etc. From the viewpoint of lowering the softening point of SnO-P2〇s glass and making the glass stable, 11 323297 201222884 point 'The molar ratio of SnO to PA (Sn〇/P2〇5) is preferably in the range of 〇9 to 摩色, More preferably in the range of 1.5 to 1 ,, and even more preferably in the range of 2 to $. If the molar ratio (_/p2〇〇 is too small, the low-temperature firing will cause the inorganic phosphor powder to be easily deteriorated when the inorganic phosphor powder is fired. In addition, if the molar ratio is too small, P2〇5) is too small to make the weather resistance. Too much lower. On the other hand, if Mohr (, 0/:SnO/Ρζ〇5) is too large, the glass tends to lose transparency, and the content of the inorganic phosphor powder in the glass-wavelength wavelength conversion member 10 is limited. 'For example, it is preferably from % by mass to 3 % by mass, from 5% by mass to 25 mass%/0, particularly preferably from 1% by mass to 20% by mass. *1 The shape of the wavelength conversion member 1A is not particularly limited. The wavelength conversion 1 〇 can be, for example, a plate shape or a rod shape. In this embodiment, the wavelength conversion member is exemplified by a plate shape having a length dimension and a thickness dimension.

/著,主要參照第2圖及第3圖,以說明本實施形離 之波長變換構件1。之製造方法。 L 首先,製作含有無機螢光體粉末與玻璃粉末且不含結 合劑之所明無結合劑之成形體。具體來說,成形體可藉由 例如將無機螢光體粉末與玻璃粉末之混合粉末使用模具壓 製成形而製作。 並且’無機榮光體粉末平均粒徑D50較佳為lem至 50 y m,更倍盔ς ^ 广 馬b/"m至25/ζπι。若無機螢光體粉末之平均 D5G過小時’則會有發光強度降低的傾向。另一方面, 右無機螢光體粉末之平均粒徑_過大時,則會有發光色 之均一性降低的傾向。 12 323297 201222884 此外,坡螭粉末的平均粒徑D50較佳為〇.丨以爪至 1〇〇/Zm’更佳為1 至50#m。若玻璃粉末的平均粒徑D5〇 過小,則燒成時會容易產生氣泡。因此會使所得之波長變 換構件10的強度降低。另一方面,若玻璃粉末的平均粒徑 D50過大,則會使無機螢光體粉末難以均一地分散,結果 使波長變換構件10的發光效率降低。 並且,本說明書中,平均粒徑D50係根據JIS_R1629, 使用島津製作所製SALD200J而測定之值。 接著’將製作之成形體於減壓環境中燒成,藉此形成 第2圖所示之燒結體預成形體3〇。燒成步驟中環境的壓 力,例如若未滿1大氣壓則燒結體預成形體中不易殘存氣 泡,故為較佳。燒成最高溫度可例如在玻璃粉末之軟化點 至軟化點+ 1001左右。 並且’本實施型態中因波長變換構件10為板狀,故較 佳為燒結體預成形物30亦為板狀、或是長方體狀及正方體 狀。 接著’藉由加熱延伸所得之燒結體預成形物,而成 形為波長變換構件10。具體來說,如第3圖所示,將燒結 體預成形物30藉由加熱器31加熱使其成為軟化狀態,再 藉由輕32拉伸燒結體預成形物3〇的端部。藉此將軟化之 燒結體預成形物30延伸,而成形為波長變換構件丨〇。 此燒結體預成形物30之加熱延伸係於玻璃粉末之軟 化點以上溫度進行’較佳為在高於玻璃粉末之軟化點溫度 200°C以下的溫度進行。 13 323297 201222884 延伸後燒結體預成形物30的厚度tl相對於延伸前的 厚度to的比⑴⑽並無特別限定,可例如為5至5〇左右。 如以上所說明,本實施型態中藉由加孰延仲燒綠體孩 絲物30而成形為波長變換構件…因此可容易地製造 面強度的波長變換構件1Q。並且,藉由加熱延伸而容易地 獲得高強度的波長變換構件之理由係推測為以下之理由! 至3。 理由1:藉由加熱延伸而在波長變換構件1〇表層形成壓縮 應力層(例如具有〇.以?&至10MPa左右的壓縮應力之層)。 理由2 .無機螢光體粉末的表層與玻璃進行反應,使無機 螢光體粉末與玻璃的密著強度變高。 理由3:藉由軟化燒結體預成形物3〇的表層而修復表層的 缺。因此,所製造之波長變換構件1〇,於波長變換構件 10的表面,長度30/zm以上且深0.05ym&上的線狀溝, 較佳為母〇. 25mm2此線狀溝之平均存在數目為丄〇〇條以下, 更佳為50條以下,又更佳為20條以下,又再更佳為1〇 條以下’特佳為實質上不存在有線狀溝。 此外,本實施蜇態中,燒結體預成形物3〇之加熱延伸 係於玻璃粉末的軟化點以上且在高於玻璃粉末的軟化點溫 度200°C以下的溫度進行。因此可製造更高強度之波長變 換構件10。若燒結體預成形物30之加熱延伸溫度過低, 則無法適當地進行加熱延伸’會使所得波長變換構件1 〇 的強度降低。另一方面,若燒結體預成形物30之加熱延伸 溫度過高’則無法獲得所求形狀之波長變換構件10。 323297 14 201222884 此外,本實施型態中將無結合劑之成形體於減壓環境 中io成因此可降低燒結體預成形物別之氣孔率,甚而降 低波長變換構件1G之氣孔率。因此可製造更高強度且發光 效率高之波長變換構件1G。並且,燒結體預成形物30及 波長變換構件1G中之氣孔率較佳為2體積%以下,更佳為 1體積%以下。 並且’本實施蜇態中’以藉由加熱延伸板狀的燒結體 預成形物30,而製造板狀的波長變換構件1〇為例說明。 但燒結體預成形物3〇及波長變換構件1 〇各自的形狀並不 限定於板狀。例如可藉由加熱延伸棒狀的燒結體預成形物, 而製造棒狀的波長變換構件。 以下’根據具髏的實施例更詳細說明本發明,但本發 明並不限定於以下實施例’在不變更其要旨之範圍内可適 宜的變更而實施。 (實施例) 將下述坡螭粉末與無機螢光體粉末以質量比(玻璃粉 末·無機螢光體粉末)9 : 1之方式混合,且藉由使用模具 壓製成形而製作成形體。其後藉由下述條件燒成此成形 體,而可製作繞成艨預成形物。 玻螭粉末的組成(質量比):Si〇2為50%、Ba0為25%、Ca〇 為 10%、B2〇3 為 5%、八12〇3為 5%、Zn〇 為 5%。 玻螭粉末的平岣粒授(D5〇) :Referring to Fig. 2 and Fig. 3, mainly, the wavelength conversion member 1 which is separated from the present embodiment will be described. Manufacturing method. L First, a molded body containing a binder containing an inorganic phosphor powder and a glass powder and containing no binder is prepared. Specifically, the molded body can be produced by, for example, press-molding a mixed powder of an inorganic phosphor powder and a glass powder using a mold. And the average particle diameter D50 of the inorganic glaze powder is preferably lem to 50 y m, more than a ς ς ^ 广 马 b / " m to 25 / ζ πι. If the average D5G of the inorganic phosphor powder is too small, the luminous intensity tends to decrease. On the other hand, when the average particle diameter _ of the right inorganic phosphor powder is too large, the uniformity of the luminescent color tends to decrease. Further, the average particle diameter D50 of the swill powder is preferably 〇. 丨 to 1 〇〇/Zm', more preferably 1 to 50 #m. When the average particle diameter D5 of the glass powder is too small, bubbles are likely to be generated during firing. Therefore, the strength of the obtained wavelength conversion member 10 is lowered. On the other hand, when the average particle diameter D50 of the glass powder is too large, it is difficult to uniformly disperse the inorganic phosphor powder, and as a result, the luminous efficiency of the wavelength conversion member 10 is lowered. In the present specification, the average particle diameter D50 is a value measured by using SALD200J manufactured by Shimadzu Corporation according to JIS_R1629. Then, the produced molded body is fired in a reduced pressure atmosphere to form a sintered body preform 3 shown in Fig. 2 . In the case where the pressure in the environment in the firing step is, for example, less than 1 atmosphere, the bubbles are less likely to remain in the sintered body preform, which is preferable. The maximum firing temperature can be, for example, from the softening point of the glass powder to the softening point + 1001. Further, in the present embodiment, since the wavelength conversion member 10 has a plate shape, it is preferable that the sintered body preform 30 has a plate shape, a rectangular parallelepiped shape, and a rectangular parallelepiped shape. Next, the sintered body preform obtained by heating is formed into a wavelength conversion member 10. Specifically, as shown in Fig. 3, the sintered body preform 30 is heated by the heater 31 to be softened, and the end portion of the sintered body preform 3 is stretched by the light 32. Thereby, the softened sintered body preform 30 is extended to be formed into a wavelength converting member 丨〇. The heating extension of the sintered body preform 30 is carried out at a temperature higher than the softening point of the glass powder, preferably at a temperature higher than the softening point temperature of the glass powder by 200 °C or lower. 13 323 297 201222884 The ratio (1) (10) of the thickness t1 of the sintered body preform 30 after stretching to the thickness to before stretching is not particularly limited, and may be, for example, about 5 to 5 Torr. As described above, in the present embodiment, the wavelength conversion member is formed by twisting the green body 30, and thus the surface intensity of the wavelength conversion member 1Q can be easily produced. Further, the reason why the high-intensity wavelength conversion member is easily obtained by heating and extending is presumed to be the following reason! To 3. Reason 1: A compressive stress layer (for example, a layer having a compressive stress of about 10 MPa to about 10 MPa) is formed on the surface layer of the wavelength conversion member 1 by heating and stretching. Reason 2: The surface layer of the inorganic phosphor powder reacts with the glass to increase the adhesion strength between the inorganic phosphor powder and the glass. Reason 3: The surface layer was repaired by softening the surface layer of the sintered body preform 3〇. Therefore, the wavelength conversion member 1 manufactured by the wavelength conversion member 10 has a length of 30/zm or more and a depth of 0.05 μm& on the surface of the wavelength conversion member 10, preferably a mother groove. 25 mm2, the average number of the linear grooves It is preferably 50 or less, more preferably 20 or less, and even more preferably 1 or less. 'Specially, there is substantially no linear groove. Further, in the present embodiment, the heating extension of the sintered body preform 3 is performed at a temperature higher than the softening point of the glass powder and at a temperature higher than the softening point temperature of the glass powder by 200 °C or lower. Therefore, the higher-intensity wavelength conversion member 10 can be manufactured. When the heating extension temperature of the sintered body preform 30 is too low, the heating and stretching cannot be appropriately performed, and the strength of the obtained wavelength conversion member 1 降低 is lowered. On the other hand, if the heating extension temperature of the sintered body preform 30 is too high, the wavelength conversion member 10 having the desired shape cannot be obtained. Further, in the present embodiment, the molded body having no binder is formed in a reduced pressure atmosphere, so that the porosity of the sintered body preform can be lowered, and the porosity of the wavelength conversion member 1G can be lowered. Therefore, the wavelength conversion member 1G having higher intensity and high luminous efficiency can be manufactured. Further, the porosity of the sintered body preform 30 and the wavelength converting member 1G is preferably 2% by volume or less, more preferably 1% by volume or less. In the present embodiment, a plate-shaped wavelength conversion member 1 is produced by heating a plate-shaped sintered body preform 30 by heating. However, the shape of each of the sintered body preform 3 and the wavelength converting member 1 is not limited to a plate shape. For example, a rod-shaped wavelength conversion member can be produced by heating a rod-shaped sintered body preform. The present invention will be described in detail below with reference to the preferred embodiments, but the present invention is not limited to the following examples, and modifications may be made without departing from the spirit and scope of the invention. (Example) The following shovel powder and inorganic phosphor powder were mixed in a mass ratio (glass powder/inorganic phosphor powder) of 9:1, and a molded body was produced by press molding using a mold. Thereafter, the formed body was fired by the following conditions to produce a wound preform. The composition (mass ratio) of the glassy powder: Si〇2 was 50%, Ba0 was 25%, Ca〇 was 10%, B2〇3 was 5%, 八12〇3 was 5%, and Zn〇 was 5%. The flat grain of the glass powder (D5〇):

玻螭粉末的軟化點:850°C 無機螢光體粉末的錤成:Y3(Al,Gd)5〇12 : Ce2+ 15 323297 201222884 無機螢光體粉末的平均粒徑(D50) : 2〇#m 燒成最高溫度:850°C 燒成時的環境:空氣 燒成時的環境壓力:lOOPa 接著,將所得之燒結體切斷為寬15mm、厚度45mm、 長lOOrnm之長方體狀而製作為母材。接著,將此母材設置 在延伸成形機,以limn/分之運送速度移入保持在1〇2〇艽 (軟化點+ 170C)之成形爐,且成形爐出口以225mm/分之 速度拉出。藉由以自動切斷機將所拉出之成形體切斷,而 可製作寬lmm、厚度0.3咖、長300_之矩形長尺狀之波長 變換構件。確認以藍色LED(發光波長:460nm)的光照射此 波長變換構件時,會發出白光。 本實施例中所得波長變換構件之三點彎曲強度係根據 JIS-R16(H ’使用島津製作所製Aut〇Graph AG_1〇kNIS測定 時’其值為250MPa。 (比較例) 製作含有上述實施例中使用之玻璃粉末與無機螢光體 粉末,質量比為9 : 1的玻璃膏。藉由將此玻璃膏塗佈於 PET膜上而製作為生胚薄片。其後將此生胚薄片以與上述 實施例相同之燒成條件燒成,藉此製作具有與上述實施例 相同尺寸之波長變換構件。 所得波長變換構件之三點彎曲強度係以與上述實施例 相同之方法測定,其值為13〇MPa。 由以上結果可知,藉由加熱延伸燒結體預成形物而可 16 323297 201222884 製作高強度的波長變換構件。 【圖式簡單說明】 第1圖係本發明一實施型態之光源的示意側面圖。 第2圖係燒結體預成形物之示意斜視圖。 第3圖係用以說明加熱延伸步驟之示意側面圖。 【主要元件符號說明】 1 光源 2 合成光 10 波長變換構件 10a 螢光 20 發光元件 20a 激發光 30 燒結體預成形物 31 加熱器 32 輥 to 燒結體預成形物延伸前的厚度 tl 燒結體預成形物延伸後的厚度 17 323297Softening point of glassy powder: 850 °C Formation of inorganic phosphor powder: Y3 (Al, Gd) 5〇12 : Ce2+ 15 323297 201222884 Average particle size of inorganic phosphor powder (D50) : 2〇#m The highest temperature of the firing: 850 ° C. Environment at the time of firing: Ambient pressure at the time of air firing: 100 Pa Next, the obtained sintered body was cut into a rectangular parallelepiped shape having a width of 15 mm, a thickness of 45 mm, and a length of 100 nm to prepare a base material. Next, this base material was placed in an extension molding machine, and transferred to a forming furnace maintained at 1 〇 2 〇艽 (softening point + 170 C) at a transport speed of limn/min, and the outlet of the forming furnace was pulled out at a speed of 225 mm/min. By cutting the drawn molded body by an automatic cutter, a rectangular length-changing member having a width of 1 mm, a thickness of 0.3 coffee, and a length of 300 mm can be produced. When it is confirmed that the wavelength conversion member is irradiated with light of a blue LED (light emission wavelength: 460 nm), white light is emitted. The three-point bending strength of the wavelength conversion member obtained in the present example is 250 MPa in accordance with JIS-R16 (H' measured by Aut〇Graph AG_1〇kNIS manufactured by Shimadzu Corporation). (Comparative Example) Production was carried out in the above-described examples. The glass powder and the inorganic phosphor powder are a glass paste having a mass ratio of 9: 1. The glass paste is applied onto the PET film to prepare a green sheet. Thereafter, the green sheet is used in the same manner as the above embodiment. A wavelength conversion member having the same dimensions as those of the above-described examples was produced by firing in the same firing conditions. The three-point bending strength of the obtained wavelength conversion member was measured in the same manner as in the above Example, and its value was 13 MPa. From the above results, it is understood that a high-strength wavelength conversion member can be produced by heating and stretching the sintered body preform. 16 323 297 201222884. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic side view of a light source according to an embodiment of the present invention. Fig. 2 is a schematic perspective view of a sintered body preform. Fig. 3 is a schematic side view for explaining a heating extension step. [Main component symbol description] 1 Light source 2 Fluorescent light-emitting element 10a 20 10 20a excitation light wavelength conversion member 30 sintered preform 31 roller heater 32 to a thickness of the preformed sintered body after the sintered body extends in front of the thickness tl extends preformed 17323297

Claims (1)

201222884 七、申清專利範圍: 1. 一種波長變換構件之製造方法,藉由將無機螢光體粉末 與玻璃粉末之燒結體預成形物(preform)加熱延伸而成 形為波長變換構件。 2. 如申請專利範圍第1項所述之波長變換構件之製造方 法’前述燒結體預成形物之加熱延伸係在等於或大於前 述玻璃粉末之軟化點但等於或小於較前述玻璃粉末之 軟化點高200X:之溫度之溫度下進行。 3. 如申請專利範圍第1項或第2項所述之波長變換構件之 製造方法’形成含有前述無機螢光體與前述玻璃粉末但 不含結合劑之成形物,並將前述成形物在減壓環境下燒 成而形成前述燒結體預成形物。 4. 一種波長變換構件,係將無機螢光體粉末與玻璃粉末之 燒結體預成形物加熱延伸成形而得到。 5·如申請專利範圍第4項所述之波長變換構件,該波長變 換構件為板狀或棒狀。 6.如申請專利範圍帛5項所述之波長變換構件,該波長變 換構件為長度尺寸與厚度尺寸的比為⑽:1以上之板 狀物。 7·如申凊專利範圍帛4項至第6項任-項所述之波長變換 構件’其中之前述無機螢光體粉末為由選自氧化物無機 螢光體、氮化物無機螢光體、氧氮化物無機螢光體、硫 化物無機螢光體、氧硫化物無機螢光體、稀土金屬硫化 物無機螢光體、銘酸鹽化物無機螢光體、以及齒素填酸 1 323297 201222884 卜 鹽化物無機螢光體中之一種以上之物質構成。 8. 如申請專利範圍第4項至第7項任一項所述之波長變換 構件,在前述波長變換構件表面上,在每0. 25mm2之面 積中平均存在數目為100條以下之長度30 μ m以上、深 度0. 05 /z in以上的線狀溝。 9. 一種光源,其具備: 波長變換構件,其為如申請範圍第4項至第8項任 一項所述者;以及 發光元件,其為對於前述波長變換構件發出前述波 長變換構件之激發光。 10. 如申請專利範圍第9項所述之光源,其中,前述發光元 件為LED。 11. 如申請專利範圍第9項或第10項所述之光源,其中, 前述發光元件射出藍色光,前述波長變換構件吸收一部 分前述藍色光而發出黃色光,並且藉由前述藍色光與前 述黃色光之合成而發出白色光。 12. 如申請專利範圍第9項至第11項任一項所述之光源, 係具備複數個前述發光元件。 2 323297201222884 VII. The scope of the patent application: 1. A method for producing a wavelength conversion member, which is formed by converting a sintered body preform of an inorganic phosphor powder and a glass powder into a wavelength conversion member. 2. The method for producing a wavelength conversion member according to claim 1, wherein the heating extension of the sintered body preform is equal to or greater than a softening point of the glass powder but equal to or less than a softening point of the glass powder. It is carried out at a temperature of 200X: high. 3. The method for producing a wavelength conversion member according to claim 1 or 2, wherein a molded article containing the inorganic phosphor and the glass powder but not containing a binder is formed, and the molded article is reduced. The sintered body preform is formed by firing in a pressure environment. A wavelength conversion member obtained by heating and stretching a sintered body preform of an inorganic phosphor powder and a glass powder. 5. The wavelength conversion member according to claim 4, wherein the wavelength conversion member has a plate shape or a rod shape. 6. The wavelength conversion member according to claim 5, wherein the wavelength conversion member is a plate having a ratio of length dimension to thickness dimension of (10):1 or more. The wavelength conversion member of the invention of claim 4, wherein the inorganic phosphor powder is selected from the group consisting of an oxide inorganic phosphor, a nitride inorganic phosphor, Oxynitride inorganic phosphor, sulfide inorganic phosphor, oxysulfide inorganic phosphor, rare earth metal sulfide inorganic phosphor, acid salt inorganic phosphor, and dentate acid filling 1 323297 201222884 One or more substances of a salted inorganic phosphor. 8. The wavelength conversion member according to any one of claims 4 to 7, wherein on the surface of the wavelength conversion member, an average number of 100 or less is 30 μm in an area of 0.25 mm 2 . a linear groove of m or more and a depth of 0.05 / z in or more. A light source, comprising: a wavelength conversion member according to any one of items 4 to 8; and a light-emitting element that emits excitation light of the wavelength conversion member to the wavelength conversion member . 10. The light source of claim 9, wherein the illuminating element is an LED. The light source according to claim 9 or 10, wherein the light-emitting element emits blue light, the wavelength conversion member absorbs a part of the blue light to emit yellow light, and the blue light and the yellow color are The synthesis of light produces white light. 12. The light source according to any one of claims 9 to 11, comprising a plurality of the light-emitting elements. 2 323297
TW100125935A 2010-08-02 2011-07-22 Manufactoring method of wavelength conversion component,wavelength conversion component and light source TWI591862B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010173451A JP5678509B2 (en) 2010-08-02 2010-08-02 Method for manufacturing wavelength conversion member, wavelength conversion member and light source

Publications (2)

Publication Number Publication Date
TW201222884A true TW201222884A (en) 2012-06-01
TWI591862B TWI591862B (en) 2017-07-11

Family

ID=45559286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100125935A TWI591862B (en) 2010-08-02 2011-07-22 Manufactoring method of wavelength conversion component,wavelength conversion component and light source

Country Status (3)

Country Link
JP (1) JP5678509B2 (en)
TW (1) TWI591862B (en)
WO (1) WO2012017776A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2632868A1 (en) 2010-10-28 2013-09-04 Corning Incorporated Phosphor containing glass frit materials for led lighting applications
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
WO2013148783A1 (en) 2012-03-30 2013-10-03 Corning Incorporated Bismuth borate glass encapsulant for led phosphors
JP6019842B2 (en) * 2012-07-10 2016-11-02 日本電気硝子株式会社 Method for manufacturing wavelength conversion member, wavelength conversion member and light emitting device
US10017849B2 (en) 2012-11-29 2018-07-10 Corning Incorporated High rate deposition systems and processes for forming hermetic barrier layers
US9202996B2 (en) 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
EP3020076B1 (en) * 2013-07-08 2017-09-06 Koninklijke Philips N.V. Wavelength converted semiconductor light emitting device
WO2015020859A2 (en) 2013-08-05 2015-02-12 Corning Incorporated Luminescent coatings and devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594383B2 (en) * 1977-08-06 1984-01-30 日本電気硝子株式会社 Manufacturing method of glass thin plate
WO1989007580A1 (en) * 1988-02-22 1989-08-24 Nippon Electric Glass Co., Ltd. Method of and apparatus for manufacturing thin glass plates
US7231786B2 (en) * 2004-07-29 2007-06-19 Corning Incorporated Process and device for manufacturing glass sheet
JP5242905B2 (en) * 2006-04-19 2013-07-24 日本電気硝子株式会社 Luminescent color conversion member manufacturing method and luminescent color conversion member
JP2008021868A (en) * 2006-07-13 2008-01-31 Nippon Electric Glass Co Ltd Phosphor composite member
JP5270862B2 (en) * 2007-05-15 2013-08-21 信越石英株式会社 Copper-containing silica glass, method for producing the same, and xenon flash lamp using the same
JP5311281B2 (en) * 2008-02-18 2013-10-09 日本電気硝子株式会社 Wavelength conversion member and manufacturing method thereof
JP5257854B2 (en) * 2010-02-25 2013-08-07 日本電気硝子株式会社 Luminescent color conversion member

Also Published As

Publication number Publication date
WO2012017776A1 (en) 2012-02-09
JP2012031328A (en) 2012-02-16
TWI591862B (en) 2017-07-11
JP5678509B2 (en) 2015-03-04

Similar Documents

Publication Publication Date Title
TW201222884A (en) Manufacturing method of wavelength conversion component, wavelength conversion component and light source
KR102271648B1 (en) Wavelength conversion member and light emitting device using same
JP5511820B2 (en) Alpha-sialon phosphor
TWI585055B (en) Glass material, fluorescent composite material, and light emitting device
TW201140891A (en) Warelength converting member, optical elemant and manufacturing method for wavelength converting member
JP6425001B2 (en) Wavelength conversion material, wavelength conversion member and light emitting device
CN103395997B (en) A kind of white light LEDs rare earth doping transparent glass-ceramic and preparation method thereof
TWI657064B (en) Fluorescent glass-ceramic material, method for manufaturing the same, and light emitting device including the same
JP5854367B2 (en) Method for manufacturing phosphor composite member
JP6222452B2 (en) Wavelength conversion member and light emitting device
CN106479500A (en) A kind of luminescent glass ceramic and its preparation method and the application in LED illumination device
JP2013055269A (en) Wavelength conversion member and light-emitting device
JP6365828B2 (en) Glass used for wavelength conversion material, wavelength conversion material, wavelength conversion member, and light emitting device
CN106634997A (en) Composite phosphate fluorophor and application thereof
JP5697473B2 (en) Phosphor, method for manufacturing the same, and light emitting device
CN107098582B (en) White light luminescent glass with high thermal stability and borate matrix for LED and preparation method thereof
JP4752067B2 (en) Phosphor for light emitting diode
JP7022367B2 (en) Glass used as wavelength conversion material, wavelength conversion material, wavelength conversion member and light emitting device
JP6617948B2 (en) Wavelength conversion member and light emitting device
KR20190062694A (en) Phosphor in glass composite, LED device and LCD display using the same
CN104073257B (en) A kind of thiosilicic acid salt fluorophor and application thereof
JP2012162634A (en) Phosphor, production method for same, and light-emitting device
JP2007314657A (en) Wavelength converting material using fluorescent substance
CN103855287B (en) A kind of light-emitting device and the luminescent device with the light-emitting device
JP2007314658A (en) Light emitting device