TW201217553A - Coated article and method for making the same - Google Patents
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201217553 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種鍍膜件及該鍍膜件的製備方法 [0001] [先前技術] [0002] 有害細菌的傳播和感染嚴重咸脅著人類的健康,尤其近 年來S A R S病毒、禽流感等的傳播和感染,使抗菌材料1 曰常生活中的應用迅速發展起來。將抗菌金屬(^、如、 Ag等)塗覆於基材上形成抗菌鍍膜件在目前市場上有著廣 泛的應用。該抗菌鍍膜件的殺菌機理為:鍍膜件在使用 過程中,抗菌金屬塗層會緩慢釋放出金屬離子如cu2+、 Zn2+,當微量的具有殺g性的金屬離子與細料微生物 接觸時,該金屬離子依靠庫輪力與帶有負電荷的微生物 牢固吸附,金屬離子穿透細胞壁與細菌體内蛋白質上的 巯基、氨級生反應,使蛋自質料破壞,使細胞喪失 分裂增殖能力而死亡,從而達到殺菌的目的。 [0003] 然該類金屬抗菌塗層厚度通常比較薄,且. 容易磨損,從而降低了金屬抗菌塗層的抗二3較低 【發明内容】 [0004] 有鑒於此’有必要提供_種抗菌效果較為持久的錢膜件 〇 [0005] [0006] 另外’還有必要提供—種上述㈣件的製備方法。 -種鍵膜件’其包括基材、形成於騎表面的打底層 該打底層為Π層’該鍍料成於打底層表2 複_2層和複邮士合金層,該複數T103和複數 099136033 表單編號Α0101 第4頁/共12頁 201217553201217553 VI. Description of the Invention: [Technical Field] The present invention relates to a coated member and a method for preparing the coated member [0001] [Prior Art] [0002] The spread and infection of harmful bacteria is severely threatened by human health. In particular, in recent years, the spread and infection of SARS virus, avian flu, etc., have rapidly developed the application of antibacterial materials in the daily life. The application of antibacterial metals (^, such as Ag, etc.) on a substrate to form an antibacterial coated member has a wide range of applications on the market. The sterilization mechanism of the antibacterial coating member is: during the use of the coating member, the antibacterial metal coating will slowly release metal ions such as cu2+, Zn2+, and when a trace amount of metal ions having gypsum contact with the fine microorganisms, the metal The ions are strongly adsorbed by the wheel force and the negatively charged microorganisms. The metal ions penetrate the cell wall and react with the sulfhydryl groups and ammonia-grade proteins on the proteins in the bacteria, so that the eggs are destroyed by the materials, and the cells lose their ability to divide and proliferate and die. To achieve the purpose of sterilization. [0003] However, the thickness of the metal antibacterial coating is generally relatively thin, and is easy to wear, thereby reducing the resistance of the metal antibacterial coating to a lower level [invention] [0004] In view of this, it is necessary to provide an antibacterial A more durable film of money [0005] [0006] In addition, it is necessary to provide a method for preparing the above (four) pieces. - a key film member comprising a substrate, a primer layer formed on the surface of the rider, the primer layer being a layer of ruthenium. The plating material is formed on the bottom layer of the surface layer 2 and the layer of the epoch alloy, the plurality of T103 and plural 099136033 Form number Α0101 Page 4 / Total 12 pages 201217553
Cu-Zn合金層交替排布。 [0007] 一種鍍膜件的製備方法,其包括如下步驟: [0008] 提供一基材; [0009] 在該基材的表面形成打底層,該打底層為Ti層; [0010] 在該打底層的表面形成Ti〇2層; [0011] 在該Ti〇2層的表面形成Cu-Zn合金層; [0012] 重複交替形成TiOg層和Cu-Zn合金層以形成最外層為 Ti〇2層的鑛膜件。 [0013] 本發明所述鍍膜件在基材表面交替濺鍍Ti〇2層和Cu-Zn合 金層,Ti〇2層形成為疏鬆多孔的結構,而使Cu-Zn合金層 的部分谈入到Ti〇2層中,對Cu-Zn合金層中Cu-Zn金屬離 子的快速溶出起到阻礙作用,從而可緩釋Cu-Zn金屬離子 的溶出,使Cu-Zn合金層具有長效的抗菌效果;同時Ti〇2 層中的Ti〇2本身具有抗菌效果,可強化鍍膜件的抗菌效 果,相應地延長鍍膜件的使用壽命。 【實施方式】 [0014] 請參閱圖1,本發明一較佳實施方式的鍍膜件100包括基 材10、形成於基材10表面的打底層20,形成於打底層20 表面的複數1^〇2層30和複數Cu-Zn合金層40,該複數 Ti〇2層30和複數Cu-Zn合金層40交替排布,其中與所述 打底層20直接相結合的為1^〇9層30,最外層為1^〇9層30 。本實施例中,所述複數1"丨〇2層30和複數Cu-Zn合金層 40的層數可分別為5〜20層。 099136033 表單編號A0101 第5頁/共12頁 0992062998-0 201217553 [0015] 該基材1 0的材質可為鈦或鈦合金。 [0016] 該打底層20可以磁控濺射的方式形成。該打底層為Ti層 。該打底層20的厚度可為100〜200nm。 [0017] 該複數1^〇2層30可以磁控濺射的方式形成。所述每一 Ti〇2層30的厚度可為50〜100nm。濺鍍該1^〇2層30時採 用較低的沉積溫度和沉積偏壓,使1^〇2層30具有更好的 疏鬆多孔的結構,可使所述Cu-Zn合金層40的部分嵌入到 該1^〇2層30中。 [0018] 該複數Cu-Zn合金層40可以磁控濺射的方式形成。所述每 一Cu-Zn合金層40的厚度可為200〜300ηιη。在每一Cu-Zn合金層40與相鄰的每一乜〇2層30的介面處,有部分 Cu-Zn合金層40嵌入到1^〇2層30中,從而對Cu-Zn合金 層40起到固持的作用,並可緩釋Cu-Zn金屬離子的溶出, 使Cu-Zn合金層40具有長效的抗菌效果。 [0019] 本發明一較佳實施方式的鍍膜件100的製備方法,其包括 如下步驟: [0020] 提供一基材10,該基材10的材質可為鈦或鈦合金。 [0021] 對該基材10進行表面預處理。該表面預處理可包括常規 的對基材10進行拋光、無水乙醇超聲波清洗及烘乾等步 驟。 [0022] 對經上述處理後的基材1 0的表面進行氬氣電漿清洗,以 進一步去除基材10表面殘留的雜質,以及改善基材10表 面與後續鍍層的結合力。具體操作及工藝參數為:將基 099136033 表單編號A0101 第6頁/共12頁 0992062998-0 201217553 [0023]The Cu-Zn alloy layers are alternately arranged. [0007] A method for preparing a coated member, comprising the steps of: [0008] providing a substrate; [0009] forming a primer layer on a surface of the substrate, the primer layer being a Ti layer; Forming a Ti〇2 layer on the surface; forming a Cu-Zn alloy layer on the surface of the Ti〇2 layer; [0012] repeatedly forming a TiOg layer and a Cu-Zn alloy layer alternately to form an outermost layer of Ti〇2 layer Mineral film parts. [0013] The coated member of the present invention alternately sputters a Ti〇2 layer and a Cu-Zn alloy layer on the surface of the substrate, and the Ti〇2 layer is formed into a loose porous structure, and a part of the Cu-Zn alloy layer is referred to In the Ti〇2 layer, the rapid dissolution of Cu-Zn metal ions in the Cu-Zn alloy layer is hindered, so that the dissolution of Cu-Zn metal ions can be sustained, and the Cu-Zn alloy layer has a long-lasting antibacterial effect. At the same time, Ti〇2 in the Ti〇2 layer itself has an antibacterial effect, which can enhance the antibacterial effect of the coated parts and correspondingly prolong the service life of the coated parts. [0014] Referring to FIG. 1, a coated article 100 according to a preferred embodiment of the present invention includes a substrate 10, a primer layer 20 formed on the surface of the substrate 10, and a plurality of layers formed on the surface of the primer layer 20. 2 layers 30 and a plurality of Cu-Zn alloy layers 40, the plurality of Ti〇2 layers 30 and the plurality of Cu-Zn alloy layers 40 are alternately arranged, wherein the layer directly combined with the primer layer 20 is 1^〇9 layer 30, The outermost layer is 1^〇9 layer 30. In this embodiment, the number of layers of the plurality 1"2 layer 30 and the plurality of Cu-Zn alloy layers 40 may be 5 to 20 layers, respectively. 099136033 Form No. A0101 Page 5 of 12 0992062998-0 201217553 [0015] The material of the substrate 10 may be titanium or a titanium alloy. [0016] The underlayer 20 can be formed by magnetron sputtering. The underlayer is a Ti layer. The underlayer 20 may have a thickness of 100 to 200 nm. [0017] The plurality of layers 2 can be formed by magnetron sputtering. Each Ti〇2 layer 30 may have a thickness of 50 to 100 nm. When the layer 2 is sputtered, a lower deposition temperature and a deposition bias are used, so that the layer 2 has a better porous structure, and the Cu-Zn alloy layer 40 can be partially embedded. Go to the 1^〇2 layer 30. [0018] The plurality of Cu-Zn alloy layers 40 may be formed by magnetron sputtering. Each of the Cu-Zn alloy layers 40 may have a thickness of 200 to 300 nm. At the interface of each of the Cu-Zn alloy layer 40 and the adjacent each of the 乜〇2 layers 30, a portion of the Cu-Zn alloy layer 40 is embedded in the 〇2 layer 30, thereby bonding the Cu-Zn alloy layer 40. It acts as a holding and can release the dissolution of Cu-Zn metal ions, so that the Cu-Zn alloy layer 40 has a long-lasting antibacterial effect. [0019] A method for preparing a coated member 100 according to a preferred embodiment of the present invention includes the following steps: [0020] A substrate 10 is provided, which may be made of titanium or a titanium alloy. [0021] The substrate 10 is subjected to surface pretreatment. The surface pretreatment may include conventional steps of polishing the substrate 10, ultrasonic cleaning with anhydrous ethanol, and drying. [0022] The surface of the substrate 10 subjected to the above treatment is subjected to argon plasma cleaning to further remove impurities remaining on the surface of the substrate 10, and to improve the bonding force between the surface of the substrate 10 and the subsequent plating layer. The specific operation and process parameters are: base 099136033 Form number A0101 Page 6 / Total 12 pages 0992062998-0 201217553 [0023]
[0024] Ο [0025] 099136033 材10放入一磁控濺射鍍膜機(圖未示)的鍍膜室内,將該 鍍膜室抽真空至3xl0_5torr,然後向鍍膜室内通入流量 為100〜300sccm(標準狀態毫升/分鐘)的氬氣(純度為 99. 999%),並施加-200〜-800V的偏壓於基材1〇,對基 材10表面進行氬氣電聚清洗,清洗時間為3〜lOmin。 採用磁控濺射法在經氩氣電漿清洗後的基材1〇的表面濺 鍍一打底層20,該打底層20可為一Ti層。濺鍍該打底層 20在所述磁控藏射鍍膜機中進行。使用金屬欽無,所述 鈦靶採用直流磁控電源。滅鍍時,開啟鈦靶,通入氬氣 為工作氣體,氬氣流量可為300〜500sccm,對基材施加 -50〜-150V的僥壓,鍍膜室的溫度可為1〇〇〜i5〇«c,鑛 膜時間可為5〜8min。該打底層20的厚度可為1〇〇〜 2 00nm。 繼續採用磁控滅射法在所述打底層2〇的表面濺鑛一Ti〇 2 層30。使用金屬鈦把’所述鈦乾採用直旅磁控電源。激 鍍時,開啟鈦靶,通入反應氣體氧氣,氧氣流量可為2〇 〜40sccm,通入工作氣體氬氣,氬氧流量可為2〇〇〜 350sccm,對基材1〇施加直流偏壓,直流偏壓大小可為_ 50〜-150V,基材10的溫度可為70〜13〇〇c,鍍膜時間可 為2〜3min。該!^〇2層30的厚度可為50〜1〇〇nm。濺鍍 該Ti〇2層30採用較低的沉積溫度和較低的沉積偏壓,可 使T i 〇2層30達到較好的疏鬆多孔的結構。 繼續採用磁控濺射法在所述1^〇2層30的表面濺鍍—Cu_ Zn合金層40。使用銅鋅合金靶,所述鋼鋅合金靶中鋼的 質量百分含量為8〇%〜9〇% ’所述銅辞合妹採用射頻磁 表單編號A0101 第7頁/共12頁 0992062998-0 201217553 控電源。濺鍍時,開啟銅鋅合金靶,通入工作氣體氮氣 ’氩氡流量可為20〜50sccm,對基材施加耦合脈衝偏壓 ’轉合脈衝偏壓大小可為-180〜-350V,脈衝頻率為 1〇KHz,脈衝寬度為2〇/zS,基材1〇的溫度可為7〇〜13〇 C,鍍膜時間可為2〜3min。該Cu-Zn合金層40的厚度可 為200〜3〇〇nm。 [0026] [0027] [0028] [0029] [0030] [0031] 參照上述步驟,重複交替濺鍍^(^層加和Cu—Zn合金層 ,且最外層為Ti〇2層30。交替濺鍍的次數總共可為5〜 20次。所述複數Ti〇2層30和複數Cu-Zn合金層4〇的總厚 度可為1〜8/zm。 所述鍍膜件100在基材10表面交替濺鍍Ti〇層 。金層40,Τι〇2層30形成為疏鬆多孔的結構,可使a一 以合金層40的部分欲入到該加2層3〇中,對Μ%合金 層40中Cu-Zn金屬離子的快速溶出起到阻礙作用,從而可 緩釋Cu-Zn金屬離子的溶出丨:,合金層⑽有長效 的抗菌效果;同時Ti〇層30中的Tin " 2 1〇2本身具有抗菌效果 ’可強化鍍膜件1〇〇的抗菌效果,相 调應地延長鍍膜件100 的使用壽命。 【圖式簡單說明】 圖1為本發明一較佳實施例鍍獏件的剖視圖。 【主要元件符號說明】 鍍膜件:100 基材:10 打底層:2 0 099136033 表單編號A0101 第8頁/共12頁 0992062998-0 :40 201217553 [0032] 1^0。層:30[0024] 991 [0025] 099136033 material 10 is placed in a coating chamber of a magnetron sputtering coating machine (not shown), the coating chamber is evacuated to 3xl0_5torr, and then the flow rate into the coating chamber is 100~300sccm (standard Argon gas (purity: 99.999%) in a state of ML/min), and a bias of -200 to -800 V was applied to the substrate 1 Torr, and the surface of the substrate 10 was subjected to argon electropolymerization cleaning, and the cleaning time was 3 〜 lOmin. A layer of the underlayer 20 is sputtered on the surface of the substrate after argon plasma cleaning by magnetron sputtering, and the underlayer 20 may be a Ti layer. Sputtering the underlayer 20 is performed in the magnetron deposition coating machine. The metal target is used, and the titanium target is a DC magnetron power source. When the plating is off, the titanium target is turned on, and argon gas is used as the working gas. The flow rate of the argon gas may be 300 to 500 sccm, and the substrate is subjected to a pressing pressure of -50 to -150 V, and the temperature of the coating chamber may be 1 〇〇 to i5 〇. «c, the film time can be 5~8min. The underlayer 20 may have a thickness of 1 〇〇 to 200 nm. The magnetron killing method continues to be used to sputter a Ti〇 2 layer 30 on the surface of the underlying layer 2〇. The titanium stem is made of a straight magnetic control power source using metal titanium. During the laser plating, the titanium target is turned on, and the reaction gas oxygen is introduced. The oxygen flow rate can be 2 〇 to 40 sccm, and the working gas argon gas is introduced. The argon oxygen flow rate can be 2 〇〇 to 350 sccm, and a DC bias is applied to the substrate 1 〇. The DC bias voltage can be _50~-150V, the temperature of the substrate 10 can be 70~13〇〇c, and the coating time can be 2~3min. The thickness of the layer 2 can be 50 to 1 〇〇 nm. Sputtering The Ti〇2 layer 30 uses a lower deposition temperature and a lower deposition bias to achieve a better porous structure of the Ti 2 layer 30. The Cu_Zn alloy layer 40 is sputtered on the surface of the layer 2 by magnetron sputtering. A copper-zinc alloy target is used, and the mass percentage of the steel in the steel-zinc alloy target is 8〇%~9〇%. The copper-shaped copper-shaped form number A0101 page 7/12 pages 0992062998-0 201217553 Control power supply. During sputtering, the copper-zinc alloy target is turned on, and the working gas nitrogen gas is introduced. The flow rate of the argon gas can be 20 to 50 sccm, and the coupling pulse bias is applied to the substrate. The turning pulse bias voltage can be -180 to -350 V, and the pulse frequency. It is 1 〇KHz, the pulse width is 2〇/zS, the temperature of the substrate 1〇 can be 7〇~13〇C, and the coating time can be 2~3min. The Cu-Zn alloy layer 40 may have a thickness of 200 to 3 Å. [0028] [0030] [0031] Referring to the above steps, repeating the alternate sputtering ^ (layer and Cu - Zn alloy layer, and the outermost layer is Ti 2 layer 30. Alternate splashing The number of plating times may be 5 to 20 times in total. The total thickness of the plurality of Ti〇2 layers 30 and the plurality of Cu-Zn alloy layers 4〇 may be 1 to 8/zm. The coated member 100 alternates on the surface of the substrate 10. The Ti layer is sputtered. The gold layer 40, the Τι〇2 layer 30 is formed into a loose porous structure, so that a part of the alloy layer 40 is intended to be added to the layer 2 〇, and the 合金% alloy layer 40 is Rapid dissolution of Cu-Zn metal ions acts as a barrier to slow release of Cu-Zn metal ions. The alloy layer (10) has a long-lasting antibacterial effect; while Tin " 2 in the Ti〇 layer 30 2 itself has an antibacterial effect 'enhanced the antibacterial effect of the coated member 1 ,, and the life of the coated member 100 is extended in response. FIG. 1 is a cross-sectional view of a rhodium-plated part according to a preferred embodiment of the present invention. [Main component symbol description] Coated parts: 100 Substrate: 10 dozens of bottom layer: 2 0 099136033 Form number A0101 Page 8 / Total 12 pages 0992062998-0 : 40 201217 553 [0032] 1^0. Layer: 30
* L* L
[0033] Cu-Zn 合金層[0033] Cu-Zn alloy layer
099136033 表單編號A0101 第9頁/共12頁 0992062998-0099136033 Form No. A0101 Page 9 of 12 0992062998-0
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