201222707 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種基板處理系統，更詳細地，涉及一種對基板進行蒸鍍 等的基板處理系統。 【先前技術】 OLED是指有機發光二極體，有機EL(Electro Luminescence ’電子發光) 或OLED(Organic Light-Emitting Diode，有機發光二極體)是發光的層由有機 化合物形成的薄膜發光二極體。 由於構成OLED的像素直接發光，因而光的表示範圍大於LCD(Liquid Crystal Display，液晶顯示器)且不需要背光(Backlight)，因此表現出優良的 黑色等級，並且，OLED具有相比LCD更快的反應速度，並能夠折疊。 OLED 大分為 PM OLED(Passive Matrix Organic Light-Emitting Diode， 被動式有機發光二極體)和 AM OLED(Active Matrix Organic Light-Emitting Diode ’主動式有機發光二極體），並根據發光方式和有機物等再細分。 隨著最近視頻文件的廣泛運用，響應速度相比LCD快1〇〇〇倍的OLED 已在智慧型手機顯示器或MP3P顯示器等小型顯示器市場站穩了腳步。 另一方面，OLED由形成於透明基板上的ITO電極層；有電洞注入層 (Hole Inject Layer ; HIL)，電洞傳輸層(Hole Transport Layer ; HTL)，R( Red， 紅）、G(Green ’ 綠）' B(Blue ’ 藍)等發光層(Emitting Material Layer ; EML)， 電子傳輸層(Electron Transport Layer ; ETL)，電子注入層(Electron lnject201222707 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate processing system, and more particularly to a substrate processing system for vapor deposition of a substrate or the like. [Prior Art] OLED refers to an organic light-emitting diode, and an organic EL (Electro Luminescence) or an OLED (Organic Light-Emitting Diode) is a thin-film light-emitting diode formed of an organic compound. body. Since the pixels constituting the OLED directly emit light, the range of light representation is larger than that of an LCD (Liquid Crystal Display) and does not require a backlight (Backlight), thus exhibiting an excellent black level, and the OLED has a faster reaction than the LCD. Speed and fold. The OLED is largely divided into a PM OLED (Passive Matrix Organic Light-Emitting Diode) and an AM OLED (Active Matrix Organic Light-Emitting Diode), and is based on a light-emitting method and an organic substance. Subdivision. With the recent widespread use of video files, OLEDs that respond 1x faster than LCDs have gained a foothold in the small display market, such as smart phone displays or MP3P displays. On the other hand, the OLED is composed of an ITO electrode layer formed on a transparent substrate; a Hole Inject Layer (HIL), a Hole Transport Layer (HTL), R (Red, Red), G ( Green 'Green' B (Blue 'Blue') (Emitting Material Layer; EML), Electron Transport Layer (ETL), Electron Injection Layer (Electron lnject)
Layer ; EIL)等依次層壓於IT0電極層上的有機膜；形成於有機膜上的電極 層構成。 具有如上所述的結構的OLED通過包括如下的製程製造而成：IT〇層 形成步驟，在基板上形《ΙΤΟ層；有機膜形成步驟，在形成有IT〇層的灵 板上形成有顧；以及電極層臟轉，在職有雜朗基板上形曰成^ 極層。 雖然OLED具有如上所述的優點，但由於她LCD，原材料貴且產率 低，導致生產率遠不如LCD，因而目前為止仍未普及化。 201222707 由此，鑒於如上所述的優點並順應諸如智慧型手機顯示器或mp3p顯 示器等小型顯示器市場的需求，切實需要推出一種能夠提高OLED的生產 率’並能夠降低製造成本的基板處理系統。 【發明内容】 本發明的目的在於，認識到如上所述的缺點以及必要性，提供一種能 夠通過多個搬送模塊以及與各搬送模塊結合的多個製程模塊來進行更加^ 效的基板處理製程，從而提高生產率的基板處理系統。 本發明的另一目的在於，提供一種能夠通過以最小化的設置空間配置 基板處理系統，從而顯著降低基板製造成本的基板處理系統。 本發明是為了達到上述本發明的目的而提出的，本發明公開了一種基 板處理系統，其特徵在於，包括：兩個以上搬送模塊；多個製程模塊，在 各個上述搬送模塊上結合兩個以上上述製程模塊；以及一個以上連接模 塊，將多個上述搬送模塊中相鄰的兩個搬送模塊相互連接起來，並能夠與 上述搬送模塊進行基板交換；上述連接模塊臨時儲存基板。 、 並且，本發明公開了一種基板處理系統，其特徵在於，包括：兩個以 上搬送模塊；多個製程模塊，在各個上述搬送模塊上結合兩個以上上述製 程模塊·’以及一個以上連接模塊，將多個上述搬送模塊中相鄰的兩個搬送 模塊相互連接起來，並能夠與上述搬送模塊進行基板交換；上述連接模塊 對基板進行加工。 相鄰的上述兩個搬送模塊藉由兩個以上、優選為兩個的上述連接模塊 而相連接。 上述連接模塊進行蝕刻、蒸鍍以及熱處理中的至少某一道製程。並且， 上述連接模塊用作臨時儲存基板的緩衝器。 上述連接模塊’以基板相對於地面垂直或傾斜的狀態被輸送。 多個上述搬送模塊以及上述連接模塊，以基板相對於地面垂直或傾斜 的狀態被輸送；上述製程模塊中的至少一部分基板相對於地面垂直或倾粗 的狀態來進行基板處理。 ~ " 201222707 在上述基板處理系統中’從外部接收基板的裝載互鎖模塊和向外部傳 遞加工後的基板的卸載互鎖模塊與一個搬送模塊結合或分別與相互不同的 搬送模塊結合。 上述搬送模塊，其平行於地面的平面形狀為多邊形結構。 上述搬送模塊的各邊中至少一彳固邊上結合把基板相對於地面垂直或傾 斜的狀態而被輸送的兩個以上的上述製程模塊。 上述搬送模塊包括：一對放置部，用於放置基板；旋轉驅動部，所述 旋轉驅動部旋轉所述放置部，使得所述放置部分別與所述製程模塊以及所 述連接模塊之間進行基板交換；基板移動部，使所述放置部分別與所述製 程模塊以及所述連接模塊之間進行基板交換。 上述搬送模塊依次配置成一列；相鄰的上述兩個搬送模塊通過兩個上 述連接模塊相連接；在上述連接模塊，以基板相對於地面垂直或傾斜的狀 態被輸送；從外部接收基板的裝載互鎖模塊與第一個上述搬送模塊結合， 向外部傳遞加工後的基板的卸載互鎖模塊與最後一個上述搬送模塊結合。 以上述基板的輸送方向為基準，上述製程模塊以及上述連接模塊相互 配置對稱。 在上述基板處理系統中，相鄰的上述兩個搬送模塊通過兩個上述連接 模塊相連接；上述連接模塊，以基板相對於地面垂直或傾斜的狀態被輸送； 從外部接收基板的裝載互鎖模塊和向外部傳遞加工後的基板的卸載互鎖模 塊與一個上述搬送模塊結合；上述基板經由各模塊的輸送路徑為封閉曲線。 在上述基板處理系統中，所述搬送模塊以及所述連接模塊，以基板相 對於地面垂直或傾斜的狀態被輸送；所述製程模塊包括：一個以上垂直製 程模塊和一個以上水平製程模塊，所述垂直製程模塊在基板相對於地面垂 直或傾斜的狀態下進行基板處理，所述水平製程模塊在基板相對於地面水 平的狀態下進行基板處理。 在上述基板處理系統中，使基板以相對於地面垂直或水平的狀態旋轉 的旋轉模塊設置在所述搬送模塊、所述搬送模塊與所述水平製程模塊之間 以及所述水平製程模塊中的任一模塊上。 在上述處理室中的至少一部分進行OLED基板上形成有機膜的蒸鍍製 201222707 本發明的基減理祕具有如下的優點：構成兩個以上 程模塊的搬賴塊，麵連频塊將相鄰的搬麵塊連 』 顯著提高基板處理的製程速度。 2且’本㈣的基減理系統具有如下的優點：構成兩個以上結 多個製程模塊的搬送模塊，並由將相鄰的搬送模塊連接起來的連接模塊構 成，從而能夠處理更多的基板，因此能夠顯著提高基板處理的製程速度。 ，且’本發明的基板處理系統具有如下的優點：構成兩個以上結合有 夕個製程模塊的搬送，並㈣相_搬賴塊連接起來的連接模塊構 成’從而能夠根據連續進行多個製程等基板處理的製程特性，按昭各 適當地配置製程模塊，因此能夠進行有效的基板處理。 …、 並且’本發明的基板處理系統具有如下的優點：構成兩個以上搬送模 塊’並用兩個以上制是兩個連接模塊將相__搬送模塊連接起來， 從而能夠提高相㈣兩麵賴塊之_基板交換速度，讀高基板 速度。 特別是，構成兩個將相鄰的兩個搬送模塊連接起來的連接模塊，從而 組成能夠將錢浦塊詩錄_翻相_觀雌_誠者通過 使各連接觀域齡行狀的触，即可以交魏行加時使其他 連接模塊接钱傳雜板等❹她成，因此钱_成纽的 系統的優點。 並且，本發明的基板處理彡統具有如下的優點：構成兩似上搬送模 塊’而且》目鄰_纖賴塊連接絲崎賴塊麟賴塊垂直结 合，即連接模塊和搬賴塊以基板姆於地面垂直驗臟傳賴方式相 連接，從而能夠縮小基板處理系統所占空間。 進而’本發明的基板處_統具有如下的優點：構成兩個以上搬送模 塊’而且將婦的兩傭賴塊連接起來的連接顯與搬賴塊垂直結 合，從而能夠結合兩個以上連接模塊。 並且本發明的基板處理系統具有如下的優點：具有在基板的垂直狀 態下進行基域理的垂直製織塊以及在基板的水平狀態下進行基板處理 的水平製程模塊，因而能夠進行更多樣化、最佳化的基板處理，例如根據 各基板處理製程特性來使用垂直製程模塊或水平製程模塊等。 201222707 特別是’本發明的基板處理系統具有如下的優點：還具有能夠使基板 從垂直狀態旋轉成水平狀態，從水平狀態旋轉成垂直狀態的旋轉模塊，從 而能夠進行垂直製程模塊以及水平製程模塊的組合。 【實施方式】 下面’參照附圖對本發明的基板處理系統進行詳細說明。附圖只用於 表示基板處理系統的配置以及結構，為便於說明，截面及大小將省略或與 實際相比有所誇張。 第1圖是本發明的基板處理系統的配置圖，第2圖是第1圖的基板處 理系統中的基板以及用於輸送基板的基板支架的俯視圖。 如第1圖所示’本發明的基板處理系統包括：兩個以上搬送模塊1〇〇 ; 多個製程模塊200’與各個搬送模塊1〇〇結合；以及一個以上連接模塊3〇〇, 將多個搬送模塊1〇〇中的相鄰的兩個搬送模塊1〇〇相互連接起來，並能夠 與搬送模塊100進行基板交換。Layer; EIL) is an organic film sequentially laminated on the ITO electrode layer; and an electrode layer formed on the organic film. The OLED having the structure as described above is manufactured by a process including the following steps: an IT layer formation step of forming a "germanium layer" on the substrate; an organic film formation step, which is formed on the layer on which the IT layer is formed; And the electrode layer is dirty, and it is formed into a layer on the substrate. Although the OLED has the advantages as described above, due to her LCD, the raw material is expensive and the yield is low, resulting in productivity that is far less than that of the LCD, and thus has not been popularized so far. 201222707 Thus, in view of the advantages described above and in response to the demand for a small display market such as a smart phone display or an mp3p display, there is a real need to introduce a substrate processing system capable of increasing the productivity of OLEDs and reducing manufacturing costs. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing process capable of performing a more efficient substrate processing process by a plurality of transfer modules and a plurality of process modules combined with the transfer modules, in view of the above disadvantages and necessity. Thereby a substrate processing system that improves productivity. Another object of the present invention is to provide a substrate processing system capable of significantly reducing substrate manufacturing costs by arranging a substrate processing system with a minimum of installation space. The present invention has been made to achieve the above object of the present invention. The present invention discloses a substrate processing system including two or more transfer modules, and a plurality of process modules, which are combined with two or more on each of the transfer modules. And the one or more connection modules, wherein two adjacent ones of the plurality of transfer modules are connected to each other, and the substrate can be exchanged with the transfer module; and the connection module temporarily stores the substrate. Furthermore, the present invention discloses a substrate processing system including: two or more transfer modules; a plurality of process modules, wherein two or more process modules and one or more connection modules are combined on each of the transfer modules, The two adjacent transport modules of the plurality of transport modules are connected to each other, and the substrate can be exchanged with the transport module. The connection module processes the substrate. The two adjacent transfer modules are connected by two or more, preferably two, of the above connection modules. The connection module performs at least one of etching, vapor deposition, and heat treatment. And, the above connection module is used as a buffer for temporarily storing the substrate. The above connection module ' is transported in a state where the substrate is perpendicular or inclined with respect to the ground. The plurality of transfer modules and the connection module are transported in a state where the substrate is perpendicular or inclined with respect to the ground; and at least a part of the process modules are subjected to substrate processing in a state of being vertical or inclined with respect to the ground. ~ " 201222707 In the above substrate processing system, the load interlock module that receives the substrate from the outside and the unloading interlock module that transfers the processed substrate to the outside are combined with one transfer module or separately from the transfer modules that are different from each other. The transport module has a polygonal structure parallel to the plane of the ground. At least one of the sides of each of the transport modules is coupled to two or more of the process modules that are transported in a state in which the substrate is perpendicular or inclined with respect to the ground. The transport module includes: a pair of placement portions for placing the substrate; and a rotation driving portion, the rotation driving portion rotating the placement portion such that the placement portion performs a substrate between the process module and the connection module The substrate moving portion exchanges the substrate with the process module and the connection module. The transport modules are sequentially arranged in a row; the adjacent two transport modules are connected by two connection modules; the connection module is transported in a state where the substrate is perpendicular or inclined with respect to the ground; and the loading of the substrates is received from the outside. The lock module is coupled with the first transfer module, and the unloading interlock module that transfers the processed substrate to the outside is combined with the last transfer module. The process module and the connection module are symmetrically arranged with each other based on the transport direction of the substrate. In the above substrate processing system, the adjacent two transfer modules are connected by two connection modules; the connection module is transported in a state where the substrate is perpendicular or inclined with respect to the ground; and the load lock module that receives the substrate from the outside And an unloading interlock module that transfers the processed substrate to the outside is combined with one of the transport modules; the transport path of the substrate via each module is a closed curve. In the above substrate processing system, the transport module and the connection module are transported in a state where the substrate is perpendicular or inclined with respect to the ground; the process module includes: one or more vertical process modules and one or more horizontal process modules, The vertical process module performs substrate processing in a state where the substrate is perpendicular or inclined with respect to the ground, and the horizontal process module performs substrate processing in a state where the substrate is horizontal with respect to the ground. In the above substrate processing system, a rotation module that rotates the substrate in a state perpendicular or horizontal with respect to the ground is provided between the transfer module, the transfer module and the horizontal process module, and the horizontal process module On a module. At least a part of the processing chamber is formed by vapor deposition of an organic film on an OLED substrate. 201222707 The basic reduction of the present invention has the following advantages: a blocking block constituting two or more modules, and a surface connecting block will be adjacent The moving surface block significantly increases the processing speed of the substrate processing. 2 and the basic reduction system of the present invention has the following advantages: a transfer module that constitutes two or more process modules, and a connection module that connects adjacent transfer modules, so that more substrates can be processed. Therefore, the processing speed of the substrate processing can be significantly improved. Further, the substrate processing system of the present invention has the advantages of constituting two or more transfer processes in which a plurality of process modules are combined, and (four) phase-connecting blocks are connected to each other to constitute a plurality of processes, etc. Since the process parameters of the substrate processing are appropriately arranged in accordance with the process modules, efficient substrate processing can be performed. Further, the substrate processing system of the present invention has the following advantages: two or more transfer modules are formed, and two or more connection modules are used to connect the phase transfer modules, thereby improving the phase (four) two-sided block. The substrate exchange speed, read high substrate speed. In particular, the two connection modules that connect the two adjacent transport modules are formed, thereby forming a touch that can make the Qianpu block poems _ _ _ _ _ _ _ _ _ _ _ _ _ Can pay Wei line extra time to make other connection modules to pick up the money and pass the board and so on, so the advantage of the money _ Cheng New system. Moreover, the substrate processing system of the present invention has the following advantages: constituting two similar transfer modules 'and the same as the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is connected to the ground vertical inspection method to reduce the space occupied by the substrate processing system. Further, the substrate unit of the present invention has the advantage that the two or more transfer modules are formed, and the connection connecting the two commissions of the woman is vertically combined with the transfer block, so that two or more connection modules can be combined. Further, the substrate processing system of the present invention has the advantages of having a vertical weaving block for performing the base region in the vertical state of the substrate and a horizontal process module for performing the substrate processing in the horizontal state of the substrate, thereby enabling more diversification, Optimized substrate processing, for example, using a vertical process module or a horizontal process module according to each substrate processing process characteristic. 201222707 In particular, the substrate processing system of the present invention has an advantage of having a rotation module capable of rotating a substrate from a vertical state to a horizontal state and from a horizontal state to a vertical state, thereby enabling a vertical process module and a horizontal process module. combination. [Embodiment] Hereinafter, a substrate processing system of the present invention will be described in detail with reference to the accompanying drawings. The drawings are only intended to illustrate the configuration and construction of the substrate processing system, and for ease of illustration, the cross-section and size will be omitted or exaggerated compared to the actual. Fig. 1 is a layout view of a substrate processing system of the present invention, and Fig. 2 is a plan view of a substrate in the substrate processing system of Fig. 1 and a substrate holder for transporting the substrate. As shown in FIG. 1 , the substrate processing system of the present invention includes: two or more transfer modules 1 〇〇; a plurality of process modules 200 ′ are combined with the respective transfer modules 1 ;; and more than one connection module 3 〇〇 The two adjacent transport modules 1〇〇 of the transport modules 1 are connected to each other, and can exchange substrates with the transport module 100.
本發明的基板處理系統中’作為基板處理對象的基板10只要*LCD 面板用玻璃基板、半導體基板、太陽能電子元件等基板處理的對象即可， 就能夠採祕意的基板。制是，將0LED基板，例如形成有IT0層的基 板作為主要對象。 如第2圖所示，上述基板10根據基板處理製程以相對於地面水平或垂 直的狀紐輸送’而OLED基板則㈣定於基板支架u雜態被輸送。 上述基板支架11用於以穩定的狀態輸送薄膜基板1〇，只要能夠穩定地 支撐基板10，就能採用任意結構。 上述搬送模塊100是，多個模塊結合，來與各模塊進行傳遞或引出基 板10等基板父換’纟包括搬送腔室和設置在搬送腔室内的搬送機器人等 種結構。 在上述搬送模塊1GG ’搬送腔室的側面形成用於與各模塊結合的門，考 慮到製程模塊般在規定的真空壓力下進行加工，而與麟維持與製 程模塊200的壓力對應的壓力的排氣系統相連接。 、 上述搬送模塊100的相對於地面平行的平面形狀實際具有圓形結構、 橢圓形結構1邊形結構㈣形、六邊形、人伽稱各種形狀，本實施 201222707 例中舉例了長方形結構的情況。優選地，上述搬送模塊100具有四邊形、 六邊形、八邊形等偶數條邊的多邊形結構。 在形成在上述搬送模塊100的門上設置閘閥，該閘閥用於開閉該門， 以隔離與門結合的多個模塊。 另一方面’在上述搬送模塊1〇〇内設置用於與各模塊進行基板交換的 搬，機器人110。在這裡，基板交換不僅指接收和傳遞基板10的情況，還 指單方面地傳遞基板10或單方面地接收基板1〇的情況。 上述搬送機器人110只要是能與各模塊交換基板10的結構，就能採用 各種結構’如第1圖所示，上述搬送機器人110包括：一個以上放置部111， 用於放置基板10 ;旋轉驅動部(未圖示），使放置部U1旋轉，以與放置部 111和各模塊，即多個製程模塊200、連接模塊300、裝載互鎖模塊410以 及卸載互鎖模塊420交換基板1〇 ;以及基板移動部(未圖示），其與放置部 111和各模塊，即多個製程模塊2〇〇、連接模塊3〇〇、裝載互鎖模塊41〇以 及卸載互鎖模塊420交換基板1〇。 上述放置部111根據基板1〇的輸送方式，可以形成為各種結構，例如 以基板10相對於地面水平的水平狀態支撐該基板1〇的結構或以基板1〇相 對於地面垂直或傾斜的狀態支撐該基板1〇的結構。 特別是’上述放置部111以基板10相對於地面垂直或傾斜的狀態支撐 該基板10的情況下’放置部Π1由用於支撐基板10的上下端的滾子等構 成。在這裡’上述基板10以固定於基板支架11的狀態被輸送的情況下， 放置部111通過支撐基板支架11來支撐基板1〇。 上述旋轉驅動部只要能夠使作為與待交換基板10的各模塊對應的位置 的一對放置部111旋轉，就能採用任意的結構。 並且，上述基板移動部於在放置部111位於與待交換基板10的各模塊 對應的位置時，通過使基板ίο移動來實現放置部m與各模塊之間的基板 交換’上述基板移動部能夠形成機器人、輸送滾子等各種結構。 另一方面’如第1圖所示’在放置部111以垂直狀態支撐基板1〇的情 況下，還在上述搬送機器人110設置能夠裝載大量基板10的緩衝部112。 上述旋轉驅動部用於使放置有基板10的放置部111旋轉移動到與各模 塊對應的位置，只要能夠使放置部111旋轉，就能採用任意結構。 201222707 第3a圖和第3b圖分別是第1圖的基板處理系統令搬送模塊和與搬送 模塊相結合的各模塊之間進行基板交換過程的實施例的概念圖。 另一方面，上述放置部1U為一對相向配置的結構，以進行有效的基 板交換。 在上述搬送模塊100的平面形狀為四邊形、六邊形、八邊形等多邊形 結構’在多邊形結構的搬送腔室100的一側面結合製程模塊、連接模塊、 裝載互鎖模塊、卸載互鎖模塊等兩個模塊的情況下，搬送機器人11()的一 對放置部111分別位於與兩個各模塊對應來交換基板的位置。 如上所述，一對放置部1Π分別位於與兩個各模塊對應的位置時，能 夠與各模塊進行更迅速的基板交換。 例如，如第3a圖所示，一對放置部111能夠與相對應的兩個模塊同時 進行基板交換，因此提高基板交換速度。 並且’如第3b圖所示’在搬送腔室1〇〇為四邊形結構的情況下，一對 放置部111中任一個放置部111與兩個模塊中任一個模塊交換基板，另一放 置部111與對邊的兩個模塊中任一個模塊交換基板，從而能夠提高基板交 換速度。 上述製程模塊200用於從搬送模塊1〇〇接收基板1〇來對基板1〇進行 義鑛、触a玄等規疋的製程，能夠根據不同製程，採用任意的結構。 作為上述製程模塊200的一個例子，由用於形成封閉的處理空間的處 理至、用於支撐基板10的基板支架以及用於向處理空間内供給處理氣體的 氣體供給部構成。 另一方面 在上述基板10為OLED基板的情況下，根據電漿處理 (Plasmatreatment)，在基板10上通過蒸鍍製程依次層壓電洞注入層(hil)、 電洞傳輸層(HTL)、R、G、B等發光师叫、電子傳輸邮TL)、電子注 入層(EIL)等有機膜’但製程模塊·為了進行將有機膜蒸_基板1〇的上 表面的蒸鍍製程，而設置使有機物質蒸發的蒸發裝置。 並且’上述製程模塊200能夠形成各種結構，例如使基板1〇相對於地 面維持水株_同時進行加x(水平製雜塊)或使基板1Q補於地面維 持垂直或傾斜的狀態的同時進行加工(垂直製程模塊)等。 201222707 另一方面，構成多個上述製程模塊200的情況下，可以全部都是垂直 製程模塊’可以全部都是水平製程模塊，也可以一部分是垂直製程模塊而 其餘一部分是水平製程模塊。 並且，上述製程模塊200能夠由多個構成’而以搬送模塊1〇〇為基準 根據對基板10進行加工的順序進行適當配置。 兩個以上上述製程模塊200能夠形成基板10以相對於地面垂直或傾斜 的狀態被輸送的結構，即以垂直狀態與搬送模塊10〇結合。 特別是’在上述搬送模塊1〇〇的平面形狀形成多邊形結構的情況下， 兩個以上製程模塊200以垂直狀態與上述搬送模塊100的各側面中的至少 一側面結合。 上述製程模塊200以垂直狀態與搬送模塊100結合的情況下，由於多 個製程模塊200與一個搬送模塊1〇〇結合，因而能夠大幅提高基板處理系 統的性能以及功能。 即，本發明的基板處理系統通過對一個搬送模塊1〇〇設置多個製程模 塊200,來增加能夠處理的基板1〇的數量，因此不僅能夠提高基板處理速 度，在依次進行多道製程時還能夠進行各種加工。 如第1圖所示，上述連接模塊3〇〇將相鄰的兩個搬送模塊1〇〇連接起 來，使兩個搬送模塊1〇〇之間傳遞基板10，該連接模塊3〇〇能夠形成各種 結構。 此時，上述連接模塊300起到不立即向待傳遞基板1〇的相鄰的搬送模 塊100傳遞基板1〇，而臨時儲存基板10的緩衝器功能。 並且，上述連接模塊300除了基板輸送功能之外，還能夠用作進行触 刻、蒸鍍以及熱處理中的至少某一道製程的製程模塊3〇(^ 在搬送模塊100維持規定的真空壓力的情況下，上述連接模塊3〇〇包 括用於形成封閉空間以像搬送模塊100 一樣維持規定的真空壓力的腔室。 並且，上述連接模塊300由於壓力與搬送模塊1〇〇相同，因而與搬送 模塊100相互連通或通過設置閘閥與搬送模塊1〇〇隔離。 並且，上述連接模塊300設置滾子、導轨等用於輸送基板的結構。 另方面，用兩個以上上述連接模塊300將相鄰的兩個搬送模塊1〇〇 連接起來。 .201222707 用兩個以上連接模塊300、310、320將上述相鄰的兩個搬送模塊100 連接起來的情況下，由於能夠在相鄰的兩個搬送模塊1〇〇之間進行各種形 態的基板交換，因而能夠大幅提升基板處理系統的功能。 即，在用兩個以上連接模塊300、310、320將相鄰的兩個搬送模塊1〇〇 連接起來的情況下，不僅能夠傳遞數量相當於連接模塊3〇〇數量的基板， 還能夠在傳遞基板時將連接模塊300用作暫時保管基板1〇的緩衝器，因而 能夠更有效地在相鄰的兩個搬送模塊100之間傳遞基板。 並且，在兩個連接模塊300中任一個連接模塊310與一方的搬送模塊 100交換基板10時’另一連接模塊320能夠與另一方的搬送模塊100交換 基板，因而能夠提高兩個搬送模塊1〇〇之間的基板交換速度。 並且，適當設計通過將兩個連接模塊300中的一個和另一個區分開後 設置相反的基板交換方向來輸送基板10的執跡，從而對進行各自不同的製 程的多個製程模塊200實現最佳配置。 另一方面，如第1圖所示，上述連接模塊300以在與搬送模塊1〇〇結 合時使基板10以相對於地面垂直或傾斜的狀態被輸送的方式與搬送模塊 100結合，即與搬送模塊1〇〇垂直結合。 即’如果上述連接模塊300與搬送模塊1〇〇垂直結合，就能夠用兩個 連接模塊300以最小的空間將相鄰的兩個搬送模塊1〇〇連接起來。 另一方面’上述基板處理系統還包括從外部接收基板1〇的裝載互鎖模 塊410和向外部傳遞加工後的基板1〇的卸載互鎖模塊42〇。 上述裝載互鎖模塊410用於從大氣壓狀態的外部接收基板1〇來降低壓 力之後再傳遞到真空壓力狀態的搬送模塊2〇〇，該裝載互鎖模塊41〇可以是 各種結構。上述卸載互鎖模塊420用於從真空壓力狀態的搬送模塊2〇〇向 大氣壓狀態的外部排出基板1〇 ’能夠形成各種結構。 上述裝载互鎖模塊410以及卸載互鎖模塊42〇能夠配置成各種形態， 能夠分別與同一個搬送模塊1〇〇結合，此時上述裝載互鎖模塊41〇以及卸 載互鎖模塊420還能夠構成為一個模塊。 並且，上述裝載互鎖模塊410以及卸載互鎖模塊42〇還能夠分別與相 互不同的多個上述搬送模塊1〇〇結合，例如如第丨圖所示，上述裝載互鎖 11 201222707 模塊410與多個搬送模塊100中的第一個搬送模塊1〇〇結合，卸載互鎖模 塊420與最後一個搬送模塊100結合。 另一方面，上述基板處理系統在處理OLED基板的情況下，設置在進 行加工時用於形成特定圖案的光罩(未圖示），需要根據製程條件去除光罩或 更換其他光罩，根據製程條件在製程模塊2〇〇内另行設置用於在引入基板 1〇之前更換光罩的光罩交換模塊(未圖示）。 在這裡，光罩與用於固定基板1〇的基板支架丨〗結合，光罩交換模塊 用於更換與基板支架11結合的光罩。 上述光罩父換模塊作為設置在基板10上用於交換光罩的結構，能夠形 成各種結構，該光罩交換模塊包括與搬送模塊100結合的腔室和設置在腔 室内用於更換與基板支架11結合的光罩的光罩更換裝置。 在這裡，上述光罩交換模塊取代第丨圖製程模塊200中的至少某一個。 並且’上述光罩交換模塊取代連接模塊300中的至少某一個。 ^另一方面，光罩與基板支架11結合在一起而被輸送時才需要光罩交換 模塊，在光罩另行設置在各模塊内的情況下，則不需要光罩交換模塊。 並且，上述光罩交換模塊除了包括一個獨立的腔室之外，還能夠設置 在裝載互鎖模塊410、連接腔室300以及搬送機器人11〇内。 另一方面，上述本發明的基板處理系統的特徵在於，配置多個搬送模 塊100的同時使更多的製程模塊2〇〇與多個搬送模塊1〇〇結合來對更多的 基板10進行基板處理或在一個系統内進行多道待依次進行的製程。 進而，上述搬送模塊100的配置數量是兩個或兩個以上，相鄰的兩個 搬送模塊100通過後文要說明的連接模塊300相互連接，從而能夠對更多 的基板1G進行基減理或在_個纽喊行多道待触進行的基板處理夕。 特別是’與上述搬送模塊100、结合的各模塊，即製程模塊2〇〇、連接模 塊300、裝載互鎖模塊410以及卸載互鎖模塊42〇與搬送模塊⑽垂直肢 的情況相比，本發明能夠實現更多的製程模塊2〇〇的結合。 …σ 第4a圖和第4b圖是作為本發明基板處理系統的另一例， 的輸送方向的實施例的配置圖。 土 另-方面’具有如上所述的結構的基板處理系統能夠依次進行多道製 12 201222707 例如上述基板處理系統如第1圖以及第4a圖所示，多個搬送模塊ίο。 依次配置成一列，相鄰的兩個搬送模塊1〇〇通過兩個連接模塊31〇、32〇相 連接，在連接模塊310、320中基板1〇以相對於地面垂直或傾斜的狀態被 輸送’從外部接收基板10的裝載互鎖模塊410與第一個搬送模塊1〇〇結合， 向外部傳遞加工後基板10的卸載互鎖模塊420與最後一個搬送模塊100結 合0 此時，·多個製程模塊200以及多個連接模塊31〇 ' 320以上述基板1〇 的輸送方向為基準相互對稱地進行配置，多個製程模塊2〇〇以及多個連接 模塊310、320還能夠以基板10的輸送方向為基準上下配置。 在如上所述式的基板處理系統中’如第4a圖所示，基板1〇經由各模 塊的輸送路徑形成兩個曲線。當然，在上述基板處理系統中，通過裝載互 鎖模塊410傳遞的基板1 〇經由各搬送模塊1 〇〇的同時經由與各搬送模塊i⑻ 結合的所有製程模塊200 ’最終通過卸載互鎖模塊420向外部排出。 並且，在上述基板處理系統中，如第4b圖所示，基板1〇的輸送路徑 形成閉合曲線。在這裡，上述基板10的輸送路徑形成閉合曲線的情況下， 如第4b圖所示，裝載互鎖模塊410和卸載互鎖模塊420與一個搬送模塊1〇〇 結合。 第5圖是本發明基板處理系統又一例子的配置圖。 另一方面，與上述搬送模塊100結合的各模塊均與搬送模塊1〇〇垂直 結合，除此之外，還可以是各模塊中一部分垂直結合，而其餘部分以相對 於地面水平地進行基板交換的方式結合，即水平結合。 即，本發明的基板處理系統如第5圖所示，在多個搬送模塊1〇〇以及 多個連接模塊300中’基板10以相對於地面垂直或傾斜的狀態被輸送，並 且多個製程模塊200包括：一個以上垂直製程模塊2〇〇，以基板1〇相對於 地面垂直或傾斜的狀態進行基板處理；以及一個以上水平製程模塊4〇〇，以 基板相對於地面水平的狀態進行基板處理。 此時，通過各模塊輸送的基板10根據各模塊相對於地面成為垂直狀態 或水平狀態，為了在維持垂直狀態的模塊與維持水平狀態的模塊之間進行 基板交換，基板10需要從水平狀態旋轉成垂直狀態或從垂直狀態旋轉成水 平狀態。 13 201222707 由此，在本發明的基板處理系财，使基板1〇旋轉成相對於地面垂直 或水平的旋轉模塊5〇〇設置在搬送模塊·、搬送模塊⑽與 之間以及水平製程模塊中的任意一個位置。 j上述旋轉魏500用於使基板10從水平狀態旋轉成垂直狀態或從垂直 狀態旋轉成水平狀態，該旋轉模塊500能夠形成各種結構。 以上，只是說明關於根據本發明能夠實施的優選實施例的一部分，該 項技術領域具有通常知識者應當理解，本發明的範圍並非限定於上述實施 例，上述說明的本發明的技術思想及其根本都包括在本發明的範圍内。 【圖式簡單說明】 第1圖是本發明的基板處理系統的配置圖； 第2圖是第1圖基板處理系統中的基板以及用於輸送基板的基板支架 的俯視圖； 第3a圖和第3b圖分別是第1圖基板處理系統中搬送模塊和與搬送模 塊相結合的各模塊之間進行基板交換過程的實施例的概念圖； 第4a圖和第4b圖是作為本發明基板處理系統的另一例，改變了基板 的輸送方向的實施例的配置圖；以及 第5圖是本發明的基板處理系統的又一例的配置圖。 【主要元件符號說明】 10 基板 11 基板支架 100 搬送模塊 110 搬送機器人 111 放置部 112 緩衝部 200 製程模塊 300 連接模塊 310 連接模塊 320 連接模塊 201222707 410 420 500 裝載互鎖模塊 卸載互鎖模塊 旋轉模塊In the substrate processing system of the present invention, the substrate 10 to be processed by the substrate can be a substrate to be processed by a substrate such as a glass substrate for a liquid crystal panel, a semiconductor substrate, or a solar electronic component. The OLED substrate, for example, a substrate on which an IT0 layer is formed, is mainly used. As shown in Fig. 2, the substrate 10 is transported in a horizontal or vertical direction with respect to the ground according to the substrate processing process, and the OLED substrate is (4) fixed in the substrate holder. The substrate holder 11 is used to transport the film substrate 1 in a stable state, and any structure can be adopted as long as the substrate 10 can be stably supported. The transfer module 100 is configured such that a plurality of modules are coupled to each other to transfer or take out a substrate replacement such as the substrate 10, including a transfer chamber and a transfer robot provided in the transfer chamber. A door for coupling to each module is formed on a side surface of the transfer module 1GG' transfer chamber, and processing is performed under a predetermined vacuum pressure in consideration of a process module, and the pressure is maintained in accordance with the pressure of the process module 200. The gas system is connected. The plane shape parallel to the ground of the transport module 100 actually has a circular structure, an elliptical structure, a hexagonal structure, a hexagonal shape, and a variety of shapes. In the example of 201222707, a rectangular structure is exemplified. . Preferably, the transport module 100 has a polygonal structure of even-numbered sides such as a quadrangle, a hexagon, and an octagon. A gate valve is provided on the door formed on the conveying module 100, and the gate valve is used to open and close the door to isolate a plurality of modules combined with the door. On the other hand, a robot 110 for carrying out substrate exchange with each module is provided in the transport module 1A. Here, the substrate exchange refers not only to the case of receiving and transmitting the substrate 10 but also to the case where the substrate 10 is unilaterally transferred or the substrate 1 is unilaterally received. The transfer robot 110 can have various configurations as long as it can exchange the substrate 10 with each module. As shown in Fig. 1, the transfer robot 110 includes one or more placement portions 111 for placing the substrate 10 and a rotary drive portion. (not shown), the placement portion U1 is rotated to exchange the substrate 1 with the placement portion 111 and the respective modules, that is, the plurality of process modules 200, the connection module 300, the load interlock module 410, and the unloading interlock module 420; and the substrate A moving portion (not shown) exchanges the substrate 1 with the placement portion 111 and the respective modules, that is, the plurality of process modules 2A, the connection module 3A, the load lock module 41, and the unloading interlock module 420. The placement portion 111 may be formed in various configurations depending on the manner of transporting the substrate 1 , for example, a structure in which the substrate 10 is supported in a horizontal state with respect to the ground level, or a state in which the substrate 1 is vertically or inclined with respect to the ground. The structure of the substrate 1〇. In particular, when the substrate 10 supports the substrate 10 in a state where the substrate 10 is perpendicular or inclined with respect to the ground, the placement portion Π1 is constituted by a roller or the like for supporting the upper and lower ends of the substrate 10. Here, when the substrate 10 is transported in a state of being fixed to the substrate holder 11, the placing portion 111 supports the substrate 1 by supporting the substrate holder 11. The rotation drive unit can have any configuration as long as it can rotate the pair of placement portions 111 which are positions corresponding to the respective modules of the substrate 10 to be exchanged. Further, when the placement portion 111 is located at a position corresponding to each module of the substrate 10 to be exchanged, the substrate moving portion realizes substrate exchange between the placement portion m and each module by moving the substrate ί. Various structures such as robots and conveyor rollers. On the other hand, as shown in Fig. 1, when the placement unit 111 supports the substrate 1 in a vertical state, the transfer robot 110 is provided with a buffer portion 112 capable of loading a large number of substrates 10. The rotation driving unit is configured to rotate the placement portion 111 on which the substrate 10 is placed to a position corresponding to each of the modules, and any configuration can be adopted as long as the placement portion 111 can be rotated. 201222707 Fig. 3a and Fig. 3b are conceptual diagrams respectively showing an embodiment of the substrate exchange process between the transfer module and each module combined with the transfer module in the substrate processing system of Fig. 1. On the other hand, the above-described placement portion 1U is a pair of oppositely arranged structures for efficient substrate exchange. The planar shape of the transport module 100 is a polygonal structure such as a quadrangle, a hexagon, or an octagon. The process module, the connection module, the load lock module, the unloading interlock module, and the like are combined on one side of the transfer chamber 100 of the polygonal structure. In the case of two modules, the pair of placement portions 111 of the transport robot 11 () are located at positions where the substrates are exchanged corresponding to the two modules. As described above, when the pair of placement portions 1 are located at positions corresponding to the two modules, it is possible to perform faster substrate exchange with each module. For example, as shown in Fig. 3a, the pair of placement portions 111 can perform substrate exchange at the same time as the corresponding two modules, thereby increasing the substrate exchange speed. And, as shown in FIG. 3b, in the case where the transfer chamber 1 is a quadrangular structure, any one of the pair of placement portions 111 and one of the two modules exchanges the substrate, and the other placement portion 111 The substrate is exchanged with any one of the two modules on the opposite side, so that the substrate exchange speed can be improved. The process module 200 is configured to receive a substrate 1 from the transport module 1 to perform a process of ore, abundance, and the like on the substrate 1 , and may adopt an arbitrary structure according to different processes. As an example of the above-described process module 200, it is constituted by a process for forming a closed process space, a substrate holder for supporting the substrate 10, and a gas supply portion for supplying a process gas into the processing space. On the other hand, in the case where the substrate 10 is an OLED substrate, a piezoelectric hole injection layer (hil), a hole transport layer (HTL), and a layer are sequentially formed on the substrate 10 by a vapor deposition process according to plasma treatment. , G, B and other illuminators, electronic transfer TL), electron injection layer (EIL) and other organic films 'But the process module · In order to carry out the vapor deposition process of the upper surface of the organic film evaporation _ substrate 1 , An evaporation device for the evaporation of organic matter. Further, the above-described process module 200 can be formed into various structures, for example, by maintaining the substrate 1 维持 with respect to the ground while maintaining x (horizontal block) or by making the substrate 1Q fill the ground to maintain a vertical or inclined state. (vertical process module), etc. 201222707 On the other hand, in the case of constituting a plurality of the above-described process modules 200, all of the vertical process modules may be 'horizontal process modules', or some may be vertical process modules and the other part may be horizontal process modules. Further, the process module 200 can be appropriately arranged in accordance with the order in which the substrate 10 is processed, based on the plurality of configurations', based on the transfer module 1A. Two or more of the above-described process modules 200 can form a structure in which the substrate 10 is conveyed in a state of being perpendicular or inclined with respect to the ground, that is, in a vertical state, combined with the transport module 10A. In particular, when the planar shape of the transport module 1 is formed into a polygonal structure, the two or more process modules 200 are coupled to at least one of the side surfaces of the transport module 100 in a vertical state. When the process module 200 is coupled to the transport module 100 in a vertical state, since the plurality of process modules 200 are coupled to one transport module 1A, the performance and functions of the substrate processing system can be greatly improved. That is, the substrate processing system of the present invention increases the number of substrates 1 that can be processed by providing a plurality of process modules 200 to one transport module 1 , thereby not only improving the substrate processing speed but also performing multiple processes in sequence. Can carry out various processing. As shown in Fig. 1, the connection module 3〇〇 connects the two adjacent transport modules 1〇〇, and transfers the substrate 10 between the two transport modules 1〇〇, which can form various types. structure. At this time, the connection module 300 functions to buffer the substrate 1 without temporarily transferring the substrate 1 to the adjacent transfer module 100 to be transferred to the substrate 1 to be transferred. Further, the connection module 300 can be used as a process module for performing at least one of the processes of etch, vapor deposition, and heat treatment in addition to the substrate transfer function (^ in the case where the transfer module 100 maintains a predetermined vacuum pressure) The connection module 3 includes a chamber for forming a closed space to maintain a predetermined vacuum pressure like the transfer module 100. Further, since the connection module 300 is the same as the transfer module 1〇〇, the transfer module 100 is mutually connected to the transfer module 100. It is connected or separated from the transport module 1 by providing a gate valve. Further, the connection module 300 is provided with a structure for transporting a substrate such as a roller or a guide rail. In addition, two or more of the above-described connection modules 300 are used to connect two adjacent ones. The transport module 1 is connected. .201222707 When the two adjacent transport modules 100 are connected by two or more connection modules 300, 310, and 320, the two transport modules can be adjacent to each other. The exchange of various forms of the substrate is performed, so that the function of the substrate processing system can be greatly improved. That is, two or more connection modes are used. When 300, 310, and 320 are connected to two adjacent transport modules 1〇〇, not only can the number of substrates corresponding to the number of connection modules 3〇〇 be transmitted, but also the connection module 300 can be used temporarily when the substrate is transferred. Since the buffer of the substrate 1 is stored, the substrate can be more efficiently transferred between the adjacent two transport modules 100. Further, one of the two connection modules 300 is connected to the transfer module 100 and exchanges the substrate 10 with one of the transport modules 100. When the other connection module 320 can exchange the substrate with the other transfer module 100, the substrate exchange speed between the two transfer modules 1〇〇 can be improved. Also, by designing one of the two connection modules 300 and The other is separated and the opposite substrate exchange direction is set to transport the substrate 10 to perform the optimal configuration for the plurality of process modules 200 that perform different processes. On the other hand, as shown in FIG. 1, the above connection The module 300 is coupled to the transport module 100 such that the substrate 10 is transported in a state of being perpendicular or inclined with respect to the ground when combined with the transport module 1A. That is, it is vertically coupled with the transport module 1〇〇. That is, if the connection module 300 is vertically coupled to the transport module 1〇〇, the two connection modules 300 can be used to connect the adjacent two transport modules 1以 with a minimum space. On the other hand, the above substrate processing system further includes a load interlock module 410 that receives the substrate 1 from the outside and an unloading interlock module 42 that transfers the processed substrate 1 to the outside. The load lock module 410 is used for The transfer module 2A can be of various configurations after receiving the substrate 1 from the outside of the atmospheric pressure state to reduce the pressure and then transferring it to the vacuum pressure state. The unloading interlock module 420 is used for the vacuum pressure state. The transfer module 2 排出 discharges the substrate 1 〇 ' to the outside of the atmospheric pressure state, and can form various structures. The loading and unloading module 410 and the unloading and interlocking module 42 can be configured in various forms, and can be combined with the same transporting module 1 ,. In this case, the loading and unloading module 41 〇 and the unloading and interlocking module 420 can also be configured. For a module. Moreover, the loading and unloading module 410 and the unloading and interlocking module 42A can also be combined with a plurality of the different transport modules 1〇〇 different from each other. For example, as shown in the figure, the loading interlock 11 201222707 module 410 and more The first transfer module 1 in the transfer module 100 is coupled, and the unload lock module 420 is coupled to the last transfer module 100. On the other hand, in the case of processing the OLED substrate, the substrate processing system is provided with a mask (not shown) for forming a specific pattern during processing, and it is necessary to remove the mask or replace other masks according to process conditions, according to the process. Conditions A mask exchange module (not shown) for replacing the mask before the substrate 1 is introduced is separately provided in the process module 2A. Here, the photomask is combined with a substrate holder for fixing the substrate 1 , and the photomask exchange module is used to replace the photomask combined with the substrate holder 11. The mask replacement module is configured to be disposed on the substrate 10 for exchanging the reticle, and can form various structures. The reticle exchange module includes a chamber combined with the transport module 100 and is disposed in the chamber for replacement and substrate support. 11 combined reticle reticle replacement device. Here, the photomask exchange module replaces at least one of the second process module 200. And the above-described photomask exchange module replaces at least one of the connection modules 300. On the other hand, the reticle exchange module is required when the reticle is combined with the substrate holder 11 to be transported. In the case where the reticle is separately disposed in each module, the reticle exchange module is not required. Further, the photomask exchange module can be disposed in the load lock module 410, the connection chamber 300, and the transfer robot 11A in addition to a separate chamber. On the other hand, the substrate processing system of the present invention is characterized in that a plurality of transfer modules 100 are disposed, and a plurality of process modules 2A are combined with a plurality of transfer modules 1A to perform substrate on a plurality of substrates 10. Process or perform multiple processes in a system to be performed in sequence. Further, the number of the transport modules 100 is two or more, and the adjacent two transport modules 100 are connected to each other by the connection module 300 to be described later, so that more substrates 1G can be subjected to base reduction or On the eve of the substrate processing in which multiple sings are to be touched. In particular, the present invention is in contrast to the case where the respective modules of the transfer module 100, that is, the process module 2, the connection module 300, the load lock module 410, and the unloading interlock module 42 are perpendicular to the transfer module (10). Can achieve more combinations of process modules. ... σ 4a and 4b are layout diagrams of an embodiment of a transport direction as another example of the substrate processing system of the present invention. The substrate processing system having the above configuration can be sequentially multiplexed. 12 201222707 For example, the substrate processing system has a plurality of transport modules ίο as shown in Figs. 1 and 4a. The two transport modules 1〇〇 are connected in sequence by two connection modules 31〇, 32〇, and the substrate 1〇 is transported in a state perpendicular or inclined with respect to the ground in the connection modules 310 and 320. The load interlocking module 410 that receives the substrate 10 from the outside is combined with the first transport module 1A, and the unloading interlock module 420 that transfers the processed substrate 10 to the outside is combined with the last transport module 100. At this time, a plurality of processes The module 200 and the plurality of connection modules 31A' 320 are symmetrically arranged with respect to the transport direction of the substrate 1A, and the plurality of process modules 2A and the plurality of connection modules 310, 320 can also be transported by the substrate 10. Configured for the baseline. In the substrate processing system of the above-described formula, as shown in Fig. 4a, the substrate 1 is formed into two curves via the transport paths of the respective modules. Of course, in the above substrate processing system, the substrate 1 transferred by the loading interlock module 410 passes through the respective transfer modules 1 〇〇 while passing through all the process modules 200 ′ combined with the respective transfer modules i ( 8 ) and finally through the unloading interlock module 420 . External discharge. Further, in the above substrate processing system, as shown in Fig. 4b, the transport path of the substrate 1〇 forms a closed curve. Here, in the case where the transport path of the substrate 10 is formed into a closed curve, as shown in FIG. 4b, the load interlock module 410 and the unloading interlock module 420 are coupled to one transport module 1A. Fig. 5 is a configuration diagram showing still another example of the substrate processing system of the present invention. On the other hand, each module combined with the transport module 100 is vertically coupled to the transport module 1A, in addition to which a part of each module is vertically coupled, and the rest is horizontally exchanged with respect to the ground. The way to combine, that is, the level of integration. That is, in the substrate processing system of the present invention, as shown in FIG. 5, in the plurality of transport modules 1A and the plurality of connection modules 300, the substrate 10 is transported in a state of being vertical or inclined with respect to the ground, and a plurality of process modules are provided. 200 includes: one or more vertical process modules 2〇〇, performing substrate processing in a state in which the substrate 1〇 is perpendicular or inclined with respect to the ground; and one or more horizontal process modules 4〇〇, performing substrate processing in a state in which the substrate is horizontal with respect to the ground. At this time, the substrate 10 transported by each module is in a vertical state or a horizontal state with respect to the ground, and the substrate 10 needs to be rotated from a horizontal state in order to perform substrate exchange between the module that maintains the vertical state and the module that maintains the horizontal state. Rotate in a vertical state or from a vertical state to a horizontal state. 13 201222707 Thus, in the substrate processing of the present invention, the substrate 1 is rotated so that the rotation module 5 perpendicular to the ground or horizontally is disposed in the transport module, the transport module (10), and the horizontal process module. Any position. The above-described rotary Wei 500 is used to rotate the substrate 10 from a horizontal state to a vertical state or from a vertical state to a horizontal state, and the rotation module 500 can form various structures. The above is only a part of a preferred embodiment that can be implemented in accordance with the present invention, and those skilled in the art should understand that the scope of the present invention is not limited to the above embodiments, and the above-described technical idea of the present invention and its fundamental All are included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a layout view of a substrate processing system of the present invention; FIG. 2 is a plan view of a substrate in the substrate processing system of FIG. 1 and a substrate holder for transporting the substrate; FIGS. 3a and 3b 1 is a conceptual diagram of an embodiment in which a substrate exchange process is performed between a transfer module and a module combined with the transfer module in the substrate processing system of FIG. 1; FIGS. 4a and 4b are views of the substrate processing system of the present invention. An example of the arrangement of the substrate in which the transport direction of the substrate is changed; and FIG. 5 is a layout view of still another example of the substrate processing system of the present invention. [Main component symbol description] 10 Substrate 11 Substrate holder 100 Transfer module 110 Transfer robot 111 Placement unit 112 Buffer unit 200 Process module 300 Connection module 310 Connection module 320 Connection module 201222707 410 420 500 Load interlock module Unload interlock module Rotary module