TW201221606A - Adhesion film for connecting circuit and usage thereof, circuit connection structure and manufacturing method thereof, and connecting method of circuit member - Google Patents

Abstract

The present invention provides an adhesion film for connecting circuits. The adhesion film for connecting circuits includes: a conductive adhesive layer including an adhesive composition and conductive particles; and an insulative adhesive layer including an adhesive composition without conductive particles. The adhesive composition contained in the conductive adhesive layer includes (a) a film formation material of glass transition temperature at 40 DEG C -70 DEG C, (b) an Epoxy Resin, and (c) a latent curing agent.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive film for circuit connection, a use thereof, a circuit connection structure, a method of manufacturing the same, and a method of connecting circuit members. [Prior Art] Conventionally, in order to connect a semiconductor element to a substrate, in particular, a glass substrate for a flat panel display (FPD) such as a liquid crystal, a thermosetting adhesive film (film) which is cured by heating is used. β is a thermosetting adhesive film. An adhesive film containing an epoxy resin, which is a thermosetting resin, is widely used. Since the epoxy resin is cured by heating, it becomes a polymer having high mechanical strength. The film is then firmly bonded to the liquid crystal display to obtain a highly reliable electrical device. In recent years, an adhesive film containing acrylic acid which can be cured at a lower temperature than epoxy resin has been gradually used. However, in the case where the glass substrate and the semiconductor element are previously connected by using an adhesive film, when the adhesive film is heated, since the semiconductor element is sometimes heated by heat conduction and then thermally expanded, the semiconductor element is stretched. Therefore, when the whole is cooled after the completion of the heating, the stretched semiconductor element shrinks, and the glass substrate constituting the FPD may be deformed by warpage or the like depending on the shrinkage. If the glass substrate is deformed, the display image of the display located in the deformed portion may be disordered. Various methods have been known so far in order to suppress deformation such as temperament. For example, it has been proposed to have a film interposed between a heating and pressing tool (t〇〇1) 201221606 it, a method of connecting between the parts (Japanese Patent Laid-Open No. 2006-229124 or a heating patent after the heating and pressing steps). JP-A-2004-200230). The material which can be used for the stress-relieving film is known in the art of the adhesive film (Japanese Patent Laid-Open No. Hei-277573, Japanese Patent No. 3477367). Although the glass base and the reverse shape are suppressed by using a material which can alleviate stress, there is a problem that the connection reliability is lowered. In addition, the film formability at the time of forming the adhesive film is lowered, and it is difficult to stably obtain the receiver film. Further, in particular, as the thickness of the glass and the semiconductor element is reduced, it is easy to produce a bell curve (deformation of the glass substrate) remarkably. In view of the above, it is an object of the present invention to provide a circuit connection structure for use in the following circuit connection, a circuit connection structure using the same, and a method of manufacturing the same, When the succeeding film is connected to a semiconductor element of a conventional f-base glass substrate, it is also reliable and can be deformed, and is excellent. The inventors of the present invention have conducted intensive studies to solve the above problems, and found that the internal stress of the film for connecting the film after the fashion (after curing) is too high, so that the circuit member is deformed; In the circuit connection, the portion where the modulus of elasticity is too low is generated in the adhesive film, so that the reliability is lowered. It is also known that, in particular, in the case where the elastic modulus is locally too low, the opposing electrodes are difficult to make the conduction connection reliable, and the inclination is lowered. Therefore, based on the above findings, the inventors have further studied. Found. (4) Cheng Linxiang of the degree of health is connected to the circuit connection and thus completes ^f. The high connection reliability can also suppress the deformation of the substrate, that is, the present invention provides an electrical material for the adhesive film, and the connection (4) includes the conductive reed and the crucible containing the ageing substance and the guide. The composition of the agent does not contain the insulation of the conductive particles, and the conductivity of the adhesive composition contained in the subsequent step includes U. The glass transition temperature is thief ~ 7 (r of the rc, (b resin and (C) In the latent film curing device, the first circuit electrode and the second circuit electrode are opposed to each other, and the first circuit member and the second circuit member are electrically connected to each other. In the case of 0.3 mm or less, the circuit base = 20% of the first circuit electrode, and the second circuit member has the thickness of 〇37 or less (4). The second circuit is formed on the main surface of the circuit board as described above. In the adhesive film for circuit connection, since the (a) film-forming material having a predetermined glass temperature (hereinafter referred to as "Tg") is used in the adhesive composition in the conductive adhesive layer, even if the film is cured After that, it can also be in the cured product. The internal stress is controlled to a low internal stress, and the entire cured product can have a uniform and sufficient elastic modulus. Thereby, a circuit including a circuit substrate having a thickness of 〇201221606 jooypif mm can be used even when the above-described circuit connecting adhesive film is used. When the members are connected to each other, the circuit member is also deformed, and a good adhesion due to /, an adhesive composition comprising two Tg U) film-forming materials, and (b) an epoxy resin, =, not only The film property is excellent, and excellent heat-generating property can be achieved. Further, since the adhesive film for circuit connection includes two layers of Μ == hai, the conductive electrode of the opposite electrode (four) can obtain good conductive adhesive insulating particles. The layer and/or the insulating adhesive layer may further contain (d) this can maintain more excellent connection reliability for the adhesive film for circuit connection of the present invention. ^ ^ ^ Connection structure, the circuit connection structure The body includes an i-th circuit member, and an i-th circuit electrode is formed on a main surface of a circuit board having a thickness of 〇3 or less; and a second circuit member is a main surface of the second circuit board of 2 ίί°. a second circuit electrode is formed and the second circuit electrode is disposed to face the first circuit electrode, the second circuit electrode is electrically connected to the second circuit electrode, and the connection portion is connected to the first circuit member and the second circuit. Between the members, the connection portion is a cured product of the adhesive film for circuit connection of the present invention. If the circuit connection structure is as described above, since the connection portion includes the cured product of the circuit connection secret film of the present invention, The circuit-connected structure _ internal stress (4) is low (four) stress, so that the deformation of the circuit member can be suppressed by 201221606, and (4) and the present invention provides a method for manufacturing a circuit-connected structure. The manufacturing method includes the steps of: obtaining the product 2 by the above if = connection and then between the pair of circuit members, and the upper and the second pair of circuit members including the first circuit member and the second circuit structure 4 The member is formed with a first circuit electrode on a second circuit having a thickness of G3 or less, and a second circuit member is formed on a main surface of the second circuit substrate on the second circuit member, and the circuit is laminated. The connecting portion is formed by heating and pressurizing r, and the connecting circuit electrode and the second circuit are connected to each other so that the first members arranged in the opposite direction are connected to each other. In the manufacturing method, the following circuit can be manufactured;::=r suppresses the deformation of the circuit member. In the state in which the circuit configuration is arranged, the first circuit member is opposed to the first circuit member and the first circuit member. 2 components and arrangement of circuit components:; === circuit =: = The following main circuit substrate is formed on the main surface with = degree of electricity:

S 8 201221606 ^δ/Dypif The second circuit member has the second circuit electrode formed on the main surface having a thickness of 〇3 mm or less. In the method of connecting the circuit member as described above, the circuit board is connected to the circuit using the cured product of the bonding film for circuit connection of the present month, and the internal stress in the cured product can be controlled to a low internal stress. Ensure conductivity between opposing electrodes. Therefore, the second charging circuit can be connected to the structure, the circuit is connected to the structure, and has a good function of the circuit component. The second invention provides the use of the film for the circuit connection. The film includes: a bonding layer containing 芸 Λ Λ ϋ layer and ί having an adhesive composition and containing no conductivity:::: an adhesive composition contained in the adhesive layer ja) glass transition temperature is 攸~ thief film forming material, = tree moon 曰 and (e) sneak recording curing agent, ± for the film connection for the circuit connection 2 using the C circuit electrode and the second circuit electrode in the opposite state, the first circuit member and The second circuit member is electrically connected, wherein the upper C first circuit member has the second circuit electrode formed on a main surface having a thickness of Q 3 mm, and the second circuit substrate having the 丄^ degree a3 mm« The surface of the brother 2 circuit electrode. ～ By _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Good connection reliability. 201221606. Or absolutely.=2 ==: Conductivity Next _ Maintain better connection reliability. (4) Insulating particles. Therefore, it is possible to provide the following bonding film for circuit connection and the method of connecting the method and the circuit member, and when the circuit connection is connected with a thinner circuit board == ❹ 连接 可靠性 了 抑制 抑制 抑制 抑制 抑制 抑制 抑制 :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: The above effects can also be achieved when the members are connected to each other. The above and other objects, features, and advantages of the present invention will become more apparent from the <RTIgt; [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. &lt;Continuous film for circuit connection&gt; First, the circuit connection for the present embodiment will be described with reference to Fig. 1 . Fig. 1 is a schematic cross-sectional view showing a bonding film for a circuit according to an embodiment of the present invention. The circuit connection is followed by a conductive adhesive layer 3b containing the adhesive composition 4b and the conductive particles 5 = 201221606 35/^ypif and formed on the conductive adhesive sheet 3b, and the insulation is 4 + insulating. Agent layer 3a. (3) The conductive adhesive layer 3b contains: (a) Tgg4 (rc~ film-forming material (hereinafter, there is a Japanese rut or "r, r, ancient Second, the time is called (a) component "), (b) the epoxy tree (, and then "(b) component)) and (after the latent curing agent is called "(c) component") The agent composition 4b is a disk-conducting particle 5. The film-forming material whose Tg as the component (a) is a thief-thief is a polymer (poymer*), and this polymer has a function of curing the remaining curable resin composition. The binder is contained in the curable resin composition, whereby when the curable tree test article is formed into a bribe, an adhesive film which is not easily cracked, is not easily broken, and is not easily adhered and is easy to use can be obtained. The film-forming material as described above may, for example, be selected from the group consisting of a phenoxy resin, a polyethylene methyl ester, a polystyrene resin, a polyethylene butadiene resin, a polyester resin, a polyamide resin, and a diphenyl resin. And at least one polymer of the group of polyurethane resins. Among these resins, phenoxy resin, polyamine eucalyptus and The vinyl butyric acid resin is preferred, and the compatibility between the resin and the component (b) is excellent, and excellent adhesion, heat resistance, and mechanical strength of the film-attached film for bonding after curing can be obtained. A phenoxy resin is obtained by reacting with epihalohydrin until it reaches a high molecular weight or by subjecting a bifunctional epoxy resin to a difunctional phenol to form an addition polymerization reaction. In the presence of a catalyst such as an alkali metal hydroxide, in the non-reverse 201221606 i»/5ypif f-solubilized, 卩4G °C ~ 12Gt: temperature to make l-mole bifunctional benzene with G.985 Moer ~ L () 15 moles of alcohol-reacting reaction, whereby the above phenoxy resin can be obtained. Hedan is preferably a ratio of bifunctional epoxy resin to bifunctional phenol The addition reaction of the phenoxy tree is carried out by using an epoxy group / phenol hydroxy hydroxy oxime ^ 丨 丨 丨 。 。 。 。 。 。 。 。 。 。 。 的 的 的 的 的 的 的 的 的 的 的 的Also, preferably, present, alkali metallization An organic solvent such as a guanamine type, an ether type, a ketone type, a lactone type, or an alcohol type having a boiling point of 12 (rc or more) under the conditions of a catalyst such as a compound, an organophosphorus compound, or a cyclic amine compound. In the case where the solid content of the raw material is 50 parts by mass or less, it is heated to 5 Torr. (: 〜2 〇〇. (: The above-mentioned addition polymerization reaction is carried out. As a bifunctional epoxy resin for obtaining a phenoxy resin, Examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, biphenyl diglycidyl ether, and methyl substituted biphenyl diene. Glycidyl ether. As bifunctional benzenes, there are two substances having a benzene-promising thiol group, such as benzophenone, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, bisphenol Bisphenols such as bisphenol di-, di-terminated biphenyls and methyl-substituted dihydroxy biphenyls substituted by mercapto groups. The phenoxy resin may also be modified by a radical polymerizable functional group or other reactive compound. The above various phenoxy resins may be used singly or two or more kinds of the above various phenoxy resins may be used in combination. The polyurethane resin is an elastomer having a urethane bond in a molecular chain, and is usually an active hydrogen group of a saturated polyester resin in an approximate equivalent amount,

S 12 201221606 38759pif occurs with diisocyanate groups of diisocyanate compounds (toluene diisocyanate, diisocyanate diphenyl decane, hexamethylene diisocyanate, phenyldiamidylene diisocyanate, and diisocyanate cyclohexyl decane, etc.) The linear polymer known in the reaction, the above saturated polyester resin is a polybasic acid (terephthalic acid, isophthalic acid, phthalic acid, spearic acid, adipic acid, sebacic acid, and sebacic acid) Etc., with glycol (ethylene glycol, 1,4-butanediol, 1,5-pentanol 1,6-hexanediol, diethylene glycol, triethylene glycol, polyethylene glycol, And a propylene glycol or the like) obtained by a condensation reaction and having a terminal hydroxyl group. The above-mentioned polyurethane resin is easily dissolved in an organic solvent such as an ester system (acetic acid acetate, acetic acid, etc.), a ketone system (f-ethyl group, cyclohexyl group, and acetone), and an aromatic system (anthracene, diterpene, etc.). Solvents of benzene, benzene, etc. and chlorine (three gas ethylene, two gas methane, etc.). A polyvinyl butyral resin is an elastomer having an ethylene acetal unit in a molecular chain, and a pass f is a polymerization of acetic acid, followed by a secret treatment, and then it is combined with a mixture (methic acid, acetic acid, secret, and butyl). A linear polymer obtained by a reaction such as an acid. For the polyethyl methacrylate prepared by Benwei County, the polymerization record is preferably ~25(8), and the degree of sclerotherapy is preferably 65 mol% or more. When the right polymerization degree is less than 7 GG ', the cohesive force of the polyethylene-containing styrene resin is insufficient, resulting in a decrease in film formability. When the degree of polymerization exceeds MOO, the lining property at the time of crimping the resin is not sufficient, and the guide is not interposed between the electrodes of the bonded body, so that it is difficult to obtain sufficient connection reliability. Further, if the degree of cryptogenicity is less than 65 m 〇 1%, the proportion of the alkyl group or the ethyl ketone group is increased, so that it is difficult to obtain sufficient connection reliability. 13 201221606 _45t~7 (^, ^__T04 (rC~7 (rC, ^ ts film formation) is preferably 5 (rc~赃. If there is such an in-film in-material), the error will be elastically deformed. The internal stress generated in the circuit connection after curing is absorbed, so that the connection of the circuit member can be obtained, and good connection reliability can be obtained. For the adhesive composition 4b of the film-forming material component, the amount of 2 〇 mass parts mt iQ f Parts ~ 5G f parts, more preferably the deformation of the substrate (the amount of distortion), thus providing electrical connection! · Better circuit connection to turn the film 1 〇. The larger the π macromolecular f, the easier The filming property of the lining, and the β e* A is a viscous viscosity which affects the fluidity of the adhesive composition 4b. The weight average molecular weight (Mw) of the film-forming material is preferably measured to be ~150000', especially preferably 10000~8 When the value is 5 or more, the film forming property tends to be easily obtained. On the other hand, if the value is 15 Å or less, it is easy to obtain a good phase with other components. The tendency of solubility. The above-mentioned "weight average molecular weight" means according to Table 1 below. Conditions and by gel permeation chromatography (Gel Permeati〇n

Chromatography, GPC), the value obtained by measurement using a standard polystyrene calibration curve.

S 201221606 38759pif [Table 1] Device Detector---Dongcao Co., Ltd. Manufactured GPC-8020 _ #盼份右附Α ϊΊ TM A TM One-column-----_ 不·曰队w·月ί* Mingong Takes Hitachi Chemical Industry Co., Ltd. to manufacture Gelpack ---- GL-A-160-S + GL-A1 ^〇-SfT?nnnPihr Sample concentration solvent - one _ izu mg/j mi ---- four mouth Go 咕&quot; Inject amount-------- ^ A.^ Pressure&quot; Cleansing sauce--------30 kg 卩cm2 ~ &quot;It ------ 1.00 ml/min

The epoxy resin as the component (b) may be used alone or in combination of two or more kinds from at least one type of epichlorohydrin and at least one type selected from the group consisting of a double A, a double F and a double AD. Double-type epoxy resin, self-evaporating alcohol and benzene secrets, and a secret or two secrets of 甲_oxygen resin, naphthalene epoxy resin having a skeleton containing Cai ring, and shrinkage Various epoxy compounds having two or more glycidyl groups in one molecule, such as glycerolamine, glycidol, biphenyl, and alicyclic. From the viewpoint of preventing electromigration, it is preferred to use an epoxy resin such as an impurity ion (i〇n) (Na+, cm or a highly pure product having a hydrolyzability to 300 ppm or less. A grade with a different molecular weight is widely obtained, and the adhesion or reactivity can be arbitrarily set. Therefore, the double-aged epoxy resin is more than the _ ring of the pre-fat, and the epoxy resin is epoxy resin. In particular, the double-preferred F-type epoxy resin has a low viscosity, and can be easily and widely used to set the fluidity of the circuit of the contact film H) by using it in combination with benzene. Moreover, the double-type F-type epoxy resin also has the advantage that it is easy to make the adhesive film for the circuit connection 1 〇 to have good adhesion. The blending amount of the epoxy resin is preferably 5 parts by mass to 50 parts by mass, more preferably 2 parts by mass to 40 parts by mass, based on 100 parts by mass of the total mass of the adhesive composition 牝. When the amount of the epoxy resin is less than 5 parts by mass, when the circuit members are pressure-bonded to each other, the fluidity of the circuit-connecting adhesive film 10 tends to decrease, and the amount of the epoxy resin is more than 5 〇. In the case of the mass portion, there is a tendency that the film for connecting the film 10 is deformed when the long-term material is to be held. Examples of the latent curing agent which is the component (C) include an imidazole-based, an anthraquinone-based, an amine-imide, and a dicyandiamide. The above-mentioned latent curing agent may be used alone or two or more kinds of the above-mentioned latent properties may be used in combination. Hardener. And ^ ' can also be used to group latent EHb, suppression, etc., in addition to L, in order to extend the usable time, it is preferable to use a polyamine vinegar, f S 曰 system of southern molecular substances, etc. The latent curing agent is coated to achieve microencapsulation. With respect to 100 parts by weight of the epoxy resin, t, the amount of the latent curing agent is more than 1 G mass parts to fine parts by mass. Thereby, in the curing reaction, a sufficient reaction can be obtained: if the amount of the latent curing agent is less than 10 parts by mass, the tensile response rate cannot be obtained, and it is difficult to obtain good bonding strength and the connection is Is going. When the amount of the latent curing agent is more than 200 parts by mass, the tendency to lower the pressure, for example, the fluidity of the bonding film 10 for circuit connection increases, and the pot life of the film for connecting film 10 (pot 201221606 58〇ypif life) is shortened. . ^ Read the shout 4b towel scattered with the guide Weizi 5. Since the circuit connection = H) contains the conductive particles 5, the positional or unevenness of the circuit electrodes is absorbed by the deformation of the conductive particles 5, and the contacts are more stable and electrically connected. Further, since the circuit connecting connector film 10 contains the conductive particles 5, the conductive particles 5 may be broken by the oxide layer or the passive layer on the surface of the circuit electrode, and the connection is more stable. Electric power is as described above for the conductive particles 5, and Au,

Cu, metal particles such as solder, carbon particles, and the like. From the viewpoint of obtaining a sufficient pot life, the outermost layer of the conductive particles 5 is not a transition metal such as Cu or Cu, and is preferably Au, Ag, and platinum metal. In addition, the conductive particles 5 may be conductive particles obtained by coating a surface of a transition metal such as Ni with a noble metal such as Au, or a conductive layer such as the above may be formed by coating or the like. Non-conductive glass, ceramic, plastic, etc., and the outermost layer is made of a noble metal conductive particle. It is preferable to use particles or hot-melt metal particles in which a conductive layer is formed of a plastic by coating or the like as the conductive particles 5. Since the particles are deformed by heating and pressurization, the contact area which comes into contact with the circuit electrode at the time of connection can be increased, or the thickness of the circuit terminal of the circuit member can be absorbed unevenly, and the circuit can be connected. Increased reliability. The thickness of the cladding layer of the metal-containing layer provided on the outermost layer of the conductive particles 5 is preferably 100 A or more. Thereby, the resistance between the connected circuits 17 201221606. / jypif can be sufficiently reduced. However, when a coating layer of a charge-receiving type is provided on a transition metal such as Ni, the thickness of the coating layer is preferably 3 Å or more. The reason is that since the noble metal-based cladding layer which is generated when the conductive particles 5 are mixed and dispersed is dispersed, the Ni-specific transition metal is exposed to the adhesive film, and therefore, the transition metal is released due to the redox action. 'Free radicals, so that the storage stability of the film-attached film 1 下降 is lowered. On the other hand, the upper limit of the thickness of the coating layer of the noble metal is not particularly limited, but is preferably 丨μπι or less from the viewpoint of production cost. It is preferable that the average particle diameter of the conductive particles 5 is larger than the minimum of the adjacent electrodes of the circuit member connected by the film 10 and the case where the circuit electrodes are uneven at 8 degrees. The average purity of the above-mentioned Q-particles 5 is greater than the height of the unevenness. The particle size of the particles is preferably 1 μηι 10 to 10, more preferably 2 divisions to 5 μιη. If it is flat, the U' domain does not tend to correspond to the circuit, the unevenness of the poles is uneven, and the lead of the circuit electrode is liable to fall, and if there is a relationship between the adjacent shaft electrodes, "Average granulation" means that it is measured in the following manner. That is to say, 'using a scanning electron microscope (SEM (Scanning) (Scanning (10), Manufactured by the manufacturer's name, 最 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹 妹The receiver is directed to 5 arbitrarily selected conductive particles to

S 18 201221606 38759pif = Grain Row Measurement 'The average value of the_th order particle diameter is set as the average particle diameter. Set again. Similarly, the average particle size of the catalogue of the Kawasaki (4) (4) is measured. For the composition of the adhesive having a total mass of just a part by mass, the blending amount of the pillar 5 is preferably set to 质量j by mass to 3 parts by mass. More Panyu is ο. 1 part by mass to 20 parts by mass. Thereby, it is possible to prevent a short circuit or the like of the adjacent circuit caused by the excessive conductive particles 5. According to the use of the 'adhesive composition 4b, for example, it may further contain a softening anti-aging agent, a flame retardant, a pigment, a thixotropic agent, a silanec〇Uplingagent, etc. . (Insulating Adhesive Layer) The adhesive composition 4a contained in the adhesive layer can suppress the deformation of the circuit member as long as it can be f-shaped and can be connected to the circuit member. It may be the same as the composition 4b contained in the conductive adhesive layer %, or may be different from the axial region. It is preferable that the fluidity of the insulating adhesive layer 3a is greater than the fluidity of the conductivity of $==3b. 'The type and amount of the above-mentioned components and the conductive adhesive layer 9 and/or the last (4) % may contain more film), and edge particles (hereinafter, sometimes referred to as "(4) component"). Thereby, the internal stress in the adhesive layer after the formation is further alleviated. Further, the insulating layer 3a preferably contains (d) insulating particles. &amp; As the (d) insulating particles as described above, for example, inorganic particles such as Shixia, emulsified, etc.; or poly 11 oxy rubber, methyl methacrylate - 201221606 diced dilute-styrene (Methylmethacrylate Butadiene Styrene, MBS), organic particles such as acrylic rubber, polymethyl methacrylate, and polybutadiene rubber. Further, examples of the (d) insulating particles include acrylic resin, polyester, polyurethane, polyvinyl butyral, polystyrene, polystyrene, and nitrile rubber (NBR). ), Styrene Butadiene Rubber (SBR), polyfluorene-modified resin, and the like, and particles containing a copolymer containing these substances as a component. The insulating particles are preferably organic fine particles having a molecular weight of 10,000 or more or organic fine particles having a three-dimensional crosslinked structure. Such insulating particles have high dispersibility for a curable composition. In addition, the term "having a three-dimensional crosslinked structure" herein means that the polymer chain has a three-dimensional network structure, and for example, a crosslinking agent having two or more functional groups bonded to a reaction point of the polymer is used. The polymer having a plurality of reaction sites is treated to obtain insulating particles having the configuration as described above. The organic fine particles having a molecular weight of 10,000 or more and the organic fine particles 4 having a three-dimensional crosslinked structure are preferably low in solubility in a solvent. The above effects can be obtained more remarkably with respect to the upper 3 insulating particles having low solubility in a solvent. Further, according to the above-mentioned effect, the organic fine particles having a molecular weight of 丨(8) million or more are obtained. 3 The three-dimensional crosslinked structure organic fine particles preferably contain a (meth) propylene g 2 oxy-copolymer and a poly ( Insulating particles of a methyl group of a malo acid copolymer or a complex of (6) =. Further, for example, an insulating recording such as an amine particle disclosed in Japanese Patent Publication No. 200M50573 can be used as () + and

S 20 201221606 38759pif In addition, a composition having a core shell type and a composition of a core layer of the core layer is not composed of a __recorder (4) component. Specific examples of the core-shell (IV) insulating organic particles include particles obtained by grafting an acid resin with a polysulfide-propylene I rubber as a core, and baking the material core to perform an acrylic resin. The particles obtained by grafting, etc., can also be used as disclosed in International Patent Publication No. 2_, (6) Nuclear (4) oxygen microparticles disclosed in Book No. JF, as disclosed in the pamphlet of International Patent Publication No. 2^0=020005 (A) Acrylic acid based acetobutadiene-styrene copolymer or complex, (meth)acrylic acid alkyl ester oxy-copolymer or complex and polyoxy-(meth)acrylic acid copolymer or Insulating organic particles such as a complex compound, a core-shell structured polymer particle as disclosed in Japanese Laid-Open Patent Publication No. 2 GG2-256G37, and a rubber particle having a core-shell structure as disclosed in Japanese Laid-Open Patent Publication No. 2004-18803 Wait. The above-described core-shell type insulating recording sheets may be used singly, or two or more kinds of the core-shell type insulating particles may be used in combination. Further, the average particle diameter of the (4) insulating particles is preferably about 〇1 μιη to 2 μΓη. In the case where the conductive material _3b contains (4) insulating particles, the total amount of the insulating material I/green particles and the conductive particles 5 is preferably (10) with respect to the adhesive composition 4b having a total mass of 100 parts by mass. The mass fraction is better than 4 60 M. If the insulating particles and the conductive particles are combined. When the amount of the ten-week blend is more than 80 parts by mass, the film formability and the adhesion f to the electrode tend to decrease. Further, the insulating adhesive layer 3a contains (4) the intimate particles of the insulating particles with respect to the total mass of the adhesive mass "object 4a". (d) The amount of the insulating particles is preferably 6 parts by mass. 21 201221606 μ Zhedan horse (four) parts are τ. When the amount of the insulating particles is more than the inner portion, the film forming property and the adhesion of the conductive particles 5 to the electrode tend to decrease. The thickness of the conductive adhesive layer 3b is preferably 3 μηι to ΐ2 (four), more preferably μηι 1〇 μΐΏ. Further, the thickness of the insulating adhesive layer % is preferably from 2 to 21 divisions, more preferably from 14 μη to 16 μm. Since each layer has the above-described reliability, it is preferable that the thickness of the circuit-attaching film 10 for workability, conductive particle trapping property, and connection is preferably 10 (four) to 40, and the total thickness is 1 () μηι, and the domain tends to be as follows. If it is not == to be buried, then the force will drop, „over 40 μιη, there is a tendency that on the day of the day, the rouge will overflow, thereby contaminating the surrounding parts. The adhesive composition comprising the adhesive composition 4b and the composition of the insulating adhesive layer is decomposed or dispersed in an organic solvent, and the temperature is below the activation temperature of the chemical. In this case, the conductive adhesive b and the insulating adhesive layer 3b and the insulating adhesive layer 3a are formed, and the constituent components of the insulating adhesive layer 3a are activated, and then a solvent is added. To increase the m into a knife and heat it to ensure that the flow agent is formed into a (four) liquid, and the coating liquid is applied to the stripping

S 22 201221606 JS/^ypif The solvent is removed from the inert substrate at a temperature below the activation temperature of the curing agent. The solvent to be used at this time is preferably a mixed solvent of an aromatic hydrocarbon solvent and an oxygen-containing solvent, from the viewpoint of improving the solubility of the adhesive composition 4a and the adhesive composition 4b. Further, examples of the releasable substrate include a polymer having a heat and solvent resistance of polyethylene terephthalate (PET), poly(tetra), polyethylene, and a polymer. membrane. It is especially good to have a surface treated with a release film PET film. The thickness of the release substrate is preferably from 2 μm to 75 tons. When the thickness is less than 20, the tendency to perform the temporary pressure bonding is difficult. When the thickness of the right side exceeds 75 Å, the film is formed between the circuit-connecting adhesive film 10 and the peelable substrate. The tendency to slip off. As a method of manufacturing the bonding film for circuit connection 10, for example, a bonding film for circuit connection in a method state in which the conductive adhesive layer 4b formed of the above-mentioned layer and the insulating adhesive layer are advanced, and the layers of the layers (4) are used can be used. Used as a flip-chip glass bump, /ss 'C°G), etc. During the mounting process, etc., a relatively hard base such as glass is bonded to the semiconductor element. The voxel circuit connection bonding film is heated and pressurized in a state in which the film is interposed between the glass substrate and the right member of the semiconductor, and the two electrodes 7 are electrically connected. Here, when a circuit member having a thickness of the substrate of 0.3 Å or less is used, the tortoise is particularly 23 23 201221606 yylf = continuous time. The present embodiment can be used effectively, that is, the following film can be used for circuit connection. Use, the following: package j. Conductive bond composition containing an adhesive composition and conductive particles and insulating layer containing no conductive particles. Next, the adhesive composition contained in the transfer layer contains (4) a glass transfer transfer^ The degree is 4〇c~7 (the film formation of rc = curing agent, and the above-mentioned circuit connection use is the first step of forming the first circuit electrode on the surface of the second ZV Iff surface in the opposite direction. In the circuit J, the second circuit member on which the second circuit board is formed on the second circuit board of the third circuit or the second circuit member is electrically connected. When the thickness of the substrate is further than the circuit component of g·2 or less The problem of warpage is more remarkable. It is possible to use: the thickness of the circuit substrate using the film: ::= There are many:: The circuit electrode pair of the circuit member which is disposed oppositely in the circuit member having = i = cell r Set in the ground so that the circuit is connected with the film The heating and pressurization are performed in a state in which the knives are placed, and the circuit electrodes of the circuit electrodes are electrically connected to each other, and the electric components are arranged in such a manner that the circuit components are disposed in a relatively resistant manner. plus

S 24 201221606t Pressure, the circuit electrodes disposed opposite to each other are electrically connected to each other by one of contact and direct contact via conductive particles or two kinds of contacts. &lt;Circuit Connection Structure&gt; FIG. 2 is a schematic cross-sectional view showing a laminated body 200 in which the circuit-connecting bonding film 10 of the present embodiment is inserted between the substrate 1 and the semiconductor element 2, which are a pair of circuit members, and FIG. The schematic cross-sectional view of the circuit-connecting structure 100 of the present embodiment obtained by heating and pressurizing the laminated body 2A shown in Fig. 2 is shown. The circuit connection structure 100 shown in FIG. 3 includes a substrate 1 (an i-th circuit member) in which a wiring pattern lb (first circuit electrode) is formed on a main surface of a glass substrate u (first circuit substrate), A semiconductor element 2 (second circuit member) in which a bump electrode 2b (second circuit electrode) is formed on a main surface of a chip 2a (second circuit board) of an integrated circuit (1C) And a cured product 6a and a cured product 6b (connecting portion) of the bonding film 1〇 between the substrate 丨 and the semiconductor element 2. In the circuit connection structure 1A, the wiring patterning and the bump electrodes 2b are electrically connected in a state of being disposed opposite to each other. Here, the wiring pattern 1b is preferably formed of a transparent conductive material. Typically, § 'Indium Tin Oxide (ITO) is used as the transparent conductive material. Further, the bump electrode 2b is formed of a conductive material (preferably at least one selected from the group consisting of gold, silver, tin, a metal which is turned over, and ITO) which has a function as an electrode. In the circuit connection structure 100, the opposing bump electrodes 2b and the 25 201221606 ^5/^ypif line patterns 1b are electrically connected to each other via the conductive particles 5. That is, the conductive particles 5 are in direct contact with the bump electrodes 2b and the wiring pattern lb, whereby the bump electrodes 2b and the wiring patterns 1b are electrically connected. In the circuit connection structure 100, since the substrate 1 and the semiconductor element 2 are bonded by the cured product 6a and the cured product 6b of the bonding film 10 for circuit connection, even when the thickness of the circuit member is thin (〇3 mm In the case of the following), the click of the substrate 1 can be sufficiently suppressed, and excellent connection reliability can be obtained. The circuit connection structure 1 as described above can be manufactured through the following steps. In other words, the circuit connecting structure 100 can be manufactured by the following manufacturing method, and the manufacturing method includes the steps of: forming a laminated body between the pair of circuit members by the bonding film for circuit connection according to the embodiment; The δ pair of circuit members includes a substrate 1 (first circuit member) in which a wiring pattern (i-th circuit electrode) is formed on a main surface of a glass substrate 1a (first circuit board) having a thickness of 〇3 mm or less, and a semiconductor element 2 (second circuit member) having a bump electrode 2b (second circuit electrode) formed on a main surface of a 1C wafer 2a (second circuit board) having a thickness of 〇3 mm or less; and heating and adding of the laminated body Pressing to cure the circuit connection with the adhesive film' thereby forming a connection portion between the pair of circuit members, and the wiring pattern lb (the second circuit electrode) and the bumps disposed oppositely The pair of circuit members are connected to each other in such a manner that the electrodes 2b (second circuit electrodes) are electrically connected. &lt;Connection method of circuit member&gt; The circuit connection structure 1 is obtained by the following method, that is,

26 S 201221606 jo /jypli The substrate 丨 in which the wiring pattern lb is formed on the main surface of the glass substrate 1a and the main surface of the 1C wafer 2a are formed in a state in which the wiring pattern 1b and the bump electrode 2b are opposed to each other. The semiconductor element 2 having the bump electrode 2b and the bonding film 10 for interposing between the substrate 1 and the semiconductor element 2 are heated and pressurized, and the wiring pattern 1b and the bump electrode 2b are electrically connected. In the above method, the laminate 2 is formed in such a manner that the bonding and bonding film 1 形成 formed on the peelable substrate is attached to the substrate 1 and heated and pressurized. The second film 10 for circuit connection is temporarily pressure-bonded to peel off the peelable substrate, and then the semiconductor substrate 2 is placed on the circuit electrode, and the iron is heated and pressurized. For the circuit connection, the bonding film 1 and the device 2 are sequentially laminated, dried, etc. - the adhesion of the composition 4b according to the circuit composition is followed by the *10 + adhesive composition, etc. Upper layer · Carrying out force: The condition of pressurization makes the circuit connect to the secret film i. After curing, the full strength of the bond is obtained. According to the use of the circuit of the present embodiment, even when the thickness of the circuit member is thin (== the circuit member can be suppressed, the good connection is reliably obtained [example] The invention will be described. However, the following examples are more specific. The present invention is not limited to these examples. 27 201221606 (1) Preparation of an adhesive film for circuit connection, as described in 7 'Prepare each material for forming a conductive adhesive layer and an insulating connection layer. Each film-forming material of about 1 μg was weighed, and the Tg of the film-forming material was measured by a DSC apparatus (product name: Q1〇〇〇) manufactured by TA Instruments, Inc. in accordance with the regulations of JIS K7121-1987. ) Component: Tg is 4 (TC~70t: film-forming material + "Fx_316" (manufactured by Tohto Kasei, product name): Styrene resin (Tg: 66. (:) "UR-4125" ( Toyobo Co., Ltd., product name): Polyesteramine phthalate (Tg: 68〇C) "UR-1350" (manufactured by Toyobo, product name): Polyester phthalate (Tg: 46Ϊ) "3000-K (Electric chemical industry manufacturing 'product name'): polyvinyl butyral (Tg : 64. (:) (a), Component: Film-forming material "UR_8300" other than the component (a) (manufactured by Toyobo Co., Ltd., product name: Polyesteramine phthalate (Tg: 23%)."ZX-1356- 2" (Dongdu Chemical Manufacturing's product name): phenoxy resin (Tg: 75.) "PKHC" (manufactured by InChem, product name): phenoxy resin (Tg: 89〇C) "5000-D" ( Electrochemical industry manufacturing, product name): polyvinyl butyral (Tg: 110 ° C)

28 S 201221606 JO / "YP-50" (manufactured by Tohto Kasei Co., Ltd., product name): phenoxy resin (Tg: 97〇C) (b) Ingredients: Epoxy resin "850-S" (manufactured by DIC, product name) : Bisphenol A type epoxy resin (c): latent curing agent "Novacure" (made by Asahi Kasei Chemicals, product name) (d) : Insulating particle "X-52-7030" (Shin-Etsu Shinwa (Manufactured by Shin-Etsu Slicone), product name): Polyoxane complex (a complex of polyoxyxene rubber and polyoxyl resin) (conductive particles) "Micropearl AU" (made by Sekisui Chemical Co., Ltd.) Additives "SH6040" (manufactured by Toray Dow Corning, product name). Broken coupling agent (Example 1) &lt;Electrically conductive adhesive layer&gt; 10 parts by mass of phenoxy resin "FX-316" 30 parts by mass of bisphenol A type epoxy resin "850-S", 40 parts by mass of latent curing agent "Novacure", and 1 part by mass of decane coupling agent "Sh6040" dissolved in 1 part by mass of hydrazine After benzene, 19 parts by mass of conductive particles "MicropearlAU" was added to prepare a conductive adhesive. Forming a coating liquid. Applying the above coating liquid to one side (surface coated with the coating liquid) has been applied by using a coating device (manufactured by Kane Seiki Co., Ltd., product name: Fine 29 201221606) The release film (medium-treatment) was a PET film of 50 divisions, and was dried by hot air at 7 (rc for 1 minute) to form a conductive adhesive layer having a thickness of ίο μιη on the tetra-τ film. Insulating adhesive layer> 52 parts by mass of phenoxy resin "FX-316", 26 parts by mass of chelate, fluorene type epoxy resin r85〇_s", and 18 parts by mass of latent curing agent ovacure" And j parts by mass of the decane coupling agent "sh6〇4〇" dissolved = 4 = toluene as a solvent, and then added in an amount of 3 parts by mass of Juxi Xi = particle X-52-7030" to prepare an insulating adhesive layer. In the same manner as above, a coating device (manufactured by Kangjing Seiki Co., Ltd.) was used.

2: The precision coating machine was applied to apply the above coating liquid to one side, and the thickness of the mold release treatment was 5 〇 的, which was 7 〇. . Customize the hot air drying for 10 minutes, thereby applying an insulating adhesive layer to the PE. The correction is 15 qing &lt;film for connecting the film&gt; rim: the obtained conductive adhesive layer and the absolute-or)it heating: the surface is laminated by a roll laminator.仃Laminating' is used for circuit connection with a thickness of 25 μm (Example 2 to Example 6 and Comparative Example 1 to Comparative Example 5) to prepare a ratio (parts by mass) to add each component, and to adjust the composition to be similarly In addition to the cloth liquid, in addition to Example 1, the film was bonded to make an adhesive film for circuit connection.

S 30 201221606 [Table 2] Ingredients - ! Agent layer comparison example - Insulation followed by agent layer 1 2 3 _4~ 3 _ 6 1 2 3 4 5 (a) FX-316 10 30 50' • 52 UR-4125 UR -13 50 - - 30 30 —1 --------- (a)' 3000-K UR-8300 - - • • - 30 in ---- ZX-1356-2 1 - - - - - • 30 • — PKHC _ - - - - 30 . 5000-D - _ - - • 30 • 1 YP-50 - - - - - • Lu 30 - '- (b) 850-SM) 20 10 20 20 20 20 ?.n 20 20 20 26 (c) Novacure 40 30 20 30 30 30 30 30 30 30 30 ΪΓ (d) X-52-7030 - - - . 3 - Micropearl AU 19 19 19 19 19 - 19 1 &lt;) 10 19 19 19 ----- SH6040 1 1 1 1 1 1 1 1 1 1 1 Bu 1 - (2) Fabrication of circuit-connected structure &lt;Preparation of substrate and semiconductor device&gt; Prepared on glass substrate (Corning ( C〇rning) #1737, 38 mm x 28 mm '0.3 mm thick) The surface of the substrate was formed with an IT (Indiuin Tin Oxide) wiring pattern (pattern width 50 μm, space between electrodes 5 μηι). A 1C wafer (having a shape of 17 mm x 17 mm, a thickness of 0.3 mm, a bump size of 50 μm &gt;&lt; 50 μm, a space between bumps of 50 μηι ‘bump height of 15 μm) was prepared as a semiconductor element. &lt;Connection of Substrate and Semiconductor Element&gt; The 1C wafer and the glass substrate were connected as follows using the bonding film for circuit connection manufactured in the above examples and comparative examples. Furthermore, a stage 31 including a ceramic heater, 201221606 ^ ^^ wir (150 mm x 150 mm), and a crimping member are used for connection. Heating by 〃(3_x2〇mm) ^ First, connect the circuit with 5·χ2. == 层 on the layer is to be separated, at 8 〇t, m〇 in 2 (four) heating and secret, in order to make the conductive layer _ on the glass substrate. Next, the PET film on the electrical-insulating adhesive layer is peeled off, and the IC is replaced by the glass plate. After the circuit is connected, the measured voltage is the highest: the strip d is given the bump electrode area conversion pressure of 7〇. MPa edge:: 10 seconds of heating and pressurization on the top of the wafer, the main film is connected to the broken plate and the film is not connected. (3) Evaluation (film formation) The film is used to form the core of the film and The film can be formed into a film, which means that the prepared watch is not easily broken and is not easily adhered. Evaluation result of film formation property A: Formable film B: Film formation (warpage) was not formed. Fig. 4 is a mode 2 showing a method of evaluating warpage of a glass substrate: the circuit connection structure 1 shown in Fig. 4 is The cured electricity is bonded by the substrate i, the half 2, and the substrate 1 and the semiconductor element 2

S 32 201221606. The pif road connecting adhesive film 10 is constructed {indicating that the height of the lower surface of the two sheets! is set. • The base of the straight::: is separated from the center of the U.Smm. Table = 2 is evaluated for the index. &quot; The value of L is less than 15 and the situation is set to "A", and the case of "L" is set to "b", which is performed in two stages. The evaluation results of the warpage are shown in Table 2.

The glass substrate and 1C day gate 1 in the process of manufacturing the circuit connection structure were changed from G.3 coffee to G.5 _, and the above examples and comparative examples were used in the order of the above-mentioned phase. The circuit is connected by a contact film to form a bonded body. After the tortuosity of the obtained joined body was evaluated, the warpage of the joined body was less than 15 μm. (Connection reliability) "The resistance value between the circuit of the glass substrate and the electrode of the semiconductor element was measured using the fabricated circuit connection structure. A multimeter was used (device name: MLR2:1, ETAC) Manufactured), 1 hour heat and humidity test at a temperature of 85 C and a humidity of 85% RH

The measurement was performed after (Thermal Humidity Test 'THT). Based on the resistance values after the thT test and based on the following criteria, the connection reliability was evaluated in two stages of A or b. The measurement results of the respective circuit connection structures are shown in Table 3. A : Less than 10 Ω B : 10 Ω or more 33 201221606 [Table 3]

The adhesive film for circuit connection of the present invention exhibits excellent characteristics such as film formability, (4), and connection reliability even when used for connecting thin film members. The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the invention, and any skilled person can make a few changes and simplifications without departing from the spirit of the invention. Therefore, the scope of protection of the present invention is defined as the scale defined by the application for full-time employment. [Brief Description of the Drawings] Fig. 1 is a schematic cross-sectional view showing a bonding film for circuit connection according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing a laminated body in which a circuit connection of the present embodiment is inserted between a pair of circuit members. Fig. 3 is a schematic cross-sectional view showing the circuit connection structure of the embodiment;

S 34 201221606 FIG. 4 is a schematic cross-sectional view showing a method of evaluating warpage of a glass substrate of 5 ° [Description of main components] 1 : substrate 1 a · glass substrate lb : wiring pattern 2 : semiconductor element 2a : 1C wafer 2b : bump Electrode 3a: Insulating adhesive layer 3b: Conductive adhesive layer 4a, 4b: Adhesive composition 5: Conductive particles 6a, 6b: Cured material 10: Circuit connection connecting film 100: Circuit connection structure 200: Laminated body L: the maximum value of height 35

Claims (1)

201221606; Patent application scope: 1. An adhesive film for circuit connection, comprising: and a conductive I1 raw adhesive layer containing an adhesive composition and conductive particles; a primer layer with a daughter edge, containing an adhesive composition and not The adhesive composition contained in the conductive granular adhesive layer contains a _ transfer temperature of a resin and (C) a latent curing agent, and a V circuit is used for the first circuit electrode. And the second == j second circuit member is formed on the main surface of the second == path substrate, and the second circuit electric &amp; material 2 circuit substrate is formed on the main surface having a thickness of 〇3 == Please connect the circuit as described in the first item of the patent range to the belly center (4). Edit = Γ + 3. The circuit connection structure includes: the first circuit member, the first center is formed on the main surface of the thick sound board: The first circuit-based second circuit member has a second circuit electrode formed on the main surface of the thick plate=2 circuit base-electrode is electrically connected to the ith circuit electrode of S 36 201221606; and the connection portion between Between the above] circuit components and The second circuit member is a cured product of the film of the first aspect of the invention or the film for connection of the circuit. '*· Step: 4. A method of manufacturing a circuit-connecting structure, comprising the following steps: the circuit connecting path member includes a *th circuit member and the second body; the second body: the first first circuit a second circuit electrode is formed on the main surface of the substrate; and the circuit is fixedly heated and pressurized to connect the circuit connecting circuit members, so that the pair is connected to the pair of the second circuit and the second circuit. a method of connecting the pair of circuit components and the circuit member, wherein the first circuit electrode members are arranged next to each other, and the circuit member is disposed in a state in which the second circuit electrodes are opposed to each other. And the second circuit and the second circuit described above; The circuit electrode and the above heating and addition, the electric electrode is electrically connected, and the main degree of the 37 201221606 plate is . The first circuit base of 3 mm or less has a circuit electrode having a thickness of i, and the second circuit component of the second circuit component is described above. The main surface of the 4 2 circuit board is formed with the upper 6.- including the use of the film for the connection of the film, the adhesive film and the conductive adhesive layer, the adhesive composition and the conductive particles; The adhesive layer containing the adhesive composition and containing no conductive particles. The adhesive composition contained in the electrical adhesive layer contains $« transition temperature for listening ~7Q. (10) Thin material tree 曰 and (c) latent curing agent, 虱 (4) filming for circuit connection is used in the state where the first circuit is electrically r == r, the first circuit member and ί 1 The first circuit component is formed on the main surface of the first circuit board having a thickness equal to or less than the thickness of the first circuit board, and the second circuit member is formed on the wire of the second circuit board having a thickness of 〇3 or less. There are ± second circuit electrodes. 7. If the above-mentioned conductive film is applied to the adhesive film according to item 6 of the above-mentioned item 6, the above-mentioned conductivity is further _ and/or the insulating layer further contains (d) insulating particles. Connected to S 38