TW201222795A - Method of manufacturing a plurality of optical devices - Google Patents

Method of manufacturing a plurality of optical devices Download PDF

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Publication number
TW201222795A
TW201222795A TW100120558A TW100120558A TW201222795A TW 201222795 A TW201222795 A TW 201222795A TW 100120558 A TW100120558 A TW 100120558A TW 100120558 A TW100120558 A TW 100120558A TW 201222795 A TW201222795 A TW 201222795A
Authority
TW
Taiwan
Prior art keywords
filter
substrate
optical
wafer
wafer level
Prior art date
Application number
TW100120558A
Other languages
English (en)
Chinese (zh)
Inventor
Hartmut Rudmann
Peter Riel
Original Assignee
Heptagon Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Oy filed Critical Heptagon Oy
Publication of TW201222795A publication Critical patent/TW201222795A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Filters (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Studio Devices (AREA)
TW100120558A 2010-06-14 2011-06-13 Method of manufacturing a plurality of optical devices TW201222795A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35438910P 2010-06-14 2010-06-14

Publications (1)

Publication Number Publication Date
TW201222795A true TW201222795A (en) 2012-06-01

Family

ID=44454697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100120558A TW201222795A (en) 2010-06-14 2011-06-13 Method of manufacturing a plurality of optical devices

Country Status (8)

Country Link
US (1) US20130162882A1 (OSRAM)
EP (1) EP2580781A1 (OSRAM)
JP (1) JP2013531812A (OSRAM)
KR (1) KR20130093072A (OSRAM)
CN (1) CN103201838A (OSRAM)
SG (1) SG186214A1 (OSRAM)
TW (1) TW201222795A (OSRAM)
WO (1) WO2011156926A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621252B (zh) * 2013-04-12 2018-04-11 豪威科技股份有限公司 晶圓級陣列相機

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201606075XA (en) * 2011-08-10 2016-09-29 Heptagon Micro Optics Pte Ltd Opto-electronic module and method for manufacturing the same
US9595553B2 (en) 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
SG11201506393YA (en) * 2013-02-22 2015-09-29 Heptagon Micro Optics Pte Ltd Optical imaging apparatus, in particular for computational imaging, having further functionality
US9658109B2 (en) 2013-03-15 2017-05-23 Heptagon Micro Optics Pte. Ltd. Non-contact thermal sensor module
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US20170047362A1 (en) * 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
DE102016200287A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtungen, Verfahren zum Herstellen derselben und Abbildungssystem
CN113272707A (zh) 2019-01-22 2021-08-17 奥林巴斯株式会社 内窥镜用摄像装置的制造方法、内窥镜用摄像装置和内窥镜
CN110534538A (zh) * 2019-09-03 2019-12-03 豪威光电子科技（上海）有限公司 镜头模组及其形成方法
CN110808259A (zh) * 2019-11-25 2020-02-18 华天慧创科技（西安）有限公司 一种晶圆透镜模组
GB202009957D0 (en) * 2020-06-30 2020-08-12 Ams Sensors Singapore Pte Ltd Spacer for an optical device
US11808959B2 (en) 2020-08-11 2023-11-07 Himax Technologies Limited Optical element and wafer level optical module

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US6783900B2 (en) * 2002-05-13 2004-08-31 Micron Technology, Inc. Color filter imaging array and method of formation
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
US7329861B2 (en) * 2003-10-14 2008-02-12 Micron Technology, Inc. Integrally packaged imaging module
EP1542074A1 (en) * 2003-12-11 2005-06-15 Heptagon OY Manufacturing a replication tool, sub-master or replica
KR101227544B1 (ko) * 2004-01-26 2013-01-31 디지털옵틱스 코포레이션 이스트 서브 픽셀 해상도를 가진 박형 카메라
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
WO2008011003A2 (en) * 2006-07-17 2008-01-24 Tessera North America, Inc. Camera system and associated methods
WO2006109638A1 (ja) * 2005-04-08 2006-10-19 Konica Minolta Opto, Inc. 固体撮像素子及びその製造方法
US20070216048A1 (en) 2006-03-20 2007-09-20 Heptagon Oy Manufacturing optical elements
US7572480B2 (en) * 2006-10-19 2009-08-11 Federal-Mogul World Wide, Inc. Method of fabricating a multilayer ceramic heating element
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package
JP2009010261A (ja) * 2007-06-29 2009-01-15 Fujikura Ltd 半導体パッケージおよびその製造方法
TWI505703B (zh) * 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
US20090159200A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
US8610823B2 (en) * 2007-12-19 2013-12-17 Heptagon Micro Optics Pte. Ltd. Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
JP5175620B2 (ja) * 2008-05-29 2013-04-03 シャープ株式会社 電子素子ウェハモジュールおよびその製造方法、電子素子モジュール、電子情報機器
US8828174B2 (en) * 2008-08-20 2014-09-09 Heptagon Micro Optics Pte. Ltd. Method of manufacturing a plurality of optical devices
JP5332423B2 (ja) * 2008-09-08 2013-11-06 ソニー株式会社 撮像装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621252B (zh) * 2013-04-12 2018-04-11 豪威科技股份有限公司 晶圓級陣列相機

Also Published As

Publication number Publication date
CN103201838A (zh) 2013-07-10
SG186214A1 (en) 2013-01-30
WO2011156926A1 (en) 2011-12-22
EP2580781A1 (en) 2013-04-17
JP2013531812A (ja) 2013-08-08
US20130162882A1 (en) 2013-06-27
KR20130093072A (ko) 2013-08-21

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