TW201222576A - Coil-type electronic component and its manufacturing method - Google Patents

Coil-type electronic component and its manufacturing method Download PDF

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Publication number
TW201222576A
TW201222576A TW100114178A TW100114178A TW201222576A TW 201222576 A TW201222576 A TW 201222576A TW 100114178 A TW100114178 A TW 100114178A TW 100114178 A TW100114178 A TW 100114178A TW 201222576 A TW201222576 A TW 201222576A
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Taiwan
Prior art keywords
oxide layer
coil
particles
electronic component
soft magnetic
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TW100114178A
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Chinese (zh)
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TWI433175B (en
Inventor
Hideki Ogawa
Atsushi Tanada
Hitoshi Matsuura
Kiyoshi Tanaka
Hiroshi Kishi
Kenji Kawano
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Taiyo Yuden Kk
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Publication of TW201222576A publication Critical patent/TW201222576A/en
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Publication of TWI433175B publication Critical patent/TWI433175B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • HELECTRICITY
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    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
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    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147Alloys characterised by their composition
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    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
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    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
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    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
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    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
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    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/33Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particles; metallic particles having oxide skin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
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    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0246Manufacturing of magnetic circuits by moulding or by pressing powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06Coil winding
    • H01F41/098Mandrels; Formers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C2202/00Physical properties
    • C22C2202/02Magnetic
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    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147Alloys characterised by their composition
    • H01F1/14766Fe-Si based alloys
    • HELECTRICITY
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    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings
    • HELECTRICITY
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    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • H01F41/125Other insulating structures; Insulating between coil and core, between different winding sections, around the coil
    • HELECTRICITY
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    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/02Coils wound on non-magnetic supports, e.g. formers
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    • H01F5/00Coils
    • H01F5/06Insulation of windings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49069Data storage inductor or core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49071Electromagnet, transformer or inductor by winding or coiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49073Electromagnet, transformer or inductor by assembling coil and core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Soft Magnetic Materials (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Powder Metallurgy (AREA)

Abstract

A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.

Description

201222576 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種線圈型電子零件及其製造方去,尤其 是關於一種適合作為可於電路基板上進行表面安裴之小型 . 化線圈型電子零件的使用軟磁性合金之線圈型電子零件及 ^ 其製造方法。 【先前技術】 先前,作為於高頻下使用之抗流線圈之磁芯,係使用鐵 氧體磁芯、金屬薄板之切面磁芯或壓粉磁芯。 與鐵氧體相比,使用金屬磁體具有可獲得高飽和磁通密 度之優點。另一方面,金屬磁體本身之絕緣性較低,因此 必需實施絕緣處理。 專利文獻1中,提出有將包含具有表面氧化覆膜之以一卜以 粉末與結著劑之混合物壓縮成形後,於氧化性環境中進行 熱處理的技術。根據該專利文獻,藉由於氧化性環境中進 行熱處理,可於壓縮成形時合金粉末表面之絕緣層受到破 壞時形成氧化層(氧化fg )’從而以低磁芯損失獲得具有良 好之直流重疊特性的複合磁性材料。 . 專利文獻2中,記載有將使用以金屬磁體粒子作為主成 分且含有玻璃之金屬磁體膏所形成的金屬磁體層,與使用 含有銀等金屬之導體膏所形成的導體圖案積層,且於積層 體内形成線圈圖案的積層型電子零件,以及於氮環境中、 400°C以上之溫度下煅燒該積層型電子零件之技術。 [先前技術文獻] 154655.doc 201222576 [專利文獻] [專利文獻1]曰本專利特開2001· 11563號公報 [專利文獻2]曰本專利特開2007-27354號公報 【發明内容】 [發明所欲解決之課題] 專利文獻1之複合磁性材料由於係使用表面預先形成有 氧化覆膜之Fe-Al-Si粉末進行成形,故而壓縮成形時需要 較大之壓力。 另外’於應用於功率電感器等需要更大電流流通之電子 零件的情形時’存在無法充分應對進一步之小型化的問 題。 專利文獻2之積層型電子零件需要控制玻璃均勻地被覆 金屬磁體粒子’必需利用氮環境,存在生產成本上升之問 題。 本發明係鑒於上述情況而成,本發明提供一種線圈型電 子零件及其製造方法,該線圈型電子零件包含可低成本地 生產,且兼具高磁導率與高飽和嘮通密度兩種特性之磁 體。 [解決問題之技術手段] 本發明者們為達成上述目的而努力研究,結果發現了下 述現象’即若將含有鐵、碎及較鐵容易氧化之元素的軟磁 生口金粒子與結合材料混合後成形,於氧環境中對該成形 體進行熱處理而使結合材料分解,且使軟磁性合金粒子之 表面氧化Μ絲化層,則減理後之磁料高於熱處理 154655.doc 201222576 刖之磁導率。並且,本發明者們發現該經熱處理之成形體 中’軟磁性合金粒子彼此經由氧化層而結合。 本發明係基於邊荨發現而完成者,其係如下所述。 (1)一種線圈型電子零件,其特徵在於:其係於素體之内部 或表面具有線圈者,且 素體由含有鐵、矽及較鐵容易氧化之元素的軟磁性合金 粒子(亦稱為「合金粒子」、「軟磁體粒子」)群所構成;於 各軟磁性合金粒子之表面生成有該粒子氧化而形成之氧化 層,》玄氧化層與s玄合金粒子相比含有較多的較鐵容易氧化 之元素;粒子彼此經由該氧化層而結合。 ⑺如⑴之線圈型電子零件,其中將軟磁體粒子彼此結合 之部分之氧化層的厚度厚於不涉及結合之軟磁體粒子表面 之氧化層。 (3)如⑴之線圈型電子零件’其中將軟磁體粒子彼此結合 之部分之氧化層的厚度薄於不涉及結合之軟磁體粒子表面 之氧化層。 ⑷如⑴或⑺之線圈型電子零件,其中軟磁體粒子中之至 少-部分係包含具有50奈米以上之厚度之氧化層的粒子。 (5)如⑴至⑷中任―項之線圈型電子零件,其中將上述粒 子彼此結合之上述氧化層為同一相。 其中上述較鐵 其申上述較鐵 (6)如(1)至(5)中任一項之線圈型電子零件 容易氧化之元素為路。 (7)如(1)至(5)中任一項之線圈型電子零件 容易氧化之元素為|呂。 154655.doc 201222576 (8) 如(6)之線圈型電子零件,其中上述軟磁性合金之組成 為絡 2〜8 wt%、碎 1.5〜7 wt%、鐵 88〜96.5 wt%。 (9) 如(7)之線圈型電子零件,其中上述軟磁性合金之組成 為鋁 2〜8 wt%、矽 1.5〜12 wt%、鐵 80〜96.5 wt0/〇。 (10) 如(1)至(9)中任一項之線圈型電子零件,其中軟磁體粒 子之算術平均粒徑為3 0微米以下。 (11) 如(1)至(10)中任一項之線圈型電子零件,其中上述氧 化層自上述軟磁體粒子側觀看朝向外側依序包含:上述鐵 成分之含量降低且上述容易氧化之元素之含量增加的第一 氧化層,及上述鐵成分之含量降低且上述容易氧化之元素 之含量降低的第二氧化層。 (12) 如⑴)之線圈型電子零件,纟中自上述軟磁體粒子側 觀看朝向外側,於上述第一氧化層中,上述矽之含量具有 反曲點。 (13)如⑴至(12)中任—項之線圈型電子零件,纟中氧化層 係藉由使用掃描式電子顯微鏡之能量色散χ射線分析並以 ZAF法計算出的容易氧化之元素相對於鐵之波峰強度比大 於上述粒子中之容易氧化之元素相對於鐵之波♦強度比 者0 (14)如⑴至(13)中任—項之線圈型電子零件’其中上述線 圈其端部與形成於上述素體表面之導體膜電性連接。 f一種線圏型電子零件,其特徵在於:其係具有線圈 者,且’素體由軟磁性合金粒子群構成;於各軟磁性合金 粒子之表面生成有該粒子氧化而形成之氧化層,·該氧化層 154655.doc 201222576 與該合金粒子相比含有較多的較鐵容易氧化之金屬;粒子 彼此經由該氧化層而結合;且於該素體之内部形成有線圈 導體。 (16) 如(15)之線圈型電子零件,其中線圈導體為導體圖 案,且係與素體同時煅燒之導體。 (17) 如(15)或(16)之線圈型電子零件,其中該氧化層中之較 鐵容易氧化之金屬為絡。 (18) 如(15)或(16)之線圈型電子零件,其中該氧化層中之較 鐵容易氧化之金屬為鋁。 (19) 一種線圈型電子零件之製造方法,該線圈型電子零件 係於素體中設置有線圈者,該製造方法包括以下步驟: 將黏合劑與軟磁性合金粒子之混合物加壓而獲得成形 於含有氧之環境中將上述成形體熱處理,於上述軟磁性 合金粒子之表面形成氧化層,使上述軟磁性合金粒子彼此 經由氧化層結合而獲得素體;及 於上述素體中設置線圈及外部導出用。 (20)—種線圈型電子零件之製造方201222576 VI. Description of the Invention: [Technical Field] The present invention relates to a coil type electronic component and a manufacturer thereof, and more particularly to a small-sized coil type electronic suitable for surface mounting on a circuit substrate A coil type electronic component using a soft magnetic alloy for a part and a method of manufacturing the same. [Prior Art] Conventionally, as a magnetic core of a choke coil used at a high frequency, a ferrite core, a cut core of a metal thin plate, or a powder magnetic core is used. The use of metal magnets has the advantage of achieving high saturation flux density compared to ferrite. On the other hand, the metal magnet itself has low insulation, so it is necessary to carry out insulation treatment. Patent Document 1 proposes a technique in which a mixture containing a surface oxide film and a mixture of a powder and a binder is compression-molded and then heat-treated in an oxidizing atmosphere. According to this patent document, by performing heat treatment in an oxidizing atmosphere, an oxide layer (oxidation fg) can be formed when the insulating layer on the surface of the alloy powder is destroyed during compression molding, thereby obtaining a DC overlap characteristic with low core loss. Composite magnetic material. Patent Document 2 describes a metal magnet layer formed by using a metal magnet paste containing metal magnet particles as a main component and a conductor pattern formed of a conductor paste containing a metal such as silver, and laminated thereon. A laminated electronic component in which a coil pattern is formed in the body, and a technique of calcining the laminated electronic component in a nitrogen atmosphere at a temperature of 400 ° C or higher. [Prior Art Document] 154655.doc 201222576 [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-11563 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-27354 Problem to be Solved The composite magnetic material of Patent Document 1 is formed by using Fe-Al-Si powder having an oxide film formed on its surface in advance, so that a large pressure is required for compression molding. In addition, when it is applied to an electronic component such as a power inductor that requires a larger current to flow, there is a problem that it is not possible to sufficiently cope with further miniaturization. The laminated electronic component of Patent Document 2 requires the control glass to be uniformly coated with the metal magnet particles. It is necessary to utilize the nitrogen atmosphere, and there is a problem that the production cost rises. The present invention has been made in view of the above circumstances, and provides a coil type electronic component which can be produced at low cost and which has both high magnetic permeability and high saturation enthalpy density. The magnet. [Means for Solving the Problem] The inventors of the present invention have diligently studied to achieve the above object, and as a result, have found that the soft magnetic green gold particles containing iron, broken, and iron easily oxidized are mixed with the bonding material. Forming, heat-treating the shaped body in an oxygen environment to decompose the bonding material, and oxidizing the surface of the soft magnetic alloy particles to smear the layer, the magnetic material after the reduction is higher than the heat treatment of the heat treatment 154655.doc 201222576 刖rate. Further, the inventors have found that the soft magnetic alloy particles in the heat-treated molded body are bonded to each other via the oxide layer. The present invention has been completed based on the discovery of the edge, which is as follows. (1) A coil type electronic component characterized in that it has a coil inside or on a surface of an element body, and the element body is a soft magnetic alloy particle containing iron, bismuth and an element which is easily oxidized by iron (also called "Alloy particles" and "soft magnetic particles" are grouped; an oxide layer formed by oxidation of the particles is formed on the surface of each soft magnetic alloy particle, and the smectic oxide layer contains more than the s-alloy particles. An element in which iron is easily oxidized; particles are bonded to each other via the oxide layer. (7) The coil type electronic component of (1), wherein a portion of the oxide layer in which the soft magnetic particles are bonded to each other is thicker than an oxide layer which does not involve the surface of the bonded soft magnetic particle. (3) The coil-type electronic component of (1) wherein the thickness of the oxide layer of the portion where the soft magnetic particles are bonded to each other is thinner than the oxide layer which does not involve the surface of the bonded soft magnetic particle. (4) The coil type electronic component of (1) or (7), wherein at least a portion of the soft magnetic particles is a particle containing an oxide layer having a thickness of 50 nm or more. (5) The coil type electronic component of any one of (1) to (4), wherein the oxide layer in which the particles are bonded to each other is the same phase. The above-mentioned iron-like alloys are more likely to be oxidized by the coil-type electronic parts of any one of (1) to (5). (7) The coil type electronic component according to any one of (1) to (5), which is easily oxidized, is an element. 154655.doc 201222576 (8) The coil type electronic component of (6), wherein the composition of the soft magnetic alloy is 2 to 8 wt%, 1.5 to 7 wt%, and 88 to 96.5 wt% of iron. (9) The coil type electronic component according to (7), wherein the composition of the soft magnetic alloy is 2 to 8 wt% of aluminum, 1.5 to 12 wt% of ruthenium, and 80 to 96.5 wt0 / Torr of iron. (10) The coil type electronic component according to any one of (1) to (9) wherein the soft magnetic particle has an arithmetic mean particle diameter of 30 μm or less. (11) The coil-type electronic component according to any one of (1) to (10), wherein the oxide layer is sequentially included from the side of the soft magnetic particle side toward the outer side: the content of the iron component is lowered and the element is easily oxidized The first oxide layer having an increased content and the second oxide layer having a reduced content of the iron component and a reduced content of the element which is easily oxidized. (12) The coil-type electronic component according to (1), wherein the crucible has an inflection point in the first oxide layer as viewed from the soft magnetic particle side. (13) The coil type electronic component of any one of (1) to (12), wherein the oxide layer in the crucible is analyzed by energy dispersive ray ray using a scanning electron microscope and the element which is easily oxidized by the ZAF method is relative to The intensity ratio of the peak of the iron is greater than the ratio of the element which is easily oxidized in the above-mentioned particles to the intensity of the wave of iron. 0 (14) The coil type electronic part of any one of (1) to (13) wherein the end of the coil is The conductor film formed on the surface of the above-mentioned element body is electrically connected. f is a wire-type electronic component characterized in that it has a coil, and the element body is composed of a soft magnetic alloy particle group; and an oxide layer formed by oxidation of the particle is formed on the surface of each soft magnetic alloy particle. The oxide layer 154655.doc 201222576 contains a larger amount of metal which is more easily oxidized than iron than the alloy particles; the particles are bonded to each other via the oxide layer; and a coil conductor is formed inside the element body. (16) The coil type electronic component of (15), wherein the coil conductor is a conductor pattern and is a conductor which is simultaneously calcined with the element body. (17) The coil type electronic component of (15) or (16), wherein the metal in the oxide layer which is more easily oxidized by iron is a network. (18) The coil type electronic component of (15) or (16), wherein the metal in the oxide layer which is easily oxidized by iron is aluminum. (19) A method of manufacturing a coil type electronic component in which a coil is provided in a body, the manufacturing method comprising the steps of: pressurizing a mixture of a binder and a soft magnetic alloy particle to obtain a shape The molded body is heat-treated in an atmosphere containing oxygen to form an oxide layer on the surface of the soft magnetic alloy particles, and the soft magnetic alloy particles are bonded to each other via an oxide layer to obtain an element body; and a coil is provided in the element body and externally derived use. (20) - Manufacturer of coil type electronic parts

,該線圈型電子零件 該製造方法包括以下步驟: 子之混合物加工成片狀; 圈用導電圖案而獲得成形體; 成形體熱處理,於上述軟磁性 ’使上述軟磁性合金粒子彼此 ^有線圏之素體;及 I54655.doc 201222576 (21)如(19)或(20)之線圈型電子零件之製造方法,其中上述 氧環境為大氣環境。 [發明之效果] 根據本發明,由於係使用該粒子氧化而形成之氧化層作 為各軟磁體粒子之絕緣層,故而無需為實現絕緣而向軟磁 體粒子中混合樹脂、玻璃。另外,與表面預先經氧化處理 之Fe-Al-Si粉末相比較,成形時無需施加較大之壓力。 因此,可獲得能低成本地生產,且兼具高磁導率與高飽 和磁通密度兩種特性之磁體。 【實施方式】 再者,本說明書中,「粒子氧化而形成之氧化層」係由 粒子之自然氧化以上之氧化反應所形成的氧化層,係指藉 由於氧化性環境中對粒子的成形體進行熱處理,使粒子之 表面與氧進行反應而成長之氧化層。再者,「層」係可根 據組成、結構、物性、外觀及/或製造步驟等而明顯識別 之層,包含其分界明確者、分界不明確者,另外,包含於 粒子上為連續膜者、一部分具有非連續部分者。於某些態 樣t,「氧化層」為被覆粒子整體之連續氧化膜。另外, 此種氧化層具有本說明書中規定之任一特徵,藉由粒子表 面之氧化反應所成長之氧化層可與藉由其他方法而被覆之 氧化膜層區別開。另外,本說明書中,「與·相比較多」、 「較…容易」等表示比較之表達意味著實質性之差異表 示功能、結構、作用效果產生顯著差異之程度的差異。 以下,參照圖1及圖2 ,對本發明之使用電子零件用軟磁 154655.doc 201222576 性合金之素體的第1貫施形態進行說明。圖1係表示本實施 形態之使用電子零件用軟磁性合金之素體1 〇之外觀的側視 圖。 本實施形態之使用電子零件用軟磁性合金之素體i 〇係作 ' 為用於捲繞捲線型晶片電感器之線圈之磁芯而使用者。磁 • 芯11包含與電路基板等之安裝面平行配設,用以捲繞線圈 的板狀之捲芯部11 a,及於捲芯部11 a之相互對向之端部分 別配設的一對凸緣部lib、lib,外觀呈鼓形。線圈之端部 與形成於凸緣部lib、lib表面之導體膜14電性連接。 本實施形態之使用電子零件用軟磁性合金之素體1 〇之特 徵在於:其係由含有鐵(Fe)、矽(Si)及較鐵容易氧化之元 素的軟磁性合金粒子群所構成,各軟磁體粒子之表面形成 有該粒子氧化所成之氧化層,該氧化層與該合金粒子相比 含有較多之鉻,粒子彼此經由該氧化層而結合。 以下之§己載中係以元素名或元素符號而記述。 圖2係本實施形態之使用電子零件用軟磁性合金之素體 10之剖面的放大模式圖,係根據使用SEM(掃描式電子顯 微鏡)以3000倍拍攝素體之厚度方向之剖面所得的組成像 . 而製作之圖。 . 可藉由以下所述之方式識別上述模式圖中之複數個粒子 以及氧化層。首先,以通過素體中心之厚度方向之剖面露 出的方式進行研磨,使用掃描式電子顯微鏡(SEM)以3000 倍拍攝所獲得之剖面而獲得組成像。 掃描式電子顯微鏡(SEM)會使構成元素之差異於組成像 I54655.doc 201222576 中以對比度(亮度)之差異而呈現。 繼而’將上述中所獲得之組成像的各像素分類為三級之 亮度等級。關於亮度等級’可將上述組成像中的粒子刮面 之輪廓可完整確認之粒子中’各粒子之剖面之長轴尺寸^ 與短軸尺寸d2之簡單平均值D=(dl+d2)/2較原料粒子(未形 成有氧化層的作為原料之合金粒子)之平均粒_5〇%)大 的粒子之組成對比度作為中Μ度等級,將上述組成像中 符合該亮度等級之部分判斷為粒子卜另外’可將組成對 比度較上述中心亮度等級暗之亮度等級之部分判斷為氧化 層2。再者,較理想為進行複數次測定。 另外,可將較上述中心亮度等級明亮之亮度等級之部分 判斷為空隙3。 關於氧化層2之厚度之測定,可藉由將自粒子與氧化層2 之分界面至氧化層2與空隙3之分界面的最短距離作為氧化 層2之厚度’而求出氧化層2之厚度。 具體而言,氧化層2之厚度可藉由如下所述之方式而求 出。使用SEM(掃描式電子顯微鏡)以1〇〇〇倍或3〇〇〇倍拍攝 素體10之厚度方向之剖面,使用圖像處理軟體求出所獲得 之組成像之1個粒子的中心,使用Eds(能量色散χ射線分 析裝置)自該中心點於半徑方向上進行線性分析。將氧濃 度為中心點處之氧濃度之3倍以上的區域判定為氧化物(亦 即,考慮測定之抖動將3倍作為閾值,且將未達3倍者判定 為非氧化層,實際之氧化層之氧濃度亦有可能為1〇〇倍2 上),測定至粒子外周部之長度作為氧化層2之厚度。於某 154655.doc 10 201222576 些態樣中,可自本說明書中記載之任_種方法(根據亮度 專級之識別法、根據氧濃度之識別法,後述之根據組成比 之識別法、根據波峰強度比之識別法等)、或者其他與氧 儿素之存在(濃度)相關的公知之任一種方法中適宜地選擇 評價方法而劃定氧化層之區域。 再者’於某些態樣中’具有氧化層之軟磁體粒子之平均 粒徑與原料粒子(成形、熱處理前之粒子)之平均粒徑實質 上或者大致相同。 形成於合金粒子表面之氧化層2的厚度即便於⑽合金粒 子中亦可根據部分之不同而形成為不同之厚度。 作為-態樣,藉由使整體形成為以較合金粒子表面之氧 化層(鄰接空隙3之氧化層)厚之氧化層結合的合金粒子彼 此’而獲得高強度之效果。 另外’作為其他態樣’藉由使整體形成為以較合金粒子 之氧化層(鄰接空隙3之氧化層)薄之氧化層結合的合金 粒子彼此,而獲得高磁導率之效果。 * 進而’作為其他態樣’至少軟磁體粒子群之—部分為局 P匕3具有50奈米以上之厚度之氧化層(作為表面氧化 的粒子。 ^ 作為其他態樣’將上述粒子彼此結合之上述氧化層較佳 為同-相。所謂同一相’係指粒子間之氧化層中實質上I =、(除氧化層所鄰接之空隙以外),各粒子由相同之結晶 、且連項地經由氧化層而結合,該事項可藉由穿透式電 子顯微鏡(TEM)而確認。另外’結晶之結構知圖4所示可藉 154655.doc 201222576 由x射線繞射分析裝置而確認。 如後所述,氧化層之結構、組成、厚度等可藉由原料粒 子之組成、粒子間之距離(填充率)、熱處理溫度、熱處理 時間、熱處理環境中之氧量等而控制。氧化層之厚度於粒 子間亦不均勻,於某些態樣中,實質上全部或者大部分之 氧化層具有10〜200 nm之範圍的厚度。 作為其他態樣, 上述氧化層較佳為自上述合金粒子側觀看,包含: 上述鐵成分之含量降低且上述容易氧化之元素之含量增 加的第一氧化層,及上述鐵成分之含量降低且上述容易氧 化之元素之含量降低的第二氧化層。 再者,更佳為自上述合金粒子側觀看,於上述第一氧化 層中’上述矽之含量具有反曲點。又,第一氧化層與第二 氧化層之分界可明確亦可模糊。 該結構如圖5所示可藉由EDS(能量色散χ射線分析裝置) 而確認,可獲得抑制飽和磁通密度降低之效果。 上述使用電子零件用軟磁性合金之素體中的粒子之組成 比可藉由如下方式而確認。首先,以使通過粒子中心之剖 面露出之方式研磨原料粒子,將研磨而得之剖面使用掃描 式電子顯微鏡(SEM)以3000倍拍攝而獲得組成像,針對該 組成像’藉由能量色散X射線分析(EDS),以ZAF法計算出 粒子中心附近之1 μηι □的組成。繼而,以使通過上述電子 零件用軟磁性合金素體之大致中心的厚度方向之剖面露出 之方式進行研磨’將研磨而得之剖面使用掃描式電子顯微 154655.doc 201222576 鏡(讓)以3_倍拍攝而獲得組成像,自組成像中,抽取 粒子剖面之輪靡可完整確認之粒子中、各粒子之剖面之長 軸尺寸㈣短轴尺以2之簡單平均值D=(di+d2)/2較原料 粒子之平均粒徑_%)大的粒子,藉由能量色散χ射線分 析(EDS),以ZAF法計算出其長軸與短軸之交點附近之i μιη□的組成’將該組成與上述原料粒子之組成比加以對 比,藉此可獲知上述使用電子零件用軟磁性合金之素體中 的合金粒子之組成比(由於原料粒子之組成為公知,故而 藉由將以ZAF法計算出之組成彼此進行比較,可求出素體 中的合金粒子之組成)。 上述使用電子零件用軟磁性合金之素體中的氧化層之厚 度,設為由以上述方法鑑定出的粒子〗、丨之表面所存在之 氧化層的下述厚度tl與厚度t2的簡單平均值求出的平均厚 度T=(tl+t2)/2,上述厚度tl係上述氧化層自粒子丨之表面之 厚度的最厚部之厚度,上述厚度t2係最薄部之厚度。 作為本發明之一態樣,容易氧化之元素之例可列舉鉻之 態樣。 本貫施开> 態之使用電子零件用軟磁性合金之素體1 〇包 含:含有鉻wt%、矽1.5〜7 wt%、鐵88〜96 5 wt%的複 數個粒子1、1,及於粒子1之表面生成之氧化層2。氧化層 2至少含有鐵及鉻,使用穿透式電子顯微鏡進行能量色散X 射線分析所得的鉻相對於鐵之波峰強度比R2實質上大於粒 子中的鉻相對於鐵之波峰強度比R1 (例如尺2為R1之數倍以 上、數十倍以上)。另外,於複數個粒子間亦有存在空隙3 154655.doc 13 201222576 之部位。 對於上述電子零件用軟磁性合金素體,上述氧化層2中 的鉻相對於鐵之波峰強度比R2、及上述粒子1中的鉻相對 於鐵之強度比R1分別可藉由如下方式而求出。首先,藉由 SEM-EDS,求出上述組成像中以粒子!之内部的以長軸以 與短轴d2相交之點為中心之1 μιηα的組成。其次,藉由 SEM-EDS,求出上述組成像中之粒子J表面之氧化層2之相 當於平均厚度T=(tl+t2)/2之氧化層厚度部位中以氧化層之 厚度之中心點為中心之1 μιη□的組成,上述平均厚度 T=(tl+t2)/2係由上述氧化層2的最厚部之厚度丨丨與最薄部之 厚度t2求出。繼而,由粒子!内部之鐵之強度^^^、鉻之 強度ClCrKa,可求出鉻相對於鐵之波峰強度比 R1==ClCrKa/ClFeKa。另外,由氧化層2之厚度之令心點處的 鐵之強度C2FeKa、鉻之強度C2CrKa,可求出鉻相對於鐵之 波峰強度比 R2=C2crKe/C2peKa。 另外’本發明之使用電子零件用軟磁性合金之素體中,經 由生成於鄰接之粒子1、1之表面的氧化層而結合,可藉由 根據上述組成像而製作的如圖2所示之模式圖而確認。另 外,經由生成於鄰接之粒子1、1之表面的氧化層而結合, 係顯現在使用電子零件用軟磁性合金之素體之磁特性、強 度之提高。 本發明之使用電子零件用軟磁性合金之素體之製造,作 為一態樣,首先,於含有鉻、矽、鐵之原料粒子中添加例 如熱塑性樹脂等結合劑,加以攪拌混合而獲得造粒物。繼 154655.doc 201222576 而,將該造粒物壓縮成形而形成成形體,於大氣中、 柳〜崎下對所獲得之成形體進行熱處理。藉由於該大 氣中進行熱處理,可將經混合之熱塑性樹脂脫脂,並且一 面使原本存在於粒子中藉由熱處理而移動至表面之鉻、及 作為粒子之主成分之鐵與氧結合,_面於粒子表面生成包 含金屬氧化物之氧化層,且使鄰接之粒子表面的氧化層彼 此結合。所生成之氧化層(金屬氧化物層)主要是由以及絡 構成之氧化物,可確保粒子間之絕緣,且提供使用電子零 件用軟磁性合金之素體。 作為原料粒子之例,可列舉㈣水切法製造之粒子, 作為原料粒子之形狀之例,可列舉球狀、扁平狀。 本發明中,若於氧環境下升高熱處理溫度則結合劑會分 :,且軟磁性合金體會氧化。因此,作為成形體之熱處理 '、件,車父佳為於大氣令、400〜_°C下保持1分鐘以上。藉 由於該溫度㈣内進行熱處理,可形成優異之氧化層^ :為_〜8〇〇t。亦可於大氣中以外之條件,例如氧分壓 、大=相同程度之環境中進行熱處理。於還原環境或非 匕%蜒中,糟由熱處理不會生成包含金屬氧化物之氧化 因此粒子彼此燒結,導致體積電阻率顯著降低。 對環境中之氧濃度、水蒸氣量並無特別限定’若自生產 :考慮’則較理想的是大氣或者乾燥空氣。 之於4GG(:時’可獲得優異之強度與優異 =電阻率。另—方面,若熱處理溫度大於靖,則 B &增加,但體積電阻率降低。 154655.doc 15 201222576 藉由將上述熱處理溫度中之保持時間設為丨分鐘以上, 容易生成包含含有Fe及鉻之金屬氧化物之氧化層。氧化層 厚度將於一定值飽和,因此不特別設定保持時間之上限, 但考慮到生產性’較妥當的是設為2小時以下。 如上所述,藉由將熱處理條件設為上述範圍,可同時滿 足優異之強度與優異之體積電阻率,可獲得使用具有氧化 層之軟磁性合金的素體。 亦即,藉由熱處理溫度、熱處理時間、熱處理環境中之 氧篁等來控制氧化層之形成。 本發明之電子零件用軟磁性合金素體中,藉由對鐵_矽— 較鐵容易氧化之元素之合金粉末實施上述處理,可獲得高 磁導率與高飽和磁通密度。並且,藉由該高磁導率,可獲 得此以較先前更小型之軟磁性合金素體而流通更大電流之 電子零件。 並且,與利用樹脂或玻璃使軟磁性合金粒子結合之線圈 零件不同’本發明既不使用樹脂亦不使用玻璃,且亦無需 施加較大之壓力以成形,因此可低成本地生產。 另外’本實施形態之電子零件用軟磁性合金素體可維持 高飽和磁通密度’並且可防止於大氣中之熱處理後玻璃成 分等浮出至素體表面,可提供具有高尺寸穩定性的小型之 晶片狀電子零件。 其次,參照圖1、圖2、圖6及圖7,對本發明之電子零件 之第1實施形態進行說明。圆丨及圖2與上述的電子零件用 軟磁性合金素體之實施形態重複,因而省略說明。圖6係 154655.doc • 16· 201222576 表示本實施形態之電子零件的透視一部分之側視圖。另 外’圖7係表示本實施形態之電子零件之内部結構的縱剖 面圖。本實施形態之電子零件20係作為線圈型電子零件的 捲線型晶片電感裔。該電子零件20包括:上述之電子零件 用軟磁性合金素體10即鼓形之磁芯11,及一對板狀磁芯 12、12,一對板狀磁芯12、12之圖示省略,其由上述素體 10構成,將鼓形之磁芯11的兩凸緣部11b、lib間分別連 結。於磁芯11之凸緣部lib、lib之安裝面上,分別形成有 一對外部導體膜14、14。另外,於磁芯丨丨之捲芯部Ua 上,捲繞有包含絕緣被覆導線之線圈1 5而形成捲繞部 15a,並且兩端部15b、15b分別熱壓接合於凸緣部nb、 lib之安裝面的外部導體膜14、14上《外部導體膜14、14 包含:形成於素體10之表面之燒製導體層14a,積層形成 於該燒製導體層Ma上之鍍Ni層Mb及鍍Sn層Me。上述之 板狀磁芯12、12藉由樹脂系接著劑而接著於鼓形之磁芯i! 的凸緣部lib、lib上。 本實施形態之電子零件20包括上述之使用電子零件用軟 磁性合金之素體10作為磁芯11,該素體1〇包含含有鉻、 矽、鐵之複數個粒子以及氧化層’該氧化層係生成於該粒 子之表面’至少含有鐵及鉻,藉由使用掃描式電子顯微鏡 之能量色散X射線分析’以ZAF法計算出的鉻相對於鐵之 波峰強度比大於上述粒子中的鉻相對於鐵之波峰強度比, 並且於鄰接之上述粒子之表面生成的氧化層彼此結合。另 外’於素體10之表面,形成有至少一對外部導體膜14、 154655.doc •17- 201222576 14°關於本實施形態之電子零件2〇中的使用電子零件用軟 磁性合金之素體1 〇係與上述重複,因而省略說明。 磁芯11具有至少捲芯部丨丨a,捲芯部1丨&之剖面之形狀可 採用板狀(長方形)' 圓形、橢圓。 進而’較佳為於上述捲芯部1丨3之端部具有至少凸緣部 11 〇 若存在凸緣部11,則容易利用凸緣部i丨控制線圈相對於 捲芯部11 a之位置’電感等特性穩定。 磁芯11之態樣有:具有一個凸緣之態樣,具有兩個凸緣 之態樣(鼓形磁芯),將捲芯部〗丨a之軸長方向配置為相對於 安裝面垂直之態樣,將捲芯部丨丨a之軸長方向配置為相對 於安裝面水平之態樣。 尤其是僅於捲芯部11 a之軸之一端具有凸緣,且將捲芯 部11 a之軸長方向配置為相對於安裝面垂直之態樣對於具 有低背化效果而言較佳。 導體膜14係形成於使用電子零件用軟磁性合金之素體⑺ 之表面,且上述線圈之端部連接於上述導體膜14。 導體膜14有燒製導體膜、樹脂導體膜。作為於電子零件 用軟磁性合金素體10上形成燒製導體膜之例,有使用於銀 中添加有玻璃之膏體以特定之溫度進行燒製的方法。作為 於使用電子零件用軟磁性合金之素體1〇上形成樹脂導體膜 之例,有塗佈含有銀及環氧樹脂之膏體,然後進行特定之 孤度處理的方法。於燒製導體膜之情形時,可於形成導體 膜後進行熱處理。 I54655.doc 201222576 '·、圈之材質有銅、銀。較佳為對線圈施以絕緣覆膜。 線圈之形狀有扁平線、方線、圓線。 於扁平線、方線之情形時,可縮小捲繞線間之間隙,對 於使電子零件小型化而言較佳。 作為形成本實施形態之電子零件20中的制電子零件用 軟磁性合金之素體1G表面之導體膜Μ、Μ之燒製導體層 14a具體例,可藉由以下方式而形成。 於上述之素體1〇即磁芯u之凸緣部Ub、丨卟之安裝面, 塗佈含有金屬粒子及玻璃料的燒製型電極材料膏(本實施 例十為燒製型Ag|*),於大氣中進行熱處理,藉此於素體 10之表面直接燒結固定電極材料。進而亦可於所形成的 燒製導體層14a之表面藉由電解鍍敷而形成见、Sn之金屬 鍍敷層。 另外,作為一態樣,本實施形態之電子零件2 〇亦可藉由 以下之製造方法而獲得。 將包$含有絡2〜8*1;。/。、矽1.5〜7〜1。/。、鐵88〜96.5\^0/〇 作為具體之組成例的原料粒子與結合劑的材料成形,於所 獲得之成形體的至少成為安裝面之表面,塗佈含有金屬粉 末及玻璃料之燒製型電極材料膏後,於大氣中、 400〜900°C下對所獲得之成形體進行熱處理。進而,亦可 於所形成之燒製導體層上形成金屬鍍敷層。藉由該方法, 可同時形成於粒子表面生成有氧化層且鄰接之粒子表面之 氧化層彼此結合的電子零件用軟磁性合金素體、與該素體 表面之導體膜之燒製導體層,從而可將製造製程簡略化。 154655.doc •19- 201222576 由於絡較鐵容易氧化,故而相比純鐵,可抑制於氧化環 境中加熱時鐵過度氧化。作為鉻以外之容易氧化之元素, 可列舉鋁。 以下,參照圖8,就本發明之電子零件用軟磁性合金素 體之實施形態的變形例進行說明。圖8係表示變形例之一 例的使用電子零件用軟磁性合金之素體1〇,的内部結構之透 視圖。本變形例之素體1〇,外觀呈長方體狀,内部埋設有捲 繞成螺旋狀之内部線圈35,内部線圈35之兩端部之抽出部 分別露出於素體10·之相互對向之一對端面。素體ι〇,與埋 設於内部之内部線圈35一起構成積層體晶片31。本變形例 之電子零件用軟磁性合金素體1〇,與上述的第1實施形態之 電子零件用軟磁性合金素體1〇同樣地特徵在於:包含含有 鉻、石夕、鐵之複數個粒子以及氧化層’該氧化層係生成於 粒子之表面,至少含有鐵及鉻,藉由使用掃描式電子顯微 鏡之能量色散X射線分析所得出的鉻相對於鐵之波峰強度 比大於粒子中的鉻相對於鐵之波峰強度比,並且於鄰接之 粒子表面生成之氧化層彼此結合。 本變形例之電子零件用軟磁性合金素體1〇,亦具有與上 述第^實施形態之電子零件用軟磁性合金素體ι〇相同之作 用、效果。 繼而,參照圖9, 形例進行說明《圖 内部結構透視圖 就本發明之電子零件之實施形態的變 9係表示變形例之一例之電子零件40的 使用電子零件用軟磁性合金 本變形例之電子零件40於上述變形例之 之素體10'的相互對向之一對端 154655.doc 201222576 面及其附近包括一對外部導體膜34、34,該—對外部導體 膜34、34形成為與内部線圈35露出之抽出部連接。圖示省 略,外部導體膜34、34與上述的第i實施形態之電子:件 20之外部導體膜14、14同樣地,包含燒製導體層,及積層 形成於該燒製導體層上之鍍见層、鍍以層。本變形例之電 子零件40亦具有與上述的第1實施形態之電子零件2〇相同 之作用、效果。 進而,構成本發明中之電子零件用軟磁性合金素體的複 數個粒子之組成較佳為含有2$鉻$8糾%,且丨矽$7 m〇/。’嶋鐵狐5 wt%。當其组成在該範圍内時,本發 明之電子零件用軟磁性合金素體顯示更高之強度與更高之 體積電阻率。 一 Γ7 -般而言,軟磁性合金巾之Fe量越多,㈣和磁通密度 越高1於直流重疊特性有利,但是在作為磁性元件使用 時,高溫高濕時生銹或該鏽之脫落等成為問題。 另外,以不鏽鋼為代表,|所周知向磁性合金中添加絡 對於耐钮性有效果。但是,使用含有絡之上述合金粉末, 於非氧化性環境中進行熱處理所成的壓粉磁心以絕緣電阻 計測定的比電阻為10-« Qcm ’儘管具有粒子間不產生渴流 損失之程度之值’但是要形成外部導體膜需要ι〇5 ^以 上之比電阻’無法於外部導體膜之燒製導體層上形成金屬 鑛敷層。 因此,本發明令係於氧化環境令對包含具有上述組成之 原料粒子與結合劑之成形體進行熱處理,使粒子表面生成 ]54655.doc 201222576 包含金屬氧化物層之氧化層,且使鄰接之粒子表面之氧化 層彼此結合,藉此獲得高強度。所獲得的電子零件用軟磁 性合金素體之體積電阻率Pv大幅度提高,為1〇5 Qcm以 上,可於素體表面形成之外部導體膜之燒製導體層上,不 產生鍍敷延伸地形成Ni、Sn等之金屬鍍敷層。 進而,說明於較佳形態之本發明之電子零件用軟磁性合 金素體中限定組成之理由。 複數個粒子之組成中的鉻含量若未達2 wt°/。,則體積電 阻率較低’無法不產生鍍敷延伸地於外部導體膜之燒製導 體層上形成金屬鍍敷層。 另外,於鉻多於8 wt%之情形時,亦體積電阻率較低, 無法不產生鍍敷延伸地於外部導體膜之燒製導體層上形成 金屬鍍敷層。 另外,如上述專利文獻1中所記載,使用Fe_Si_A丨粉末藉 由大氣中熱處理而形成氧化物被覆層的氧化物係被覆層中 不含絡之氧化物。因此’其體積電阻率低於1〇5 ,無 法不產生鍍敷延伸地於外部導體膜之燒製導體層上形成金 屬鍍敷層。 上述電子零件用軟磁性合金素體中,複數個粒子之組成 中的Si具有改善體積電阻率之作用,但若Si未達丨5 ”%則 無法獲得該效果,另一方面,於大於7 wt%之情形時,該 效果亦不充分,上述電子零件用軟磁性合金素體之體積電 阻率不足105 Qcm,因此無法不產生鍍敷延伸地於外部導 體膜之燒製導體層上形成金屬鑛敷層。另外,Si亦具有改 154655.doc -22- 201222576 善磁導率之作用,但於Si多於7 wt%之情形時,會因以含 量相對降低而致使飽和磁通密度降低,且伴隨成形性惡化 而磁導率及飽和磁通密度降低。 使用鋁作為鉻以外之容易氧化之元素之情形時,較佳為 鋁 2〜8 wt%、矽 1.5〜12 wt%、鐵 80〜96.5 wt%。 複數個粒子之組成中的鋁含量若未達2 m%,則體積電 阻率較低,無法不產生鍍敷延伸地於外部導體膜之燒製導 體層上形成金屬鍍敷層。另夕卜’於鋁含量大於8 «之情 形時,會因Fe含量相對降低而致使飽和磁通密度降低。 就防銹之觀點而言,較佳為鉻2〜8 wt%、矽丨5〜7 wt%、 鐵88〜96.5 wt%之組成。 再者,亦可使用於鐵-鉻-矽之合金粒子中混合鐵·鋁·矽 之合金粒子(例如未達合金粒子合計之5〇以以)者。 上述電子零件用軟磁性合金素體中,複數個粒子之組成 中的鐵含S若未達88 wt%,則飽和磁通密度降低且伴隨成 形性惡化而磁導率及飽和磁通密度降低。另外,於鐵含量 大於96.5 wt%之情形時,由於鉻含量、矽含量相對降低而 致使體積電阻率降低。 進而,本發明中,複數個粒子之平均粒徑更理想的是, 換算成原料粒子之平均粒徑d5〇%(算術平均)時為5〜3〇 μιη。另外,上述複數個粒子之平均粒徑亦可近似於以下 述方式求得之值,即,自使用掃描式電子顯微鏡(SEM)以 3 000倍拍攝素體之剖面所得的組成像中,選取粒子剖面之 輪廓可完整確認之粒子,用各粒子之剖面之長轴尺寸㈣ I54655.doc -23- 201222576 短軸尺寸d2之簡單平均值D=⑷述)/2之總和除以上述粒 子之個數所得的值。 合金金屬粒子群具有粒度分佈,呈橢圓之形狀而並不— 定為圓球形。 另外,當對立體之合金金屬粒子進行二維(平面)觀察 時,根據所觀察之剖面之位置不同,表觀大小不同。 因此’關於本發明之平均粒徑,係藉由測定大量之粒子 數而評價粒徑^ 千 因此’較理想的是測定至少⑽個以上之符合至少 條件之粒子數。 具體方法如下’將於粒子剖面為最大之直徑作為長轴, 找出將長軸之長度二等分之點。 =含該點且於粒子剖面為最小之直徑作為短軸。將其 寺疋義為長軸尺寸、短軸尺寸。 ^斤測定之粒子係'如下大小者,,將粒子剖面之最大直 交大的粒子以自大至小之順序依序排列,粒子剖面之累 。比率占自掃描式電子顯微鏡(SEM)之圖像除去粒子剖面 之輪^無法完整確認之粒子、空隙及氧化層後之面積的 y 5 /❶之大小之粒子。 右上述平均粒徑在該範圍内,則可獲得高飽和磁通密度 ·=Τ以上)與高磁導率(27以上),並^便於_咖以上 之頻率下,亦可抑制粒子内產生渦流損失。 ^者,本說明書中所揭示之具體數值之含義為於某些態 樣中約為該等數值’另夕卜’數值範圍之記載中的上限及/ 154655.doc •24- 201222576 或下限數值於某些態樣中係包含於範圍内,於某些態樣中 則不包含於範圍内。另夕卜’於某些態樣中,數值係表示平 均值、典型值、中位值等。 [實施例] 以下,藉由實施例及比較例更具體地說明本發明,但本 發明並不受該等之任何限定。 為判斷使用電子零件用軟磁性合金之素體的磁特性之優 劣以原料粒子之填充率為8〇 V0l%之方式於6〜12 ton/cm2 之間調整成形壓力’成形為外徑丨4 mm、内徑8 mm、厚度 3 mm之環狀,於大氣中實施熱處理後,於所獲得之素體 上,將包含直徑0.3 mm之胺基甲酸酯被覆銅線之線圈捲繞 20圈’獲得試驗試樣。使用振動試樣型磁力計(東英工業 公司製造:VSM)測定飽和磁通密度Bs’使用電感電容電 阻測量計(LCR-meter)(Agilent Technologies 公司製造: 4285A) ’於測定頻率1 〇〇 kHz下測定磁導率μ。將飽和磁通 密度Bs為0.7 Τ以上之情況判斷為良好。將磁導率μ為2〇以 上之情況判斷為良好。 為了判斷使用電子零件用軟磁性合金之素體的強度之優 劣’使用圖10所示之測定方法,如下所述地測定3點彎曲 斷裂應力。用於測定3點彎曲斷裂應力之試片係如下所得 者’即’以原料粒子之填充率為80 vol%之方式於6〜12 ton/cm2之間調整成形壓力,成形為長度50 mm、寬度10 mm、厚度4 mm之板狀成形體後,於大氣中實施熱處理所 得者。 154655.doc -25- 201222576 將點f曲斷裂應力為10 kgf/mm2以上之情況判斷為良 好。 ” 將飽和磁通密度Bs、磁導率μ、3點彎曲斷裂應力均良好 之情況判斷為合袼。 另外,為判斷使用電子零件用軟磁性合金之素體的體積 電阻率之優劣,如圖10所示,依據JIS_K69U進行測定。 用於測^體積電阻率之試片係如下所得者,即,以原料粒 子之填充率為80 vol%之方式於6〜12 t〇n/cm2之間調整成形 壓力,成形為直徑100 mm、厚度2 mm之圓板狀後於= 氣中實施熱處理所得者。 將體積電阻率為W0-3 ncm以上之情況判斷為可接受, 1X10·丨Qcm以上之情況判斷為良好,lxl〇5 ftcm以上之情 況判斷為優異。 β 若體積電阻率為1X10-丨,則可減小於高頻下使 用時因渦流所致之損失。另外,若為lxl05 ncm以上則 可藉由濕式鍍敷於導體層上形成金屬鍍敷層。 另外’為判斷電子零件用軟磁性合金素體表面之外部導 體膜之燒製導體層上的金屬鍍敷層之形成狀態之優劣,於 以下所述之實施例中,係將電子零件用軟磁性合金素體之 形狀設為鼓形。 判斷所獲得的電子零件試樣之外部導體膜上的金屬 層之形成狀態之優劣,係使用放大鏡目視判斷外觀又將 Ni、Sn鍍敷層連續地形成於燒製導體層上,且未自燒製導 體層向其周圍產生鍍敷延伸之情況判斷為〇,其他情況判 154655.doc -26- 201222576 斷為X。 (實施例1) 作為用於獲得電子零件用軟磁性合金素體之原料粒子, 使用平均粒徑(d50°/。)為10 μπι,且組成比為鉻:5 wt%, 矽:3 wt%,鐵:92 wt%之作為水霧化粉末之合金粉末 (Epson Atmix股份有限公司製造之PF-20F)。上述原料粒子 之平均粒徑d50%係使用粒度分析計(曰機裝公司製造: 93 20HHRA)測定所得。另外,研磨上述粒子直至通過粒子 中心之剖面露出為止,使用掃描式電子顯微鏡(SEM, Hitachi High-Technologies公司製造之SS-4300SE/N),以 3000倍拍攝所獲得之剖面而獲得組成像,關於該組成像, 藉由能量色散X射線分析(EDS),以ZAF法計算出粒子之中 心附近與表面附近各1 μπι □之組成,確認粒子中心附近之 上述組成比與粒子表面附近之上述組成比大致相等。 繼而,藉由濕式旋轉攪拌裝置混合上述粒子與聚乙烯醇 縮丁醛(積水化學公司製造:S-LEC BL :固形物成分濃度 為3 0 wt%之溶液),獲得造粒物。 使用所獲得之造粒粉末,以複數個粒子之填充率為80 vol%之方式於6〜12 ton/cm2之間調整成形壓力,獲得長度 50 mm、寬度10 mm、厚度4 mm之方板狀之成形體,直徑 1 00 mm、厚度2 mm之圓板狀之成形體,外徑14 mm、内徑 8 mm、厚度3 mm之環狀之成形體,以及於捲芯部(寬度1.0 mmx高度0.36 mmx長度1.4 mm)之兩端具有方形凸緣(寬度 1.6 mmx高度0.6 mmx厚度0.3 mm)的鼓形之磁芯成形體, 154655.doc -27- 201222576 及一對板狀磁芯成形體(長度2.0 mmx寬度0.5 mmx厚度0.2 mm) 〇 對上述中所獲得之圓板狀之成形體、環狀之成形體、鼓 形之成形體、一對板狀成形體,於大氣中、7〇〇°c下進行 60分鐘熱處理。 關於對上述圓板狀之成形體進行熱處理而獲得的圓板狀 之素體,依據JIS-K6911測定體積電阻率,結果示於表1。 另外,關於對上述鼓形之成形體進行熱處理而獲得的鼓 形之素體,以使通過捲芯部之大致中心的厚度方向之剖面 露出之方式進行研磨,使用掃描式電子顯微鏡(SEM)以 3〇〇〇倍拍攝該剖面而獲得組成像。繼而,將上述中所獲得 之組成像中的各像素分類為三級之亮度等級,將上述組成 像令的粒子剖面之輪廓可完整確認之粒子中,各粒子之剖 面之長轴尺寸dl與短軸尺寸d2之簡單平均值⑷述Μ 較原料粒子之平均粒徑(d5〇%)大的粒子之組成對比度作為 广度等級’將上述組成像中符合該亮度等級之部分判 斷為粒,卜另外’將組成對比度較上述中心亮度等級暗 等級ί部分判斷為氧化層2。另外,將較上述令心 冗度專級明亮之直麻黎 結果以模式圖而示;;2 ^分判斷為空隙3,將所得之 =子:上述組成像中’抽取粒子剖面之輪 »心之粒子中’各粒子 ^ 簡單平灼心 轴尺寸dl與短軸尺寸心之 簡早+均值D=(dl+d2)/ 的粒子,藉由U A W位千之千均粒徑_%)大 藉由能量色散X射線分析(EDS),以ZAF法計算出 154655.doc -28- 201222576 其長轴與短轴之交點附近之1 μΓΠ□的組成,將該組成與上 述原料粒子之組成比加以對比,確認上述素體中的複數個 粒子之組成比與原料粒子之組成比大致或實質上相等。 繼而’藉由SEM-EDS,求出上述組成像中粒子1之内部 的以長軸di與短軸d2相交之點為中心之i μιη口的組成將 其結果示於圖3(A)。其次’ #由SEM_EDS,求出上述組成 像中粒子1表面之氧化層2中,氧化層厚度相當於平均厚度 T=(tl+t2)/2之部位的以氧化層之厚度之中心點為中心之丄 μηι□的組成,上述平均厚度T=(u+t2)/2係由上述氧化層2 的最厚部之厚度^與最薄部之厚度12求出,將所得之組成 示於圖3(B)中。根據圖3(a)可知,粒子i内部之鐵之強度 ClFeKa為4200 count,鉻之強度(:1(:心為1〇〇 c〇unt,鉻相對 於鐵之波峰強度比R1=ClcrKa/clFeKa為〇 ON。根據圖3(b) 可知,氧化層2之厚度之中心點處的鐵之強度^以。為3〇〇〇 count,絡之強度C2CrK^ 18〇〇 count,鉻相對於鐵之波峰 強度比R2-C2CrKa/C2FeKa* 〇.6〇,大於上述粒子内部之鉻相 對於鐵之波峰強度比。 另外,本發明之電子零件用軟磁性合金素體中,鄰接之 粒子1、1之表面所生成的氧化層2、2彼此結合之事項可藉 由根據上述組成像所製作的圖2所示之模式圖而確認。 根據以上之結果,確認本實施例丨之電子零件用軟磁性 合金素體包含含有鉻2〜8 wt❶/。、矽1.5〜7 wt%、鐵88〜96.5 wt%的複數個粒子!、i,及於粒子i之表面生成之氧化 層,並且氧化層至少含有鐵及鉻,使用穿透式電子顯微鏡 154655.doc •29· 201222576 進行能量色散χ射線分析所得的鉻相對於鐵之波峰強度比 大於粒子中的鉻相對於鐵之波峰強度比。 另外,於對上述環狀之成形體進行熱處理而獲得的環狀 之素體上,將包含直徑〇·3 mm之胺基甲酸酯被覆銅線之線 圈捲繞20圈,獲得試驗試樣。使用振動試樣型磁力計(東 英工業公司製造:VSM)測定飽和磁通密度Bs,使用LCR 測量計(Agilent Technologies公司製造:4285A),於測定頻 率1 00 kHz下測定磁導率μ。所獲得之結果示於表1。 另外’對於將上述中所獲得之方板狀之成形體,於大氣 中,熱處理溫度 150°C、20(TC、30(TC、500。(:、600。〇、 700°C、800°C、1000°C下分別進行60分鐘熱處理而獲得的 方板狀之素體以及於室溫下放置後的方板狀之成形體,測 定3點彎曲斷裂應力,將結果示於表1及表2。 另外’於上述鼓形之素體的兩凸緣部之安裝面塗佈燒製 型Ag導體膜膏,於大氣中歷時約30分鐘升溫至7〇(rc,於 700°C下保持1 〇分鐘’然後歷時約30分鐘降溫,藉此進行 導體膜材料之燒製處理’形成外部導體膜之燒製導體層。 進而,藉由電解鍍敷法,於該導體膜表面上形成Ni(厚度2 μπι)、Sn(厚度 7 μπι)。 所獲得之結果示於表1。 其結果,素體之強度為7.4 kgf/mm2,作為磁特性之飽和 磁通密度Bs為1.51 T,磁導率μ為45,體積電阻率為 4.2Χ105 Dcm,金屬鍍敷層之形成性為〇,分別獲得良好之 測定結果及判斷結果。再者,亦於熱處理前進行磁導率μ 154655.doc -30- 201222576 測定。其結果示於表3。 繼而’於上述鼓形素體之捲芯部上捲繞包含絕緣被覆導 線之線圈,並且將線圈兩端部分別熱壓接合於上述外部導 體膜上,進而,將對上述板狀成形體進行熱處理而獲得的 板狀之素體,利用樹脂系接著劑分別接著於上述鼓形素體 之凸緣部之兩側’獲得捲線型晶片電感器。 (實施例2) 除將原料粒子之組成比設為鉻:3 wt%,矽:5 wt%, 鐵:92 wt%以外,以與實施例!相同之方式製作評價試 樣’將所獲得之結果示於表1及表2。 如表1及表2所示,作為磁特性之飽和磁通密度仏為146 T,磁導率μ為43,素體之強度為2 8 kgf/mm2,體積電阻率 為2.0X105 Qcm,金屬鍍敷層之形成性為〇,與實施例工同 樣地獲得良好之測定結果及判斷結果。另外,藉由 EDS進行分析之結果,可確認粒子彼此藉由進行熱處理而 於粒子表面形成之金屬氧化物(氧化層)而結合,該氧化層 係與合金粒子相比含有較多的較鐵容易氧化之元素(此處 為絡)的氧化物。 (實施例3) 除將原料粒子之平均粒徑(d50%)設為6 μπι以外以與實 施例】相同之方式製作評價試樣,將所獲得之結果示於表1 及表2。 如表1及表2所示,作為磁特性之飽和磁通密度以為 Τ’磁導率μ為27 ’素體之強度為66 kgf/mm2,體積電阻率 154655.doc 31 201222576 為3.0xl°5 ncm,金屬鍍敷層之形成性為。,與實施例1I5] 樣地獲得良好之測定結果及判斷結果。另外藉由㈣_ EDS進行分析之結果,可確認粒子彼此㈣進行熱處理而 於粒子表面形成之金屬氧化物(氧化層)而結合,該氧化層 係與合金粒子相比含有較多的較鐵容易氧化之S素(此處 為絡)的氧化物。 (實施例4) 除將原料粒子之平均粒徑(d50%)設為3 _以外,以與實 加例1相同之方式製作評價試樣’將所獲得之結果示於表1 及表2。 表1及表2所不,作為磁特性之飽和磁通密度為〗π T磁導率卜為2〇,素體之強度為7.6 kgf/mm2,體積電阻率 為7胸〇5⑽,金屬鑛敷層之形成性為。,與實施例丄同 樣地獲得良好之測定結果及判斷結果。另夕卜,藉由SEM_ EDS進行分析之結果,可確認粒子彼此藉由進行熱處理而 於粒子表面形成之金屬氧化物(氧化層)而結合,該氧化層 係與合金粒子相比含有較多的較鐵容易氧化之S素(此處 為絡)的氧化物。 (實施例5) 除將原料粒子之組成比設為絡:9.5 wt%,石夕:3 wt%, 线7·5 wt/o以外’以與實施例1相同之方式製作評價試 樣,將所獲得之測定結果及判斷結果示於表1及表2。如表 1及表2所示,作為磁特性之飽和磁通密度Bs為1刊丁,磁 導率μ為33,素體之強度為7 4 kgf/_2 ’體帛電阻率為 I54655.doc •32· 201222576 4.7x10-3 ncm,金屬鍵敷層之形成性心。可知於絡超㈣ wt%之本實施例中,體積電阻率降低。另外,藉由sem· 删進行分析之結|,可確認粒子彼此藉由進行熱處理而 於粒子表面形成之金屬氧化物(氧化層)而結合,該氧化層 係與合金粒子相比含有較多的較鐵容易氧化之元素(此處 為絡)的氧化物。 (實施例6) ^ 除將原料粒子之組成比設為鉻:5 wt%,矽:i wt〇/〇, 鐵:94 wt%以外,以與實施例}相同之方式製作評價試 樣,將所獲得之測定結果及判斷結果示於表丨及表2。如表 1及表2所不,可知作為磁特性之飽和磁通密度Bs為[π T磁導率μ為26,素體之強度為18 kgf/mm2,體積電阻率 為8.3X10·3 Qcm,金屬鍍敷層之形成性為X。另外,藉由 SEM-EDS進行分析之結果,可確認粒子彼此藉由進行熱處 理而於粒子表面形成之金屬氧化物(氧化層)而結合,該氧 化層係與合金粒子相比含有較多的較鐵容易氧化之元素 (此處為鉻)的氧化物。 (實施例7) 除將大氣中之處理溫度設為1〇〇〇°c以外,以與實施例i 相同之方式獲得電感器零件。測定及判斷結果示於表1。 如表1及表2所示,作為磁特性之飽和磁通密度仏為15〇 T,磁導率μ為50,素體之強度為2〇 kgf/mm2,體積電阻率 為2.0><102卩(^11,金屬鍍敷層之形成性為><。熱處理溫度提 高之本實施例中,雖然3點彎曲斷裂應力增大,但體積電 154655.doc •33· 201222576 阻率低於實施例卜另外,藉由sem_eds進行分析之社 果’可確認粒子彼此藉由進行熱處理而於粒子表面形成二 金屬氧化物(氧化層)而結合,該氧化層係與合金粒子相比 含有較多的較鐵容易氧化之元素(此處為⑹的氧化^ (實施例8) 除將原料粒子之組成比設為矽:9 5,鋁:5 $ wt%’鐵:85 wt%以外’以與實施例1相同之方式製作評 價試樣,將所獲得之測定結果及判斷結果示於幻及表2。 表1及表2所不,作為磁特性之飽和磁通密度為m Τ’磁導率μ為32,素體之強度為14kgf/_2,體積電阻率 為8加1〇3⑽,金屬鍵敷層之形成性為“可知體積電阻 率較低,無法於外部導體膜之燒製導體層上形成金屬鍍敷 層。另夕卜,藉由SEM-EDS進行分析之結果,可確認粒子彼 此藉由進行熱處理而於粒子表面形成之金屬氧化物(氧化 層)而結合,該氧化層係與合金粒子相比含有較多的較鐵 容易氧化之元素(此處為鋁)的氧化物。 (比較例1) 除將原料粒子之組成比設為絡:1 wt〇/。,石夕:6.5 wt%, 鐵:92.5 wt%以外,以與實施例1相同之方式製作評價試 #,將所獲得之測定結果及判斷結果示於表i及表2。 士表1及表2所示’作為磁特性之飽和磁通密度為〗% 磁導率μ為〗7 ,素體之強度為4 2 ,體積電阻率 為4.9X101 fiCm,金屬錢敷層之形成性為X。另外,藉由 SEM EDS進行分析之結果,可知於〇未達2 之本比較 I54655.doc * 34 - 201222576 例中,藉由熱處理而於粒子表面形成之金屬氧 層)並非與人全物工匆(氧化 ' 子相比含有較多的較鐵容易氧化之-去 (此處為絡)的氧化物,因此體積電阻率較低。 '、 (參考例1) 除不進行熱處理以外,以與實施例㈠目同之方式製作 價試樣,將所獲得之敎結果及判斷結果示於h及表2°。 ,及表2所不,作為磁特性之飽和磁通密度Bs為1.50 率爲1 Γ率^為35,素體之強度為〇.54 kgf/mm2,體積電阻 數廢1G ΩεΠ1 °再者’本參考例中省略了關於金屬鍵 敷層之形成性的試㈣作及評價。藉由進行分析 ^結果’可知本參考例中,於粒子之表面未生成包含金屬 氧化物之氧化層。因此’體積電阻率相比實施例稍稍降 (參考例2) 除將大氣_之處理溫度設為3Gn,以與實施例㈠目 同之方式製作評價試樣,將所獲得之測定結果及判斷結果 2於表1及表2。如表1及表2所示,作為磁特性之飽和磁通 密又Bs為1.5〇 τ,磁導率^為^,素體之強度為〇 μ kgf/mm2’體積電阻率為i 4χ1〇5 ^。再者,本參考例中 省略了關於金屬鍵敷層之形成性的試樣製作及評價。藉由 SEM-EDS進行分析之結果,可知本參考例中由於熱處理溫 度低於40〇c ’因此於粒子之表面未充分生成包含金屬氧 化物之氧化層。因此,體積電阻率相比實施例稍稍降低。 (實施例9) 154655.doc 35· 201222576 其次’說明積層型之實施例。 使用與實施例1相同之合金粒子,製作積層數為20層, 形狀為3.2 mmxl.6 mmx〇.8 mm的於素體内部具有線圈之線 圈型電子零件。 首先’使用狹縫式塗佈機,將合金金屬粒子85 wt%、丁 基卡必醇(溶劑)13 wt。/。、聚乙烯醇縮丁醛(黏合劑)2 wt°/〇之 混合物加工成厚度4〇 μηι之片狀,繼而將Ag粒子85 wt0/〇、 丁基卡必醇(溶劑)13 wt。/。、聚乙烯醇縮丁醛(黏合劑)2 wt〇/〇 之導體膏塗佈於片材上,形成導電圖案。 然後’積層形成有導電圖案之片材,以加壓壓力2 ton/cm2獲得積層體。 以大氣下、800°C、2 hr之條件對該積層體進行熱處理而 獲得素體。 於該内部形成有線圏之素體的線圈之抽出部露出之面以 及安裝面塗佈含Ag之膏體,於7〇〇〇c進行1〇分鐘熱處理, 獲得形成有金屬鍍敷層之線圈型電子零件。作為磁特性之 飽和磁通密度Bs為K41T,磁導率μ為15。再者,熱處理前 之磁導率μ為13。金屬鍍敷層之形成係形成犯。另外,藉 由SEM-EDS進行分析之結| ’可確認粒子彼此藉由進行熱 處理而於粒子表面形成之金屬氧化物(氧化層)而結合,該 氧化層係與合金粒子相比含有較多的較鐵容易氧化之元素 (此處為鉻)的氧化物。 再者,確認實施例1〜4之粒子中,結合部分之厚度較合 金粒子表面之氧化層厚。實施例5、6之粒子中,結合部分 154655.doc •36· 201222576 之厚度較合金粒子表面之氡化層薄。確認實施例卜8之粒 子之氧化層的厚度為50奈米以上。 [表1] . S且成[Wt0/〇] 粒徑dSO [μηι] 熱處理 溫度 [°C] Bs [T] μ 3點彎曲斷 裂應力 [kgf/mm2] 體積電 阻率 [Ωαη] 金屬鍍 敷層形 成性 Cr Si A1 Fe 實施例1 5 3 - 92 10 700 1.51 45 7.4 4.2χ105 Ο 實施例2 3 5 - 92 10 700 1.46 43 2.8 2.〇χ105 Ο 實施例3 5 3 - 92 6 700 1.45 27 6.6 3_〇χ105 ο 實施例4 5 3 - 92 3 1 700 1.38 20 7.6 7.〇χ105 ο 實施例5 9.5 3 - 87.5 10 700 1.36 33 7.4 4.7χ1〇·3 X 實施例6 5 1 - 94 10 700 1.58 26 18 8.3 χ10·3 X 實施例7 5 3 - 92 10 1000 1.50 50 20 2.〇χ102 X 實施例8 - 9.5 5.5 85 10 700 0.77 32 1.4 8·〇χ103 X 比較例1 1 6.5 _ 92.5 10 700 1.36 17 4.2 4.9x10' X 參考例1 5 3 - 92 10 - 1.50 35 0.54 1·4χ105 _ 參考例2 5 3 - 92 10 300 1.50 35 0.83 1.4χ105 - [表2] 熱處理溫度與3點贊曲斷裂應力[lcgf/mm2] 熱處理溫度 rc) 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例8 比較例1 25 0.54 0.48 0.51 0.52 0.48 0.53 0.25 0.55 150 1.1 1.2 1.1 1.3 1.0 1.3 0.89 1.2 200 0.45 0.31 0.42 0.55 0.48 0.72 0.19 0.58 300 0.83 0.72 0.90 1.01 0.92 0.92 0.23 0.82 500 3.4 1.2 2.0 3.7 3.6 5.7 0.26 2.4 600 4.5 1.7 3.5 5.1 4.9 8.0 0.43 3.9 700 7.4 2.8 6.6 7.6 7.4 18 1.4 4.2 800 12 4.5 10 16 17 24 5.7 6.5 1000 20 7.3 15 27 28 33 7.8 8.2 ※實施例1之熱處理溫度1000X:對應實施例7 154655.doc -37· 201222576 [表3] 熱處理溫度與μ 熱處理溫度 (0〇 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例8 比較例1 25 35 32 23 19 28 23 24 30 700 45 43.0 27 20 33 26 32 17 △μ 29 36 17 7 18 13 33 -43 △μ=(熱處理溫度為7〇〇°C時之μ-熱處理溫度為25°C時之μ)/熱處理溫度為25°C時之 μχΙΟΟ [產業上之可利用性] 本發明之電子零件用軟磁性合金素體以及使用該素體之 電子零件適合作為可於電路基板上進行表面安裝的小型化 之電子零件。尤其是使用於流通大電流之功率電感器之情 形時,於零件之小型化方面較佳。 【圖式簡單說明】 圖1係表示本發明之使用電子零件用軟磁性合金之素體 的第1實施形態之側視圖。 圖2係第1實施形態之使用電子零件用軟磁性合金之素體 之剖面的放大模式圖。 圖3(A)、(Β)係表示使用掃描式電子顯微鏡,藉由能量 色散X射線分析對第1實施形態之使用電子零件用軟磁性合 金之素體進行分析所得之結果的圖。 圖4係表示使用X射線繞射分析裝置分析第1實施形態之 使用電子零件用軟磁性合金之素體之氧化層所得的結果的 圖。 圖5係使用掃描式電子顯微鏡,藉由能量色散X射線分析 對第1實施形態之使用電子零件用軟磁性合金之素體進行 154655.doc -38- 201222576 線性分析之結果的圖。 圖0係表示本發明之線圈型電子零件之第1實施形態的透 視—部分之側視圖。 圖7係表示第1實施形態之線圈型電子零件之内部結構的 縱剖面圖。 圖8係表示本發明之使用電子零件用軟磁性合金之素體 之貫施形態的變形例之一例的内部結構透視圖。 圖9係表示本發明之電子零件之實施形態的變形例之一 例的内部結構透視圖。 圖1〇係表示本發明之實施例之3點彎曲斷裂應力之試樣 測定方法的說明圖。 圖11係表示本發明之實施例之體積電阻率之試樣測定方 法的說明圖。 【主要元件符號說明】 1 粒子 2 氧化層 3 空隙 10、10, 使用電子零件用軟磁性合金 11 鼓形之磁芯 1 la 捲芯部 lib 凸緣部 12 板狀磁芯 14、34 外部導體膜 14a 燒製導體膜層 154655.doc •39- 201222576 14b 鍍Ni層 14c 鑛Sn層 15 線圈 15a 捲繞部 15b 端部(接合部) 20 電子零件(捲線型晶片 電感器) 31 積層體晶片 34 外部導體膜 35 内部線圈 40 電子零件(積層型晶片 電感) dl 長軸尺寸 d2 短軸尺寸 tl 最厚部之厚度 t2 最薄部之厚度 154655.doc -40-The manufacturing method of the coil type electronic component comprises the steps of: processing a mixture of the sub-sheet into a sheet shape; and obtaining a formed body by using a conductive pattern; and heat-treating the shaped body to cause the soft magnetic alloy particles to be wired to each other Body; and I54655. The method of manufacturing a coil type electronic component according to (19) or (20), wherein the oxygen environment is an atmospheric environment. [Effect of the Invention] According to the present invention, since the oxide layer formed by oxidation of the particles is used as the insulating layer of each of the soft magnetic particles, it is not necessary to mix the resin or the glass into the soft magnetic particles for the purpose of achieving insulation. Further, it is not necessary to apply a large pressure during molding as compared with the Fe-Al-Si powder whose surface has been previously oxidized. Therefore, a magnet which can be produced at low cost and which has both high magnetic permeability and high saturation magnetic flux density can be obtained. [Embodiment] In the present specification, the "oxidation layer formed by oxidation of particles" is an oxide layer formed by an oxidation reaction of natural oxidation of particles, which means that a molded body of particles is formed in an oxidizing atmosphere. The heat treatment is an oxide layer in which the surface of the particles reacts with oxygen to grow. Furthermore, a "layer" is a layer that can be clearly identified according to composition, structure, physical properties, appearance, and/or manufacturing steps, including those whose boundaries are clearly defined, whose boundaries are not clear, and which are included in the particles as continuous films, Some have a non-continuous part. In some cases t, the "oxide layer" is a continuous oxide film covering the entire particle. Further, such an oxide layer has any of the features specified in the present specification, and the oxide layer grown by the oxidation reaction of the particle surface can be distinguished from the oxide film layer which is coated by other methods. In addition, in the present specification, "comparative with ·", "comparable with", etc., means that the expression of comparison means that the difference in substance indicates a difference in the degree of significant difference in function, structure, and effect. Hereinafter, referring to FIG. 1 and FIG. 2, the use of soft magnetic 154655 for electronic parts of the present invention. Doc 201222576 The first embodiment of the elemental body of the alloy is described. Fig. 1 is a side elevational view showing the appearance of the element body 1 using a soft magnetic alloy for electronic parts according to the embodiment. In the present embodiment, the soft body of the soft magnetic alloy for electronic components is used as the magnetic core for winding the coil of the wound wire type inductor. The magnetic core 11 includes a plate-shaped core portion 11a for winding a coil in parallel with a mounting surface of a circuit board or the like, and a respective one of the opposite ends of the winding core portion 11a. The flange portions lib and lib have a drum shape. The ends of the coils are electrically connected to the conductor film 14 formed on the surfaces of the flange portions lib and lib. The element body 1 using a soft magnetic alloy for an electronic component according to the present embodiment is characterized in that it is composed of a group of soft magnetic alloy particles containing iron (Fe), bismuth (Si), and an element which is easily oxidized by iron. An oxide layer formed by oxidation of the particles is formed on the surface of the soft magnetic particles, and the oxide layer contains a larger amount of chromium than the alloy particles, and the particles are bonded to each other via the oxide layer. The following § contains the element name or element symbol. 2 is an enlarged schematic view showing a cross section of the element body 10 using a soft magnetic alloy for an electronic component according to the embodiment, and is a composition image obtained by taking a cross section of the thickness direction of the element body by SEM (scanning electron microscope) at 3000 times. .  And the map made. .  The plurality of particles and the oxide layer in the above pattern diagram can be identified by the means described below. First, the surface was exposed by a cross section in the thickness direction of the center of the element body, and the obtained image was obtained by scanning the obtained cross section at 3,000 times using a scanning electron microscope (SEM). Scanning electron microscopy (SEM) will make the difference between the constituent elements and the composition like I54655. Doc 201222576 is presented in terms of contrast (brightness). Then, each pixel of the composition image obtained in the above is classified into three levels of brightness levels. Regarding the brightness level 'the simple average value of the major axis dimension ^ and the minor axis dimension d2 of the profile of each particle in the particle which can be completely confirmed in the above-mentioned composition image D = (dl + d2) / 2 The composition contrast of the particles larger than the raw material particles (the average particle size of the alloy particles in which the oxide layer is not formed) is large, and the portion of the composition image that satisfies the brightness level is determined as the particle. Further, it is possible to judge the portion of the brightness level which is darker than the above-described central brightness level as the oxide layer 2. Further, it is preferred to carry out a plurality of measurements. Further, it is possible to judge the portion of the brightness level which is brighter than the above-mentioned central brightness level as the gap 3. Regarding the measurement of the thickness of the oxide layer 2, the thickness of the oxide layer 2 can be determined by the shortest distance from the interface between the particle and the oxide layer 2 to the interface between the oxide layer 2 and the gap 3 as the thickness of the oxide layer 2. . Specifically, the thickness of the oxide layer 2 can be found by the following method. The SEM (scanning electron microscope) was used to take a section of the thickness direction of the element body 10 at a magnification of 1 to 3 or 3, and the center of one particle of the obtained composition image was obtained using an image processing software. Eds (energy dispersive ray ray analysis device) performs linear analysis from the center point in the radial direction. A region in which the oxygen concentration is three times or more the oxygen concentration at the center point is determined as an oxide (that is, considering that the jitter of the measurement is three times as a threshold value, and that the non-oxidized layer is determined to be less than three times, the actual oxidation is performed. The oxygen concentration of the layer may also be 1 〇〇 2 (above), and the length to the outer peripheral portion of the particles is measured as the thickness of the oxide layer 2. Yu 154655. Doc 10 201222576 Some of the methods described in this manual can be used according to the identification method of the brightness level, the identification method according to the oxygen concentration, the identification method according to the composition ratio described later, and the identification based on the peak intensity ratio. The method of delineating the oxide layer is appropriately selected by any of the known methods relating to the presence or concentration of oxygen species (concentration). Further, in some aspects, the average particle diameter of the soft magnetic particles having an oxide layer is substantially the same as or substantially the same as the average particle diameter of the raw material particles (particles before forming and heat treatment). The thickness of the oxide layer 2 formed on the surface of the alloy particles may be different in thickness depending on the portion of the (10) alloy particles. As a state, a high strength effect is obtained by forming the entirety into alloy particles bonded to each other with a thicker oxide layer than the oxide layer on the surface of the alloy particles (the oxide layer adjacent to the void 3). Further, as another aspect, the effect of high magnetic permeability is obtained by forming the entirety into alloy particles which are bonded to the oxide layer which is thinner than the oxide layer of the alloy particles (the oxide layer adjacent to the void 3). * Further, 'as a different aspect', at least the soft magnetic particle group is partially an oxide layer having a thickness of 50 nm or more (as a surface oxidized particle. ^ As another aspect, the above particles are combined with each other) The oxide layer is preferably the same phase. The term "the same phase" means substantially I = in the oxide layer between the particles (except for the void adjacent to the oxide layer), and each particle is formed by the same crystal and The oxide layer is combined, and this matter can be confirmed by a transmission electron microscope (TEM). In addition, the structure of the crystal is shown in Figure 4, which can be borrowed from 154655. Doc 201222576 Confirmed by the x-ray diffraction analysis device. As will be described later, the structure, composition, thickness and the like of the oxide layer can be controlled by the composition of the raw material particles, the distance between the particles (filling ratio), the heat treatment temperature, the heat treatment time, the amount of oxygen in the heat treatment environment, and the like. The thickness of the oxide layer is also non-uniform between the particles. In some aspects, substantially all or most of the oxide layer has a thickness in the range of 10 to 200 nm. In other aspects, the oxide layer is preferably viewed from the side of the alloy particles, and includes: a first oxide layer having a reduced content of the iron component and an increased content of the element which is easily oxidized, and a content of the iron component being lowered and A second oxide layer having a reduced content of elements that are easily oxidized. Further, it is more preferable that the content of the ruthenium in the first oxide layer has an inflection point as viewed from the side of the alloy particles. Further, the boundary between the first oxide layer and the second oxide layer may be clearly or blurred. This structure can be confirmed by an EDS (Energy Dispersive Xenon Radiation Analyzer) as shown in Fig. 5, and an effect of suppressing a decrease in saturation magnetic flux density can be obtained. The composition ratio of the particles in the element body using the soft magnetic alloy for electronic parts described above can be confirmed as follows. First, the raw material particles are polished so that the cross section passing through the center of the particle is exposed, and the cross section obtained by polishing is obtained by scanning electron microscopy (SEM) at 3,000 times to obtain a composition image for which the energy dispersive X-ray is obtained. Analysis (EDS), the composition of 1 μηι □ near the center of the particle was calculated by the ZAF method. Then, the cross section in the thickness direction of the substantially center of the soft magnetic alloy body for the electronic component is exposed, and the cross section obtained by polishing is scanned using electron microscopy 154655. Doc 201222576 Mirror (Let) obtains a composition image by taking 3× times of shooting. From the composition image, the rim of the particle profile can be completely confirmed. The long axis dimension of each particle section (4) Short axis rule is 2 simple The particles having a larger average value D=(di+d2)/2 than the average particle diameter _% of the raw material particles are calculated by the energy dispersive ray ray analysis (EDS), and the intersection of the major axis and the minor axis is calculated by the ZAF method. The composition of the i μιη□ is compared with the composition ratio of the above-mentioned raw material particles, whereby the composition ratio of the alloy particles in the element body using the soft magnetic alloy for electronic parts is known (since the composition of the raw material particles is known) Therefore, the composition of the alloy particles in the element body can be determined by comparing the compositions calculated by the ZAF method with each other. The thickness of the oxide layer in the element body using the soft magnetic alloy for electronic parts described above is a simple average value of the following thickness tl and thickness t2 of the oxide layer existing on the surface of the particle identified by the above method and the surface of the crucible. The obtained average thickness T = (tl + t2) / 2, the thickness tl is the thickness of the thickest portion of the thickness of the oxide layer from the surface of the particle crucible, and the thickness t2 is the thickness of the thinnest portion. As an aspect of the present invention, examples of the element which is easily oxidized include a chromium form. The use of a soft magnetic alloy for electronic parts, including the chromium wt%, 矽1. 5 to 7 wt%, iron 88 to 96 5 wt% of a plurality of particles 1, 1 and an oxide layer 2 formed on the surface of the particle 1. The oxide layer 2 contains at least iron and chromium, and the peak intensity ratio R2 of chromium relative to iron obtained by energy dispersive X-ray analysis using a transmission electron microscope is substantially larger than the peak intensity ratio R1 of chromium in the particles (for example, a ruler). 2 is several times or more and several tens of times or more of R1). In addition, there are gaps between the plurality of particles 3 154655. Doc 13 The part of 201222576. In the soft magnetic alloy body for an electronic component, the peak ratio R2 of chromium to iron in the oxide layer 2 and the intensity ratio R1 of chromium in the particle 1 with respect to iron can be obtained as follows. . First, the particles in the above composition image are obtained by SEM-EDS! The inner portion has a composition in which the long axis is 1 μιη α centered on the point intersecting the short axis d2. Next, by SEM-EDS, the center point of the thickness of the oxide layer in the thickness portion of the oxide layer corresponding to the average thickness T = (tl + t2) / 2 of the oxide layer 2 on the surface of the particle J in the composition image is obtained. The average thickness T = (tl + t2) / 2 of the composition of 1 μm η □ is determined by the thickness 丨丨 of the thickest portion of the oxide layer 2 and the thickness t2 of the thinnest portion. Then, by the particles! The strength of the inner iron ^^^, the strength of the chromium, ClCrKa, can be determined as the peak intensity ratio of chromium to iron R1 == ClCrKa / ClFeKa. Further, from the strength C2FeKa of the iron at the center of the oxide layer 2 and the strength C2CrKa of the chromium, the peak intensity ratio of chromium to iron can be determined as R2 = C2crKe / C2peKa. Further, in the element body using the soft magnetic alloy for electronic parts of the present invention, it is bonded via an oxide layer formed on the surfaces of the adjacent particles 1 and 1, and can be produced by the composition image as shown in FIG. Confirmed by the pattern diagram. Further, the combination of the oxide layers formed on the surfaces of the adjacent particles 1 and 1 results in an improvement in the magnetic properties and strength of the element body using the soft magnetic alloy for electronic parts. In the production of the element body of the soft magnetic alloy for electronic parts of the present invention, first, a binder such as a thermoplastic resin is added to the raw material particles containing chromium, bismuth or iron, and the mixture is stirred and mixed to obtain a granulated product. . Following 154655. Doc 201222576, the granulated product is compression-molded to form a molded body, and the obtained molded body is heat-treated in the air at a temperature of a bark. By heat-treating in the atmosphere, the mixed thermoplastic resin can be degreased, and the chromium which is originally present in the particles by the heat treatment and moved to the surface, and the iron which is the main component of the particles are combined with oxygen, An oxide layer containing a metal oxide is formed on the surface of the particle, and the oxide layers on the surface of the adjacent particle are bonded to each other. The resulting oxide layer (metal oxide layer) is mainly composed of an oxide composed of a complex, which ensures insulation between particles, and provides a soft body using a soft magnetic alloy for electronic parts. Examples of the raw material particles include (IV) particles produced by a water-cut method, and examples of the shape of the raw material particles include a spherical shape and a flat shape. In the present invention, if the heat treatment temperature is raised in an oxygen atmosphere, the binder will be divided: and the soft magnetic alloy body will be oxidized. Therefore, as a heat treatment of the molded body, the car is kept at atmospheric temperature for 400 minutes at 400 ° C. By performing heat treatment in this temperature (4), an excellent oxide layer can be formed: _~8〇〇t. The heat treatment may also be carried out in an environment other than the atmosphere, such as an oxygen partial pressure or a large = same degree. In the reducing environment or in the non-匕%蜒, the heat treatment does not generate oxidation containing metal oxides, so the particles are sintered to each other, resulting in a significant decrease in volume resistivity. The oxygen concentration and the amount of water vapor in the environment are not particularly limited. If it is produced or considered, it is preferably atmospheric or dry air. For 4GG (: when 'excellent strength and excellent = resistivity. On the other hand, if the heat treatment temperature is greater than Jing, B & increase, but the volume resistivity decreases. 154655. Doc 15 201222576 By setting the holding time in the above heat treatment temperature to 丨min or more, an oxide layer containing a metal oxide containing Fe and chromium is easily formed. The thickness of the oxide layer is saturated at a certain value, so the upper limit of the holding time is not particularly set, but it is considered that the productivity is set to be 2 hours or less. As described above, by setting the heat treatment conditions to the above range, it is possible to simultaneously satisfy the excellent strength and the excellent volume resistivity, and it is possible to obtain an element body using a soft magnetic alloy having an oxide layer. That is, the formation of the oxide layer is controlled by heat treatment temperature, heat treatment time, oxygen enthalpy in the heat treatment environment, and the like. In the soft magnetic alloy body for an electronic component of the present invention, high magnetic permeability and high saturation magnetic flux density can be obtained by subjecting the iron powder to an alloy powder of an element which is easily oxidized by iron. Also, with this high magnetic permeability, it is possible to obtain an electronic component which flows more current than the previously smaller soft magnetic alloy body. Further, unlike the coil component in which the soft magnetic alloy particles are bonded by resin or glass, the present invention can be produced at low cost without using a resin or a glass, and without applying a large pressure to form. In addition, the soft magnetic alloy body for electronic parts of the present embodiment can maintain a high saturation magnetic flux density and prevent the glass component and the like from floating to the surface of the element body after heat treatment in the atmosphere, and can provide a small size with high dimensional stability. Wafer-like electronic parts. Next, a first embodiment of an electronic component according to the present invention will be described with reference to Figs. 1, 2, 6, and 7. The circular cymbal and Fig. 2 are the same as the above-described embodiment of the soft magnetic alloy body for an electronic component, and thus the description thereof is omitted. Figure 6 is 154655. Doc • 16· 201222576 A side view showing a part of a perspective view of the electronic component of the embodiment. Fig. 7 is a vertical cross-sectional view showing the internal structure of the electronic component of the embodiment. The electronic component 20 of the present embodiment is a wound-type wafer inductor of a coil type electronic component. The electronic component 20 includes the above-described soft magnetic alloy body 10 for electronic components, that is, a drum-shaped magnetic core 11, and a pair of plate-shaped magnetic cores 12 and 12. The illustration of the pair of plate-shaped magnetic cores 12 and 12 is omitted. This is composed of the above-described element body 10, and connects the flange portions 11b and 11b of the drum-shaped magnetic core 11 to each other. A pair of outer conductor films 14, 14 are formed on the mounting faces of the flange portions lib and lib of the magnetic core 11, respectively. Further, a coil 15 including an insulated coated wire is wound around the core portion Ua of the magnetic core to form a wound portion 15a, and both end portions 15b and 15b are thermocompression bonded to the flange portions nb and lib, respectively. On the outer conductor films 14 and 14 of the mounting surface, the outer conductor films 14 and 14 include a fired conductor layer 14a formed on the surface of the element body 10, and a Ni plating layer Mb laminated on the fired conductor layer Ma and The Sn layer is plated with Me. The plate-like cores 12 and 12 described above are attached to the flange portions lib and lib of the drum core i! by a resin-based adhesive. The electronic component 20 of the present embodiment includes the above-described element body 10 using a soft magnetic alloy for electronic components as a magnetic core 11, and the element body 1 includes a plurality of particles containing chromium, lanthanum, and iron, and an oxide layer The surface generated on the surface 'at least containing iron and chromium, by energy dispersive X-ray analysis using a scanning electron microscope', the ratio of the peak intensity of chromium to iron calculated by the ZAF method is greater than that of the above-mentioned particles relative to iron The peak intensity ratio is combined with the oxide layers formed on the surfaces of the adjacent particles. Further, at least one pair of outer conductor films 14, 154655 are formed on the surface of the element body 10. Doc • 17-201222576 14° The use of the soft body of the soft magnetic alloy for electronic components in the electronic component 2 of the present embodiment is the same as that described above, and thus the description thereof is omitted. The magnetic core 11 has at least a core portion 丨丨a, and the shape of the cross section of the core portion 1 丨 & can be a plate-like (rectangular) circular or elliptical shape. Further, it is preferable that at least the flange portion 11 is provided at the end portion of the winding core portion 1丨3, and if the flange portion 11 is present, the position of the coil relative to the core portion 11a can be easily controlled by the flange portion i丨. Inductive and other characteristics are stable. The magnetic core 11 has a state of having a flange and having two flanges (drum core), and the axial length of the core portion 丨a is arranged to be perpendicular to the mounting surface. In the aspect, the axial length direction of the core portion 丨丨a is arranged to be horizontal with respect to the mounting surface. In particular, it is preferable that the one end of the shaft of the winding core portion 11a has a flange, and the axial length direction of the winding core portion 11a is arranged to be perpendicular to the mounting surface, which is preferable for having a low-returning effect. The conductor film 14 is formed on the surface of the element body (7) using a soft magnetic alloy for electronic parts, and the end portion of the coil is connected to the conductor film 14. The conductor film 14 has a fired conductor film and a resin conductor film. As an example of forming a fired conductor film on the soft magnetic alloy body 10 for an electronic component, there is a method of firing at a specific temperature using a paste in which silver is added to silver. As an example of forming a resin conductor film on a body of a soft magnetic alloy for an electronic component, there is a method of applying a paste containing silver and an epoxy resin, and then performing a specific degree of treatment. In the case of firing a conductor film, heat treatment may be performed after forming a conductor film. I54655. Doc 201222576 '·The material of the circle is copper and silver. Preferably, the coil is coated with an insulating film. The shape of the coil has a flat line, a square line, and a round line. In the case of a flat wire or a square wire, the gap between the winding wires can be made small, which is preferable for miniaturizing the electronic component. A specific example of the conductive film layer a on the surface of the element body 1G of the soft magnetic alloy for the electronic component for use in the electronic component 20 of the present embodiment, which can be formed by the following, can be formed as follows. A fired electrode material paste containing metal particles and a glass frit is applied to the mounting surface of the flange portion Ub and the crucible of the magnetic core u, which is the above-mentioned element body 1 (the tenth embodiment is a fired Ag|* The heat treatment is performed in the atmosphere, whereby the electrode material is directly sintered and fixed on the surface of the element body 10. Further, a metal plating layer of Sn and Sn may be formed by electrolytic plating on the surface of the formed fired conductor layer 14a. Further, as an aspect, the electronic component 2 of the present embodiment can also be obtained by the following manufacturing method. The package $ contains the network 2~8*1; /.矽1. 5~7~1. /. , iron 88~96. 5\^0/〇 is formed as a material sample of a specific composition example and a material of a binder, and a baked electrode material paste containing a metal powder and a glass frit is applied to at least a surface of the obtained molded body which is a mounting surface. Thereafter, the obtained shaped body is subjected to heat treatment in the atmosphere at 400 to 900 °C. Further, a metal plating layer may be formed on the formed fired conductor layer. According to this method, a soft magnetic alloy body for an electronic component in which an oxide layer is formed on the surface of the particle and an oxide layer on the surface of the adjacent particle is bonded to each other, and a conductor layer of the conductor film on the surface of the element body can be simultaneously formed. The manufacturing process can be simplified. 154655. Doc •19- 201222576 Since iron is more oxidized than iron, it can suppress excessive oxidation of iron during heating in an oxidizing environment compared to pure iron. As an element which is easy to oxidize other than chromium, aluminum is mentioned. Hereinafter, a modification of the embodiment of the soft magnetic alloy body for an electronic component of the present invention will be described with reference to Fig. 8 . Fig. 8 is a perspective view showing the internal structure of a soft body using a soft magnetic alloy for an electronic component, which is an example of a modification. The element body of the present modification has a rectangular parallelepiped shape, and an inner coil 35 wound in a spiral shape is embedded therein, and the extraction portions at both end portions of the inner coil 35 are exposed to one another in the mutual orientation of the element body 10·. To the end face. The elementary body ι is formed of a laminated body wafer 31 together with the inner coil 35 embedded therein. The soft magnetic alloy body of the electronic component according to the first modification is characterized in that it contains a plurality of particles containing chromium, stellite, and iron in the same manner as the soft magnetic alloy body of the electronic component according to the first embodiment. And an oxide layer formed on the surface of the particles, containing at least iron and chromium, and the peak intensity ratio of chromium to iron obtained by energy dispersive X-ray analysis using a scanning electron microscope is larger than that of chromium in the particles. The peak intensity ratio of iron and the oxide layers formed on the surfaces of adjacent particles are combined with each other. The soft magnetic alloy body of the electronic component according to the present modification has the same effects and effects as those of the soft magnetic alloy body of the electronic component of the above-described embodiment. Next, a description will be given of a soft magnetic alloy for use in an electronic component according to an embodiment of the electronic component of the present invention. The electronic component 40 is opposite to the opposite end of the element body 10' of the above modification. The doc 201222576 surface and its vicinity include a pair of outer conductor films 34, 34 which are formed to be connected to the drawn portion where the inner coil 35 is exposed. In the same manner as the outer conductor films 14 and 14 of the electronic component 20 of the above-described first embodiment, the outer conductor films 34 and 34 include a fired conductor layer and a plating layer formed on the fired conductor layer. See layers, plated with layers. The electronic component 40 of the present modification also has the same functions and effects as those of the electronic component 2 of the above-described first embodiment. Further, the composition of the plurality of particles constituting the soft magnetic alloy body for an electronic component in the present invention preferably contains 2% of chromium and 8% by weight, and 丨矽$7 m〇/. '嶋铁狐5 wt%. When the composition is within this range, the soft magnetic alloy body for electronic parts of the present invention exhibits higher strength and higher volume resistivity. In general, the more Fe content of a soft magnetic alloy towel, the higher the magnetic flux density (1) and the DC superposition characteristic are favorable, but when used as a magnetic element, the rust or the rust falls off at high temperature and high humidity. Waiting to become a problem. Further, as a representative of stainless steel, it is known that adding a complex to a magnetic alloy has an effect on the resistance to the button. However, the powder magnetic core obtained by heat-treating the alloy powder containing the above-mentioned alloy powder in a non-oxidizing environment has an specific resistance of 10 - «Qcm" measured by an insulation resistance meter, although it has a degree of no thirst loss between particles. The value 'but to form an outer conductor film requires a specific resistance of ι 〇 5 ^ or more 'cannot form a metal ore layer on the fired conductor layer of the outer conductor film. Therefore, the present invention is based on an oxidation environment in which a shaped body comprising a raw material particle having the above composition and a binder is heat-treated to form a surface of the particle. Doc 201222576 comprises an oxide layer of a metal oxide layer and bonds the oxide layers of the adjacent particle surfaces to each other, thereby obtaining high strength. The obtained volume resistivity Pv of the soft magnetic alloy body for electronic parts is greatly increased to be 1〇5 Qcm or more, and the plating conductor layer of the outer conductor film formed on the surface of the element body can be formed without plating extension. A metal plating layer of Ni, Sn, or the like is formed. Further, the reason why the composition is limited in the soft magnetic alloy body for electronic parts of the present invention in a preferred embodiment will be described. The chromium content in the composition of a plurality of particles is less than 2 wt ° /. The volume resistivity is low, and it is impossible to form a metal plating layer on the fired conductor layer of the outer conductor film without causing plating extension. Further, in the case where the chromium is more than 8 wt%, the volume resistivity is also low, and it is impossible to form a metal plating layer on the fired conductor layer of the outer conductor film without causing the plating extension. In addition, as described in the above-mentioned Patent Document 1, an oxide-based coating layer in which an oxide coating layer is formed by heat treatment in the atmosphere by using Fe_Si_A powder is not contained in the oxide. Therefore, the volume resistivity is less than 1 〇 5, and it is impossible to form a metal plating layer on the fired conductor layer of the outer conductor film without causing plating extension. In the soft magnetic alloy body for an electronic component, Si in a composition of a plurality of particles has an effect of improving volume resistivity, but if Si is less than 5"%, the effect cannot be obtained, and on the other hand, it is greater than 7 wt. In the case of %, the effect is also insufficient, and the volume resistivity of the soft magnetic alloy body for electronic parts is less than 105 Qcm, so that it is impossible to form a metal ore on the fired conductor layer of the outer conductor film without causing plating extension. In addition, Si also has a change of 154655. Doc -22- 201222576 Good magnetic permeability, but when Si is more than 7 wt%, the saturation magnetic flux density is lowered due to the relative decrease in content, and the magnetic permeability and saturation magnetic permeability are accompanied by deterioration of formability. The pass density is reduced. When aluminum is used as an element which is easily oxidized other than chromium, it is preferably aluminum 2 to 8 wt%, 矽 1. 5~12 wt%, iron 80~96. 5 wt%. If the aluminum content in the composition of the plurality of particles is less than 2 m%, the volume resistivity is low, and the metal plating layer cannot be formed on the fired conductor layer of the outer conductor film without causing the plating extension. In addition, when the aluminum content is more than 8 «, the saturation magnetic flux density is lowered due to a relatively low Fe content. From the viewpoint of rust prevention, it is preferably 2 to 8 wt% of chromium, 5 to 7 wt% of ruthenium, and 88 to 96 of iron. The composition of 5 wt%. Further, it is also possible to use an alloy particle of iron, aluminum, and antimony in an alloy particle of iron-chromium-bismuth (for example, a total of 5 Å of the alloy particles). In the soft magnetic alloy body for an electronic component, if the iron content S in the composition of the plurality of particles is less than 88% by weight, the saturation magnetic flux density is lowered and the magnetic permeability and the saturation magnetic flux density are lowered as the formability is deteriorated. In addition, the iron content is greater than 96. In the case of 5 wt%, the volume resistivity is lowered due to a relative decrease in the chromium content and the niobium content. Further, in the present invention, the average particle diameter of the plurality of particles is more preferably 5 to 3 Å μηη in terms of the average particle diameter d5〇% (arithmetic mean) of the raw material particles. Further, the average particle diameter of the plurality of particles may be approximated to a value obtained by selecting a particle from a composition image obtained by scanning a scanning electron microscope (SEM) at a magnification of 3,000 times. The profile of the profile can be completely confirmed by the particle, using the long axis dimension of the profile of each particle (4) I54655. Doc -23- 201222576 The simple average value of the short axis dimension d2 is D = (4) The total sum of /2 is divided by the number of the above particles. The alloy metal particle group has a particle size distribution and is in the shape of an ellipse and is not - defined as a spherical shape. Further, when the three-dimensional (planar) observation of the three-dimensional alloy metal particles is performed, the apparent size differs depending on the position of the observed cross section. Therefore, the average particle diameter of the present invention is determined by measuring a large number of particles, and it is preferable to measure at least (10) or more of the particles satisfying at least the condition. The specific method is as follows: The diameter of the largest particle section is taken as the long axis, and the point where the length of the long axis is equally divided is found. = The diameter containing this point and having the smallest particle profile as the short axis. The temple is defined as the long axis size and the short axis size. The particle size of the measurement is as follows. The largest orthogonal particle of the particle profile is arranged in order from largest to smallest, and the particle profile is tired. The ratio is based on the image of the scanning electron microscope (SEM). The particles of the cross section of the particle are removed. The particles of the size of y 5 /❶ which are not completely confirmed by the particles, voids, and oxide layer. When the average particle diameter on the right side is within the range, a high saturation magnetic flux density (= Τ or more) and a high magnetic permeability (27 or more) can be obtained, and at a frequency higher than the above, the eddy current can be suppressed in the particles. loss. The meaning of the specific numerical values disclosed in the specification is the upper limit in the description of the numerical range of the numerical values in some cases and / 154655. Doc •24- 201222576 or the lower limit values are included in the range in some cases and are not included in the range in some cases. In addition, in some aspects, numerical values indicate average values, typical values, median values, and the like. [Examples] Hereinafter, the present invention will be specifically described by way of Examples and Comparative Examples, but the present invention is not limited thereto. In order to judge the magnetic characteristics of the soft magnetic alloy using the soft magnetic alloy for electronic parts, the forming pressure is adjusted between 6 and 12 ton/cm2 in a manner of filling the raw material particles at a rate of 8 〇V0% to form an outer diameter of 丨4 mm. a ring having an inner diameter of 8 mm and a thickness of 3 mm. After heat treatment in the atmosphere, the obtained element body will have a diameter of 0. A 3 mm urethane-coated copper wire coil was wound 20 turns to obtain a test sample. The saturation magnetic flux density Bs' was measured using a vibrating sample magnetometer (manufactured by Toei Industrial Co., Ltd.: VSM) using an inductance-capacitance resistance meter (LCR-meter) (manufactured by Agilent Technologies, Inc.: 4285A) 'measuring frequency 1 〇〇 kHz The magnetic permeability μ was measured. The saturation magnetic flux density Bs is 0. 7 Τ or more is judged to be good. It was judged to be good in the case where the magnetic permeability μ was 2 〇 or more. In order to judge the strength of the element using the soft magnetic alloy for electronic parts, the three-point bending fracture stress was measured as follows using the measurement method shown in Fig. 10 . The test piece for measuring the three-point bending fracture stress was obtained by adjusting the forming pressure between 6 to 12 ton/cm 2 in such a manner that the filling ratio of the raw material particles was 80 vol%, and forming it into a length of 50 mm and a width. After a plate-shaped molded body of 10 mm and a thickness of 4 mm, heat treatment is performed in the atmosphere. 154655. Doc -25- 201222576 It is judged that the fracture stress at the point f is 10 kgf/mm2 or more. It is judged that the saturation magnetic flux density Bs, the magnetic permeability μ, and the three-point bending fracture stress are good. In addition, in order to judge the volume resistivity of the element using the soft magnetic alloy for electronic parts, As shown in Fig. 10, the measurement was carried out in accordance with JIS_K69U. The test piece for measuring the volume resistivity was obtained by adjusting the filling ratio of the raw material particles to 80 vol% to 6 to 12 t〇n/cm2. The molding pressure is formed into a disk shape of 100 mm in diameter and 2 mm in thickness and then heat-treated in = gas. The case where the volume resistivity is W0-3 ncm or more is judged to be acceptable, and 1×10·丨Qcm or more. It is judged to be good, and it is judged to be excellent in the case of lxl 〇 5 ftcm or more. β If the volume resistivity is 1×10-丨, the loss due to eddy current at the time of use at a high frequency can be reduced. Further, if it is lxl05 ncm or more, The metal plating layer can be formed by wet plating on the conductor layer. In addition, the quality of the metal plating layer on the fired conductor layer of the outer conductor film on the surface of the soft magnetic alloy body for electronic components can be judged. , as described below In the embodiment, the shape of the soft magnetic alloy body for the electronic component is set to a drum shape. The quality of the formation of the metal layer on the outer conductor film of the obtained electronic component sample is judged by using a magnifying glass to visually judge the appearance. The Ni and Sn plating layers were continuously formed on the fired conductor layer, and the case where the self-fired conductor layer was not plated to the periphery thereof was judged as 〇, and the other case was judged as 154655. Doc -26- 201222576 is broken as X. (Example 1) As a raw material particle for obtaining a soft magnetic alloy body for an electronic component, an average particle diameter (d50°/.) was used as 10 μm, and the composition ratio was chromium: 5 wt%, 矽: 3 wt%. , Iron: 92 wt% of an alloy powder as a water atomized powder (PF-20F manufactured by Epson Atmix Co., Ltd.). The average particle diameter d50% of the above-mentioned raw material particles was measured by using a particle size analyzer (manufactured by Seiko Co., Ltd.: 93 20HHRA). Further, the particles were polished until the cross section of the particle center was exposed, and a cross section obtained by photographing the obtained cross section at 3,000 times using a scanning electron microscope (SEM, SS-4300SE/N manufactured by Hitachi High-Technologies Co., Ltd.) was obtained. The composition image was calculated by energy dispersive X-ray analysis (EDS), and the composition of 1 μπι □ near the center of the particle and the vicinity of the surface was calculated by the ZAF method, and the above composition ratio near the center of the particle and the composition ratio near the surface of the particle were confirmed. Almost equal. Then, the above particles and polyvinyl butyral (manufactured by Sekisui Chemical Co., Ltd.: S-LEC BL: a solution having a solid content concentration of 30% by weight) were mixed by a wet rotary stirring device to obtain a granulated product. Using the obtained granulated powder, the forming pressure was adjusted between 6 and 12 ton/cm 2 in such a manner that the filling ratio of the plurality of particles was 80 vol%, and a square plate having a length of 50 mm, a width of 10 mm, and a thickness of 4 mm was obtained. The molded body, a circular plate-shaped formed body having a diameter of 100 mm and a thickness of 2 mm, an annular molded body having an outer diameter of 14 mm, an inner diameter of 8 mm, and a thickness of 3 mm, and a core portion (width 1. 0 mmx height 0. 36 mmx length 1. 4 mm) with square flanges at both ends (width 1. 6 mmx height 0. 6 mmx thickness 0. 3 mm) drum core shape, 154655. Doc -27- 201222576 and a pair of plate cores (length 2. 0 mmx width 0. 5 mmx thickness 0. 2 mm) 圆 The disk-shaped molded body, the annular molded body, the drum-shaped molded body, and the pair of plate-shaped molded bodies obtained in the above were heat-treated at 70 ° C for 60 minutes in the air. . The disk-shaped element body obtained by heat-treating the above-mentioned disk-shaped molded body was measured for volume resistivity in accordance with JIS-K6911, and the results are shown in Table 1. In addition, the drum-shaped element body obtained by heat-treating the above-mentioned drum-shaped molded body is polished so as to expose a cross section in the thickness direction passing through substantially the center of the core portion, and is scanned using a scanning electron microscope (SEM). The cross section was taken 3 times to obtain a composition image. Then, each pixel in the composition image obtained in the above is classified into three levels of brightness levels, and the long axis size of the cross section of each particle is dl and short among the particles in which the contour of the particle profile of the composition image is completely confirmed. A simple average value of the axial dimension d2 (4) 组成 The composition contrast of the particles larger than the average particle diameter (d5〇%) of the raw material particles is determined as the breadth level 'the portion of the composition image that satisfies the brightness level as a grain, and the other' The composition contrast is judged to be the oxide layer 2 as compared with the above-described central luminance level dark level ί portion. In addition, the straight result of the above-mentioned self-confidence is bright and the result is shown in the pattern diagram; 2^ is judged as the gap 3, and the obtained = child: the circle of the extracted particle profile in the above composition image In the particles, 'each particle ^ simply flattened the mandrel size dl and the short axis size of the heart is early + mean D = (dl + d2) / particles, by UAW thousand thousand average particle size _%) Calculated by energy dispersive X-ray analysis (EDS) by ZAF method 154655. Doc -28- 201222576 The composition of 1 μΓΠ□ near the intersection of the major axis and the minor axis, compares the composition with the composition ratio of the above-mentioned raw material particles, and confirms the composition ratio of the plurality of particles in the above-mentioned element body and the raw material particles The composition ratio is approximately or substantially equal. Then, the composition of the i μιη port centered on the point where the long axis di and the short axis d2 intersect in the inside of the particle 1 in the composition image is obtained by SEM-EDS, and the result is shown in Fig. 3(A). Next, # by SEM_EDS, the oxide layer 2 on the surface of the particle 1 in the composition image is determined, and the thickness of the oxide layer corresponding to the average thickness T = (tl + t2) / 2 is centered on the center point of the thickness of the oxide layer. In the composition of 丄μηι□, the average thickness T=(u+t2)/2 is obtained from the thickness ^ of the thickest portion of the oxide layer 2 and the thickness 12 of the thinnest portion, and the obtained composition is shown in Fig. 3. (B) Medium. According to Fig. 3(a), the intensity of iron inside the particle i is 4200 count, the strength of chromium (: 1 (: the heart is 1〇〇c〇unt, the peak intensity ratio of chromium to iron is R1=ClcrKa/clFeKa According to Fig. 3(b), the strength of the iron at the center of the thickness of the oxide layer 2 is 3〇〇〇count, the strength of the network is C2CrK^18〇〇count, and the chromium is relative to the iron. The peak intensity ratio R2-C2CrKa/C2FeKa* 〇. 6〇, which is larger than the peak intensity ratio of chromium in the above particles relative to iron. Further, in the soft magnetic alloy body for an electronic component of the present invention, the oxide layers 2 and 2 formed on the surfaces of the adjacent particles 1 and 1 may be bonded to each other by the composition shown in Fig. 2 based on the composition image. Confirmed by the pattern diagram. From the above results, it was confirmed that the soft magnetic alloy body for electronic parts of the present embodiment contains chromium 2 to 8 wt%.矽1. 5~7 wt%, iron 88~96. 5 wt% of multiple particles! , i, and an oxide layer formed on the surface of the particle i, and the oxide layer contains at least iron and chromium, using a transmission electron microscope 154655. Doc •29· 201222576 The intensity ratio of chromium to iron peak obtained by energy dispersive ray ray analysis is greater than the peak intensity ratio of chromium to iron in the particles. Further, on a ring-shaped element body obtained by heat-treating the above-mentioned annular molded body, a coil containing a urethane-coated copper wire having a diameter of 〇·3 mm was wound 20 times to obtain a test sample. The saturation magnetic flux density Bs was measured using a vibrating sample magnetometer (manufactured by Toray Industries, Inc., VSM), and the magnetic permeability μ was measured at a measurement frequency of 100 kHz using an LCR meter (manufactured by Agilent Technologies, Inc.: 4285A). The results obtained are shown in Table 1. In addition, the heat-treated temperature of 150 ° C and 20 (TC, 30 (TC, 500, 〇, 700 ° C, 800 ° C) in the atmosphere of the molded article obtained in the above-mentioned square plate shape. The square plate-shaped element obtained by heat-treating at 1000 ° C for 60 minutes and the square-shaped molded body placed at room temperature were measured for three-point bending fracture stress, and the results are shown in Table 1 and Table 2. Further, a fired Ag conductor film paste was applied to the mounting surface of the two flange portions of the above-mentioned drum-shaped body, and the temperature was raised to 7 Torr (rc at atmospheric temperature for about 30 minutes, and kept at 700 ° C for 1 〇. Then, the temperature is lowered for about 30 minutes, thereby performing a firing treatment of the conductor film material to form a fired conductor layer of the outer conductor film. Further, Ni is formed on the surface of the conductor film by electrolytic plating (thickness 2) Μπι), Sn (thickness 7 μπι). The results obtained are shown in Table 1. As a result, the strength of the element was 7. 4 kgf/mm2, as the saturation of the magnetic properties, the magnetic flux density Bs is 1. 51 T, magnetic permeability μ is 45, and volume resistivity is 4. 2Χ105 Dcm, the formation of the metal plating layer is 〇, and good measurement results and judgment results are obtained respectively. Furthermore, the magnetic permeability μ 154655 is also performed before the heat treatment. Doc -30- 201222576 Determination. The results are shown in Table 3. Then, a coil including an insulated coated wire is wound around the core portion of the drum-shaped body, and both end portions of the coil are thermocompression bonded to the outer conductor film, and further, the plate-shaped formed body is heat-treated. The obtained plate-like element body was obtained by using a resin-based adhesive agent on both sides of the flange portion of the above-mentioned drum-shaped element body to obtain a wound-line type wafer inductor. (Example 2) In addition to the composition ratio of the raw material particles: chromium: 3 wt%, 矽: 5 wt%, iron: 92 wt%, and examples! The evaluation sample was produced in the same manner. The results obtained are shown in Tables 1 and 2. As shown in Tables 1 and 2, the saturation magnetic flux density 仏 as the magnetic property is 146 T, the magnetic permeability μ is 43, the strength of the element body is 28 kgf/mm 2 , and the volume resistivity is 2. 0X105 Qcm, the formability of the metal plating layer was 〇, and good measurement results and judgment results were obtained in the same manner as in the example. Further, as a result of analysis by EDS, it was confirmed that the particles were bonded to each other by a metal oxide (oxide layer) formed on the surface of the particles by heat treatment, and the oxide layer contained more iron than the alloy particles. An oxide of an oxidized element (here, a network). (Example 3) An evaluation sample was produced in the same manner as in the Example except that the average particle diameter (d50%) of the raw material particles was 6 μm, and the results obtained are shown in Tables 1 and 2. As shown in Tables 1 and 2, the saturation magnetic flux density as the magnetic property is Τ' magnetic permeability μ is 27 ′. The strength of the element body is 66 kgf/mm 2 and the volume resistivity is 154655. Doc 31 201222576 is 3. 0xl ° 5 ncm, the formation of the metal plating layer is. Good measurement results and judgment results were obtained in the same manner as in Example 1I5. Further, as a result of analysis by (4)_EDS, it was confirmed that the particles (4) were heat-treated and bonded to a metal oxide (oxide layer) formed on the surface of the particles, and the oxide layer contained more iron than the alloy particles. The oxide of the S element (here, the complex). (Example 4) An evaluation sample was prepared in the same manner as in Example 1 except that the average particle diameter (d50%) of the raw material particles was changed to 3 Å. The results obtained are shown in Tables 1 and 2. Table 1 and Table 2 do not, as the magnetic property, the saturation magnetic flux density is 〖π T, the magnetic permeability is 2 〇, and the strength of the element is 7. 6 kgf / mm2, volume resistivity is 7 chest 5 (10), the formation of metal ore layer is. Good measurement results and judgment results were obtained in the same manner as in the examples. Further, as a result of analysis by SEM_EDS, it was confirmed that the particles were bonded to each other by a metal oxide (oxide layer) formed on the surface of the particles by heat treatment, and the oxide layer contained more than the alloy particles. An oxide of S (here, a complex) which is more easily oxidized than iron. (Example 5) The composition ratio of the raw material particles was set to be a complex: 9. 5 wt%, Shi Xi: 3 wt%, line 7.5 wt/o. An evaluation sample was prepared in the same manner as in Example 1, and the obtained measurement results and judgment results are shown in Tables 1 and 2. As shown in Tables 1 and 2, the saturation magnetic flux density Bs as the magnetic property is 1 dd, the magnetic permeability μ is 33, and the strength of the plasto is 7 4 kgf / 2 ′. The volume resistivity is I54655. Doc •32· 201222576 4. 7x10-3 ncm, the forming core of the metal bond layer. It can be seen that in the present embodiment in which the complex is over (four) wt%, the volume resistivity is lowered. In addition, it is confirmed that the particles are bonded to each other by a metal oxide (oxide layer) formed on the surface of the particles by heat treatment, and the oxide layer is more contained than the alloy particles. An oxide of an element (here, a network) that is more susceptible to oxidation by iron. (Example 6) ^ An evaluation sample was prepared in the same manner as in Example} except that the composition ratio of the raw material particles was set to chromium: 5 wt%, 矽: i wt〇 / 〇, iron: 94 wt%. The measurement results and judgment results obtained are shown in Tables and Table 2. As shown in Table 1 and Table 2, it is understood that the saturation magnetic flux density Bs as the magnetic property is [π T magnetic permeability μ is 26, the strength of the element body is 18 kgf/mm 2 , and the volume resistivity is 8. 3X10·3 Qcm, the formability of the metal plating layer is X. Further, as a result of analysis by SEM-EDS, it was confirmed that the particles were bonded to each other by a metal oxide (oxide layer) formed on the surface of the particles by heat treatment, and the oxide layer contained more than the alloy particles. An oxide of an element of iron which is easily oxidized (here, chromium). (Example 7) An inductor component was obtained in the same manner as in Example i except that the treatment temperature in the atmosphere was set to 1 °C. The measurement and judgment results are shown in Table 1. As shown in Tables 1 and 2, the saturation magnetic flux density 仏 as the magnetic property is 15 〇 T, the magnetic permeability μ is 50, the strength of the element body is 2 〇 kgf/mm 2 , and the volume resistivity is 2. 0><102卩(^11, the formability of the metal plating layer is ><. In the present embodiment, the heat treatment temperature is increased, although the 3-point bending fracture stress is increased, but the volumetric electric power is 154655.doc •33·201222576. The resistivity is lower than that of the embodiment. In addition, the analysis of the fruit by sem_eds can confirm that the particles are mutually By forming a dimetal oxide (oxide layer) on the surface of the particle by heat treatment, the oxide layer contains more elements which are more easily oxidized than iron (here, the oxidation of (6) (Example) 8) An evaluation sample was prepared in the same manner as in Example 1 except that the composition ratio of the raw material particles was set to 矽: 9.5, aluminum: 5 $ wt% 'iron: 85 wt%, and the obtained measurement results and The judgment results are shown in the illusion and Table 2. Table 1 and Table 2 do not, the saturation magnetic flux density as the magnetic property is m Τ 'the magnetic permeability μ is 32, the strength of the element body is 14 kgf / _2, and the volume resistivity is 8. When 1〇3(10) is added, the formability of the metal bond layer is "it is known that the volume resistivity is low, and it is impossible to form a metal plating layer on the fired conductor layer of the outer conductor film. In addition, analysis by SEM-EDS is performed. As a result, it was confirmed that the particles were subjected to heat treatment with each other. The metal oxide (oxide layer) formed on the surface of the particle is combined, and the oxide layer contains more oxides than the alloy particles which are easily oxidized by an element (here, aluminum). (Comparative Example 1) The composition ratio of the raw material particles was set to 1 : 〇 / /, 夕 夕 : 6.5 wt %, and iron: 92.5 wt %, and the evaluation test # was prepared in the same manner as in Example 1, and the obtained measurement results and judgments were obtained. The results are shown in Tables i and 2. In Tables 1 and 2, the saturation magnetic flux density as the magnetic property is 〖%, the magnetic permeability μ is 〖7, the strength of the element body is 4 2 , and the volume resistivity is 4.9. X101 fiCm, the formation of the metal money layer is X. In addition, the results of the analysis by SEM EDS show that the surface of the particle is not treated by the comparison of I54655.doc * 34 - 201222576 The formation of the metal oxide layer) is not the same as that of the human body (the oxidation contains more oxides that are more easily oxidized than iron (here, the complex), so the volume resistivity is lower. ', ( Reference Example 1) A price was produced in the same manner as in Example (1) except that the heat treatment was not carried out. For the sample, the obtained enthalpy results and judgment results are shown in h and Table 2°, and Table 2, as the magnetic property, the saturation magnetic flux density Bs is 1.50, and the rate is 1 Γ rate ^ 35, the body The strength is 〇.54 kgf/mm2, and the volume resistance is 1G ΩεΠ1 °. In addition, the test (4) for the formation of the metal bond layer is omitted in this reference example. By analyzing the result, the reference is known. In the example, an oxide layer containing a metal oxide is not formed on the surface of the particle. Therefore, the volume resistivity is slightly lower than that of the embodiment (Reference Example 2) except that the treatment temperature of the atmosphere is set to 3 Gn, and the embodiment (I) In the same manner, an evaluation sample was prepared, and the obtained measurement result and judgment result 2 were shown in Table 1 and Table 2. As shown in Table 1 and Table 2, the saturation magnetic flux density as the magnetic property is 1.5 〇τ, the magnetic permeability ^ is ^, and the strength of the element body is 〇μ kgf/mm2' volume resistivity is i 4χ1〇5 ^. Further, in the present reference example, the preparation and evaluation of the sample regarding the formability of the metal bond layer were omitted. As a result of analysis by SEM-EDS, it was found that in the present reference example, since the heat treatment temperature was lower than 40 〇c ', an oxide layer containing a metal oxide was not sufficiently formed on the surface of the particles. Therefore, the volume resistivity is slightly lower than that of the embodiment. (Embodiment 9) 154655.doc 35·201222576 Next, an embodiment of a laminated type will be described. Using the same alloy particles as in Example 1, a coil type electronic component having a coil inside the element body of 20 layers and having a shape of 3.2 mm x 1.6 mm x 8 mm was prepared. First, 85 wt% of alloy metal particles and 13 wt% of butyl carbitol (solvent) were used using a slit coater. /. A mixture of polyvinyl butyral (adhesive) 2 wt / 〇 was processed into a sheet having a thickness of 4 〇 μηι, and then Ag particles were 85 wt 0 / 〇, butyl carbitol (solvent) 13 wt. /. A conductive paste of polyvinyl butyral (adhesive) 2 wt〇/〇 is applied to the sheet to form a conductive pattern. Then, a sheet in which a conductive pattern was formed was laminated, and a laminate was obtained at a press pressure of 2 ton/cm 2 . The laminate was heat-treated under the conditions of 800 ° C and 2 hr to obtain an element body. A paste containing Ag is formed on the surface on which the lead portion of the coil in which the wire is formed, and the paste is coated on the mounting surface, and heat-treated at 7 ° C for 1 minute to obtain a coil type in which a metal plating layer is formed. Electronic parts. The saturation magnetic flux density Bs as the magnetic property was K41T, and the magnetic permeability μ was 15. Further, the magnetic permeability μ before the heat treatment was 13. The formation of a metal plating layer is a crime. In addition, the analysis was carried out by SEM-EDS | 'It was confirmed that the particles were bonded to each other by a metal oxide (oxide layer) formed on the surface of the particles by heat treatment, and the oxide layer contained more than the alloy particles. An oxide of an element (here chromium) that is more susceptible to oxidation by iron. Further, it was confirmed that in the particles of Examples 1 to 4, the thickness of the bonded portion was thicker than that of the surface of the alloy particles. In the particles of Examples 5 and 6, the bonding portion 154655.doc • 36·201222576 is thinner than the deuterated layer on the surface of the alloy particles. It was confirmed that the thickness of the oxide layer of the particles of Example 8 was 50 nm or more. [Table 1] . S and into [Wt0/〇] Particle size dSO [μηι] Heat treatment temperature [°C] Bs [T] μ 3-point bending fracture stress [kgf/mm2] Volume resistivity [Ωαη] Metal plating layer Forming Cr Si A1 Fe Example 1 5 3 - 92 10 700 1.51 45 7.4 4.2χ105 实施 Example 2 3 5 - 92 10 700 1.46 43 2.8 2.〇χ105 实施 Example 3 5 3 - 92 6 700 1.45 27 6.6 3_〇χ105 ο Example 4 5 3 - 92 3 1 700 1.38 20 7.6 7.〇χ105 ο Example 5 9.5 3 - 87.5 10 700 1.36 33 7.4 4.7χ1〇·3 X Example 6 5 1 - 94 10 700 1.58 26 18 8.3 χ10·3 X Example 7 5 3 - 92 10 1000 1.50 50 20 2.〇χ102 X Example 8 - 9.5 5.5 85 10 700 0.77 32 1.4 8·〇χ103 X Comparative Example 1 1 6.5 _ 92.5 10 700 1.36 17 4.2 4.9x10' X Reference Example 1 5 3 - 92 10 - 1.50 35 0.54 1·4χ105 _ Reference Example 2 5 3 - 92 10 300 1.50 35 0.83 1.4χ105 - [Table 2] Heat treatment temperature and 3 points of praise Fracture stress [lcgf/mm2] heat treatment temperature rc) Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 8 Comparative Example 1 25 0.54 0.48 0.51 0.52 0.48 0.53 0.25 0.55 150 1.1 1.2 1.1 1 .3 1.0 1.3 0.89 1.2 200 0.45 0.31 0.42 0.55 0.48 0.72 0.19 0.58 300 0.83 0.72 0.90 1.01 0.92 0.92 0.23 0.82 500 3.4 1.2 2.0 3.7 3.6 5.7 0.26 2.4 600 4.5 1.7 3.5 5.1 4.9 8.0 0.43 3.9 700 7.4 2.8 6.6 7.6 7.4 18 1.4 4.2 800 12 4.5 10 16 17 24 5.7 6.5 1000 20 7.3 15 27 28 33 7.8 8.2 * Heat treatment temperature of Example 1 1000X: Corresponding Example 7 154655.doc -37· 201222576 [Table 3] Heat treatment temperature and μ heat treatment temperature ( 0〇Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 8 Comparative Example 1 25 35 32 23 19 28 23 24 30 700 45 43.0 27 20 33 26 32 17 Δμ 29 36 17 7 18 13 33 -43 △μ=(μ when the heat treatment temperature is 7〇〇°C, μ when the heat treatment temperature is 25°C)/μ热处理 when the heat treatment temperature is 25°C [Industrial Applicability] The soft magnetic alloy body for an electronic component of the invention and the electronic component using the same are suitable as a miniaturized electronic component that can be surface-mounted on a circuit board. In particular, when it is used in the case of a power inductor in which a large current flows, it is preferable in terms of miniaturization of parts. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing a first embodiment of an element body using a soft magnetic alloy for electronic parts according to the present invention. Fig. 2 is an enlarged schematic view showing a cross section of an element body using a soft magnetic alloy for an electronic component according to the first embodiment. 3(A) and 3(B) are diagrams showing the results of analyzing the element body of the soft magnetic alloy for electronic parts of the first embodiment by energy dispersive X-ray analysis using a scanning electron microscope. Fig. 4 is a view showing the results of analyzing the oxide layer of the element body of the soft magnetic alloy for electronic parts of the first embodiment, which is analyzed by the X-ray diffraction analysis apparatus. Fig. 5 is a graph showing the results of linear analysis of 154655.doc -38 - 201222576 of the soft magnetic alloy for electronic parts according to the first embodiment by energy dispersive X-ray analysis using a scanning electron microscope. Fig. 0 is a side view showing a perspective portion of the first embodiment of the coil type electronic component of the present invention. Fig. 7 is a longitudinal sectional view showing the internal structure of a coil type electronic component according to the first embodiment. Fig. 8 is a perspective view showing an internal structure of an example of a modification of the embodiment of the soft magnetic alloy for an electronic component according to the present invention. Fig. 9 is a perspective view showing an internal structure of an example of a modification of the embodiment of the electronic component of the present invention. Fig. 1 is an explanatory view showing a method of measuring a sample of a 3-point bending fracture stress according to an embodiment of the present invention. Fig. 11 is an explanatory view showing a method of measuring a sample having a volume resistivity according to an embodiment of the present invention. [Description of main component symbols] 1 Particle 2 Oxide layer 3 Void 10, 10, Soft magnetic alloy for electronic parts 11 Drum core 1 la Core lib Flange 12 Plate core 14, 34 External conductor film 14a fired conductor film layer 154655.doc •39- 201222576 14b Ni plating layer 14c ore Sn layer 15 coil 15a winding portion 15b end portion (joining portion) 20 electronic parts (winding type wafer inductor) 31 laminated body wafer 34 external Conductor film 35 Internal coil 40 Electronic parts (Laminated chip inductor) dl Long axis dimension d2 Short axis dimension tl Thickest part thickness t2 Thickest part thickness 154655.doc -40-

Claims (1)

201222576 七、申請專利範圍: 1. -種線圈型電子零件,其特徵在於:其係於素體之内部 或表面具有線圈者,且 素體由含有鐵、石夕及較鐵容易氧化之元素的軟磁性合 金粒子群所構成;於各軟磁性合金粒子之表面生成有該 粒子氧化而形成之氧化層;該氧化層與該合金粒子相比 含有較多的較鐵容易氧化之元辛. 凡京’粒子彼此經由該氧化 層而結合。 中將軟磁體粒子彼此 涉及結合之軟磁體粒 2.如請求項1之線圈型電子零件,其 結合之部分之氧化層的厚度厚於不 子表面之氧化層。 ’其中將軟磁體粒子彼此 於不涉及結合之軟磁體粒 3.如請求項1之線圈型電子零件 結合之部分之氧化層的厚度薄 子表面之氧化層。 ,其中軟磁體粒子中之 上之厚度之氧化層的粒 4.如請求項1或2之線圈型電子零件 至少一部分係包含具有5〇奈米以 子0 其中將上述粒子彼此結 其中上述較鐵容易氧化 其中上述較鐵容易氧化 5·如請求項1之線圈型電子零件 合之上述氧化層為同—相。 6.如請求項1之線圈型電子零件 之元素為鉻。 如請求項1之線圈型電子零件 之元素為鋁。 8.如請求項6之線圈型電子 千’其中上述軟磁性合金之 154655.doc 201222576 組成為鉻2〜8 wt%、石夕1.5〜7 wt%、鐵88〜96.5 wt%。 9_如請求項7之線圈型電子零件,其中上述軟磁性合金之 組成為鋁2〜8 wt°/〇、石夕1.5〜12 wt%、鐵80〜96.5 wt%。 10. 如請求項丨之線圈型電子零件,其中軟磁體粒子之算術 平均粒徑為30微米以下。 11. 如請求項丨之線圈型電子零件,其中上述氧化層自上述 軟磁體粒子側觀看朝向外側依序包含: 上述鐵成分之含量降低且上述容易氧化之元素之含量 增加的第一氧化層,及 上述鐵成分之含量降低且上述容易氧化之元素之含量 降低的第二氧化層。 12. 如請求項11之線圈型電子零件,其中自上述軟磁體粒子 側觀看朝向外側,於上述第一氧化層中,上述矽之含量 具有反曲點。 13. :請求項i之線圈型電子零件,其中氧化層係藉 掃也式電子顯微鏡之能量色散χ射線分析並以zaf法計 算出的容易氧化之元素相對於鐵之波峰強度比大於上述 粒子中之容易氧化之元素相對於鐵之波峰強度比者。 14. 如請求項1之線圈型雷早 ,、 电千零件,其中上述線圈其端部與 形成於上述素體表面之導體膜電性連接。 K一種線圈型電子零件,其特徵在於:其係具有線圈者,且 素體由軟磁性合金粒子群構成;於各軟磁性合金粒子 ::面生成使該粒子氧化而形成之氧化層;該氧化層與 該5金粒子相比含有較多的較鐵容易氧化之金屬;粒子 154655.doc 201222576 彼此經由該氧化層而結合; 於該素體之内部形成有線圈導體。 16. 17. 18. 19. 20. 如凊求項15之線圈型電子零件,其中線圈導體為導體圖 案’且係與素體同時炮燒之導體。 如請求項15或16之線圈型電子零件,纟中該氧化層中之 較鐵容易氧化之金屬為鉻。 如請求項15或16之線圈型電子零件,其中該氧化層中之 較鐵谷易氧化之金屬為铭。 一種線圈型電子零件之製造方法,該線圈型電子零件係 於素體中•又置有線圈者,該製造方法包括以下步驟: 將黏合劑與軟磁性合金粒子之混合物加壓而獲得成形 體; 於3有氡之核境中將上述成形體熱處理,於上述軟磁 性合金粒子之表面形成氧化層,使上述軟磁性合金粒子 彼此經由氧化層結合而獲得素體;及 於上述素體中設置線圈及外部導出用電極。 一種線圈型電子零件之製造方法,該線圈型電子零件係 於素體中设置有線圈者,該製造方法包括以下步驟: 將黏合劑與軟磁性合金粒子之混合物加工成片狀; 於忒片材上形成並積層線圈用導電圖案而獲得成形 體; 於含有氧之環境中將i述成形體熱處S,於上述軟磁 It 〇金粒子之表面形成氧化層,使上述軟磁性合金粒子 彼此、由氧化層結合而獲得内部具有線圈之素體;及 154655.doc 201222576 於上述素體中設置外部導出用電極。 21.如請求項19或20之線圈型電子零件之製造方法,其 述氧環境為大氣環境。 154655.doc201222576 VII. Patent application scope: 1. - A coil type electronic component, characterized in that it is attached to the inside or the surface of the element body, and the element body is composed of elements containing iron, stone stalk and iron which are easily oxidized. a soft magnetic alloy particle group is formed; an oxide layer formed by oxidation of the particles is formed on the surface of each of the soft magnetic alloy particles; and the oxide layer contains more elements which are more easily oxidized than iron than the alloy particles. 'The particles are bonded to each other via the oxide layer. The soft magnetic particles of the soft magnetic particles are combined with each other. 2. The coil-type electronic component of claim 1, wherein the portion of the oxide layer is thicker than the oxide layer on the surface of the non-sub-surface. An oxide layer in which the soft magnetic particles are bonded to each other without involving soft magnetic particles 3. The portion of the oxide layer of the oxide layer of the portion of the coil-type electronic component of claim 1 is bonded. a particle of an oxide layer having a thickness above the soft magnetic particle. 4. The coil type electronic component of claim 1 or 2, at least a part of which comprises 5 nanometers to a sub-zero, wherein the particles are bonded to each other, wherein the iron is It is easy to oxidize, wherein the above-mentioned iron is easily oxidized. 5. The coil-type electronic component of claim 1 is a homo-phase. 6. The element of the coil type electronic component of claim 1 is chromium. The element of the coil type electronic component of claim 1 is aluminum. 8. The coil type electron of claim 6 wherein 154655.doc 201222576 of the above soft magnetic alloy is composed of chromium 2 to 8 wt%, Shixi 1.5 to 7 wt%, and iron 88 to 96.5 wt%. 9) The coil type electronic component according to claim 7, wherein the composition of the soft magnetic alloy is 2 to 8 wt/min of aluminum, 1.5 to 12 wt% of Shixia, and 80 to 96.5 wt% of iron. 10. The coil-type electronic component of the claim ,, wherein the soft magnetic particles have an arithmetic mean particle size of 30 μm or less. 11. The coil-type electronic component according to claim 1, wherein the oxide layer is sequentially included from the side of the soft magnetic particle side toward the outer side: the first oxide layer having a reduced content of the iron component and an increased content of the easily oxidizable element, And a second oxide layer having a reduced content of the iron component and a reduced content of the element which is easily oxidized. 12. The coil type electronic component of claim 11, wherein the content of the ruthenium has an inflection point in the first oxide layer as viewed from the soft magnetic particle side. 13. The coil-type electronic component of claim i, wherein the oxide layer is analyzed by energy dispersive ray ray analysis by a scanning electron microscope and the ratio of the easily oxidized element to the iron peak intensity calculated by the zaf method is larger than the above particle The ratio of the easily oxidized element to the peak intensity of iron. 14. The coil type of the claim 1 of the present invention, wherein the end portion of the coil is electrically connected to a conductor film formed on a surface of the element body. K is a coil-type electronic component characterized in that it has a coil and the element body is composed of a group of soft magnetic alloy particles; and an oxide layer formed by oxidizing the particles on each surface of each soft magnetic alloy particle; The layer contains a larger amount of metal which is more easily oxidized than iron than the 5 gold particles; the particles 154655.doc 201222576 are bonded to each other via the oxide layer; a coil conductor is formed inside the element body. 16. 17. 18. 19. 20. The coil-type electronic component of claim 15, wherein the coil conductor is a conductor pattern and is a conductor that is simultaneously fired with the element body. In the coil type electronic component of claim 15 or 16, the metal in the oxide layer which is more easily oxidized than iron is chromium. The coil type electronic component of claim 15 or 16, wherein the oxide layer is more susceptible to oxidation of the metal. A method for manufacturing a coil type electronic component, wherein the coil type electronic component is in a body and further provided with a coil, the manufacturing method comprising the steps of: pressurizing a mixture of the binder and the soft magnetic alloy particles to obtain a formed body; The molded body is heat-treated in a nuclear environment of 3, an oxide layer is formed on the surface of the soft magnetic alloy particles, and the soft magnetic alloy particles are bonded to each other via an oxide layer to obtain an element body; and a coil is provided in the element body. And external lead electrodes. A method for manufacturing a coil type electronic component, wherein the coil type electronic component is provided with a coil in a body, the manufacturing method comprising the steps of: processing a mixture of a binder and a soft magnetic alloy particle into a sheet; Forming and laminating a conductive pattern for a coil to obtain a molded body; forming an oxide layer on the surface of the soft magnetic It sheet metal in an atmosphere containing oxygen, and forming the soft magnetic alloy particles from each other The oxide layer is combined to obtain an element body having a coil inside; and 154655.doc 201222576 An external lead electrode is provided in the above-mentioned element body. 21. The method of manufacturing a coil type electronic component according to claim 19 or 20, wherein the oxygen atmosphere is an atmospheric environment. 154655.doc
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CN102893346B (en) 2017-11-10
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